Method for processing a chuck table, method for manufacturing a processed chuck table, method for processing a workpiece, method for manufacturing a processed wafer, and processing apparatus.

Abstract

This invention provides a technology that can reduce thickness variations in a workpiece after processing, particularly for workpieces with polygonal shapes. [Solution] The chuck table has a holding surface for holding a workpiece and is rotatable about a rotation axis intersecting the holding surface, and includes a holding member processing step for processing the holding member that forms the holding surface. In the holding member processing step, the holding member is processed such that the holding surface has an outer peripheral projection shape in which at least a part of the outer peripheral region, which is outside the central region, protrudes in a direction intersecting the extension surface of the extension surface of the central region, which is the part of the holding surface that includes the center.

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