Light-emitting module, method for manufacturing the same, and display apparatus including the same
JP2026094373APending Publication Date: 2026-06-09SEOUL SEMICONDUCTOR
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- SEOUL SEMICONDUCTOR
- Filing Date
- 2026-03-05
- Publication Date
- 2026-06-09
AI Technical Summary
Benefits of technology
【0029】 本発明の実施例によると、複数のユニットピクセルを覆うように、黒色モールディング層と透明モールディング層を含むモールディング部を回路基板上に配置して色感差を改善し、輝度の損失を最小化する発光モジュールを提供することができる。
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Figure 2026094373000001_ABST
Abstract
The present invention provides a light-emitting module having an improved structure that mitigates color differences that may be caused by circuit boards and minimizes brightness loss, and a method for manufacturing the same. [Solution] An embodiment of the present disclosure includes a light-emitting module comprising a circuit board, a plurality of unit pixels arranged on the circuit board, and a molding portion covering the plurality of unit pixels. The molding portion includes a first molding layer that at least partially covers each of the unit pixels, and a second molding layer that covers the first molding layer. Furthermore, an anti-glare layer may be disposed on the molding portion.
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Claims
[Claim 1] The invention described in the specification and drawings of this application.