Film deposition apparatus, conductive film manufacturing apparatus, and film deposition method
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- NIKON CORP
- Filing Date
- 2026-02-26
- Publication Date
- 2026-06-09
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Figure 2026094269000001_ABST
Abstract
Claims
[Claim 1] A film-forming apparatus that supplies a mist containing fine particles to a substrate and forms a film containing the fine particles on the surface of the substrate, An air guide member covering at least a portion of the surface of the substrate, The system includes a mist supply unit that supplies the mist into the space between the surface of the substrate and the air guide member, The mist supply unit includes a charge-applying unit that positively or negatively charges the mist, and a mist ejection unit that ejects the mist charged by the charge-applying unit into the space. The air guide member has a wall surface facing the surface of the substrate, A film deposition apparatus comprising an electrostatic field generating unit that generates an electrostatic field on the wall surface having the same sign as the mist that is charged by the charge-applying unit.