Indication device

Abstract

This makes it difficult to short-circuit the heating wire and the first wire, and also makes it difficult for the heating wire to become excessively hot. [Solution] The display device comprises a first substrate 21 having a display area AA and a non-display area NAA; a first wiring 30 and a heating wiring 40 arranged in the display area AA and consisting of a part of the first conductive film; a first connection part 42 and a second connection part 45 arranged in the non-display area NAA and consisting of a part of the first conductive film; a first insulating film 35 arranged on the first conductive film; and a third connection part 46 arranged in the non-display area NAA and consisting of a part of the second conductive film arranged on the first insulating film 35, overlapping with a part of the first wiring 30 and a part of the second connection part 45. The first insulating film 35 is provided with a first contact hole CHB1 positioned to overlap with both the first wiring 30 and the third connection part 46, and a second contact hole CHB2 positioned to overlap with both the second connection part 45 and the third connection part 46.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a display device in which a heating wiring and a first wiring are less likely to be short-circuited and a significant increase in the temperature of the heating wiring is less likely to occur.

Background Art

[0002] Conventionally, as an example of a display device, a liquid crystal display device described in Patent Document 1 below is known. The liquid crystal display device described in Patent Document 1 includes a liquid crystal panel, a memory that stores current data indicating the current brightness of each pixel provided in the liquid crystal panel until the next time, (i) a combination of previous data and current data, an inputable combination, and (ii) a look-up table that stores in advance an output signal corresponding to each combination, control means that outputs the output signal as corrected current data in order to facilitate grayscale transition from the previous time to the current time, a heater that heats the liquid crystal panel, and heater control means that controls the start and stop of heating by the heater so that the temperature of the liquid crystal panel becomes within ±3°C of a predetermined target temperature within the range of 33°C to 63°C.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the liquid crystal display device described in Patent Document 1 above, the heater is configured by connecting a heater electrode made of a transparent electrode film with a metal electrode. Contact resistance occurs at the connection point between the heater electrode and the metal electrode, and this contact resistance may cause the connection point to become locally extremely hot. In contrast, even if the heater electrode is made of the same metal material as the metal electrode, it is difficult to address this issue because there is a concern about short circuits with other electrodes and wiring on the liquid crystal panel.

[0005] The technology described herein was developed based on the circumstances described above, and aims to make it difficult for the heating wiring and the first wiring to short-circuit, and to make it difficult for the heating wiring to become excessively hot. [Means for solving the problem]

[0006] (1) A display device relating to the technology described herein includes: a first substrate having a display area on which an image is displayed and a non-display area on which the image is not displayed; a first wiring disposed in the display area on the first substrate, extending along a first direction, and consisting of a part of a first conductive film; a heating wiring disposed in the display area on the first substrate, extending along a first direction, and consisting of a part of the first conductive film different from the first wiring; a first connection portion disposed in the non-display area on the first substrate, extending along a second direction intersecting the first direction, consisting of a part of the first conductive film different from the first wiring and the heating wiring, and connected to the heating wiring; and the non-display area on the first substrate. The substrate comprises: a first connection portion sandwiched between the first wiring and a second connection portion which consists of a portion of the first conductive film different from the first wiring, the heating wiring, and the first connection portion; a first insulating film disposed on the upper side of the first conductive film; and a third connection portion which is disposed in the non-display area of ​​the first substrate and consists of a part of the second conductive film disposed on the upper side of the first insulating film, crosses the first connection portion, and overlaps with a part of the first wiring and a part of the second connection portion. The first insulating film is provided with a first contact hole disposed at a position that overlaps with both the first wiring and the third connection portion, and a second contact hole disposed at a position that overlaps with both the second connection portion and the third connection portion.

[0007] (2) In addition to (1) above, the display device may also include a first electrode that is arranged superimposed on at least a portion of the first wiring and the heating wiring, is not connected to the heating wiring, and is connected to the first wiring.

[0008] (3) In addition to (2) above, the display device may also have the first electrode made of a portion of the second conductive film different from the third connecting portion, and the first insulating film may be provided with a third contact hole positioned to overlap both the first wiring and the first electrode.

[0009] (4) In addition to (3) above, the display device comprises a second insulating film disposed on the upper side of the second conductive film, a pixel electrode consisting of a part of the third conductive film disposed on the upper side of the second insulating film and superimposed on a part of the first electrode, a source wiring consisting of a part of the fourth conductive film disposed on the lower side of the first conductive film and the third insulating film disposed on the lower side of the third insulating film, a source electrode connected to the source wiring, a drain electrode consisting of a part of the fourth conductive film different from the source wiring and the source electrode, a fourth insulating film disposed on the lower side of the fourth conductive film, a semiconductor portion consisting of a part of the semiconductor film disposed on a lower side of the fourth insulating film and superimposed on the source electrode and the drain electrode, respectively, and a fourth connection portion consisting of a part of the first conductive film different from the first wiring, the heating wiring, the first connection portion and the second connection portion and superimposed on the drain electrode. The first wiring comprises a fifth connection portion which is made up of a portion of the second conductive film different from the third connection portion and the first electrode, and which is arranged superimposed on both the fourth connection portion and the pixel electrode, the first wiring transmits at least a common potential signal, the fourth insulating film is provided with a fourth contact hole positioned superimposed on both the source electrode and the semiconductor portion, and a fifth contact hole positioned superimposed on both the drain electrode and the semiconductor portion, the third insulating film is provided with a sixth contact hole positioned superimposed on both the drain electrode and the fourth connection portion, the first insulating film is provided with a seventh contact hole positioned superimposed on both the fourth connection portion and the fifth connection portion, and the second insulating film is provided with an eighth contact hole positioned superimposed on both the fifth connection portion and the pixel electrode.

[0010] (5) In addition to (4) above, the display device may have a plurality of source wirings that extend along the first direction and are spaced apart in the second direction, the first wirings being arranged to overlap with the first source wirings included in the plurality of source wirings, and the heating wirings being arranged to overlap with the second source wirings included in the plurality of source wirings.

[0011] (6) In addition to (5) above, the first insulating film and the third insulating film of the display device may have a greater film thickness than the second insulating film.

[0012] (7) In addition to (2) above, the display device further comprises a second insulating film disposed on the upper side of the second conductive film, and a sixth connecting portion which is made of a portion of the second conductive film different from the third connecting portion and is disposed superimposed on a portion of the first wiring and a portion of the first electrode, wherein the first electrode is made of a portion of the third conductive film disposed on the upper side of the second insulating film, the first insulating film is provided with a ninth contact hole disposed at a position superimposed on both the first wiring and the sixth connecting portion, and the second insulating film is provided with a tenth contact hole disposed at a position superimposed on both the sixth connecting portion and the first electrode.

[0013] (8) In addition to (7) above, the display device also comprises: a pixel electrode made of a portion of the second conductive film different from the third and sixth connection portions; a third insulating film arranged superimposed on the pixel electrode and located on the lower side of the first conductive film; a source wiring made of a part of the fourth conductive film located on the lower side of the third insulating film; a source electrode connected to the source wiring; a drain electrode made of a portion of the fourth conductive film different from the source wiring and the source electrode; a fourth insulating film located on the lower side of the fourth conductive film; a semiconductor portion made of a part of a semiconductor film located on the lower side of the fourth insulating film and arranged superimposed on the source electrode and the drain electrode, respectively; and the first wiring made of the first conductive film. The device comprises a heating wiring, a fourth connection portion which is made up of a portion different from the first and second connection portions and is arranged superimposed on the drain electrode, the first wiring being configured to transmit at least a common potential signal, the fourth insulating film being provided with a fourth contact hole positioned superimposed on both the source electrode and the semiconductor portion, and a fifth contact hole positioned superimposed on both the drain electrode and the semiconductor portion, the third insulating film being provided with a sixth contact hole positioned superimposed on both the drain electrode and the fourth connection portion, and the first insulating film being provided with an eleventh contact hole positioned superimposed on both the fourth connection portion and the pixel electrode.

[0014] (9) In addition to (8) above, the display device may have a plurality of source wirings that extend along the first direction and are spaced apart in the second direction, the first wirings being arranged to overlap with the first source wirings included in the plurality of source wirings, and the heating wirings being arranged to overlap with the second source wirings included in the plurality of source wirings.

[0015] (10) In addition to (9) above, the first insulating film and the third insulating film of the display device may have a greater film thickness than the second insulating film.

[0016] (11) Further, in addition to any one of the above (1) to (10), the display device may transmit the common potential signal and the position detection signal in a time-division manner through the first wiring.

[0017] (12) Further, in addition to any one of the above (1) to (11), the display device may include a second substrate disposed to face the first substrate with a gap therebetween, and a liquid crystal layer sandwiched between the first substrate and the second substrate.

Advantages of the Invention

[0018] According to the technology described in this specification, it is possible to make it difficult for the heating wiring and the first wiring to be short-circuited, and it is possible to make it difficult for the heating wiring to be significantly heated.

Brief Description of the Drawings

[0019] [Figure 1] Plan view of a liquid crystal panel, a flexible substrate, a control substrate, etc. constituting the liquid crystal display device according to Embodiment 1 [Figure 2] Cross-sectional view of a liquid crystal panel, a flexible substrate, a control substrate, etc. constituting the liquid crystal display device according to Embodiment 1 [Figure 3] Circuit diagram showing the electrical configuration of an array substrate constituting the liquid crystal panel according to Embodiment 1 [Figure 4] Plan view showing the configuration related to the touch panel function and the configuration related to the heater function provided on the array substrate according to Embodiment 1 [Figure 5] Cross-sectional view showing the configuration near the TFT of the array substrate according to Embodiment 1 [Figure 6] Cross-sectional view showing the configuration near the central portion in the Y-axis direction of the pixel electrode of the array substrate according to Embodiment 1 [Figure 7] Cross-sectional view showing the connection portion between the touch electrode and the touch wiring of the array substrate according to Embodiment 1 [Figure 8] Cross-sectional view showing the connection portion of the touch wiring, the touch terminal portion, and the bridge wiring of the array substrate according to Embodiment 1 [Figure 9]Cross-sectional view showing the structure near the TFT in the array substrate according to Embodiment 2 [Figure 10] Cross-sectional view showing the structure near the central part in the Y-axis direction of the pixel electrode in the array substrate according to Embodiment 2 [Figure 11] Cross-sectional view showing the connection portion between the touch electrode and the touch wiring in the array substrate according to Embodiment 2

Mode for Carrying Out the Invention

[0020] <Embodiment 1> Embodiment 1 will be described with reference to FIGS. 1 to 8. In this embodiment, a liquid crystal display device 10 used in an in-vehicle CMS (Camera Monitor System) will be exemplified. The in-vehicle CMS is a system that displays an image captured by a camera on a display (liquid crystal display device 10) as an alternative to a door mirror or a rearview mirror using a mirror surface in an automobile. The liquid crystal display device 10 according to this embodiment includes a display function and a touch panel function (position input function). Note that the X-axis, Y-axis, and Z-axis are shown in part of each drawing, and each axis direction is drawn so as to be the direction shown in each drawing. Also, the upper side of FIGS. 2, 5 to 8 is defined as the front side, and the lower side of the same figure is defined as the back side.

[0021] As shown in FIG. 1, the liquid crystal display device 10 includes at least a liquid crystal panel (display device, display panel) 11 having a horizontally long rectangular shape and capable of displaying an image, and a backlight device (lighting device) which is an external light source that irradiates light for display to the liquid crystal panel 11. The backlight device is disposed on the back side (rear side) of the liquid crystal panel 11, and has a light source (for example, an LED) that emits white light (white light) and an optical member that converts the light from the light source into planar light by imparting an optical action to the light. The central side portion of the screen (main surface) of the liquid crystal panel 11 is a display area AA where an image is displayed. On the other hand, the frame-shaped (framed) outer peripheral side portion surrounding the display area AA on the screen of the liquid crystal panel 11 is a non-display area NAA where an image is not displayed.

[0022] As shown in Figure 1, a circuit section (peripheral circuit section, gate circuit section) 12 is provided in the non-display area NAA of the liquid crystal panel 11. A pair of circuit sections 12 are arranged so as to sandwich the display area AA from both sides in the X-axis direction. The circuit section 12 is provided in a strip-shaped area extending along the Y-axis direction. The circuit section 12 is for supplying scanning signals to the gate wiring 26, which will be described later, and is monolithically provided on the array substrate 21, which will be described later. The circuit section 12 is a GDM (Gate Driver Monolithic) circuit. The circuit section 12 includes a shift register circuit that outputs scanning signals at predetermined timings, a buffer circuit for amplifying scanning signals, and the like.

[0023] The liquid crystal panel 11 will be described in detail with reference to Figure 2 in addition to Figure 1. As shown in Figures 1 and 2, the liquid crystal panel 11 is formed by bonding a pair of substrates 20 and 21 together. Of the pair of substrates 20 and 21, the front side is the opposing substrate (second substrate) 20, and the back side is the array substrate (first substrate) 21. Both the opposing substrate 20 and the array substrate 21 are formed by laminating various films on the inner surface of glass substrates (substrate portion) 20GS and 21GS. A liquid crystal layer (medium layer) 22 containing liquid crystal molecules, which are substances whose optical properties change when an electric field is applied, is interposed between the pair of substrates 20 and 21. A sealing portion 23 is provided between the outer peripheral edges of the pair of substrates 20 and 21 to seal the liquid crystal layer 22. The sealing portion 23 is formed in a rectangular frame shape (endless ring) so as to surround the liquid crystal layer 22. Furthermore, polarizing plates 13 are attached to the outer surfaces of both substrates 20 and 21.

[0024] As shown in Figures 1 and 2, the opposing substrate 20 has a shorter short side dimension than the array substrate 21. The opposing substrate 20 is bonded to the array substrate 21 such that one end aligns with the array substrate 21 in the short side direction (Y-axis direction). Therefore, the array substrate 21 has an exposed portion 21A on the other end in the short side direction that protrudes laterally from the opposing substrate 20. This exposed portion 21A is the edge of the frame-shaped non-display area NAA that extends along the X-axis direction, and a flexible substrate 14 for supplying various signals is mounted on it.

[0025] The flexible substrate 14 is constructed by forming numerous wiring patterns on a substrate made of a synthetic resin material (e.g., polyimide resin) that has insulating and flexible properties. As shown in Figures 1 and 2, a driver 15 is mounted on the flexible substrate 14 using COF (Chip On Film). The driver 15 consists of an LSI chip having a drive circuit inside. The driver 15 processes various signals transmitted by the flexible substrate 14. The driver 15 supplies various signals (e.g., image signals) to the wiring of the display area AA (e.g., source wiring 27, which will be described later). One end of the flexible substrate 14 is connected to the exposed portion 21A of the array substrate 21, and the other end is connected to the control substrate 16. The flexible substrate 14 is connected to the central portion of the exposed portion 21A in the X-axis direction. The control substrate 16 is constructed by mounting multiple circuit components on a rigid substrate made of synthetic resin (e.g., paper phenol or glass epoxy resin). The control board 16 includes several circuit components, such as a power supply IC (Integrated Circuit) 16A which is a DC power supply for outputting power, a timing controller 16B which generates various signals supplied to the driver 15, a touch panel controller 16C which controls the touch panel function, and a level shifter IC for controlling (stepping down / stepping up) the voltage level. The control board 16 has a connector section to which the flexible board 14 and the like are connected. The control board 16 is arranged so that it overlaps the back side of the backlight device by bending the flexible board 14 in a folded shape. A temperature sensor 17 is connected to the control board 16. The temperature sensor 17 is positioned close to or in contact with the liquid crystal panel 11, and is capable of detecting the temperature near the liquid crystal panel 11.

[0026] Next, the configuration of the display area AA on the array substrate 21 will be explained using Figure 3. As shown in Figure 3, at least TFTs (switching elements, transistors) 24 and pixel electrodes 25 are provided on the inner surface of the display area AA on the array substrate 21. The TFTs 24 and pixel electrodes 25, together with the color filter described later, constitute the display unit, the pixel PX. Multiple TFTs 24 and pixel electrodes 25 are arranged in a matrix (matrix) pattern with spacing along the X-axis and Y-axis directions. Around these TFTs 24 and pixel electrodes 25, gate wiring (scanning wiring) 26 and source wiring (image wiring, signal wiring) 27 are arranged orthogonally (intersecting) with each other. Multiple gate wirings 26 extend along the X-axis direction and are arranged with spacing along the Y-axis direction. Multiple source wirings 27 extend along the Y-axis direction (first direction) and are arranged with spacing along the X-axis direction (second direction intersecting the first direction). The TFT 24 includes a gate electrode 24A connected to the gate wiring 26, a source electrode 24B connected to the source wiring 27, a drain electrode 24C connected to the pixel electrode 25, and a semiconductor portion 24D connected to the source electrode 24B and the drain electrode 24C. The TFT 24 is driven based on a scanning signal supplied from the circuit portion 12 to the gate electrode 24A via the gate wiring 26. Then, the potential related to the image signal supplied from the driver 15 to the source electrode 24B via the source wiring 27 is supplied to the drain electrode 24C via the semiconductor portion 24D. As a result, the pixel electrode 25 is charged to the potential related to the image signal. The pixel electrode 25 is located in the region surrounded by the gate wiring 26 and the source wiring 27, and its planar shape is, for example, approximately rectangular. In addition, a common electrode 28 is formed on the inner surface of the display area AA of the array substrate 21, superimposed on all the pixel electrodes 25 (see Figure 6). The common electrode 28 extends over almost the entire display area AA.

[0027] Furthermore, the display area AA of the opposing substrate 20 is provided with multiple color filters at positions facing each pixel electrode 25 on the array substrate 21. The color filters consist of three colors, R (red), G (green), and B (blue), arranged repeatedly in a predetermined order, and together with the TFT 24 and the pixel electrodes 25, they constitute pixels PX of each color (red pixels, green pixels, and blue pixels). The three pixels PX of red, green, and blue pixels constitute a display pixel capable of displaying a predetermined gradation of color. In addition, a light-shielding portion (black matrix) is formed between each color filter to prevent color mixing. Moreover, the innermost surfaces of the opposing substrate 20 and the array substrate 21 are provided with alignment films to orient the liquid crystal molecules contained in the liquid crystal layer 22.

[0028] The liquid crystal panel 11 according to this embodiment has both a display function for displaying images and a touch panel function for detecting the position (input position) entered by the user based on the displayed image. The liquid crystal panel 11 has an integrated (in-cell) touch panel pattern for performing the touch panel function. The configuration related to the touch panel function will be explained with reference to Figure 4. In Figure 4, the configuration consisting of the first transparent electrode film (touch electrode 29 and bridge wiring 46, which will be described later) is shown in a shaded form. The touch panel pattern for performing the touch panel function is a so-called projected capacitive type, and its detection method is a self-capacitive type. As shown in Figure 4, the touch panel pattern consists of a plurality of touch electrodes (first electrode, position detection electrode) 29 arranged in a matrix within the main surface of the liquid crystal panel 11. The touch electrodes 29 are arranged in the display area AA of the liquid crystal panel 11. Therefore, the display area AA of the liquid crystal panel 11 almost coincides with the touch area (position input area) where the input position can be detected, and the non-display area NAA almost coincides with the non-touch area (non-position input area) where the input position cannot be detected. The touch electrodes 29 are composed of the common electrodes 28 described above. The common electrodes 28 have partition slits that separate adjacent touch electrodes 29. These partition slits divide the common electrodes 28 into a grid pattern, forming multiple electrically independent touch electrodes 29. When a user brings a conductive object such as a finger (position input object) close to the surface of the liquid crystal panel 11 to input a position based on the image of the display area AA of the liquid crystal panel 11 that the user is viewing, a capacitance is formed between the finger and the touch electrodes 29. As a result, the capacitance detected at the touch electrodes 29 near the finger changes as the finger approaches, and becomes different from that of the touch electrodes 29 farther away from the finger, making it possible to detect the input position based on this. In addition to the arrangement shown in Figure 4, the specific number of touch electrodes 29 can be changed as appropriate. The touch electrode 29 is roughly rectangular in shape when viewed in a plane, with each side measuring a few millimeters. Therefore, the touch electrode 29 is much larger in size than the pixel PX when viewed in a plane, and is positioned to span multiple pixels in both the X-axis and Y-axis directions.

[0029] As shown in Figure 4, multiple touch wirings (first wiring, position detection wiring) 30 connected to multiple touch electrodes 29 are provided on the inner surface of the display area AA of the array substrate 21. The touch wirings 30 extend along the Y-axis and run parallel to the source wiring 27. Multiple touch wirings 30 are arranged in a row with spacing in the X-axis direction. The multiple touch wirings 30 connected to multiple touch electrodes 29 that are arranged along the Y-axis and form a single row are biased towards one side of the row of touch electrodes 29 in the X-axis direction (right side in Figure 4). The touch wirings 30 are supplied with a common potential signal (reference potential signal) related to the display function and a touch signal (position detection signal) related to the touch panel function from the touch panel controller 16C at different timings (time-division multiplexing) (see Figure 1). The touch panel controller 16C supplies the common potential signal to the touch wiring 30 in synchronization with the timing at which the signal related to the display function is supplied from the timing controller 16B to the driver 15. The timing at which a common potential signal is supplied from the touch panel controller 16C to the touch wiring 30 is the display period, and the timing at which a touch signal is supplied from the touch panel controller 16C to the touch wiring 30 is the sensing period (position detection period). During the display period, a common potential signal is supplied to all touch wiring 30, so all touch electrodes 29 become at a common potential (reference potential) and function as a common electrode 28.

[0030] Here, the various films laminated on the inner surface of the array substrate 21 will be explained with reference to Figure 5. Figure 5 shows the cross-sectional structure of the array substrate 21 near the TFT 24. As shown in Figure 5, the glass substrate (substrate) 21GS of the array substrate 21 has at least the following laminated films formed in order from the bottom layer side (glass substrate 21GS side): a first metal film, a base coat film 31, a semiconductor film, a gate insulating film 32, a second metal film, a first interlayer insulating film (fourth insulating film) 33, a third metal film (fourth conductive film), a first planarization film (third insulating film) 34, a fourth metal film (first conductive film), a second planarization film (first insulating film) 35, a first transparent electrode film (second conductive film), a second interlayer insulating film (second insulating film) 36, a second transparent electrode film (third conductive film), and an alignment film (not shown).

[0031] The first, second, third, and fourth metal films are all conductive by being single-layer films made of one type of metal material or multilayer films or alloys made of different types of metal materials. The first metal film constitutes the light-shielding portion 37, which will be described later. The second metal film constitutes the gate wiring 26, the gate electrode 24A of the TFT 24, etc. The third metal film constitutes the source wiring 27, the source electrode 24B of the TFT 24, the drain electrode 24C, etc. The fourth metal film constitutes the touch wiring 30, etc. The fourth metal film may be a multilayer film, for example, and may include a layer made of Ti (titanium) or Mo (molybdenum) in the uppermost layer. The semiconductor film is made of a crystalline polysilicon semiconductor material (semiconductor material) created by known methods such as laser crystallization. The polysilicon semiconductor material of the semiconductor film has higher electron mobility compared to amorphous silicon semiconductor material or oxide semiconductor material. The semiconductor film constitutes the semiconductor portion 24D of the TFT 24, etc. The first transparent electrode film and the second transparent electrode film are made of a transparent electrode material (for example, ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide)). The first transparent electrode film constitutes a common electrode 28 (touch electrode 29), etc. The second transparent electrode film constitutes a pixel electrode 25, etc.

[0032] The base coat film 31, gate insulating film 32, first interlayer insulating film 33, and second interlayer insulating film 36 are all types of inorganic materials (inorganic resin materials), such as SiO2 (silicon oxide, silicon oxide) and SiN x The first planarization film 34 and the second planarization film 35 are made of organic materials such as (silicon nitride). The thickness of the first planarization film 34 and the second planarization film 35 is usually greater than the thickness of the base coat film 31, the gate insulating film 32, the first interlayer insulating film 33, and the second interlayer insulating film 36. Specifically, the thickness of the base coat film 31, the gate insulating film 32, the first interlayer insulating film 33, and the second interlayer insulating film 36, which are made of inorganic materials, is, for example, several tens to several hundred nanometers, while the thickness of the first planarization film 34 and the second planarization film 35, which are made of organic materials, is, for example, about 1 μm to 3 μm. The inner surface of the array substrate 21 (the surface on the liquid crystal layer 22 side) is planarized by these first planarization films 34 and the second planarization film 35. The base coat film 31 is interposed between the semiconductor film and the first metal film. The gate insulating film 32 is interposed between the semiconductor film and the second metal film. The first interlayer insulating film 33 is interposed between the second metal film and the third metal film. The first planarization film 34 is interposed between the third metal film and the fourth metal film. The second planarization film 35 is interposed between the fourth metal film and the first transparent electrode film. The second interlayer insulating film 36 is interposed between the first transparent electrode film and the second transparent electrode film.

[0033] The cross-sectional configuration of the TFT24 will now be described. As shown in Figure 5, the TFT24 according to this embodiment is a so-called top-gate type, in which a gate electrode 24A, which is part of the second metal film, is superimposed on the upper layer side of the semiconductor portion 24D, which is part of the semiconductor film, via a gate insulating film 32. The semiconductor portion 24D has low-resistance regions at both ends that do not overlap with the gate electrode 24A, while the central portion that overlaps with the gate electrode 24A is a non-low-resistance region that is not subjected to low-resistance treatment. The low-resistance region of the semiconductor portion 24D is created, for example, by applying a low-resistance treatment using the gate electrode 24A as a mask during the manufacturing process of the array substrate 21. The array substrate 21 is provided with a light-shielding portion 37 that overlaps with at least the non-low-resistance region of the semiconductor portion 24D. The light-shielding portion 37 is made up of part of the first metal film. Since the light-shielding portion 37 is positioned below the non-low-resistivity region of the semiconductor portion 24D, it can block light irradiated from the backlight device onto the non-low-resistivity region of the semiconductor portion 24D. This suppresses the variation in the characteristics of the TFT 24 that may occur when light is irradiated onto the non-low-resistivity region of the semiconductor portion 24D.

[0034] As shown in Figure 5, the source electrode 24B of the TFT 24 consists of a part of the third metal film and is superimposed on one low-resistance region (one end portion) of the semiconductor portion 24D via the gate insulating film 32 and the first interlayer insulating film 33. A source contact hole (fourth contact hole) CHS is provided in communication with the gate insulating film 32 and the first interlayer insulating film 33 at positions where they overlap with both the source electrode 24B and the semiconductor portion 24D. The source electrode 24B and the semiconductor portion 24D are connected to each other through the source contact hole CHS. The drain electrode 24C of the TFT 24 consists of a part of the third metal film and is superimposed on the other low-resistance region (the other end portion) of the semiconductor portion 24D via the gate insulating film 32 and the first interlayer insulating film 33. A drain contact hole (fifth contact hole) CHD is provided in communication with both the drain electrode 24C and the semiconductor portion 24D at positions where they overlap the gate insulating film 32 and the first interlayer insulating film 33. The drain electrode 24C and the semiconductor portion 24D are connected to each other through the drain contact hole CHD.

[0035] As shown in Figure 5, the TFT24 has a first intermediate electrode (fourth connection part) 38 and a second intermediate electrode (fifth connection part) 39 located between the drain electrode 24C, which is made up of a part of the third metal film, and the pixel electrode 25, which is made up of a part of the second transparent electrode film. The first intermediate electrode 38 is made up of a part of the fourth metal film (a part different from the touch wiring 30 and the heating wiring 40). The first intermediate electrode 38 is arranged superimposed on the upper layer side of a part of the drain electrode 24C (a part that does not overlap with the semiconductor part 24D) via the first planarization film 34. The second intermediate electrode 39 is made up of a part of the first transparent electrode film (a part different from the common electrode 28 and the touch electrode 29). The second intermediate electrode 39 is arranged superimposed on the upper layer side of a part of the first intermediate electrode 38 (a part that does not overlap with the drain electrode 24C) via the second planarization film 35. The second intermediate electrode 39 is arranged superimposed on the lower layer side of a part of the pixel electrode 25 via the second interlayer insulating film 36. In the first planarization film 34 interposed between the drain electrode 24C and the first intermediate electrode 38, a first pixel contact hole (sixth contact hole) CHP1 is provided at a position that overlaps with both the drain electrode 24C and the first intermediate electrode 38. The drain electrode 24C and the first intermediate electrode 38 are connected to each other through the first pixel contact hole CHP1 of the first planarization film 34. In the second planarization film 35 interposed between the first intermediate electrode 38 and the second intermediate electrode 39, a second pixel contact hole (seventh contact hole) CHP2 is provided at a position that overlaps with both the first intermediate electrode 38 and the second intermediate electrode 39. The first intermediate electrode 38 and the second intermediate electrode 39 are connected to each other through the second pixel contact hole CHP2 of the second planarization film 35. In the second interlayer insulating film 36 interposed between the second intermediate electrode 39 and the pixel electrode 25, a third pixel contact hole (eighth contact hole) CHP3 is provided with an opening at a position that overlaps with both the second intermediate electrode 39 and the pixel electrode 25. The second intermediate electrode 39 and the pixel electrode 25 are connected to each other through the third pixel contact hole CHP3 of the second interlayer insulating film 36. In this way, the drain electrode 24C is connected to the pixel electrode 25 via the first intermediate electrode 38 and the second intermediate electrode 39.

[0036] Furthermore, the common electrode 28 provided in the display area AA of the array substrate 21 is arranged to overlap with all the pixel electrodes 25, as shown in Figure 6. Figure 6 shows the cross-sectional configuration of the pixel electrode 25 in the array substrate 21 near the center in the Y-axis direction. The common electrode 28 extends over almost the entire display area AA. The common electrode 28, which is made up of a part of the first transparent electrode film, is positioned on the lower layer side (glass substrate 21GS side) of the pixel electrode 25, which is made up of a part of the second transparent electrode film, with a gap equal to the thickness of the second interlayer insulating film 36. A common potential signal, which is considered a common potential (reference potential), is supplied to the common electrode 28. A slit 25A is provided in the pixel electrode 25 located on the upper layer side of the common electrode 28. When the pixel electrode 25 is charged to a potential based on the image signal transmitted to the source wiring 27 as the TFT 24 is driven, a potential difference is generated between the pixel electrode 25 and the common electrode 28. As a result, a fringe electric field (oblique electric field) is generated between the opening edge of the slit 25A in the pixel electrode 25 and the common electrode 28, which includes a component along the main surface of the array substrate 21 as well as a component normal to the main surface of the array substrate 21. Therefore, by utilizing this fringe electric field, the orientation state of the liquid crystal molecules contained in the liquid crystal layer 22 can be controlled, and a predetermined display is made based on this orientation state of the liquid crystal molecules. In other words, the liquid crystal panel 11 according to this embodiment is set to FFS (Fringe Field Switching) mode.

[0037] The connection structure between the touch electrode 29, which is formed by dividing the common electrode 28, and the touch wiring 30 will be explained with reference to Figure 7. As shown in Figure 7, a portion of the touch wiring 30, which is made up of a part of the fourth metal film, is superimposed on the lower layer side of a portion of the touch electrode 29, which is made up of a part of the first transparent electrode film, via the second planarization film 35. A touch contact hole (third contact hole) CHT is opened and provided in the second planarization film 35 at a position where it overlaps with both the touch wiring 30 and the touch electrode 29. The touch wiring 30 and the touch electrode 29 are connected to each other through the touch contact hole CHT of the second planarization film 35.

[0038] Incidentally, since the liquid crystal display device 10 according to this embodiment is used in an in-vehicle CMS, there is a strong concern that the response speed of the liquid crystal panel 11 will decrease due to the viscosity of the liquid crystal layer 22 increasing in low-temperature environments. Therefore, the liquid crystal panel 11 according to this embodiment is equipped with a heater function to improve the response speed at low temperatures, and the configuration for performing the heater function is in-cell. The configuration related to the heater function will be explained with reference to Figure 4, etc.

[0039] As shown in Figure 4, the array substrate 21 is provided with a heating wiring 40, a first main wiring 41 and a second main wiring (first connection part) 42, a first heating terminal part 43 and a second heating terminal part 44, as a configuration for performing a heater function. The heating wiring 40, the first main wiring 41, the second main wiring 42, the first heating terminal part 43 and the second heating terminal part 44 are all made up of a part of the fourth metal film. The heating wiring 40 is arranged in the display area AA, extends along the Y-axis direction, and runs parallel to the source wiring 27 and the touch wiring 30. The heating wiring 40 traverses the display area AA longitudinally, extending from the exposed part 21A side of the array substrate 21 toward the opposite side in the Y-axis direction. Therefore, the heating wiring 40 traverses all of the multiple touch electrodes 29 that are arranged in a row along the Y-axis direction in the display area AA. Multiple heating wirings 40 are arranged side by side with spacing in the X-axis direction. Multiple heating wires 40 superimposed on multiple touch electrodes 29 arranged along the Y-axis to form a single row are predominantly located on the other side of the row of touch electrodes 29 in the X-axis direction (left side in Figure 4). Although the heating wires 40 are arranged superimposed on the touch electrodes 29, they are not connected to the superimposed touch electrodes 29. A second planarization film 35 is interposed between the heating wires 40, which are made up of a part of the fourth metal film, and the touch electrodes 29, which are made up of a part of the first transparent electrode film, thereby keeping the heating wires 40 and the touch electrodes 29 in an insulated state (see Figure 6). In this way, the touch electrodes 29 are arranged superimposed on at least a portion of the heating wires 40 that are not connected, thereby ensuring a sufficient area for the formation of the touch electrodes 29.

[0040] As shown in Figure 4, both the first trunk wiring 41 and the second trunk wiring 42 are located in the non-display area NAA. More specifically, the first trunk wiring 41 is provided to extend along three sides of the frame-shaped non-display area NAA, excluding the exposed portion 21A, and surrounds the display area AA from three sides. The first trunk wiring 41 has a first trunk wiring component 41A located on the side of the non-display area NAA opposite to the exposed portion 21A in the Y-axis direction, and a pair of second trunk wiring components 41B located on the pair of sides at both ends of the non-display area NAA in the X-axis direction. The first trunk wiring component 41A extends along the X-axis direction and is adjacent along its entire length to the side of the rectangular display area AA opposite to the exposed portion 21A in the Y-axis direction. The first trunk wiring component 41A is connected to one end (the upper side in Figure 4, opposite to the exposed portion 21A side) in the Y-axis direction of all heating wiring 40 located in the display area AA. The pair of second trunk wiring components 41B extend along the Y-axis direction and are adjacent to both sides of the rectangular display area AA that extend along the Y-axis direction, along their entire length. The end of the second trunk wiring component 41B on the exposed portion 21A side is connected to the first heating terminal portion 43, which will be described later.

[0041] As shown in Figure 4, the second trunk wiring 42 is located in the exposed portion 21A of the frame-shaped non-display area NAA. The second trunk wiring 42 extends along the X-axis direction in the exposed portion 21A, and multiple trunk wirings are arranged in a line with spacing in the X-axis direction. Multiple second trunk wirings 42 are arranged in a straight line. The number of second trunk wirings 42 installed is half the total number of rows of touch electrodes 29 arranged along the X-axis direction (8 in Figure 4) (4 in Figure 4). The second trunk wiring 42 is connected to the other end of the multiple heating wirings 40 arranged in the display area AA in the Y-axis direction (the lower side of Figure 4, the exposed portion 21A side). Specifically, one second trunk wiring 42 has multiple heating wirings 40 (6 in Figure 4) superimposed on each of the two rows of touch electrodes 29 arranged consecutively along the X-axis direction. Between two groups of heating wires 40 connected to one second main wiring 42, there is a group of touch wires 30 connected to each touch electrode 29 in a single row. Note that the multiple touch wires 30 include groups of touch wires 30 that are positioned between two second main wiring 42s in the X-axis direction.

[0042] As shown in Figure 4, the first heating terminal section 43 and the second heating terminal section 44 are both provided on the exposed portion 21A of the array substrate 21. More specifically, the first heating terminal section 43 and the second heating terminal section 44 are positioned on the exposed portion 21A in a location that overlaps with the flexible substrate 14, and are connected to a plurality of terminal sections on the flexible substrate 14 via an anisotropic conductive film (ACF).

[0043] As shown in Figure 4, two first heating terminals 43 are arranged at spaced intervals in the X-axis direction on the exposed portion 21A. The two first heating terminals 43 are connected to the ends of the two second trunk wiring components 41B provided on the first trunk wiring 41, on the opposite side in the Y-axis direction from the first trunk wiring component 41A side (the lower side in Figure 4, the exposed portion 21A side). The two first heating terminals 43 are connected to the positive terminals of the power supply IC (DC power supply) 16A, which are connected to the positive terminals of the terminals provided on the flexible substrate 14. Multiple second heating terminals 44 are arranged at spaced intervals in the X-axis direction on the exposed portion 21A. The number of second heating terminals 44 is the same as the number of second trunk wirings 42. Multiple second heating terminals 44 are individually connected to multiple second trunk wirings 42. The second heating terminal section 44 is connected to the end of the second main wiring 42 in the X-axis direction on the array substrate 21. Each of the multiple second heating terminal sections 44 is connected to the negative terminal section of the flexible substrate 14 that is connected to the negative terminal of the power supply IC 16A.

[0044] As shown in Figure 1, the array substrate 21 of the liquid crystal panel 11, configured as described above, is supplied with various signals for displaying images (including image signals), various signals for performing touch panel functions (including touch signals), and power for performing heater functions from the control board 16 via the flexible substrate 14. Specifically, the circuit section 12 on the array substrate 21 is supplied with gate start pulse signals and clock signals, etc., from the control board 16 via the flexible substrate 14. The circuit section 12 sequentially outputs scanning signals to a plurality of gate wirings 26 based on the supplied gate start pulse signals and clock signals, etc. Image signals are supplied to a plurality of source wirings 27 on the array substrate 21 from the driver 15 via the flexible substrate 14. The TFT 24 is driven at the timing when scanning signals are supplied to the gate wirings 26, so that the pixel electrodes 25 can be charged to a potential based on the image signals supplied to the source wirings 27. Furthermore, as previously described, touch signals and common potential signals are supplied to the multiple touch wirings 30 on the array substrate 21 from the touch panel controller 16C via the flexible substrate 14 in a time-division manner.

[0045] As shown in Figures 1 and 4, the positive terminal of the power supply IC 16A of the control board 16 is connected to the first heating terminal section 43 of the array substrate 21 via the flexible substrate 14, and the negative terminal of the power supply IC 16A of the control board 16 is connected to the second heating terminal section 44 via the flexible substrate 14. As a result, based on the potential difference between the first main wiring 41 connected to the first heating terminal section 43 and the second main wiring 42 connected to the second heating terminal section 44, current flows through the multiple heating wires 40 from the first main wiring 41 side to the second main wiring 42 side. As the multiple heating wires 40 are energized, heat is generated from each heating wire 40 according to its respective wiring resistance. The heat generated from the multiple heating wires 40 arranged in the display area AA is transferred to the liquid crystal layer 22, thereby heating the liquid crystal layer 22 in the display area AA. Therefore, even in low-temperature environments, the liquid crystal layer 22 is heated by the heat from the multiple heating wires 40, which allows for a favorable reduction in the viscosity of the liquid crystal layer 22 in the display area AA. This improves the response speed of the liquid crystal panel 11 and enhances the display quality of the image. The amount of current flowing from the power supply IC 16A to the multiple heating wires 40 is controlled based on the temperature detected by the temperature sensor 17.

[0046] As shown in Figure 6, the heating wiring 40 and the touch wiring 30 are arranged superimposed on different source wirings 27 in a planar view. More specifically, the heating wiring 40 and the touch wiring 30 each consist of a portion of the fourth metal film and are arranged superimposed on the upper layer of the source wiring 27, which consists of a portion of the third metal film, via the first planarization film 34. Here, when distinguishing between multiple source wirings 27, the source wiring 27 that superimposes on the touch wiring 30 in a planar view is designated as the "first source wiring" and its designation is denoted with the subscript "α", the source wiring 27 that superimposes on the heating wiring 40 in a planar view is designated as the "second source wiring" and its designation is denoted with the subscript "β", and when referring to them collectively without distinction, no subscript is added to the designation.

[0047] In this way, since the touch wiring 30 and the heating wiring 40 are arranged superimposed on the first source wiring 27α and the second source wiring 27β via the first planarization film 34, respectively, it is possible to maintain a high aperture ratio for each pixel PX while preventing short circuits. Furthermore, since the heating wiring 40 consists of a separate portion of the fourth metal film from the touch wiring 30, the number of metal films can be reduced compared to the case where additional metal films constituting the heating wiring were added. This makes it possible to reduce the number of processes required for manufacturing the liquid crystal panel 11.

[0048] As shown in Figure 4, the touch wiring 30 arranged in the display area AA has its end on the opposite side of the touch electrode 29 to which it is to be connected (the lower side in Figure 4, the exposed area 21A side) extended to the non-display area NAA in the Y-axis direction. In contrast, the exposed area 21A of the array substrate 21 is provided with a touch terminal section (second connection section) 45 that is connected to the touch wiring 30. The touch terminal section 45, like the touch wiring 30 and heating wiring 40, is made up of a part of the fourth metal film. The touch terminal section 45 is provided in the exposed area 21A of the array substrate 21. More specifically, multiple touch terminal sections 45 are arranged in a row at intervals in the X-axis direction on the exposed area 21A. The number of touch terminal sections 45 is the same as the number of touch wiring 30. The touch terminal sections 45 are arranged at intervals in the Y-axis direction relative to the touch wiring 30 to which it is to be connected. The touch terminal portion 45 is positioned in the exposed portion 21A at a distance from the second heating terminal portion 44 in the X-axis direction. Similar to the first heating terminal portion 43 and the second heating terminal portion 44, the touch terminal portion 45 is positioned in the exposed portion 21A in a location that overlaps with the flexible substrate 14, and is connected to the terminal portion provided on the flexible substrate 14 via an anisotropic conductive film. In addition, a source terminal portion (not shown) connected to the end of the source wiring 27 is also positioned in the exposed portion 21A in a location that overlaps with the flexible substrate 14, and the terminal portion provided on the flexible substrate 14 is connected to the source terminal portion via an anisotropic conductive film.

[0049] As shown in Figure 4, a bridge wiring (third connection part) 46 for connecting the touch wiring 30 and the touch terminal part 45 is provided in the non-display area NAA of the array substrate 21. The bridge wiring 46 overlaps the end of the touch wiring 30 on the side opposite to the touch electrode 29 to be connected in the Y-axis direction (lower side in Figure 4) and the end of the touch terminal part 45 on the side of the touch wiring 30 to be connected (upper side in Figure 4), and extends across both ends. The bridge wiring 46 is made up of the same first transparent electrode film as the common electrode 28 (touch electrode 29) and the second intermediate electrode 39. Therefore, as shown in Figure 8, a second planarization film 35 is interposed between the bridge wiring 46 and the touch wiring 30 and the touch terminal part 45. A first bridge contact hole (first contact hole) CHB1 is opened and provided in the second planarization film 35 at a position that overlaps with both the touch wiring 30 and the bridge wiring 46. The touch wiring 30 and the bridge wiring 46 are connected through the first bridge contact hole CHB1 of the second planarization film 35. A second bridge contact hole (second contact hole) CHB2 is provided in the second planarization film 35 at a position that overlaps with both the touch terminal section 45 and the bridge wiring 46. The touch terminal section 45 and the bridge wiring 46 are connected through the second bridge contact hole CHB2 of the second planarization film 35. In this way, the touch wiring 30 extending along the Y-axis in the display area AA is connected to the touch terminal section 45 located in the non-display area NAA via the bridge wiring 46, and is energized via the touch terminal section 45 and the bridge wiring 46.

[0050] Incidentally, as shown in Figure 4, the multiple touch wirings 30 include touch wirings 30 in which a second main wiring 42 is interposed between them and the touch terminal section 45 to be connected, and touch wirings 30 in which a second main wiring 42 is not interposed between them and the touch terminal section 45 to be connected. In the following, when distinguishing between the multiple bridge wirings 46, the bridge wiring 46 connected to the touch wiring 30 in which a second main wiring 42 is interposed between it and the touch terminal section 45 will be referred to as the "first bridge wiring" and its subscript "α" will be added to its symbol, and the bridge wiring 46 connected to the touch wiring 30 in which a second main wiring 42 is not interposed between it and the touch terminal section 45 will be referred to as the "second bridge wiring" and its subscript "β" will be added to its symbol. When referring to them collectively without distinction, no subscript will be added to the symbol. Furthermore, when distinguishing between multiple touch wirings 30 and touch terminals 45, the touch wiring 30 and touch terminals 45 connected to the first bridge wiring 46α are referred to as "first touch wiring and first touch terminal" and the subscript "α" is added to their symbols, and the touch wiring 30 and touch terminals 45 connected to the second bridge wiring 46β are referred to as "first touch wiring and first touch terminal" and the subscript "β" is added to their symbols. When referring to them collectively without distinction, no subscript is added to their symbols.

[0051] As shown in Figures 4 and 8, the first bridge wiring 46α is arranged to cross (straddle) the second main wiring 42 which is interposed between the first touch wiring 30α and the first touch terminal portion 45α. Since the second planarization film 35 is interposed between the first bridge wiring 46α and the second main wiring 42, which are in a crossing relationship, a short circuit between the first bridge wiring 46α and the second main wiring 42 is prevented. By adopting a bridge structure that connects the first touch wiring 30α and the first touch terminal portion 45α to the first bridge wiring 46α, the second main wiring 42, which is made up of a part of the fourth metal film, can be directly connected to the heating wiring 40, which is also made up of a part of the fourth metal film. In other words, a bridge structure is not required to connect the heating wiring 40 and the second main wiring 42. If, for example, the first touch wiring and the first touch terminal were directly connected without using the first bridge wiring 46α, and the second main wiring were divided into two parts, and a bridge structure (a structure in which a bridge wiring consisting of a part of the first transparent electrode film is connected to the two divided parts of the second main wiring) were adopted to connect these divided parts, there would be concerns that contact resistance would occur at the connection point of the bridge structure, resulting in high resistance at that connection point and causing localized and significantly high temperatures. In this embodiment, however, the heating wiring 40 and the second main wiring 42 are directly connected, so contact resistance is avoided. As a result, it becomes less likely that the heating wiring 40 and the second main wiring 42 will reach locally significantly high temperatures.

[0052] On the other hand, as shown in Figure 4, the second bridge wiring 46β does not cross the second main wiring 42 because the second main wiring 42 is not interposed between the second touch wiring 30β and the second touch terminal 45β. In other words, even though there is no problem in directly connecting the second touch wiring 30β and the second touch terminal 45β, the second bridge wiring 46β is deliberately interposed. Thus, the connection structure between the second touch wiring 30β and the second touch terminal 45β is a bridge structure similar to the connection structure between the first touch wiring 30α and the first touch terminal 45α. As a result, the signal degradation that may occur in the signal supplied to the touch electrode 29 by the first touch wiring 30α and the signal supplied to the touch electrode 29 by the second touch wiring 30β becomes equivalent, so that a potential difference is less likely to occur between multiple touch electrodes 29 during the display period, resulting in good display quality, and the sensing sensitivity (position detection sensitivity) is good during the sensing period.

[0053] Furthermore, as shown in Figures 5 and 8, the second intermediate electrode 39 and the bridge wiring 46 are each made up of a portion of the first transparent electrode film. Therefore, in the manufacturing of the liquid crystal panel 11, the bridge wiring 46 can be provided in the same step as patterning the first transparent electrode film to provide the second intermediate electrode 39. This makes it possible to reduce the number of processes required to manufacture the liquid crystal panel 11.

[0054] Furthermore, as shown in Figures 5 and 6, the heating wiring 40 and the first intermediate electrode 38 are each made up of a portion of the fourth metal film. Therefore, in the manufacturing of the liquid crystal panel 11, the heating wiring 40 can be provided in the same step as the patterning of the fourth metal film to provide the first intermediate electrode 38. This makes it possible to reduce the number of processes required to manufacture the liquid crystal panel 11.

[0055] Furthermore, the first planarization film 34 and the second planarization film 35, located on the lower and upper sides of the touch wiring 30 and heating wiring 40, respectively, have a greater film thickness than other insulating films made of inorganic material (including the second interlayer insulating film 36), as shown in Figures 6 and 8. This increases the certainty that the touch wiring 30 is kept insulated from both the touch electrode 29 and the first source wiring 27α, which are not intended to be connected, and also increases the certainty that the heating wiring 40 is kept insulated from both the touch electrode 29 and the second source wiring 27β. As a result, it becomes less likely that the touch wiring 30 will short-circuit with the touch electrode 29 and the first source wiring 27α, which are not intended to be connected, and it also becomes less likely that the heating wiring 40 will short-circuit with the touch electrode 29 and the second source wiring 27β, thereby improving yield.

[0056] Furthermore, the fourth metal film constituting the touch wiring 30 and the heating wiring 40 is preferably a laminated film containing Ti or Mo in its uppermost layer. In this way, as shown in Figure 7, the contact resistance between the touch wiring 30 and the touch electrode 29, which are connected to each other through the touch contact hole CHT, becomes sufficiently low, at about 0.1kΩ to 1kΩ. As a result, the display quality is good during the display period and the sensing sensitivity is good during the sensing period.

[0057] Furthermore, the first heating terminal section 43, the second heating terminal section 44, and the touch terminal section 45 may include metal films other than the fourth metal film or transparent electrode films. In other words, the first heating terminal section 43, the second heating terminal section 44, and the touch terminal section 45 may have a laminated structure of the fourth metal film and other metal films or transparent electrode films.

[0058] As described above, the liquid crystal panel (display device) 11 of this embodiment includes an array substrate (first substrate) 21 having a display area AA on which an image is displayed and a non-display area NAA on which an image is not displayed; a touch wiring (first wiring) 30 arranged in the display area AA of the array substrate 21, extending along a first direction, and consisting of a part of the fourth metal film (first conductive film); a heating wiring 40 arranged in the display area AA of the array substrate 21, extending along a first direction, and consisting of a part of the fourth metal film different from the touch wiring 30; a second trunk wiring (first connection part) 42 arranged in the non-display area NAA of the array substrate 21, extending along a second direction intersecting the first direction, consisting of a part of the fourth metal film different from the touch wiring 30 and the heating wiring 40, and connected to the heating wiring 40; and the second trunk wiring 42 sandwiched between the touch wiring 30 and the heating wiring 40 in the non-display area NAA of the array substrate 21. The array substrate 21 is provided with a touch terminal portion (second connection portion) 45 which is located in a position that overlaps with both the touch wiring 30, heating wiring 40, and second main wiring 42 of the fourth metal film, a second planarization film (first insulating film) 35 which is located on the upper side of the fourth metal film, and a bridge wiring (third connection portion) 46 which is located in the non-display area NAA of the array substrate 21 and is located on the upper side of the second planarization film 35, and which crosses the second main wiring 42 and overlaps with both the touch wiring 30 and the touch terminal portion 45. The second planarization film 35 is provided with a first bridge contact hole (first contact hole) CHB1 which is located in a position that overlaps with both the touch wiring 30 and the bridge wiring 46, and a second bridge contact hole (second contact hole) CHB2 which is located in a position that overlaps with both the touch terminal portion 45 and the bridge wiring 46.

[0059] The heating wiring 40, which extends along the first direction in the display area AA, is connected to the second main wiring 42, which extends along the second direction in the non-display area NAA, and is energized via the second main wiring 42. When the heating wiring 40 is energized, it generates heat, which heats the components of the display area AA. This improves the responsiveness of the liquid crystal panel 11 even when the ambient temperature is low. The touch wiring 30, which extends along the first direction in the display area AA, is connected to the touch terminal section 45 located in the non-display area NAA via bridge wiring 46, and is energized via the touch terminal section 45 and the bridge wiring 46. Between the touch wiring 30, which is made up of a portion of the fourth metal film, and the touch terminal section 45, the second main wiring 42, which is made up of a portion of the fourth metal film, is interposed. In contrast, the bridge wiring 46, which is part of the first transparent electrode film, crosses the second main wiring 42 and is connected to the touch wiring 30 and the touch terminal portion 45 through the first bridge contact hole CHB1 and the second bridge contact hole CHB2 of the second planarization film 35, respectively. This prevents short circuits between the touch wiring 30 and the heating wiring 40. Since the heating wiring 40 and the second main wiring 42 are each made of parts of the fourth metal film and are connected to each other in a direct manner, contact resistance can be avoided compared to the case where the portion made of the first transparent electrode film is connected to the heating wiring 40. As a result, it becomes less likely that the heating wiring 40 and the second main wiring 42 will reach extremely high temperatures locally.

[0060] Furthermore, the device includes a touch electrode (first electrode) 29 that is superimposed on at least a portion of both the touch wiring 30 and the heating wiring 40, is not connected to the heating wiring 40, and is connected to the touch wiring 30. The signal transmitted by the touch wiring 30 is supplied to the touch electrode 29. Since the touch electrode 29 is also superimposed on at least a portion of the heating wiring 40 that is not connected, a sufficient area for forming the touch electrode 29 can be ensured.

[0061] Furthermore, the touch electrode 29 is made from a portion of the first transparent electrode film that is different from the bridge wiring 46, and the second planarization film 35 is provided with a touch contact hole (third contact hole) CHT positioned to overlap both the touch wiring 30 and the touch electrode 29. The touch wiring 30 is connected to the touch electrode 29 through the touch contact hole CHT of the second planarization film 35. The touch electrode 29 is insulated from the heating wiring 40 by the second planarization film 35 interposed between it and the superimposed heating wiring 40.

[0062] Furthermore, the third metal film consists of a second interlayer insulating film (second insulating film) 36 arranged on the upper side of the first transparent electrode film, a pixel electrode 25 which is made up of a part of the second transparent electrode film (third conductive film) arranged on the upper side of the second interlayer insulating film 36 and is arranged superimposed on a part of the touch electrode 29, a first planarization film (third insulating film) 34 arranged on the lower side of the fourth metal film, a source wiring 27 which is made up of a part of the third metal film (fourth conductive film) arranged on the lower side of the first planarization film 34, a source electrode 24B connected to the source wiring 27, and a part of the third metal film that is different from the source wiring 27 and the source electrode 24B. The drain electrode 24C consists of a drain electrode 24C, a first interlayer insulating film (fourth insulating film) 33 disposed on the lower side of the third metal film, a semiconductor portion 24D made of a part of the semiconductor film disposed on the lower side of the first interlayer insulating film 33 and superimposed on the source electrode 24B and the drain electrode 24C, a first intermediate electrode (fourth connection portion) 38 made of a portion of the fourth metal film different from the touch wiring 30, heating wiring 40, second main wiring 42 and touch terminal portion 45 and superimposed on the drain electrode 24C, and bridge wiring 46 and touch electrode 29 of the first transparent electrode film. The touch wiring 30 comprises a second intermediate electrode (fifth connection part) 39 which is made up of different parts and is arranged superimposed on both the first intermediate electrode 38 and the pixel electrode 25, and the touch wiring 30 is configured to transmit at least a common potential signal, and at least the first interlayer insulating film 33 is provided with a source contact hole (fourth contact hole) CHS which is positioned superimposed on both the source electrode 24B and the semiconductor part 24D, and a drain contact hole (fifth contact hole) CHD which is positioned superimposed on both the drain electrode 24C and the semiconductor part 24D. The first planarization film 34 is provided with a first pixel contact hole (sixth contact hole) CHP1 positioned to overlap with both the drain electrode 24C and the first intermediate electrode 38; the second planarization film 35 is provided with a second pixel contact hole (seventh contact hole) CHP2 positioned to overlap with both the first intermediate electrode 38 and the second intermediate electrode 39; and the second interlayer insulating film 36 is provided with a third pixel contact hole (eighth contact hole) CHP3 positioned to overlap with both the second intermediate electrode 39 and the pixel electrode 25.When a channel region is formed in the semiconductor section 24D, the image signal supplied from the source wiring 27 to the source electrode 24B is transmitted to the drain electrode 24C through the channel region. Since the pixel electrode 25 is connected to the drain electrode 24C via the first intermediate electrode 38 and the second intermediate electrode 39, the pixel electrode 25 is charged to the potential related to the image signal transmitted to the drain electrode 24C. When a common potential signal is supplied to the touch electrode 29 by the touch wiring 30, an electric field is generated between the touch electrode 29 and the pixel electrode 25 based on the potential difference between them. Since the heating wiring 40 and the first intermediate electrode 38 each consist of a part of the fourth metal film, the heating wiring 40 can be provided in the process of patterning the fourth metal film to provide the first intermediate electrode 38 during the manufacturing of the liquid crystal panel 11.

[0063] Furthermore, the source wiring 27 extends along the first direction, and multiple source wirings are arranged at intervals in the second direction. The touch wiring 30 is arranged superimposed on the first source wiring 27α included in the multiple source wirings 27, and the heating wiring 40 is arranged superimposed on the second source wiring 27β included in the multiple source wirings 27. Since the touch wiring 30 and the first source wiring 27α are parallel to each other and superimposed, and the heating wiring 40 and the second source wiring 27β are parallel to each other and superimposed, the aperture ratio can be improved.

[0064] Furthermore, the second planarization film 35 and the first planarization film 34 have a greater film thickness than the second interlayer insulating film 36. Since the second planarization film 35 has a greater film thickness than the second interlayer insulating film 36, the reliability of keeping the touch wiring 30 and the touch electrode 29 in an insulated state is increased. Since the first planarization film 34 has a greater film thickness than the second interlayer insulating film 36, the reliability of keeping the touch wiring 30 and the first source wiring 27α in an insulated state is increased, as is the reliability of keeping the heating wiring 40 and the second source wiring 27β in an insulated state. As a result, it becomes less likely for the touch wiring 30 to short-circuit with the touch electrode 29 or the first source wiring 27α, and it becomes less likely for the heating wiring 40 to short-circuit with the touch electrode 29 or the second source wiring 27β, thus improving the yield.

[0065] Furthermore, the touch wiring 30 transmits a common potential signal and a position detection signal in a time-division multiplexed manner. When the common potential signal is supplied by the touch wiring 30, the touch electrode 29 exhibits a display function by generating an electric field between itself and the pixel electrode 25, and when the position detection signal is supplied by the touch wiring 30, it exhibits a position detection function by forming a capacitance with the position input body. Since the formation range of the touch electrode 29 is extended to overlap with at least a portion of the unconnected heating wiring 40, the position detection sensitivity of the touch electrode 29 is improved.

[0066] The array substrate also includes a counter substrate (second substrate) 20 positioned opposite the array substrate 21 with a gap between them, and a liquid crystal layer 22 sandwiched between the array substrate 21 and the counter substrate 20. The liquid crystal layer 22 sandwiched between the array substrate 21 and the counter substrate 20 is heated by the heating wiring 40, thereby improving the response speed. By improving the response speed of the liquid crystal layer 22, the display quality can be improved.

[0067] <Embodiment 2> Embodiment 2 will be described with reference to Figures 9 to 11. This Embodiment 2 shows a case where the positional relationship between the pixel electrode 125 and the common electrode 128 (touch electrode 129) is reversed. Note that redundant explanations of the structure, operation, and effects, which are the same as those described in Embodiment 1, will be omitted.

[0068] In the array substrate 121 according to this embodiment, as shown in Figures 9 and 10, the pixel electrode 125 is made of a part of the first transparent electrode film, and the common electrode 128 (touch electrode 129) is made of a part of the second transparent electrode film. The common electrode 128 has multiple slits 128A opening at positions that overlap with the pixel electrode 125. With this configuration, the TFT 124 has a first intermediate electrode 138 located between the drain electrode 124C, which is made of a part of the third metal film, and the pixel electrode 125, which is made of a part of the first transparent electrode film, but does not have the second intermediate electrode 39 (see Figure 5) described in Embodiment 1. The first intermediate electrode 138, which is made of a part of the fourth metal film, is connected to the drain electrode 124C, which is made of a part of the third metal film, through the first pixel contact hole CHP 101 provided in the first planarization film 134. A portion of the pixel electrode 125 is arranged superimposed on the upper layer of a portion of the first intermediate electrode 138 (the portion that does not overlap with the drain electrode 124C) via the second planarization film 135. The second planarization film 135 has a fourth pixel contact hole (eleventh contact hole) CHP4 opening at a position that overlaps with both the first intermediate electrode 138 and the pixel electrode 125. The pixel electrode 125, which is made up of a portion of the first transparent electrode film, is connected to the first intermediate electrode 138, which is made up of a portion of the fourth metal film, through the fourth pixel contact hole CHP4 of the second planarization film 135.

[0069] As shown in Figure 11, the array substrate 121 according to this embodiment is provided with a third intermediate electrode (sixth connection part) 47 for connecting a touch electrode 129, which is made up of a part of the second transparent electrode film, and a touch wiring 130, which is made up of a part of the fourth metal film. The third intermediate electrode 47 is made up of a part different from the pixel electrode 125 and bridge wiring 46 (see Figure 8) of the first transparent electrode film. The third intermediate electrode 47 is arranged superimposed on a part of the touch wiring 130 on the upper layer side via the second planarization film 135. The third intermediate electrode 47 is arranged superimposed on a part of the touch electrode 129 on the lower layer side via the second interlayer insulating film 136. In the second planarization film 135 interposed between the touch wiring 130 and the third intermediate electrode 47, a first touch contact hole (ninth contact hole) CHT1 is provided with an opening at a position that superimposes both the touch wiring 130 and the third intermediate electrode 47. The touch wiring 130 and the third intermediate electrode 47 are connected to each other through the first touch contact hole CHT1 of the second planarization film 135. In the second interlayer insulating film 136 interposed between the third intermediate electrode 47 and the touch electrode 129, a second touch contact hole (10th contact hole) CHT2 is provided with an opening at a position that overlaps with both the third intermediate electrode 47 and the touch electrode 129. The third intermediate electrode 47 and the touch electrode 129 are connected to each other through the second touch contact hole CHT2 of the second interlayer insulating film 136. In this way, the touch wiring 130 is connected to the touch electrode 129 via the third intermediate electrode 47.

[0070] As described above, according to this embodiment, the device comprises a second interlayer insulating film 136 disposed on the upper side of the first transparent electrode film, and a third intermediate electrode (sixth connection part) 47 which is made from a portion of the first transparent electrode film different from the bridge wiring 46 and is arranged superimposed on a portion of the touch wiring 130 and a portion of the touch electrode 129. The touch electrode 129 is made from a portion of the second transparent electrode film disposed on the upper side of the second interlayer insulating film 136, and the second planarization film 135 is provided with a first touch contact hole (ninth contact hole) CHT1 which is positioned to overlap with both the touch wiring 130 and the third intermediate electrode 47, and the second interlayer insulating film 136 is provided with a second touch contact hole (tenth contact hole) CHT2 which is positioned to overlap with both the third intermediate electrode 47 and the touch electrode 129. The touch wiring 130 is connected to the third intermediate electrode 47 through the first touch contact hole CHT1 of the second planarization film 135. The third intermediate electrode 47 is connected to the touch electrode 129 through the second touch contact hole CHT2 of the second interlayer insulating film 136. In this way, the touch wiring 130 is connected to the touch electrode 129 via the third intermediate electrode 47. The touch electrode 129 is insulated from the superimposed heating wiring 140 by the second planarization film 135 and the second interlayer insulating film 136 interposed between it and the heating wiring 140.

[0071] Furthermore, the pixel electrode 125 consists of a portion of the first transparent electrode film different from the bridge wiring 46 and the third intermediate electrode 47; the first planarization film 134 is arranged superimposed on the pixel electrode 125 and positioned on the lower side of the fourth metal film; the source wiring 127 consists of a portion of the third metal film positioned on the lower side of the first planarization film 134; the source electrode 124B is connected to the source wiring 127; the drain electrode 124C consists of a portion of the third metal film different from the source wiring 127 and the source electrode 124B; the first interlayer insulating film 133 is positioned on the lower side of the third metal film; the semiconductor portion 124D consists of a portion of the semiconductor film positioned below the first interlayer insulating film 133 and is arranged superimposed on the source electrode 124B and the drain electrode 124C; and the touch wiring 130, heating wiring 140, second trunk wiring 142, and touch terminal portion of the fourth metal film. The touch wiring 130 consists of a portion different from 145 and includes a first intermediate electrode 138 that is superimposed on the drain electrode 124C, and transmits at least a common potential signal. The first interlayer insulating film 133 is provided with a source contact hole CHS positioned to superimpose on both the source electrode 124B and the semiconductor portion 124D, and a drain contact hole CHD positioned to superimpose on both the drain electrode 124C and the semiconductor portion 124D. The first planarization film 134 is provided with a first pixel contact hole CHP101 positioned to superimpose on both the drain electrode 124C and the first intermediate electrode 138, and the second planarization film 135 is provided with a fourth pixel contact hole (11th contact hole) CHP4 positioned to superimpose on both the first intermediate electrode 138 and the pixel electrode 125. When a channel region is created in the semiconductor section 124D, the image signal supplied from the source wiring 127 to the source electrode 124B is transmitted to the drain electrode 124C through the channel region. Since the pixel electrode 125 is connected to the drain electrode 124C via the first intermediate electrode 138, the pixel electrode 125 is charged with the potential related to the image signal transmitted to the drain electrode 124C. When a common potential signal is supplied to the touch electrode 129 by the touch wiring 130, an electric field is generated between the touch electrode 129 and the pixel electrode 125 based on the potential difference between them.Since the heating wiring 140 and the first intermediate electrode 138 each consist of a portion of the fourth metal film, the heating wiring 140 can be provided in the process of patterning the fourth metal film to provide the first intermediate electrode 138 during the manufacturing of the liquid crystal panel 11.

[0072] Furthermore, the source wiring 127 extends along a first direction, and multiple source wirings are arranged at intervals in a second direction. The touch wiring 130 is arranged superimposed on the first source wiring 127α included in the multiple source wirings 127, and the heating wiring 140 is arranged superimposed on the second source wiring 127β included in the multiple source wirings 127. Since the touch wiring 130 and the first source wiring 127α are parallel to each other and superimposed, and the heating wiring 140 and the second source wiring 127β are parallel to each other and superimposed, the aperture ratio can be improved.

[0073] Furthermore, the second planarization film 135 and the first planarization film 134 have a greater film thickness than the second interlayer insulating film 136. Since the second planarization film 135 has a greater film thickness than the second interlayer insulating film 136, the likelihood of the touch wiring 130 and the pixel electrode 125 being kept insulated, and the likelihood of the heating wiring 140 and the pixel electrode 125 being kept insulated, is increased. Since the first planarization film 134 has a greater film thickness than the second interlayer insulating film 136, the likelihood of the touch wiring 130 and the first source wiring 127α being kept insulated, and the likelihood of the heating wiring 140 and the second source wiring 127β being kept insulated, is increased. As a result, it becomes less likely that the touch wiring 130 will short-circuit with the pixel electrode 125 or the first source wiring 127α, and it becomes less likely that the heating wiring 140 will short-circuit with the pixel electrode 125 or the second source wiring 127β, thus improving the yield.

[0074] <Other Embodiments> The technology disclosed herein is not limited to the embodiments described above in the description and drawings, but also includes, for example, the following embodiments.

[0075] (1) The second trunk wiring 42,142 may not be located on the exposed portion 21A of the array substrates 21,121, but rather on the portion that overlaps with the opposing substrate 20.

[0076] (2) The length and number of second trunk wirings 42,142 can be changed as appropriate, in addition to what is shown in the figure. As the length of the second trunk wirings 42,142 increases in the X-axis direction, the number of them decreases, and the number of first bridge wirings 46α that intersect with the second trunk wirings 42,142 increases, while the number of second bridge wirings 46β that do not intersect with the second trunk wirings 42,142 tends to decrease.

[0077] (3) In (2) above, the second trunk lines 42,142 may have a length that extends approximately the entire length of the display area AA in the X-axis direction. In this case, all bridge lines 46 intersect with the second trunk lines 42,142. That is, all bridge lines 46 become the first bridge lines 46α.

[0078] (4) The second bridge wiring 46β can be omitted, and the second touch wiring 30β and the second touch terminal section 45β can be directly connected.

[0079] (5) The touch terminals 45, 145 may be positioned offset in the X-axis direction from the touch wirings 30, 130 to which they are connected. In this case, at least a portion of the bridge wiring 46 may be configured to extend along an oblique direction that is inclined with respect to both the X-axis and Y-axis directions.

[0080] (6) The negative terminal of the power supply IC 16A of the control board 16 may be connected to the first heating terminal 43 via the flexible substrate 14, and the positive terminal of the power supply IC 16A of the control board 16 may be connected to the second heating terminal 44 via the flexible substrate 14.

[0081] (7) Instead of the first planarization films 34,134 made of organic material, an insulating film made of inorganic material may be provided.

[0082] (8) Instead of the second planarization film 35,135 made of organic material, an insulating film made of inorganic material may be provided.

[0083] (9) TFT24,124 may also have a bottom gate structure, that is, a structure in which the gate electrode 24A is superimposed on the lower layer side of the semiconductor portion.

[0084] (10) The light-shielding portion 37 may be omitted. In that case, the first metal film may be removed, resulting in three layers of metal film.

[0085] (11) The driver 15 may be mounted on the exposed portion 21A of the array substrate 21, 121 using COG (Chip On Glass). In this case, the touch terminals 45, 145 and the display terminals may be positioned to overlap with the driver 15 and connected to the terminals provided on the driver 15 via an anisotropic conductive film.

[0086] (12) The touch panel controller 16C may be provided on a flexible circuit board 14 or the like.

[0087] (13) The liquid crystal panel 11 may not have a touch panel function. In the liquid crystal panel 11 without a touch panel function, the common electrodes 28, 128 have a non-divided structure. In the case of the non-divided common electrodes 28, 128, the in-plane resistance distribution may be high due to the screen size of the liquid crystal panel 11, etc. In that case, common wiring (first wiring) can be provided on the array substrates 21, 121 using a fourth metal film with a lower sheet resistance than the first transparent electrode film that constitutes the common electrodes (first electrodes) 28, 128. The common wiring, which consists of a part of the fourth metal film, has a configuration almost the same as the touch wiring 30, 130 described above, and is arranged superimposed on the source wiring 27, 127 (first source wiring 27α, 127α) which consists of the third metal film in the display area AA. When applied to the configuration described in Embodiment 1, the common wiring is connected to the common electrode 28, which consists of a part of the first transparent electrode film, through a contact hole formed in the second planarization film 35. When applied to the configuration described in Embodiment 2, an intermediate electrode consisting of a part of the first transparent electrode film is provided, the common wiring is connected to the intermediate electrode through a contact hole formed in the second planarization film 135, and the intermediate electrode is connected to the common electrode 128 through a contact hole formed in the second interlayer insulating film 136. In any case, the third metal film constituting the common wiring has a lower sheet resistance than the first transparent electrode film constituting the common electrodes 28 and 128, so the in-plane resistance distribution at the common electrodes 28 and 128 can be reduced, thereby stably maintaining the common electrodes 28 and 128 at a common potential.

[0088] (14) The circuit section 12 can be omitted. In that case, a gate driver having the same function as the circuit section 12 may be attached to the array substrates 21 and 121. Alternatively, the circuit section 12 may be provided only on one side of the array substrates 21 and 121.

[0089] (15) The semiconductor film material constituting the semiconductor parts 24D and 124D may be amorphous silicon, oxide semiconductor material, or the like.

[0090] (16) The planar shape of the liquid crystal panel 11 may be a vertically elongated rectangle, square, circle, semicircle, oval, ellipse, trapezoid, etc.

[0091] (17) The display mode of the LCD panel 11 may be VA mode, IPS mode, etc., in addition to FFS mode.

[0092] (18) The liquid crystal panel 11 may be of a type other than transmissive, such as a reflective or semi-transmissive type. If the liquid crystal panel 11 is of a reflective type, the backlight device can be omitted.

[0093] (19) A display panel other than the LCD panel 11 (such as an organic EL display panel) may also be used. [Explanation of symbols]

[0094] 11...Liquid crystal panel (display device), 20...Opposite substrate (second substrate), 21,121...Array substrate (first substrate), 22...Liquid crystal layer, 24B,124B...Source electrode, 24C,124C...Drain electrode, 24D,124D...Semiconductor part, 25,125...Pixel electrode, 27,127...Source wiring, 27α,127α...First source wiring, 27β,127β...Second source wiring, 29,129...Touch electrode (first electrode), 30,130...Touch wiring ( 1st wiring), 33,133...1st interlayer insulating film (4th insulating film), 34,134...1st planarization film (3rd insulating film), 35,135...2nd planarization film (1st insulating film), 36,136...2nd interlayer insulating film (2nd insulating film), 38,138...1st intermediate electrode (4th connection part), 39...2nd intermediate electrode (5th connection part), 40,140...heating wiring, 42,142...2nd main wiring (1st connection part), 45,145...touch terminal part (2nd connection part), 46...bridge wiring Line (3rd connection point), 47...3rd intermediate electrode (6th connection point), AA...Display area, CHB1...1st bridge contact hole (1st contact hole), CHB2...2nd bridge contact hole (2nd contact hole), CHD...Drain contact hole (5th contact hole), CHP1, CHP101...1st pixel contact hole (6th contact hole), CHP2...2nd pixel contact hole (7th contact hole), CHP3...3rd pixel contact hole (8th contact hole), CHP4...4th pixel contact hole (11th contact hole), CHS...Source contact hole (4th contact hole), CHT...Touch contact hole (3rd contact hole), CHT1...1st touch contact hole (9th contact hole), CHT2...2nd touch contact hole (10th contact hole), NAA...Non-display area

Claims

1. A first substrate having a display area where an image is displayed and a non-display area where the image is hidden, Distributed in the display area of ​​the first substrate, extending along the first direction, and comprising a first wiring which is part of the first conductive film, A heating wire is arranged in the display area of ​​the first substrate, extends along the first direction, and consists of a portion of the first conductive film that is different from the first wiring, Displaced in the non-display area of ​​the first substrate, extending along a second direction intersecting the first direction, consisting of a portion of the first conductive film different from the first wiring and the heating wiring, and having a first connection portion connected to the heating wiring, In the non-display area of ​​the first substrate, a second connection portion is arranged between the first wiring and the second connection portion, which consists of a portion of the first conductive film different from the first wiring, the heating wiring, and the first connection portion. A first insulating film disposed on the upper layer side of the first conductive film, The first substrate is provided with a third connection portion which is located in the non-display area and is made of a part of the second conductive film located on the upper layer side of the first insulating film, crosses the first connection portion, and overlaps with a part of the first wiring and a part of the second connection portion. A display device provided with a first contact hole located in the first insulating film that overlaps with both the first wiring and the third connection portion, and a second contact hole located in the second connection portion and the third connection portion.

2. The display device according to claim 1, comprising a first electrode that is arranged superimposed on at least a portion of the first wiring and the heating wiring, is not connected to the heating wiring, and is connected to the first wiring.

3. The first electrode consists of a portion of the second conductive film that is different from the third connecting portion. The display device according to claim 2, wherein the first insulating film is provided with a third contact hole positioned to overlap both the first wiring and the first electrode.

4. A second insulating film disposed on the upper side of the second conductive film, A pixel electrode consisting of a part of the third conductive film disposed on the upper layer side of the second insulating film, and superimposed on a part of the first electrode, A third insulating film is disposed on the lower side of the first conductive film, A source wiring consisting of a part of the fourth conductive film disposed on the lower side of the third insulating film, A source electrode connected to the aforementioned source wiring, A drain electrode consisting of a portion of the fourth conductive film that is different from the source wiring and the source electrode, A fourth insulating film is disposed on the lower side of the fourth conductive film, A semiconductor portion consisting of a part of the semiconductor film disposed below the fourth insulating film, and arranged superimposed on the source electrode and the drain electrode, respectively, A fourth connection portion is formed from a portion of the first conductive film that is different from the first wiring, the heating wiring, the first connection portion, and the second connection portion, and is arranged superimposed on the drain electrode, The second conductive film comprises a portion different from the third connecting portion and the first electrode, and a fifth connecting portion which is arranged superimposed on both the fourth connecting portion and the pixel electrode, The first wiring is designed to transmit at least a common potential signal, The fourth insulating film is provided with a fourth contact hole positioned to overlap with both the source electrode and the semiconductor portion, and a fifth contact hole positioned to overlap with both the drain electrode and the semiconductor portion. The third insulating film is provided with a sixth contact hole positioned to overlap both the drain electrode and the fourth connection portion. The first insulating film is provided with a seventh contact hole positioned to overlap both the fourth and fifth connection portions. The display device according to claim 3, wherein the second insulating film is provided with an eighth contact hole positioned to overlap both the fifth connection portion and the pixel electrode.

5. The source wiring extends along the first direction, and multiple sources are arranged at intervals in the second direction. The first wiring is arranged to overlap with the first source wiring included in the plurality of source wirings, The display device according to claim 4, wherein the heating wiring is arranged to overlap with a second source wiring included in a plurality of source wirings.

6. The display device according to claim 5, wherein the first insulating film and the third insulating film have a greater film thickness than the second insulating film.

7. A second insulating film disposed on the upper side of the second conductive film, The device comprises a sixth connection portion which is made of a portion of the second conductive film different from the third connection portion and is arranged superimposed on a portion of the first wiring and a portion of the first electrode, The first electrode consists of a part of the third conductive film disposed on the upper side of the second insulating film. The first insulating film is provided with a ninth contact hole positioned to overlap both the first wiring and the sixth connection portion. The display device according to claim 2, wherein the second insulating film is provided with a tenth contact hole positioned to overlap both the sixth connection portion and the first electrode.

8. A pixel electrode consisting of a portion of the second conductive film different from the third and sixth connection portions, A third insulating film is arranged superimposed on the pixel electrode and positioned on the lower layer side of the first conductive film, A source wiring consisting of a part of the fourth conductive film disposed on the lower side of the third insulating film, A source electrode connected to the aforementioned source wiring, A drain electrode consisting of a portion of the fourth conductive film that is different from the source wiring and the source electrode, A semiconductor portion comprising a fourth insulating film disposed on the lower side of the fourth conductive film, and a part of a semiconductor film disposed on the lower side of the fourth insulating film, and superimposed on the source electrode and the drain electrode, respectively, The first conductive film comprises a fourth connection portion which is made up of a portion different from the first wiring, the heating wiring, the first connection portion and the second connection portion, and is arranged superimposed on the drain electrode, The first wiring is designed to transmit at least a common potential signal, The fourth insulating film is provided with a fourth contact hole positioned to overlap with both the source electrode and the semiconductor portion, and a fifth contact hole positioned to overlap with both the drain electrode and the semiconductor portion. The third insulating film is provided with a sixth contact hole positioned to overlap both the drain electrode and the fourth connection portion. The display device according to claim 7, wherein the first insulating film is provided with an eleventh contact hole positioned to overlap both the fourth connection portion and the pixel electrode.

9. The source wiring extends along the first direction, and multiple sources are arranged at intervals in the second direction. The first wiring is arranged to overlap with the first source wiring included in the plurality of source wirings, The display device according to claim 8, wherein the heating wiring is arranged to overlap with a second source wiring included in a plurality of source wirings.

10. The display device according to claim 9, wherein the first insulating film and the third insulating film have a greater thickness than the second insulating film.

11. The display device according to any one of claims 1 to 10, wherein the first wiring transmits a common potential signal and a position detection signal in a time-division manner.

12. A second substrate is arranged opposite the first substrate with a gap between them, A display device according to any one of claims 1 to 10, comprising a liquid crystal layer sandwiched between the first substrate and the second substrate.

Images