Electrical component modules and air conditioning systems
By separating circuits with noise sources and microcontrollers in electrical component modules, the module reduces microcontroller costs and maintains communication quality through optimized wire connections and arrangements.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- DAIKIN INDUSTRIES LTD
- Filing Date
- 2024-10-07
- Publication Date
- 2026-04-17
AI Technical Summary
The cost associated with microcomputers in electrical component modules with multiple substrates is high due to the need for microcomputers on each substrate for communication signal processing.
The electrical component module separates a first circuit with a noise source from a second circuit with a microcontroller, allowing simple signals to be transmitted without a microcontroller, and uses wires to connect them, with specific length and arrangement to minimize noise interference.
This configuration reduces the cost of microcomputers, suppresses noise interference, and maintains communication quality by omitting microcontrollers in certain circuits and optimizing wire length and arrangement.
Smart Images

Figure 2026066627000001_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to an electrical component module and an air conditioner including the same.
Background Art
[0002] An electrical component module having a plurality of divided substrates and transmitting and receiving communication signals between the substrates is known (see Patent Document 1). The electrical component module includes a microcomputer mounted on each of the plurality of substrates and a signal line connecting the microcomputers, and transmits and receives communication signals between the microcomputers via the signal line. The microcomputer demodulates a communication signal including information based on voltage and frequency according to a communication protocol.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] When transmitting and receiving communication signals between substrates, a microcomputer is required for each substrate. Therefore, in a conventional electrical component module having a plurality of substrates, the cost related to the microcomputer has increased.
[0005] An object of the present disclosure is to suppress the cost related to a microcomputer in an electrical component module having a plurality of divided substrates.
Means for Solving the Problems
[0006] (1) The electrical component module of the present disclosure includes a first substrate having a first circuit including a noise generation source, a second circuit including a microcomputer that transmits and receives communication signals with other circuits other than the first circuit, a second substrate separated from the first substrate, and an electric wire that transmits and receives simple signals between the first circuit and the second circuit.
[0007] In the electrical component module of this disclosure, the first circuit and the second circuit transmit and receive simple signals that do not require decoding processing based on a communication protocol, via wires without a microcontroller that performs decoding processing based on a communication protocol. Therefore, the first circuit does not require a microcontroller. Thus, the electrical component module of this disclosure can omit the microcontroller in the first circuit, and thus the cost related to the microcontroller can be reduced.
[0008] (2) In the electrical component module of the present disclosure, the microcontroller preferably controls the transmission and reception of the simple signal between the first circuit and the second circuit.
[0009] The electrical component module with the above configuration can omit the microcontroller in the first circuit, thus reducing the cost associated with the microcontroller.
[0010] (3) In the electrical component module of the present disclosure, the length of the wire is preferably 40 mm or more and 250 mm or less.
[0011] The electrical component module with the above configuration can suppress the influence of noise generated in the first circuit on the transmission and reception of communication signals in the second circuit by setting the length of the wires to 40 mm or more, and can suppress the deterioration of communication quality of simple signals and communication signals caused by the length of the wires by setting the length of the wires to 250 mm or less. As a result, the electrical component module of this disclosure can suppress the deterioration of communication quality for communication signals and simple signals.
[0012] (4) In an electrical component module according to any of the embodiments of (1) to (3) of the present disclosure, it is preferable that the first substrate and the second substrate are arranged on the same plane.
[0013] In the electrical component module with the above configuration, the length of the wires connecting the first and second circuits can be reduced by arranging the first and second circuit boards on the same plane. As a result, the electrical component module of this disclosure can suppress the deterioration of the communication quality of simple signals caused by the length of the wires.
[0014] (5) In an electrical component module according to any of the embodiments of (1) to (4) of the present disclosure, it is preferable that the first circuit includes a switching power supply circuit and the second circuit includes a high-frequency communication circuit.
[0015] The electrical component module with the above configuration can suppress the influence of noise generated in the switching power supply circuit on the transmission and reception of communication signals performed by the high-frequency communication circuit. As a result, the electrical component module of this disclosure can suppress the deterioration of the communication quality of communication signals.
[0016] (6) The electrical component module of any embodiment of (1) to (5) of the present disclosure preferably includes a plurality of the wires, wherein the plurality of wires are configured as a harness.
[0017] The electrical component module of this disclosure facilitates the connection of the first and second circuits by configuring multiple wires as a harness.
[0018] (7) In the electrical component module of the present disclosure, the harness preferably includes three or more and 22 or fewer wires.
[0019] The electrical component module of this disclosure, when having multiple signal lines, can facilitate the connection of the first circuit and the second circuit by configuring the multiple signal lines as a harness.
[0020] (8) In an electrical component module according to any of the embodiments of (1) to (7) of the present disclosure, it is preferable that the first circuit board does not have the microcontroller.
[0021] The electrical component module of the present disclosure can suppress the cost related to the microcomputer by omitting the microcomputer on the first substrate.
[0022] (9) The air conditioner of the present disclosure includes a first device having the electrical component module according to any one of the aspects (1) to (8) above, and a second device having the other circuit, and the first device and the second device are arranged separately.
[0023] The air conditioner of the present disclosure includes an electrical component module in a first device. In the electrical component module, the first circuit and the second circuit perform transmission and reception of simple signals that do not require decoding processing based on a communication protocol via an electric wire without passing through a microcomputer. Therefore, the first circuit does not require a microcomputer for performing decoding processing based on a communication protocol. Thus, the air conditioner of the present disclosure can omit the microcomputer of the first circuit in the first device, and can suppress the cost related to the microcomputer.
Brief Description of the Drawings
[0024] [Figure 1] FIG. 1 is a schematic diagram showing an air conditioner according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a schematic diagram showing an electrical component module according to an embodiment of the present disclosure. [Figure 3] FIG. 3 is a perspective schematic diagram showing the connection status of the first substrate and the second substrate by a harness. [Figure 4] FIG. 4 is a perspective schematic diagram showing the positional relationship between the first substrate and the second substrate in the electrical component module. [Figure 5] FIG. 5 is an explanatory diagram showing the relationship between the length of an electric wire and the communication quality of a communication signal.
Embodiments for Carrying Out the Invention
[0025] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.
[0026] [Regarding the overall configuration of the air conditioning system] Figure 1 is a schematic diagram showing an air conditioning system according to one embodiment of the present disclosure. Figure 1 shows an air conditioning system 100, which is one embodiment of the air conditioning system of the present disclosure. The air conditioning system 100 is an air conditioning system equipped with an electrical module 10, which is one embodiment of the electrical module of the present disclosure. The air conditioning system 100 shown in Figure 1 is a refrigeration cycle system that adjusts the temperature of the air in a target space to be air-conditioned to a predetermined target temperature. In this embodiment, the case in which the air conditioning system of the present disclosure is a refrigeration cycle system is illustrated as an example, but the air conditioning system of the present disclosure is not limited to a refrigeration cycle system and may be, for example, a ventilation system or the like.
[0027] As shown in Figure 1, the air conditioning system 100 comprises an indoor unit 101 installed indoors S1 and an outdoor unit 102 installed outdoors S2. The air conditioning system 100 includes a connecting pipe 103. The connecting pipe 103 circulates refrigerant between the indoor unit 101 and the outdoor unit 102. The air conditioning system 100 includes a compressor 110, a four-way switching valve 111, an outdoor heat exchanger 112, an outdoor expansion valve 113, an indoor heat exchanger 121, and a refrigerant circuit 105 including refrigerant piping connecting these. The refrigerant circuit 105 includes gas refrigerant piping 105G and liquid refrigerant piping 105L.
[0028] The indoor unit 101 is equipped with an indoor heat exchanger 121. The indoor heat exchanger 121 constitutes part of the refrigerant circuit 105. The indoor heat exchanger 121 is a cross-fin tube type or microchannel type heat exchanger and is used to exchange heat with the indoor air. The indoor unit 101 further includes an electrical module 10, which will be described later.
[0029] The indoor unit 101 is equipped with an indoor fan 122. The indoor fan 122 is configured to draw in indoor air into the indoor unit 101, perform heat exchange between the drawn-in air and the refrigerant in the indoor heat exchanger 121, and then blow the air back into the room. The indoor fan 122 is equipped with a motor 123 whose operating speed can be adjusted by inverter control.
[0030] The outdoor unit 101 includes a compressor 110, a four-way switching valve 111, an outdoor heat exchanger 112, and an outdoor expansion valve 113, etc. The compressor 110, the four-way switching valve 111, the outdoor heat exchanger 112, and the outdoor expansion valve 113 constitute part of the refrigerant circuit 105. The outdoor unit 101 further includes an outdoor unit control board 40, which will be described later.
[0031] The compressor 110 draws in low-pressure gaseous refrigerant and discharges high-pressure gaseous refrigerant. The compressor 110 is equipped with a motor 114 whose operating speed can be adjusted by inverter control.
[0032] The four-way switching valve 111 reverses the flow of refrigerant in the refrigerant circuit 105, switching the supply of refrigerant discharged from the compressor 110 to either the outdoor heat exchanger 112 or the indoor heat exchanger 121. This allows the air conditioning system 100 to switch between cooling and heating operations.
[0033] The outdoor heat exchanger 112 is, for example, a cross-fin tube type or microchannel type heat exchanger, and is used to exchange heat with the refrigerant using air as the heat source. The outdoor expansion valve 113 is composed of an electrically operated valve that can adjust the refrigerant flow rate, etc.
[0034] The outdoor unit 102 is equipped with an outdoor fan 115. The outdoor fan 115 is equipped with a motor 116 whose operating speed can be adjusted by inverter control. The outdoor fan 115 is configured to take in outdoor air S2 into the outdoor unit 102, perform heat exchange between the taken-in air and the refrigerant, and then blow the air out to the outside of the outdoor unit 102.
[0035] (Electrical component module) Figure 2 is a schematic diagram showing an electrical component module according to one embodiment of the present disclosure. As shown in Figures 1 and 2, the indoor unit 101 includes an electrical component module 10. The electrical component module 10 includes an indoor unit control board 20 that controls the operation of each part of the indoor unit 101. The indoor unit control board 20 has a function to control the operation of the indoor unit 101 and also has a communication function with the outdoor unit 102.
[0036] (Indoor unit control board) As shown in Figure 2, the indoor unit control board 20 includes a first board 21 and a second board 22. In other words, the indoor unit control board 20 is divided into multiple boards (first board 21 and second board 22). In the electrical component module 10, the first board 21 and the second board 22 are separated.
[0037] The first circuit board 21 is equipped with a first circuit 31, and the second circuit board 22 is equipped with a second circuit 32. In the electrical component module 10 of this disclosure, the first circuit 31 has a power control function for the power supplied to the indoor unit 101 and includes a switching power supply circuit 33. The switching power supply circuit 33 is connected to an external AC power supply 130 via the outdoor unit 102 and connecting wiring 60, etc. The switching power supply circuit 33 converts AC to DC and adjusts the output voltage, supplying power to the first circuit 31 and the second circuit 32. In the electrical component module 10, the switching power supply circuit 33 is a source of noise.
[0038] The indoor unit control board 20 may further include circuits other than the first circuit 31 and the second circuit 32. The first board 21 may further include, for example, an inverter power control circuit (not shown) that controls the operation of the motor 123 for the indoor fan 122. In the electrical component module 10, the inverter power control circuit is a source of noise. In this disclosure, the case in which the indoor unit control board 20 is divided into multiple boards (first board 21 and second board 22) for the electrical component module 10 provided in the indoor unit 101 is illustrated, but the electrical component module in this disclosure may also be an electrical component module provided in the outdoor unit 102, in which case the outdoor unit control board 40 is divided into multiple boards.
[0039] In the electrical component module 10 of this disclosure, the second circuit 32 includes a high-frequency communication circuit 34 that performs communication between the indoor unit 101 and the outdoor unit 102. The high-frequency communication circuit 34 enables the transmission and reception of signals at a communication speed of Mbps or higher. The high-frequency communication circuit 34 has a faster communication speed than conventional communication circuits that were common to the past and transmitted and received signals at a communication speed of kbps or lower. In the following description, the signal transmitted and received by the high-frequency communication circuit 34 will be referred to as the communication signal CS. The communication signal CS is a signal that contains information such as voltage and frequency, and is a signal that can be de-noised (error corrected) by demodulation processing based on a communication protocol. The communication signal CS can transmit and receive information with just two lines (signal line and reference line). The communication signal CS is a signal that requires modulation and demodulation processing by program. For this reason, a microcontroller is required on both the transmitting and receiving sides for the transmission and reception of the communication signal CS.
[0040] Thus, in the electrical component module 10 of this disclosure, the first circuit 31 includes a switching power supply circuit 33, and the second circuit 32 includes a high-frequency communication circuit 34. The second board 22 (second circuit 32), which includes the high-frequency communication circuit 34, is separated from the first board 21 (first circuit 31), which includes the switching power supply circuit 33. Therefore, the electrical component module 10 can suppress the influence of noise emitted from the switching power supply circuit 33 on the transmission and reception of the communication signal CS performed by the high-frequency communication circuit 34.
[0041] In the electrical component module 10 of this disclosure, the high-frequency communication circuit 34 includes a microcontroller 35. The microcontroller 35 performs demodulation processing based on a communication protocol when transmitting and receiving the communication signal CS. The high-frequency communication circuit 34 transmits and receives the communication signal CS to and from the outdoor unit control board 40 of the outdoor unit 102 via the microcontroller 35.
[0042] (Outdoor unit control board) The outdoor unit control board 40 is a control board that controls the operation of each part of the outdoor unit 102. The outdoor unit control board 40 includes a control circuit (other circuits) 41. The control circuit 41 includes a high-frequency communication circuit 42 and an inverter power supply control circuit 43. The high-frequency communication circuit 42 includes a microcontroller 45. The high-frequency communication circuit 42 transmits and receives communication signals CS with the high-frequency communication circuit 34 of the second board 22 via the microcontroller 45 and the connecting wiring 60. The inverter power supply control circuit 43 controls the rotational speed of the motor 114 of the compressor 110 and the rotational speed of the motor 116 of the outdoor fan 115 of the outdoor unit 102.
[0043] The indoor unit control board 20 and the outdoor unit control board 40 are electrically connected by a connecting wire 60. The high-frequency communication circuit 34 on the indoor unit control board 20 side and the high-frequency communication circuit 42 on the outdoor unit control board 40 side transmit and receive communication signals CS via microcontrollers 35 and 45.
[0044] As shown in Figure 2, in the electrical component module 10 of this disclosure, the first circuit board 21 and the second circuit board 22 are electrically connected by an electric wire 51. The electric wire 51 electrically connects the first circuit 31 and the second circuit 32. The first circuit 31 and the second circuit 32 transmit and receive signals via the electric wire 51. In the following description, the signals transmitted and received between the first circuit 31 and the second circuit 32 are referred to as simple signals SS. Simple signals SS are analog voltage signals that contain only voltage information and do not require demodulation processing based on a communication protocol. Therefore, a microcontroller is not required for transmitting and receiving simple signals SS. For transmitting and receiving simple signals SS, an electric wire 51 is required for each signal that needs to be transmitted and received. Simple signals SS are susceptible to noise because noise removal (error correction) by demodulation processing is not possible.
[0045] As shown in Figure 2, in the electrical component module 10 of this disclosure, the first board 21 and the second board 22 transmit and receive a simple signal SS via an electric wire 51. In the electrical component module 10, the transmission and reception of the simple signal SS between the first board 21 and the second board 22 is controlled by a microcontroller 35. In other words, the microcontroller 35 controls the transmission and reception of the simple signal SS between the first circuit 31 and the second circuit 32. For this reason, in the electrical component module 10 of this disclosure, the first board 21 does not have a microcontroller.
[0046] As described above, the electrical component module 10 of this disclosure comprises a first board 21 having a first circuit 31 including a switching power supply circuit 33 which is a source of noise, a second board 22 separated from the first board 21 having a second circuit 32 including a microcontroller 35 that transmits and receives a communication signal CS between the first circuit 31 and the control circuit 41 other than the first circuit 31, and an electric wire 51 that transmits and receives a simple signal SS between the first circuit 31 and the second circuit 32.
[0047] (Regarding harnesses) Figure 3 is a schematic perspective view showing the connection between the first and second circuit boards by a harness. As shown in Figures 2 and 3, the electrical component module 10 includes a plurality of wires 51. These multiple wires 51 are configured as a harness 50.
[0048] As shown in Figure 3, the harness 50 comprises multiple wires 51. The harness 50 is connected to the first circuit 31 and the second circuit 32 via connectors 52. Connectors 52 include a first connector 52a and a second connector 52b. One of the first connector 52a and the second connector 52b is a male connector, and the other is a female connector. The first connector 52a is provided at both ends of the wire 51 in the longitudinal direction. The second connector 52b is provided on the first circuit 31 and the second circuit 32, respectively. In the harness 50, one first connector 52a is fitted into the second connector 52b of the first circuit 31, and the other first connector 52a is fitted into the second connector 52b of the second circuit 32. In this way, by using the harness 50, the connection of the first circuit 31 and the second circuit 32 with multiple wires 51 can be made easier.
[0049] In the electrical component module 10 of this disclosure, the number of wires 51 constituting the harness 50 is set to be 3 or more and 22 or less.
[0050] When transmitting and receiving a simple signal SS, at least one wire 51 for transmitting the simple signal SS, at least one wire 51 for receiving the simple signal SS, and at least one wire 51 for power supply are required. For this reason, in the electrical component module 10 of this disclosure, the number of wires 51 constituting the harness 50 is three or more.
[0051] The electrical component module 10 installed in the indoor unit 101 (see Figure 1) is preferably designed to be compact. For this reason, the connector 52 installed on the indoor unit control board 20 (first board 21 and second board 22) was selected to have 22 or fewer terminals, taking into account the maximum number of wires 51 required for transmitting and receiving simple signals SS.
[0052] Based on the above, in the electrical component module 10 of this disclosure, the number of wires 51 constituting the harness 50 is set to be 3 or more and 22 or less. By using a harness 50 with such a configuration, the electrical component module 10 of this disclosure can easily connect the first circuit 31 and the second circuit 32. The connector 52 is divided into standard products and non-standard products (custom products) depending on the number of terminals. By adopting a standard connector 52, the electrical component module 10 of this disclosure can suppress the cost increase caused by the adoption of the harness 50.
[0053] (Regarding the positional relationship between the first and second substrates) Figure 4 is a schematic perspective view showing the positional relationship between the first and second circuit boards in an electrical component module. As shown in Figure 4, in the electrical component module 10 of this embodiment, the first circuit board 21 and the second circuit board 22 are supported by a plate-shaped member 15. The plate-shaped member 15 is a member having a flat portion. The material of the plate-shaped member 15 is not particularly limited, and metal, resin, etc., can be used. The first circuit board 21 and the second circuit board 22 are fixed to the support surface 16 of the plate-shaped member 15. The support surface 16 is the flat portion of the plate-shaped member 15. In other words, in the electrical component module 10, the first circuit board 21 and the second circuit board 22 are arranged on the same plane (on the support surface 16). Although the electrical component module 10 of this embodiment supports the first circuit board 21 and the second circuit board 22 with one plate-shaped member 15, in the electrical component module 10 of this disclosure, the first circuit board 21 and the second circuit board 22 may each be supported by two different plate-shaped members 15. In this case, the support surfaces 16 of the two plate-shaped members 15 are arranged on the same plane.
[0054] For example, if the arrangement of the first substrate 21 and the second substrate 22 is misaligned in the direction X shown in Figure 4 (the direction perpendicular to the support surface 16), the length L of the wire 51 connecting the first substrate 21 and the second substrate 22 will be greater than when there is no misalignment (in other words, when they are arranged on the same plane). In the electrical component module 10, an increase in the length L of the wire 51 can be a factor that degrades the communication quality of the simple signal SS. For this reason, in the electrical component module 10 of this disclosure, it is preferable that the first substrate 21 and the second substrate 22 are arranged on the same plane. In this case, the length L of the wire 51 can be minimized, thereby suppressing a decrease in the communication quality of the simple signal SS.
[0055] (Regarding the relationship between wire length and communication quality) Figure 5 is an explanatory diagram showing the relationship between the length of the electric wire and the communication quality of the communication signal. Figure 5 shows the relationship between the length L of the electric wire 51 and the index (PhyRate) that represents the communication quality of the communication signal CS. The unit of the index (PhyRate) is [Mbps]. As a result of diligent research, the inventors of this application have found that in order to ensure the communication quality of the communication signal CS between the indoor unit 101 and the outdoor unit 102 (see Figure 1), it is preferable to ensure a PhyRate of 55 [Mbps] or more under measurement conditions that take into account disturbances such as wiring impedance. For this reason, the electrical component module 10 of this disclosure has a configuration that can ensure a PhyRate of 55 [Mbps] or more for the communication signal CS between the second circuit 32 and the control circuit (other circuit) 41.
[0056] As shown in Figure 5, in the electrical component module 10, if the length L of the wire 51 is short, the distance between the first board 21 and the second board 22 also becomes short, and the communication quality of the communication signal CS from the high-frequency communication circuit 34 deteriorates due to the influence of noise emitted from the switching power supply circuit 33. In the electrical component module 10, in order to suppress the influence of noise emitted from the switching power supply circuit 33, it is preferable to increase the distance between the first board 21 and the second board 22. As shown in Figure 5, in the electrical component module 10, if the length L of the wire 51 is 40 mm or more, a PhyRate of 55 [Mbps] or more can be secured for the communication signal CS.
[0057] The electric wire 51 functions as a receiving unit (antenna) that receives noise. Therefore, as shown in Figure 5, the longer the length L of the electric wire 51, the more noise enters the second circuit 32 via the electric wire 51, thus degrading the communication quality of the communication signal CS from the high-frequency communication circuit 34. Furthermore, an increase in noise entering from the electric wire 51 also leads to a decrease in the communication quality of the simple signal SS itself transmitted via the electric wire 51. For this reason, it is preferable for the electric component module 10 to reduce the separation distance between the first circuit board 21 and the second circuit board 22 to suppress noise entering from the electric wire 51. As shown in Figure 5, when the length L of the electric wire 51 is 250 mm or less, the electric component module 10 can secure a PhyRate of 55 [Mbps] or more for the communication signal CS.
[0058] As described above, in the electrical component module 10 of this disclosure, the length L of the wire 51 is 40 mm or more and 250 mm or less. By making the length L of the wire 51 40 mm or more, the electrical component module 10 can ensure a separation distance of at least 40 mm between the switching power supply circuit 33, which is a noise source on the first circuit board 21, and the high-frequency communication circuit 34. This makes it possible to suppress the influence of noise generated in the first circuit 31 on the transmission and reception of the communication signal CS of the second circuit 32 (high-frequency communication circuit 34). Furthermore, by making the length L of the wire 51 250 mm or less, the electrical component module 10 can suppress the deterioration of the communication quality of the simple signal SS and the communication signal CS caused by the length of the wire 51. With an electrical component module 10 with such a configuration, it is possible to suppress the deterioration of the communication quality of both the communication signal CS and the simple signal SS.
[0059] (Regarding air conditioning systems) As shown in Figure 1, the air conditioning system 100 of this disclosure comprises an indoor unit (first unit) 101 having an electrical component module 10, and an outdoor unit (second unit) 102 having a control circuit (other circuit) 41. In the air conditioning system 100 of this disclosure, the indoor unit 101 and the outdoor unit 102 are separated. In this configuration, the air conditioning system 100 enables high-speed communication at a communication speed of the Mbps order between the indoor unit 101 and the outdoor unit 102 via high-frequency communication circuits 34 and 42 connected by jumper wiring 60. As a result, the air conditioning system 100 can transmit and receive signals with a larger capacity (exchange more information) between the indoor unit 101 and the outdoor unit 102. Consequently, the air conditioning system 100 can more accurately control the temperature of the indoor space S1, thereby ensuring higher air conditioning quality.
[0060] [Effects of the Embodiment] (1) The electrical component module 10 of the above embodiment comprises a first board 21 having a first circuit 31 including a noise source (switching power supply circuit 33), a second board 22 having a second circuit 32 including a microcontroller 35 that transmits and receives a communication signal CS between the first circuit 31 and a control circuit 41 other than the first circuit 31, and separated from the first board 21, and an electric wire 51 that transmits and receives a simple signal SS between the first circuit 31 and the second circuit 32.
[0061] In the electrical component module 10 of this embodiment, the first circuit 31 and the second circuit 32 transmit and receive simple signals SS that do not require decoding processing based on a communication protocol, via the wire 51 without going through a microcontroller that performs decoding processing based on a communication protocol. For this reason, the first circuit 31 does not require a microcontroller. Therefore, the electrical component module 10 of this embodiment can omit the microcontroller in the first circuit 31, thereby reducing the cost associated with the microcontroller.
[0062] (2) In the electrical component module 10 of the above embodiment, the microcontroller 35 controls the transmission and reception of a simple signal SS between the first circuit 31 and the second circuit 32. With this configuration of the electrical component module 10, the microcontroller in the first circuit 31 can be omitted, thus reducing the cost associated with the microcontroller.
[0063] (3) In the electrical component module 10 of the above embodiment, the length L of the electric wire 51 is 40 mm or more and 250 mm or less. In this configuration, the electrical component module 10 can suppress the influence of noise generated in the first circuit 31 on the transmission and reception of the communication signal CS in the second circuit 32 by setting the length L of the wire 51 to 40 mm or more, and can suppress the deterioration of the communication quality of the simple signal SS and the communication signal CS caused by the length of the wire 51 by setting the length L of the wire 51 to 250 mm or less. As a result, the electrical component module 10 of this embodiment can suppress the deterioration of the communication quality of the communication signal CS and the simple signal SS.
[0064] (4) In the electrical component module 10 of the above embodiment, the first circuit board 21 and the second circuit board 22 are arranged on the same plane. In this configuration, the electrical component module 10 can suppress the length L of the wires 51 connecting the first circuit 31 and the second circuit 32 by arranging the first circuit board 21 and the second circuit board 22 on the same plane. As a result, the electrical component module 10 of this embodiment can suppress the deterioration of the communication quality of simple signals SS caused by the length of the wires 51.
[0065] (5) In the electrical component module 10 of the above embodiment, the first circuit 31 includes a switching power supply circuit 33, and the second circuit 32 includes a high-frequency communication circuit 34. In this configuration, the electrical component module 10 can suppress the influence of noise generated in the switching power supply circuit 33 on the transmission and reception of the communication signal CS performed by the high-frequency communication circuit 34. As a result, the electrical component module 10 of this embodiment can suppress the deterioration of the communication quality of the communication signal CS.
[0066] (6) The electrical component module 10 of the above embodiment includes a plurality of wires 51, and the plurality of wires 51 are configured as a harness 50. In this configuration, the electrical component module 10 can easily connect the first circuit 31 and the second circuit 32 by configuring multiple wires 51 as a harness 50.
[0067] (7) In the electrical component module 10 of the above embodiment, the harness 50 includes three or more and 22 or fewer wires 51. In the case of an electrical component module 10 with such a configuration, if it has multiple wires 51, the connection of the first circuit 31 and the second circuit 32 can be made easier by configuring the multiple wires 51 as a harness 50.
[0068] (8) In the electrical component module 10 of the above embodiment, the first circuit board 21 does not have a microcontroller. With this configuration of the electrical component module 10, the cost related to the microcontroller can be reduced by omitting the microcontroller on the first circuit board 21.
[0069] (9) The air conditioning system 100 of the above embodiment comprises an indoor unit (first unit) 101 having an electrical equipment module 10 and an outdoor unit (second unit) 102 having a control circuit (other circuit) 41, and the indoor unit 101 and the outdoor unit 102 are arranged at a distance from each other.
[0070] The air conditioning system 100 of this embodiment includes an electrical module 10 in the indoor unit 101. In the electrical module 10, the first circuit 31 and the second circuit 32 transmit and receive simple signals SS that do not require decoding processing based on a communication protocol, via the wire 51 without going through a microcontroller. Therefore, the first circuit 31 does not require a microcontroller for decoding processing based on a communication protocol. Thus, the air conditioning system 100 of this disclosure can omit the microcontroller in the first circuit 31 of the indoor unit 101, and thus the cost related to the microcontroller can be reduced.
[0071] Although embodiments have been described above, it should be understood that various modifications to the form and details are possible without departing from the spirit and scope of the claims. [Explanation of Symbols]
[0072] 10: Electrical component module 21:First board 22:Second board 31:First circuit 32:Second circuit 33: Switching power supply circuit 34: High-frequency communication circuits 35: Microcontroller 41: Control circuits (other circuits) 50: Harness 51:Electric wire 100: Air conditioning system 101: Indoor unit (first device) 102: Outdoor unit (second device) CS: Communication signal SS: Simple signal L: Length (of an electrical wire)
Claims
1. A first substrate (21) having a first circuit (31) including a noise source, The second circuit (22) is separated from the first circuit board (21) and includes a second circuit (32) which includes a microcontroller (35) that transmits and receives communication signals (CS) with other circuits (41) other than the first circuit (31), A wire (51) that transmits and receives a simple signal (SS) between the first circuit (31) and the second circuit (32), An electrical component module (10) is provided.
2. The microcontroller (35) controls the transmission and reception of the simple signal (SS) between the first circuit (31) and the second circuit (32), as described in claim 1, for the electrical component module (10).
3. The electrical component module (10) according to claim 1 or claim 2, wherein the length (L) of the electric wire (51) is 40 mm or more and 250 mm or less.
4. The first substrate (21) and the second substrate (22) are arranged on the same plane, the electrical component module (10) according to claim 1 or claim 2.
5. The electrical component module (10) according to claim 1 or claim 2, wherein the first circuit (31) includes a switching power supply circuit (33), and the second circuit (32) includes a high-frequency communication circuit (34).
6. Including a plurality of the aforementioned electric wires (51), The plurality of electric wires (51) are configured as a harness (50), as described in claim 1 or claim 2, for the electrical component module (10).
7. The electrical component module (10) according to claim 6, wherein the harness (50) includes three or more and 22 or fewer electric wires (51).
8. The first circuit board (21) is an electrical component module (10) according to claim 1 or claim 2, wherein the first circuit board (21) does not have the microcontroller (35).
9. A first device (101) having the electrical component module (10) according to claim 1 or claim 2, A second device (102) having the aforementioned other circuit (41), Equipped with, The first device (101) and the second device (102) are an air conditioning system (100) arranged at a distance from each other.
Citation Information
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