Substrate processing apparatus and substrate processing method

Abstract

This disclosure describes a substrate processing apparatus and a substrate processing method that can accurately acquire the state of a nozzle. [Solution] The substrate processing apparatus comprises an inspection substrate including a base portion and an imaging portion disposed on the base portion, a holding portion configured to hold the substrate or the inspection substrate, a drive portion configured to rotate the holding portion, a processing liquid supply portion including a nozzle configured to discharge processing liquid onto the substrate held by the holding portion, and a control unit. The control unit is configured to perform a first process in which, while the inspection substrate is held by the holding portion, the drive portion is controlled to rotate the holding portion, thereby adjusting the position of the imaging portion relative to the nozzle to a predetermined first imaging position, and a second process in which, after the first process, the imaging portion is controlled to image the nozzle at the first imaging position.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method.

Background Art

[0002] Patent Document 1 discloses a substrate processing apparatus including a holding unit that holds a substrate, a splash prevention cup disposed around the holding unit, a processing liquid supply nozzle that supplies a processing liquid to the substrate held by the holding unit, imaging means disposed above the processing liquid supply nozzle and the splash prevention cup and that images a supply path of the processing liquid between the processing liquid supply nozzle and the substrate surface, and control means that performs a predetermined operation when a supply state of the processing liquid imaged by the imaging means is abnormal.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure describes a substrate processing apparatus and a substrate processing method capable of accurately acquiring the state of a nozzle.

Means for Solving the Problems

[0005] An example of a substrate processing apparatus includes an inspection substrate including a base and an imaging unit disposed on the base, a holding unit configured to hold a substrate or the inspection substrate, a drive unit configured to rotate the holding unit, a processing liquid supply unit including a nozzle configured to discharge processing liquid onto the substrate held by the holding unit, and a control unit. The control unit is configured to perform a first process, in which, while the inspection substrate is held by the holding unit, it controls the drive unit to rotate the holding unit, thereby adjusting the position of the imaging unit relative to the nozzle to a predetermined first imaging position, and a second process, after the first process, to control the imaging unit to image the nozzle at the first imaging position. [Effects of the Invention]

[0006] According to the substrate processing apparatus and substrate processing method described herein, it becomes possible to accurately acquire the state of the nozzle. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a schematic plan view showing an example of a substrate processing system. [Figure 2] Figure 2 is a schematic side view showing an example of a liquid processing unit. [Figure 3] Figure 3 is a block diagram showing an example of the main components of a substrate processing system. [Figure 4] Figure 4 is a schematic diagram showing an example of the controller's hardware configuration. [Figure 5] Figure 5 is a flowchart illustrating an example of a procedure for inspecting the condition of a nozzle. [Figure 6] Figure 6 is a top view of the inspection substrate to illustrate an example of adjusting the imaging position. [Figure 7] Figure 7 shows an example of an image captured to illustrate the method for calculating the nozzle height. [Figure 8]Figure 8 is a diagram illustrating the method for calculating the center position of the nozzle tip. Figure 8(a) shows an example of an image captured when the imaging position is 0°. Figure 8(b) is a graph showing the change in brightness value in the horizontal direction at a predetermined position in the image captured in Figure 8(a). Figure 8(c) shows an example of an image captured when the imaging position is 90°. Figure 8(d) is a graph showing the change in brightness value in the horizontal direction at a predetermined position in the image captured in Figure 8(c). [Figure 9] Figure 9 is a diagram illustrating the method for calculating the center position of the nozzle tip. Figure 9(a) shows an example of an image captured when the imaging position is 180°. Figure 9(b) is a graph showing the change in brightness value in the horizontal direction at a predetermined position in the image captured in Figure 9(a). Figure 9(c) shows an example of an image captured when the imaging position is 270°. Figure 9(d) is a graph showing the change in brightness value in the horizontal direction at a predetermined position in the image captured in Figure 9(c). [Figure 10] Figure 10 is a diagram illustrating the method for calculating the nozzle tilt. Figure 10(a) shows an example of an image captured when the imaging position is 0°, Figure 10(b) shows an example of an image captured when the imaging position is 90°, Figure 10(c) shows an example of an image captured when the imaging position is 180°, and Figure 10(d) shows an example of an image captured when the imaging position is 270°. [Figure 11] Figure 11 is a diagram illustrating the method for calculating the nozzle's inclination vector. [Figure 12] Figure 12 is a diagram illustrating the method for calculating abnormalities on the nozzle surface, and shows an example of an image obtained by unfolding an image captured over almost the entire circumference of the nozzle's outer surface onto a plane. [Figure 13] Figure 13 is a side view showing another example of a test substrate. [Figure 14] Figure 14 is a side view showing another example of a test substrate. [Figure 15] Figure 15 is a side view showing another example of a test substrate. [Modes for carrying out the invention]

[0008] In the following descriptions, the same reference numeral will be used for identical elements or elements with the same function, and redundant explanations will be omitted. Furthermore, in this specification, when referring to the top, bottom, right, and left of a figure, the direction of the reference numeral in the figure will be used as the reference.

[0009] [Circuit board processing system] First, with reference to Figure 1, a substrate processing system 1 (substrate processing apparatus) configured to process a substrate W will be described. The substrate processing system 1 comprises an input / output station 2, a processing station 3, and a controller Ctr (control unit). The input / output station 2 and the processing station 3 may be arranged in a single line horizontally, for example.

[0010] The substrate W may be disc-shaped, or it may be a plate shape other than circular, such as a polygon. The substrate W may have a notch in which a part is cut out. The notch may be, for example, a notch (groove such as U-shaped or V-shaped), or a straight section extending in a straight line (a so-called orientation flat). The substrate W may be, for example, a semiconductor substrate (silicon wafer), a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, or various other types of substrates. The diameter of the substrate W may be, for example, about 200 mm to 450 mm.

[0011] The loading / unloading station 2 includes a mounting section 4, a loading / unloading section 5, and a shelf unit 6 (storage chamber). The mounting section 4 includes a plurality of mounting tables (not shown) arranged in the width direction (vertical direction in Figure 1). Each mounting table is configured to accommodate a carrier 7. The carrier 7 is configured to house at least one substrate W in a sealed state. The carrier 7 includes an opening / closing door (not shown) for loading and unloading the substrate W.

[0012] The loading / unloading unit 5 is arranged adjacent to the placement unit 4 in the direction in which the loading / unloading station 2 and the processing station 3 are aligned (the left-right direction in FIG. 1). The loading / unloading unit 5 includes an opening / closing door (not shown) provided for the placement unit 4. With the carrier 7 placed on the placement unit 4, when both the opening / closing door of the carrier 7 and the opening / closing door of the loading / unloading unit 5 are opened, the inside of the loading / unloading unit 5 and the inside of the carrier 7 communicate with each other.

[0013] The loading / unloading unit 5 incorporates a transfer arm A1 and a shelf unit 6. The transfer arm A1 is configured to be capable of horizontal movement in the width direction of the loading / unloading unit 5, vertical movement in the vertical direction, and rotational movement around the vertical axis. The transfer arm A1 is configured to take out the substrate W from the carrier 7 and deliver it to the shelf unit 6, and also to receive the substrate W from the shelf unit 6 and return it into the carrier 7. The shelf unit 6 is located in the vicinity of the processing station 3 and is configured to accommodate the substrate W and the inspection substrate J (to be described in detail later).

[0014] The processing station 3 includes a transfer unit 8 and a plurality of liquid processing units U. The transfer unit 8 extends horizontally, for example, in the direction in which the loading / unloading station 2 and the processing station 3 are aligned (the left-right direction in FIG. 1). The transfer unit 8 incorporates a transfer arm A2 (transfer unit). The transfer arm A2 is configured to be capable of horizontal movement in the longitudinal direction of the transfer unit 8, vertical movement in the vertical direction, and rotational movement around the vertical axis. The transfer arm A2 is configured to take out the substrate W or the inspection substrate J from the shelf unit 6 and deliver it to the liquid processing unit U, and also to receive the substrate W or the inspection substrate J from the liquid processing unit U and return it into the shelf unit 6.

[0015] [Liquid Processing Unit] Subsequently, referring to FIG. 2, the liquid processing unit U will be described in detail. The liquid processing unit U is configured to perform a predetermined liquid treatment (for example, a treatment for removing dirt and foreign substances, an etching treatment, etc.) on the substrate W. The liquid processing unit U may be, for example, a single-wafer cleaning device that cleans the substrate W one by one by spin cleaning.

[0016] The liquid processing unit U includes a chamber 10 (processing chamber), a blower unit 20, a rotating and holding unit 30, a supply unit 40 (processing liquid supply unit, cleaning liquid supply unit), and a cup member 50.

[0017] Chamber 10 is a housing configured to allow substrates W or test substrates J to be loaded into and unloaded from its interior. An loading / unloading port (not shown) is formed in the side wall of Chamber 10. Substrates W or test substrates J are transported into and out of Chamber 10 by a transport arm A2 through this loading / unloading port.

[0018] The blower unit 20 is mounted on the top wall of the chamber 10. The blower unit 20 is configured to create a downward flow within the chamber 10 based on a signal from the controller Ctr.

[0019] The rotating and holding unit 30 includes a drive unit 31, a shaft 32, and a holding unit 33. The drive unit 31 operates based on an operation signal from the controller Ctr and is configured to rotate the shaft 32. The drive unit 31 may be a power source such as an electric motor.

[0020] The holding portion 33 is provided at the tip of the shaft 32. The holding portion 33 is configured to hold the back surface of the substrate W or inspection substrate J by suction, for example. That is, the rotating holding portion 30 may be configured to rotate the substrate W or inspection substrate J around a rotation center axis Ax perpendicular to the surface of the substrate W or inspection substrate J, while the substrate W or inspection substrate J is in a substantially horizontal position.

[0021] The supply unit 40 is configured to supply multiple processing liquids of different types from the nozzle N to the surface of the substrate W. The supply unit 40 includes liquid sources 41, 42, valves 43, 44, piping 45-47, nozzle N, arm Ar, and drive unit 48 (nozzle drive unit).

[0022] The liquid source 41 may be configured as a source for supplying the treatment liquid. The treatment liquid may be, for example, an acidic treatment liquid or an alkaline treatment liquid. The acidic treatment liquid may include, for example, SC-2 solution (a mixture of hydrochloric acid, hydrogen peroxide, and pure water), SPM (a mixture of sulfuric acid and hydrogen peroxide solution), HF solution (hydrofluoric acid), DHF solution (dilute hydrofluoric acid), HNO3+HF solution (a mixture of nitric acid and hydrofluoric acid), etc. The alkaline treatment liquid may include, for example, SC-1 solution (a mixture of ammonia, hydrogen peroxide, and pure water), hydrogen peroxide solution, etc. The liquid source 41 is connected to the nozzle N via pipes 45 and 47.

[0023] The liquid source 42 may be configured as a source for supplying cleaning fluid. The cleaning fluid may be, for example, an organic cleaning fluid or a rinsing fluid. The organic cleaning fluid may contain, for example, IPA (isopropyl alcohol). The rinsing fluid may contain, for example, pure water (DIW: deionized water), ozonated water, carbonated water (CO2 water), ammonia water, etc. The liquid source 41 is connected to the nozzle N via pipes 46 and 47.

[0024] Valves 43 and 44 are provided in piping 45 and 46, respectively. Valves 43 and 44 are configured to open and close based on operating signals from controller Ctr.

[0025] The nozzle N is held by an arm Ar. A drive unit 48 is connected to the arm Ar. The drive unit 48 operates based on an operation signal from the controller Ctr and is configured to move the arm Ar horizontally or vertically. As a result, the nozzle N is configured to move horizontally or vertically above the substrate W. The drive unit 48 may also be configured to operate based on an operation signal from the controller Ctr and to change the angle of the arm Ar with respect to the vertical axis. In this case, the angle of the nozzle N changes along with the change in the angle of the arm Ar with respect to the vertical axis. That is, the posture (horizontal position, vertical position, or angle) of the nozzle N may be adjusted by driving the arm Ar by the drive unit 48.

[0026] When a processing liquid or cleaning liquid is discharged from the nozzle N onto the surface of the substrate W, the nozzle N may be positioned above the substrate W such that its discharge opening faces the surface of the substrate W. Furthermore, when the condition of the nozzle N is inspected as described later, the nozzle N may be positioned above the inspection substrate J such that its discharge opening faces the surface of the inspection substrate J.

[0027] The cup member 50 is provided so as to surround the holding portion 33. The cup member 50 is configured to collect the processing liquid that splashes out from the outer edge of the substrate W as the substrate W is held and rotated by the rotating holding portion 30. A drain port 51 and an exhaust port 52 are provided at the bottom of the cup member 50.

[0028] The drain port 51 is configured to discharge the processing liquid or cleaning liquid collected by the cup member 50 to the outside of the liquid processing unit U. The exhaust port 52 is configured to discharge the downward flow formed around the substrate W by the blower 20 to the outside of the liquid processing unit U. This downward flow is accompanied by gas generated around the substrate W as the substrate W is processed by the processing liquid.

[0029] [Test board] The inspection substrate J is configured to inspect the state of the nozzle N. As illustrated in Figure 2, the inspection substrate J includes a base portion J1, an imaging portion J2, an illumination portion J3, a battery J4, and a communication portion J5. The base portion J1 may be disc-shaped, similar to the substrate W, or it may be a non-circular plate shape such as a polygon. The base portion J1 holds the imaging portion J2, the illumination portion J3, the battery J4, and the communication portion J5.

[0030] The imaging unit J2 operates based on an operating signal from the controller Ctr and is configured to image the appearance of the nozzle N. The imaging unit J2 may be, for example, a CCD camera, a CMOS camera, etc. The imaging unit J2 is located on the base unit J1. The imaging unit J2 may be positioned on the base unit J1 such that, when imaging the nozzle N, it is located closer to the outer edge of the base unit J1 than the nozzle N. The imaging unit J2 may be configured so that its elevation angle can be changed by a drive unit (not shown). The elevation angle may be, for example, 0° to 90°.

[0031] The illumination unit J3 operates based on an operating signal from the controller Ctr and is configured to irradiate the nozzle N with light when the imaging unit J2 is imaging the nozzle N. The illumination unit J3 is located on the base unit J1. The illumination unit J3 may also be located near the imaging unit J2.

[0032] Battery J4 is configured to supply power to electronic devices installed on the test circuit board J. For charging battery J4, a charging port may be provided on the shelf unit 6, for example. In this case, while the test circuit board J is retracted into the shelf unit 6 and held there, battery J4 is charged via the charging port. The charging method for battery J4 may be contact charging, where charging is performed by contact with the metal terminals of the charging port, or non-contact charging, where power is transmitted without using metal terminals or the like.

[0033] The communication unit J5 is configured to communicate with the controller Ctr (for example, the processing unit M3 described later). The communication unit J5 can receive operation signals from the controller Ctr to operate the imaging unit J2 and the illumination unit J3. The communication unit J5 can transmit the image data captured by the imaging unit J2 to the controller Ctr. The communication method between the communication unit J5 and the controller Ctr is not particularly limited and may be wireless communication or wired (communication cable) communication. Examples of wireless communication include LTE (Long Term Evolution), LTE-A (LTE-Advanced), SUPER3G, IMT-Advanced, 4G, 5G, FRA (Future Radio Access), W-CDMA (registered trademark), GSM (registered trademark), CDMA2000, UMB (Ultra Mobile Broadband), IEEE 802.11 (Wi-Fi), IEEE 802.16 (WiMAX), IEEE 802.20, UWB, Bluetooth (registered trademark), and other communication methods.

[0034] [Controller Details] The controller Ctr is configured to partially or entirely control the board processing system 1. As illustrated in Figure 3, the controller Ctr has a reading unit M1, a storage unit M2, a processing unit M3, an instruction unit M4, and a communication unit M5 as functional modules. These functional modules are merely a convenient division of the controller Ctr's functions into multiple modules, and do not necessarily mean that the hardware constituting the controller Ctr is divided into such modules. Each functional module is not limited to being implemented by program execution, but may also be implemented by a dedicated electrical circuit (e.g., a logic circuit) or an integrated circuit (ASIC: Application Specific Integrated Circuit) that integrates these.

[0035] The reading unit M1 is configured to read a program from a computer-readable recording medium RM. The recording medium RM stores a program for operating each part of the substrate processing system 1. The recording medium RM may be, for example, a semiconductor memory, an optical recording disk, a magnetic recording disk, or a magneto-optical recording disk. In the following, each part of the substrate processing system 1 may include the blowing unit 20, the rotating and holding unit 30, the supply unit 40, the imaging unit J2, the illumination unit J3, and the communication unit J5.

[0036] The storage unit M2 is configured to store various types of data. For example, the storage unit M2 may store programs read from the recording medium RM by the reading unit M1, setting data input from the operator via an external input device (not shown), etc. The storage unit M2 may also store data of processing conditions (processing recipes) for processing the substrate W, for example. The storage unit M2 may also store data of images captured by the imaging unit J2 transmitted via the communication units J5 and M5, for example.

[0037] The processing unit M3 is configured to process various types of data. For example, the processing unit M3 may generate signals to operate various parts of the substrate processing system 1 based on various types of data stored in the memory unit M2. For example, the processing unit M3 may generate an operation signal to cause the imaging unit J2 to start or stop imaging. For example, the processing unit M3 may generate an operation signal to adjust the elevation angle or focus of the imaging unit J2. For example, the processing unit M3 may generate an operation signal to cause the illumination unit J3 to start or stop illuminating light.

[0038] The processing unit M3 may calculate the state of the nozzle N based on the data of the image captured by the imaging unit J2, for example. The state of the nozzle N may include, for example, the orientation of the nozzle (height of the nozzle N, center position of the tip of the nozzle N, tilt of the nozzle N, etc.) and any abnormalities on the surface of the nozzle N. Based on the calculated orientation of the nozzle N, the processing unit M3 may calculate the expected landing position of the processing liquid discharged from the nozzle N onto the surface of the substrate W. The processing unit M3 may also calculate the deviation between the calculated expected landing position and the rotation center axis Ax of the rotation holding unit 30. The processing unit M3 may issue an alarm from a notification unit (not shown) when the calculated deviation is outside a predetermined range or when there is an abnormality on the surface of the nozzle N (for example, the alarm may be displayed on a display, or an alarm sound or alarm guidance may be emitted from a speaker).

[0039] The instruction unit M4 is configured to transmit the operation signals generated in the processing unit M3 to each part of the board processing system 1. The communication unit M5 is configured to communicate with the communication unit J5 as described above. When the communication unit M5 performs wireless communication with the communication unit J5, the communication unit M5 may be configured in the same way as the communication unit J5.

[0040] The hardware of the controller Ctr may consist of, for example, one or more control computers. The controller Ctr may include a circuit C1 as a hardware configuration, as illustrated in Figure 4. The circuit C1 may consist of electrical circuit elements. The circuit C1 may include, for example, a processor C2, memory C3, storage C4, a driver C5, and input / output ports C6.

[0041] The processor C2 may be configured to implement each of the above-described functional modules by executing a program in cooperation with at least one of the memory C3 and storage C4 and performing signal input and output via the input / output port C6. The memory C3 and storage C4 may function as a storage unit M2. The driver C5 may be a circuit configured to drive each part of the board processing system 1. The input / output port C6 may be configured to mediate signal input and output between the driver C5 and each part of the board processing system 1.

[0042] The board processing system 1 may have one controller Ctr, or it may have a controller group (control unit) composed of multiple controllers Ctr. If the board processing system 1 has a controller group, each of the above functional modules may be realized by one controller Ctr, or by a combination of two or more controllers Ctr. If the controller Ctr is composed of multiple computers (circuit C1), each of the above functional modules may be realized by one computer (circuit C1), or by a combination of two or more computers (circuit C1). The controller Ctr may have multiple processors C2. In this case, each of the above functional modules may be realized by one processor C2, or by a combination of two or more processors C2.

[0043] [How to inspect the condition of the nozzle] Next, an example of a method for inspecting the state of nozzle N will be described with reference to Figures 5 to 11. In the following description, an example will be given in which the inspection begins with the inspection substrate J placed on the shelf unit 6. Furthermore, the image captured by the imaging unit J2 may be a grayscale image or a color image.

[0044] First, the controller Ctr controls the transport arm A2 to transport the inspection substrate J from the shelf unit 6 to the liquid treatment unit U. Next, the inspection substrate J is held in the rotating holding unit 30 of the liquid treatment unit U (see step S1 in Figure 5). Then, the controller Ctr controls the drive unit of the nozzle N to move the nozzle N so that it is positioned at the origin.

[0045] The origin is set such that when the processing liquid or cleaning liquid is discharged from the nozzle N, which is positioned at the origin, the liquid landing position approximately coincides with the rotational axis Ax (center of the substrate W). However, due to the influence of the tilt of the nozzle N or the misalignment of the arm Ar, the liquid landing position may deviate from the rotational axis Ax even when the nozzle N is positioned at the origin. Also, due to the influence of the tilt of the arm Ar, the height position of the tip of the nozzle N when the nozzle N is positioned at the origin may deviate from a predetermined set position.

[0046] Next, the controller Ctr controls the rotation and holding unit 30 to rotate the inspection substrate J via the rotation and holding unit 30 so that the imaging unit J2 relative to the nozzle N is positioned at a predetermined imaging position P1 (see Figure 6) (see step S2 in Figure 5). Note that if the imaging unit J2 is already in the imaging position when the inspection substrate J is held by the rotation and holding unit 30 from the transport arm A2, the process in step S2 does not need to be executed.

[0047] Next, the controller Ctr controls the imaging unit J2 and illumination unit J3 via the communication units M5 and J5, illuminating the nozzle N with light using the illumination unit J3 while imaging the nozzle N with the imaging unit J2 (see step S3 in Figure 5). The captured image data is transmitted to the controller Ctr via the communication units M5 and J5. Alternatively, before imaging the nozzle N, the controller Ctr may control the imaging unit J2 via the communication units M5 and J5 to adjust its elevation angle and focus.

[0048] Steps S2 and S3 may be repeated as needed for the inspection, and the nozzle N may be imaged by the imaging unit J2 from different directions while changing the imaging position. For example, as illustrated in Figure 6, the nozzle N may be imaged by the imaging unit J2 from different imaging positions P1 to P4 at approximately 90° intervals. In this case, four images are obtained, each taken from imaging positions P1 to P4. Alternatively, although not shown, the nozzle N may be imaged by the imaging unit J2 from different imaging positions at approximately 15° intervals. In this case, 24 images are obtained, each taken from each imaging position. Alternatively, although not shown, the nozzle N may be continuously imaged by the imaging unit J2 while the inspection substrate J is rotated. In this case, an image of the entire circumference of the nozzle N (a so-called panoramic image) is obtained. When the nozzle N is imaged from different directions while changing the imaging position, these multiple imaging positions may be spaced approximately equally apart in the rotation direction of the inspection substrate J (i.e., spaced apart at predetermined angles), or the spacing may not be equal.

[0049] Next, the controller Ctr processes the data from at least one image captured by the imaging unit J2 to calculate the orientation of the nozzle N (see step S4 in Figure 5). Here, we will explain an example in which the orientation of the nozzle N is calculated as (A) the height of the nozzle N, (B) the center position of the tip of the nozzle N, and (C) the tilt of the nozzle N.

[0050] (A) Height of nozzle N First, the lowest point of nozzle N (see Figure 7) is identified in the captured image. Methods for identifying the lowest point of nozzle N include, for example, an operator observing the captured image and specifying the lowest point of nozzle N, or a controller Ctr processing the captured image using known edge detection techniques and detecting the lowest point of nozzle N based on the processed image.

[0051] Next, the straight-line distance between the lowest point of the nozzle N and the surface of the base J1 is calculated to obtain the height of the nozzle N. Specifically, the controller Ctr may determine the number of pixels between the lowest point of the nozzle N and the surface of the base J1, multiply it by the previously obtained length per pixel (mm / pixel), and calculate the height of the nozzle N (mm). Alternatively, as illustrated in Figure 7, the height of the nozzle N may be obtained by using an image of the nozzle N and the scale SC simultaneously, and reading the height of the lowest point of the nozzle N using the scale SC. The scale SC may be provided on the base J1 extending upward from the surface of the base J1 so as to be located near the nozzle N, or it may be provided in front of the lens of the imaging unit J2.

[0052] (B) Center position of the tip of nozzle N In the following section, we will describe an example of calculating the center position of the tip of the nozzle N based on four images obtained by imaging the nozzle N from imaging positions P1 to P4, which are approximately 90° apart, using the imaging unit J2, as illustrated in Figure 6.

[0053] First, the nozzle N is captured by the imaging unit J2 from the imaging position P1, and in the captured image (for example, the image captured at 0° around the rotation center axis Ax), a horizontal line L passing through the tip of the nozzle N is specified (see Figure 8(a)). Methods for specifying the horizontal line L include, for example, an operator observing the captured image to specify the tip of the nozzle N, or a controller Ctr comparing a previously acquired image of the tip of the nozzle N with the captured image using known image recognition technology to automatically determine the tip of the nozzle N in the captured image.

[0054] Next, the controller Ctr calculates the change in luminance value along the horizontal line L (see Figure 8(b)). In the example in Figure 8(a), since the luminance value of nozzle N is smaller than the background, it can be determined that the coordinate where the luminance value decreases sharply is the side edge of the tip of nozzle N. In the example in Figure 8(b), two coordinates with a luminance of 100 are determined to be the side edges of the tip of nozzle N, and the distance between these two coordinates is determined as the width of the tip of nozzle N, while the coordinate midway between these two coordinates is determined as the center position of the tip of nozzle N.

[0055] Next, the controller Ctr calculates the deviation ΔX1 between the coordinates of the rotation center axis Ax in the captured image and the center of the tip of the nozzle N. In the example in Figure 8(b), the coordinates of the rotation center axis Ax in the captured image are 300 pixels, but they may also be calculated by averaging the coordinates of the center of the tip of the nozzle N in multiple captured images.

[0056] Next, the controller Ctr performs the same processing on other captured images. As a result, based on the captured image obtained by capturing the nozzle N from the imaging unit J2 from the imaging position P2 (for example, the captured image at a position 90° around the rotation center axis Ax) (see Figure 8(c)), the width of the tip of the nozzle N, the center position of the tip of the nozzle N, and the deviation ΔY1 are calculated (see Figure 8(d)).

[0057] Furthermore, based on the image obtained by imaging the nozzle N from imaging position P3 using the imaging unit J2 (for example, the image taken at a position 180° around the rotation center axis Ax) (see Figure 9(a)), the width of the tip of the nozzle N, the center position of the tip of the nozzle N, and the deviation ΔX2 are calculated (see Figure 9(b)). In addition, based on the image obtained by imaging the nozzle N from imaging position P4 using the imaging unit J2 (for example, the image taken at a position 270° around the rotation center axis Ax) (see Figure 9(c)), the width of the tip of the nozzle N, the center position of the tip of the nozzle N, and the deviation ΔY2 are calculated (see Figure 9(d)).

[0058] Next, the controller Ctr calculates the center position of the nozzle N tip based on the calculated ΔX1, ΔX2, ΔY1, and ΔY2. Specifically, in the example above, four images taken from imaging positions that are 90° apart are used, so the coordinates (pixels) in the X direction in the image are obtained by the average value of ΔX1 and ΔX2 (= (ΔX1 + ΔX2) / 2), and the coordinates (pixels) in the Y direction in the image are obtained by the average value of ΔY1 and ΔY2 (= (ΔY1 + ΔY2) / 2). Then, the coordinates (pixels) in the image are multiplied by the previously acquired length per pixel (mm / pixel) to calculate the actual coordinates (mm) of the center position of the nozzle N tip.

[0059] Alternatively, the actual coordinates (mm) of the center position of the nozzle tip may be calculated based on at least two images taken from different imaging positions. However, using at least three images taken from different imaging positions smooths out errors due to the rotation of the base J1 and errors in the images caused by the imaging unit J2, allowing for a more accurate calculation of the actual coordinates (mm) of the center position of the nozzle tip.

[0060] (C) Tilt of nozzle N In the following section, we will explain an example of calculating the center position of the tip of the nozzle N based on four images obtained by imaging the nozzle N from imaging positions P1 to P4, which are approximately 90° apart, using the imaging unit J2, as illustrated in Figure 6.

[0061] First, the controller Ctr uses known image recognition techniques to identify the corners Q11 and Q12 (see Figure 10(a)) that make up the tip of the nozzle N in the image obtained by the imaging unit J2 from the imaging position P1 (for example, the image taken at 0° around the rotation center axis Ax). Next, the controller Ctr obtains the coordinates (pixels) of the corners Q11 and Q12 in the image and calculates the perpendicular bisector H1 (see the same figure) of the line segment connecting the corners Q11 and Q12. Next, the controller Ctr calculates the angle θ1 (see the same figure) of the perpendicular bisector H1 with respect to the vertical line.

[0062] Next, the controller Ctr performs the same processing on other captured images. As a result, based on the captured image obtained by capturing the nozzle N from the imaging unit J2 from the imaging position P2 (for example, the captured image at a position of 90° around the rotation center axis Ax), the corners Q21 and Q22, the perpendicular bisector H2, and the angle θ2 are calculated respectively (see Figure 10(b)).

[0063] Furthermore, based on the image obtained by imaging the nozzle N from imaging position P3 using the imaging unit J2 (for example, the image taken at a position of 180° around the rotation center axis Ax), the corners Q31 and Q32, the perpendicular bisector H3, and the angle θ3 are calculated respectively (see Figure 10(c)). In addition, based on the image obtained by imaging the nozzle N from imaging position P4 using the imaging unit J2 (for example, the image taken at a position of 270° around the rotation center axis Ax), the corners Q41 and Q42, the perpendicular bisector H4, and the angle θ4 are calculated respectively (see Figure 10(d)).

[0064] Next, the controller Ctr calculates the tilt of the nozzle N based on the calculated θ1 to θ4. Specifically, the controller Ctr first calculates the amount of tilt per unit height (e.g., 1 mm), i.e., the tilt vectors I1 to I4, based on the angles θ1 to θ4 (see Figure 11). In the above example, since four images taken from imaging positions that differ by 90° are used, the Y coordinates of tilt vectors I1 and I3 can be set to 0, and the X coordinates of tilt vectors I2 and I4 can be set to 0. Therefore, tilt vector I1 can be set to (Xi1, 0, 1), tilt vector I2 can be set to (0, Yi2, 1), tilt vector I3 can be set to (Xi3, 0, 1), and tilt vector I4 can be set to (0, Yi4, 1). Then, by using trigonometric ratios, Xi1 can be calculated using tanθ1, Yi2 using tanθ2, Xi3 using tanθ3, and Yi4 using tanθ4 (see the same figure). Next, the controller Ctr combines the calculated slope vectors I1 to I4 to calculate the amount of slope per unit height of the nozzle N, i.e., the slope vector I of the nozzle N.

[0065] The gradient vector I may be calculated based on at least two captured images taken from different imaging positions. However, using at least three captured images taken from different imaging positions allows for smoothing of errors due to the rotation of the base unit J1 and errors in the captured images caused by the imaging unit J2, thereby enabling a more accurate calculation of the gradient vector I.

[0066] Next, the controller Ctr calculates the predicted landing position of the processing liquid discharged from the nozzle N onto the surface of the substrate W based on the orientation of the nozzle N calculated in step S4 (see step S5 in Figure 5). For example, the controller Ctr may calculate the predicted landing position using at least one of the following: the height of the nozzle N calculated in step S4, the actual coordinates of the center position of the tip of the nozzle N, and the slope vector I of the nozzle N.

[0067] Next, the controller Ctr calculates the deviation between the predicted liquid application position calculated in step S5 and the rotational center axis Ax (see step S6 in Figure 5). Next, the controller Ctr determines whether the deviation is within a predetermined tolerance range (see step S7 in Figure 5). This tolerance range may be determined based on various conditions, such as the processing accuracy of the substrate W, the rotational speed during processing of the substrate W, the type of processing liquid, and the discharge flow rate of the processing liquid.

[0068] If the deviation is outside a predetermined tolerance range (NO in step S7 of Figure 5), the controller Ctr proceeds to step S10 and issues an alarm indicating that adjustment of the nozzle N is necessary. Based on this alarm, the operator may manually adjust the nozzle N, or the controller Ctr may automatically adjust the nozzle N by controlling various parts of the liquid treatment unit U (e.g., the drive unit 48). Subsequently, the controller Ctr controls the transport arm A2 to unload the inspection substrate J from the liquid treatment unit U and transport the inspection substrate J to the shelf unit 6 (see step S11 of Figure 5).

[0069] The controller Ctr may also determine whether the orientation of the nozzle N calculated in step S4 (for example, the height of the nozzle N, the actual coordinates of the center position of the tip of the nozzle N, the inclination vector I of the nozzle N, etc.) is within a predetermined tolerance range. In this case as well, the controller Ctr may issue an alarm if the orientation of the nozzle N is not within the predetermined tolerance range. Alternatively, if the orientation of the nozzle N is not within the predetermined tolerance range, the controller Ctr may control various parts of the liquid processing unit U (for example, the drive unit 48, etc.) to automatically adjust the nozzle N. In this case, maintenance of the nozzle N can be performed efficiently.

[0070] On the other hand, if the result of the judgment in step S7 is that the deviation is within a predetermined tolerance range (YES in step S7 in Figure 5), the controller Ctr detects whether or not there is an abnormality on the surface of the nozzle N (see step S8 in Figure 5). Below, we will describe an example in which the presence or absence of an abnormality on the surface of the nozzle N is detected based on a panoramic image of the entire circumference of the nozzle N, as illustrated in Figure 12.

[0071] First, a panoramic image of nozzle N without abnormalities is acquired as a reference image. Next, the controller Ctr subtracts the brightness value for each pixel located at corresponding coordinates in the reference image and the panoramic image of the subject to inspection, and calculates a corrected image. Next, the controller Ctr processes the corrected image using a known edge detection technique and calculates the size of the area where the edges are enhanced. Next, the controller Ctr determines whether the size of the area is within a predetermined tolerance range. If the size of the area is not within the predetermined tolerance range, the controller Ctr determines that an abnormality Ab (see Figure 12) exists in nozzle N. Note that the above reference image may be obtained by averaging the brightness values ​​of all pixels in the panoramic image of the subject to inspection. Alternatively, the panoramic image of the subject to inspection may be processed directly using a known edge detection technique without using a reference image.

[0072] If the controller Ctr determines that an abnormality Ab exists in nozzle N (NO in step S9 of Figure 5), it proceeds to step S10 and issues an alarm indicating that an abnormality exists in nozzle N. If an alarm is issued, the operator may replace nozzle N with a new nozzle N. Alternatively, if the abnormality Ab in nozzle N is a deposit adhering to the surface of nozzle N, the controller Ctr may control the various parts of the liquid treatment unit U to supply treatment liquid or cleaning liquid to nozzle N and remove the deposit from nozzle N.

[0073] On the other hand, if the determination in step S9 indicates that there is no abnormality Ab in nozzle N (YES in step S9 in Figure 5), the process proceeds to step S11, where controller Ctr controls transport arm A2 to remove the inspection substrate J from liquid processing unit U and transport it to shelf unit 6. This completes the inspection of the nozzle N's condition.

[0074] Furthermore, once the inspection of the nozzle N of one liquid processing unit U is complete, the inspection substrate J may be transported to another liquid processing unit U for inspection of the nozzle N of that unit U, without returning the inspection substrate J to the shelf unit 6. Alternatively, the inspection substrate may be periodically brought into the liquid processing unit U each time the substrate W is processed a predetermined number of times in the liquid processing unit U, and the condition of the nozzle N of the liquid processing unit U may be inspected. In this case, the controller Ctr may compare the data on the current nozzle N condition with the data on the previous nozzle N condition to determine whether the current nozzle N condition is within a predetermined acceptable range. If it is not within the acceptable range, the controller Ctr may issue an alarm as in step S10.

[0075] [Effect] In the above example, while the inspection substrate J is held by the rotating holding unit 30, the position of the imaging unit J2 relative to the nozzle N is adjusted to a predetermined imaging position by rotating the rotating holding unit 30. Therefore, there are no obstructions between the imaging unit J2 and the nozzle N, which is the object to be imaged, and the nozzle N is imaged from an appropriate position. Consequently, it becomes possible to acquire the state of the nozzle N with high accuracy.

[0076] As shown in the above example, the nozzle is imaged from multiple imaging positions. Therefore, it becomes possible to acquire the state of nozzle N with greater accuracy.

[0077] According to the above example, the nozzle N can be imaged from multiple imaging positions that are spaced approximately equally apart in the rotational direction of the inspection substrate J. In this case, the outer surface of the nozzle N is imaged over almost its entire circumference. Therefore, it becomes possible to acquire the state of the nozzle N with even greater accuracy.

[0078] As shown in the above example, when imaging the nozzle N, the nozzle N may be positioned on the rotational axis Ax side of the rotational holding unit 30 relative to the imaging unit J2. In this case, even if the imaging unit J2 rotates via the inspection substrate J, the position of the nozzle N relative to the imaging unit J2 is less likely to change. Therefore, it becomes possible to continuously image the nozzle N with the imaging unit J2 without adjusting the orientation of the imaging unit J2.

[0079] As shown in the above example, by processing the image captured by the imaging unit J2, the presence or absence of abnormalities on the surface of the nozzle N can be detected. Therefore, the presence or absence of deposits or scratches on the surface of the nozzle N, and the presence or absence of deformation of the nozzle N can be detected. Accordingly, by adjusting the nozzle N based on the detection results (e.g., replacement, cleaning, etc.), it becomes possible to eliminate in advance any impact on substrate processing due to abnormalities on the surface of the nozzle N.

[0080] As shown in the above example, the presence or absence of abnormalities on the surface of the nozzle N is detected by comparing an image of the nozzle N captured by the imaging unit J2 before the substrate W is processed with the processing liquid (an image of a nozzle N without abnormalities) with an image of the nozzle N captured by the imaging unit J2 after the substrate W is processed with the processing liquid. Therefore, by comparing the two images, the location of the abnormality on the surface of the nozzle N becomes more prominent. As a result, it becomes possible to detect the presence or absence of abnormalities on the surface of the nozzle N more accurately.

[0081] As shown in the above example, by processing the image captured by the imaging unit J2, at least one of the nozzle N's orientations—the height of the nozzle N, the center position of the tip of the nozzle N in the horizontal direction, and the inclination of the nozzle N—can be detected. Therefore, it becomes possible to determine the orientation of the nozzle N based on the detection results.

[0082] As shown in the above example, the predicted landing position of the processing liquid discharged from nozzle N onto the substrate W surface is calculated based on the detected orientation of nozzle N. Therefore, it is possible to determine the predicted landing position in advance without actually discharging the processing liquid onto the substrate W.

[0083] According to the above example, the deviation between the calculated predicted liquid application position and the rotational axis Ax of the rotating holding unit 30 is calculated. Therefore, by adjusting the nozzle N based on this deviation, it becomes possible to pre-align the liquid application position from the nozzle N to the origin without actually discharging the liquid onto the substrate W.

[0084] As shown in the above example, an alarm is sounded if the calculated deviation is determined to be outside the predetermined tolerance range. Therefore, it is possible to eliminate in advance the impact of the deviation on the substrate processing.

[0085] In the above example, when the imaging unit J2 images the nozzle N, light is irradiated onto the nozzle N from the illumination unit J3. Therefore, it becomes possible to image the nozzle N more clearly.

[0086] As shown in the above example, the imaging unit J2 and the controller Ctr can be connected to each other wirelessly for communication. In this case, there is no need for a communication cable to be connected to the inspection substrate J, so the rotation of the inspection substrate J by the rotation holding unit 30 is less likely to be hindered. Therefore, it becomes possible to increase the degree of freedom of the imaging position of the nozzle N.

[0087] In the above example, the inspection substrate J includes a battery J4 that supplies power to the imaging unit J2 and is also rechargeable. Therefore, since there is no need for a power cable to be connected to the inspection substrate J, the rotation of the inspection substrate J by the rotation holding unit 30 is less likely to be hindered. As a result, it becomes possible to increase the degree of freedom of the imaging position of the nozzle N.

[0088] In the above example, the inspection substrate J is transported between the liquid processing unit U and the shelf unit 6 by the transport arm A2. Therefore, it is possible to move the inspection substrate J to the shelf unit 6 while the substrate is being processed by the liquid processing unit U.

[0089] [Differentiation] The disclosures herein should be considered in all respects to be illustrative and not restrictive. Various omissions, substitutions, and modifications may be made to the above examples without departing from the claims and the gist thereof.

[0090] (1) In the above example, the substrate processing system 1 was described as a substrate cleaning device, but the substrate processing system 1 may also be a coating and developing device. That is, the processing liquid supplied to the surface of the substrate W may be, for example, a coating liquid for forming a film on the surface of the substrate W, or a developing liquid for developing the resist film.

[0091] (2) The inspection substrate J does not have to include the illumination unit J3. Alternatively, the inspection substrate J may include multiple illumination units J3. In this case, as illustrated in Figure 13, the multiple illumination units J3 may be spaced apart from each other at approximately equal intervals in the rotational direction of the inspection substrate J.

[0092] (3) The inspection substrate J may include a plurality of imaging units J2. In this case, as illustrated in Figure 13, the plurality of imaging units J2 may be spaced approximately equally apart from each other in the rotational direction of the inspection substrate J. When the nozzle N is imaged by the plurality of imaging units J2, multiple locations of the nozzle N can be imaged simultaneously simply by adjusting the positions of the plurality of imaging units J2 relative to the nozzle N to predetermined imaging positions. Therefore, it becomes possible to acquire the state of the nozzle N accurately and quickly.

[0093] (4) The imaging unit J2 may be placed on the surface of the base unit J1 or may be built into the base unit J1.

[0094] (5) In the above examples, the condition of the nozzle N from which the processing liquid or cleaning liquid is discharged was inspected, but the nozzle from which a gas (for example, nitrogen gas) is discharged may also be the subject of inspection.

[0095] (6) In the above examples, the holding part 33 held the substrate W by suction, but the substrate W may be held mechanically.

[0096] (7) The controller Ctr may generate three-dimensional shape data of the nozzle N by processing multiple images obtained by imaging the nozzle N from different directions using the imaging unit J2 while changing the imaging position. In this case, the nozzle N can be observed in more detail based on the generated three-dimensional shape data. Therefore, it becomes possible to acquire the state of the nozzle N with greater accuracy. Alternatively, the three-dimensional shape data of the nozzle N may be acquired using a non-contact 3D scanner instead of the imaging unit J2.

[0097] (8) The imaging unit J2 may image the nozzle N while the processing liquid is being discharged. In this case, the actual state of the processing liquid discharged from the nozzle N can be confirmed. Therefore, if the state of the nozzle N is abnormal, it is possible to detect the abnormality early. In this case, an imaging unit J2 having a waterproof function may be used, or the imaging unit J2 may be positioned away from the flow of the processing liquid in order to suppress adhesion of the processing liquid to the imaging unit J2.

[0098] Alternatively, as illustrated in Figure 14, the inspection substrate J may include a transparent member J6 positioned on the base J1 so as to cover the imaging unit J2. In this case, the nozzle N is imaged by the imaging unit J2 through the transparent member J6. Therefore, even if processing liquid falls or is discharged from the nozzle N, the presence of the transparent member J6 makes it difficult for the processing liquid to adhere to the imaging unit J2. Thus, it is possible to accurately acquire the state of the nozzle N while protecting the imaging unit J2. Furthermore, imaging by the imaging unit J2 can be performed even while the processing liquid is being discharged from the nozzle N. Therefore, it is possible to determine the actual position where the processing liquid lands on the substrate W. The transparent member J6 may be made of a material that has chemical resistance to the processing liquid (for example, quartz, resin, etc.).

[0099] (9) As illustrated in Figure 15, the nozzle N may be imaged by the imaging unit J2 from approximately directly below. In this case as well, the center position of the tip of the nozzle N and the presence or absence of abnormalities on the tip surface of the nozzle N can be detected.

[0100] [Other examples] Example 1. An example of a substrate processing apparatus includes an inspection substrate including a base and an imaging unit disposed on the base, a holding unit configured to hold the substrate or the inspection substrate, a drive unit configured to rotate the holding unit, a processing liquid supply unit including a nozzle configured to discharge processing liquid onto the substrate held by the holding unit, and a control unit. The control unit is configured to perform a first process, in which, while the inspection substrate is held by the holding unit, controls the drive unit to rotate the holding unit, thereby adjusting the position of the imaging unit relative to the nozzle to a predetermined first imaging position, and a second process, after the first process, to control the imaging unit to image the nozzle at the first imaging position. However, according to the substrate processing apparatus described in Patent Document 1, the imaging means is positioned above the processing liquid supply nozzle and the splash-proof cup. Therefore, when attempting to image the vicinity of the nozzle tip, these may function as obstructions, potentially blocking the area to be imaged or preventing light from hitting the area to be imaged uniformly, making it impossible to clearly image the area to be imaged. Furthermore, imaging must avoid the processing liquid supply nozzle and splash prevention cup, and the imaging direction is limited to diagonally above, which may limit the imaging range. However, with the apparatus in Example 1, while the inspection substrate is held in the holding unit, the driving unit is controlled to rotate the holding unit, thereby adjusting the position of the imaging unit relative to the nozzle to a predetermined first imaging position. As a result, there are no obstructions between the imaging unit and the nozzle being imaged, and the nozzle is imaged from an appropriate position. Therefore, it becomes possible to acquire the state of the nozzle with high accuracy.

[0101] Example 2. In the apparatus of Example 1, the control unit may be configured to perform a third process after the second process, in which, while the inspection substrate is held in the holding unit, the drive unit is controlled to rotate the holding unit, thereby adjusting the position of the imaging unit relative to the nozzle to a second imaging position different from the first imaging position; and a fourth process after the third process, in which the imaging unit is controlled to image the nozzle at the second imaging position. In this case, the nozzle is imaged from multiple imaging positions. Therefore, it becomes possible to acquire the state of the nozzle with greater accuracy.

[0102] Example 3. In the apparatus of Example 2, the control unit may be configured to control the drive unit to rotate the holding unit while continuously executing the first process, the second process, the third process, and the fourth process.

[0103] Example 4. In the apparatus of Example 2 or Example 3, the control unit is configured to perform a fifth process after the fourth process, in which, while the inspection substrate is held in the holding unit, the drive unit is controlled to rotate the holding unit, thereby adjusting the position of the imaging unit relative to the nozzle to a third imaging position different from the first and second imaging positions; and a sixth process after the fifth process, the imaging unit is controlled to image the nozzle at the third imaging position. The first imaging position, the second imaging position, and the third imaging position may be spaced approximately equally apart in the rotational direction of the inspection substrate. In this case, the nozzle is imaged from three imaging positions spaced approximately equally apart in the rotational direction of the inspection substrate. That is, the outer surface of the nozzle is imaged over approximately its entire circumference. Therefore, it becomes possible to acquire the state of the nozzle with even greater accuracy.

[0104] Example 5. In the apparatus of Examples 2 to 4, the control unit may be configured to perform a seventh process in which it generates three-dimensional shape data of the nozzle by image processing of multiple captured images captured by the imaging unit. In this case, the nozzle can be observed in more detail based on the generated three-dimensional shape data. Therefore, it becomes possible to acquire the state of the nozzle with greater accuracy.

[0105] Example 6. In any of the devices in Examples 1 to 5, the imaging unit may be positioned on the outer peripheral edge side of the base unit relative to the nozzle when imaging the nozzle. In this case, the nozzle is positioned on the rotational axis side of the holding unit relative to the imaging unit. Therefore, even if the imaging unit rotates via the inspection substrate, the position of the nozzle relative to the imaging unit is less likely to change. Consequently, it becomes possible to continuously image the nozzle with the imaging unit without adjusting the orientation of the imaging unit.

[0106] Example 7. In any of the devices in Examples 1 to 6, the control unit may be configured to perform an eighth process to detect the presence or absence of abnormalities on the nozzle surface by image processing of the image captured by the imaging unit. In this case, the presence or absence of deposits or scratches on the nozzle surface, the presence or absence of nozzle deformation, etc., can be detected. Therefore, by adjusting the nozzle (e.g., replacement, cleaning, etc.) based on the detection results, it becomes possible to eliminate in advance any impact on substrate processing due to abnormalities on the nozzle surface.

[0107] Example 8. In the apparatus of Example 7, the eighth process may include detecting the presence or absence of abnormalities on the nozzle surface by comparing an image captured by the imaging unit before the substrate is processed with the processing liquid with an image captured by the imaging unit after the substrate is processed with the processing liquid. In this case, the comparison of the two images makes the location of abnormalities on the nozzle surface more prominent. Therefore, it becomes possible to detect the presence or absence of abnormalities on the nozzle surface more accurately.

[0108] Example 9. In any of the devices in Examples 1 to 8, the control unit may be configured to perform a ninth process in which it detects at least one nozzle orientation, such as the nozzle height, the center position of the nozzle tip in the horizontal direction, and the nozzle tilt, by image processing of the captured image taken by the imaging unit. In this case, it becomes possible to determine the nozzle orientation based on the detection result.

[0109] Example 10. In the apparatus of Example 9, the control unit may be configured to perform a 10th process, which calculates the expected landing position of the processing liquid discharged from the nozzle onto the substrate surface, based on the nozzle orientation detected in the 9th process. In this case, it becomes possible to determine the expected landing position in advance without actually discharging the processing liquid onto the substrate.

[0110] Example 11. In the apparatus of Example 10, the control unit may be configured to perform an eleventh process that calculates the deviation between the predicted liquid application position calculated in the tenth process and the rotational center axis of the holding unit. In this case, by adjusting the nozzle based on the calculated deviation, it becomes possible to pre-align the liquid application position from the nozzle to the origin without actually discharging the liquid onto the substrate.

[0111] Example 12. In the apparatus of Example 11, the control unit may be configured to execute a 12th process that issues an alarm if it determines that the deviation calculated in the 11th process is outside a predetermined tolerance range. In this case, it becomes possible to eliminate in advance the impact of the deviation on the substrate processing.

[0112] Example 13. The apparatus of Example 11 or Example 12 may further include a nozzle drive unit configured to change the orientation of the nozzle, and the control unit may be configured to control the nozzle drive unit and perform a 13th process in which it determines that the deviation calculated in the 11th process is outside a predetermined tolerance range to adjust the orientation of the nozzle so that the deviation is within the tolerance range. In this case, since the control unit automatically controls the orientation of the nozzle when the deviation is outside the tolerance range, it becomes possible to perform nozzle maintenance efficiently.

[0113] Example 14. In any of the devices in Examples 1 to 13, the second process may include imaging the nozzle at the first imaging position while the processing liquid is being discharged. In this case, the actual state of the processing liquid discharged from the nozzle can be confirmed. Therefore, if the state of the nozzle is abnormal, it becomes possible to detect the abnormality early.

[0114] Example 15. In any of the apparatuses in Examples 1 to 14, the inspection substrate may include a transparent member positioned to cover the imaging unit, and the second process may include imaging the nozzle through the transparent member at the first imaging position. In this case, even if processing liquid falls or is discharged from the nozzle, the presence of the transparent member makes it difficult for the processing liquid to adhere to the imaging unit. Therefore, it is possible to accurately acquire the state of the nozzle while protecting the imaging unit. Furthermore, imaging can be performed by the imaging unit while the processing liquid is being discharged from the nozzle. Therefore, it is possible to determine the actual location where the processing liquid lands on the substrate.

[0115] Example 16. In any of the devices in Examples 1 to 15, the inspection substrate may include an illumination unit located on the base, and the illumination unit may be configured to irradiate the nozzle with light when the imaging unit images the nozzle. In this case, it becomes possible to image the nozzle more clearly.

[0116] Example 17. In any of the devices in Examples 1 to 16, the inspection substrate may include another imaging unit located in a different location on the base from the imaging unit. In this case, the nozzle is imaged by multiple imaging units. Therefore, by simply adjusting the positions of the multiple imaging units relative to the nozzle to predetermined imaging positions, multiple locations on the nozzle can be imaged simultaneously. Thus, it becomes possible to acquire the state of the nozzle accurately and quickly.

[0117] Example 18. In any of the devices in Examples 1 to 17, the imaging unit and the control unit may be connected to each other wirelessly so as to enable communication. In this case, since there is no need for a communication cable to be connected to the inspection substrate, the rotation of the inspection substrate by the holding unit is less likely to be hindered. Therefore, it becomes possible to increase the degree of freedom of the imaging position of the nozzle.

[0118] Example 19. In any of the devices in Examples 1 to 18, the inspection board may include a battery configured to supply power to the imaging unit and to be rechargeable. In this case, since a power cable does not need to be connected to the inspection board, the rotation of the inspection board by the holding unit is less likely to be hindered. Therefore, it becomes possible to increase the degree of freedom of the imaging position of the nozzle.

[0119] Example 20. Any apparatus from Examples 1 to 19 may include a processing chamber configured to house a holding unit, a drive unit, and a nozzle; a storage chamber configured to house an inspection substrate; and a transport unit configured to transport the inspection substrate between the processing chamber and the storage chamber. In this case, the inspection substrate can be moved to the storage chamber while the substrate is being processed by the processing chamber.

[0120] Example 21. An example of a substrate processing method includes: a first step of holding an inspection substrate, which includes a base and an imaging unit positioned on the base, in a holding unit; a second step of adjusting the position of the imaging unit relative to the nozzle of the processing liquid supply unit to a predetermined first imaging position by rotating the holding unit after the first step; a third step of imaging the nozzle at the first imaging position after the second step; a fourth step of unloading the inspection substrate from the holding unit after the third step; a fifth step of holding the substrate in the holding unit after the fourth step; and a sixth step of processing the substrate by supplying processing liquid to the substrate through the nozzle via the processing liquid supply unit after the fifth step. In this case, the same effects and advantages as the apparatus in Example 1 can be obtained. [Explanation of Symbols]

[0121] 1...Substrate processing system (substrate processing device), 6...Shelf unit (storage chamber), 10...Chamber (processing chamber), 30...Rotating holding unit, 31...Drive unit, 33...Holding unit, 40...Supply unit (processing liquid supply unit, cleaning liquid supply unit), 48...Drive unit (nozzle drive unit), 50...Cup member, A2...Transport arm (transport unit), Ax...Rotational central axis, Ctr...Controller (control unit), J...Inspection substrate, J1...Base unit, J2...Imaging unit, J3...Illumination unit, J4...Battery, J5...Communication unit, J6...Transparent member, N...Nozzle, U...Liquid processing unit, W...Substrate.

Claims

1. An inspection substrate including a base portion and an imaging portion disposed on the base portion, A holding part configured to hold the substrate or the inspection substrate, A drive unit configured to rotate the holding part, A processing liquid supply unit including a nozzle configured to discharge processing liquid onto the substrate held in the holding unit, It includes a control unit, The control unit, With the inspection substrate held in the holding portion, a first process is performed to adjust the position of the imaging portion relative to the nozzle to a predetermined first imaging position by controlling the drive portion to rotate the holding portion, After the first process, a second process is performed in which the imaging unit is controlled to image the nozzle at the first imaging position, After the second process, while the inspection substrate is held in the holding part, a third process is performed in which the drive unit is controlled to rotate the holding part, thereby adjusting the position of the imaging unit relative to the nozzle to a second imaging position different from the first imaging position. A substrate processing apparatus configured to perform a fourth process, after the third process, by controlling the imaging unit to image the nozzle at the second imaging position.

2. The apparatus according to claim 1, wherein the control unit is configured to control the drive unit to rotate the holding unit and to continuously execute the first process, the second process, the third process and the fourth process.

3. The control unit, After the fourth process, while the inspection substrate is held in the holding part, a fifth process is performed in which the drive unit is controlled to rotate the holding part, thereby adjusting the position of the imaging unit relative to the nozzle to a third imaging position different from the first imaging position and the second imaging position. The system is configured to perform a sixth process after the fifth process by controlling the imaging unit to image the nozzle at the third imaging position. The apparatus according to claim 1 or 2, wherein the first imaging position, the second imaging position, and the third imaging position are spaced approximately equally apart from each other in the rotational direction of the inspection substrate.

4. The apparatus according to any one of claims 1 to 3, wherein the control unit is configured to perform a seventh process to generate three-dimensional shape data of the nozzle by image processing a plurality of captured images captured by the imaging unit.

5. The apparatus according to any one of claims 1 to 4, wherein the imaging unit is located on the outer peripheral edge side of the base portion than the nozzle when imaging the nozzle.

6. The apparatus according to any one of claims 1 to 5, wherein the control unit is configured to perform an eighth process to detect whether or not there is an abnormality on the surface of the nozzle by image processing the captured image captured by the imaging unit.

7. The apparatus according to claim 6, wherein the eighth process includes detecting whether or not there is an abnormality on the surface of the nozzle by comparing an image captured by the imaging unit before the substrate is processed with the processing liquid with an image captured by the imaging unit after the substrate is processed with the processing liquid.

8. An inspection substrate including a base portion and an imaging portion disposed on the base portion, A holding part configured to hold the substrate or the inspection substrate, A drive unit configured to rotate the holding part, A processing liquid supply unit including a nozzle configured to discharge processing liquid onto the substrate held in the holding unit, It includes a control unit, The control unit, With the inspection substrate held in the holding portion, a first process is performed to adjust the position of the imaging portion relative to the nozzle to a predetermined first imaging position by controlling the drive portion to rotate the holding portion, After the first process, a second process is performed in which the imaging unit is controlled to image the nozzle at the first imaging position, A substrate processing apparatus configured to perform a third process, which involves image processing of an image captured by the imaging unit to detect whether or not there is an abnormality on the surface of the nozzle.

9. The apparatus according to claim 8, wherein the third process includes detecting whether or not there is an abnormality on the surface of the nozzle by comparing an image captured by the imaging unit before the substrate is processed with the processing liquid with an image captured by the imaging unit after the substrate is processed with the processing liquid.

10. The apparatus according to any one of claims 1 to 9, wherein the control unit is configured to perform a ninth process to detect at least one nozzle orientation, which is the height of the nozzle, the center position of the tip of the nozzle in the horizontal direction, and the inclination of the nozzle, by image processing of the image captured by the imaging unit.

11. The apparatus according to claim 10, wherein the control unit is configured to perform a tenth process, which calculates the predicted position where the processing liquid discharged from the nozzle will land on the surface of the substrate, based on the orientation of the nozzle detected in the ninth process.

12. The apparatus according to claim 11, wherein the control unit is configured to perform an eleventh process which calculates the deviation between the predicted liquid application position calculated in the tenth process and the rotational center axis of the holding unit.

13. The apparatus according to claim 12, wherein the control unit is configured to perform a twelfth process that issues an alarm when it determines that the deviation calculated in the eleventh process is outside a predetermined tolerance range.

14. The nozzle drive unit is further configured to change the orientation of the nozzle, The apparatus according to claim 12 or 13, wherein the control unit is configured to control the nozzle drive unit and perform a 13th process to adjust the position of the nozzle so that the deviation calculated in the 11th process falls within the allowable range, when it is determined that the deviation is outside a predetermined allowable range.

15. An inspection substrate including a base portion and an imaging portion disposed on the base portion, A holding part configured to hold the substrate or the inspection substrate, A drive unit configured to rotate the holding part, A processing liquid supply unit including a nozzle configured to discharge processing liquid onto the substrate held in the holding unit, It includes a control unit, The control unit, With the inspection substrate held in the holding portion, a first process is performed to adjust the position of the imaging portion relative to the nozzle to a predetermined first imaging position by controlling the drive portion to rotate the holding portion, After the first process, a second process is performed in which the imaging unit is controlled to image the nozzle at the first imaging position, A third process involves image processing of the image captured by the imaging unit to detect at least one nozzle orientation, which includes the height of the nozzle, the center position of the nozzle tip in the horizontal direction, and the inclination of the nozzle. A fourth process is performed to calculate the predicted landing position of the processing liquid discharged from the nozzle onto the surface of the substrate, based on the nozzle's orientation detected in the third process. A fifth process is performed to calculate the deviation between the predicted liquid contact position calculated in the fourth process and the rotational center axis of the holding part, A substrate processing apparatus configured to perform a sixth process that issues an alarm if it is determined that the deviation calculated in the fifth process is outside a predetermined tolerance range.

16. The apparatus according to any one of claims 1 to 15, wherein the second process includes imaging the nozzle in which the processing liquid is being discharged at the first imaging position.

17. The inspection substrate includes a transparent member arranged to cover the imaging unit, The apparatus according to any one of claims 1 to 15, wherein the second process includes imaging the nozzle through the transparent member at the first imaging position.

18. The apparatus according to any one of claims 1 to 17, wherein the inspection substrate includes another imaging unit located in a different location on the base portion from the imaging unit.

19. The apparatus according to any one of claims 1 to 18, wherein the imaging unit and the control unit are connected to each other wirelessly so as to be able to communicate with each other.

20. The apparatus according to any one of claims 1 to 19, wherein the inspection substrate includes a battery configured to supply power to the imaging unit and to be rechargeable.

21. A processing chamber configured to house the holding unit, the drive unit, and the nozzle, A housing chamber configured to house the aforementioned test substrate, The apparatus according to any one of claims 1 to 20, further comprising a transport unit configured to transport the inspection substrate between the processing chamber and the storage chamber.

22. An inspection substrate including a base portion and an imaging portion disposed on the base portion, A holding part configured to hold the substrate or the inspection substrate, A drive unit configured to rotate the holding part, A processing liquid supply unit including a nozzle configured to discharge processing liquid onto the substrate held in the holding unit, It includes a control unit, The control unit, With the inspection substrate held in the holding portion, a first process is performed to adjust the position of the imaging portion relative to the nozzle to a predetermined first imaging position by controlling the drive portion to rotate the holding portion, The system is configured to perform a second process after the first process by controlling the imaging unit to image the nozzle at the first imaging position. The substrate processing apparatus comprises, in the second processing, imaging the nozzle in the state in which the processing liquid is being discharged at the first imaging position.

23. An inspection substrate including a base portion and an imaging portion disposed on the base portion, A holding part configured to hold the substrate or the inspection substrate, A drive unit configured to rotate the holding part, A processing liquid supply unit including a nozzle configured to discharge processing liquid onto the substrate held in the holding unit, It includes a control unit, The inspection substrate includes a transparent member arranged to cover the imaging unit, The control unit, With the inspection substrate held in the holding portion, a first process is performed to adjust the position of the imaging portion relative to the nozzle to a predetermined first imaging position by controlling the drive portion to rotate the holding portion, The system is configured to perform a second process after the first process by controlling the imaging unit to image the nozzle at the first imaging position. The second process includes imaging the nozzle through the transparent member at the first imaging position, wherein the substrate processing apparatus is provided.

24. An inspection substrate including a base portion and an imaging portion disposed on the base portion, A holding part configured to hold the substrate or the inspection substrate, A drive unit configured to rotate the holding part, A processing liquid supply unit including a nozzle configured to discharge processing liquid onto the substrate held in the holding unit, It includes a control unit, The inspection substrate includes another imaging unit located in a different location from the imaging unit within the base portion, The control unit, With the inspection substrate held in the holding portion, a first process is performed to adjust the position of the imaging portion relative to the nozzle to a predetermined first imaging position by controlling the drive portion to rotate the holding portion, A substrate processing apparatus configured to perform a second process, after the first process, by controlling the imaging unit to image the nozzle at the first imaging position.

25. An inspection substrate including a base portion and an imaging portion disposed on the base portion, A holding part configured to hold the substrate or the inspection substrate, A drive unit configured to rotate the holding part, A processing liquid supply unit including a nozzle configured to discharge processing liquid onto the substrate held in the holding unit, It includes a control unit, The imaging unit and the control unit are connected to each other wirelessly so that they can communicate with one another. The control unit, With the inspection substrate held in the holding portion, a first process is performed to adjust the position of the imaging portion relative to the nozzle to a predetermined first imaging position by controlling the drive portion to rotate the holding portion, A substrate processing apparatus configured to perform a second process, after the first process, by controlling the imaging unit to image the nozzle at the first imaging position.

26. An inspection substrate including a base portion and an imaging portion disposed on the base portion, A holding part configured to hold the substrate or the inspection substrate, A drive unit configured to rotate the holding part, A processing liquid supply unit including a nozzle configured to discharge processing liquid onto the substrate held in the holding unit, It includes a control unit, The inspection substrate includes a battery configured to supply power to the imaging unit and to be rechargeable. The control unit, With the inspection substrate held in the holding portion, a first process is performed to adjust the position of the imaging portion relative to the nozzle to a predetermined first imaging position by controlling the drive portion to rotate the holding portion, A substrate processing apparatus configured to perform a second process, after the first process, by controlling the imaging unit to image the nozzle at the first imaging position.

27. An inspection substrate including a base portion and an imaging portion disposed on the base portion, A holding part configured to hold the substrate or the inspection substrate, A drive unit configured to rotate the holding part, A processing liquid supply unit including a nozzle configured to discharge processing liquid onto the substrate held in the holding unit, A processing chamber configured to house the holding unit, the drive unit, and the nozzle, A housing chamber configured to house the aforementioned test substrate, A transport unit configured to transport the inspection substrate between the processing chamber and the storage chamber, It includes a control unit, The control unit, With the inspection substrate held in the holding portion, a first process is performed to adjust the position of the imaging portion relative to the nozzle to a predetermined first imaging position by controlling the drive portion to rotate the holding portion, A substrate processing apparatus configured to perform a second process, after the first process, by controlling the imaging unit to image the nozzle at the first imaging position.

28. The inspection board includes an illumination unit located on the base portion, The apparatus according to any one of claims 1 to 27, wherein the illumination unit is configured to irradiate the nozzle with light when the imaging unit takes an image of the nozzle.

29. A first step is to hold an inspection substrate, which includes a base portion and an imaging portion disposed on the base portion, in a holding portion. A second step is performed in which, after the first step, the holding part is rotated to adjust the position of the imaging part relative to the nozzle of the processing liquid supply part to a predetermined first imaging position, A third step is performed after the second step, in which the nozzle is imaged at the first imaging position, A fourth step is performed in which, with the inspection substrate held in the holding part, the position of the imaging unit relative to the nozzle is adjusted to a second imaging position different from the first imaging position by rotating the holding part, A fifth step is to image the nozzle at the second imaging position, after the fourth step described above. After the fifth step, a sixth step is to remove the inspection substrate from the holding unit, After the sixth step described above, a seventh step is to hold the substrate in the holding part, A substrate processing method comprising, after the seventh step, an eighth step in which the processing liquid supply unit supplies a processing liquid to the substrate through the nozzle to process the substrate.

30. The method according to claim 29, wherein the second step, the third step, the fourth step, and the fifth step are performed in succession while the holding portion is rotated.

31. A ninth step is performed in which, with the inspection substrate held in the holding part, the position of the imaging unit relative to the nozzle is adjusted to a third imaging position different from the first imaging position and the second imaging position by rotating the holding part, The process further includes, after the ninth step, a tenth step of imaging the nozzle at the third imaging position, The method according to claim 29 or 30, wherein the first imaging position, the second imaging position, and the third imaging position are spaced approximately equally apart from each other in the rotational direction of the inspection substrate.

32. The method according to any one of claims 29 to 31, further comprising an eleventh step of generating three-dimensional shape data of the nozzle by image processing a plurality of captured images captured by the imaging unit.

33. The method according to any one of claims 29 to 31, further comprising a twelfth step of detecting whether or not there is an abnormality on the surface of the nozzle by image processing the image captured by the imaging unit.

34. The method according to claim 33, wherein the twelfth step includes detecting whether or not there is an abnormality on the surface of the nozzle by comparing an image captured by the imaging unit before the substrate is processed with the processing liquid with an image captured by the imaging unit after the substrate is processed with the processing liquid.

35. A first step is to hold an inspection substrate, which includes a base portion and an imaging portion disposed on the base portion, in a holding portion. A second step is performed in which, after the first step, the holding part is rotated to adjust the position of the imaging part relative to the nozzle of the processing liquid supply part to a predetermined first imaging position, A third step is performed after the second step, in which the nozzle is imaged at the first imaging position, A fourth step is to remove the inspection substrate from the holding unit after the third step described above, A fifth step is to hold the substrate in the holding part, after the fourth step described above. A sixth step is performed in which the processing liquid supply unit supplies processing liquid to the substrate through the nozzle after the fifth step, A substrate processing method comprising a seventh step of detecting whether or not there is an abnormality on the surface of the nozzle by image processing the image captured by the imaging unit.

36. The method according to claim 35, wherein the seventh step includes detecting whether or not there is an abnormality on the surface of the nozzle by comparing an image captured by the imaging unit before the substrate is processed with the processing liquid with an image captured by the imaging unit after the substrate is processed with the processing liquid.

37. A 13th step involves image processing of the image captured by the imaging unit to detect at least one nozzle orientation, which includes the height of the nozzle, the center position of the nozzle tip in the horizontal direction, and the inclination of the nozzle. A 14th step in which, based on the orientation of the nozzle detected in the 13th step, the predicted landing position of the processing liquid discharged from the nozzle onto the surface of the substrate is calculated, A 15th step involves calculating the deviation between the predicted liquid application position calculated in the 14th step and the rotational center axis of the holding part, The method according to any one of claims 29 to 36, further comprising a 16th step of issuing an alarm if it is determined that the deviation calculated in the 15th step is outside a predetermined tolerance range.

38. A first step is to hold an inspection substrate, which includes a base portion and an imaging portion disposed on the base portion, in a holding portion. A second step is performed in which, after the first step, the holding part is rotated to adjust the position of the imaging part relative to the nozzle of the processing liquid supply part to a predetermined first imaging position, A third step is performed after the second step, in which the nozzle is imaged at the first imaging position, A fourth step is to remove the inspection substrate from the holding unit after the third step described above, A fifth step is to hold the substrate in the holding part, after the fourth step described above. A sixth step is performed in which the processing liquid supply unit supplies processing liquid to the substrate through the nozzle after the fifth step, A seventh step involves processing the captured image taken by the imaging unit to detect at least one nozzle orientation, which includes the height of the nozzle, the center position of the nozzle tip in the horizontal direction, and the inclination of the nozzle. An eighth step in which, based on the orientation of the nozzle detected in the seventh step, the expected position of the processing liquid discharged from the nozzle onto the surface of the substrate is calculated, A ninth step involves calculating the deviation between the predicted liquid application position calculated in the eighth step and the rotational center axis of the holding part, A substrate processing method comprising a tenth step of issuing an alarm when it is determined that the deviation calculated in the ninth step is outside a predetermined tolerance range.

39. The method according to any one of claims 29 to 38, wherein the third step includes imaging the nozzle in which the processing liquid is being discharged at the first imaging position.

40. The inspection substrate includes a transparent member arranged to cover the imaging unit, The method according to any one of claims 29 to 39, wherein the third step includes imaging the nozzle through the transparent member at the first imaging position.

41. The method according to any one of claims 29 to 40, wherein the inspection substrate includes another imaging unit located in a different location on the base portion from the imaging unit.

42. The method according to any one of claims 29 to 41, wherein the inspection substrate includes a battery configured to supply power to the imaging unit and to be rechargeable.

43. A first step is to hold an inspection substrate, which includes a base portion and an imaging portion disposed on the base portion, in a holding portion. A second step is performed in which, after the first step, the holding part is rotated to adjust the position of the imaging part relative to the nozzle of the processing liquid supply part to a predetermined first imaging position, A third step is performed after the second step, in which the nozzle is imaged at the first imaging position, A fourth step is to remove the inspection substrate from the holding unit after the third step described above, A fifth step is to hold the substrate in the holding part, after the fourth step described above. The process includes a sixth step, after the fifth step, in which the processing liquid supply unit supplies processing liquid to the substrate through the nozzle to process the substrate, The third step of the substrate processing method includes imaging the nozzle in the state in which the processing liquid is being discharged at the first imaging position.

44. A first step is to hold an inspection substrate, which includes a base portion and an imaging portion disposed on the base portion, in a holding portion. A second step is performed in which, after the first step, the holding part is rotated to adjust the position of the imaging part relative to the nozzle of the processing liquid supply part to a predetermined first imaging position, A third step is performed after the second step, in which the nozzle is imaged at the first imaging position, A fourth step is to remove the inspection substrate from the holding unit after the third step described above, A fifth step is to hold the substrate in the holding part, after the fourth step described above. The process includes a sixth step, after the fifth step, in which the processing liquid supply unit supplies processing liquid to the substrate through the nozzle to process the substrate, The inspection substrate includes a transparent member arranged to cover the imaging unit, A substrate processing method comprising the third step of imaging the nozzle through the transparent member at the first imaging position.

45. A first step is to hold an inspection substrate, which includes a base portion and an imaging portion disposed on the base portion, in a holding portion. A second step is performed in which, after the first step, the holding part is rotated to adjust the position of the imaging part relative to the nozzle of the processing liquid supply part to a predetermined first imaging position, A third step is performed after the second step, in which the nozzle is imaged at the first imaging position, A fourth step is to remove the inspection substrate from the holding unit after the third step described above, A fifth step is to hold the substrate in the holding part, after the fourth step described above. The process includes a sixth step, after the fifth step, in which the processing liquid supply unit supplies processing liquid to the substrate through the nozzle to process the substrate, A substrate processing method comprising the inspection substrate including another imaging unit located in a different location on the base portion from the imaging unit.

46. A first step is to hold an inspection substrate, which includes a base portion and an imaging portion disposed on the base portion, in a holding portion. A second step is performed in which, after the first step, the holding part is rotated to adjust the position of the imaging part relative to the nozzle of the processing liquid supply part to a predetermined first imaging position, A third step is performed after the second step, in which the nozzle is imaged at the first imaging position, A fourth step is to remove the inspection substrate from the holding unit after the third step described above, A fifth step is to hold the substrate in the holding part, after the fourth step described above. The process includes a sixth step, after the fifth step, in which the processing liquid supply unit supplies processing liquid to the substrate through the nozzle to process the substrate, A substrate processing method comprising a battery configured to supply power to the imaging unit and to be rechargeable, wherein the inspection substrate includes the battery.

Images