Film deposition apparatus, conductive film manufacturing apparatus, and film deposition method

JP2026094269APending Publication Date: 2026-06-09NIKON CORP
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Patent Information

Application Number
JP2026029397
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2020-01-21
Filing Date
2026-02-26
Publication Date
2026-06-09
Patent Text Reader

Abstract

This invention relates to a mist deposition apparatus and a mist deposition method that atomizes a solution containing fine material particles (nanoparticles) into a mist and sprays it onto a substrate to be treated, thereby forming a thin film of the material on the surface of the substrate. [Solution] A film-forming apparatus for supplying a mist containing fine particles to a substrate and forming a film containing fine particles on the surface of the substrate comprises an air guide member that covers at least a portion of the surface of the substrate, and a mist supply unit that supplies mist to the space between the surface of the substrate and the air guide member, wherein the mist supply unit includes a charge application unit that positively or negatively charges the mist, and a mist ejection unit that ejects the mist charged by the charge application unit into the space, and the air guide member has a wall surface facing the surface of the substrate and includes an electrostatic field generating unit that generates a potential on the wall surface with the same sign as the mist charged by the charge application unit.
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