Substrate transport apparatus, substrate processing apparatus, and substrate transport method

Abstract

The present invention provides a substrate transport device, a substrate processing device, and a substrate condition acquisition method that can improve measurement accuracy. [Solution] The substrate processing apparatus 1 includes a storage unit 73 that stores a correction value for the linearity error between the height position measured by the rotary encoder 25 and the known true height position for each slot of the carrier. The control unit 71 measures the production height position of the substrate in the carrier placed on the stage using the rotary encoder 25 by moving the light-emitting and light-receiving parts of the mapping sensor 27 with the shutter lifting unit 23. The control unit 71 reads the correction value corresponding to the slot in which the substrate is inserted by referring to the storage unit 73 and corrects the production height position using the correction value. The control unit 71 controls the removal and storage operations of the transport robot IR based on the corrected production height position.

Description

Technical Field

[0001] The present invention relates to a substrate transfer device for loading and unloading substrates, a substrate processing device, and a substrate state acquisition method. Examples of the substrate include a semiconductor substrate, a substrate for an FPD (Flat Panel Display), a glass substrate for a photomask, a substrate for an optical disk, a substrate for a magnetic disk, a ceramic substrate, a substrate for a solar cell, and the like. Examples of the FPD include a liquid crystal display device, an organic EL (electroluminescence) display device, and the like.

Background Art

[0002] Conventional substrate processing devices include a sensor pair (a light projecting unit and a light receiving unit) (see, for example, Patent Documents 1 and 2). The sensor pair is lowered while forming an optical axis by the sensor pair. Thereby, for example, the height position of the substrate is acquired.

[0003] In addition, Patent Document 1 discloses teaching, which is an operation of teaching a transfer robot the height at which a hand enters a carrier using a jig.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] Conventional methods have the following problem: When removing a substrate from a carrier or placing a substrate into a carrier, if the clearance between the hand and the substrate is small, the hand may come into contact with the substrate, potentially damaging it. Therefore, there is a need to accurately acquire the shape and position of the substrate within the carrier, i.e., the condition of the substrate (e.g., height, thickness, warp), using a light-emitting unit and a light-receiving unit.

[0006] However, if a timing belt is used to raise and lower the light-emitting and light-receiving units, the linearity error of the timing belt will negatively affect the measurement accuracy.

[0007] The present invention has been made in view of these circumstances, and aims to provide a substrate transport device, a substrate processing device, and a substrate transport method that can improve measurement accuracy. [Means for solving the problem]

[0008] To achieve this objective, the present invention has the following configuration. That is, the substrate transport device according to the present invention is a substrate transport device for loading and unloading substrates, comprising: a stage on which a carrier for inserting and supporting production substrates in a horizontal position is placed in each of a plurality of slots formed at regular intervals in the vertical direction; a transport robot equipped with a hand for holding the production substrates and for taking out and storing the production substrates from the carrier; a mapping sensor having a light-emitting unit and a light-receiving unit; a lifting unit for moving the light-emitting unit and the light-receiving unit together in the vertical direction; a height sensor for measuring the height position of the light-emitting unit and the light-receiving unit; and a height position measured by the height sensor and a pre-known The system comprises a storage unit that stores a correction value for the linearity error with respect to the true height position for each slot of the carrier, and a control unit, wherein the control unit measures the production height position of the production substrate in the carrier placed on the stage using the height sensor by moving the light-emitting unit and the light-receiving unit with the lifting unit, reads the correction value corresponding to the slot in which the production substrate is inserted by referring to the storage unit, corrects the production height position using the correction value, and controls the removal and storage operations of the transport robot based on the corrected production height position.

[0009] According to the substrate transport device of the present invention, the control unit reads a correction value corresponding to the slot into which the substrate W is inserted by referring to the storage unit, and uses this correction value to correct the production height position of the production substrate. This improves the measurement accuracy of the production height position.

[0010] Furthermore, in the substrate transport device described above, the correction value stored in the memory unit is preferably obtained using a calibration jig equipped with a plurality of calibration substrates in a horizontal position, aligned at regular intervals in the vertical direction to correspond to each slot of the carrier, as follows: The control unit moves the light-emitting unit and the light-receiving unit by the lifting unit, measures the calibration height position of one of the plurality of calibration substrates on the calibration jig placed on the stage using the height sensor, and calculates the correction value for correcting the linearity error by taking the difference between the pre-known true height position of the calibration substrate and the calibration height position measured by the height sensor.

[0011] The control unit can calculate a correction value by subtracting the calibration height position measured by the height sensor from the known true height position of the calibration substrate of the calibration jig.

[0012] Furthermore, in the substrate transport device described above, the first correction value, second correction value, and third correction value, including the correction value stored in the storage unit, are obtained using a calibration jig equipped with a plurality of calibration substrates in a horizontal position aligned at regular intervals in the vertical direction, as follows: the plurality of calibration substrates is fewer than the plurality of slots, the first slot and the second slot of the plurality of slots correspond to the first calibration substrate and the second calibration substrate of the plurality of calibration substrates, respectively, the third slot of the plurality of slots is positioned between the first slot and the second slot, and the control unit moves the light-emitting unit and the light-receiving unit by the lifting unit, thereby obtaining the substrate Preferably, the height sensor measures the first and second calibration height positions of the first and second calibration substrates of the calibration jig placed on the jig, respectively, and calculates the first and second correction values ​​for correcting the linearity error related to the first and second slots by subtracting the first and second calibration height positions measured by the height sensor from the first and second true height positions of the first and second calibration substrates that are known in advance, respectively, and then calculates the third correction value related to the third slot by linear interpolation based on the first and second correction values.

[0013] For example, if the number of calibration boards is less than the number of slots (multiple production boards), there may be no calibration board corresponding to the third slot located between the first and second slots. In this case, the control unit calculates a third correction value for the third slot by linear interpolation based on the first and second correction values ​​for the first and second slots. Therefore, the production height position of the production board stored in the third slot can be corrected using the third correction value calculated by linear interpolation. This improves the measurement accuracy of the production height position of the production board stored in the third slot. Furthermore, since the number of calibration boards in a calibration jig is less than the number of slots, the calibration jig can be simplified.

[0014] Furthermore, in the substrate transport device described above, one example of the true height position of the calibration substrate is a value measured by a three-dimensional measuring machine.

[0015] Furthermore, in the substrate transport apparatus described above, it is preferable that the control unit measures the calibration height position by measuring the position corresponding to the minimum value of the first valley in the first signal waveform output from the mapping sensor, where the light from the light-emitting unit is blocked by the calibration substrate and the signal value becomes smaller, using the height sensor.

[0016] For example, suppose that the height of the substrate is obtained by measuring two height positions on the top and bottom surfaces of the substrate, and then calculating the center position of the two height positions. In this case, two measurement operations for the two heights and a calculation operation for the center position are required to obtain the height of the substrate. According to the present invention, since the calibration height position corresponding to the minimum value of the first valley is measured by a height sensor, the calibration height position of the calibration substrate can be obtained in a single measurement operation.

[0017] Furthermore, in the substrate transport apparatus described above, it is preferable that the control unit measures the production height position by measuring the position corresponding to the minimum value of the second valley in the second signal waveform output from the mapping sensor, where the light from the light-emitting unit is blocked by the production substrate and the signal value becomes smaller, using the height sensor.

[0018] Similarly, since the production height position corresponding to the minimum value of the second valley is measured by a height sensor, the production height position of the production board can be obtained in a single measurement operation.

[0019] Furthermore, in the substrate transport apparatus described above, when the minimum value of the first valley is located between the first reference point of the first pulse and the second reference point of the second pulse, the control unit acquires a time difference value between the pulse time corresponding to the first reference point of the first pulse and the mapping time corresponding to the minimum value of the first valley, and further acquires the internal distance from the first reference point to the minimum value of the valley by integrating the time difference value with the moving speed of the light-emitting unit and the light-receiving unit, and preferably uses the internal distance when measuring the first calibration height position. This makes it possible to measure distance and position with a higher resolution than the resolution of the height sensor.

[0020] Furthermore, in the substrate transport device described above, an example of the height sensor is a rotary encoder. Also, in the substrate transport device described above, an example of the lifting section comprises two pulleys and a timing belt wrapped around the two pulleys to move around them, and the light-emitting section and the light-receiving section are moved vertically using the timing belt. This makes it possible to suppress the linearity error of the timing belt caused by the expansion and contraction of the timing belt.

[0021] Furthermore, the substrate processing apparatus according to the present invention is characterized by comprising the above-described substrate transport device and a substrate processing unit that processes the production substrate transported by the transport robot.

[0022] Furthermore, the substrate transport method according to the present invention is a substrate transport method used in a substrate transport device for loading and unloading substrates, wherein the substrate transport device comprises a stage on which a carrier for inserting and supporting production substrates in a horizontal position is placed in each of a plurality of slots formed at regular intervals in the vertical direction, a transport robot equipped with a hand for holding the production substrates and for removing and storing the production substrates from the carrier, a mapping sensor having a light-emitting unit and a light-receiving unit, a lifting unit for moving the light-emitting unit and the light-receiving unit together in the vertical direction, a height sensor for measuring the height position of the light-emitting unit and the light-receiving unit, and a known height position measured by the height sensor and The substrate transport method comprises a storage unit that stores a correction value for the linearity error with respect to the true height position for each slot of the carrier, and is characterized by comprising: a production measurement step of measuring the production height position of the production substrate in the carrier placed on the stage with the height sensor by moving the light-emitting unit and the light-receiving unit with the lifting unit; a correction step of reading the correction value corresponding to the slot in which the production substrate is inserted by referring to the storage unit and correcting the production height position using the correction value; and a transport robot control step of controlling the removal and storage operations of the transport robot based on the corrected production height position.

[0023] In the substrate transport method described above, it is preferable to further include a correction value acquisition step in which a correction value stored in the storage unit is acquired to correspond to each slot of the carrier, using a calibration jig equipped with a plurality of calibration substrates in a horizontal position aligned at regular intervals in the vertical direction, wherein the correction value acquisition step includes a calibration measurement step in which the calibration height position of one of the plurality of calibration substrates of the calibration jig placed on the stage is measured with the height sensor by moving the light-emitting unit and the light-receiving unit with the lifting unit, and a correction value calculation step in which a correction value is calculated to correct the linearity error, which is the difference between the pre-known true height position of the calibration substrate and the calibration height position measured by the height sensor.

[0024] According to the substrate transfer device, substrate processing device, and substrate transfer method according to the present invention, the measurement accuracy can be improved.

Brief Description of Drawings

[0025] [Figure 1] It is a plan view showing a substrate processing device according to Example 1. [Figure 2] It is a cross-sectional view of a carrier. [Figure 3] It is a front view of a carrier. [Figure 4] It is a longitudinal sectional view showing a substrate processing device according to Example 1. [Figure 5] It is a side view showing a lid attaching / detaching part. [Figure 6] It is a plan view showing a mapping sensor located at a standby position. [Figure 7] It is a plan view showing a mapping sensor located at a detection position. [Figure 8] It is a block diagram showing a control system of a substrate processing device. [Figure 9] (a) is a plan view showing a calibration jig, and (b) is a longitudinal sectional view of the calibration jig taken along the arrow G-G. [Figure 10] It is a flowchart for explaining the operation of a substrate processing device. [Figure 11] It is a diagram for explaining the linearity error of a timing belt. [Figure 12] It is a side view showing the state where the light irradiated from a light projecting part travels toward a light receiving part. [Figure 13] It is a longitudinal sectional view showing the operation of mapping to a calibration substrate. [Figure 14] (a) is a diagram showing the signal waveform output from a mapping sensor in the mapping to a calibration substrate, and (b) is a diagram showing the pulse output from a rotary encoder. [Figure 15] It is a longitudinal sectional view showing the operation of mapping to a substrate (production substrate). [Figure 16](a) is a diagram showing the signal waveform output from the mapping sensor during mapping onto a substrate (production substrate), and (b) is a diagram showing the pulse output from the rotary encoder. [Figure 17] This diagram illustrates a method for obtaining the thickness of a circuit board (a circuit board used for production). [Figure 18] This is a side view illustrating how to calculate clearance. [Figure 19] This figure shows experimental results comparing the linearity error before and after calibration. [Figure 20] This is a longitudinal cross-sectional view showing a calibration jig equipped with 13 calibration substrates according to Example 2. [Figure 21] This figure shows an example of measurement results indicating the true height positions of 13 calibration substrates in a calibration jig. [Figure 22] This diagram illustrates a method for calculating the linearity error between two linearity errors using linear interpolation. [Figure 23] This diagram illustrates the method for calculating internal distance in a modified example. [Figure 24] This is a side view showing the sensor movement part related to another modified example. [Figure 25] This is a side view showing the sensor movement part related to another modified example. [Modes for carrying out the invention]

[0026] The following describes Example 1 of the present invention. [Examples]

[0027] Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. Figure 1 is a plan view showing the substrate processing apparatus 1 according to Embodiment 1. Figure 2 is a cross-sectional view of the carrier C, and Figure 3 is a front view of the carrier C. Figure 4 is a longitudinal cross-sectional view showing the substrate processing apparatus 1 according to Embodiment 1. Figure 5 is a side view showing the lid attachment / detachment section 11.

[0028] <1. Configuration of substrate processing equipment> Refer to Figure 1. The substrate processing apparatus 1 processes the substrate W. The substrate processing apparatus 1 comprises an indexer block 2 and a processing block 3.

[0029] The horizontal direction in which the indexer block 2 and processing block 3 are positioned is called the front-to-back direction (X direction). The direction from processing block 3 towards indexer block 2 is forward, and the opposite direction is backward. The horizontal direction perpendicular to the front-to-back direction is called the width direction (Y direction). The direction perpendicular to both the front-to-back direction and the width direction is called the up-and-down direction (Z direction).

[0030] <1-1. Indexer Block> The indexer block 2 comprises at least one (e.g., two or four) load ports (openers) 5, a housing 7, and a transport robot IR. The load ports 5 are used for loading and unloading substrates W. Each load port 5 is equipped with a stage 9 and a lid attachment / detachment section 11 (see Figure 4). A carrier C and a calibration jig 81 (described later) are selectively placed on the stage 9.

[0031] The carrier C is designed to house multiple (e.g., 25) substrates W in a horizontal orientation, aligned vertically (Z-direction) at regular intervals (e.g., 10 mm pitch). The substrates W are formed, for example, in a disc shape. A Front Opening Unify Pod (FOUP) is used as the carrier C, but is not limited to this. For example, the carrier may be a cassette (open cassette) without a lid portion 17 (described later) that closes the opening 14 (described later).

[0032] Refer to Figures 2 and 3. The carrier C comprises a container (carrier body) 13, an opening 14, multiple pairs (e.g., 25 pairs) of shelves 15, 16, and a lid 17. The container 13 houses multiple substrates W. The opening 14 is provided on the front of the container 13. Each of the multiple substrates W is removed from and placed back into the carrier C through the opening 14. When the carrier C is being transported, the lid 17 that closes the opening 14 is attached to the container 13. When removing the substrates W from the carrier C, the lid 17 is removed from the container 13.

[0033] Multiple pairs of shelves 15, 16 are provided vertically within the container 13. In the vertical direction, the multiple pairs of shelves 15, 16 are arranged at regular intervals (for example, 10 mm pitch) according to the design. One substrate W is placed horizontally on each pair of shelves 15, 16. As shown in Figure 3, for example, 25 shelves 15 are provided on the left inner wall 13A of the container 13, and 25 shelves 16 are provided on the right inner wall 13B of the container 13.

[0034] Furthermore, within the carrier C, for example, the space between two pairs of vertically adjacent shelf sections 15, 16 that accommodates one substrate W is called a slot. Therefore, the carrier C supports substrates W in a horizontal position by inserting them into each of the multiple (e.g., 25) slots SL (SL1 to SL25) formed at regular intervals in the vertical direction. In other words, the carrier C has multiple (e.g., 25) slots SL1 to SL25, each accommodating multiple (e.g., 25) substrates W. The 25 slots SL1 to SL25 are arranged in order from bottom to top. Slot SL1 is the lowest slot, and slot SL25 is the highest slot.

[0035] In Figure 3, for example, board W23 of the 25 boards W (W1 to W25) is housed in slot SL23 of the 25 slots SL1 to SL25. Board W24 is housed in slot SL24, and board W25 is housed in slot SL25.

[0036] Refer to Figures 1, 4, and 5. The two load ports 5 are arranged in the width direction (Y direction). The two load ports 5 are located at the front of the indexer block 2. Specifically, the two load ports 5 are located on the outside of the housing 7, on the front wall portion 7A of the housing 7. The wall portion 7A is provided with a passage opening 7B corresponding to the opening 14 of the carrier C placed on the stage 9 of each load port 5. For example, the transport robot IR removes the substrate W from the carrier C placed on the stage 9 through the passage opening 7B.

[0037] The lid attachment / detachment section 11 of the load port 5 includes a shutter section 19, a shutter forward / backward section 21, a shutter lifting / lowering section 23, and a rotary encoder (height sensor) 25. The shutter section 19 opens and closes the corresponding passage opening 7B. The shutter section 19 can also hold the lid section 17 of the carrier C. Therefore, the shutter section 19 can remove the lid section 17 from the carrier C or attach the lid section 17 to the carrier C.

[0038] The shutter advancement / retraction mechanism 21 moves the shutter unit 19 forward and backward in the front-rear direction (X direction). The shutter advancement / retraction mechanism 21 comprises, for example, an electric motor 21A, a screw shaft 21B, a slider 21C, and a guide rail 21D. Alternatively, the shutter advancement / retraction mechanism 21 may be equipped with an air cylinder instead of the electric motor 21A and screw shaft 21B. The slider 21C supports the shutter unit 19.

[0039] The shutter lifting unit 23 includes, for example, an electric motor 23A, two pulleys 23B and 23C, a timing belt 23D, a slider 23E, and a guide rail 23F. The shutter lifting unit 23 uses the timing belt 23D to move the shutter unit 19, the light-emitting unit 27A (described later), the light-receiving unit 27B (described later), and the sensor support member 31 (described later) together in the vertical direction (Z direction).

[0040] Two pulleys 23B and 23C are arranged vertically. The two pulleys 23B and 23C are each rotatably supported around two horizontal axes AX1 and AX2. The two horizontal axes AX1 and AX2 each extend, for example, in the width direction (Y direction). A ring-shaped timing belt 23D is wrapped around the two pulleys 23B and 23C so as to move around them. A slider 23E is also attached (fixed) to the timing belt 23D. A guide rail 23F is arranged to extend vertically. The slider 23E is guided vertically by the guide rail 23F. The slider 23E supports the shutter advance / return section 21.

[0041] The rotating output shaft of the electric motor 23A is connected, for example, to the lower pulley 23B. The electric motor 23A rotates the pulley 23B around the horizontal axis AX1. When the lower pulley 23B is rotated, the timing belt 23D causes the upper pulley 23C to rotate around the horizontal axis AX2. When the electric motor 23A rotates the pulley 23B in the forward direction, the slider 23E, shutter advance / retraction section 21, shutter section 19, light emitter 27A, and light receiver 27B rise along with the movement of the timing belt 23D. Conversely, when the electric motor 23A rotates the pulley 23B in the reverse direction, the slider 23E and the other components descend along with the movement of the timing belt 23D.

[0042] The rotary encoder 25 measures the height positions of the shutter unit 19, the light-emitting unit 27A, and the light-receiving unit 27B. The rotary encoder 25 is connected, for example, to the upper pulley 23C. The rotary encoder 25 detects the amount of mechanical displacement of the rotation of the pulley 23C and outputs a pulse (pulse signal). By counting the number of pulses from the rotary encoder 25, the vertical movement of the shutter unit 19, the light-emitting unit 27A, and the light-receiving unit 27B is obtained, as well as the height positions of the shutter unit 19, the light-emitting unit 27A, and the light-receiving unit 27B from their reference positions.

[0043] The rotary output shaft of the electric motor 23A may be connected to the upper pulley 23C instead of the lower pulley 23B. The rotary encoder 25 may also be connected to the lower pulley 23B instead of the upper pulley 23C to detect the mechanical displacement of the lower pulley 23B. Furthermore, if the rotary output shaft of the electric motor 23A is connected to the lower pulley 23B, the rotary encoder 25 may also be connected to the lower pulley 23B.

[0044] Refer to Figures 6 and 7. The lid attachment / detachment unit 11 further includes a mapping sensor 27 and a sensor movement unit 29. The mapping sensor 27 is used for mapping (mapping operation) to measure (acquire) the state of the substrate W (for example, the height position, thickness, and inclination of the substrate W). The mapping sensor 27 includes a light-emitting unit 27A and a light-receiving unit 27B.

[0045] As the mapping sensor 27, for example, a transmissive fiber sensor is used. Therefore, the mapping sensor 27 further comprises a light-emitting element (e.g., an LED: light-emitting diode), a light-receiving element, a first optical fiber, and a second optical fiber. The first optical fiber sends light from the light-emitting element to the light-emitting unit 27A. The second optical fiber sends the light received by the light-receiving unit 27B to the light-receiving element. The light-receiving element converts the received light into an electrical signal. The mapping sensor 27 outputs a signal corresponding to the amount of light (received intensity) of the light received by the light-receiving unit 27B.

[0046] The light-emitting unit 27A and the light-receiving unit 27B are provided, for example, on the upper surface of the shutter unit 19 via a sensor movement unit 29. The sensor movement unit 29 includes a sensor support member 31 that supports the light-emitting unit 27A and the light-receiving unit 27B. The sensor support member 31 is formed, for example, in a C-shape in plan view.

[0047] The light-emitting unit 27A and the light-receiving unit 27B are arranged in the width direction (Y direction). Specifically, the light-emitting unit 27A and the light-receiving unit 27B are arranged in the horizontal direction (Y direction) perpendicular to the insertion / removal direction TD in which the substrate W is inserted into and removed from the carrier C through the opening 14 of the carrier C. The light-emitting unit 27A is provided at the first end of the C-shaped sensor support member 31, and the light-receiving unit 27B is provided at the second end of the sensor support member 31. The light-emitting unit 27A is positioned at the same height as the light-receiving unit 27B. The light-emitting unit 27A and the light-receiving unit 27B face each other. If there are no obstacles blocking the light, the light emitted from the light-emitting unit 27A is received by the light-receiving unit 27B. The optical axis LT connecting the light-emitting unit 27A and the light-receiving unit 27B extends in the width direction (Y direction).

[0048] The sensor moving unit 29 further includes, for example, an electric motor, a screw shaft, and a guide rail. Alternatively, the sensor moving unit 29 may be equipped with an air cylinder. The sensor moving unit 29 moves the light-emitting unit 27A, the light-receiving unit 27B, and the sensor support member 31 linearly in the front-rear direction (X direction). Normally, the light-emitting unit 27A and the light-receiving unit 27B are in standby position (see Figure 6). When mapping is performed, the sensor moving unit 29 moves the light-emitting unit 27A and the light-receiving unit 27B into the carrier C placed on the stage 9 (see Figure 7). When the light-emitting unit 27A and the light-receiving unit 27B are in the detection position, they are positioned on the opening 14 side so that, in a plan view, they face each other across the periphery of the substrate W. That is, the optical axis LT intersects the periphery of the substrate W in a plan view.

[0049] Note that the load port 5, or the load port 5 and the transport robot IR, corresponds to the substrate transport device of the present invention. The shutter lifting unit 23 corresponds to the lifting unit of the present invention.

[0050] Refer to Figures 1 and 4. Next, the transport robot IR will be described. The transport robot IR is located inside the housing 7. The transport robot IR transports the substrate W between the two carriers C of the two load ports 5 and the substrate mounting section PS (described later). For example, a horizontal articulated robot is used as the transport robot IR. The transport robot IR is equipped with a hand 41, an articulated arm 43, a lifting platform 45, and a height sensor 47.

[0051] The hand 41 holds the substrate W in a horizontal position. The transport robot IR uses the hand 41 to remove and place the substrate W into the carrier C placed on the stage 9.

[0052] The hand 41 is connected to the tip of the articulated arm 43. The base of the articulated arm 43 is connected to a lifting platform 45 so as to be rotatable around a vertical axis. The articulated arm 43 moves the hand 41 horizontally (XY direction). The articulated arm 43 can also change the orientation of the hand 41. The lifting platform 45 moves the hand 41 and the articulated arm 43 vertically (Z direction). The articulated arm 43 and the lifting platform 45 are each equipped with electric motors. A height sensor 47 measures the height position of the hand 41. The height sensor 47 is equipped with, for example, a rotary encoder.

[0053] The transport robot IR may, instead of having a multi-joint arm, be equipped with, for example, a reciprocating section having a screw shaft and a guide rail. This reciprocating section moves the hand 41 forward and backward.

[0054] <1-2. Processing Block> Refer to Figure 1. Processing block 3 comprises at least one processing unit 51, a center robot CR, and a substrate mounting section (shelf) PS. The substrate mounting section PS is located between the transport robot IR and the center robot CR. The substrate mounting section PS can hold one or more substrates W.

[0055] The processing unit 51 performs a pre-set process on the substrate W. The processing unit 51 performs at least one of the following processes: coating a processing solution such as a resist, developing, washing, and polishing (grinding). For example, the processing unit 51 includes, for example, a holding and rotating unit 53 and a nozzle 55. The holding and rotating unit 53 includes a spin chuck that holds one substrate W in a horizontal position and an electric motor that rotates the spin chuck around a vertical axis passing through the center of the substrate W. The nozzle 55 discharges the processing solution onto the upper surface of the substrate W held by the holding and rotating unit 53.

[0056] Furthermore, if the processing unit 51 performs a cleaning process, it may be equipped with a brush. Also, if the processing unit 51 performs a polishing (grinding) process, it may be equipped with a polishing tool. In addition, the processing unit 51 may perform a dry etching process, an ashing process, or a film formation process.

[0057] The center robot CR is configured similarly to the transport robot IR. Briefly, the center robot CR is equipped with a hand 61 that holds the substrate W in a horizontal position. The center robot CR moves the hand 61 that holds the substrate W in the horizontal direction (XY direction) and the vertical direction (Z direction). The center robot CR transports the substrate W between at least one processing unit 51 and the substrate mounting section PS.

[0058] <1-3. Control System for Substrate Processing Equipment> Refer to Figure 8. The substrate processing apparatus 1 comprises a control unit 71, a storage unit (storage medium) 73, and a notification unit 75. The control unit 71 controls each component of the substrate processing apparatus 1. The control unit 71 comprises one or more processors, such as a central processing unit (CPU). The storage unit 73 comprises at least one of ROM (Read-Only Memory), RAM (Random-Access Memory), and a hard disk.

[0059] The memory unit 73 stores computer programs necessary to control each component of the substrate processing apparatus 1. The memory unit 73 also stores various operations (for example, steps S01 to S09 described later). The memory unit 73 stores the correction value HS of the linearity error LG between the calibration height position HA measured by the rotary encoder 25 and the true height position SN for each slot SL of the carrier C.

[0060] Furthermore, the memory unit 73 stores, for example, 25 true height positions SN (SN1 to SN25), 25 calibration height positions HA (HA1 to HA25), 25 production height positions HB (HB1 to HB25), 25 linearity errors LG1 to LG25 (25 correction values ​​HS1 to HS25), corrected height positions HD (HD1 to HD25), and 25 thicknesses TK (TK1 to TK25). The notification unit 75 includes, for example, at least one of a buzzer, speaker, lamp (light), or display such as a liquid crystal.

[0061] <2. Calibration Jig> Next, the calibration jig 81 will be described. The calibration jig 81 is used for calibration work. Calibration work is performed, for example, when the substrate processing device 1 is started up, but is not limited to this timing. Calibration work may also be performed when the load port 5 is started up. Figure 9(a) is a plan view of the calibration jig 81. Figure 9(b) is a longitudinal cross-sectional view of the calibration jig 81 shown by the arrow GG in Figure 9(a).

[0062] The calibration jig 81 is formed to mimic a carrier C and multiple substrates W. Therefore, the calibration jig 81 is also called a dummy jig. The calibration jig 81 is designed to include multiple (e.g., 25) calibration substrates CW (CW1 to CW25) arranged horizontally at regular intervals (e.g., 10 mm pitch) in the vertical direction, and a substrate support member 83. In Figure 9(b), the symbol PT1 indicates the interval (or pitch). The multiple calibration substrates CW and the substrate support member 83 are made of, for example, metal. Multiple calibration substrates CW are provided on the front of the substrate support member 83. In Figure 9(a), each calibration substrate CW is formed in a semicircular shape that mimics a part of the substrate W. The length PJ shown in Figure 9(a) may be smaller than the radius of the arc of the calibration substrate CW.

[0063] In the calibration jig 81 shown in Figure 9(b), the portion where the calibration substrate CW is placed constitutes a calibration slot. In other words, the calibration jig 81 has multiple (e.g., 25) calibration slots CS1 to CS25, each of which is placed a multiple (e.g., 25) calibration substrate CW. For example, calibration substrate CW23, one of the 25 calibration substrates CW1 to CW25, is placed in calibration slot CS23 of the 25 calibration slots CS1 to CS25. Calibration substrate CW24 is placed in calibration slot CS24. Calibration substrate CW25 is placed in calibration slot CS25.

[0064] In Figures 3 and 9(b), for example, calibration slot CS23 corresponds to slot SL23. In other words, calibration slot CS23 is at the same height as slot SL23 (Figure 3). Also, calibration slot CS24 corresponds to slot SL24, and calibration slot CS25 corresponds to slot SL25.

[0065] The 25 true height positions SN(SN1~SN25) of the 25 calibration substrates CW1~CW25 of the calibration jig 81 are values ​​that have been known in advance through measurement. Each of the 25 true height positions SN1~SN25 is a value measured, for example, by a three-dimensional measuring machine.

[0066] A three-dimensional measuring machine is, for example, a contact-type measuring machine. A three-dimensional measuring machine comprises, for example, a table, a probe, and a computer. The calibration jig 81, which is the object to be measured, is placed on the table. When the probe is brought into contact with the calibration jig 81 on the table, a contact signal is output to the computer. Based on the contact signal, the computer measures the coordinates of the 25 calibration substrates CW1 to CW25 of the calibration jig 81, i.e., the 25 true height positions SN1 to SN25, using one or more sensors.

[0067] <3. Operation of the substrate processing device> Figure 10 is a flowchart illustrating the operation of the substrate processing apparatus 1. In Figure 10, steps S01 to S03 are steps related to calibration work, and steps S04 to S09 are steps related to device production.

[0068] Figure 11 is a diagram illustrating the linearity error of the timing belt 23D. As shown in Figure 4, the timing belt 23D is interposed between the mapping sensor 27 (light-emitting unit 27A and light-receiving unit 27B) and the rotary encoder 25. Therefore, the linearity error of the timing belt 23D caused by the expansion and contraction of the timing belt 23D may adversely affect the measurement accuracy of the rotary encoder 25. For this reason, calibration work is performed in steps S01 to S03. According to this embodiment, the linearity error of the timing belt 23D caused by the expansion and contraction of the timing belt 23D can be suppressed. Calibration work is performed for each load port 5.

[0069] The calibration jig 81 shall have 25 calibration slots CS1 to CS25, each containing 25 calibration substrates CW1 to CW25. The carrier C shall have 25 slots SL1 to SL25, each containing 25 substrates W1 to W25.

[0070] Furthermore, the 25 circuit boards W correspond to 25 calibration circuit boards CW1 to CW25. For example, circuit board W23 (and slot SL23) corresponds to calibration circuit board CW23. That is, circuit board W23 (and slot SL23) is at the same height as calibration circuit board CW23. Similarly, circuit board W24 (and slot SL24) corresponds to calibration circuit board CW24. Circuit board W25 (and slot SL25) corresponds to calibration circuit board CW25.

[0071] [Step S01] Preparation of calibration jig The operator prepares the calibration jig 81. The memory unit 73 of the substrate processing device 1 needs to store the 25 true height positions SN1 to SN25 for each of the 25 calibration substrates CW1 to CW25 in the calibration jig 81. First, the operator measures the 25 true height positions SN1 to SN25 using, for example, a three-dimensional measuring machine. Each of the 25 true height positions SN1 to SN25 is, for example, the center position of the thickness.

[0072] After measurement, the operator stores the 25 true height positions SN1 to SN25 in the memory unit 73. The calibration jig 81 is placed on one of the two load ports 5, on the stage 9. If the 25 true height positions SN1 to SN25 are known in advance (i.e., if the 25 true height positions SN1 to SN25 are already stored in the memory unit 73), the measurement procedure may be omitted.

[0073] [Step S02] Mapping of the calibration substrate After the calibration jig 81 is placed on the stage 9, the lid attachment / detachment unit 11 moves the shutter unit 19 to open the passage opening 7B. Then, the lid attachment / detachment unit 11 brings the light-emitting unit 27A and the light-receiving unit 27B facing the calibration jig 81 through the passage opening 7B.

[0074] As shown in Figure 6, the light-emitting unit 27A and the light-receiving unit 27B are positioned in a standby position. The sensor movement unit 29 moves the light-emitting unit 27A and the light-receiving unit 27B forward. As a result, as shown in Figure 7, the light-emitting unit 27A and the light-receiving unit 27B are positioned to face each other in a plan view, for example, across the periphery of the calibration substrate CW25.

[0075] Subsequently, the mapping sensor 27 is activated. This activates the light-emitting unit 27A to emit light and the light-receiving unit 27B to receive light. The light emitted from the light-emitting unit 27A spreads out towards the light-receiving unit 27B, for example, in a conical shape, as shown in Figure 12. The light emitted from the light-emitting unit 27A may also spread out towards the light-receiving unit 27B, for example, in a fan shape, at least in the vertical direction. The light emitted from the light-emitting unit 27A is received by the light-receiving unit 27B. As a result, the mapping sensor 27 outputs a signal corresponding to the amount of light received by the light-receiving unit 27B.

[0076] For example, if the light emitted from the light-emitting unit 27A is not blocked by an obstacle including the substrate W, the light-receiving unit 27B receives a certain amount of light, and the mapping sensor 27 outputs a signal value S1 of a certain magnitude. This signal value S1 will be called the "signal value S1 when light is not blocked". In contrast, if the light from the light-emitting unit 27A is blocked by the substrate W, the amount of light received by the light-receiving unit 27B decreases. Therefore, the mapping sensor 27 outputs a signal with a value smaller than the signal value S1.

[0077] The memory unit 73 stores 25 correction values ​​HD1 to HD25, which will be described later. Each correction value HD stored in the memory unit 73 is acquired as follows using a calibration jig 81 equipped with 25 horizontal calibration boards CW1 to CW25 aligned at regular intervals in the vertical direction to correspond to each slot SL1 to SL25 of the carrier C. Specifically, the control unit 71 moves the light-emitting unit 27A and the light-receiving unit 27B by the shutter lifting unit 23, and measures the calibration height position HA of the calibration board CW on the calibration jig 81 placed on the stage 9 with the rotary encoder 25. Subsequently, the control unit 71 calculates a correction value HD that corrects the linearity error LG, which is the difference between the known true height position SN of the calibration board CW and the calibration height position HA of the calibration board CW measured by the rotary encoder 25.

[0078] These operations will be explained in order. Refer to Figure 13. The control unit 71 lowers the operating light-emitting unit 27A and light-receiving unit 27B using the shutter lifting unit 23. This allows the rotary encoder 25 to measure the 25 calibration height positions HA1 to HA25 of the 25 calibration substrates CW1 to CW25 of the calibration jig 81 placed on the stage 9. This operation will be explained in more detail.

[0079] The light-emitting unit 27A and the light-receiving unit 27B are positioned higher than the calibration substrate CW25 of the calibration slot CS25. The shutter lifting unit 23 performs mapping to lower the light-emitting unit 27A and the light-receiving unit 27B while they are in operation.

[0080] The mapping sensor 27 outputs the signal waveform shown in Figure 14(a). The rotary encoder 25 outputs pulses (pulse signals) corresponding to the amount of movement of the light-emitting unit 27A and the light-receiving unit 27B, as shown in Figure 14(b). The signal waveform output from the mapping sensor 27 and the pulses output from the rotary encoder 25 are sent to the control unit 71.

[0081] In Figure 14(a), the horizontal axis represents time, and the vertical axis represents signal intensity (voltage (mV)). In Figure 14(b), the horizontal axis represents time, and the vertical axis represents pulse ON (1) and OFF (0).

[0082] The signal waveform output from the mapping sensor 27 contains 25 valleys VA (VA1 to VA25) corresponding to the 25 substrates W. Each of the valleys VA1 to VA25 is a portion where the light from the light-emitting unit 27A is blocked by the corresponding substrate W, resulting in a smaller signal value. Figure 14(a) shows two valleys VA25 and VA24, respectively, corresponding to the two substrates W25 and W24 shown in Figure 13.

[0083] When the light-emitting unit 27A and the light-receiving unit 27B pass through the center position of the thickness of each substrate W, the signal output from the mapping sensor 27 has the property of becoming a minimum value. Therefore, the control unit 71 measures the position corresponding to the minimum value MNA25 of the signal in the valley VA25, for example, in the signal waveform from the mapping sensor 27 using the rotary encoder 25. This measures the calibration height position HA25 of the calibration substrate CW25.

[0084] For example, when using the starting height position HTS of the mapping as a reference (see Figure 13), the control unit 71 counts the number of pulses from the starting height position HTS (corresponding time) to obtain the downward movement amount MV1 (= movement amount per pulse × number of pulses) from the starting height position HTS to the signal minimum value MNA25. The control unit 71 can also obtain the calibration height position HA25 of the calibration substrate CW25 corresponding to the signal minimum value MNA25 of the valley VA1 from the starting height position HTS and the movement amount MV1.

[0085] Furthermore, for example, in the case of valley VA24, the height position HA24 of the calibration board CW24 corresponding to the signal minimum MNA24 is obtained. By counting the number of pulses between the signal minimum MNA25 of valley VA25 and the signal minimum MNA24 of the next valley VA24, the displacement (distance) MV2 between two adjacent boards W24 and W25 is obtained. Similarly, for the remaining 23 valleys VA1 to VA23, 23 calibration height positions HA1 to HA23 of the 23 calibration boards CW1 to CW23 corresponding to the signal minimums MNA1 to MNA23 are obtained.

[0086] After mapping is performed, the sensor movement unit 29 retracts the light-emitting unit 27A and the light-receiving unit 27B from the detection position to the standby position (see Figures 6 and 7). Then, the lid attachment / detachment unit 11 closes the passage opening 7B with the shutter unit 19. After that, the calibration jig 81 is moved from the stage 9.

[0087] [Step S03] Calculation of linearity error The control unit 71 calculates 25 linearity errors LG1 to LG25 by subtracting the 25 true height positions SN1 to SN25 of the 25 calibration substrates CW1 to CW25 from the 25 calibration height positions HA1 to HA25 measured by the rotary encoder 25.

[0088] For example, the control unit 71 calculates the linearity error LG25 by subtracting the true height position SN25 of the calibration substrate CW25 from the calibration height position HA25 measured by the rotary encoder 25. The control unit 71 also calculates the linearity error LG24 by subtracting the true height position SN24 of the calibration substrate CW24 from the calibration height position HA24 measured by the rotary encoder 25. Each linearity error LGi is calculated by the following equation (1). Linearity error LGI = True height position SNi - Calibration height position HAi ... (1)

[0089] Here, "i" represents the slot number. For example, in the case of slot SL24, the slot number is "24". Also, in the case of slot SL25, the slot number is "25".

[0090] The 25 linearity errors LG1 to LG25 become the 25 correction values ​​HS1 to HS25, as shown in equation (2) below. Correction value HSi = Linearity error LGI ···(2)

[0091] The correction value HSi is set for each of the 25 slots SL1 to SL25 of the carrier C. The control unit 71 stores the calculated 25 correction values ​​HS1 to HS25 in the storage unit 73. This completes the calibration process.

[0092] [Step S04] Mapping of production substrates After calibration, a carrier C (production carrier) containing a substrate W (production substrate) for producing the device is placed on one of the two load ports 5, on stage 9.

[0093] Subsequently, the shutter portion 19 of the lid attachment / detachment portion 11 holds the lid portion 17 of the carrier C. Then, the shutter advance / retract portion 21 retracts the shutter portion 19. This removes the lid portion 17 from the carrier C and opens the passage opening 7B. Then, the shutter lifting portion 23 lowers the shutter portion 19 and the light-emitting portion 27A and light-receiving portion 27B slightly in order to allow the light-emitting portion 27A and light-receiving portion 27B to enter the carrier C.

[0094] Subsequently, the sensor movement unit 29 advances the light-emitting unit 27A and the light-receiving unit 27B from the standby position to the detection position (see Figures 6 and 7). As a result, the light-emitting unit 27A and the light-receiving unit 27B are positioned on the opening 14 side so that they face each other across the peripheral edge of the substrate W in a plan view.

[0095] Refer to Figure 15. Subsequently, the control unit 71 lowers the operating light-emitting unit 27A and light-receiving unit 27B using the shutter lifting unit 23. This allows the rotary encoder 25 to measure the 25 production height positions HB (HB1 to HB25) of the 25 substrates W1 to W25 in the carrier C placed on the stage 9. This operation will be explained in detail.

[0096] The light-emitting unit 27A and the light-receiving unit 27B are positioned higher than the calibration substrate CW25 of slot SL25. The shutter lifting unit 23 performs mapping to lower the operating light-emitting unit 27A and the light-receiving unit 27B.

[0097] The mapping sensor 27 outputs the signal waveform shown in Figure 16(a). The rotary encoder 25 outputs pulses (pulse signals) corresponding to the amount of movement of the light-emitting unit 27A and the light-receiving unit 27B, as shown in Figure 16(b). The control unit 71 acquires (detects) the state of the substrate W within the carrier C (e.g., the height position and thickness of the substrate W) based on the signal waveform from the mapping sensor 27 and the pulses from the rotary encoder 25. The order in which the height position and thickness of the substrate W are acquired is not limited.

[0098] (1) First, the operation of acquiring the production height position of the substrate W will be explained. The signal waveform output from the mapping sensor 27 contains 25 valleys VB1 to VB25 corresponding to the 25 substrates W1 to W25. Each of the valleys VB1 to VB25 is a part where the light from the light-emitting unit 27A is blocked by the corresponding substrate W, and the signal value becomes smaller. Figure 16(a) shows two valleys VB25 and VB24 corresponding to the two substrates W25 and W24 shown in Figure 15.

[0099] The control unit 71 uses the rotary encoder 25 to measure the position corresponding to the minimum value MNB25 of the signal in the valley VB25, for example, in the signal waveform output from the mapping sensor 27. This allows the production height position HB25 of the substrate W25 to be obtained.

[0100] For example, when using the starting height position HTS of the mapping as a reference (see Figure 15), the control unit 71 counts the number of pulses from the time corresponding to the starting height position HTS to obtain the downward movement amount MV1 (= movement amount per pulse × number of pulses) from the time corresponding to the starting height position HTS to the signal minimum value MNB25. The control unit 71 can also obtain the production height position HB25 of the substrate W25 corresponding to the signal minimum value MNB25 of the valley VB25 from the starting height position HTS and the movement amount MV1.

[0101] Furthermore, for example, in the case of valley VB24, the production height position HB24 of substrate W24 corresponding to the signal minimum MNB24 is measured. By counting the number of pulses between the signal minimum MNB25 of valley VB25 and the signal minimum MNB24 of the next valley VB24, the amount of movement (distance) MV2 between two adjacent substrates W25 and W24 is obtained. Similarly, for the remaining 23 valleys VB1 to VB23, the 23 production height positions HB1 to HB23 of the 23 substrates W corresponding to the 23 signal minimums MNB1 to MNB23 are obtained.

[0102] (2) Next, the operation for obtaining the thickness of the substrate W will be explained. For example, the thicknesses TK24 and TK25 of the two substrates W24 and W25 shown in Figure 15 will be obtained.

[0103] Refer to Figure 17. When the light-emitting unit 27A and the light-receiving unit 27B pass through the interface (upper and lower surfaces) of the substrate W, the signal output from the mapping sensor 27 has the property of being approximately half the depth from the signal value S1 in the unshielded state to the minimum signal value. Therefore, the control unit 71 obtains the thickness TK25 of the substrate W25 by measuring the distance corresponding to the section in the trough VB25 of the signal waveform that is approximately half or less of the depth DP25 from the signal value S1 in the unshielded state to the minimum signal value MNB25 using the rotary encoder 25.

[0104] Let me explain in detail. The control unit 71 determines that when the signal value of the signal waveform output from the mapping sensor 27 is below the threshold SK (or less than the threshold SK), it is approximately half the depth DP of each valley VB1 to VB25. This threshold SK is set in advance through experimentation. The control unit 71 obtains the thickness TK25 of the substrate W25 (= amount of movement per pulse × number of pulses) by counting the number of pulses in the section where the depth is approximately half or less.

[0105] In other words, the control unit 71 uses the rotary encoder 25 to measure the width of the signal waveform where, for example, the signal value of a valley VB25 is below the threshold SK. This allows the thickness TK25 of the substrate W25 to be measured. Similarly, the control unit 71 uses the rotary encoder 25 to measure the width of the signal waveform where, for example, the signal value of a valley VB24 is below the threshold SK. This allows the thickness TK24 of the substrate W24 to be measured.

[0106] Furthermore, the 23 thicknesses TK1 to TK23 of the remaining 23 substrates W1 to W23 are also obtained based on the threshold SK, similar to thicknesses TK24 and TK25. In Figure 17, the code TT corresponds to the height position of the upper surface of substrate W25, and the code TB corresponds to the height position of the lower surface of substrate W24.

[0107] After mapping is performed, the sensor movement unit 29 moves the light-emitting unit 27A and the light-receiving unit 27B from the detection position to the standby position (see Figures 6 and 7). Subsequently, the shutter lifting unit 23 lowers the shutter unit 19 to a position that does not obstruct the transport of the substrate W by the transport robot IR, as shown by the solid line in Figure 4.

[0108] [Step S05] Correction Next, the operation for correcting the production height position HB will be described. The control unit 71 refers to the storage unit 73 to read the correction value HS corresponding to the slot CL into which the production substrate CW is inserted, and corrects the height position of the production substrate CW using the correction value HS. This operation will be explained in detail.

[0109] The control unit 71 corrects 25 production height positions HB1 to HB25 using 25 correction values ​​HS1 to HS25 (= 25 linearity errors LG1 to LG25) read from the storage unit 73. For example, the control unit 71 corrects production height position HB25 using correction value HS25 (= linearity error LG25). The control unit 71 also corrects production height position HB24 using correction value HS24 (= linearity error LG24).

[0110] The control unit 71 corrects the production height positions HB1 to HB25 of the 25 substrates W1 to W25 according to the following equation (3). Corrected height position HDi = Production height position HBi + Correction value HSi ... (3)

[0111] Note that "i" is the slot number. According to equation (3), the corrected height positions HD1 to HD25 can be brought closer to the true height positions SN1 to SN25.

[0112] [Step S06] Is the clearance above the standard value? Next, the control unit 71 calculates clearances CL1 to CL24 for the 25 substrates W. The control unit 71 also determines whether each of the clearances CL1 to CL24 is equal to or greater than a preset reference value.

[0113] When clearances CL1 to CL24 are not specifically distinguished, they are written as "Clearance CL". Similarly, when height positions HD1 to HD25 are not specifically distinguished, they are written as "Height Position HD". When thicknesses TK1 to TK25 are not specifically distinguished, they are written as "Thickness TK".

[0114] Figure 18 is a side view showing the method for calculating clearance CL. Clearance CL is the total clearance between substrate WA and hand 41, and between substrate WB and hand 41, assuming that hand 41 is positioned between substrate WA and substrate WB.

[0115] First, let's explain how to calculate clearances CL1 to CL24. Clearance CL is calculated using either formula (4) or formula (5) below. Clearance CL = (Corrected height position HD of board WB - Thickness TK of board WB ÷ 2) - (Corrected height position HD of board WA + Thickness TK of board WA ÷ 2) - Thickness HH of hand 41 ... (4) Clearance CL = (Height position of the bottom surface of the board WB - Height position of the top surface of the board WA) - Thickness HH of the hand 41 ... (5)

[0116] Here, the two circuit boards WA and WB are two circuit boards that are adjacent to each other vertically. Circuit board WB is housed in, for example, slot SL25 within carrier C, and circuit board WA is housed in, for example, slot SL24.

[0117] Using equation (4) or equation (5) above, for example, the control unit 71 calculates the total clearance CL24 between the board W25 and the hand 41, and between the board W24 and the hand 41, assuming that the hand 41 is positioned between the two boards W25 and W24. In the same manner, 23 clearances CL1 to CL23 are calculated. Since the 24 clearances CL are calculated using 25 corrected height positions HD, each clearance CL can be calculated with high accuracy.

[0118] Next, the control unit 71 determines whether each of the 24 calculated clearances CL1 to CL24 is equal to or greater than a preset reference value. If at least one of the 24 clearances CL1 to CL24 is less than the reference value, the process proceeds to step S07. If all 24 clearances CL1 to CL24 are equal to or greater than the reference value, the process proceeds to step S08.

[0119] [Step S07] Stop transporting the circuit board and trigger an alarm. The control unit 71 controls the transport robot IR to prevent any of the substrates W from being removed from the carrier C when at least one of the 24 clearances CL is smaller than a preset reference value. If the clearance CL is small, when the hand 41 is inserted between the two substrates W, the hand 41 may come into contact with at least one of the two substrates W, potentially damaging that substrate W.

[0120] Furthermore, if at least one of the 24 clearances CL1 to CL24 is smaller than a preset reference value, the control unit 71 will notify the notification unit 75 that the clearance CL is smaller than the reference value, for example, by sounding a buzzer or flashing a lamp.

[0121] [Step S08] Removal of the circuit board If all 24 clearances CL1 to CL24 are above the standard value, the transport robot IR uses the hand 41 to insert it between, for example, two substrates W25 and W24 in the carrier C placed on the stage 9. As a result, the transport robot IR removes substrate W25 from the carrier C and transports the removed substrate W25 to the substrate mounting section PS. The transport robot IR then transports the remaining 24 substrates W in the carrier C to the substrate mounting section PS in order.

[0122] In other words, the control unit 71 controls the retrieval and storage operations of the transport robot IR based on the corrected height position HD of the substrate W. Since the hand 41 is precisely inserted into the carrier C based on the corrected height position HD, it is possible to prevent the hand from contacting the substrate W or the substrate W held by the hand from contacting the inside of the carrier C (e.g., shelf sections 15, 16) during the retrieval and storage operations.

[0123] [Step S09] Substrate processing The central robot CR removes the substrate W25 from the substrate mounting section PS and transports it to the processing unit 51. The processing unit 51 performs pre-set processing on the substrate W25 transported by the transport robot IR and the central robot CR. The central robot CR returns the substrate W25 processed by the processing unit 51 to the substrate mounting section PS. The remaining 24 substrates W are also transported by the central robot CR and processed by the processing unit 51.

[0124] The transport robot IR sequentially transports the 25 substrates W processed by the processing unit 51 from the substrate placement section PS to the carrier C placed on the stage 9. After the 25 substrates W are stored in the carrier C, the lid attachment / detachment section 11 attaches the lid 17, held by the shutter section 19, to the carrier C (container 13), and closes the passage opening 7B with the shutter section 19. The shutter section 19 then releases its hold on the lid 17. The carrier C is then transported from the stage 9 of the load port 5 to the next destination.

[0125] In this embodiment, the control unit 71 reads a correction value HS corresponding to the slot SL into which the substrate W is inserted by referring to the storage unit 73, and uses this correction value HS to correct the production height position HB of the substrate W. This improves the measurement accuracy of the production height position HB. The control unit 71 can also calculate the correction value HS by subtracting the calibration height position HA measured by the rotary encoder 25 from the known true height position SN of the calibration substrate CW of the calibration jig 81.

[0126] In other words, the control unit 71 measures the calibration height positions HA24 and HA25 for calibration substrates CW24 and CW25, for which the true height positions SN24 and SN25 are known in advance. The control unit 71 then subtracts the true height positions SN24 and SN25 from the measured calibration height positions HA24 and HA25. This calculates the linearity errors LG24 and LG25. The linearity errors LG24 and LG25 become the correction values ​​HS24 and HS25. Subsequently, the control unit 71 measures the production height positions HB24 and HB25 for substrates W24 and W25. The control unit 71 corrects the production height position HB25 of substrate W25 corresponding to calibration substrate CW25 with the correction value HS25, and also corrects the production height position HB24 of substrate W24 corresponding to calibration substrate CW24 with the correction value HS24. This improves the measurement accuracy of the production height positions HB24 and HB25.

[0127] Figure 19 shows the experimental results comparing the linearity error before calibration (no correction) and after calibration (with correction). In Figure 19, the linearity error for the 25 slots SL before calibration is within the range of -0.1 mm to 0.1 mm. In contrast, the linearity error for the 25 slots SL after calibration is within a narrower range than before calibration, specifically within the range of -0.05 mm to 0.05 mm. Therefore, it can be seen that the measurement accuracy has improved.

[0128] Furthermore, for example, the height position of the substrate may be obtained by measuring two height positions on the top and bottom surfaces of the substrate, and then calculating the center position of the two height positions. In this case, two measurement operations for the two heights and a calculation operation for the center position are required to obtain the height position of the substrate. According to this embodiment, for example, the calibration height position HA25 corresponding to the minimum value MNA25 of the valley VA25 shown in Figure 14(a) is measured by the rotary encoder 25, so the calibration height position HA25 of the calibration substrate CW25 can be obtained in a single measurement operation.

[0129] Similarly, for example, the production height position HB25 corresponding to the minimum value MNB25 of the valley VB25 shown in Figure 16(a) is measured by the rotary encoder 25, so the production height position HB25 of the substrate W25 can be obtained in a single measurement operation. [Examples]

[0130] Next, Embodiment 2 of the present invention will be described with reference to the drawings. Note that explanations that overlap with those in Embodiment 1 will be omitted.

[0131] In Example 1, the number of calibration substrates CW in the calibration jig 81 was the same as the number of substrates W in the carrier C. However, the number of calibration substrates CW may be less than the number of substrates W. In other words, the number of calibration boards CW can be fewer than the number of slots CL.

[0132] Figure 20 is a longitudinal cross-sectional view showing a calibration jig 81 according to Embodiment 2. The calibration jig 81 is designed to have multiple (e.g., 13) calibration substrates CW arranged horizontally at regular intervals (e.g., 20 mm pitch) in the vertical direction. In Figure 20, the reference numeral PT2 indicates the interval (or pitch). The interval PT2 is wider than the interval PT1 shown in Figure 9(a). The calibration jig 81 also has 13 calibration slots CS1, CS3, CS5, ..., CS23, CS25, where the 13 calibration substrates CW1, CW3, CW5, ..., CW23, CW25 are respectively arranged.

[0133] Preferably, the calibration jig 81 includes a calibration substrate CW1 corresponding to the substrate W1 at the lowest position of the carrier C, and a calibration substrate CW25 corresponding to the substrate W25 at the highest position. Furthermore, the number of calibration substrates CW is not limited to 25 or 13. For example, the number of calibration substrates CW may be 9, 7, or 5. For example, 9 calibration substrates CW may be aligned at regular intervals (e.g., 30 mm pitch).

[0134] Next, with reference to Figure 10, the operation of the substrate processing apparatus 1 (including the load port 5) according to Embodiment 2 will be described. The production carrier C is, for example, designed to accommodate 25 substrates W1 to W25.

[0135] [Step S01] Preparation of calibration jig The operator measures 13 true height positions SN1, SN3, SN5, ..., SN23, SN25 using, for example, a three-dimensional measuring machine. Each of the 13 true height positions SN1, SN3, SN5, ..., SN23, SN25 is, for example, the center position of the thickness. Figure 21 shows an example of the measurement results for the 13 true height positions SN1, SN3, SN5, ..., SN23, SN25. After measurement, the operator stores the 13 true height positions SN1, SN3, SN5, ..., SN23, SN25 in the memory unit 73. The calibration jig 81 is then placed on the stage 9 of a predetermined load port 5.

[0136] [Step S02] Mapping of the calibration substrate Subsequently, as shown in Figures 6 and 7, the sensor movement unit 29 moves the light-emitting unit 27A and the light-receiving unit 27B from the standby position to the detection position. Then, the control unit 71 lowers the operating light-emitting unit 27A and the light-receiving unit 27B using the shutter lifting unit 23. This allows the rotary encoder 25 to measure the 13 calibration height positions HA1, HA3, HA5, ..., HA23, HA25 of the 13 calibration substrates CW1, CW3, CW5, ..., CW23, CW25 of the calibration jig 81 placed on the stage 9.

[0137] [Step S03] Calculation of linearity error The control unit 71 subtracts the 13 true height positions SN1, SN3, SN5, ..., SN23, SN25 of the 13 calibration substrates CW1, CW3, CW5, ..., CW23, CW25 from the 13 calibration substrates HA1, HA3, HA5, ..., HA23, HA25 measured by the rotary encoder 25. This calculates 13 linearity errors LG1, LG3, LG5, ..., LG23, LG25.

[0138] The reference point for the height position (height) may be the lower surface of the calibration jig 81 (substrate support member 83) indicated by the symbol H0 in Figure 20 or Figure 9(b), or the upper surface of the stage 9. Alternatively, the reference point for the height position may be the center position of the thickness TK of the calibration substrate CW1 placed at the lowest position.

[0139] Here, in order to correct the 25 production height positions HB1 to HB25, in addition to 13 linearity errors LG (e.g., linearity error LG1), 12 linearity errors LG2, LG4, ..., LG22, LG24 are required. Alternatively, it can be said that in addition to 13 correction values ​​HS (e.g., correction value HS1), 12 correction values ​​HS2, HS4, ..., HS22, HS24 are required.

[0140] Refer to Figure 22. The control unit 71 calculates linearity error LG24 by linear interpolation based on two neighboring linearity errors (for example, linearity errors LG23 and LG25). The control unit 71 also calculates linearity error LG22 by linear interpolation based on linearity errors LG21 and LG23. Similarly, the control unit 71 calculates the remaining 10 LG2, LG4, ..., LG20 by linear interpolation. Note that the linearity error LG is calculated by linear interpolation using the following equation (6). LG=LGA+(LGB-LGA)×(HT-HTA)÷(HTB-HTA) ···(6)

[0141] Here, the variable LGA is the linearity error related to the lower calibration board. The variable LGB is the linearity error related to the upper calibration board. The variable HT is, for example, the design height position of a hypothetical calibration board. The variable HTA is, for example, the design height position of the lower calibration board. The variable HTB is, for example, the design height position of the upper calibration board.

[0142] Using the linear interpolation in equation (6), 12 linearity errors LG2, LG4, ..., LG22, LG24 are calculated. By adding these to 13 linearity errors LG (linearity errors LG23, LG25) obtained using 13 calibration boards CW (for example, calibration boards CW23, CW25), 25 linearity errors LG1 to LG25 are obtained. These 25 linearity errors LG1 to LG25 become 25 correction values ​​HS1 to HS25. The control unit 71 stores the 25 correction values ​​HS1 to HS25 in the storage unit 73. This completes the calibration process.

[0143] [Step S04] Mapping of production substrates After calibration, a carrier C (production carrier) containing the substrates W (production substrates) for producing the devices is placed on the stage 9. The control unit 71 lowers the operating light-emitting unit 27A and light-receiving unit 27B using the shutter lifting unit 23. This allows the rotary encoder 25 to measure the production height positions HB1 to HB25 of the 25 substrates W1 to W25 inside the carrier C placed on the stage 9.

[0144] [Step S05] Correction The control unit 71 corrects 25 production height positions HB1 to HB25 using 25 correction values ​​HS1 to HS25 (25 linearity errors LG1 to LG25) read from the storage unit 73.

[0145] Note that in Figure 10, steps S06 to S07 of Example 2 are the same as steps S06 to S07 of Example 1. Therefore, the explanation of steps S06 to S07 of Example 2 is omitted.

[0146] This embodiment has the following advantages. For example, since the 13 calibration boards CW are fewer than the 25 slots SL1 to SL25 (25 boards W), there may be cases where there is no calibration board CW24 corresponding to slot SL24 located between the two slots SL23 and SL25. In this case, the control unit 71 calculates a correction value HS24 (linearity error LG24) for slot SL24 by linear interpolation based on the two correction values ​​HS23 and HS25 (linearity errors LG23 and LG25) for the two slots SL23 and SL25. Therefore, the production height position HB24 of the board W24 housed in slot SL24 can be corrected using the correction value HS24 calculated by linear interpolation. As a result, the measurement accuracy of the production height position HB24 of the board W24 housed in slot SL24 can be improved. In addition, since the 13 calibration boards CW in the calibration jig 81 are fewer than the 25 slots SL, the calibration jig 81 can be simplified.

[0147] The present invention is not limited to the above embodiments and can be modified and implemented as follows.

[0148] (1) In the above-described embodiment, the calibration jig 81 is provided with a plurality of calibration substrates CW provided on the front of the substrate support member 83, as shown in Figures 9(a) and 9(b). However, the calibration jig 81 is not limited to this. For example, the calibration jig may be provided with a calibration carrier similar to the carrier C shown in Figures 2 and 3, and a plurality of calibration substrates CW housed within the calibration carrier. The calibration carrier may be made of metal. The plurality of calibration substrates CW may also be made of metal. Each calibration substrate CW is formed in a disc shape.

[0149] (2) In the above-described embodiment and modification (1), the shutter lifting unit 23 comprises two pulleys 23B and 23C, and a timing belt 23D wrapped around the two pulleys 23B and 23C to move around the two pulleys 23B and 23C. The shutter lifting unit 23 also moves the light-emitting unit 27A and the light-receiving unit 27B in the vertical direction using the timing belt 23D. In this regard, the shutter lifting unit 23 may, for example, include a screw shaft arranged to extend in the vertical direction. In this case, the electric motor 23A rotates the screw shaft around the axis of rotation of the screw shaft that extends in the vertical direction. As a result, the slider 23E moves in the vertical direction along the guide rail 23F.

[0150] In other words, the control unit 71 moves the light-emitting unit 27A and the light-receiving unit 27B vertically using a screw shaft. This makes it possible to suppress linearity errors of the screw shaft.

[0151] (3) In the above-described embodiments and modifications, the control unit 71 measured the calibration height position HA1 corresponding to the minimum value MNA1 of the signal at the trough VA1 of the signal waveform using the rotary encoder 25. This measured the calibration height position HA of the calibration substrate CW25. Here, the measurement resolution of height positions such as the calibration height position HA depends on the resolution of the rotary encoder 25. Therefore, the measurement resolution can be increased by increasing the resolution of the rotary encoder 25. However, generally, high-resolution rotary encoders 25 are relatively expensive.

[0152] Therefore, for example, when mapping is being performed, the control unit 71 counts the number of pulses output from the rotary encoder 25 within a certain period of time and measures the frequency. Then, the control unit 71 calculates the movement speed IC (increasing gradient) by multiplying the measured frequency by the amount of movement per pulse (distance (unit: μm)). This movement speed IC is the vertical movement speed (Z direction) of the light-emitting unit 27A and the light-receiving unit 27B.

[0153] Refer to Figure 23. For example, when the control unit 71 finds that the minimum value MNA25 of the valley VA25 is located between the first reference point P1 of the first pulse PL1 and the second reference point P2 of the second pulse PL2, the control unit 71 obtains the difference value DF (= mapping time T2 - pulse time T1) between the pulse time T1 corresponding to the first reference point P1 of the first pulse PL1 and the mapping time T2 corresponding to the minimum value MNA25 of the valley VA25. The difference value DF corresponds to the time difference value of the present invention.

[0154] Subsequently, the control unit 71 acquires the internal distance DS2 from the first reference point P1 to the minimum value MNA25 of the valley VA25 by integrating the difference value DF into the movement speed IC of the light-emitting unit 27A and the light-receiving unit 27B. For example, the control unit 71 uses the internal distance DS2 when acquiring the calibration height position HA25 of the calibration substrate CW25. For example, when acquiring the height position of the calibration substrate CW25 from the amount of movement between a preset height position P0 (e.g., the starting height position) and the minimum value MNA25 of the valley VA25, the control unit 71 calculates the distance (amount of movement) DS1 by counting the number of pulses (including the first pulse) included between the preset height position P0 and the minimum value MNA25 of the valley VA25. Then, the control unit 71 acquires the amount of movement between the first reference point P1 and the minimum value MNA25 of the first pulse PL1, i.e., the internal distance DS2. This allows for measuring distance (distance DS1 + internal distance DS2) with a higher resolution than that of the rotary encoder 25.

[0155] This modified version can be applied not only to the measurement of the calibration height position HA, but also to the measurement of the production height position HB. Furthermore, it can be applied to the measurement of the substrate thickness TK, the calibration substrate CW, and the top surface (indicated as TT in Figure 17) and bottom surface (indicated as TB in Figure 17) of the substrate W.

[0156] (4) In the embodiments and modifications described above, the light-emitting unit 27A and the light-receiving unit 27B were moved linearly in the front-rear direction and the extension / retraction direction TD (X direction) by the sensor moving unit 29. In this respect, as shown in Figure 24, the light-emitting unit 27A and the light-receiving unit 27B may be rotated around a horizontal axis AX5 extending in the width direction by the sensor moving unit 86. The sensor moving unit 86 comprises an arm 87 and a drive unit 88. The tip 87A of the arm 87 fixes the sensor support member 31 that supports the light-emitting unit 27A, etc.

[0157] Furthermore, a drive unit 88 is provided at the base end 87B of the arm 87, which is located on the opposite side of the tip end 87A via the horizontal axis AX5. The drive unit 88 causes the base end 87B to rotate around the horizontal axis AX5, thereby rotating the light-emitting unit 27A and the light-receiving unit 27B around the horizontal axis AX5. This may move the light-emitting unit 27A and the light-receiving unit 27B between a standby position and a detection position. The drive unit 88 includes, for example, an air cylinder or a linear encoder including an electric motor.

[0158] Furthermore, as shown in Figure 25, the light-emitting unit 27A and the light-receiving unit 27B may each be moved by the sensor movement unit 90. The sensor movement unit 90 comprises horizontally extending arms 91 and 92 and a drive unit 95. The light-emitting unit 27A and the light-receiving unit 27B are attached to the arms 91 and 92, respectively. The drive unit 95 comprises an electric motor. The drive unit 95 rotates the light-emitting unit 27A around the vertical axis AX7 via arm 91. The drive unit 95 also rotates the light-receiving unit 27B around the vertical axis AX8 via arm 92. As a result, the light-emitting unit 27A and the light-receiving unit 27B are moved between a standby position and a detection position.

[0159] (5) In the embodiments and modifications described above, the light-emitting unit 27A and the light-receiving unit 27B moved together with the shutter unit 19. However, the light-emitting unit 27A and the light-receiving unit 27B may move independently of the shutter unit 19.

[0160] (6) In the embodiments and modifications described above, the light-emitting unit 27A and the light-receiving unit 27B are provided on the lid attachment / detachment unit 11. In this regard, the light-emitting unit 27A and the light-receiving unit 27B may be provided, for example, on the tip of the hand 41 or articulated arm 43 of the transport robot IR. The transport robot IR may be equipped with a timing belt to move the light-emitting unit 27A and the light-receiving unit 27B in the vertical direction.

[0161] (7) In the embodiments and modifications described above, the substrate processing apparatus 1 is equipped with a control unit 71. The load port 5 or the transport robot IR may be equipped with a second control unit. The second control unit is equipped with one or more processors, such as a central processing unit (CPU). The second control unit is able to communicate with the control unit 71. The second control unit controls the respective components of the load port 5 and the transport robot IR. At least one of the control unit 71 and the second control unit corresponds to the control unit of the present invention.

[0162] Furthermore, the load port 5 or the transport robot IR may have a second memory unit in addition to the second control unit. The second memory unit comprises, for example, at least one of ROM, RAM, and a hard disk. The second memory unit is able to communicate with the second control unit. The second memory unit stores the computer programs necessary to control each configuration of the load port 5 and the transport robot IR. The memory unit 73 also stores various operations and, for example, 25 true height positions SN1 to SN25 and 25 correction values ​​HS1 to HS25.

[0163] (8) In the embodiments and modifications described above, when mapping was performed, the shutter lifting unit 23 lowered the light-emitting unit 27A and the light-receiving unit 27B. In this regard, the shutter lifting unit 23 may raise the light-emitting unit 27A and the light-receiving unit 27B so that they move from bottom to top relative to the multiple substrates W.

[0164] (9) In the embodiments and modifications described above, for example, the production height position HB25 of the substrate W25 housed in the slot SL25 (i.e., the center position of the thickness of the substrate W25) was corrected by the correction value HS25. In this regard, the correction value HS25 may also correct the height positions of the upper and lower surfaces of the substrate W25. [Explanation of Symbols]

[0165] 1 ... Substrate processing equipment 5… Load port IR… Transport robot 9… Stage C... Career 14…Aperture 23... Shutter lifting mechanism 23B, 23C… Pulley 23D… Timing belt 25… Rotary encoder 27… Mapping sensor 27A ... Light source 27B … Light receiving section 31 ... Sensor support member TD… Direction of insertion / removal 41… Hand 47… Height sensor 51 ... Processing Unit 71 ... Control Unit 73 … Storage section 81 ... Calibration jig CW(CW1~CW25) … Calibration board SN (SN1~SN25) ... True height position CS1~CS25… Calibration slots W(W1~W25,WA,WB) ... Circuit board SL (SL1~SL25) ... Slot HA (HA1~HA25) ... Calibration height position VA1~VA25 … Tanibe MNA1~MNA25 … Local minimums VB1~VB25 … Tanibe MNB1~MNB25 … Minimum value HB (HB1~HB25) ... Production height position LG (LG1~LG25) ... Linearity error HS (HS1~HS25) ... Correction value HD (HD1~HD25) ... Height position S1 ... Signal value PL1 ... First pulse PL2… Second pulse P1 … 1st reference point P2…Second reference point IC … Movement speed T1… Pulse time T2… Mapping time DF ... Difference value DS2 ... Internal distance division

Claims

1. A circuit board transport device for loading and unloading circuit boards, A stage on which a carrier is mounted for inserting and supporting production substrates in a horizontal position into each of several slots formed at regular intervals in the vertical direction, A transport robot equipped with a hand for holding the production substrate, which removes and stores the production substrate relative to the carrier, A mapping sensor having a light-emitting unit and a light-receiving unit, A lifting mechanism that moves the light-emitting unit and the light-receiving unit together in the vertical direction, A height sensor for measuring the height position of the light-emitting unit and the light-receiving unit, A storage unit stores, for each slot of the carrier, a correction value for the linearity error between the height position measured by the height sensor and the known true height position. It comprises a control unit and, The control unit, By moving the light-emitting unit and the light-receiving unit with the lifting unit, the height position of the production substrate within the carrier placed on the stage is measured by the height sensor. Referencing the memory unit, read the correction value corresponding to the slot in which the production board is inserted, and use the correction value to correct the production height position. A substrate transport device characterized by controlling the removal and storage operations of the transport robot based on the corrected production height position.

2. In the substrate transport apparatus according to claim 1, The correction value stored in the memory unit is obtained using a calibration jig equipped with multiple calibration substrates in a horizontal orientation, aligned at regular intervals in the vertical direction to correspond to each slot of the carrier, as follows: The control unit, By moving the light-emitting unit and the light-receiving unit with the lifting unit, the height position of one of the multiple calibration substrates of the calibration jig placed on the stage is measured by the height sensor. A substrate transport device characterized by calculating a correction value for correcting linearity error by taking the difference between the pre-known true height position of the calibration substrate and the calibration height position measured by the height sensor.

3. In the substrate transport apparatus according to claim 1, The first correction value, second correction value, and third correction value, including the correction value stored in the memory unit, are obtained using a calibration jig equipped with multiple calibration substrates arranged horizontally at regular intervals in the vertical direction, as follows: If the number of calibration boards is less than the number of slots, The first slot and the second slot among the plurality of slots correspond to the first calibration board and the second calibration board among the plurality of calibration boards, respectively. The third slot among the aforementioned plurality of slots is positioned between the first slot and the second slot. The control unit, By moving the light-emitting unit and the light-receiving unit with the lifting unit, the height sensors measure the first calibration height position and the second calibration height position of the first calibration substrate and the second calibration substrate of the calibration jig placed on the stage. By subtracting the first and second calibration height positions measured by the height sensor from the first and second calibration height positions, respectively, which are known in advance, the first and second correction values ​​for correcting the linearity error related to the first and second slots are calculated. A substrate transport device characterized by calculating the third correction value for the third slot by linear interpolation based on the first correction value and the second correction value.

4. In the substrate transport apparatus according to claim 2, A substrate transport device characterized in that the true height position of the calibration substrate is a value measured by a three-dimensional measuring machine.

5. In the substrate transport apparatus according to claim 2, The control unit measures the calibration height position by measuring the position corresponding to the minimum value of the first valley in the first signal waveform output from the mapping sensor, where the light from the light-emitting unit is blocked by the calibration substrate and the signal value becomes smaller, using the height sensor.

6. In the substrate transport apparatus according to claim 5, The substrate transport apparatus is characterized in that the control unit measures the production height position by measuring the position corresponding to the minimum value of the second valley in the second signal waveform output from the mapping sensor, where the light from the light-emitting unit is blocked by the production substrate and the signal value becomes smaller, using the height sensor.

7. In the substrate transport apparatus according to claim 5, The control unit determines when the minimum value of the first valley is located between the first reference point of the first pulse and the second reference point of the second pulse, which are output continuously from the height sensor. The time difference value between the pulse time corresponding to the first reference point of the first pulse and the mapping time corresponding to the minimum value of the first valley is obtained, and further, By integrating the time difference value with the movement speed of the light-emitting unit and the light-receiving unit, the internal distance from the first reference point to the minimum value of the valley is obtained. A substrate transport device characterized by using the internal distance when measuring the first calibration height position.

8. In a substrate transport apparatus according to any one of claims 1 to 7, The substrate transport device is characterized in that the height sensor is a rotary encoder.

9. In the substrate transport apparatus according to claim 8, The substrate transport device is characterized in that the lifting section comprises two pulleys and a timing belt wrapped around the two pulleys so as to move around the two pulleys, and the timing belt is used to move the light-emitting section and the light-receiving section in the vertical direction.

10. A substrate transport device according to claim 1, A substrate processing unit that processes the production substrate transported by the transport robot, A substrate processing apparatus characterized by comprising:

11. A substrate transport method used in a substrate transport device for loading and unloading substrates, The substrate transport device is A stage on which a carrier is mounted for inserting and supporting production substrates in a horizontal position into each of several slots formed at regular intervals in the vertical direction, A transport robot equipped with a hand for holding the production substrate, which removes and stores the production substrate relative to the carrier, A mapping sensor having a light-emitting unit and a light-receiving unit, A lifting mechanism that moves the light-emitting unit and the light-receiving unit together in the vertical direction, A height sensor for measuring the height position of the light-emitting unit and the light-receiving unit, The system includes a storage unit that stores a correction value for the linearity error between the height position measured by the height sensor and the known true height position for each slot of the carrier, The substrate transport method is, A production measurement step is performed by moving the light-emitting unit and the light-receiving unit by the lifting unit, thereby measuring the production height position of the production substrate in the carrier placed on the stage using the height sensor. A correction step involves reading the correction value corresponding to the slot in which the production substrate is inserted by referring to the storage unit, and correcting the production height position using the correction value. A transport robot control process that controls the removal and storage operations of the transport robot based on the corrected production height position, A substrate transport method characterized by comprising the following:

12. In the substrate transport method according to claim 11, The process further includes a correction value acquisition step in which a correction jig equipped with multiple horizontally positioned calibration substrates aligned at regular intervals in the vertical direction is used to acquire the correction values ​​stored in the storage unit so as to correspond to each slot of the carrier, The correction value acquisition step is, A calibration measurement step is performed by moving the light-emitting unit and the light-receiving unit by the lifting unit, thereby measuring the calibration height position of one of the multiple calibration substrates of the calibration jig placed on the stage using the height sensor. A correction value calculation step for calculating a correction value that corrects the linearity error, which is the difference between the known true height position of the calibration substrate and the calibration height position measured by the height sensor, A substrate transport method characterized by having the following features.

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