IC card and its manufacturing method

Abstract

A dual interface IC card and its manufacturing method are provided, which enable an IC module to be satisfactorily embedded in a recess in a card base and improve the reliability of the electrical connection between the IC module and an antenna. [Solution] The IC card 1 comprises a card base 2 with a recess 9, an IC module 70, and an antenna 80. The IC module 70 comprises a substrate 72, an IC chip body 74, multiple antenna connection terminals 73a, and an external connection terminal 71. The antenna 80 comprises an antenna wire 83 and multiple conductive plates 100. The multiple antenna connection terminals 73a and the multiple conductive plates 100 are electrically connected to each other by conductive adhesive layers 11, and the IC chip body 74 and the antenna 80 form a contactless communication circuit. The conductive plate 100 is formed so that its width along the short side of the card base 2 in a plan view decreases toward the center of the recess 9.

Description

[Technical Field]

[0001] The present invention relates to a dual interface IC card capable of contact and non-contact communication with an external device, and a method for manufacturing the same. [Background technology]

[0002] Conventional IC cards include contact IC cards, which input and output electrical signals through an external connection terminal on the card surface, and contactless IC cards, which input and output electrical signals via an antenna using electromagnetic induction or other methods. In addition to these, dual-interface IC cards, which combine the functions of both contact and contactless IC cards with a single IC chip, are also in use. Dual-interface IC cards, in particular, can be used as contact IC cards, which are effective in preventing external leakage of input and output data during financial transactions, and as highly convenient contactless IC cards, which allow data to be exchanged in close proximity when entering and exiting a room or using a ticket gate at a station. For this reason, dual-interface IC cards are becoming increasingly popular in the market.

[0003] A dual interface IC card is manufactured as follows. First, as described in Patent Document 1, a card substrate including one or more core sheets is formed, and an area for embedding an IC module is cut from the surface of the card substrate. The IC module is then embedded in the area. Here, a conductor is arranged on one of the one or more core sheets, and the conductor forms a wound antenna for providing contactless communication and a contact terminal that is in electrical contact with the terminal of the IC module. The contact terminal is, for example, arranged in a meander shape.

[0004] To expose the contact terminals, which are formed with meandering conductors, from the card substrate, cutting is performed using an end mill. However, variations in the thickness of the core sheet that constitutes the substrate and the heat and pressure conditions used to embed the conductors in the core sheet cause variations in the embedding depth of the conductors from the surface of the card substrate. Therefore, it is difficult to reliably expose conductors of approximately 0.2 mm or less from the card substrate without damaging them. Damage to the conductors can lead to breakage of the wound antenna, resulting in a decrease in yield, and a decrease in productivity due to a slower processing speed.

[0005] On the other hand, in order to avoid such problems, it is conceivable to expose an antenna-side connection part made of conductive plates connected to both ends of an antenna from the card substrate, rather than exposing a contact terminal part made of meandering conductor wire from the card substrate.Patent Document 2 describes a dual interface IC card that uses an inlay that includes a coil-shaped antenna made of coated conductor wire provided inside the inlay, and antenna-side connection parts made of conductive plates connected to both ends of the antenna.

[0006] Now, let us explain the issues that arise when using a rectangular, plate-shaped antenna-side connection portion as in Patent Document 2. Fig. 3 is an enlarged view of the vicinity of the recess 9 for embedding an IC module in the card base 2 of an IC card 1p, which is a dual interface IC card equipped with a substantially rectangular conductive plate 100p similar to that in Patent Document 2. The conductive plate 100p is composed of a first plate 110p on the left side and a second plate 120p on the right side. First, as shown in Fig. 3(a), it is assumed that the conductive plate 100p is disposed approximately in the center of the ring-shaped portion of the shallowly cut first recess 91 in the recess 9 in the vertical direction (direction along the Y-axis).

[0007] The relative positional relationship between the conductive plate 100p and the recess 9 may be misaligned due to machining tolerances. It is necessary to maximize the contact area between the first plate 110p and the second plate 120p and the area of ​​the antenna connection terminals 73a and 73b, which are electrical contacts on the IC module side and are indicated by the dashed-dotted rectangle inside the conductive plate 100p. For this reason, the original first plate 110p and the second plate 120p are formed slightly larger to include the excess portions 111p and 121p, respectively, indicated by the dotted lines, within the area of ​​the second recess 92, which is to be cut deeper than the first recess 91. Then, during the cutting process of the recess 9, the excess portions 111p and 121p are cut out together when the second recess 92 is formed. This prevents unnecessary gaps from being created between the first plate 110p, the second plate 120p, and the second recess 92, even if the first plate 110p and the second plate 120p are misaligned in the left-right direction.

[0008] However, suppose that the conductive plate 100p is positioned above the ring-shaped portion of the first recess 91 of the recess 9 in the vertical direction (the direction along the Y-axis) as shown in FIG. 3(b). In this case, the original first plate 110p and second plate 120p are formed slightly larger so as to include excess portions 111p and 121p, respectively, indicated by dotted lines, within the area of ​​the second recess 92, which is to be cut deeper than the first recess 91. Then, in the cutting step of the recess 9, the excess portions 111p and 121p are cut together when the second recess 92 is formed. However, if the upper end portions of the first plate 110p and the second plate 120p are close to the upper end portion of the second recess 92, it becomes difficult to cleanly cut and remove the excess portions 111p and 121p.

[0009] That is, as shown in FIG. 3(b), protruding remaining portions 110q and 120q remain at the upper right end of the first plate 110p and the upper left end of the second plate 120p after cutting off the excess portions 111p and 121p. The remaining portions 110q and 120q are unintentional residues, also known as "whiskers" or "burrs." The presence of such remaining portions 110q and 120q may prevent the IC module from being properly embedded in the recess 9 and may result in protrusion from the surface of the card body, or may reduce the adhesive strength between the IC module and the card body. Furthermore, the thermal pressure generated when embedding the IC module may be concentrated near the remaining portions 110q and 120q, potentially damaging or deforming the IC module. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] Japanese Patent Application Publication No. 2019-219732 [Patent Document 2] Japanese Patent Application Publication No. 2020-91637 Summary of the Invention [Problem to be solved by the invention]

[0011] The present disclosure has been made in consideration of these circumstances, and aims to provide a dual interface IC card and a manufacturing method thereof that allows the IC module to be well embedded in the recess of the card base and improves the reliability of the electrical connection between the IC module and the antenna. [Means for solving the problem]

[0012] A first configuration of a dual interface IC card capable of contact and contactless communication according to this embodiment comprises a card base having a recess, an IC module embedded in the recess, and an antenna disposed inside the card base, wherein the IC module comprises a substrate, an IC chip disposed on one side of the substrate and a plurality of antenna connection terminals electrically connected to the IC chip, and an external connection terminal disposed on the other side of the substrate, electrically connected to the IC chip, and exposed on the side of the card base on which the recess is formed, and the antenna comprises an antenna wire and a plurality of conductive plates disposed at the ends of the antenna wire and electrically connected to the antenna wire, and the plurality of antenna connection terminals and the plurality of conductive plates are electrically connected to each other by conductive adhesive layers, so that the IC chip and the antenna form a contactless communication circuit, and the conductive plate is formed so that when the card base is viewed in plan through the IC module from the side on which the recess is formed, the width of the conductive plate along the short side of the card base decreases toward the center of the recess.

[0013] Furthermore, an IC card according to a second configuration of another embodiment of the present invention may be configured such that, in the first configuration, when the card base is viewed in plan view through the IC module from the side on which the recess is formed, the upper and lower ends of the conductive plate extend along the long side direction of the card base from a first position toward the center of the recess to a second position, and from the second position toward the center of the recess along the long side direction to a third position which is the end of the conductive plate, the upper end extends at an incline toward the lower end with respect to the long side direction, and the lower end extends at an incline toward the upper end with respect to the long side direction.

[0014] In addition, an IC card according to a third configuration of another embodiment of this invention may be such that, in the first or second configuration, when the card base is viewed in plan by looking through the IC module from the side on which the recess is formed, the conductive plate has an approximately hexagonal shape resembling home plate, with an approximately rectangular portion and an approximately trapezoidal portion combined, and the tip of the approximately trapezoidal portion of the conductive plate is positioned facing the center of the recess.

[0015] Furthermore, in an IC card according to a fourth configuration of another embodiment of this invention, in the first or second configuration, when the card base is viewed in plan view by looking through the IC module from the side on which the recess is formed, the upper and lower ends of the conductive plate may extend along the long side direction of the card base from a first position toward the center of the recess to a second position, and from the second position toward the center of the recess along the long side direction to a third position which is the end of the conductive plate, the upper end extends with an approximately arc-shaped contour toward the lower end in the long side direction, and the lower end extends with an approximately arc-shaped contour toward the upper end in the long side direction.

[0016] In addition, an IC card according to a fifth configuration of another embodiment of the present invention may be any of the first to fourth configurations, in which one or more through-holes are formed in the conductive plate.

[0017] A method for manufacturing a dual interface IC card capable of contact communication and contactless communication with an external device, according to a sixth configuration of this embodiment, includes the steps of: preparing a first substrate and a second substrate; preparing an IC module including a substrate, an IC chip arranged on one surface of the substrate and a plurality of antenna connection terminals electrically connected to the IC chip, and an external connection terminal arranged on the other surface of the substrate and electrically connected to the IC chip; forming an antenna consisting of an antenna wire and a plurality of conductive plates on one surface of the first substrate, and electrically connecting a plurality of tips of the antenna wire and the plurality of conductive plates, respectively; and bonding the first substrate and the second substrate together by heat fusion so as to sandwich the antenna therebetween. the step of laminating the laminated body with an adhesive to form a laminate; the step of punching the laminated body to a card size to form a card body; the step of forming a recess in the card body for embedding the IC module so that the plurality of conductive plates are at least partially exposed; the step of embedding the IC module in the recess and electrically connecting the plurality of antenna connection terminals and the plurality of conductive plates so as to face each other to form a contactless communication circuit using the IC chip and the antenna, wherein the conductive plate is formed so that when the card body is viewed in plan view through the IC module from the side on which the recess is formed, the width of the conductive plate along the short side of the card body becomes smaller toward the center of the recess. [Effects of the Invention]

[0018] According to this embodiment, it is possible to provide a dual interface IC card and a manufacturing method thereof that enable the IC module to be satisfactorily embedded in the recess of the card base and improve the reliability of the electrical connection between the IC module and the antenna. [Brief explanation of the drawings]

[0019] [Figure 1] 1A and 1B are a plan view and a cross-sectional view taken along line AA illustrating the structure of a dual-interface IC card according to a first embodiment of the present disclosure. [Figure 2] FIG. 10 is an enlarged view of the vicinity of the recess of the card base when the IC module is removed. [Figure 3] FIG. 10 is an enlarged view of the vicinity of the recess of the card base when the IC module is removed, for explaining the conductive plate according to the prior art. [Figure 4] FIG. 3 is a view corresponding to a part of FIG. 2(a), illustrating a method for forming a conductive plate. [Figure 5] 5A and 5B are diagrams corresponding to FIG. 4 and illustrating variations in the shape of the conductive plate. [Figure 6] 1(b) is a front and back view of the IC module and an enlarged view of part B in FIG. 1(b). [Figure 7] FIG. 4 is a diagram corresponding to FIG. 2(a) for explaining the structure of a dual interface IC card according to a second embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0020] An example of an IC card according to the present disclosure will be described below with reference to the drawings, etc. However, the IC card according to the present disclosure is not limited to the embodiments and examples described below.

[0021] The figures shown below are schematic illustrations. Therefore, the size and shape of each part are appropriately exaggerated to facilitate understanding. Furthermore, hatching indicating the cross section of a member is omitted as appropriate in each figure. The numerical values ​​such as dimensions of each member and the names of materials described in this specification are examples of embodiments and are not limited to these, and may be selected and used as appropriate. In this specification, terms specifying shapes or geometric conditions, such as parallel, orthogonal, and perpendicular, are intended to include not only their strict meanings but also substantially the same state.

[0022] 1. First embodiment of the present disclosure An example of an embodiment of an IC card according to the present disclosure will be described. An IC card 1 according to a first embodiment is a dual-interface IC card. For ease of explanation, an XYZ coordinate system is set for the IC card 1. First, as shown in FIGS. 1(a) and 1(b), the Z axis is taken as the normal direction to the main surface of the IC card 1. The direction from the main surface on which the external connection terminals 71 of the IC module 70 are not arranged to the main surface on which the external connection terminals 71 are arranged is defined as the +Z direction or upward in the thickness direction, and the opposite direction is defined as the -Z direction or downward in the thickness direction.

[0023] When IC card 1 is viewed from the +Z direction, the line perpendicular to both short sides of IC card 1 and the Z axis is defined as the X axis. The direction from one short side closer to external connection terminal 71 toward the other short side is defined as the +X direction or rightward direction, and the opposite direction is defined as the -X direction or leftward direction. The axis perpendicular to the X and Z axes is defined as the Y axis, and the direction from one long side farther from external connection terminal 71 toward the other long side is defined as the +Y direction or upward direction, and the opposite direction is defined as the -Y direction or downward direction.

[0024] FIG. 1(a) is a plan view of the IC card 1 as viewed from the +Z direction. FIG. 1(b) is a cross-sectional view of the IC card 1 of FIG. 1(a) cut along line AA parallel to the X axis as viewed from the -Y direction. FIG. 2 is an enlarged plan view showing the configuration of the card base 2 from FIG. 1(a) with the IC module 70 removed. FIG. 2(a) is a diagram showing the conductive plate 100 (first plate 110 and second plate 120) disposed near the center of the first recess 91 along the left-right vertical direction of the ring-shaped portion of the first recess 91 of the recess 9, i.e., the Y-axis direction, which is the short side direction of the card base 2. FIG. 2(b) is a diagram showing the conductive plate 100 disposed at a position shifted upward from the center of the first recess 91 along the left-right vertical direction of the ring-shaped portion of the first recess 91 of the recess 9.

[0025] 3 is an enlarged plan view showing the configuration of the card base 2 from which the IC module 70 has been removed, similar to FIG. 2, but showing a case in which the conductive plate is a conductive plate 100p according to the prior art. FIG. 3(a) shows the conductive plate 100p arranged in the vertical direction of the ring-shaped portion of the first recess 91 of the recess 9, near the approximate center of the first recess 91. FIG. 3(b) shows the conductive plate 100p arranged in the vertical direction of the ring-shaped portion of the first recess 91 of the recess 9, shifted upward from the approximate center of the first recess 91.

[0026] 6(a) is a view of the external connection terminal 71 side of the IC module 70 viewed from the +Z direction, similar to FIG. 1(a). FIG. 6(b) is a view of the IC module 70 viewed from the -Z direction, opposite to FIG. 6(a). Most of the molded portion 74b of the IC chip body 74 is omitted here to allow a see-through view of the interior. FIG. 6(c) is an enlarged cross-sectional view of portion B near the antenna connection terminal 73a in FIG. 1(b).

[0027] As shown in FIG. 1(a), the IC card 1 has a generally rectangular thin plate shape with rounded corners in a plan view from the +Z direction. An IC module 70 including an external connection terminal 71 is disposed on the surface of the dual-interface IC card on the +Z direction side, slightly to the upper left of the center, i.e., closer to the -X direction and closer to the +Y direction than the center. As shown in FIGS. 1(a) and 1(b), the IC module 70 is embedded in a recess 9 formed in the card base 2, and is disposed so that the surface of the external connection terminal 71 on the +Z direction side is substantially flush with the surface of the card base 2 on the +Z direction side. This configuration of the IC card 1 complies with ISO / IEC 7816-1, an international IC card standard. As shown in FIG. 1, the external connection terminal 71 has sections for the external terminals defined by the ISO / IEC 7816-2 and ISO / IEC 7816-3 standards.

[0028] This standard specifies the following external terminals: C1 terminal (supply voltage input terminal), C2 terminal (reset signal input terminal), C3 terminal (clock signal input terminal), C5 terminal (signal ground terminal), and C7 terminal (serial data input or output terminal). Note that the C6 terminal is a standard or individual use terminal that is not normally used, and the C4 and C8 terminals are unused terminals reserved for future use. Note that the C1, C2, C3, C5, and C7 terminals may be abbreviated as VCC, RST, CLK, GND, and I / O, respectively.

[0029] 6(b), a plurality of pads 74p are formed on the IC chip 74a, the details of which will be described later. Each of the plurality of pads 74p on the IC chip 74a is electrically connected to a respective terminal of the external connection terminal 71 (for example, terminals C1, C2, C3, C5, and C7, although not shown) via a conductive wire 75. Two of the pads 74p on the IC chip 74a other than those mentioned above are electrically connected via conductive wires 75 to antenna connection terminals 73a and 73b, which are formed on the surface of the substrate 72 opposite the external connection terminal 71.

[0030] 1(a) and 1(b), the antenna connecting terminal 73a is electrically connected to the first plate 110, which is the conductive plate 100, via the conductive adhesive layer 11. The first plate 110 is welded to one end of the antenna wire 83. Furthermore, although not shown in FIG. 1(b), the antenna connecting terminal 73b is also electrically connected to the second plate 120 via the conductive adhesive layer 11, and the second plate 120 is welded to the other end of the antenna wire 83. As a result, the antenna connecting terminals 73a and 73b are electrically connected to both ends of the antenna wire 83, respectively.

[0031] As a result, the pads 74p of the IC chip 74a and the antenna connecting terminals 73a and 73b are electrically connected to each other via the wires 75, and the antenna connecting terminal 73a is electrically connected to one end of the antenna 80 via the conductive adhesive layer 11 and the first plate 110. The antenna connecting terminal 73b is electrically connected to the other end of the antenna 80 via the conductive adhesive layer 11 and the second plate 120. As a result, the IC chip 74a and the antenna 80 can form a closed contactless communication circuit.

[0032] Meanwhile, in Fig. 2(a), the planned arrangement areas of the antenna connection terminals 73a, 73b in the recess 9 of the card base 2 when the IC module 70 is embedded are respectively indicated by substantially rectangular dashed lines. As shown in Fig. 2(a), the card base 2 is viewed in plan from the side on which the recess 9 is formed, looking through the IC module 70. That is, Fig. 2(a) is an enlarged plan view showing the configuration of the card base 2 from which the IC module 70 has been removed in Fig. 1(a). In other words, Fig. 2(a) can also be said to be a plan view of the card base 2, looking through the IC module 70, in the vicinity of the recess 9 of the card base 2 on which the IC module 70 is mounted.

[0033] At this time, the conductive plate 100 is formed so that the width of the conductive plate 100 along the short side direction of the card base 2 decreases toward the center of the recess 9. Specifically, the width of the first plate 110 along the short side direction is a constant width W21 in a region of the first recess 91 away from the second recess 92 as it moves from the -X direction side to the +X direction side (the center of the recess 9) along the long side direction of the card base 2. However, in a region of the first recess 91 closer to the second recess 92, the width gradually narrows from W21 to a smaller width W22 as it moves from the -X direction side to the +X direction side (the center of the recess 9).

[0034] The second plate 120 is disposed symmetrically with the first plate 120. That is, the width along the short side of the second plate 120 is a constant width W21 in a region of the first recess 91 that is far from the second recess 92, as it moves from the +X direction side to the -X direction side (the center of the recess 9) along the long side of the card base 2. However, in a region of the first recess 91 that is close to the second recess 92, the width gradually narrows from W21 to a smaller width W22 as it moves from the -X direction side to the +X direction side (the center of the recess 9).

[0035] In other words, the shape of the conductive plate 100 is formed so that the width of the conductive plate 100 along the short side direction of the card base 2 tapers toward the center of the recess 9. On the other hand, Fig. 2(b) is a diagram showing a case in which the conductive plate 100 has the same shape as Fig. 2(a) but is positioned above the ring-shaped portion of the first recess 91 of the recess 9 in the vertical direction (the direction along the Y-axis) on the left and right sides. In this case, the original first plate 110 and second plate 120 are formed slightly larger so as to include approximately trapezoidal excess portions 111 and 121, respectively, indicated by dotted lines, within the region of the second recess 92, which is to be cut deeper than the first recess 91.

[0036] Then, in the cutting process of the recess 9, the excess portions 111 and 121 are cut together when the second recess 92 is formed. However, as described above, the end portions of the recess 9 of each of the first plate 110 and the second plate 120 near the center are formed so that the width along the short side direction of the card base 2 tapers toward the center of the recess 9. Therefore, even if the position of the conductive plate 100 is shifted upward, the upper end portion of the conductive plate 100 is unlikely to come close to the upper end portion of the second recess 92. Therefore, it is possible to effectively prevent the excess portions 111 and 121 from remaining during the cutting process, as in the conductive plate 100p according to the conventional technology shown in FIG. 3(b). This also applies when the position of the conductive plate 100 is shifted downward.

[0037] In this way, since it is less likely that an unnecessary remaining portion will be left behind, the IC module 70 can be successfully embedded in the recess 9, preventing the IC module 70 from protruding from the surface of the card base 2 and reducing the adhesive strength between the IC module 70 and the card base 2. Furthermore, the heat and pressure applied when embedding the IC module 70 is uniformly applied to the IC module 70, reducing the risk of damaging or deforming the IC module 70. As a result, it is possible to provide a dual interface IC card and a manufacturing method thereof that allows the IC module 70 to be successfully embedded in the recess 9 of the card base 2 and improves the reliability of the electrical connection between the IC module 70 and the antenna 80.

[0038] The configuration of the IC card 1 of this embodiment and the manufacturing method thereof will be described in detail below.

[0039] (a) Card base The card base 2 refers to the card body excluding the IC module 70 that constitutes the IC card 1. As shown in Fig. 1(b), the card base 2 typically has a configuration in which an over-sheet layer 8, a core layer 7, antenna holding layers 6 and 5, a core layer 4, and an over-sheet layer 3 are laminated in this order from one end on the -Z direction side in the thickness direction. In addition, an antenna 80 is disposed between the antenna holding layers 6 and 5, and includes an antenna wire 83 wound in a loop shape and formed from a coated conductor wire or the like, and a conductive plate 100.

[0040] The card base 2 may refer to both the card before the recess 9 is formed and the card after the recess 9 is formed, and may refer to both the card without the antenna 80 and the card including the antenna 80. In addition, both ends of the antenna wire 83 of the antenna 80 are electrically connected to a first plate 110 on the -X direction side and a second plate 120 on the +X direction side, which are arranged along the X axis direction. The first plate 110 and the second plate 120 are each element of the conductive plate 100.

[0041] For ease of explanation, the present embodiment will be described assuming that the antenna wire 83 of the antenna 80 is a single, unbranched conductor wound into a loop, but the present disclosure is not limited to this and includes antenna wires 83 that are appropriately branched and have three or more ends. Furthermore, three or more conductive plates 100 can also be disposed depending on the number of ends of the antenna wire 83.

[0042] The layer structure of the card base 2 is not limited to the above, and may be a three-layer structure of an over-sheet layer, an antenna holding layer, and an over-sheet layer, or a two-layer structure of an antenna holding layer and an antenna holding layer. Alternatively, the layer structure of the card base 2 may be a multi-layer structure of eight or more layers, such as an over-sheet layer, a core layer, an inner layer, an antenna holding layer, an antenna holding layer, an inner layer, a core layer, and an over-sheet layer. Furthermore, printing or an embedded magnetic stripe may be applied to the surface of the over-sheet layer 3 or 8 of the card base 2 opposite the core layer 4 or 7, or printing may be applied to the surface of the core layer 4 or 7 adjacent to the over-sheet layer 3 or 8.

[0043] From the standpoint of conforming to standards such as ISO / IEC 7816-1, the thickness of the card base 2 is preferably 0.76 mm or more and 0.84 mm or less, but may be outside this range.

[0044] (i) Core layer The core layer is also referred to as the inner layer. A wide variety of white or colored plastic sheets can be used for the core layers 4 and 7, including the following single films or composite films: polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylic ester, polypropylene, polyethylene, polyurethane, etc. The thickness of the core layers 4 and 7 can be selected appropriately taking into account the overall thickness of the card, but can be, for example, approximately 0.10 mm or more and 0.38 mm or less.

[0045] (ii) Antenna support layer The antenna holding layer, like the core layer, is also referred to as the inner layer. Antenna holding layers 5 and 6 have the function of sandwiching and holding antenna 80, and a wide variety of plastic sheets can be used, similar to those used for core layers 4 and 7. Antenna holding layers 5 and 6 may be made of the same material as core layers 4 and 7, or may be made of a different material. The thickness of antenna holding layers 5 and 6 can be selected appropriately taking into account the overall thickness of the card, but can be, for example, approximately 0.10 mm or more and 0.38 mm or less.

[0046] (iii) Oversheet layer The over-sheet layers 3 and 8 are typically made of the same material as the core layer and antenna holding layer, but a transparent material with a thickness of approximately 0.05 mm or more and 0.18 mm or less is often used. From the viewpoint of preventing curling when the laminate of the core layer, antenna holding layer, and over-sheet layer is integrated by heat pressing or the like, it is preferable that the over-sheet layers 3 and 8 have the same thickness, but they do not necessarily have to be the same. This also applies to the core layers 4 and 7 and the antenna holding layers 5 and 6 described above.

[0047] The material of the over-sheet layer may be any material that is heat-adhesive. However, even if the over-sheet layer itself is not heat-adhesive, the core layer and the over-sheet layer can be integrated by additionally forming a layer of a known adhesive that generates adhesive force when heated between them. Furthermore, when IC card 1 is used as a magnetic card, a magnetic stripe may be embedded in advance in one or both of over-sheet layers 3 and 8 by thermal transfer or the like on the main surface opposite to both or one of core layers 4 and 7.

[0048] (iv) Antenna sheet In this embodiment, as described below, the antenna 80 is formed on one surface of the antenna holding layer 5 or 6, and both ends of the antenna wire 83 constituting the antenna 80 are electrically connected to the first plate 110 and the second plate 120. Formation of the antenna 80 on the antenna holding layer 5 or 6 is performed, for example, as follows. First, the first plate 110 and the second plate 120 are adhered and fixed to the surface of the antenna holding layer 6 facing the antenna holding layer 5 before lamination by applying heat and pressure or the like. At this time, an adhesive may be applied to the surface of the antenna holding layer 6 before the first plate 110 and the second plate 120 are placed. The first plate 110 and the second plate 120 are aligned in the left-right direction at the intended position for mounting the IC module 70, and are placed so that portions of the plates overlap the antenna connection terminals 73a and 73b of the IC module 70 when placed.

[0049] Thereafter, the tip of the antenna wire 83 is welded to either the first plate 110 or the second plate 120. Then, starting from this point, a predetermined heat pressure is applied to the antenna wire 83, and the antenna wire 83, which is a coated conductor covered with an insulating material, is embedded in the surface of the antenna holding layer 6 by a wire winding former. That is, while applying a predetermined heat pressure to the antenna wire 83, an antenna supply head is drawn into a loop shape as shown in FIG. 1( a), and the antenna wire 83 supplied from the antenna supply head is sequentially embedded in the antenna holding layer 6. The antenna wire 83 that has been embedded is cut, and the tip of the cut antenna wire 83 is used as the end point and welded to the other of the first plate 110 or the second plate 120.

[0050] The tip that serves as the starting point and the tip that serves as the end point of the antenna wire 83 are electrically connected to either the first plate 110 or the second plate 120 by welding. In this way, an antenna holding layer 6 (antenna sheet 12) on which the antenna 80 is formed is obtained. The intermediate product in which the antenna 80 is embedded in the antenna holding layer 5 or 6 is sometimes referred to as the antenna sheet 12. The antenna sheet 12 can be distributed on the market by itself as a component for manufacturing an IC card 1. Alternatively, a commercial model may exist in which a sheet material such as an antenna holding layer is supplied to a processor, who processes it into an antenna sheet 12 and delivers it to the supplier.

[0051] (v) Antenna In the antenna 80 formed on the antenna holding layer 5 or 6, the antenna connection terminals 73a and 73b of the IC module 70 are electrically connected to the pair of first plate 110 and second plate 120 to which the multiple tips of the antenna wire 83 are electrically connected. As a result, the IC chip 74a and the antenna 80 provided in the IC module 70 form a communication circuit for contactless communication. The communication circuit may be one that performs close-proximity communication using, for example, the 13.56 MHz HF frequency band specified in ISO / IEC 18092, ISO / IEC 144443, or the like. Alternatively, it may be one that performs communication using other frequency bands, such as the 920 MHz UHF frequency band, the 125 kHz LF frequency band, or the 2.45 GHz microwave frequency band.

[0052] When IC card 1 is held over an external device such as a reader / writer, the magnetic field and radio waves generated by the reader / writer generate electromotive force and current in the communication circuit, which then supplies power to IC chip 74a. This enables IC chip 74a to be driven, enabling contactless transmission and reception of information with the reader / writer, and reading and rewriting of information from and to the memory.

[0053] The antenna wire 83 constituting the antenna 80 is typically formed of a coated conductor wire in which the periphery of a copper wire is coated with an insulating material. Alternatively, copper alloy wires such as Cu-Ni, Cu-Cr, Cu-Zn, Cu-Sn, and Cu-Be, or various metal wires and metal alloy wires such as iron, stainless steel, and aluminum, can also be selected. By using a coated conductor wire, the IC card 1 can be manufactured more inexpensively than, for example, a copper foil etching method. However, the IC card 1 of the present disclosure may also use an antenna wire formed by a copper foil etching method, a metal foil punching method, or the like.

[0054] The diameter of the antenna wire 83 is not particularly limited as long as it can ensure the characteristics as a contactless communication circuit, but it can be, for example, 0.03 mm or more and 0.30 mm or less, and preferably 0.05 mm or more and 0.15 mm or less. By setting the diameter in the latter range, durability against heat pressure during embedding and external forces due to cutting can be improved, and good communication characteristics can be ensured.

[0055] (vi) Conductive plates (first plate and second plate) Next, the first plate 110 and the second plate 120 constituting the conductive plate 100 will be described in detail. When viewed in a plan view along the Z-axis direction, which is the normal direction to the main surface of the IC card 1, the first plate 110 and the second plate 120 each have a home-base-like, approximately hexagonal shape formed by combining an approximately rectangular portion and an approximately trapezoidal portion. The approximately hexagonal shape of home-base is obtained by combining the approximately rectangular portion and the approximately trapezoidal portion, which have the same length, so that one side of the approximately rectangular portion overlaps the bottom of the approximately trapezoidal portion. Furthermore, the first plate 110 and the second plate 120 are arranged such that the tip, which is the top of the approximately trapezoidal portion, faces the center of the recess 9.

[0056] As shown in Figure 2(a), the first plate 110 and the second plate 120 have, in a planar view, an area that overlaps with the first recess 91, i.e., an area that is exposed from the card base 2, and an area that is located outside the first recess 91 and is embedded inside the card base 2.

[0057] 2(a), in the plan view, of the outer periphery 93 of the recess 9, the straight lines that overlap the edge 93a on the −X direction side along the Y axis and the edge 93b on the +X direction side along the Y axis are defined as straight lines m1 and m2, respectively. In this case, the region of the first plate 110 on the +X direction side of the line m1 is exposed from the card base 2 in the first recess 91, and the region of the second plate 120 on the −X direction side of the line m2 is covered by the card base 2. Similarly, the region of the second plate 120 on the −X direction side of the line m2 is exposed from the card base 2 in the first recess 91, and the region of the second plate 120 on the +X direction side of the line m2 is covered by the card base 2.

[0058] Taking the first plate 110 as an example, the width along the X-axis direction of the first plate 110 exposed from the card base 2 in the first recess 91 is W12, the same as the width of the first recess 91, and is narrower than the width W11 including the width of the portion covered by the card base 2. Furthermore, the vertical width along the Y-axis direction of the first plate 110 exposed from the card base 2 in the first recess 91 is a constant width W21 in a region closer to the outer side of the first recess 91, i.e., the -X direction side. However, the width gradually narrows from a predetermined position closer to the inner side of the first recess 91, i.e., the +X direction side, toward the +X direction side, and reaches a width W22 at the end on the +X direction side, which is smaller than width W21.

[0059] 2(a), in a region on the +X direction side of straight line m1, which is the exposed portion of first plate 110 from first recess 91, the vertical width of first plate 110 along the Y axis direction from straight line m1 to a distance W13 in the X axis direction is a constant width W21. On the other hand, in the region from straight line m1 beyond distance W13 in the X axis direction to a distance W12, the upper end (tip on the +Y direction side) of first plate 110 extends at an incline toward the lower end side (−Y direction side) with respect to the long side direction, and the lower end (tip on the −Y direction side) extends at an incline toward the upper end side (+Y direction side) with respect to the long side direction.

[0060] That is, from a first position toward the center of the recess 9 along the long side direction of the card base 2 to a second position, the upper and lower ends of the first plate 110 extend along the long side direction. Here, the first position can be replaced with a position on the line m1, and the second position can be replaced with a position on the first recess 91, which is separated from the line m1 by a distance W13 in the X-axis direction. Furthermore, from the second position toward the center of the recess 9 along the long side direction to a third position, which is the end of the first plate, the upper end extends at an incline downward with respect to the long side direction, and the lower end extends at an incline upward with respect to the long side direction. Here, the third position can be replaced with a boundary position between the second recess 92 and the first recess 91, which is separated from the line m1 by a distance W12 in the X-axis direction.

[0061] In this embodiment, the degree to which the upper end inclines downward relative to the long side direction from the second position toward the center of the recess 9 along the long side direction to the third position at the end of the first plate 110 is linear, and the degree to which the lower end inclines upward relative to the long side direction is also linear. Note that in the modified examples described later, the following will also be explained. That is, the degree to which the upper end inclines downward relative to the long side direction from the second position toward the center of the recess 9 along the long side direction to the third position at the end of the first plate 110 is an arc-shaped curve. Furthermore, the degree to which the lower end inclines upward relative to the long side direction is also an arc-shaped curve.

[0062] Furthermore, the inclined straight line at the top end relative to the long side direction and the inclined straight line at the bottom end relative to the long side direction are vertically symmetrical. As a result, the first plate 110 has a home base-like, approximately hexagonal shape that combines an approximately rectangular portion and an approximately trapezoidal portion in a plan view along the Z axis direction. The first plate 110 is also arranged so that the tip that forms the upper base of the approximately trapezoidal portion faces the center of the recess 9 (the +X direction side). The second plate 120 is also configured in the same shape as the first plate 110, and is arranged so as to be bilaterally symmetrical with respect to the first plate 110 along the Y axis that passes through the center of the recess 9.

[0063] The values ​​of W11, W12, W13, W21, and W22 are arbitrary. For example, W11 can be 4 mm or more and 8 mm or less, W12 can be 2 mm or more and 4 mm or less, W13 can be 1 mm or more and 3 mm or less, W21 can be 4 mm or more and 8 mm or less, and W22 can be 1 mm or more and 5 mm or less. In particular, it is preferable that the distance W13 extends from the area of ​​the antenna connecting terminal toward the center of the recess 9. In other words, it is preferable that the second position is located closer to the center of the recess 9 than the area of ​​the antenna connecting terminals 73a and 73b of the IC module 70. By satisfying this condition, it is possible to prevent the width of the conductive plate 100 from becoming smaller and thereby prevent a decrease in the electrical contact area with the antenna connecting terminals 73a and 73b.

[0064] Furthermore, from a second position toward the center of the recess 9 along the long side to a third position at which the conductive plate 100 terminates, the angle at which the upper end of the conductive plate 100 slopes downward relative to the long side and the angle at which the lower end of the conductive plate 100 slopes upward relative to the long side are preferably 15° or more and 75° or less, respectively. By setting the angle to 15° or more, even if the conductive plate 100 is misaligned in the vertical direction, the upper and lower ends of the conductive plate 100 are more likely to be aligned with the upper and lower ends of the second recess 92, thereby preventing unintended remaining portions. Furthermore, by setting the angle to 75° or less, even if the conductive plate 100 is misaligned in the horizontal direction, a sufficient contact area between the conductive plate 100 and the antenna connection terminal can be ensured, improving the reliability of the electrical connection between the IC chip 74a and the antenna 80.

[0065] As described above, the sizes and ratios of W12, W11, and W2 are arbitrary, but it is preferable that the area of ​​the antenna connection terminal 73a when the IC module 70 is placed be included within the area of ​​the vertical width W21 and horizontal width W12 of the first plate 110. This is because a stable contact area for electrical connection between the antenna connection terminal 73a and the first plate 110 can be obtained. The same applies to the second plate 120. In this way, the multiple antenna connection terminals 73a, 73b are electrically connected to the conductive plates, first plate 110 and second plate 120, on the surface facing the opening side of the recess 9 of the card base 2.

[0066] Furthermore, since a portion of the first plate 110 and the second plate 120 is covered by the card base 2 in this manner, the first plate 110 and the second plate 120 are more effectively held against external forces such as the cutting resistance of the end mill blade when forming the recess 9. This prevents the plates from accidentally peeling off from the card base 2 and becoming misaligned.

[0067] The first plate 110 and the second plate 120 may have a laminated structure including at least two layers: a first member and a second member laminated on the +Z direction side of the first member. In this case, it is preferable that the second member is a member that is less susceptible to oxidation than the first member. A member that is less susceptible to oxidation can be rephrased as a metal having a lower ionization tendency than the first member, for example, when both the first member and the second member are metals. Examples of such metals include aluminum, iron, nickel, or copper for the first member, and silver, palladium, platinum, or gold for the second member.

[0068] Considering the ease of material procurement, cost, processability, electrical properties, etc., it is preferable to use highly conductive copper for the first member and silver plating for the second member among the above listed materials. By using copper, which can ensure sufficient conductivity, as the first member and silver plating, which is resistant to oxidation and easily exposes the metal interface when the resin layer is cut with an end mill, for the second member, good electrical properties and processability can be obtained while suppressing cost increases.

[0069] On the other hand, the first plate 110 and the second plate 120 may be configured as a single member only, without the two or three or more layer laminated structure described above. In this case, the single member is limited to a conductive member, and for example, the members exemplified above as the first member and the second member, or alloys thereof, can be used. Preferably, copper, aluminum, stainless steel, or the like, which have high conductivity, can be selected. Using a single member makes it easier to obtain and process materials, which also leads to cost reduction.

[0070] In this embodiment, the first plate 110 and the second plate 120 of the conductive plate 100 are configured to have the same shape and are arranged so as to be bilaterally symmetrical along the Y axis passing through the center of the recess 9. In addition, from a second position toward the center of the recess 9 along the long side direction to a third position which is the end of the first plate 110, an inclined straight line whose upper end is inclined downward with respect to the long side direction and an inclined straight line whose lower end is inclined upward with respect to the long side direction are vertically symmetrical.

[0071] However, the present disclosure is not limited to this embodiment, and the first plate 110 and the second plate 120 may be configured in different shapes, and they do not have to be arranged symmetrically along the Y axis passing through the center of the recess 9. Furthermore, the inclined line where the upper end of the conductive plate 100 slopes downward relative to the long side direction and the inclined line where the lower end slopes upward relative to the long side direction do not have to be symmetrical in the vertical direction.

[0072] Next, a method for forming the conductive plate 100 will be described. Fig. 4 is a cutaway view of only the left half of the recess 9 in Fig. 2(a), illustrating the method for forming the conductive plate 100. This figure shows the state before the IC module 70 is embedded. Fig. 4(a) shows the state after only the first recess 91 of the recess 9 has been cut, and Fig. 4(b) shows the state after the second recess 92 has been additionally cut thereafter.

[0073] First, focusing on the first plate 110 of the conductive plate 100 embedded in advance in the card base 2, when a first recess 91 with a relatively shallow depth is formed in the card base 2 by cutting, a part of the first plate 110 is exposed at the bottom surface of the first recess 91. As described above, the first plate 110 at this time is formed to include a part that is embedded in the card base 2 on the −X direction side of the straight line m1, a part that is exposed at the bottom surface of the first recess 91, and an excess part 111 that overlaps with the second recess 92 and will eventually be cut away and disappear.

[0074] Next, cutting of the second recess 92 is additionally performed to change the state from that shown in FIG. 4(a) to that shown in FIG. 4(b). Because the second recess 92 is set deeper than the first recess 91, all of the excess portion 111 that overlaps the second recess 92 in plan view is cut away. The excess portion 111 is formed in a shape that extends toward the center of the recess 91, just like the shape of the conductive plate 100 remaining in the first recess 91. Therefore, when cutting the second recess 92, regardless of whether the cutting blade advances from the +Y direction or the -Y direction in plan view, the conductive plate 100 is inclined in a direction away from the advancing direction of the cutting blade. This minimizes the possibility of unintended residues, such as "whiskers" or "burrs," remaining on the conductive plate 100.

[0075] (vii) Conductive Plate Modification 1 Next, modified examples of the shape of the conductive plate will be described. As described above, the conductive plate 100 of this embodiment has a home plate-like, approximately hexagonal shape formed by combining an approximately rectangular portion and an approximately trapezoidal portion when viewed in a plan view along the Z-axis direction, which is the normal direction to the main surface of the IC card 1. However, the shape of the conductive plate of the present disclosure is not limited to this, and various variations are permitted as long as they provide similar effects.

[0076] Fig. 5 is a diagram corresponding to Fig. 4, illustrating variations in the shape of the conductive plate. Fig. 5(a) shows the state of the card base 2 in which the conductive plate 100a according to Modification 1 is embedded, after only the first recess 91 of the recesses 9 has been cut, and Fig. 5(b) shows the state after the second recess 92 has been additionally cut. That is, Fig. 5(a) is a diagram corresponding to Fig. 4(a) regarding the conductive plate 100a, and Fig. 5(b) is a diagram corresponding to Fig. 4(b) regarding the conductive plate 100a.

[0077] 5(a) and 5(b), the conductive plate 100a according to the first modification is processed in the same manner as the conductive plate 100. Focusing on the first plate 110a of the conductive plate 100a embedded in the card base 2 in advance, when a first recess 91 having a relatively shallow depth is formed in the card base 2 by cutting, a part of the first plate 110a is exposed at the bottom surface of the first recess 91. At this time, the first plate 110a is formed to include a part that is embedded in the card base 2 on the −X direction side of the straight line m1, a part that is exposed at the bottom surface of the first recess 91, and an excess part 111a that overlaps with the second recess 92 and will eventually be cut away and eliminated.

[0078] The conductive plate 100a of the first modification is also formed so that, when the card base 2 is viewed in plan from the side on which the recess 9 is formed, the width of the conductive plate 100a along the short side of the card base 2 decreases toward the center of the recess 9. That is, from a first position toward the center of the recess 9 along the long side of the card base 2 to a second position, the upper and lower ends of the first plate 110a extend along the long side. However, from the second position toward the center of the recess 9 along the long side to a third position at the end of the first plate 110a, the degree of displacement of the upper end toward the lower end relative to the long side is not linear, but is a generally arc-shaped contour that is convex outward (toward the +Y direction and the +X direction). Furthermore, from the second position to the third position, the degree of displacement of the lower end toward the upper end relative to the long side is not linear, but is a generally arc-shaped contour that is convex outward (toward the -Y direction and the +X direction).

[0079] That is, from the second position toward the center of the recess 9 along the long side direction to the third position, the shape of the conductive plate 100a is such that the upper end of the conductive plate 100a has a generally arc-shaped contour that extends toward the lower end in the long side direction, and the lower end also has a generally arc-shaped contour that extends toward the upper end in the long side direction. The generally arc-shaped contour is a convex shape extending from the inside to the outside of the conductive plate 100a. The first plate 110a and the second plate 120a (not shown) are configured bilaterally symmetrical to each other. Furthermore, the first plate 110a and the second plate 120a each have a vertically symmetrical shape. The first plate 110a and the second plate 120a are arranged such that the tip portions of the conductive plate 100a, which include a generally arc-shaped portion and have a narrower width along the short side direction of the card base 2, face the center of the recess 9.

[0080] Next, the second recess 92 is cut to change from the state shown in FIG. 5(a) to the state shown in FIG. 5(b). Because the second recess 92 is set deeper than the first recess 91, all of the excess portion 111a that overlaps the second recess 92 in plan view is cut away. The excess portion 111a is formed by extending the shape of the conductive plate 100a remaining in the first recess 91 toward the center of the recess 9. Therefore, when cutting the second recess 92, regardless of whether the cutting blade advances from the +Y direction or the -Y direction in plan view, the conductive plate 100a is inclined in a direction away from the cutting blade's advancement direction. This minimizes the possibility of unintended residue, also known as "whiskers" or "burrs," remaining on the conductive plate 100a. This also applies to the second plate 120a (not shown).

[0081] In this modification, it is possible to smoothly change the shape of the upper and lower ends of first plate 110a from the first position toward the center of recess 9 along the long side direction of card base 2 to the second position, and the shape of the upper and lower ends from the second position to the third position. In particular, since the change in the shape of the upper and lower ends of first plate 110a before and after the second position can be made smooth, it is possible to suppress the influence of changes in cutting resistance of cutting tools, etc., and improve the stability of ensuring the contact area between conductive plate 100a and the antenna connection terminal.

[0082] Here, the radius of curvature R1 of the substantially arc-shaped upper and lower ends of the conductive plate 100a from the second position to the third position along the long side toward the center of the recess 9 is preferably 1 mm or more and 3 mm or less. By having the radius of curvature R1 in this range, the changes in the shapes of the upper and lower ends of the conductive plate 100a from the first position to the second position and from the second position to the third position can be made smooth.

[0083] (viii) Conductive Plate Modification 2 Next, a second modification relating to the shape of the conductive plate will be described. Fig. 5(c) shows the state of the card base 2 in which the conductive plate 100a according to the second modification is embedded after only the first recess 91 of the recesses 9 has been cut, and Fig. 5(d) shows the state after the second recess 92 has been additionally cut. That is, Fig. 5(c) is a diagram corresponding to Fig. 5(a) relating to the conductive plate 100b, and Fig. 5(d) is a diagram corresponding to Fig. 5(b) relating to the conductive plate 100b.

[0084] 5(c) and 5(d), the conductive plate 100b according to the second modification is processed in the same manner as the conductive plate 100a. Focusing on the first plate 110b of the conductive plate 100b embedded in the card base 2 in advance, when the first recess 91 is formed in the card base 2 by cutting, a part of the first plate 110b is exposed at the bottom surface of the first recess 91. At this time, the first plate 110b is formed to include a part that is embedded in the card base 2 on the −X direction side of the line m1, a part that is exposed at the bottom surface of the first recess 91, and an excess part 111b that overlaps with the second recess 92 and will eventually be cut away and eliminated.

[0085] The conductive plate 100b of the second modification is also formed so that, when the card base 2 is viewed from the side where the recess 9 is formed, the width of the conductive plate 100b along the short side of the card base 2 decreases toward the center of the recess 9. That is, from a first position toward the center of the recess 9 along the long side of the card base 2, from a first position to a second position, the upper and lower ends of the first plate 110b extend along the long side. The degree of displacement of the upper end toward the lower end relative to the long side from the second position to the third position along the long side is not linear, as in the first modification, but forms a generally arc-shaped contour that is convex inward (toward the -Y direction and the +X direction). The degree of displacement of the lower end toward the upper end relative to the long side from the second position to the third position forms a generally arc-shaped contour that is convex inward (toward the +Y direction and the +X direction).

[0086] That is, from the second position toward the center of the recess 9 along the long side direction to the third position, the shape of the conductive plate 100b is such that the upper end of the conductive plate 100b has a substantially arc-shaped contour that extends toward the lower end in the long side direction, and the lower end also has a substantially arc-shaped contour that extends toward the upper end in the long side direction. The substantially arc-shaped contour is a shape that convex from the outside to the inside of the conductive plate 100b. The first plate 110b and the second plate 120b (not shown) are also arranged such that their tip portions, which include a substantially arc-shaped portion and have a narrower width along the short side direction of the card base 2, face the center of the recess 9.

[0087] Next, the second recess 92 is cut to change from the state shown in FIG. 5(c) to the state shown in FIG. 5(d). Because the second recess 92 is set deeper than the first recess 91, all of the excess portion 111b that overlaps the second recess 92 in plan view is cut away. The excess portion 111b is formed by extending the shape of the conductive plate 100b remaining in the first recess 91 toward the center of the recess 9. Therefore, when cutting the second recess 92, regardless of whether the cutting blade advances from the +Y direction or the -Y direction in plan view, the conductive plate 100b is inclined in a direction away from the advancing direction of the cutting blade. Furthermore, the shapes of the upper and lower ends of the conductive plate 100b from the second position to the third position toward the center of the recess 9 along the long side direction of the card base 2 are approximately arc-shaped, convex from the outside to the inside of the conductive plate 100b. This is expected to minimize the cutting resistance when the cutting blade, which has a circular cross section, comes into contact with the approximately arc-shaped concave side surface of the conductive plate 100b, regardless of whether the cutting blade advances from the +Y direction or the -Y direction, thereby minimizing the amount of unintended residue known as "whiskers" or "burrs" remaining on the conductive plate 100b.

[0088] Here, the radius of curvature R2 of the approximately arcuate shape of the upper and lower ends of the conductive plate 100a from the second position toward the center of the recess 9 along the long side direction to the third position is preferably 1 mm or more and 3 mm or less. This range allows the conductive plate 100b to have an approximately arcuate contour approximating the diameter of the cutting blade, thereby enabling stable cutting. Note that the above-described modified example merely illustrates one example of the present disclosure and may include other variations. For example, the degree of displacement of the upper end toward the lower end relative to the long side direction from the second position toward the center of the recess 9 along the long side direction to the third position at the end of the first plate may have a curved contour formed by a combination of multiple approximately arcs that are convex outward (toward the +Y direction and the +X direction), or may have a curved contour formed by a combination of multiple approximately arcs that are convex inward (toward the -Y direction and the +X direction). Furthermore, the degree to which the upper end is displaced downward in the long side direction from the second position toward the center of recess 9 along the long side to the third position at the end of the first plate may have a contour that combines a straight line, a substantially circular arc that is convex outward (toward the +Y direction and the +X direction), and a substantially circular arc that is convex inward (toward the -Y direction and the +X direction). The same applies to the degree to which the lower end is displaced upward in the long side direction from the second position toward the center of recess 9 along the long side to the third position at the end of the first plate.

[0089] (b) IC module Next, each of the main components of the IC module 70 will be described mainly with reference to Figures 1(a), 1(b), 6(a), 6(b), and 6(c). The IC module 70 is embedded in a recess 9 formed in the card base 2, and antenna connection terminals 73a and 73b of the IC module 70 are electrically connected to the first plate 110 and the second plate 120 of the antenna 80, respectively, via a conductive adhesive layer 11. This allows the formation of a communication circuit for contactless communication.

[0090] Furthermore, the IC chip 74a can perform contact communication with a contact type reader / writer or the like through an external connection terminal 71 provided on the IC module .

[0091] The substrate 72 is made by attaching copper foil to the front and back of a flexible insulating resin film such as glass epoxy resin or polyimide resin via an adhesive, and leaving the copper foil attached to the front and back of the resin film so as to form a predetermined pattern. Specifically, an external connection terminal 71 is formed on one copper foil surface of the resin film, and antenna connection terminals 73a and 73b are formed on the other copper foil surface. Specifically, a photosensitive material is applied to one and the other copper foil surfaces of the resin film, a film plate with a predetermined pattern formed thereon is placed, exposed to light, and the non-photosensitive portions are removed by etching, in that order.

[0092] This forms a substrate 72 with some copper foil remaining in a predetermined pattern on the front and back surfaces of the resin film. In addition, bonding holes 76, which are through holes for wire bonding to external connection terminals 71, are provided in advance in a plurality of locations on the substrate 72.

[0093] As shown in FIGS. 1(a) and 6(a), the external connection terminal 71 is defined as each external terminal section defined by the ISO / IEC 7816-2 standard. Specifically, the external connection terminal 71 includes the C1 terminal (supply voltage input terminal), C2 terminal (reset signal input terminal), C3 terminal (clock signal input terminal), C5 terminal (signal ground terminal), and C7 terminal (serial data input or output terminal), which are not shown in the figure. The C6 terminal is a standard or individual use terminal that is not normally used, and the C4 and C8 terminals are unused terminals reserved for future use. These terminal areas are defined by insulating grooves. Specifically, the external connection terminal 71 is formed by a predetermined pattern of terminal areas made of copper foil or the like on one side of an insulating substrate 72, and the insulating groove is an area where the copper foil is interrupted and the substrate 72 is exposed.

[0094] 6(b), the outline of the molded portion 74b is shown with a dashed line, and the outlines of the IC chip 74a, bonding holes 76, wires 75, pads 74p, and antenna connection terminals 73a and 73b hidden inside the molded portion 74b should also be dashed lines. However, for ease of viewing, these are all shown with solid lines, assuming that the molded portion 74b does not exist.

[0095] The surface of the IC chip 74a facing away from the substrate 72 is a circuit surface, and a circuit pattern and a plurality of pads 74p, which are electrodes, are provided on the surface. At locations corresponding to each section of the external connection terminals 71, the back surfaces of the external connection terminals 71 can be seen from the -Z direction side through bonding holes 76, which are holes formed in the substrate 72. That is, the pads 74p of the IC chip 74a and predetermined sections of the external connection terminals 71 can be electrically connected to each other by connecting them with wires 75, such as gold wires, through the bonding holes 76.

[0096] Furthermore, a pair of antenna connection terminals 73a and 73b, which are conductive regions that are approximately T-shaped or approximately H-shaped in a plan view, are arranged on both left and right sides of the IC chip 74a on the surface of the substrate 72 opposite to the external connection terminal 71. The multiple antenna connection terminals 73a and 73b are electrically connected to the corresponding multiple conductive plates 100 (first plate 110 and second plate 120) on the surfaces of the conductive plates 100, that is, the first plate 110 and the second plate 120, that face the opening side of the recess 9 of the card base 2.

[0097] Taking FIG. 6(b) as an example, multiple pads 74p on the IC chip 74a are connected to each of the sections of the external connection terminal 71 (sections C1, C2, C3, C5, and C7, not shown) by wires 75. Pads 74p other than those mentioned above on the IC chip 74a are also connected to antenna connection terminals 73a and 73b by wires 75. These bonding holes 76 and wires 75 are covered and protected by a molded portion 74b. In this embodiment, seven pads 74p are provided on the IC chip 74a, but the number and arrangement are merely an example and any number and arrangement may be used.

[0098] An IC chip body 74 is disposed on the surface of the substrate 72 opposite to the surface on which the external connection terminals 71 are formed. The IC chip body 74 is composed of an IC chip 74a adhered and fixed to the substrate 72 with an adhesive, bonding wires 75 for connection, and a molded portion 74b made of sealing resin for protecting these. The IC chip 74a includes a CPU for controlling both contact and contactless communication operations, and storage devices such as RAM, ROM, EEPROM, and flash memory. The IC chip 74a also includes various circuits, such as an interface circuit for decoding input signals and generating output signals for contact and contactless communication, and a power generation circuit. Note that these various circuits may be provided as elements separate from the IC chip 74a.

[0099] The molded portion 74b is provided as a protruding portion that covers the IC chip 74a and the wires 75 to protect them from external force loads and environmental loads. The molded portion 74b is made of an ultraviolet curable resin, a thermosetting resin, or the like.

[0100] The thickness of the IC chip body 74 depends on the thickness of the IC chip 74a provided therein and the shape of the bonded wires, but can be, for example, 0.45 mm to 0.75 mm. The total thickness of the IC module 70 can be, for example, 0.35 mm to 1.0 mm, and preferably 0.40 mm to 0.65 mm. By keeping the thickness within the latter range, the maximum depth of the recess 9 can be 0.7 mm or less, and the overall thickness of the IC card 1 can be kept to 0.84 mm or less, as defined by the ISO / IEC 7816-1 standard.

[0101] Electrical signals input through the external connection terminal 71 are converted by the contact interface unit into information that can be interpreted by the IC chip 74a and input to the IC chip 74a. The IC chip 74a uses memory while the CPU reads, writes, and performs calculations on data, and outputs some information as a result of these processes to the contact interface unit. The contact interface unit converts this information into a predetermined electrical signal intended for an external device such as a contact reader / writer, and outputs it from the external connection terminal 71. As mentioned above, the memory is composed of EEPROM, which is a rewritable nonvolatile memory, RAM, which is a volatile memory for temporary storage, ROM, which is a non-rewritable nonvolatile memory, etc. The EEPROM may be replaced with flash memory, etc.

[0102] Furthermore, the electrical signal input through the antenna 80 is converted by the contactless interface unit into information that can be interpreted by the IC chip 74a and input to the IC chip 74a. The CPU of the IC chip 74a reads, writes, calculates, etc. data while using the memory, and outputs some information as a result of these processes to the contactless interface unit. The contactless interface unit converts this information into a predetermined electrical signal intended for an external device such as a contactless reader / writer, and outputs it from the antenna 80.

[0103] (c) Conductive adhesive layer After forming a recess 9 for embedding the IC module 70 in the card base 2 by cutting using an end mill or the like, the conductive adhesive layer 11 is described below, which embeds and fixes the IC module 70 in the recess 9 and electrically and mechanically connects it to the recess 9. As shown in Fig. 6(c), the conductive adhesive layer 11 is a liquid or tape-like member that is disposed so as to be sandwiched between the first plate 110, the second plate 120 (not shown), the substrate 72 of the IC module 70, and the antenna connection terminals 73a and 73b (not shown) formed on the substrate 72.

[0104] The conductive adhesive layer 11 sandwiched between the first plate 110, the second plate 120, and the antenna connection terminals 73a, 73b and the adhesive layer sandwiched between the IC module 70 and the card base 2 in the area where the antenna connection terminals 73a, 73b are not present do not necessarily have to be made of the same material. For example, the former may be a tape-like material and the latter a liquid material, and the components of the former and latter conductive adhesive layers may be different. However, by making the components and configuration of the former and latter conductive adhesive layers the same, the burden of material preparation and formation processes for the conductive adhesive layers can be reduced.

[0105] The conductive adhesive layer 11 may be applied or attached in advance to the surface of the substrate 72 of the IC module 70 opposite the external connection terminal 71, or may be applied or attached to the bottom surface of the recess 9 of the card base 2 after cutting.

[0106] A typical conductive adhesive layer 11 also serves as a mechanical connection between the IC module 70 and the cut card base 2, and may be applied or attached to the entire back surface of the substrate 72 or to a portion of the recess 9 that corresponds to the first recess 91. In this way, the electrical connection between the IC chip 74a and the antenna 80 and the mechanical connection between the IC module 70 and the card base 2 can be achieved with the same type of conductive adhesive layer 11, which contributes to simplification of the process.

[0107] However, the conductive adhesive layer 11 may be applied and stuck to the back surface of the substrate 72 so as to cover only the areas of the antenna connection terminals 73a and 73b, and another adhesive that does not have conductivity may be applied and stuck to the rest of the back surface of the substrate 72. This is because the conductivity of the other adhesive does not need to be taken into consideration, making it easier to select an adhesive that is advantageous for mechanical connection.

[0108] The conductive adhesive layer 11, which can be used for both electrical and mechanical connection, can be anisotropic conductive film (ACF) or anisotropic conductive paste (ACP). Alternatively, conductive paste or solder paste, which is epoxy resin with silver particles dispersed as a filler, can also be used. Among these, ACF can be thermally laminated to the entire back surface of the substrate 72 of the IC module 70. The IC module 70 can then be embedded in the recess 9 of the card base 2 after being cut, and then heat-pressed at a predetermined temperature and load. This facilitates electrical connection between the IC chip 74a and the antenna 80. Furthermore, mechanical connection of the IC module 70 to the card base 2 can be achieved at the same time, simplifying the process of mounting the IC module 70 on the card base 2.

[0109] The electrical connection between the IC chip 74a and the antenna 80 and the mechanical connection between the IC module 70 and the card base 2 when an ACF is used as the conductive adhesive layer 11 can be explained as follows, based on FIG. 6(c). The conductive adhesive layer 11 has a structure in which conductive particles 11a, each consisting of spherical resin or metal particles surrounded by a metal film, are dispersed in an adhesive 11b, which is a binder containing an adhesive component. The conductive particles 11a may be resin coated with nickel or gold, or solder particles. Various solder particles, such as SnPb-based, SnAgCu-based, SnCu-based, SnZnBi-based, SnAgInBi-based, and SnZnAl-based, as well as alloys of these with other metals, can be used. These structures are similar when an ACP is used.

[0110] Here, thermal pressure is applied to the substrate 72 from the +Z direction to the -Z direction so as to compress the conductive adhesive layer 11, which is arranged so as to be sandwiched between the first plate 110 electrically connected to the tip of the antenna wire 83, the substrate 72 of the IC module 70, and the antenna connection terminal 73a formed on the substrate 72.

[0111] As a result, strong thermal pressure is applied to a particularly narrow portion of the conductive adhesive layer 11, which is sandwiched between the antenna holding layer 6 and the antenna connecting terminal 73a. The conductive particles 11a of the conductive adhesive layer 11 in this portion are pressed together by the first plate 110 exposed from the antenna holding layer 6 and the antenna connecting terminal 73a along the thickness direction of the conductive adhesive layer 11. Furthermore, if the conductive particles 11a are small, the conductive particles 11a overlap in a daisy chain manner from the first plate 110 to the antenna connecting terminal 73a along the thickness direction of the conductive adhesive layer 11. In other words, the exposed first plate 110 and the antenna connecting terminal 73a are electrically connected via the conductive particles 11a.

[0112] On the other hand, between the antenna holding layer 6 and the substrate 72 in the region where the antenna connecting terminal 73a is not present, the conductive particles 11a are not compressed to the extent that they are pressed by the first plate 110 and the antenna connecting terminal 73a along the thickness direction of the conductive adhesive layer 11, or to the extent that they overlap in a daisy chain manner. However, the adhesive force of the adhesive 11b generated by the thermal pressure mechanically connects the antenna holding layer 6 and the substrate 72. One possible reason for the adhesive force of the adhesive 11b is a wedge effect that occurs when the adhesive 11b penetrates into minute irregularities on the surfaces of the antenna holding layer 6 and the substrate 72.

[0113] As described above, in IC module 70, antenna connection terminals 73a and 73b facing each other and first plate 110 and second plate 120 are electrically connected to each other via, for example, ACF. The ACF is arranged in a region along the outer periphery 93 of recess 9 so as to overlap with first recess 91 in a plan view along the Z-axis direction.

[0114] (d) IC card manufacturing method Next, an example of a method for manufacturing the IC card 1, which is a dual interface IC card, using the card base 2, IC module 70, and conductive adhesive layer 11 described above will be described.

[0115] First, the first plate 110 and the second plate 120, which are the conductive plate 100, are adhered to the surface of either the antenna holding layer 5 or 6 on the side not adjacent to the core layer 4 or 7. Both may be adhered and fixed to the surface of the antenna holding layer 5 or 6 via an adhesive. The first plate 110 and the second plate 120 can both be made of the same material and have the same configuration.

[0116] Next, a coated conductor coated with an insulating member is embedded as antenna wire 83 by a winding machine on the formation surface of antenna holding layer 5 or 6 on which conductive plate 100 is formed, with one of first plate 110 and second plate 120 as the starting point and the other as the end point. Here, the winding machine welds the tip of antenna wire 83 to first plate 110 and second plate 120 at the start and end points of antenna wire 83.

[0117] Specifically, for example, while applying a predetermined heat and pressure to the antenna holding layer 6, an antenna supply head is drawn in a loop shape as shown in Fig. 1(a), and antenna wires 83 supplied from the antenna supply head are successively embedded in the antenna holding layer 6. In this case, the antenna holding layer 6 may be referred to as a first substrate.

[0118] Next, as shown in FIG. 1(b), over-sheet layer 8, core layer 7, antenna holding layers 6 and 5, core layer 4, and over-sheet layer 3 are stacked in this order from the bottom in the thickness direction. Then, the laminate of large sheets with cards arranged vertically and horizontally in multiple faces is sandwiched between stainless steel plates from above and below in the thickness direction, and heat and pressure are applied to the laminate via the stainless steel plates. At this time, for example, antenna 80 is formed in advance on the surface of antenna holding layer 6 so that it is sandwiched between antenna holding layers 5 and 6. At this time, antenna holding layer 5, which is positioned opposite antenna holding layer 6 as the first substrate and is stacked on the first substrate so as to sandwich antenna 80, may be referred to as the second substrate.

[0119] By undergoing this heat pressing process, a large-sized sheet-unit card base can be obtained in which each layer of the laminate, including the first substrate and the second substrate, is integrated. Furthermore, if any of the oversheet layer, core layer, and antenna-holding layer has heat resistance that prevents heat fusion at a predetermined temperature, an adhesive sheet that heat fused at a predetermined temperature is sandwiched between the layers, or an adhesive is applied. Then, by subjecting these to a heat pressing process, an integrated large-sized sheet-unit card base can be obtained.

[0120] The large-sized card substrate obtained as described above, on which cards are arranged in a multi-faced array, is punched out by a punching machine into card substrates 2 that meet the ISO / IEC 7816-1 card size. In addition, recesses 9 for embedding IC modules 70 are formed in the card substrate 2 by cutting using an end mill. This results in the cut card substrate 2. The recesses 9 are made up of two stages: a first recess 91 with a first depth for accommodating the flat substrate 72 of the IC module 70, and a second recess 92 with a second depth deeper than the first recess 91 for accommodating the convex IC chip body 74.

[0121] Typically, the recess 9 is machined in such a way that the entire surface of the recess 9 is first machined to form a first recess 91 of a first depth. Next, a second recess 92 of a slightly smaller size and a second depth is additionally machined near the center of the roughly rectangular first recess 91. This allows the recess 9 to be formed with two levels. Furthermore, the surfaces of the first plate 110 and the second plate 120 are exposed at the bottom of the first recess 91 of the card base 2.

[0122] Meanwhile, separate from the manufacturing of the card base 2 and the cutting process for forming the recesses 9, the conductive adhesive layer 11 is attached to the IC module 70. The IC module 70 is typically a module tape in which the IC module 70 is continuously formed on a long tape in one or two rows. A tape-shaped ACF is attached to the surface of this module tape opposite the surface on which the external connection terminals 71 are formed, while applying a certain amount of heat and pressure. The module tape with the ACF attached is then punched out with a punching machine into a roughly rectangular IC module 70 with rounded corners, thereby obtaining the IC module 70 with the conductive adhesive layer 11 attached.

[0123] Then, the IC module 70 with the conductive adhesive layer 11 attached is embedded in the card base 2 with the recess 9 formed therein, and a predetermined heat block is pressed against the external connection terminal 71, applying a predetermined heat pressure toward the card base 2 for a predetermined time. Melting the conductive adhesive layer 11 made of ACF establishes electrical connections between the antenna connection terminals 73a and 73b of the IC module 70 and the first plate 110 and second plate 120. At the same time, mechanical connections are established between the IC module 70 and the card base 2. The application time and heat pressure conditions for the ACF vary depending on the type and composition of the ACF. For example, the application time and heat pressure conditions can be between 0.5 seconds and 10.0 seconds, the temperature between 150°C and 250°C, and the pressure between 20 MPa and 100 MPa.

[0124] The manufacturing process for IC card 1, which is a dual-interface IC card capable of contact and contactless communication with external devices, can be summarized as follows. The manufacturing process includes preparing an antenna retaining layer 6, which is a first substrate, and an antenna retaining layer 5, which is a second substrate. The manufacturing process also includes preparing an IC module 70, which includes a substrate 72, an IC chip 74a, multiple antenna connection terminals 73a and 73b, and an external connection terminal 71. The IC chip 74a is disposed on one side of the substrate 72. The multiple antenna connection terminals 73a and 73b are electrically connected to the IC chip 74a. The external connection terminal 71 is electrically connected to the IC chip 74a.

[0125] The manufacturing process also includes a step of forming an antenna 80 composed of an antenna wire 83 and multiple conductive plates 100 on one surface of the first base material, and electrically connecting multiple tips of the antenna wire 83 to the multiple conductive plates 100. The manufacturing process further includes a step of laminating the first base material and the second base material by thermal fusion or with an adhesive so as to sandwich the antenna 80 therebetween to form a laminate. The manufacturing process also includes a step of punching the laminate into a card size to form the card base 2.

[0126] The manufacturing process includes a step of forming a recess 9 in which to embed the IC module 70 so that the plurality of conductive plates 100 are at least partially exposed in the card base 2. The manufacturing process includes a step of embedding the IC module 70 in the recess 9, and electrically connecting the plurality of antenna connection terminals 73a, 73b and the plurality of conductive plates 100 so that they face each other, thereby forming a contactless communication circuit by the IC chip 74a and the antenna 80. In this manufacturing process, the conductive plate 100 is formed so that, when the card base 2 is viewed in plan from the side on which the recess 9 is formed and through the IC module 70, the width of the conductive plate 100 along the short side of the card base 2 decreases toward the center of the recess 9.

[0127] (e) Regarding the IC card of the first embodiment of the present disclosure In summary, the IC card 1 of the first embodiment according to the present disclosure is a dual-interface IC card capable of contact and contactless communication with an external device. The IC card 1 includes a card base 2 having a recess 9, an IC module 70 embedded in the recess 9, and an antenna 80 disposed inside the card base 2. The IC module 70 includes a substrate 72, an IC chip 74a, multiple antenna connection terminals 73a and 73b, and an external connection terminal 71. The IC chip 74a is disposed on one side of the substrate 72. The multiple antenna connection terminals 73a and 73b are electrically connected to the IC chip 74a. The external connection terminal 71 is disposed on the other side of the substrate 72, is electrically connected to the IC chip 74a, and is exposed on the side of the card base 2 where the recess 9 is formed.

[0128] The antenna 80 includes an antenna wire 83 and a plurality of conductive plates 100 that are disposed at the tip of the antenna wire 83 and electrically connected to the antenna wire 83. The plurality of antenna connection terminals 73a, 73b and the plurality of conductive plates 100 are electrically connected by conductive adhesive layers 11, respectively, so that the IC chip 74a and the antenna 80 form a contactless communication circuit. When the card base 2 is viewed in plan through the IC module 70 from the side on which the recess 9 is formed, the conductive plate 100 is formed so that the width of the conductive plate 100 along the short side of the card base 2 decreases toward the center of the recess 9.

[0129] The IC card 1 having the above-described configuration can achieve the following advantages over an IC card having a conventional conductive plate 100p. As described above, the first plate 110 and the second plate 120, which are the original conductive plate 100, are formed slightly larger so as to include the predetermined shaped excess portions 111 and 121 within the area of ​​the second recess 92, which is cut deeper than the first recess 91. This is to prevent a reduction in the electrical contact area between the conductive plate 100 and the antenna connection terminals 73a and 73b of the IC module 70 when the conductive plate 100 is positioned with a lateral shift.

[0130] Then, in the cutting process of the recess 9, the excess portions 111 and 121 are cut out together when the second recess 92 is formed. However, as described above, the end portions of the recess 9 of each of the first plate 110 and the second plate 120 near the center are formed so that the width along the short side direction of the card base 2 tapers toward the center of the recess 9. Therefore, even if the position of the conductive plate 100 is shifted upward, the upper end portion is less likely to come into close proximity with the upper end portion of the second recess 92, and it is possible to effectively prevent the excess portions 111 and 121 from remaining during the cutting process, as in the conductive plate 100p according to the conventional technology. This is also true when the position of the conductive plate 100 is shifted downward.

[0131] In this way, since it is less likely that an unnecessary remaining portion will be left behind, the IC module 70 can be successfully embedded in the recess 9, preventing the IC module 70 from protruding from the surface of the card base 2 and reducing the adhesive strength between the IC module 70 and the card base 2. Furthermore, the heat and pressure applied when embedding the IC module 70 is uniformly applied to the IC module 70, reducing the risk of damaging or deforming the IC module 70. As a result, it is possible to provide a dual interface IC card and a manufacturing method thereof that allows the IC module 70 to be successfully embedded in the recess 9 of the card base 2 and improves the reliability of the electrical connection between the IC module 70 and the antenna 80.

[0132] 2. Second embodiment of the present disclosure Next, an IC card 1a of a second embodiment will be described as another example of an embodiment of the IC card of the present disclosure. The differences from the IC card 1 of the first embodiment will be mainly described. Fig. 7 is a view corresponding to Fig. 2(a), in which the conductive plates 100c (first plate 110c and second plate 120c) are arranged near the approximate center of the first recess 91 along the Y-axis direction, which is the vertical direction of the ring-shaped portion of the first recess 91 of the recess 9, i.e., the short side direction of the card base 2.

[0133] As shown in FIG. 7 , in the IC card 1a of the second embodiment, four through holes 230 are formed in each of the first plate 110c and the second plate 120c. However, instead of the through holes 230, notches or other openings with open contours may be formed as through-holes. The first plate 110c has four through holes 230 arranged along the short side of the card base 2, i.e., parallel to the Y axis. Furthermore, the contours of each of the through holes aligned along the Y axis direction are substantially identical, approximately rectangular, in a plan view from the Z axis direction. These four through holes 230 formed in the first plate 110c form a first through hole group 210. Similarly, these four through holes 230 formed in the second plate 120c form a second through hole group 220. The first through hole group 210 and the second through hole group 220 may be collectively or collectively referred to as the through hole group 200.

[0134] In this embodiment, four through holes 230 are formed in each of the first plate 110c and the second plate 120c. However, there is no limit to the number of through holes, and the number may be one or more, three or less, or five or more. Therefore, the term "through hole group" can also be applied to the case where there is only one through hole. While the example shown shows each through hole 230 in each plate arranged along the short side direction of the card base 2, i.e., parallel to the Y-axis, each through hole 230 in each plate may also be arranged along the long side direction of the card base 2, i.e., parallel to the X-axis. Furthermore, multiple through holes 230 may be arranged at an angle to each other with respect to the short side direction of the card base 2. Furthermore, the shapes and sizes of the multiple through holes 230 may be the same or different. Preferred examples of these will be described later. Furthermore, the portions described as "through holes 230" may be replaced with "notches" as appropriate.

[0135] 7, a first through-hole group 210 and a second through-hole group 220, each consisting of four through-holes 230, are formed in the first plate 110c and the second plate 120c of the card base 2. The first through-hole group 210 and the second through-hole group 220 are formed in a range that overlaps with the area of ​​the antenna connection terminals 73a and 73b of the IC module 70. In other words, in a plan view of the IC card 1 from the +Z direction, the first through-hole group 210 and the second through-hole group 220 of the first plate 110c and the second plate 120c may overlap with the area of ​​the antenna connection terminals 73a and 73b when the IC module 70 is embedded in the recess 9 of the card base 2.

[0136] In this way, in the IC card 1a, when viewed in plan from the side of the card base 2 where the recess 9 is formed, the through-hole 230 is formed in the first plate 110c in the region where the first plate 110c and the antenna connecting terminal 73a overlap each other. Also, the through-hole 230 is formed in the second plate 120c in the region where the second plate 120c and the antenna connecting terminal 73b overlap each other.

[0137] This ensures that the plurality of antenna connection terminals 73a, 73b are electrically connected to the plurality of first plates 110c and second plates 120c by the conductive adhesive layer 11. Furthermore, the conductive adhesive layer functions to connect the substrate 72 of the IC module 70 to the card base 2 through the through holes 230 formed in the first plate 110c and the second plate 120c, thereby further strengthening the mechanical connection between the IC module 70 and the card base 2. Therefore, it is possible to provide a dual interface IC card that can improve the reliability of the electrical connection between the IC module 70 and the antenna 80.

[0138] It goes without saying that the conductive plate 100c according to this embodiment may be configured by further combining the configuration of the conductive plate 100a according to Modification 1 of the first embodiment or the conductive plate 100b according to Modification 2. Such configurations are also included within the scope of the present disclosure. [Explanation of symbols]

[0139] 1, 1a IC card 1p IC card 2 Card Base 3, 8 oversheet layers 4, 7 Core layer 5, 6 Antenna support layer 9 Recess 11 Conductive adhesive layer 11a Conductive particles 11b Adhesive 12 Antenna sheet 70 IC modules 71 External connection terminal 72 PCB 73a, 73b Antenna connection terminals 74 IC chip body 74a IC chip 74b molded part 74p Pad 75 wire 76 Bonding Hole 80 Antenna 83 Antenna Wire 91 First recess 92 Second recess 93 Outer circumference Areas 93a and 93b 100 Conductive Plate 110, 110a, 110b, 110c First plate 110p 1st Plate 110q remaining part 111, 111a, 111b Surplus parts 111p, 121p Surplus 120, 120a, 120b, 120c Second plate 120p 2nd Plate 120q remaining part 200 through hole group 210 1st through hole group 220 2nd through hole group 230 Through hole

Claims

1. A dual interface IC card capable of contact communication and contactless communication with an external device, a card base having a recess; an IC module embedded in the recess; an antenna disposed inside the card base, the IC module comprises a substrate, an IC chip disposed on one surface of the substrate and a plurality of antenna connection terminals electrically connected to the IC chip, and external connection terminals disposed on the other surface of the substrate, electrically connected to the IC chip, and exposed on the surface of the card base on which the recess is formed; the antenna includes an antenna wire and a plurality of conductive plates disposed at tips of the antenna wire and electrically connected to the antenna wire; the plurality of antenna connection terminals and the plurality of conductive plates are electrically connected by conductive adhesive layers, so that the IC chip and the antenna form a non-contact communication circuit; A dual interface IC card, wherein the conductive plate is formed so that when the card base is viewed in plan view through the IC module from the side on which the recess is formed, the width of the conductive plate along the short side of the card base becomes smaller toward the center of the recess.

2. When the card base is viewed from the side where the recess is formed through the IC module, the upper and lower ends of the conductive plate extend along the long side direction of the card body from a first position toward the center of the recess to a second position, 2. The dual interface IC card of claim 1, wherein from the second position toward the center of the recess along the long side direction to a third position which is the end of the conductive plate, the upper end extends at an incline toward the lower end with respect to the long side direction, and the lower end extends at an incline toward the upper end with respect to the long side direction.

3. When the card base is viewed from the side where the recess is formed through the IC module, the conductive plate has a substantially hexagonal shape resembling home base, in which a substantially rectangular portion and a substantially trapezoidal portion are combined; 2. The dual interface IC card according to claim 1, wherein a tip of the approximately trapezoidal portion of the conductive plate is arranged facing the center of the recess.

4. When the card base is viewed from the side where the recess is formed through the IC module, the upper and lower ends of the conductive plate extend along the long side direction of the card body from a first position toward the center of the recess to a second position, 2. The dual interface IC card of claim 1, wherein from the second position toward the center of the recess along the long side direction to a third position which is the end of the conductive plate, the upper end extends with an approximately arc-shaped contour approaching the lower end side in the long side direction, and the lower end extends with an approximately arc-shaped contour approaching the upper end side in the long side direction.

5. 2. The dual interface IC card according to claim 1, wherein said conductive plate has one or more openings formed therethrough.

6. A method for manufacturing a dual interface IC card capable of contact communication and contactless communication with an external device, comprising: Providing a first substrate and a second substrate; a step of preparing an IC module including a substrate, an IC chip disposed on one surface of the substrate and a plurality of antenna connection terminals electrically connected to the IC chip, and an external connection terminal disposed on the other surface of the substrate and electrically connected to the IC chip; forming an antenna composed of an antenna wire and a plurality of conductive plates on one surface of the first substrate, and electrically connecting a plurality of tips of the antenna wire to the plurality of conductive plates, respectively; a step of laminating the first base material and the second base material by thermal fusion or via an adhesive so as to sandwich the antenna therebetween to form a laminate; a step of punching the laminate into a card size to form a card base; forming a recess in the card base for embedding the IC module so that the plurality of conductive plates are at least partially exposed; a step of embedding the IC module in the recess, and electrically connecting the plurality of antenna connection terminals and the plurality of conductive plates so as to face each other, thereby forming a contactless communication circuit by the IC chip and the antenna, A method for manufacturing a dual interface IC card, wherein the conductive plate is formed so that, when the card base is viewed in plan view through the IC module from the side on which the recess is formed, the width of the conductive plate along the short side of the card base becomes smaller toward the center of the recess.

Images