Lighting device comprising a support structure with improved thermal and optical properties

Abstract

To provide a lighting device having improved capability of imitating light emission characteristics of a conventional halogen lamp.SOLUTION: In the lighting device 1 including the support structure 13, the support structure 13 includes a first layer 13a including a metal and a second layer 13b including a metal; And first light emitting elements 11. 1, 11. 2, 11. 3, 11. 4, 11. 5, which are arranged in contact with the second layer 13b, and second light emitting elements 12a. 1, 12a. 2, 12a. 3, 12a. 4, 12a. 5, 12b. 1, which are arranged separated from the other of the first layer 13a and the second layer 13b.SELECTED DRAWING: FIG. 2A

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 021,315, filed May 7, 2020, and European Patent Application No. 20173441.5, filed May 7, 2020, each of which is incorporated herein by reference in its entirety.

[0002] Technical Field The present disclosure relates to a lighting device including a support structure having a central mounting surface for at least one first light emitting element and at least one lateral mounting surface for at least one second light emitting element, such that the lighting device may be suitably used, for example, as a retrofit to mimic a halogen lamp for an automotive headlight. The present disclosure also relates to a method of manufacturing the lighting device and an automotive headlight having such a lighting device. [Background technology]

[0003] Lighting devices such as halogen lamps have been the standard light source for automotive headlights for many years. However, recent advances in LED technology and the associated new design possibilities and energy efficiency have led to increased interest in finding suitable replacements for halogen lamps based on LED technology; such replacements are often referred to as LED retrofits.

[0004] Although LED retrofits have become popular in recent years, their ability to mimic halogen lamps is still not optimal. The different geometries of, for example, the emitting area (filament) of a halogen lamp and, for example, the LED die (emitting surface) can create problems when an LED die is used to mimic the emission of a halogen lamp not only in the near field but also in the far field. Summary of the Invention [Problem to be solved by the invention]

[0005] In one approach, existing LED retrofits include PCB (printed circuit board)-based support structures with LEDs positioned on both sides of the PCB. While such approaches may already provide satisfactory results for certain applications, further improved solutions are needed to achieve light intensity distributions that mimic the corresponding light intensity distributions of halogen lamps, particularly meeting the requirements for automotive applications, such as headlight applications. At the same time, it is desirable to provide a solution that allows for dealing with the large heat densities expected from LEDs that mimic halogen lamps, particularly in automotive headlight applications.

[0006] It is therefore an object of the present invention to provide a lighting device having an improved ability to mimic the light emitting characteristics of conventional halogen lamps. It is a further object of the present invention to provide a lighting device having an improved ability to handle high heat densities. It is yet a further object of the present invention to provide a method of manufacturing a lighting device. [Means for solving the problem]

[0007] According to a first aspect of the present disclosure, there is provided a lighting device including a support structure, the support structure including: a first layer comprising a metal; and a second layer comprising a metal; a central mounting surface formed by a portion of the first layer and a portion of the second layer; and at least one lateral mounting surface formed by a portion of one of the first layer and the second layer; the lighting device further including at least one first light-emitting element in contact with the first layer and in contact with the second layer and disposed on the central mounting surface; and a second light-emitting element in contact with one of the first layer and the second layer forming the lateral mounting surface and separated from the other of the first layer and the second layer and disposed on the lateral mounting surface.

[0008] According to a second aspect of the present invention, there is provided a method for manufacturing a lighting device, particularly a lighting device according to the first aspect, the method comprising the steps of: providing a support structure, the step of providing the support structure comprising: providing a first layer comprising a metal; providing a second layer comprising a metal; forming a central mounting surface with a portion of the first layer and a portion of the second layer; and forming at least one lateral mounting surface with a portion of one of the first layer and the second layer; the method further comprising the steps of: disposing at least one first light-emitting element on the central mounting surface in contact with the first layer and in contact with the second layer; and disposing at least one second light-emitting element in contact with one of the first layer and the second layer forming the lateral mounting surface and separated from the other of the first layer and the second layer.

[0009] According to a third aspect of the present invention, there is provided a headlight for a motor vehicle comprising a lighting device according to the first aspect.

[0010] Exemplary embodiments of the first, second and third aspects of the present invention may have one or more of the characteristics described below.

[0011] In an exemplary embodiment, the support structure includes first and second layers that comprise or consist essentially of a metallic material, such as a metal, metal mixture, or alloy, having good electrical and thermal conductivity properties, such as copper and / or aluminum, whereby consisting essentially of should be understood as consisting primarily of (e.g., at least 90%) such metal, and possibly including additional materials such as impurities, etc.

[0012] In an exemplary embodiment, the support structure is formed by two essentially planar layers (which may be bent one or more times depending on the application) arranged parallel and adjacent to each other and separated by an insulating layer comprising, for example, a dielectric insulating material, the use of which is beneficial, for example, with respect to the corresponding properties of withstanding and conducting heat.

[0013] The central mounting surface is formed by respective portions of the first and second layers, particularly their respective edge portions. For example, the first and second layers may be formed by one double-sided metal core board or two single-sided metal core boards, such as insulated metal substrates (IMS), and the central mounting surface, in this case, corresponds to the edge of the one double-sided IMS or the adjacent edge of each of the two single-sided IMS. Note that more than two IMSs (metal core boards) may be used if required by the application. For example, a single-sided or double-sided IMS sandwiched between two outer IMSs may enable additional connections as needed. Alternatively or additionally, two or more IMSs may be adjacently arranged to form the first and / or second layers. At least one lateral mounting surface is formed by a portion of one of the first and second layers. In other words, at least one lateral mounting surface is formed by a portion of the first layer or a portion of the second layer. In an exemplary embodiment, at least one lateral mounting surface is formed by a portion of one of the first and second layers adjacent to the central mounting surface, in particular forming an angle of 90°±5° with the central mounting surface.

[0014] Thus, in contrast to conventional LED retrofits, for example, by providing a central mounting surface, particularly at an edge portion of the support structure, and at least one corresponding lateral mounting surface, the respective mounting surfaces for mounting at least one first light-emitting element and at least one second light-emitting element are advantageously provided to mimic the filament of a conventional halogen lamp. In particular, providing a central mounting surface in addition to one or two lateral mounting surfaces advantageously allows for simulating not only the near field of a conventional halogen lamp, but also the far field. In this way, the lighting device according to the first aspect can meet the requirements for the near and far field intensity distributions present, particularly in the automotive field, so that it can be advantageously used as a light source for automotive headlights. At the same time, while highly advantageous for such applications, the lighting device according to the first aspect can also be suitably used as a light source in other applications, such as flashlight applications, projector applications, etc.

[0015] The lighting device further includes at least one first light-emitting element disposed on the central mounting surface in contact with the first layer and in contact with the second layer. In this manner, in an exemplary embodiment, the at least one first light-emitting element is in mechanical, electrical, and / or thermal contact with the metal of the central mounting surface. The lighting device further includes at least one second light-emitting element disposed on the lateral mounting surface in contact with one of the first and second layers forming the lateral mounting surface and separated from the other of the first and second layers. In this manner, in an exemplary embodiment, the at least one second light-emitting element is in mechanical, electrical, and / or thermal contact with the metal of the lateral mounting surface. In this exemplary embodiment, the at least one first light-emitting element and / or the at least one second light-emitting element are light-emitting diodes (LEDs), particularly LED dies. Using LEDs is advantageous in terms of efficiency (light output power vs. power consumption) and the ability to appropriately select the color of light for a particular application, for example.

[0016] In an exemplary embodiment, the support structure further includes an electrically insulating layer separating the first and second layers. The insulating layer can be, for example, an insulating layer sandwiched between the first and second layers, i.e., in direct contact with and disposed between the first and second layers. In an exemplary embodiment, the insulating layer includes or consists of a dielectric material that is advantageous in terms of its heat-resistant and heat-transporting properties. Suitable materials can include, for example, highly conductive dielectric materials such as PrePreg with appropriate particles, phase change sheets, or resin-coated copper (RCC).

[0017] By providing a support structure formed by first and second layers sandwiching an insulating layer, a compact and solid structure can be advantageously provided for supporting and electrically contacting the light emitting elements of the lighting device, which advantageously allows the lighting device to be incorporated into automobile headlights, particularly as a light source. Additionally, it has been found that providing a sandwich structure of first and second layers (particularly comprising a metal such as copper) and a dielectric insulating layer allows for improved thermal management and enhanced heat flow guidance away from heat generated by the light emitting elements.

[0018] In an exemplary embodiment, each of the first and second layers includes at least two, particularly adjacent, conductor segments and at least one corresponding insulating segment separating the at least two conductor segments. Thus, the first and second layers may each correspond to a metal sheet, such as a copper sheet, cut into respective segments using, for example, a thin laser beam, and the segments attached (e.g., glued) to the insulating layer to form the respective first and second layers. In alternative examples, the first and second layers may correspond to respective sides of a double-sided IMS, or each of the first and second layers may correspond to a corresponding single-sided IMS, thereby, in such examples, the conductor segments may correspond to respective conductors of the double-sided or single-sided IMS. By segmenting each layer into conductor segments, each layer may be used to electrically contact one or more light-emitting elements, such that the respective longitudinal arrangements of the light-emitting elements can be positioned on a central mounting surface and / or a lateral mounting surface and contacted, for example, to mimic the filaments of a halogen lamp. A support structure constructed in this manner has been found to be particularly advantageous in that it allows heat generated by individual light-emitting elements to be transported away via corresponding conductor segments corresponding to the individual light-emitting elements.

[0019] In an exemplary embodiment, the first light-emitting element is arranged in electrical contact, particularly mechanical contact, with at least one conductor segment of the first layer and at least one conductor segment of the second layer. Thus, the first and second layers can be used, for example, to contact the first light-emitting elements arranged with respective polarities on the central mounting surface. Thus, in an exemplary embodiment, at least two first light-emitting elements arranged on the central mounting surface are connected in parallel to a power source. While such a parallel connection of the first light-emitting elements arranged on the central mounting surface may be advantageous in terms of simplicity of connection, it should be noted that, on the other hand, by appropriately utilizing the individual contact segments formed by the first and second layers, it is also possible to individually control each of the first light-emitting elements arranged on the central mounting surface.

[0020] In an exemplary embodiment, the second light-emitting element is arranged in electrical contact, particularly mechanical contact, with only one of the first and second layers, particularly forming the lateral mounting surface, and is arranged in electrical isolation from at least one conductor segment of the other of the first and second layers. It should be noted that, when electrically isolated from at least one conductor segment of the other of the first and second layers, the at least one second light-emitting element cannot be in direct contact with this layer. In other words, the at least one second light-emitting element is electrically connected to (and arranged in mechanical contact with) only one or more conductor segments of the first or second layer.

[0021] In an exemplary embodiment, each of the at least two conductor segments (in each of the first and second layers) includes a first leg, a second leg, and an L-shaped portion having a bent portion between the first and second legs, the first leg being shorter than the second leg. Thus, the first leg is connected to the second leg via the bent portion to form an L-shape. Note that, in the exemplary embodiment, when forming the L-shaped portion, the first leg is disposed at an angle of 90°±20°, particularly ±10°, particularly ±5°, relative to the second leg. For example, in the case where the first and second layers each correspond to the above-mentioned metal sheet, the conductor segments can be cut from the metal sheet using an L-shaped cut. In the case where the first and second layers correspond to one or more IMSs, the corresponding conductors of the IMSs can be L-shaped.

[0022] In an exemplary embodiment, the central mounting surface is formed by the respective ends of the first legs of at least two conductor segments in the first layer and the respective ends of the first legs of at least two conductor segments in the second layer. Thus, in the exemplary embodiment, the first legs of each conductor segment are connected (mechanically and electrically) to a respective first or second light emitting element. Thus, at least one first light emitting element is in electrical and mechanical contact with the conductor segments in the first layer and the conductor segments in the second layer. In an exemplary embodiment, at least one lateral mounting surface is formed by the respective lateral surfaces of the first legs of at least two conductor segments in one of the first and second layers forming the lateral mounting surface. Thus, at least one second light emitting element is in mechanical and electrical contact only with the first legs of the conductor segments in the first or second layer. Such an L-shape has been found to be advantageous for mimicking the filament of a halogen lamp, as it facilitates exposing, for example, one or more linear arrangements of light emitting elements arranged on the respective mounting surfaces in a manner that mimics the position of the filament in a halogen lamp.

[0023] In an exemplary embodiment, the lighting device includes a first lateral mounting surface formed by a portion of the first layer and a second lateral mounting surface formed by a portion of the second layer, wherein each of the first and second lateral mounting surfaces is adjacent to and angled relative to the central mounting surface. In other words, the light emitting elements are arranged on three different adjacent surfaces of the support structure, thereby advantageously simulating the three-dimensional structure of a filament. Arranged in this manner, the light emitting elements are advantageously positioned to not only mimic the near field of the filament, but also its far field. In an exemplary embodiment, the first and second lateral mounting surfaces are opposite each other and angled 90°±5° relative to the central mounting surface. By arranging two or more light emitting elements on each of the central mounting surface and the two lateral mounting surfaces along a common mounting direction, a three-dimensional arrangement of the light emitting elements optimized for simulating such a filament is achieved. Thus, in an exemplary embodiment, the central mounting surface, the first lateral mounting surface, and the second lateral mounting surface are surfaces of the longitudinal mounting portion that form the protrusion of the support structure. Further, in an exemplary embodiment, the lighting device includes a central arrangement of at least two first light emitting elements (e.g., 3, 4, 5, 6, 7, 8, 9, 10 light emitting elements) arranged along the mounting direction on the central mounting surface, a lateral arrangement of at least two second light emitting elements arranged along the mounting direction on the first lateral mounting surface, and a lateral arrangement of at least two second light emitting elements arranged along the mounting direction on the second lateral mounting surface.

[0024] In an exemplary embodiment, the support structure comprises a metal core board, particularly an insulated metal substrate, forming a first and second layer, or two metal core boards, particularly two insulated metal substrates forming the first and second layers, respectively. In other words, each of the first and second layers may correspond to, for example, a single-sided metal core board, or both the first and second layers may correspond to respective sides of a single double-sided metal core board. In an exemplary embodiment, the metal core board is an insulated metal substrate (IMS) board. An IMS board includes a thin layer of conductive material (e.g., copper) on a dielectric layer (e.g., a heat-activated epoxy resin, a highly conductive dielectric material such as PrePreg with appropriate particles, a phase change sheet, or resin-coated copper (RCC)), which is laminated onto a thicker base layer of conductive material (e.g., aluminum or copper). The thin layer and / or base layer of the IMS may correspond to the first and / or second layers. The use of a metal core board has been found to be advantageous in that it allows for the provision of a compact and solid support structure with highly beneficial heat transport properties.

[0025] In an exemplary embodiment, the lighting device according to the first aspect is a light source, e.g., a lamp configured to be mounted in a lighting system, in particular in a headlight for an automobile. Different lighting systems include, for example, a projector system, a flashlight, a reflector and / or a projector system. In the context of a vehicle, typical applications include low beam, high beam, fog and / or DRL applications. When configured in this way, the lighting device may further include, for example, a suitable socket for mounting the lighting device in such a lighting system.

[0026] The features and exemplary embodiments of the present invention described above may equally relate to different aspects according to the present invention. In particular, when a feature relating to a lighting device according to the first aspect is disclosed, a corresponding feature relating to a method according to the second aspect or a motor vehicle headlight according to the third aspect is also disclosed.

[0027] It will be understood that the presentation of embodiments of the present invention in this section is merely illustrative and not limiting.

[0028] Other features of the present invention will become apparent from the following detailed description considered in conjunction with the accompanying drawings. It will be understood, however, that the drawings are designed solely for purposes of illustration and not as a definition of the limits of the invention, for which reference should be made to the appended claims. It should be further understood that the drawings are not drawn to scale and are merely intended to conceptually illustrate the structures and procedures described herein. [Brief explanation of the drawings]

[0029] Examples of the invention are described in detail below with reference to the accompanying drawings.

[0030] [Figure 1] FIG. 1 is a diagram illustrating an example of a headlight using a conventional halogen lamp. [Figure 2A] 1 is a diagram illustrating an exemplary lighting device according to an embodiment of the present invention; [Figure 2B] 2B is a cross-sectional view of the lighting device of FIG. 2A. [Figure 3A] 2B is a top view of the mounting portion of the lighting device of FIG. 2A. FIG. [Figure 3B] 2B is a side view of the mounting portion of the lighting device of FIG. 2A. [Figure 4A] 10A and 10B show a support structure for a lighting device according to a further embodiment. [Figure 4B] 4B shows a support structure and corresponding light emitting element of the lighting device of FIG. 4A. [Figure 4C] 4C shows the support structure and light emitting element of FIG. 4B in a different perspective. DETAILED DESCRIPTION OF THE INVENTION

[0031] FIG. 1 shows a headlight 100 having a reflector 120 to which an exemplary conventional H7 halogen lamp 110 is attached. The filament 111 of the halogen lamp 110 is positioned at the focal point of the reflector 120 so that light 132 emitted from the filament 111 is reflected by the reflector 120 along a primary lighting direction 150. A cover 121 may incorporate appropriate optics for shaping the reflected light and forming light 133 leaving the headlight 100. The lamp 110 includes a socket 114 attached to the reflector 120 via a mounting portion 116. Pins 117a and 117b extend from the socket 114 for power connection. The bulb 113 extends from a base portion 115 that surrounds the filament 111 and terminates in a light-blocking portion 112 that blocks direct light from the filament 111.

[0032] 2A and 2B illustrate an exemplary lighting device 1 according to an exemplary embodiment of the present invention. Accordingly, FIG. 2A shows a three-dimensional view of a portion of lighting device 1, and FIG. 2B shows a cross-sectional side view on a first layer 13a. Lighting device 1 is an LED retrofit including a base portion 16 that can be connected to a corresponding automotive headlight (not shown) via a socket 14 (FIG. 2B). Instead of the bulb 113 and filament 111 of FIG. 1, lighting device 1 includes a support structure 13 and an arrangement of light-emitting diodes (LEDs) 11, 12a, and 12b, which are examples of light-emitting elements. As can be seen from FIG. 2A, support structure 13 is interposed between sections 16a and 16b of base portion 16 and is formed by first and second layers 13a and 13b separated by an insulating layer 17a. A longitudinal mounting portion 15 protrudes from support structure 13, which includes a central mounting surface 18c (see FIG. 3A). The central arrangement 11 of LEDs 11.1, 11.2, 11.3, 11.4, and 11.5 (examples of first light-emitting elements) is linearly arranged along the mounting direction on the central mounting surface 18c. The mounting portion 15 further comprises mutually opposing lateral mounting surfaces 18a and 18b (see FIG. 3A), which are adjacent to the central mounting surface 18c and are arranged at an angle (90°±5°) with respect to the central mounting surface 18c. The lateral arrangement 12a of LEDs 12a.1, 12a.2, 12a.3, 12a.4, and 12a.5 (examples of second light-emitting elements) is arranged along the mounting direction on the lateral mounting surface 18a. The corresponding lateral arrangement of LEDs arranged on the opposing lateral mounting surface 18b is not visible in FIGS. 2A and 2B due to the perspective. Thus, a halogen lamp filament, such as filament 111 of FIG. 1, can be advantageously simulated by placing LEDs on corresponding central and lateral mounting surfaces of support structure 13 as shown in FIG. 2A.

[0033] As shown in Figure 2B, the first layer 13a includes conductor segments 13a.1, 13a.2, 13a.3, 13a.4, and 13a.5, which are insulated from one another by insulating segments 17b.1, 17b.2, 17b.3, and 17b.4 and correspond, for example, to the first lighting elements 11.1, 11.2, 11.3, 11.4, and 11.5, respectively. The second layer 13b includes corresponding conductor segments that are not visible in the drawing due to the perspective. As can be further seen from Figure 2B, each of the conductor segments includes an L-shaped portion, with a respective first leg perpendicular to the mounting direction (and to the corresponding mounting surface 18c) of, for example, the first lighting elements 11.1, 11.2, 11.3, 11.4, and 11.5, and a respective second leg parallel to the mounting direction (and to the corresponding mounting surface). The first leg and the second leg are connected to each other by a bend in which the respective conductor portions are bent to form an angle of essentially 90° (ie, 90°±5°).

[0034] Figures 3A and 3B show the mounting portion 15 of the lighting device 1 of Figures 2A and 2B in more detail. Figure 3A shows a top view over the first and second layers 13a and 13b (over the conductor segments 13a.1 and 13b.1), while Figure 3B shows a side view of the support structure 13 corresponding to the side view of Figure 2B. As shown, the first layer 13a corresponds to a single-sided insulating metal substrate (IMS) board including a metal base layer 21a, a dielectric insulating layer 23a, and a thin contact layer 19a. Accordingly, the second layer 13b corresponds to a single-sided IMS board including a metal base layer 21b, a dielectric insulating layer 23b, and a contact layer 19b. As exemplarily shown for LED 11.1, the LEDs of central arrangement 11 are in mechanical and electrical contact with first layer 13a and second layer 13b so that, on the one hand, the LEDs of central arrangement 11 can be electrically controlled and, on the other hand, the heat generated by the LEDs of arrangement 11 is advantageously guided away by the thick base portions (layers 13a and 13b) of the respective IMS boards.

[0035] Furthermore, as shown in the second lighting element 12a.1, the LEDs in the lateral arrangement 12a are in mechanical and electrical contact with the metal base portion 21a of the first layer 13a via respective contact portions 22a (sometimes also referred to as pedestals) and with a thin contact layer 19a separated from the contact portions 22a by air gaps 20a. Similarly, as shown in the second lighting element 12b.1, the LEDs in the lateral arrangement 12b are in mechanical and electrical contact with the metal base portion 21b of the second layer 13b via respective contact portions 22b (further pedestals) and with a thin contact layer 19b separated from the contact portions 22b by air gaps 20b. It should be noted that the air gaps 20a and 20b may be filled with an insulating material.

[0036] As a result of this configuration, the LEDs in the lateral arrangements 12a and 12b are advantageously in mechanical contact with the thicker base portions (first and second layers) 13a and 13b via the aforementioned pedestals, so that beneficial heat transport is also possible for the lateral arrangements 12a and 12b. This, on the one hand, connects all the LEDs in the central arrangement 11 and the lateral arrangements 12a and 12b to an efficient thermal conductor in order to efficiently guide away the generated heat. On the other hand, by sharing the first layer 13a between the central arrangement 11 and the lateral arrangements 12a, and by sharing the second layer 13b between the central arrangement 11 and the lateral arrangements 12b, a beneficially compact design is provided.

[0037] As can be further seen from FIG. 3A, the provision of thin contact layers 19a and 19b and contact portions 22a and 22b allows for centrally and laterally arranged three corresponding LEDs, e.g. LEDs 12a.1, 11.1 and 12b.1; LEDs 12a.2, 11.2 and 12b.2; LEDs 12a.3, 11.3 and 12b.3; LEDs 12a.4, 11.4 and 12b.4; or LEDs 12a.5, 11.5 and 12b.5, to be connected in series, which advantageously allows for the use of a simple controller for controlling the operation of the LEDs.

[0038] 3B shows in more detail the segments forming the first and second layers. As can be seen from FIG. 3B, the structure shown in FIG. 3A is repeated for each segment. In other words, an air gap 20a, a contact portion 22a, a thin contact layer 19a, a dielectric insulating layer 23a, and a metal base layer 21a are provided for each conductor segment of the first layer 13a, and a corresponding structure is also provided for the second layer 13b (not visible from the perspective of FIG. 3B).

[0039] 4A, 4B, and 4C illustrate a further embodiment of a support structure 13′ including a first layer 13a′ and a second layer 13b′ (see FIG. 4B). Each of the first and second layers 13a′ and 13b′ corresponds, in this embodiment, to a copper plate (thickness ∼400 μm) structured into respective conductor segments. For example, as can be seen in FIG. 4A, the first layer 13a′ is structured into individual slits or segments 13a.1′, 13a.2′, 13a.3′, 13a.4′, 13a.5′, and 13a.6′ separated by respective insulating air gaps (insulating segments) 17b.1′, 17b.2′, 17b.3′, 17b.4′, and 17b.5′, which may be filled with insulating material, e.g., using a laser. As can be seen in FIG. 4B, the first layer 13a' and the second layer 13b' are insulated from each other by an insulating layer 17a', e.g., a layer of dielectric material. Similar to the case shown in FIGS. 2A and 2B, the longitudinal mounting portion 15' is formed as a protrusion of the support structure 13', which includes a central mounting surface 18c. The central arrangement 11 of LEDs is linearly arranged along the mounting direction on the central mounting surface 18c (FIG. 4B). The mounting portion 15' further includes mutually opposing lateral mounting surfaces adjacent to the central mounting surface 18c and arranged at an angle (essentially 90°) to the central mounting surface 18c. The lateral arrangements 12a and 12b of LEDs are arranged along the mounting direction of the lateral mounting surfaces (FIG. 4B). As in the case of FIGS. 2A and 2B, the LEDs in the central arrangement 11 are in mechanical and electrical contact with the first layer 13a' and the second layer 13b'. Furthermore, the LEDs in the lateral arrangement 12a are only in mechanical and electrical contact with the first layer 13a', and the LEDs in the lateral arrangement 12b are only in mechanical and electrical contact with the second layer 13b'. In the case of the second embodiment, each LED in the lateral arrangements 12a, 12b is in contact with a pair of conductor segments for electrical connection (FIG. 4C). In the illustrated case, five light-emitting LEDs on each lateral mounting surface and on the central mounting surface are electrically connected in series, which advantageously allows the use of simple control electronics for operating the lighting device.

[0040] List of reference symbols: Lighting equipment 1 First light-emitting element 11.1, 11.2, 11.3, 11.4, 11.5 Second light-emitting elements 12a.1, 12a.2, 12a.3, 12a.4, 12a.5, 12b.1 Central placement of light-emitting element 11 Lateral arrangement of light-emitting elements 12a, 12b Support structure 13, 13' 1st layer 13a, 13a' 2nd layer 13b, 13b' Conductor segments 13a.1, 13a.2, 13a.3, 13a.4, 13a.5, 13a.1', 13a.2', 13a.3', 13a.4', 13a.5', 13a.6' Socket 14 Mounting section 15, 15' Base 16 Sections 16a and 16b Insulating layers 17a, 17a' Insulated segments 17b.1, 17b.2, 17b.3, 17b.4, 17b.1', 17b.2', 17b.3', 17b.4', 17b.5' Mounting surfaces 18a, 18b, 18c Thin contact layer 19a, 19b Air gap 20a, 20b Base parts 21a, 21b Contact part 22a, 22b Insulating layers 23a, 23b Headlight 100 Halogen lamp 110 Filament 111 Light-blocking portion 112 Valve 113 Socket 114 Base part 115 Mounting part 116 Pins 117a, 117b Reflector 120 Cover 121 Rays 132, 133 Main lighting direction 150

Claims

[Claim 1] 1. A lighting device, comprising: a plurality of conductor segments arranged in a first layer and a second layer, each of the first layer and the second layer including at least two conductor segments, each conductor segment being electrically insulated from the other conductor segments; a central mounting surface formed by a portion of each of the plurality of conductor segments; at least one lateral mounting surface formed by a portion of each of the first layer conductor segments; a support structure including: a plurality of first light emitting elements disposed on the central mounting surface, each of the first light emitting elements contacting two conductor segments from the first layer; a plurality of second light emitting elements disposed on the lateral mounting surface, each of the second light emitting elements contacting two conductor segments from the first layer; 1. A lighting device comprising:

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