Imaging device

Abstract

To dissipate heat from inside the enclosure. [Solution] The imaging device comprises a first image sensor, a first heat conduction unit that conducts heat generated by the first image sensor, a first image processing circuit that processes first image data based on the output from the first image sensor, a second heat conduction unit that conducts heat generated by the first image processing circuit, and a third heat conduction unit provided between the first heat conduction unit and the second heat conduction unit, through which heat from the second heat conduction unit is conducted via space, all housed in a housing. The first heat conduction unit is positioned relative to the first image sensor in a direction intersecting the direction in which light is incident on the first image sensor, and absorbs heat generated by the first image sensor and dissipates it to the housing. The third heat conduction unit diffuses heat generated from the first image processing circuit within the third heat conduction unit.

Description

Technical Field

[0001] The present invention relates to an imaging device.

Background Art

[0002] Patent Document 1 discloses a heat dissipation structure that makes it difficult for thermal interference to occur between multiple types of heat-generating electronic components. However, in the heat dissipation structure of Patent Document 1, since a heat insulation member is used, heat does not spread uniformly in the heat insulation member. Therefore, heat diffusion near the circuit board is not considered.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] An imaging device according to the disclosed technology includes a first imaging element, a first heat conduction part that conducts heat generated by the first imaging element, a first image processing circuit that processes first image data based on an output from the first imaging element, a second heat conduction part that conducts heat generated by the first image processing circuit, and a third heat conduction part provided between the first heat conduction part and the second heat conduction part, through which heat from the second heat conduction part is conducted via space, and is provided in a housing. The first heat conduction part is arranged with respect to the first imaging element in a direction intersecting the direction in which light is incident on the first imaging element, absorbs heat generated by the first imaging element, and dissipates the heat to the housing. The third heat conduction part diffuses heat generated from the first image processing circuit inside the third heat conduction part.

Brief Description of the Drawings

[0005] [Figure 1] FIG. 1 is a perspective view of an imaging device according to Example 1. [Figure 2] FIG. 2 is a first side cross-sectional view of an imaging device according to Example 1. [Figure 3]Figure 3 is a side cross-sectional view 2 of the imaging device according to Example 1. [Figure 4] Figure 4 is an explanatory diagram showing the imaging device according to Example 2. [Figure 5] Figure 5 is a side cross-sectional view of the imaging device according to Example 3. [Figure 6] Figure 6 is a side cross-sectional view of the imaging device according to Example 3. [Figure 7] Figure 7 is a perspective view showing an example of the routing of a flexible wiring board within an imaging device. [Figure 8] Figure 8 is a side cross-sectional view of the imaging device according to Example 5. [Figure 9] Figure 9 is a side cross-sectional view of the imaging device according to Example 6. [Figure 10] Figure 10 is a side cross-sectional view of the imaging device according to Example 7. [Modes for carrying out the invention] [Examples]

[0006] <Appearance of the imaging device> Figure 1 is a perspective view of the imaging device according to Embodiment 1. In Figure 1, (A) is a front perspective view and (B) is a rear perspective view. The imaging device 100 has a housing 101. The housing 101 has a front panel 101A, a rear panel 101B, a bottom panel 101C, a top panel 101D, a left side panel 101E, and a right side panel 101F.

[0007] A wide-angle lens 102A is provided on the front panel 101A. A wide-angle lens 102B is provided on the rear panel 101B. An air intake port 104 is provided on the left side panel 101E. An exhaust port 105 is provided on the right side panel 101F. The air intake port 104 and the exhaust port 105 are provided with, for example, mesh-like or linear slits, through which air passes. The air intake port 104 and the exhaust port 105 are configured to communicate in the X-axis direction inside the housing 101.

[0008] The wide-angle lens 102A is mounted on the housing 101 so as to be exposed from the housing 101. The wide-angle lens 102A receives light from outside the housing 101 and emits it to the image sensor. The wide-angle lens 102B is mounted on the housing 101 so as to be exposed from the housing 101 in the opposite direction to the direction in which the wide-angle lens 102A is exposed. The wide-angle lens 102B receives light from outside the housing 101 and emits it to the image sensor.

[0009] The optical axis of wide-angle lens 102A and the optical axis of wide-angle lens 102B coincide. At least one of the wide-angle lenses 102A and 102B has a field of view of 180 degrees or more. The imaging device 100 arranges two image sensors facing opposite directions and places wide-angle lenses 102A and 102B in front of each image sensor to image the subject with a solid angle of 4π steradians.

[0010] By combining the image data obtained from the two image sensors, a full-sphere image (an image within a solid angle of 4π steradians) is generated. Note that if the wide-angle lenses 102A and 102B do not require a solid angle of 4π steradians to be used to capture the subject, both lenses may have a field of view of less than 180 degrees.

[0011] Here, the coordinate axis 110 of Example 1 will be described. In the coordinate axis 110, the optical axis of the wide-angle lenses 102A and 102B is defined as Z, the direction from optical axis Z and 102B to wide-angle lens 102A is defined as the +Z direction, and the direction from optical axis Z and 102A to wide-angle lens 102B is defined as the -Z direction. In addition, the two axes perpendicular to the optical axis Z are defined as X and Y, respectively.

[0012] Axis X is the alignment direction of the left side panel 101E and the right side panel 101F. The direction from the left side panel 101E to the right side panel 101F is defined as the +X direction, and the direction from the right side panel 101F to the left side panel 101E is defined as the -X direction. The +X direction indicates the intake and exhaust direction. Axis Y is the alignment direction of the bottom panel 101C and the top panel 101D. The direction from the bottom panel 101C to the top panel 101D is defined as the +Y direction, and the direction from the top panel 101D to the bottom panel 101C is defined as the -Y direction.

[0013] Furthermore, in this embodiment, in reference numerals such as wide-angle lenses 102A and 102B, where "A" and "B" are appended to the end, the reference numeral ending in "A" indicates a component located on the front side of the imaging device 100, and the reference numeral ending in "B" indicates a component located on the rear side of the imaging device 100. Note that if "A" (front side) and "B" (rear side) are not distinguished, "A" and "B" are omitted. For example, if wide-angle lenses 102A and 102B are not distinguished, they are simply referred to as "wide-angle lens 102".

[0014] <Side cross-sectional view of imaging device 100> Figure 2 is a side cross-sectional view 1 of the imaging device 100 according to Embodiment 1. The imaging device 100 includes lens barrels 201A, 201B, image sensors 202A, 202B, first heat sinks 203-1A, 203-1B, second heat sinks 203-2A, 203-2B, flexible wiring boards 204A, 204B, first heat dissipation sheets 205-1A, 205-1B, second heat dissipation sheets 205-2A, 205-2B, heat diffusion members 206A, 206B, circuit boards 207A, 207B, processors 208A, 208B, third heat sinks 209A, 209B, ventilation holes 210, and a cooling fan 211.

[0015] The image sensor 202, circuit board 207, and processor 208 are heat sources. The processor 208 generates more heat than the image sensor 202. The lens barrel 201 holds the wide-angle lens 102. The image sensor 202 receives subject light from the wide-angle lens 102, converts it into an electrical signal, and outputs it to the circuit board 207 and processor 208 via the flexible wiring board 204.

[0016] The first heat sink 203-1 is a heat conductive member that absorbs heat from the first heat dissipation sheet 205-1 and dissipates it to the housing 101. Alternatively, the first heat sink 203-1 may be exposed from the front panel 101A. This improves cooling efficiency because the air inside the housing 101 is directly discharged from the first heat sink 203-1 to the outside of the imaging device 100. The path through which heat is transferred from the image sensor 202 to the first heat sink 203-1 is called the heat conduction path.

[0017] The second heat sink 203-2 is a heat conduction member that absorbs heat from the second heat dissipation sheet 205-2 and dissipates heat to the housing 101. The second heat sink 203-2 may be exposed from the front panel portion 101A. Thereby, since the air inside the housing 101 is directly discharged from the second heat sink 203-2 to the outside of the imaging device 100, the cooling efficiency is improved. The path through which heat is transferred from the imaging element 202 to the second heat sink 203-2 is referred to as a heat conduction path.

[0018] The flexible printed wiring board 204 is a flexible printed wiring board that outputs an output signal from the imaging element 202 to the circuit board 207 and the processor 208. The flexible printed wiring board 204 is routed between the imaging element 202 and the circuit board 207, bypassing the heat diffusion member 206, and is routed between the -X side end of the heat diffusion member 206 and the inner surface of the right side panel portion 101F.

[0019] The first heat dissipation sheet 205-1 is a heat conduction member that absorbs heat from the imaging element 202 via the flexible printed wiring board 204 and dissipates heat to the first heat sink 203-1. The second heat dissipation sheet 205-2 is a heat conduction member that absorbs heat from the imaging element 202 and dissipates heat to the second heat sink 203-2.

[0020] The heat diffusion member 206 does not prevent heat from transferring from one side of the insulating member to the other side, as an insulating member does, but rather diffuses heat from the circuit board 207 and processor 208 into the interior of the heat diffusion member 206. The heat diffusion member 206 is made of, for example, stainless steel (or copper, aluminum, etc.). The heat diffusion member 206 is, for example, a plate-shaped member that intersects (preferably orthogonal to) the Z-axis, i.e., the alignment direction of the image sensor 202 and processor 208. One end of the heat diffusion member 206 is supported on the inner surface of the left side panel 101E, and the other end is supported together with the flexible wiring board 204 on the inner surface of the right side panel 101F. The heat diffusion member 206 preferably has a thermal conductivity of 10 [W / mK] (W: watt, m: meter, K: Kelvin) or more. Since the thermal conductivity of stainless steel is generally 15 to 20 [W / mK], it is preferable for the heat diffusion member to have a thermal conductivity of 15 [W / mK] or more.

[0021] The heat diffusion member 206 diffuses heat within its interior in the planar direction of the heat diffusion member 206, i.e., in the XY plane direction (indicated by the thick white arrow in Figure 2). This direction is referred to as the heat diffusion direction. The heat diffusion member 206 is sandwiched in its center between the first heat sink 203-1, the second heat sink 203-2, the first heat dissipation sheet 205-1 and the second heat dissipation sheet 205-2, and the circuit board 207. Therefore, the heat diffusion direction is the direction away from these heat conducting members.

[0022] In a 360-degree imaging device like the imaging device 100, heat tends to accumulate near the heat source (image sensor 202, circuit board 207, and processor 208) near the Z-axis. By making the heat diffusion member 206 a plate-shaped member that extends in the XY plane, heat does not accumulate near the heat source (image sensor 202, circuit board 207, and processor 208) near the Z-axis. Therefore, the more heat is diffused inside the heat diffusion member 206, the smaller the heat distribution in the middle of the heat diffusion member 206 facing the heat source, and the larger the heat distribution at both ends in the X direction that do not face the heat source. This suppresses the temperature rise of the heat source.

[0023] The heat diffusion member 206A divides the internal space on the front side of the housing 101, extending in the +Z direction from the ventilation hole 210, into a first internal space 221A and a second internal space 222A. Similarly, the heat diffusion member 206B divides the internal space on the front side of the housing 101, extending in the -Z direction from the ventilation hole 210, into a first internal space 221B and a second internal space 222B.

[0024] As a result, even if the heat generated from the image sensor 202 is transferred from the first internal space 221 to the heat diffusion member 206, it is diffused within the heat diffusion member 206, thereby suppressing heat transfer to the second internal space 222. Similarly, even if the heat generated from the processor 208 and the circuit board 207 is transferred from the second internal space 222 to the heat diffusion member 206, it is diffused within the heat diffusion member 206, thereby suppressing heat transfer to the first internal space 221.

[0025] The circuit board 207 is a thermal conductive material on which the processor 208 and other circuits, memory, wiring, and terminals (not shown) are mounted and which connects to the flexible wiring board 204. The processor 208 is an image processing circuit that performs image processing based on the output signal from the image sensor 202 and generates image data.

[0026] The third heatsink 209 contacts the processor 208, absorbs heat from the processor 208, and dissipates heat through the ventilation holes 210. The third heatsink 209 is, for example, a plate-shaped member that intersects (preferably perpendicular to) the Z-axis. Together with the inner surface of the housing 101 and the heat diffusion member 206, the third heatsink 209 forms the second internal space 222.

[0027] The ventilation hole 210 is a space having an intake port 104 and an exhaust port 105. The ventilation hole 210 is partitioned in the Z direction by the third heat sink 209. Air from the intake port 104 is heated inside the ventilation hole 210 by the heat from the third heat sink 209 and discharged from the exhaust port 105. In Figure 2, the ventilation hole 210 is located in the X direction, but it may also be located in the Z direction.

[0028] The cooling fan 211 is installed inside the vent 210 and cools the inside of the vent 210. The rotation axis of the cooling fan 211 is parallel to the Z axis. The cooling fan 211 has intake ports 212A and 212B and exhaust port 212F. Intake ports 212A and 212B each face the third heat sink 209. Exhaust port 212D is directed towards the exhaust port 105 of the housing 101. Therefore, the cooling fan 211 draws in air from inside the vent 210 through intake ports 212A and 212B and exhausts it through exhaust ports 212F and 105.

[0029] In Figure 2, a cross-section in the XZ plane is shown, but the heat diffusion member 206 does not extend across the XZ plane. This allows for a reduction in the weight of the imaging device 100. Alternatively, the heat diffusion member 206 may extend across the XZ plane. This would increase the area of ​​the heat diffusion member 206, thereby improving the heat diffusion efficiency.

[0030] In Figure 2, a cross-section in the XZ plane is shown, but the third heat sink 209 does not extend across the XZ plane. This allows for a reduction in the weight of the imaging device 100. Alternatively, the third heat sink 209 may extend across the XZ plane. This would improve the air cooling efficiency inside the ventilation hole 210.

[0031] Figure 3 is a side cross-sectional view 2 of the imaging device 100 according to Embodiment 1. In Figure 3, the ends of the heat diffusion member 206 that do not face the circuit board 207 are thicker in the Z direction than the middle section that faces the circuit board 207. In this way, by increasing the thickness of the heat diffusion member 206 in the Z direction as it moves away from the circuit board 207, the heat distribution in the middle section that faces the circuit board 207 is reduced, and the heat distribution at the ends in the X direction that do not face the circuit board 207 is increased. Therefore, the temperature rise of the circuit board 207 is suppressed.

[0032] In this way, the imaging device 100 can dissipate heat from the vicinity of the circuit board 207 so as to move it away from the circuit board 207. This suppresses the temperature rise of the circuit board 207 and reduces noise generation. [Examples]

[0033] Example 2 describes an imaging device with a different structure from the imaging device 100 of Example 1. Components identical to those in Example 1 are denoted by the same reference numerals, and their descriptions are omitted.

[0034] Figure 4 is an explanatory diagram showing an imaging device according to Embodiment 2. In Figure 4, (A) is a perspective view of the imaging device 400 according to Embodiment 2, and (B) is a side cross-sectional view of the imaging device 400. The imaging device 400 has a housing 401. The housing 401 has a front panel 401A, a rear panel 401B, a bottom panel 401C, a top panel 401D, a left side panel 401E, and a right side panel 401F.

[0035] A wide-angle lens 102A is provided on the front panel 401A. A wide-angle lens 102B is provided on the rear panel 401B. An air intake port 401Ea is provided on the left side panel 401E. An air intake port 401Fa is provided on the right side panel 401F. The air intake ports 401Ea and 401Fa are provided with, for example, mesh-like or linear slits, through which air passes. The air intake ports 401Ea and 401Fa are configured to communicate in the X-axis direction inside the housing 401.

[0036] The fourth heatsink 403 is provided in contact with the inner surface of the top plate portion 401D. The fourth heatsink 403 is supported by the third heat dissipation sheet 405. The fourth heatsink 403 absorbs heat from the third heat dissipation sheet 405 and dissipates it to the housing 401. Alternatively, the fourth heatsink 403 may be exposed from the top plate portion 401D. This improves cooling efficiency because the air inside the housing 401 is directly discharged from the fourth heatsink 403 to the outside of the imaging device 100.

[0037] The flexible wiring board 404 is a flexible printed circuit board that outputs the output signal from the image sensor 202 to the circuit board 207 and the processor 208. The +Y side end of the flexible wiring board 404 is connected to the fourth heat sink 403. The middle part of the flexible wiring board 404 is sandwiched between the image sensor 202 and the third heat dissipation sheet 405. The -Y side end of the flexible wiring board 404 is connected to the circuit board 207, bypassing the heat diffusion member 406.

[0038] The third heat dissipation sheet 405 is in contact with the fourth heat sink 403 and the flexible wiring board 404. The third heat dissipation sheet 405 absorbs heat from the image sensor 202 via the flexible wiring board 404 and dissipates it to the fourth heat sink 403. The third heat dissipation sheet 405 is, for example, a copper tape.

[0039] The heat diffusion member 406, like the heat diffusion member 206, diffuses heat from the circuit board 207 and the processor 208 into its interior. The heat diffusion member 406 is made of, for example, stainless steel. The heat diffusion member 406 is, for example, a plate-shaped member that intersects (preferably orthogonal to) the Y-axis, i.e., the direction of the arrangement of the image sensor 202 and the processor 208, and is supported inside the housing 401.

[0040] The heat diffusion member 406 diffuses heat from the image sensor, the circuit board 407, and the processor 208 within the XZ plane. This direction is referred to as the heat diffusion direction. Since the heat diffusion member 406 is sandwiched in its center by the heat sources, the processor 208, the circuit board 407, and the image sensor 202, the heat diffusion direction is away from the heat sources.

[0041] In a 360-degree spherical imaging device like the imaging device 400, heat tends to accumulate near the image sensor 202, especially near the Z-axis. By making the heat diffusion member 206 a plate-shaped member that extends in the XZ plane, heat does not accumulate near the heat source (image sensor 202), which is near the Z-axis. Therefore, the more heat is diffused within the heat diffusion member 406, the smaller the heat distribution in the middle of the heat diffusion member 406 that is facing the heat source, and the larger the heat distribution at both ends in the Z direction that are not facing the heat source. Consequently, the temperature rise of the heat source is suppressed.

[0042] The heat diffusion member 406 divides the inside of the housing 401 into a third internal space 421 and a fourth internal space 422. As a result, even if heat generated from the image sensor 202 is transferred from the third internal space 421 to the heat diffusion member 406, it is diffused inside the heat diffusion member 406, thereby suppressing heat transfer to the fourth internal space 422. Similarly, even if heat generated from the processor 208 and the circuit board 407 is transferred from the fourth internal space 422 to the heat diffusion member 406, it is diffused inside the heat diffusion member 406, thereby suppressing heat transfer to the third internal space 421.

[0043] The circuit board 407 mounts the processor 208 and other circuits, memory, wiring, and terminals (not shown) and connects to the flexible wiring board 404. The circuit board 407 extends in the Y-axis direction.

[0044] The fifth heatsink 409 has a ventilation hole 410 inside. The fifth heatsink 409 connects the intake port 401Ea and the intake port 401Fa through the ventilation hole 410. The fifth heatsink 409 is in contact with the processor 208 and absorbs heat from the processor 208 and dissipates it through the ventilation hole 410. The fifth heatsink 409 has a cooling fan 411 inside the ventilation hole 410.

[0045] The cooling fan 411 draws in air from the intake port 401Ea. The drawn-in air is heated by the heat released into the vent 410. The cooling fan 411 then discharges this heated air from the intake port 401Fa. The fifth heatsink 409 and the cooling fan 411 function as a heat diffusion unit that dissipates heat from inside the housing 401 to the outside of the housing 401.

[0046] Thus, even with an internal structure like that of the imaging device 400 in Example 2, heat near the circuit board 407 and processor 208 can be diffused away from the circuit board 407 and processor 208. This suppresses the temperature rise of the circuit board 407 and processor 208, thereby reducing noise generation. [Examples]

[0047] Example 3 is a modified shape of the fifth heat sink 409 in Example 2. Components identical to those in Example 1 and Example 2 are denoted by the same reference numerals, and their descriptions are omitted.

[0048] Figure 5 is a side cross-sectional view of the imaging device according to Embodiment 3. (A) shows a first modified shape of the fifth heat sink 409, and (B) shows a second modified shape of the fifth heat sink 409.

[0049] In (A), the imaging device 500a has fifth heat sinks 509A and 509B. The fifth heat sinks 509A and 509B are comb-shaped heat sinks. Each comb tooth of the fifth heat sinks 509A and 509B is arranged in a nested manner with respect to each other. At least a portion of the fifth heat sinks 509A and 509B is positioned to be exposed from the air intake ports 401Ea and 401Fa.

[0050] In (B), the imaging device 500b has fifth heat sinks 519A and 519B which are comb-shaped heat sinks. The comb teeth protrude in the Z-axis direction and extend in the X-axis direction. The comb teeth of the fifth heat sink 519A are located on the portion of the fifth heat sink 519B that does not have comb teeth, and the comb teeth of the fifth heat sink 519B are located on the portion of the fifth heat sink 519A that does not have comb teeth. At least a portion of the fifth heat sinks 519A and 519B are located to be exposed from the intake ports 401Ea and 401Fa.

[0051] Because the fifth heatsinks 509 and 519 have a comb-like shape, they have a larger surface area compared to the third heatsink 209 of Example 1 and the fifth heatsink 409 of Example 2. Therefore, heat dissipation efficiency is improved. In addition, since cooling fans 211 and 411 are not required, costs, weight reduction, and power saving can be achieved. Furthermore, the comb teeth of the fifth heatsink 519A are positioned in the areas of the fifth heatsink 519B that do not have comb teeth, and the comb teeth of the fifth heatsink 519B are positioned in the areas of the fifth heatsink 519A that do not have comb teeth. Therefore, the thickness in the Z-axis direction can be reduced. [Examples]

[0052] Example 4 is a modified shape of the fifth heatsink 409 in Example 2. Components identical to those in Examples 1 to 3 are denoted by the same reference numerals, and their descriptions are omitted.

[0053] Figure 6 is a side cross-sectional view of the imaging device according to Embodiment 3. (A) shows a first modified shape of the fifth heat sink 409, and (B) shows a second modified shape of the fifth heat sink 409.

[0054] In (A), the imaging device 600a has a fifth heat sink 609. The fifth heat sink 609 has an elongated shape in the Y-axis direction and has a through hole 610 in the Y-axis direction. The -Y side end of the fifth heat sink 609 has an air intake port 610a and is in contact with the inner surface of the bottom plate portion 401C.

[0055] The +Y side end has an exhaust port 610b and is spaced apart from the heat diffusion member 206. The bottom plate portion 401C is provided with an intake port 401Ca, which communicates with the intake port 610a of the through hole 610. The back plate portion 401B is provided with a cooling fan 611. The cooling fan 611 discharges the air in the fourth internal space 422 to the outside of the imaging device 600a.

[0056] Air from intake ports 401Ca and 610a passes through the through-hole 610, is heated in the fifth heatsink 609 which has absorbed heat from the processor 208, and is discharged from exhaust port 610b. The discharged air is drawn in by the cooling fan 611 and discharged outside the imaging device 600a.

[0057] The imaging device 600b in (B) differs from the imaging device 600a in the position of the cooling fan 611 and in the presence of an air intake port 401Aa and an exhaust port 401Ba. In the imaging device 600b, the cooling fan 611 is located at the -Y side end of the fifth heat sink 609 and is exposed from the bottom plate portion 401C. The air intake port 401Aa is located on the front plate portion 401A, and the exhaust port 401Ba is located on the rear plate portion 401B.

[0058] Air drawn in from outside the imaging device 600b by the cooling fan 611 is heated in the fifth heat sink 609 through the through hole 610 and discharged from the exhaust port 610b. The discharged air is then discharged outside the imaging device 600a through the exhaust port 401Ba along the heat diffusion member 206.

[0059] Figure 7 is a perspective view showing an example of the routing of the flexible wiring board 704 within the imaging devices 600a and 600b. The flexible wiring board 704, like the flexible wiring board 404, is a flexible printed circuit board that outputs the output signal from the image sensor 202 to the circuit board 207 and the processor 208. The flexible wiring board 704 has one end 202a, a first intermediate section 202b, a second intermediate section 202c, and the other end 202d.

[0060] One end 704a extends in the -Y direction, as in Figure 4, and is sandwiched between the image sensor 202 and the third heat dissipation sheet 405, connecting to the image sensor 202. The first intermediate section 704b is bent from the one end 704a, extends in the -X direction, and is placed on the heat diffusion member 206. The second intermediate section 704c is bent from the first intermediate section 704b and extends in the -Y direction. The other end 704d is bent from the second intermediate section 704c, extends in the +X direction, and is connected to the circuit board 407. In this way, the flexible wiring board 704 can be routed between the third internal space 421 and the fourth internal space 422 without obstructing the exhaust path in the Z-axis direction. [Examples]

[0061] Example 5 is a modified example of the intake and exhaust path in Example 4. Components identical to those in Examples 1 to 4 are denoted by the same reference numerals, and their descriptions are omitted.

[0062] Figure 8 is a side cross-sectional view of the imaging device according to Embodiment 5. (A) shows the imaging device 800a with a two-intake, two-exhaust structure. The imaging device 800a has a first intake port 401Aa in the front plate portion 401A. The first intake port 401Aa communicates with the third internal space 421. The imaging device 800a has a second intake port 401Ca in the bottom plate portion 401C. The second intake port 401Ca communicates with the intake port 610a of the fifth heat sink 609.

[0063] The imaging device 800a has a first cooling fan 811 and a second cooling fan 812 on the back plate portion 401B. The first cooling fan 811 is arranged to communicate with the third internal space 421. The second cooling fan 812 is arranged to communicate with the fourth internal space 422.

[0064] The imaging device 800a has a fourth heat sink 803 in the third internal space 421. The fourth heat sink 803 is connected to the third heat dissipation sheet 405 and absorbs heat from the image sensor 202. Air from the first air intake 401Aa is heated by the fourth heat sink 803 and discharged outside the imaging device 800a by the first cooling fan 811.

[0065] This intake and exhaust flow is designated as the first intake and exhaust path. Additionally, air from the intake ports 401Ca and 610a passes through the through-hole 610, is heated by the fifth heatsink 609 (which absorbs heat from the processor 208), and is then discharged outside the imaging device 800a by the second cooling fan 812. This intake and exhaust flow is designated as the second intake and exhaust path.

[0066] The imaging device 800a uses a processor 208 to independently control the first cooling fan 811 corresponding to the third internal space 421 and the second cooling fan 812 corresponding to the fourth internal space 422. For example, the intake and exhaust force of the first cooling fan 811 can be made greater than that of the second cooling fan 812, or the intake and exhaust force of the second cooling fan 812 can be made greater than that of the first cooling fan 811. Therefore, the intake and exhaust forces of the first cooling fan 811 and the second cooling fan 812 can be adjusted for each intake and exhaust path according to the heat source.

[0067] (B) shows an imaging device 800b with a two-intake, one-exhaust structure. The differences from the imaging device 800a in (A) will be explained below. The imaging device 800b has a third cooling fan 813 on the back plate portion 401B. The third cooling fan 813 is arranged to communicate with the third internal space 421 and the fourth internal space 422.

[0068] Air from the first intake port 401Aa is heated by the fourth heat sink 803 and discharged outside the imaging device 800a by the third cooling fan 813. This intake and exhaust flow is the first intake and exhaust path. Air from the intake ports 401Ca and 610a passes through the through hole 610, is heated by the fifth heat sink 609 which has absorbed heat from the processor 208, and discharged outside the imaging device 800a by the third cooling fan 813. This intake and exhaust flow is the second intake and exhaust path.

[0069] The imaging device 800a controls the third cooling fan 813 via the processor 208. Therefore, the third internal space 421 and the fourth internal space 422 can be cooled simultaneously, improving the control efficiency of the cooling fan and reducing costs and weight by reducing the number of parts. [Examples]

[0070] Example 6 is a modified version of the internal structure in Example 2. Components identical to those in Examples 1 and 2 are denoted by the same reference numerals, and their descriptions are omitted.

[0071] Figure 9 is a side cross-sectional view of the imaging device according to Embodiment 6. Unlike the imaging device 400 of Embodiment 2, the imaging device 900 does not have a heat diffusion member 206. Therefore, the inside of the housing 401 is not divided into a third internal space 421 and a fourth internal space 422, as in the imaging device 400.

[0072] Instead, the imaging device 800a has a first air intake port 401Aa on its front panel 401A. The first air intake port 401Aa communicates with the inside of the housing 401. The imaging device 900 has a cooling fan 911 on its rear panel 401B. The cooling fan 911 is positioned to communicate with the inside of the housing 401.

[0073] The air from the first air intake port 401Aa is heated by the heat dissipation from the fourth heat sink 403 and the fifth heat sink 409, and is discharged outside the imaging device 800a by the cooling fan 911. The first air intake port 401Aa and the cooling fan 911 function as heat diffusion units that dissipate heat from inside the housing 401 to the outside of the housing 401.

[0074] Thus, the imaging device 900 has an intake and exhaust path in the X-axis direction and an intake and exhaust path in the Z-axis direction, both provided by the cooling fan 411. The imaging device 900 controls the cooling fan 411 and the cooling fan 911 independently using the processor 208. For example, the intake and exhaust force of the cooling fan 411 can be made greater than that of the cooling fan 911, or the intake and exhaust force of the cooling fan 911 can be made greater than that of the cooling fan 411. Therefore, the intake and exhaust forces of the cooling fans 411 and 911 can be adjusted for each intake and exhaust path according to the heat source.

[0075] Furthermore, the air heated by the heat from the fifth heat sink 409 rises towards the image sensor 202. Therefore, by providing an intake and exhaust path in the X-axis direction by the cooling fan 411 between the image sensor 202 and the fifth heat sink 409, the air heated by the heat from the fifth heat sink 409 is suppressed from being sent to the image sensor 202, and the cooling fan 911 can exhaust it through the intake and exhaust path in the Z-axis direction. In addition, since the heat diffusion member 206 is unnecessary, the number of parts can be reduced and costs can be lowered accordingly. [Examples]

[0076] Example 7 is a modified version of the imaging devices 600a and 600b of Example 4. Components identical to those in Examples 1 to 4 are denoted by the same reference numerals, and their descriptions are omitted.

[0077] Figure 10 is a side cross-sectional view of the imaging device according to Embodiment 7. Unlike the imaging devices 600a and 600b of Embodiment 4, the imaging device 1000 does not have a heat diffusion member 206. Instead, the imaging device 800a has a cooling fan 1010 in the position where the heat diffusion member 206 was provided in the imaging devices 600a and 600b of Embodiment 4. Therefore, the inside of the housing 401 is divided into a third internal space 421 and a fourth internal space 422 by the cooling fan 1010.

[0078] The cooling fan 1010 has a first intake port 1011a, a second intake port 1011b, and an exhaust port 1011c. The cooling fan 1010 draws in air from the first intake port 1011a and the second intake port 1011b, and exhausts it to the outside of the imaging device 1000 through the exhaust port 1011c.

[0079] The first air intake port 1011a faces the fourth heat sink 803, which absorbs heat from the image sensor 202. Air from the air intake port 401Aa of the front panel 401A is heated by the fourth heat sink 803, and this heated air is drawn in through the first air intake port 1011a and discharged outside the imaging device 1000 through the exhaust port 1011c. This intake and exhaust flow is referred to as the first intake and exhaust path.

[0080] The second intake port 1011b faces the exhaust port 610b of the fifth heat sink 609, which absorbs heat from the processor 208. Air from the exhaust port 610b and the air in the fourth internal space 422 are drawn in through the second intake port 1011b and discharged outside the imaging device 1000 through the exhaust port 1011c. This intake and exhaust flow is referred to as the second intake and exhaust path.

[0081] The exhaust port 1011c communicates with the exhaust port 401Ba of the back panel 401B. Air drawn in from the first intake port 1011a and the second intake port 1011b is discharged outside the imaging device 1000 from the exhaust ports 1011c and 401Ba.

[0082] Thus, the imaging device 1000 divides the inside of the housing 401 into a third internal space 421 and a fourth internal space 422 using a cooling fan 1010 with intake on both sides. The cooling fan 1010 exhausts air in the Z-axis direction, away from the circuit board 407 and the processor 208, and functions as a heat diffusion unit that diffuses heat in the heat diffusion direction. Therefore, there is no need to provide stainless steel as a heat diffusion member 206, which reduces the number of parts and thus lowers costs.

[0083] Furthermore, since the fourth heatsink 803 is close to the first air intake port 1011a and the exhaust port 610b of the fifth heatsink 609 is close to the second air intake port 1011b, cooling efficiency can be improved.

[0084] It should be noted that the present invention is not limited to the above, and may be combined in any way. Furthermore, other embodiments that can be conceivable within the scope of the technical idea of ​​the present invention are also included in the scope of the present invention. [Explanation of Symbols]

[0085] 100 Imaging device, 101 Housing, 102 Wide-angle lens, 104 Intake port, 105 Exhaust port, 201 Lens barrel, 202 Image sensor, 203 Heat sink, 204 Flexible wiring board, 205 Heat dissipation sheet, 206 Heat diffusion material, 207 Circuit board, 208 Processor, 209 Heat sink, 210 Ventilation holes, 211 Cooling fan, 221 First internal space, 222 Second internal space, 400 Imaging device, 401 Housing, 403 Heat sink, 404 Flexible wiring board, 405 Heat dissipation sheet, 406 Heat diffusion material, 407 Circuit board, 408 Processor, 409 Heat sink, 410 Ventilation holes, 411 Cooling fan, 421 Third internal space, 422 Fourth internal space, 500a Imaging device, 500b Imaging device, 509 Heat sink, 600a, 600b Imaging device, 609 Heat sink, 610 Through hole, 611 Cooling fan, 704 Flexible wiring board, 800a Imaging device, 800b Imaging device, 803 Heat sink, 811 Cooling fan, 812 Cooling fan, 813 Cooling fan, 900 Imaging device, 911 Cooling fan, 1000 Imaging device, 1010 Cooling fan

Claims

1. First image sensor and A first heat conduction unit that conducts heat generated by the first image sensor, A first image processing circuit that processes first image data based on the output from the first image sensor, A second heat conduction unit that conducts heat generated in the first image processing circuit, A third heat conduction section is provided between the first heat conduction section and the second heat conduction section, The device comprises a cooling fan that expels air heated by the heat conducted to the second heat conduction section to the outside of the housing, The first heat conduction unit is positioned relative to the first image sensor in a direction intersecting the direction in which light is incident on the first image sensor, and dissipates the heat generated by the first image sensor in a direction away from the third heat conduction unit. The third heat conduction unit diffuses the heat generated from the first image processing circuit within the third heat conduction unit. Imaging device.

2. The imaging device according to Claim 1, The direction in which the air is discharged to the cooling fan is in the same direction as the direction of heat diffusion by the third heat conduction section, in an imaging device.

3. An imaging device according to claim 1 or 2, The first image sensor and the third heat conduction unit are arranged at a distance from each other. An imaging device in which heat generated from the first image sensor is transferred to the third heat conduction unit.

4. An imaging device according to claim 1 or 2, The third heat conduction section is an imaging device supported by the housing.

5. The imaging device according to Claim 1, The first heat conduction unit dissipates heat to the front side of the housing of the imaging device.

6. An imaging device according to any one of claims 1 to 4, The second heat conduction part is a heat sink, in the imaging device.

Images