Light-emitting devices and luminaires

Abstract

The present invention provides a light-emitting device capable of obtaining desired light while stably providing an optical functional part, and a lighting fixture including the light-emitting device. [Solution] The optical functional part comprises a substrate, a light-emitting part disposed on the substrate and including a light-emitting layer, which emits light from the light-emitting layer from its upper surface, a base provided to form a gap between itself and the upper surface of the light-emitting part and having an optical element structure that transmits light emitted from the light-emitting part, and a support part extending from the base to the area surrounding the region where the light-emitting part is disposed, and a light-reflecting part having light-reflecting or light-shielding properties that covers the side surface of the light-emitting part and the surface of the support part on the substrate.

Description

Technical Field

[0001] The present invention relates to a light-emitting device including a light-emitting element and a lighting fixture including the light-emitting device.

Background Art

[0002] A light-emitting device using a light-emitting element such as a light-emitting diode (LED) as a light source is known. For example, Patent Document 1 discloses a light-emitting device including a light-emitting element, a wavelength conversion member disposed on the light-emitting element, a light reflection member covering the side surfaces of the light-emitting element and the wavelength conversion member, and an optical function portion disposed on the wavelength conversion member.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the light-emitting device described in Patent Document 1, the optical function portion is provided by being adhered to the upper surface of a light reflection member made of resin. For example, on the surface after disposing and curing uncured resin serving as the light reflection member, there may be depressions, distortions, etc. due to so-called resin sink marks.

[0005] When the optical function portion is adhered to a light reflection member having depressions or distortions on its surface, for example, there is a risk that the optical function portion may be in a posture different from the original desired posture. If such a situation occurs, the optical function portion may cause an optical axis deviation or rotate in the two-dimensional or three-dimensional direction, resulting in poor performance of the optical function, failure to obtain desired light from the light-emitting device, and ultimately a possible decrease in light output.

[0006] The present invention has been made in view of the above-mentioned points, and aims to provide a light-emitting device that can stably provide an optical functional part while obtaining desired light, and a lighting fixture including the light-emitting device. [Means for solving the problem]

[0007] The light-emitting device according to the present invention is characterized by comprising a substrate, a light-emitting part disposed on the substrate and including a light-emitting layer, which emits light from the light-emitting layer from its upper surface, a base provided to form a gap between itself and the upper surface of the light-emitting part and having an optical element structure that transmits light emitted from the light-emitting part, and a support part extending from the base to the area surrounding the region in which the light-emitting part is disposed, and a light-reflecting part having light-reflecting or light-shielding properties that covers the side surface of the light-emitting part and the surface of the support part on the substrate. [Brief explanation of the drawing]

[0008] [Figure 1] This is a top view of the light-emitting device according to Example 1. [Figure 2] This is a cross-sectional view of the light-emitting device according to Example 1. [Figure 3] This is a cross-sectional view showing an example of the manufacturing process of the light-emitting device according to Example 1. [Figure 4] This is a cross-sectional view showing an example of the manufacturing process of the light-emitting device according to Example 1. [Figure 5] This is a cross-sectional view of a light-emitting device according to a modified example 1 of Example 1. [Figure 6] This is a cross-sectional view of a light-emitting device according to a modified example 2 of Example 1. [Figure 7] This is a cross-sectional view of a light-emitting device according to a modified example 3 of Example 1. [Figure 8] This is a top view of the light-emitting device according to a modified example 4 of Example 1. [Figure 9] This is a cross-sectional view of a light-emitting device according to a modified example 5 of Example 1. [Figure 10] This is a top view of the light-emitting device according to modification 6 of Example 1. [Figure 11] This is a cross-sectional view of a lamp used as an application example of the light-emitting device according to Example 1. [Modes for carrying out the invention]

[0009] Embodiments of the present invention will be described in detail below. In the following description and accompanying drawings, substantially identical or equivalent parts are denoted by the same reference numerals.

[0010] [Overview of the light-emitting device 100] The configuration of the light-emitting device 100 according to Embodiment 1 will be described with reference to Figures 1 and 2. Figure 1 is a top view of the light-emitting device 100 according to Embodiment 1. Figure 2 is a cross-sectional view of the light-emitting device 100 shown in Figure 1 along line 2-2.

[0011] The light-emitting device 100 is composed of a substrate 11, a light-emitting element 13 arranged on the substrate 11, a phosphor portion 15 arranged on the light-emitting element 13, an optical function portion 17 arranged on the phosphor portion 15, and a light-reflective member 19.

[0012] In Figure 1, the outline of the light-emitting element 13 is shown with a dashed line, and the recess 21C and support part 22 of the optical function part 17, which will be described later, are shown with a dashed line. In Figure 2, the vertical direction in the figure is the height direction of the light-emitting device 100, and the horizontal direction in the figure is the width direction of the light-emitting device 100.

[0013] [Circuit board 11] The substrate 11 is an insulating structure composed of a flat bottom portion 11A having a rectangular top surface shape and a frame-shaped frame portion 11B formed along the outer edge of the top surface of the bottom portion 11A and exposing the central region of the top surface of the bottom portion 11A. In other words, the substrate 11 is a concave body having a recess with the central region of the top surface of the bottom portion 11A as its bottom surface.

[0014] The substrate 11 is made of a ceramic such as aluminum nitride (AlN) or alumina (Al2O3). The substrate 11 may be formed by integrally forming a bottom portion 11A and a frame portion 11B such that it has a recess opening upwards.

[0015] [Light-emitting element 13] The light-emitting element 13 is a light-emitting diode (LED) having a rectangular upper surface shape and including a semiconductor structure layer having a light-emitting layer formed in a substantially central region on the upper surface of the bottom 11A of the substrate 11.

[0016] In the light-emitting device 100, the light-emitting element 13 is composed of a semiconductor structure layer of a gallium nitride (GaN) system. When the light-emitting element 13 is driven, blue light with a peak wavelength of, for example, 450 nm is emitted from the above-described light-emitting layer.

[0017] The light-emitting element 13 includes a translucent growth substrate (not shown), a semiconductor structure layer formed on the lower surface of the growth substrate, and a pair of element electrodes (not shown) electrically connected to the semiconductor structure layer. Each of the pair of element electrodes is electrically joined to each of a pair of wiring electrodes (not shown) formed on the upper surface of the bottom 11A of the substrate 11. That is, the light-emitting element 13 is flip-chip mounted on the bottom 11A of the substrate 11. Note that the light-emitting element 13 may be mounted via wire bonding.

[0018] The light-emitting element 13 can be energized by receiving power supply from an external power source via a pair of wiring electrodes provided on the substrate 11. When the light-emitting element 13 is driven by receiving power supply, the above-described blue light is emitted from the upper surface of the light-emitting element 13.

[0019] [Phosphor portion 15] The phosphor portion 15 is a phosphor layer having a rectangular upper surface shape and joined to the upper surface of the light-emitting element 13 via a transparent adhesive (not shown). When the light-emitting element 13 is mounted via wire bonding, the lower surface of the phosphor portion 15 is disposed in the light-emitting region of the light-emitting element 13. Here, the light-emitting region refers to the region on the upper surface of the light-emitting element 13 where light is emitted.

[0020] The phosphor portion 15 is formed to taper upward from its bottom surface. Specifically, the phosphor portion 15 is integrally formed by a rectangular prism-shaped lower portion extending vertically from the upper surface of the light-emitting element 13, a truncated square pyramidal middle portion formed on the lower portion and having inclined surfaces on its sides that slope inward, and a rectangular prism-shaped upper portion formed on the middle portion.

[0021] Here, the side surface of the middle portion of the phosphor portion 15 may be a curved inclined surface. In addition to the tapered shape described above, the phosphor portion 15 may also be a three-dimensional shape consisting of rectangular faces, such as a cube or a cuboid.

[0022] The phosphor portion 15 consists of a phosphor that is excited by blue light emitted from the light-emitting element 13 and emits fluorescence. The phosphor portion 15 is, for example, a transparent ceramic phosphor plate made of yttrium aluminum garnet (YAG:Ce) phosphor with cerium (Ce) as an activator.

[0023] In the phosphor portion 15, the fluorescence emitted when the phosphor is excited by blue light has a broad green to orange wavelength range spanning 480 to 700 nm, with a yellow peak wavelength at 520 to 570 nm.

[0024] When blue light emitted from the light-emitting element 13 enters the phosphor portion 15, some of it passes through the phosphor portion 15, while the other portion excites the phosphor, causing fluorescence to be emitted from the excited phosphor.

[0025] Therefore, from the upper surface 15T of the phosphor section 15, excitation light that has passed through the phosphor section 15 without contributing to fluorescence generation and fluorescence emitted from the phosphor are emitted. As a result, white light, which is a mixture of blue light and yellow fluorescence, is emitted from the upper surface 15T of the phosphor section 15. In the light-emitting device 100 of this embodiment, the light-emitting element 13 and the phosphor section 15 function as light-emitting parts.

[0026] A light-transmitting coating layer RE is formed on the upper surface 15T of the phosphor portion 15. The coating layer RE is made of a material that has low affinity with the uncured resin material that will become the light-reflecting member 19 after curing, such as a fluororesin.

[0027] Furthermore, the coating layer RE may be an optical multilayer film or a glass film. The thickness of the coating layer RE can be set to a desired thickness according to the material and application. The coating layer RE can also be formed across the upper surface 15T of the phosphor portion 15 and the upper surface of the light reflecting member 19.

[0028] [Optical function section 17] The optical functional part 17, as an optical element, is a structure arranged on the phosphor part 15 so as to cover the upper surface 15T of the phosphor part 15. The optical functional part 17 consists of a base part 21, a support part 22 that extends downward from the base part 21 and supports the base part 21 with respect to the substrate 11, and a plurality of protrusions 23 formed on the upper surface of the base part 21.

[0029] The base portion 21 of the optical function unit 17 is a translucent plate-like portion having a rectangular upper surface shape. The base portion 21 has a recess 21C in the center of its lower surface, which is recessed compared to the surrounding area. In the light-emitting device 100 of this embodiment, the recess 21C has a rectangular planar shape.

[0030] In the light-emitting device 100, the upper surface 15T of the phosphor portion 15 and the bottom surface 21B of the recess 21C of the base portion 21 are separated. Furthermore, in a top view of the light-emitting device 100, the area of ​​the bottom surface 21B of the recess 21C is larger than the area of ​​the upper surface 15T of the phosphor portion 15. Specifically, the outer edge of the recess 21C is formed to surround the phosphor portion 15.

[0031] The support portion 22 of the optical functional portion 17 extends from a region along the outer edge of the lower surface of the base portion 21 to a region surrounding the area on the upper surface of the bottom portion 11A of the substrate 11 where the light-emitting element 13 is located. In the light-emitting device 100 of this embodiment, the optical functional portion 17 is a plate-shaped portion that has light reflectivity. The support portion 22 supports the base portion 21 by being bonded to the upper surface of the bottom portion 11A of the substrate 11 via an adhesive (not shown) made of silicone resin.

[0032] Furthermore, the support portion 22 is not necessarily located along the outer edge of the base portion 21; the side surface of the support portion 22 may be formed inward or outward from the side surface of the base portion 21. For example, if the support portion 22 is formed outward from the side surface of the base portion 21, it becomes easier to control the height when filling the light-emitting device 100 with the uncured resin-based material that will become the light-reflecting member 19 during manufacturing. On the other hand, if the support portion 22 is formed inward from the side surface of the base portion 21, the rigidity of the optical function portion 17 is increased, and deformation of the optical function portion 17 when mounting the optical function portion 17 during manufacturing of the light-emitting device 100 can be prevented.

[0033] As shown in Figure 1, the support portion 22 is formed in pairs along the extension directions of two sides that extend vertically in the figure on the lower surface of the base portion 21, facing each other. In other words, the support portion 22 is formed to sandwich the light-emitting element 13 and the phosphor portion 15 when viewed from above.

[0034] Furthermore, it is preferable that the support portion 22 has sufficient hardness to prevent damage or breakage due to shrinkage stress associated with the curing of the light-reflecting member 19 when filling the recess in the substrate 11 with an uncured resin-based material that will become the light-reflecting member 19 after curing during the manufacturing of the light-emitting device 100. For example, it is preferable that the support portion 22 has a Shore A hardness of 50 or higher.

[0035] The protrusions 23 of the optical functional section 17 are hemispherical lenses formed on the upper surface of the base 21, with each protruding upward. As shown in Figure 1, the protrusions 23 are arranged on the upper surface of the base 21 in a configuration of, for example, 3 rows and 3 columns, totaling 9 protrusions.

[0036] The configuration of the protrusions 23 is not limited to this; there may be four protrusions arranged in two rows and two columns, or one additional protrusion 23 may be added to the central part of the four protrusions arranged in two rows and two columns. When the protrusions 23 are arranged in two rows and two columns and one protrusion 23 is added to the central part, the light distribution characteristics of the emitted light from the light-emitting device 100 can be adjusted.

[0037] Specifically, for example, the brightness of the light distribution component near 0° with respect to the optical axis perpendicular to the upper surface 15T of the phosphor portion 15 can be reduced relatively with respect to other light distribution components, and the brightness of the light of those other light distribution components can be adjusted to achieve the desired light distribution. In addition, for example, the brightness within the narrow-angle component can be made more uniform.

[0038] Furthermore, the bottom surface 21B of the recess 21C may not be flat, but may have an uneven shape (for example, a moth-eye structure or a microlens structure). This can improve the light extraction efficiency compared to the case where the bottom surface 21B is flat.

[0039] In the light-emitting device 100, the base 21 and the protrusion 23 of the optical functional unit 17 are made of transparent silicone resin (refractive index n=1.41). The support part 22 of the optical functional unit 17 is made of silicone resin containing titanium oxide (TiO2) particles as a material that reflects or scatters blue light and yellow fluorescence. In other words, in the light-emitting device 100, the base 21 and the protrusion 23 of the optical functional unit 17 are translucent, while only the support part 22 is light-reflecting.

[0040] In the light-emitting device 100, the optical functional part 17 is formed by integrally forming a base portion 21, a support portion 22, and a protrusion portion 23. The optical functional part 17 is manufactured, for example, by a so-called two-color molding method in which a primary resin and a secondary resin are combined and integrally molded in a single manufacturing cycle.

[0041] Specifically, for example, the optical functional part 17 is first manufactured by setting a first mold in a movable base mold and filling it with silicone resin as the primary resin to form the base 21 and the convex part 23. Then, the first mold is removed, the base mold is moved and a second mold is set in place and filled with silicone resin containing TiO2 particles as the secondary resin to form the support part 22. This completes the manufacturing of the optical functional part 17.

[0042] In the light-emitting device 100, light emitted from the upper surface 15T of the phosphor portion 15 passes through the recess 21C and enters the base portion 21, and is emitted to the outside of the light-emitting device 100 from each surface of the protrusion 23. In other words, in the light-emitting device 100, each surface of the protrusion 23 of the optical function portion 17 functions as a light-emitting surface.

[0043] [Light-reflecting member 19] The light-reflecting member 19 is a light-reflecting member formed in a recess of the substrate 11. The light-reflecting member 19 is filled in such a way that it covers the respective sides of the light-emitting element 13 and the phosphor portion 15, and the surface of the support portion 22 of the optical function portion 17, while exposing the upper surface 15T of the phosphor portion 15.

[0044] Therefore, in the light-emitting device 100, only the light-reflecting support portion 22 of the optical functional portion 17 is covered by the light-reflecting member 19, while the light-transmitting base portion 21 and convex portion 23 are exposed from the light-reflecting member 19.

[0045] In the light-emitting device 100, the light-reflecting member 19 and the lower surface of the base 21 of the optical function unit 17 are in contact with each other. However, the upper surface of the light-reflecting member 19 and the lower surface of the base 21 do not necessarily have to be in contact with each other. For example, if a depression is created on the surface of the light-reflecting member 19 due to resin shrinkage during curing, the upper surface of the light-reflecting member 19 and the lower surface of the base 21 may be separated from each other by this depression.

[0046] The light-reflecting member 19 is made of a material that reflects blue light emitted from the light-emitting element 13 and yellow fluorescence emitted from the phosphor portion 15. The light-reflecting member 19 is made of, for example, a silicone resin containing TiO2 particles.

[0047] The light-reflecting member 19 reflects or scatters the light emitted from the light-emitting element 13 and the phosphor portion 15 that reaches the respective sides of the light-emitting element 13 and the phosphor portion 15. As a result, the light-reflecting member 19 can suppress the leakage of light that reaches the respective sides of the light-emitting element 13 and the phosphor portion 15 to the outside of the light-emitting device 100.

[0048] In the region of the upper surface of the light-reflecting member 19 that is outside the base portion 21, a light-reflecting member 24 is formed, which has a frame-shaped upper surface and covers the outer surface of the base portion 21. The light-reflecting member 24 is made of a silicone resin containing TiO2 particles, similar to the light-reflecting member 19.

[0049] The light-reflecting member 24 reflects or scatters the light that reaches the outer surface of the base 21 when the light emitted from the phosphor portion 15 is guided to the base portion 21 in the left-right direction in Figure 2. This prevents the light that reaches the outer surface of the base portion 21 from leaking out of the light-emitting device 100.

[0050] Furthermore, the amount of TiO2 particles contained in the resin of the light-reflecting member 19 and the light-reflecting member 24 may be varied. For example, the amount of TiO2 particles in the light-reflecting member 19, which is in direct contact with the light-emitting element 13 and the phosphor portion 15, may be increased compared to that of the light-reflecting member 24, thereby increasing the light reflectivity of the light-reflecting member 19.

[0051] In the light-emitting device 100, as described above, a coating layer RE made of a material with low affinity to the uncured resin material constituting the light-reflecting member 19 is formed over the upper surface 15T of the phosphor portion 15.

[0052] Therefore, in the light-emitting device 100, when the uncured resin material that will become the light-reflecting member 19 after curing is filled into the recess of the substrate 11, even if the filled resin creeps up onto the upper surface 15T of the phosphor portion 15, the coating layer RE will be able to repel it.

[0053] Therefore, it is possible to prevent uncured resin material from remaining on the upper surface 15T of the phosphor portion 15, which would then harden and form a light-reflecting member 19 on the upper surface 15T of the phosphor portion 15. In other words, it is possible to prevent the light-emitting surface of the phosphor portion 15 from being blocked by the light-reflecting member 19.

[0054] [Regarding the light emitted from the light-emitting device 100] Here, the light emitted from the light-emitting device 100 of this embodiment will be described. In the light-emitting device 100, as described above, a recess 21C is formed on the lower surface of the base 21, and the upper surface 15T of the phosphor portion 15 and the bottom surface 21B of the recess 21C of the base 21 are separated.

[0055] Therefore, a gap is formed between the upper surface 15T of the phosphor portion 15 and the bottom surface 21B of the recess 21C of the base portion 21. In the light-emitting device 100 of this embodiment, the formed gap is filled with air (refractive index n=1.0).

[0056] Here, the gap formed between the upper surface 15T of the phosphor portion 15 and the bottom surface 21B of the recess 21C of the base portion 21 becomes a low refractive index region with a relatively lower refractive index than the base portion 21 and the convex portion 23 of the optical functional portion 17 for light emitted from the upper surface 15T of the phosphor portion 15. In other words, light emitted from the upper surface 15T of the phosphor portion 15 enters the optical functional portion 17, which has a higher refractive index than the gap, through the gap, which is a low refractive index region.

[0057] As shown by the dashed line in Figure 2, the light emitted from the upper surface 15T of the phosphor portion 15 is narrowed in the direction of the optical axis, which is perpendicular to the bottom surface 21B of the recess 21C of the base portion 21, according to Snell's law, and then incident on the convex portion 23. Therefore, by providing an air gap between the upper surface 15T of the phosphor portion 15 and the bottom surface 21B of the recess 21C of the optical function portion 17, it is possible to increase the narrow-angle component of the light emitted from the light-emitting device 100.

[0058] In this embodiment, the narrow-angle component of the light emitted from the light-emitting device 100 refers to the component of light emitted within a range of 30° or less with respect to the optical axis direction, which is perpendicular to the upper surface 15T of the phosphor portion 15.

[0059] In the light-emitting device 100, the light containing the aforementioned narrow-angle component that is incident on the protrusion 23 is further narrowed by the lens effect of the surface of the protrusion 23, as shown by the dashed line in Figure 2, and then emitted from the light-emitting device 100.

[0060] Therefore, in the light-emitting device 100 of this embodiment, the narrow-angle component of the light emitted from the light-emitting device 100 can be increased by providing an air gap (low refractive index portion) between the upper surface 15T of the phosphor portion 15 and the bottom surface 21B of the recess 21C of the base portion 21 of the optical function portion 17, and by providing a convex portion 23 on the upper surface of the base portion 21.

[0061] [Suppression of the decrease in light output of the light-emitting device 100] The following describes how to suppress the decrease in light output of the light-emitting device 100 in this embodiment. In the light-emitting device 100 of this embodiment, as described above, the support portion 22 of the optical function unit 17 is joined to the upper surface of the bottom portion 11A of the substrate 11.

[0062] Here, we consider the case where the optical functional part 17 is not provided with a support part 22, and the base part 21 of the optical functional part 17 is joined to the light-reflecting member 19 via an adhesive. In this case, the uncured resin material, which will become the light-reflecting member 19 after curing, is filled into the recess of the substrate 11, and after curing it to form the light-reflecting member 19, the optical functional part 17 is joined to the formed light-reflecting member 19.

[0063] When the uncured resin material described above hardens, shrinkage during the hardening process can cause dents, distortions, and other defects on the surface of the light-reflecting member 19 formed after hardening. In other words, the surface of the light-reflecting member 19 is no longer flat.

[0064] When the optical function unit 17 is bonded to the light-reflecting member 19 having such a surface via an adhesive, the optical function unit 17 may end up in a position different from the intended mounting position. For example, the optical function unit 17 may be bonded with the bottom surface 21B of the recess 21C of the base 21 tilted relative to the top surface 15T of the phosphor part 15, or distortion (bending) may occur in the recess 21C. In other words, the mounting accuracy of the optical function unit 17 may become unstable.

[0065] When such problems occur, for example, the narrow-angle component of the emitted light described above may not be obtained, or unexpected scattering or diffusion may occur due to the optical function unit 17. As a result, the desired light may not be obtained from the light-emitting device 100, which may lead to a decrease in light output.

[0066] In the light-emitting device 100 of this embodiment, as described above, the support portion 22 of the optical functional portion 17 is joined to the upper surface of the bottom portion 11A of the substrate 11, which is a smooth surface. In other words, in the light-emitting device 100 of this embodiment, the optical functional portion 17 can be provided regardless of the surface properties of the formed light-reflecting member 19.

[0067] Therefore, with the light-emitting device 100 of this embodiment, the optical function unit 17 can be mounted more stably compared to the case where the base 21 is joined to the light-reflecting member 19, and it is possible to suppress the influence of changes in orientation on the light emitted from the light-emitting device 100.

[0068] Therefore, according to the light-emitting device 100 of this embodiment, the optical function unit 17 can be stably provided, and as a result, the desired light can be obtained, and for example, a decrease in the narrow-angle component light output of the light-emitting device 100 can be suppressed.

[0069] Furthermore, for example, when joining the base 21 of the optical functional part 17 to the light reflective member 19 via adhesive, there is a possibility that the adhesive used for joining may extend to the upper surface 15T of the phosphor part 15. In other words, there is a risk that the adhesive used to join the base 21 to the light reflective member 19 may seep into the aforementioned void.

[0070] Furthermore, if, for example, silicone resin is used as the adhesive, the silicone oil from the silicone resin may seep out due to the aging of the adhesive, and this seeped-out silicone oil may extend to the upper surface 15T of the phosphor portion 15.

[0071] When this happens, the adhesive itself or the silicone oil seeping out from the adhesive may block at least a portion of the upper surface 15T of the phosphor section 15. Furthermore, if the seeped silicone oil extends from the upper surface 15T to the bottom surface 21B of the phosphor section 15, it may change the optical path of the emitted light, potentially preventing the desired light from being obtained from the light-emitting device 100.

[0072] In the light-emitting device 100 of this embodiment, as described above, by joining the support portion 22 of the optical function portion 17 to the upper surface of the bottom portion 11A of the substrate 11, which is a smooth surface, deterioration of light distribution performance due to adhesives or silicone oil can be prevented.

[0073] In this embodiment of the light-emitting device 100, the support portion 22 of the optical function unit 17 only needs to be capable of supporting the base portion 21 and does not necessarily need to be light-reflecting. That is, the support portion 22 may be made of, for example, only transparent silicone resin.

[0074] Furthermore, the support portion 22 does not necessarily have to be joined to the upper surface of the bottom portion 11A of the substrate 11. For example, a plate-shaped member that protrudes inward may be provided on the inner surface of the frame portion 11B, and the support portion 22 may be joined to the upper surface of the plate-shaped member. In other words, a separate plate-shaped member may be provided for joining the support portion 22.

[0075] In the light-emitting device 100 of this embodiment, the shape of the support portion 22 is not limited to a plate shape, but may have a columnar shape such as a cylindrical or rectangular prism. Also, the number of support portions 22 is not particularly limited as long as they can support the base portion 21 with respect to the substrate 11.

[0076] Furthermore, in the light-emitting device 100 of this embodiment, the support portion 22 may be formed continuously along all four sides of the lower surface of the base portion 21. In this case, it is preferable to provide an opening in at least a part of the support portion 22 that allows resin to flow in, so that the uncured resin material, which will become the light-reflecting member 19 after curing, can be filled into the interior surrounded by the support portion 22.

[0077] In the light-emitting device 100 of this embodiment, the optical functional part 17 is assumed to be formed by integrally forming the base 21, support 22, and protrusion 23, but it is not limited to this. For example, the base 21, support 22, and protrusion 23 may be molded separately and then joined together to manufacture the optical functional part 17.

[0078] In this embodiment of the light-emitting device 100, a phosphor portion 15 is formed on the upper surface of the light-emitting element 13, but the phosphor portion 15 is not necessarily required. For example, if only blue light is to be emitted from the light-emitting device 100, only the light-emitting element 13 may be provided on the substrate 11.

[0079] In the light-emitting device 100 of this embodiment, a protrusion 23 is provided on the base 21 of the optical function unit 17, but it is not necessary for it to be provided as long as it is capable of transmitting light. Also, as mentioned above, the number of protrusions 23 may be nine or more or nine or less, and for example, one protrusion 23 may be arranged to cover the upper surface 15T of the phosphor unit 15.

[0080] In the light-emitting device 100 of this embodiment, a coating layer RE is not necessarily required to be formed on the upper surface of the phosphor portion 15. That is, the upper surface of the phosphor portion 15 may be exposed from the light-reflecting member 19.

[0081] In the light-emitting device 100 of this embodiment, light-reflecting members 19 may be formed in advance on the sides of the middle and upper portions of the phosphor portion 15, and the phosphor portion 15, which is shaped like a rectangular parallelepiped overall, may be placed on the light-emitting element 13. Subsequently, additional light-reflecting members 19 may be formed to cover the already provided light-reflecting members 19 and the lower portion of the phosphor portion 15.

[0082] In the light-emitting device 100 of this embodiment, the light-reflecting members 19 and 24 may have light-shielding properties instead of light-reflecting properties. That is, the light-reflecting members 19 and 24 should be configured to suppress light that reaches the outer surface of the light-emitting element 13, the phosphor portion 15, and the base portion 21 from leaking out of the light-emitting device 100. Alternatively, the frame portion 11B may be omitted, and the side surfaces of the light-reflecting member 19 and the substrate 11 may be formed to become the side surfaces of the light-emitting device 100.

[0083] [Manufacturing method for light-emitting device 100] Here, the manufacturing method of the light-emitting device 100 in this embodiment will be described using Figures 3 and 4. Figures 3 and 4 are cross-sectional views showing an example of the manufacturing process of the light-emitting device 100. In the following, the bonding of the optical functional part 17 to the substrate 11 and the formation of the light-reflecting member 19 will be described in particular.

[0084] First, as shown in Figure 3, a light-emitting element 13 is mounted on the upper surface of the bottom 11A of the substrate 11, and a phosphor portion 15 with a pre-formed coating layer RE on its upper surface is placed on top of the mounted light-emitting element 13. The light-emitting element 13 and the phosphor portion 15 are bonded together with a transparent adhesive, for example, as described above.

[0085] Next, as shown in Figure 4, the support portion 22 of the optical function portion 17 is attached using adhesive to the area surrounding the region on the upper surface of the bottom portion 11A of the substrate 11 where the light-emitting element 13 is mounted. At this time, the optical function portion 17 is positioned so that, in a top view, the protrusion portion 23 of the optical function portion 17 covers the entire upper surface 15T of the phosphor portion 15.

[0086] Next, an uncured resin material, which will become the light-reflecting member 19 after curing, is filled into the space SP within the recess of the substrate 11, excluding the support portion 22 for the light-emitting element 13, the phosphor portion 15, and the optical function portion 17, and the light-reflecting member 19 is formed by heating and curing this material.

[0087] Finally, a light-reflecting member 24 is formed in the region of the upper surface of the light-reflecting member 19 that is outside the base portion 21, so as to cover the outer surface of the base portion 21. The light-reflecting member 24 is formed, for example, by potting an uncured resin material that will become the light-reflecting member 24 after curing, followed by heat curing, or by molding using a mold.

[0088] [Example 1] Below, a modification 1 of Example 1 will be described with reference to Figure 5. Figure 5 is a cross-sectional view of the light-emitting device 110 according to Modification 1. The light-emitting device 110 differs from the light-emitting device 100 of Example 1 in the configuration of the optical function unit 17, but is otherwise the same as the light-emitting device 100.

[0089] In the modified light-emitting device 110, the optical function unit 17 consists of a flat base 21, support parts 22 provided on each of the opposing sides of the base 21, and a plurality of protrusions 23 provided on the upper surface of the base 21.

[0090] In this modified light-emitting device 110, the support portion 22 of the optical function portion 17 is composed of a first portion 22A extending laterally from the side surface of the base portion 21 and a second portion 22B extending toward the bottom portion 11A of the substrate 11 from a region along the outer edge of the lower surface of the first portion 22A.

[0091] In this modified light-emitting device 110, the first portion 22A has a flat plate shape, and the second portion 22B has a flat plate shape perpendicular to the main surface of the first portion 22A. Therefore, the support portion 22 has an L-shaped cross-section.

[0092] In this modified light-emitting device 110, the first portion 22A of the support portion 22 has an upper surface that is at the same height as the upper surface of the base portion 21 and has a greater thickness than the base portion 21. Therefore, in the light-emitting device 110, a recess 21C is formed by the lower surface of the base portion 21 and the inner surface of the first portion 22A of the support portion 22.

[0093] In this modified example, the second portion 22B of the support portion 22 is bonded to the upper surface of the bottom portion 11A of the substrate 11. Therefore, with the light-emitting device 110 of this modified example, the desired light can be obtained while stably mounting the optical function portion 17, similar to Example 1.

[0094] [Differentiation 2] A modified example 2 of Example 1 will be described below with reference to Figure 6. Figure 6 is a cross-sectional view of the light-emitting device 120 according to Modified Example 2. The light-emitting device 120 differs from the light-emitting device 100 of Example 1 in the configuration of the optical function unit 17, but is otherwise the same as the light-emitting device 100.

[0095] In the modified light-emitting device 120, the optical function unit 17 is composed of a flat base 21, a support portion 22 provided in a region along the outer edge of the lower surface of the base 21, and a plurality of protrusions 23 provided on the upper surface of the base 21.

[0096] In this modified light-emitting device 120, the support portion 22 of the optical function portion 17 is composed of a first portion 22A that extends laterally from a region along the outer edge of the lower surface of the base portion 21, and a second portion 22B that extends toward the bottom portion 11A of the substrate 11 from a region along the outer edge of the lower surface of the first portion 22A.

[0097] In this modified light-emitting device 120, the first portion 22A has a flat plate shape, and the second portion 22B has a flat plate shape perpendicular to the main surface of the first portion 22A. Therefore, the support portion 22 has an L-shaped cross-section.

[0098] In this modified light-emitting device 120, a recess 21C is formed by the lower surface of the base 21 and the inner surface of the first portion 22A of the support 22. In this modified light-emitting device 120, a frame-shaped light-reflecting member 24 having light reflectivity is formed on the side surface of the base 21, similar to the first embodiment.

[0099] In this modified example, the second portion 22B of the support portion 22 is bonded to the upper surface of the bottom portion 11A of the substrate 11. Therefore, with the light-emitting device 120 of this modified example, the desired light can be obtained while stably mounting the optical function portion 17, similar to Example 1.

[0100] Furthermore, the light-reflecting member 24 may be formed continuously from the side surface of the base portion 21 to the end of the upper surface of the first portion 22A, or it may be formed continuously to the upper surface of the light-reflecting member 19 or the upper surface of the frame portion 11B. This allows light (stray light) guided to the support portion 22 to be reflected, for example, in the direction of the convex portion 23, thereby improving the light output.

[0101] [Difference 3] A third modification of Example 1 will be described below with reference to Figure 7. Figure 7 is a cross-sectional view of the light-emitting device 130 according to the third modification. The light-emitting device 130 differs from the light-emitting device 100 of Example 1 in the configuration of the optical function unit 17, but is otherwise similar to the light-emitting device 100.

[0102] In the modified light-emitting device 130, the optical function unit 17 consists of a flat base 21, a support portion 22 provided in a region along the outer edge of the lower surface of the base 21, and a plurality of protrusions 23 provided on the upper surface of the base 21.

[0103] In this modified light-emitting device 130, the support portion 22 of the optical function unit 17 extends downward from a region along the outer edge of the lower surface of the base 21 toward the bottom 11A. Therefore, only the portion of the support portion 22 that is exposed from the light-reflecting member 19 is connected to the lower surface of the base 21.

[0104] In this modified light-emitting device 130, a recess 21C is formed between the lower surface of the base 21 and the portion of the support 22 that is exposed from the light-reflecting member 19. In this modified light-emitting device 130, a frame-shaped light-reflecting member 24 is formed on the side surface of the base 21 and the side surface of the portion of the support 22 that is exposed from the light-reflecting member 19, similar to Embodiment 1.

[0105] In this modified example, the support portion 22 is bonded to the upper surface of the bottom portion 11A of the substrate 11, similar to the first example. Therefore, with the light-emitting device 130 of this modified example, the desired light can be obtained while stably mounting the optical function portion 17, similar to the first example.

[0106] [Differentiation Example 4] Below, a modification 4 of Example 1 will be described with reference to Figure 8. Figure 8 is a top view of the light-emitting device 140 according to modification 4. The light-emitting device 140 differs from the light-emitting device 100 of Example 1 in the formation of the support portion 22 of the optical function portion 17, but is otherwise similar to the light-emitting device 100.

[0107] In this modified light-emitting device 140, the support portions 22 of the optical function unit 17 are provided in the central region of each side in the region along the outer edge of the lower surface of the base 21, as shown in Figure 8. That is, one support portion 22 is provided on each side of the lower surface of the base 21 such that the support portions 22 face each other in the vertical and horizontal directions in the figure.

[0108] In this modified example, the support portion 22 is bonded to the upper surface of the bottom portion 11A of the substrate 11, similar to the first example. Therefore, with the light-emitting device 140 of this modified example, the desired light can be obtained while stably mounting the optical function portion 17, similar to the first example.

[0109] [Difference 5] The following describes Modification 5 of Example 1 with reference to Figure 9. Figure 9 is a cross-sectional view of the light-emitting device 150 according to Modification 5. The light-emitting device 150 is similar to the light-emitting device 100 of Example 1 in all other respects, except that the shape of the phosphor portion 15 is different.

[0110] In this modified light-emitting device 150, the phosphor portion 15 is a rectangular parallelepiped phosphor layer having a rectangular top surface. In this modified light-emitting device 150, the base portion 21 of the optical function portion 17 is provided such that a part of its lower surface is in contact with the upper surface 15T of the phosphor portion 15.

[0111] In this modified example, the support portion 22 is bonded to the upper surface of the bottom portion 11A of the substrate 11, similar to the first example. Therefore, with the light-emitting device 150 of this modified example, the desired light can be obtained while stably mounting the optical function portion 17, similar to the first example.

[0112] In this modified light-emitting device 150, the coating layer RE is formed in the central region of the upper surface of the phosphor portion 15, but the size of the coating layer RE may be changed as appropriate. For example, the coating layer RE may be formed over the entire upper surface of the phosphor portion 15.

[0113] [Modification 6] Below, a modification 6 of Example 1 will be described with reference to Figure 10. Figure 10 is a top view of the light-emitting device 160 according to modification 5. The light-emitting device 160 differs from the light-emitting device 100 of Example 1 in that the configuration of the optical function unit 17 and the light-reflecting member 19 are not formed, but it is the same as the light-emitting device 100 in all other respects.

[0114] In this modified light-emitting device 160, the support portion 22 of the optical function unit 17 has a frame-shaped upper surface. That is, in the light-emitting device 160, the light-emitting element 13 and the phosphor portion 15 are surrounded by the support portion 22 of the optical function unit 17.

[0115] Furthermore, in the modified light-emitting device 160, the light-reflecting member 19 is not formed in the recess of the substrate 11. Therefore, the light emitted from the light-emitting element 13 and the phosphor portion 15 that reaches the respective sides of the light-emitting element 13 and the phosphor portion 15 is emitted from those sides.

[0116] In the modified light-emitting device 160, a light-reflective support portion 22 surrounds the sides of the light-emitting element 13 and the phosphor portion 15. Therefore, the light emitted from each side of the light-emitting element 13 and the phosphor portion 15 is reflected or scattered by the support portion 22.

[0117] Therefore, in the light-emitting device 160 of this modified example, even if the light-reflecting member 19 is not formed in the recess of the substrate 11, it is possible to suppress the leakage of light emitted from the sides of the light-emitting element 13 and the phosphor portion 15 to the outside of the light-emitting device 160.

[0118] Furthermore, in this modified example, the support portion 22 is bonded to the upper surface of the bottom portion 11A of the substrate 11, similar to Example 1. Therefore, with the light-emitting device 160 of this modified example, the desired light can be obtained while stably mounting the optical function portion 17, similar to Example 1.

[0119] [Application examples of the light-emitting device 100] The following describes an application example of the light-emitting device 100 of Example 1 with reference to Figure 11. Figure 11 is a cross-sectional view of a lamp 200 as an application example of the light-emitting device 100. The lamp 200 is a vehicle lamp used, for example, as a headlight for a vehicle.

[0120] The luminaire 200 comprises a housing 30, a lamp unit 31 and a power supply unit 32 located within the housing 30. The lamp unit 31 comprises a light-emitting module 34 including a light-emitting device 100, a light-gathering mirror 35 and a projection lens 36.

[0121] In the luminaire 200, the light-emitting device 100 receives power from the power supply unit 32 and emits light (diffuse light) upward in the figure. The light emitted from the light-emitting device 100 is incident on the condensing mirror 35 and is focused to a single focal point by the condensing mirror 35.

[0122] The lamp unit 31 has a shade SH for forming a passing beam light distribution (so-called low beam or high beam) in an automobile headlight. The shade SH is configured to partially reflect the light focused by the focusing mirror 35 toward the projection lens 36.

[0123] Light transmitted through the projection lens 36 via the shade SH is emitted to the outside of the luminaire 200 via a translucent outer lens 39 provided in the housing 30. By incorporating the light-emitting device 100 in this embodiment into the luminaire 200 in this way, it is possible to utilize the narrow-angle light distribution described above.

[0124] In addition, although the above describes a projection-type optical system in which light is focused onto the projection lens 36 by a focusing mirror 35, a direct projection type optical system (also called a direct-projection type) (not shown) may also be used, in which light from the light-emitting device 100 is directly incident on the projection lens without going through the focusing mirror 35. [Explanation of symbols]

[0125] 100, 110, 120, 130, 140, 150, 160 Light-emitting devices 200 Lights 11 circuit boards 13 Light-emitting element 15. Phosphor section 17 Optical function section 19, 24 Light-reflecting members 21 Base 22 Support part 23 Convex part

Claims

1. circuit board and A light-emitting unit is provided on the substrate and includes a light-emitting element that includes a light-emitting layer, and emits light from the light-emitting layer from the upper surface, An optical functional part having a base that is provided to form a gap between itself and the upper surface of the light-emitting part and has an optical element structure that transmits light emitted from the light-emitting part, and a support part that extends from the base to the area surrounding the region in which the light-emitting element is arranged, A light-reflecting portion having light-reflecting or light-shielding properties covers the side surface of the light-emitting portion and the surface of the support portion on the substrate, A light-emitting device characterized by having the following features.

2. The light-emitting device according to claim 1, characterized in that the support portion has light reflectivity.

3. The light-emitting device according to claim 2, characterized in that the support portion is formed of a material comprising titanium oxide particles in a transparent silicone resin.

4. The light-emitting device according to any one of claims 1 to 3, characterized in that the base has a recess in the center of its lower surface that is recessed compared to the surrounding area, and the bottom surface of the recess and the upper surface of the light-emitting portion are separated.

5. The light-emitting device according to any one of claims 1 to 3, characterized in that the support portion is a support body that extends above the upper surface of the light-emitting portion, and supports the base portion such that the upper surface of the light-emitting portion and the lower surface of the base portion are separated.

6. The light-emitting device according to any one of claims 1 to 3, characterized in that the support portion extends to two regions located so as to sandwich the region on the upper surface of the substrate where the light-emitting portion is arranged.

7. The light-emitting device according to any one of claims 1 to 3, characterized in that the base portion has a lens formed on the upper surface of the base portion.

8. The light-emitting device according to any one of claims 1 to 3, characterized in that the light-emitting portion has a phosphor portion formed on the light-emitting element and which emits fluorescence when excited by light emitted from the light-emitting layer.

9. The light-emitting device according to claim 8, characterized in that a translucent coating layer made of a material with low affinity to the uncured resin that will become the light-reflecting portion after curing is formed on the upper surface of the phosphor portion.

10. circuit board and A light-emitting unit is provided on the substrate and includes a light-emitting element that includes a light-emitting layer, and emits light from the light-emitting layer from the upper surface, An optical functional part having a base that is provided to form a gap between itself and the upper surface of the light-emitting part and has an optical element structure that transmits light emitted from the light-emitting part, and a light-reflecting support part that extends from the base to the area surrounding the region on the upper surface of the substrate where the light-emitting part is located, A light-emitting device characterized by having the following features.

11. A light-emitting device comprising a substrate, a light-emitting portion comprising a light-emitting element disposed on the substrate and including a light-emitting layer, which emits light from the light-emitting layer from its upper surface, a base portion having an optical element structure which has a recess in the center of its lower surface that is recessed compared to its surroundings, and which is provided such that the bottom surface of the recess and the upper surface of the light-emitting portion are separated to form a gap between them and the upper surface of the light-emitting portion, and which transmits light emitted from the light-emitting portion, and a support portion which extends from the base portion to the region surrounding the region in which the light-emitting element is disposed, and a light-reflecting portion which is a light-reflective portion that covers the side surface of the light-emitting portion on the substrate, and a light-emitting module comprising a projection lens which distributes the light emitted from the light-emitting device, A housing that covers the light-emitting module and includes an outer lens that transmits light emitted from the light-emitting device, A lighting fixture characterized by having the following features.

12. The lamp according to claim 11, further comprising a phosphor portion formed on the light-emitting element and containing a phosphor that is excited by light emitted from the light-emitting layer and emits fluorescence.

Images