Electroformed mold and method for manufacturing an electroformed mold

Abstract

This prevents the peeling of the intermediate conductive film in electroformed molds with a multilayer structure of two or more layers. [Solution] The electroforming mold 100 comprises a substrate 110, a first mold part L1 formed on the substrate 110 having a first cavity 141 corresponding to the first electroformed part 10 of the electroformed product 1 and a base part 142 made of a conductive material, and a second mold part L2 formed on the first mold part L1, having a second cavity 151 extending above the base part 142 and corresponding to the second electroformed part 20 of the electroformed product 1. The side surface 142b of the base part 142 facing the first cavity part 141 is covered with an insulating film 132, and the first conductive film 121 formed on the surface of the substrate 110 facing the first cavity part 141 and the second conductive film 122 formed on the surface of the base part 142 facing the substrate 110 are electrically isolated.

Description

【Technical Field】 【0001】 The present invention relates to an electroforming mold and a method for manufacturing the same. 【Background Art】 【0002】 For example, it has been proposed to manufacture a structure with a minute shape such as a part of a clock by a LIGA (Lithographie, Galvanoformung, Abformung) process. In the LIGA process, the above-described structure (electroformed product) is manufactured by plating using an electroforming mold. As the electroforming mold, a multi-layer structure electroforming mold for manufacturing an electroformed product having different shapes depending on the part in the thickness direction has also been proposed (for example, see Patent Document 1). 【0003】 The multi-layer structure electroforming mold described in Patent Document 1 has a first-layer photosensitive material having a cavity corresponding to the electroformed product formed on a conductive substrate, a conductive layer formed on the upper surface of the first-layer photosensitive material, and when the plating grown from the substrate fills the cavity formed in the first-layer photosensitive material, the plating conducts with the conductive layer formed on the upper surface of the first-layer photosensitive material, and the plating grows from the entire surface of the conductive layer. 【Prior Art Documents】 【Patent Documents】 【0004】 【Patent Document 1】 Japanese Patent No. 4840756 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0005】 However, in the electroformed mold described in Patent Document 1, the adhesion between the conductive layer and the photosensitive material is weak. As the second layer of plating grows from the conductive layer, tensile or compressive stress generated in the plating grown from the conductive layer formed on the step surface between the first and second layers can cause the conductive layer to peel off from the photosensitive material. The weak adhesion between the conductive layer and the photosensitive material is mainly due to the fact that the conductive layer is mainly a metallic material, while the photosensitive material is an organic material. The bonding mode between metallic materials is mainly metallic, while the bonding mode between organic materials is mainly covalent. The difference in the main bonding modes between the metallic material and the photosensitive material, as described above, prevents a strong bond from being formed. 【0006】 Furthermore, even if the conductive layer does not detach from the photosensitive material during the growth of the second layer of plating from the conductive layer, when the plating grown within the cavity of the second layer protrudes from the upper surface of the second layer of photosensitive material, and the electroforming is completed, and the upper surface of the protruding plating is ground flat, the mechanical vibrations and shear stresses of grinding are transmitted through the plating to the boundary between the conductive layer and the photosensitive material, which can cause the conductive layer to detach from the photosensitive material. If grinding continues with the conductive layer detached from the photosensitive material, the thickness of the second layer of electroformed material (plating) above the conductive layer may differ from the intended thickness. 【0007】 The present invention has been made in view of the above circumstances, and aims to provide an electroforming mold and a method for manufacturing an electroforming mold that can prevent the peeling of conductive layers formed on stepped surfaces between layers in an electroforming mold with a multilayer structure of two or more layers. [Means for solving the problem] 【0008】 The first aspect of the present invention is an electroforming mold comprising: a substrate; a first mold portion formed on the substrate, having a first cavity corresponding to a first electroformed portion of an electroformed product and a base portion formed of a conductive material; and a second mold portion formed on the first mold portion, extending above the base portion and having a second cavity corresponding to a second electroformed portion of the electroformed product, wherein the side surface of the base portion facing the first cavity portion is covered with an insulating film, and the first conductive film formed on the surface of the substrate facing the first cavity and the second conductive film formed on the surface of the base portion facing the substrate are electrically isolated from each other. 【0009】 The second aspect of the present invention is a manufacturing method for producing an electroformed mold in which a first mold portion having a first cavity, a base portion and a first peripheral wall portion formed of a conductive material, and a second mold portion having a second cavity and a second peripheral wall portion formed on the first mold portion are integrally formed, wherein a first conductive film is formed on the entire surface of a substrate, the first conductive film is removed leaving at least the area for forming the first cavity and the area for forming the first peripheral wall portion, and a second conductive film is applied on the first conductive film and on the substrate exposed after the removal of the first conductive film. This is a method for manufacturing an electroformed mold, comprising: forming a base on the portion of the second conductive film that is in contact with the substrate; removing the portion of the second conductive film that is formed on the first conductive film and the portion surrounding the first conductive film to form a gap between the first conductive film and the second conductive film in the in-plane direction of the surface of the substrate; forming an insulating film of photosensitive material on the side surface of the base; and forming the first peripheral wall portion made of photosensitive material on the outside of the base, on the first conductive film or on the gap between the first conductive film and the gap. 【0010】 The third aspect of the present invention is a method for manufacturing an electroformed mold, wherein a first mold portion having a first cavity, a base portion and a first peripheral wall portion formed of a conductive material, and a second mold portion having a second cavity and a second peripheral wall portion formed on the first mold portion are integrally formed, the method comprising: forming a first conductive film on a substrate; forming an insulating film on the first conductive film; forming a second conductive film on the insulating film; forming the base portion on a predetermined range of the second conductive film; removing the second conductive film while leaving the range on which the base portion is formed to expose the insulating film; forming an insulating film of a photosensitive material on the side surface of the base portion; forming the first peripheral wall portion made of a photosensitive material on the range of the insulating film excluding the first cavity and the base portion; and removing the range of the insulating film facing the first cavity to expose the first conductive film. [Effects of the Invention] 【0011】 The electroformed mold and method for manufacturing the electroformed mold according to the present invention can prevent the peeling of conductive layers formed between layers on stepped surfaces in electroformed molds with a multilayer structure of two or more layers. [Brief explanation of the drawing] 【0012】 [Figure 1] This is a schematic cross-sectional view showing an electroformed product manufactured using the electroforming mold of Embodiment 1. [Figure 2] This is a schematic cross-sectional view showing the electroformed mold of Embodiment 1. [Figure 3A] This is a schematic cross-sectional diagram (part 1) illustrating the process of manufacturing electroformed molds. [Figure 3B] This is a schematic cross-sectional diagram (part 2) illustrating the process of manufacturing electroformed molds. [Figure 3C] This is a schematic cross-sectional diagram (part 3) illustrating the process of manufacturing electroformed molds. [Figure 3D] This is a schematic cross-sectional diagram (part 4) illustrating the process of manufacturing electroformed molds. [Figure 3E] This is a schematic cross-sectional diagram (part 5) illustrating the process of manufacturing electroformed molds. [Figure 3F]It is a cross-sectional view (No. 6) schematically showing the process of manufacturing an electroformed mold. [Figure 3G] It is a cross-sectional view (No. 7) schematically showing the process of manufacturing an electroformed mold. [Figure 3H] It is a cross-sectional view (No. 8) schematically showing the process of manufacturing an electroformed mold. [Figure 3I] It is a cross-sectional view (No. 4) schematically showing the process of manufacturing an electroformed mold. [Figure 3J] It is a cross-sectional view (No. 5) schematically showing the process of manufacturing an electroformed mold. [Figure 3K] It is a cross-sectional view (No. 6) schematically showing the process of manufacturing an electroformed mold. [Figure 3L] It is a cross-sectional view (No. 7) schematically showing the process of manufacturing an electroformed mold. [Figure 3M] It is a cross-sectional view (No. 8) schematically showing the process of manufacturing an electroformed mold. [Figure 3N] It is a cross-sectional view (No. 9) schematically showing the process of manufacturing an electroformed mold. [Figure 3O] It is a cross-sectional view (No. 10) schematically showing the process of manufacturing an electroformed mold. [Figure 3P] It is a cross-sectional view (No. 11) schematically showing the process of manufacturing an electroformed mold. [Figure 4] It is a cross-sectional view schematically showing an electroformed product manufactured with the electroformed mold of Embodiment 2. [Figure 5] It is a cross-sectional view schematically showing the electroformed mold of Embodiment 2. [Figure 6A] It is a cross-sectional view (No. 1) schematically showing the process of manufacturing an electroformed mold. [Figure 6B] It is a cross-sectional view (No. 2) schematically showing the process of manufacturing an electroformed mold. [Figure 6C] It is a cross-sectional view (No. 3) schematically showing the process of manufacturing an electroformed mold. [Figure 6D] It is a cross-sectional view (No. 4) schematically showing the process of manufacturing an electroformed mold. [Figure 6E] It is a cross-sectional view (No. 5) schematically showing the process of manufacturing an electroformed mold. [Figure 6F] This is a schematic cross-sectional diagram (part 6) illustrating the process of manufacturing electroformed molds. [Figure 6G] This is a schematic cross-sectional diagram (part 7) illustrating the process of manufacturing electroformed molds. [Figure 6H] This is a schematic cross-sectional diagram (part 8) illustrating the process of manufacturing electroformed molds. [Figure 6I] This is a schematic cross-sectional diagram (part 4) illustrating the process of manufacturing electroformed molds. [Figure 6J] This is a schematic cross-sectional diagram (part 5) illustrating the process of manufacturing electroformed molds. [Figure 6K] This is a schematic cross-sectional diagram (part 6) illustrating the process of manufacturing electroformed molds. [Figure 6L] This is a schematic cross-sectional diagram (part 7) illustrating the process of manufacturing electroformed molds. [Figure 7A] This is a schematic cross-sectional diagram (part 1) illustrating the process of separating the electroformed product from the electroformed mold. [Figure 7B] This is a schematic cross-sectional diagram (part 2) illustrating the process of separating the electroformed product from the electroformed mold. [Figure 7C] This is a schematic cross-sectional diagram (part 3) illustrating the process of separating the electroformed product from the electroformed mold. [Modes for carrying out the invention] 【0013】 Embodiments of the electroforming mold and the method for manufacturing the electroforming mold according to the present invention will be described below with reference to the drawings. 【0014】 [Embodiment 1] Figure 1 is a schematic cross-sectional view of an electroformed product 1, an example of a two-layer structure, and Figure 2 is a schematic cross-sectional view of an electroforming mold 100, which is a mold used to manufacture the electroformed product 1 shown in Figure 1 in the electroforming process. Figures 3A-3P are schematic cross-sectional views showing the flow of the manufacturing method for the electroforming mold 100. 【0015】 <Electroformed products> The electroformed product 1 shown in Fig. 1 is a so-called two-layer structured electroformed product composed of a first electroformed part 10 and a second electroformed part 20 with different shapes in the thickness direction D. Specifically, in Fig. 1, the dimension W2 in the width direction W of the second electroformed part 20 located on the upper side is larger than the dimension W1 in the width direction W of the first electroformed part 10 located on the lower side (W1 < W2). Therefore, the electroformed product 1 has an interlayer step surface 30 that protrudes in the width direction W in the second electroformed part 20 more than in the first electroformed part 10. 【0016】 Note that although the electroformed product 1 is shown in Fig. 1 with the first electroformed part 10 arranged on the lower side and the second electroformed part 20 arranged on the upper side, this posture is only adopted for the purpose of making the correspondence with the electroforming mold 100 described later easier to understand. Needless to say, the electroformed product 1 may be used in a posture different from the posture shown in Fig. 1, for example, an upside-down posture or a lying-down sideways posture. 【0017】 <Electroforming mold> The electroforming mold 100 shown in Fig. 2 is an embodiment of the electroforming mold according to the present invention. The electroforming mold 100 is a mold for manufacturing the electroformed product 1 by an electroforming process. The electroforming mold 100 has a configuration in which a first mold part L1 and a second mold part L2 are formed in the thickness direction D on a substrate 110 on which a first conductive film 121 and a second conductive film 122 are formed. 【0018】 The substrate 110 is formed of a non-conductive insulating material. Note that the substrate 110 only needs to have a non-conductive surface (the upper surface in the drawing) on which the first conductive film 121 and the second conductive film 122 are formed, and the portions other than the surface may have conductivity. Although the substrate 110 is formed of an insulating material, it does not have to be completely non-conductive. For example, the substrate 110 can also be constituted by silicon or the like, which is a material having a relatively large resistance value represented in units of kΩ of electrical resistance. 【0019】 A first conductive film 121 and a second conductive film 122 are laminated on the surface (top surface in the figure) of the substrate 110. The first conductive film 121 and the second conductive film 122 are arranged with a gap 123 between them in the in-plane direction of the surface of the substrate 110. The first conductive film 121 is made of a conductive material, such as copper (Cu). The first conductive film 121 is not limited to copper. The first conductive film 121 may have a layer of titanium (Ti) or chromium (Cr) on its lower surface in contact with the substrate 110. Titanium and chromium have higher adhesion to silicon and the like than copper. 【0020】 The second conductive film 122 is formed of a conductive material, such as gold (Au). The second conductive film 122 is not limited to gold. The second conductive film 122 may also have a layer of titanium or chromium on the surface in contact with the substrate 110. 【0021】 Therefore, if both the first conductive film 121 and the second conductive film 122 are formed from a single material in a single-layer structure, it is necessary to selectively dissolve the first conductive film 121 and the second conductive film 122. For example, if the first conductive film 121 is made of copper and the second conductive film 122 is made of gold, it is more convenient because it allows for the selective dissolution of the first conductive film 121 and the second conductive film 122. 【0022】 The first conductive film 121 and the second conductive film 122 may be formed from exactly the same material composition. When the first conductive film 121 and the second conductive film 122 are laminated on the substrate 110 from exactly the same material composition, the first conductive film 121 and the second conductive film 122 can be selectively dissolved by adjusting the dissolution time of the first conductive film 121 and the dissolution (etching) time of the second conductive film 122. The dissolution (etching) time referred to here is the time it takes for the surface of the substrate 110 to become visible as the second conductive film 122 formed on the surface of the substrate 110 is dissolved (etched). 【0023】 As shown in Figure 3D, the second conductive film 122 is formed by laminating it on the upper surface of the first conductive film 121 and the upper surface of the substrate 110. However, in reality, the second conductive film 122 does not form a laminate with a rectangular step as schematically shown in Figure 3D. That is, at the edge of the first conductive film 121, due to the step between the first conductive film 121 and the substrate 110, the second conductive film 122 is a film that is smoothly continuous without a step from the upper surface of the first conductive film 121 to the upper surface of the substrate 110, but has a drooped edge. 【0024】 In other words, at the edges of the first conductive film 121, the thickness of the second conductive film 122 is thinner than that of the general surface on the upper surface of the first conductive film 121 (the surface other than the edges). Therefore, in Figure 3I, the second conductive film 122 in contact with the side surface of the base 142 is thinner than the second conductive film 122 formed on the general surface on the upper surface of the first conductive film 121. 【0025】 In the process shown in Figure 3I, when the second conductive film 122 is etched, the first conductive film 121 is exposed first at the edge portion of the upper surface of the first conductive film 121, rather than at the general surface of the upper surface of the first conductive film 121. Then, after the edge of the first conductive film 121 is exposed, the edge of the first conductive film 121 and the second conductive film 122 laminated on the upper surface of the substrate 110 adjacent to the first conductive film 121 are etched. This allows a gap 123 to be formed between the first conductive film 121 and the second conductive film 122 on the substrate 110 before all of the second conductive film 122 formed on the general surface of the upper surface of the first conductive film 121 is removed by etching and all of the first conductive film 121 is removed. 【0026】 Furthermore, even when the first conductive film 121 and the second conductive film 122 are formed by laminating titanium and chromium on the lower surface as described above, the first conductive film 121 and the second conductive film 122 can be made of the same material, for example, a structure in which copper and titanium are laminated. 【0027】 Since a gap 123 exists between the first conductive film 121 and the second conductive film 122 in the in-plane direction of the surface of the substrate 110, the first conductive film 121 and the second conductive film 122 are electrically isolated from each other. Therefore, the first conductive film 121 and the second conductive film 122 do not conduct electricity. 【0028】 The first mold portion L1 is formed on the conductive films 121 and 122 in the thickness direction D. The first mold portion L1 is the part that forms the first electroformed portion 10 of the electroformed product 1. The first mold portion L1 has a first cavity portion 141, a base portion 142, and a peripheral wall portion 143. 【0029】 The first cavity 141 is the portion that forms the first electroformed part 10 of the electroformed product 1, and the base 142 is a wall portion that at least partially separates the first cavity 141 from the radially outer side. In other words, the base 142 is a wall portion that forms at least a part of the outer surface in the in-plane direction of the first cavity 141. The base 142 is formed of a conductive metallic material such as nickel (Ni). The base 142 may be formed of a conductive material other than nickel. 【0030】 The first conductive film 121 is formed on the surface (upper surface) of the substrate 110 facing the first cavity 141. The second conductive film 122 is formed on the surface (lower surface) of the base portion 142 facing the substrate 110. 【0031】 The side surface 142b of the base portion 142 facing the first cavity portion 141 is covered with an insulating film 132 of an insulating photosensitive material (photoresist). The insulating film 132 does not have to completely cover the side surface 142b; for example, the upper part of the side surface 142b does not have to be covered with the insulating film 132. An intermediate conductive film 131 of a conductive material, such as copper or gold, is formed on the upper surface 142a of the base portion 142 facing the second cavity portion 151 in the second mold portion L2, which will be described later. The upper surface 142a of the base portion 142 corresponds to the stepped surface 30 of the electroformed product 1. 【0032】 The material of the intermediate conductive film 131 may be different from the material of the electroformed product 1. By using a different material for the intermediate conductive film 131, it becomes possible to selectively dissolve the intermediate conductive film 131. This makes it convenient for the electroforming mold 100 to release the electroformed product 1 from the mold 100. However, if the base 142 of the electroforming mold 100 is made of a different material from the electroformed product 1, the electroformed product 1 can be released from the electroforming mold 100 by dissolving the base 142, so the intermediate conductive film 131 is not necessary. 【0033】 The peripheral wall portion 143 is formed around the base portion 142. The peripheral wall portion 143 is formed in contact with the conductive film 122. The peripheral wall portion 143 extends to the second mold portion L2 and also serves as a wall portion that separates the second cavity portion 151 in the second mold portion L2 from the outside. Therefore, the peripheral wall portion 143 is an integral part of the first peripheral wall portion that forms the peripheral wall portion in the first mold portion L1 and the second peripheral wall portion that forms the peripheral wall portion in the second mold portion L2. The peripheral wall portion 143 is formed of an insulating photosensitive material. The photosensitive material constituting the peripheral wall portion 143 is a negative-type photosensitive material, but it may also be a positive-type photosensitive material. 【0034】 Furthermore, the portion of the peripheral wall portion 143 corresponding to the second peripheral wall portion in the second mold portion L2 may be formed partially overlapping the intermediate conductive film 131 formed on the upper surface 142a of the base portion 142, or it may be formed separately from the outer edge of the intermediate conductive film 131 formed on the upper surface 142a of the base portion 142. 【0035】 The first cavity 141 is formed facing the first conductive film 121 and not facing the second conductive film 122. On the other hand, the base 142 is formed facing the second conductive film 122 and not facing the first conductive film 121. The gap 123 formed between the first conductive film 121 and the second conductive film 122 is formed below the insulating film 132. 【0036】 The second mold portion L2 is formed on the first mold portion L1 in the thickness direction D. The second mold portion L2 is the portion that forms the second electroformed portion 20 of the electroformed product 1. The second mold portion L2 has a second cavity portion 151 and a peripheral wall portion 143. The second cavity portion 151 is the portion that forms the second electroformed portion 20, and the peripheral wall portion 143 is a wall portion that separates the second cavity portion 151 from the outside. 【0037】 <Method for manufacturing electroformed molds> Figures 3A-3P are schematic cross-sectional views illustrating the manufacturing method of the electroformed mold 100. The manufacturing method of the electroformed mold 100 shown in Figure 3A-3P is one embodiment of the manufacturing method of the electroformed mold according to the present invention. 【0038】 The manufacturing method for the electroformed mold 100 involves forming a first conductive film 121 on the upper surface of the substrate 110, as shown in Figure 3A, and then applying an insulating photosensitive material 160 on top of the first conductive film 121, as shown in Figure 3B. The photosensitive material is then cured by pre-baking, which evaporates the solvent in the photosensitive material 160. The photosensitive material 160 is a positive type, but a negative type can also be used. When using a negative type photosensitive material 160, the light-transmitting portion 201 and the light-shielding portion 202 of the mask 200, which will be described later, should be reversed. 【0039】 Next, the manufacturing method for the electroformed mold 100 involves exposing the photosensitive material 160 with ultraviolet light K using a mask 200 in which a light-shielding portion 202 corresponding to the first cavity portion 141 and a light-transmitting portion 201 corresponding to the base portion 142 are formed. 【0040】 The manufacturing method for the electroformed mold 100 involves developing the photosensitive material 160 to remove the exposed region 161 of the photosensitive material 160 that was exposed through the light-transmitting portion 201, as shown in Figure 3C, leaving the unexposed region 162 of the photosensitive material 160 that was not exposed by the light-shielding portion 202. Next, the manufacturing method for the electroformed mold 100 involves etching away the first conductive film 121 corresponding to the exposed region 161 that was exposed after the exposure region 161 was removed, forming the first conductive film 121 in a predetermined pattern, and then removing the unexposed region 162. 【0041】 In the manufacturing method of the electroformed mold 100 described above, the first conductive film 121 is formed in a predetermined pattern by a photolithography process. However, if the first conductive film 121 is formed in a predetermined pattern by a pattern formation process using a stencil mask or by an inkjet printing process instead of the photolithography process, the steps shown in Figures 3A-3C can be omitted. 【0042】 Next, as shown in Figure 3D, the manufacturing method for the electroformed mold 100 involves forming a second conductive film 122 on top of the first conductive film 121 formed in a predetermined pattern. The formation of the second conductive film 122 can be carried out using processes such as sputtering or vapor deposition. 【0043】 Next, as shown in Figure 3E, the manufacturing method for the electroformed mold 100 involves applying an insulating photosensitive material 170 onto the second conductive film 122, and curing the photosensitive material by pre-baking to evaporate the solvent in the photosensitive material 170. The photosensitive material 170 is negative type, but a positive type can also be used. When using a positive type photosensitive material 170, the light-transmitting portion 211 and the light-shielding portion 212 of the mask 210, which will be described later, should be reversed. 【0044】 Next, the manufacturing method for the electroformed mold 100 involves exposing the photosensitive material 170 to ultraviolet light K using a mask 210 having a light-transmitting portion 211 and a light-shielding portion 212 formed thereon. Here, the light-shielding portion 212 is formed to cover an area where only the second conductive film 122 is formed, and the light-transmitting portion 211 is formed to cover a wider area than the first conductive film 121. 【0045】 The manufacturing method for the electroformed mold 100 involves developing the photosensitive material 170 to remove the unexposed region 172 of the photosensitive material 170 that was not exposed through the light-shielding portion 212, as shown in Figure 3F, leaving the exposed region 171 of the photosensitive material 170 that was exposed by the light-transmitting portion 211. The exposed region 171 corresponds to the first peripheral wall portion of the first mold portion L1 within the peripheral wall portion 143. 【0046】 Next, as shown in Figure 3G, the manufacturing method for the electroformed mold 100 involves immersing it together with the anode 195 in an electroplating solution 196 and performing an electroplating step in which electricity is passed between the anode 195 and the second conductive film 122, thereby growing plating in the cavity where the unexposed region 172 has been removed. The plating that grows in the cavity is, for example, nickel, corresponding to the solution 196, and the plating that has grown in the cavity becomes the base 142 of the electroformed mold 100. 【0047】 Next, in the manufacturing method of the electroformed mold 100, if the base portion 142 grows to the point where it protrudes onto the upper surface 171a of the exposure region 171 during the electroplating process (see Figure 3G), the upper part of the base portion 142 and the upper part of the exposure region 171 are ground and polished to make the upper surface 142a of the base portion 142 flat, as shown in Figure 3H. 【0048】 Next, in the manufacturing method of the electroformed mold 100, as shown in Figure 3I, the exposure area 171 of the photosensitive material 170 is removed, and then, as shown in Figure 3J, etching is performed with a solvent selected to leave the first conductive film 121 and dissolve the second conductive film 122, thereby removing the exposed second conductive film 122. Since the exposure area 171 of the photosensitive material 170 is formed over a wider area than the first conductive film 121, when the exposed second conductive film 122 is removed, a gap 123 is formed in the plane of the substrate 110 between the second conductive film 122, which is covered by the base 142 and not exposed, and the first conductive film 121, which was exposed and has been removed from the second conductive film 122. 【0049】 Next, as shown in Figure 3K, the manufacturing method for the electroformed mold 100 involves applying an insulating photosensitive material 180 and curing the photosensitive material by pre-baking to evaporate the solvent in the photosensitive material 180. The photosensitive material 180 is negative type, but a positive type can also be used. When using a positive type photosensitive material 180, the light-transmitting portion 221 and the light-shielding portion 222 of the mask 220, which will be described later, should be reversed. 【0050】 Next, the manufacturing method for the electroformed mold 100 involves exposing the photosensitive material 180 with ultraviolet light K using a mask 220 having a light-transmitting portion 221 and a light-shielding portion 222 formed thereon. The light-transmitting portion 221 of the mask 220 irradiates the photosensitive material 180 with ultraviolet light K to form an exposed region 181 of the photosensitive material 180, while the light-shielding portion 222 of the mask 220 irradiates the photosensitive material 180 with ultraviolet light K to shield it from light and form an unexposed region 182 of the photosensitive material 180. The exposed region 181 corresponds to the second peripheral wall portion of the second mold portion L2 within the peripheral wall portion 143. 【0051】 Here, the light-transmitting portion 221 is formed in a range that exposes the outer peripheral portion corresponding to the peripheral wall portion 143, and is wider than the base portion 142, and exposes up to the inner side surface 142b of the base portion 142. Therefore, the light-transmitting portion 221 is formed to be within the range of the gap 123 or the range between the gap 123 and the first conductive film 121 inside the base portion 142. 【0052】 Next, in the manufacturing method of the electroformed mold 100, the upper part of the base 142 is ground and polished together with the photosensitive material 180, so that the upper surface 142a of the base 142 is exposed from the exposure region 181 of the photosensitive material 180, as shown in Figure 3L. Note that during the exposure shown in Figure 3K, the area corresponding to the upper surface 142a of the base 142 is also shielded from light, so that the photosensitive material 180 laminated on the upper surface 142a becomes an unexposed region 182. Therefore, in the development process, the unexposed region 182 laminated on the upper surface 142a is removed, and the upper surface 142a can be exposed. 【0053】 In this case, since the upper surface 142a of the electroformed mold 100 is formed flat in the process shown in Figure 3H, grinding to form a new flat upper surface 142a in the process shown in Figure 3L is unnecessary. Alternatively, the manufacturing method of the electroformed mold 100 may involve grinding and polishing the base portion 142 down to the portion below the upper surface 142a formed in the process shown in Figure 3H to form a new flat upper surface 142a. 【0054】 Furthermore, in the manufacturing method of the electroformed mold 100, in the step of coating the photosensitive material 180 shown in Figure 3K, the photosensitive material 180 is coated without riding up onto the upper surface 142a of the base 142, so that the flat upper surface 142a is left exposed, and thus grinding and developing in the step shown in Figure 3L are unnecessary. 【0055】 Next, as shown in Figure 3M, the manufacturing method for the electroformed mold 100 involves forming an intermediate conductive film 131 made of a conductive material on the exposed upper surface 142a of the base portion 142. Specifically, the formation of the intermediate conductive film 131 can be carried out by electroless plating, photolithography, or vapor deposition using a stencil mask. 【0056】 Next, as shown in Figure 3N, the manufacturing method for the electroformed mold 100 involves applying an insulating photosensitive material 190 to a thickness corresponding to the second mold section L2 (see Figure 2), and then curing the photosensitive material by pre-baking to evaporate the solvent in the photosensitive material 190. The photosensitive material 190 is negative type, but a positive type can also be used. When using a positive type photosensitive material 190, the light-transmitting section 231 and the light-shielding section 232 of the mask 230, which will be described later, should be reversed. 【0057】 Next, the manufacturing method for the electroformed mold 100 involves exposing the photosensitive material 190 to ultraviolet light K using a mask 230 having a light-transmitting portion 231 and a light-shielding portion 232 formed thereon. Here, the light-shielding portion 232 is formed to cover the base portion 142 and the area inside the base portion 142, and the light-transmitting portion 231 is formed to become the peripheral wall portion 143, which is the area outside the base portion 142. 【0058】 In the example shown in Figure 3N, the light-transmitting portion 231 is formed in a range that makes the exposure region 191 of the photosensitive material 190 the same region as the exposure region 181, and the exposure region 191 is located outside the outer edge of the intermediate conductive film 131. However, in the manufacturing method of the electroforming mold 100, the light-transmitting portion 231 may extend inward from the exposure region 181, so that the exposure region 191 of the photosensitive material 190 partially overlaps the outer edge of the intermediate conductive film 131. 【0059】 The manufacturing method for the electroformed mold 100 involves developing the photosensitive material 190 and the photosensitive material 180 to remove the unexposed region 192 of the photosensitive material 190 that was not exposed through the light-shielding portion 232, and the unexposed region 182 of the photosensitive material 180 that was not exposed through the light-shielding portion 222 and the light-shielding portion 232, as shown in Figure 3O, leaving the exposed region 191 of the photosensitive material 190 that was exposed by the light-transmitting portion 231, and the exposed region 181 of the photosensitive material 180 that was exposed by the light-transmitting portion 221 and the light-transmitting portion 231. 【0060】 As a result, an electroforming mold 100, as shown in Figure 2, is manufactured, comprising: a base portion L1 having a base portion 142 on which an insulating film 132 of photosensitive material 180 (exposure region 181) is formed on the side surface 142b and an intermediate conductive film 131 formed on the upper surface 142a; a first mold portion L1 having a first cavity portion 141 inside the base portion 142 and a peripheral wall portion 143 (corresponding to the first peripheral wall portion) formed of photosensitive material 180 (exposure region 181); and a second mold portion L2 having a second cavity portion 151 and a peripheral wall portion 143 (corresponding to the second peripheral wall portion) formed of photosensitive material 190 (exposure region 191). 【0061】 In the electroformed mold 100 shown in Figure 3O, the peripheral wall portion 143 of the second mold portion L2 (exposure region 191 corresponding to the second peripheral wall portion) is located further outward from the outer edge 131c of the intermediate conductive film 131 formed on the upper surface 142a of the base portion 142. However, as shown in Figure 3P, the electroformed mold 100 may also have the peripheral wall portion 143 (exposure region 191) of the second mold portion L2 partially overlapping the outer edge 131a of the intermediate conductive film 131 formed on the upper surface 142a of the base portion 142. 【0062】 (Manufacturing method for electroformed products) The electroformed mold 100 manufactured as described above is used to produce the electroformed product 1 by the electroforming process shown below. 【0063】 In other words, the electroforming mold 100 is immersed in an electroplating solution together with the anode, as in Figure 3G, and an electroplating process is carried out in which electricity is passed between the anode and the first conductive film 121 exposed in the first cavity 141. As a result, the plating grows from the first conductive film 121, filling the first cavity 141, and the plating that has filled the first cavity 141 becomes the first electroformed part 10 of the electroformed product 1. 【0064】 In this case, the second conductive film 122 is electrically isolated from the first conductive film 121 by the gap 123 formed between it and the first conductive film 121, so that the plating does not grow from the base 142 of the conductive material that is in contact with the second conductive film 122. 【0065】 Furthermore, the side surface 142b of the base portion 142 is electrically isolated from the first cavity portion 141 by an insulating film 132 formed of the photosensitive material 180 (exposure region 181), so that the plating grown in the first cavity portion 141 does not make electrical contact with the base portion 142. 【0066】 As the plating progresses further, the plating that has overflowed from the first cavity 141 reaches the intermediate conductive film 131, and the plating becomes electrically connected to the intermediate conductive film 131, causing the plating to begin growing from the entire surface of the intermediate conductive film 131 and filling the second cavity 151. The plating that has filled the second cavity 151 becomes the second electroformed part 20 of the electroformed product 1. 【0067】 Here, since the base 142 of the electroformed mold 100 is formed of a conductive material, the bonding force between the intermediate conductive film 131 and the base 142 at the stepped surface between the first cavity 141 of the first layer and the second cavity 151 of the second layer is greater than the bonding force between the intermediate conductive film 131 and the base 142 when the base 142 is formed of a photosensitive material. Therefore, even if plating grows from the intermediate conductive film 131 during the manufacturing process of the electroformed product 1, and tensile or compressive stress is generated in the plating, the intermediate conductive film 131 will not peel off from the base 142. 【0068】 Furthermore, in the manufacturing process of the electroformed product 1, if the upper surface of the second electroformed section 20 is ground flat after the electroformed product 1 has been formed up to the second electroformed section 20, the electroforming mold 100 will not cause the intermediate conductive film 131 to peel off from the base 142, even if mechanical vibrations and shear stresses from grinding are transmitted to the boundary between the intermediate conductive film 131 and the base 142 via the second electroformed section 20. Moreover, if a different material is selected for the base 142 than the electroformed material, the intermediate conductive film 131 becomes unnecessary, further reducing the possibility of peeling. 【0069】 [Embodiment 2] Figure 4 is a schematic cross-sectional view of another example of an electroformed product 501 with a two-layer structure, and Figure 5 is a schematic cross-sectional view of an electroforming mold 300, which is a mold for manufacturing the electroformed product 501 shown in Figure 4 in the electroforming process. Figures 6A-6M are schematic cross-sectional views showing the flow of the manufacturing method of the electroforming mold 300. 【0070】 <Electroformed products> The electroformed product 501 shown in Figure 4 is a so-called two-layer electroformed product composed of a first electroformed section 510 and a second electroformed section 520, which have different shapes in the thickness direction D. Specifically, the electroformed product 501 has a first electroformed section 510 located on the lower side in the thickness direction D in Figure 4, having a cavity 540 on the inside and forming the outer wall, and a second electroformed section 520 located above the first electroformed section 510 and the cavity 540 in the thickness direction D. The lower surface of the second electroformed section 520 facing the cavity 540 is a stepped surface 530 with respect to the first electroformed section 510. 【0071】 <Electroformed mold> The electroforming mold 300 shown in Figure 5 is another embodiment of the electroforming mold according to the present invention. The electroforming mold 300 is a mold for manufacturing an electroformed product 501 by an electroforming process. The electroforming mold 300 has a configuration in which a first mold part L1 and a second mold part L2 are formed in the thickness direction D on a substrate 310 on which a first conductive film 321, an insulating film 323, and a second conductive film 322 are formed. 【0072】 The substrate 310 may be formed from a conductive material or a non-conductive insulating material. If the substrate 310 is formed from a conductive material, the first conductive film 321, described later, does not need to be provided. 【0073】 On the surface of the substrate 310 (the top surface in the figure), a first conductive film 321, an insulating film 323, and a second conductive film 322 are formed in this order, starting from the side closest to the surface of the substrate 310. The first conductive film 321 is positioned in contact with the surface of the substrate 310. 【0074】 The first conductive film 321 is formed of a conductive material, such as gold (Au). The first conductive film 321 is not limited to gold. The first conductive film 321 may have a layer of titanium (Ti) or chromium (Cr) on its lower surface in contact with the substrate 310. 【0075】 The second conductive film 322 is formed of a conductive material, such as gold. The second conductive film 322 is not limited to gold. The second conductive film 322 may also have a layer of titanium or chromium on the side closer to the substrate 310. The first conductive film 321 and the second conductive film 322 may be formed of the same material or of different materials. 【0076】 The insulating film 323 is formed of a non-conductive insulating material. The insulating film 323 is positioned between the first conductive film 321 and the second conductive film 322 in the thickness direction D. Therefore, the first conductive film 321 and the second conductive film 322 are electrically isolated in the thickness direction D, and there is no electrical conductivity between the first conductive film 321 and the second conductive film 322. 【0077】 The first mold portion L1 is formed in the thickness direction D on the first conductive film 321, the insulating film 323, and the second conductive film 322. The first mold portion L1 is the portion that forms the first electroformed portion 510 of the electroformed product 501. The first mold portion L1 has a first cavity portion 341, a base portion 342, and a peripheral wall portion 343. The first cavity portion 341 is the portion that forms the first electroformed portion 510 of the electroformed product 501, and the base portion 342 is a wall portion formed inside the first cavity portion 341 that partitions the inside of the first cavity portion 341. The base portion 342 is formed of a conductive metallic material such as nickel (Ni). The base portion 342 may be formed of a conductive material other than nickel. 【0078】 The side surface 342b of the base portion 342 facing the first cavity portion 341 is covered with an insulating film 332 of an insulating photosensitive material (photoresist). The insulating film 332 does not have to completely cover the side surface 342b; for example, the upper part of the side surface 342b does not have to be covered with the insulating film 332. An intermediate conductive film 331 of a conductive material, such as gold or copper, is formed on the upper surface 342a of the base portion 342 that faces the second cavity portion 351 in the second mold portion L2, which will be described later. The upper surface 342a of the base portion 342 corresponds to the stepped surface 530 of the electroformed product 501. 【0079】 The peripheral wall portion 343 is formed around the first cavity portion 341. The peripheral wall portion 343 is formed in contact with the insulating film 323. The peripheral wall portion 343 extends to the second mold portion L2 and also serves as a wall portion that separates the second cavity portion 351 in the second mold portion L2 from the outside. Therefore, the peripheral wall portion 343 is an integral part of the first peripheral wall portion that forms the peripheral wall portion in the first mold portion L1 and the second peripheral wall portion that forms the peripheral wall portion in the second mold portion L2. The peripheral wall portion 343 is formed of an insulating photosensitive material. The photosensitive material constituting the peripheral wall portion 343 is a negative-type photosensitive material, but it may also be a positive-type photosensitive material. 【0080】 Furthermore, at the interface between the first mold portion L1 and the second mold portion L2, the peripheral wall portion 343 of the second mold portion L2 may be formed closer to the base portion 342, or it may be formed further away from the base portion 342. 【0081】 The first cavity 341 is formed facing the first conductive film 321. On the other hand, the base 342 is formed facing the second conductive film 322. 【0082】 The second mold portion L2 is formed on the first mold portion L1 in the thickness direction D. The second mold portion L2 is the portion that forms the second electroformed portion 520 of the electroformed product 501. The second mold portion L2 has a second cavity portion 351 and a peripheral wall portion 343. The second cavity portion 351 is the portion that forms the second electroformed portion 520, and the peripheral wall portion 343 is a wall portion that separates the second cavity portion 351 from the outside. 【0083】 <Method for manufacturing electroformed molds> Figures 6A-6L are schematic cross-sectional views illustrating the manufacturing method of the electroformed mold 300. The manufacturing method of the electroformed mold 300 shown in Figures 6A-6L is another embodiment of the manufacturing method of the electroformed mold according to the present invention. 【0084】 As shown in Figure 6A, the manufacturing method for the electroformed mold 300 involves forming a first conductive film 321 on the upper surface of a substrate 310, forming an insulating film 323 on the upper surface of the first conductive film 321, and forming a second conductive film 322 on the upper surface of the insulating film 323. 【0085】 Next, as shown in Figure 6B, the manufacturing method for the electroformed mold 300 involves applying an insulating photosensitive material 360 onto the second conductive film 322, and curing the photosensitive material by pre-baking to evaporate the solvent in the photosensitive material 360. The photosensitive material 360 is a positive type, but a negative type can also be used. When using a negative type photosensitive material 360, the light-transmitting portion 401 and the light-shielding portion 402 of the mask 400, which will be described later, should be reversed. 【0086】 Next, the manufacturing method for the electroformed mold 300 involves exposing the photosensitive material 360 with ultraviolet light K using a mask 400 in which a light-shielding portion 402 corresponding to the first cavity portion 341 and a light-transmitting portion 401 corresponding to the base portion 342 are formed. 【0087】 The manufacturing method for the electroformed mold 300 involves developing the photosensitive material 360, as shown in Figure 6C, to remove the exposed region 361 of the photosensitive material 360 that was exposed through the light-transmitting portion 401, leaving the unexposed region 362 of the photosensitive material 360 that was not exposed by the light-shielding portion 402. Next, as shown in Figure 6D, the manufacturing method for the electroformed mold 300 involves immersing it together with the anode 391 in an electroplating solution 392 and performing an electroplating process in which electricity is passed between the anode 391 and the second conductive film 322 to grow plating in the cavity where the exposed region 361 was removed. The plating that grows in the cavity is, for example, nickel, corresponding to the solution 392, and the plating that grows in the cavity becomes the base 342 of the electroformed mold 300. 【0088】 Next, as shown in Figure 6E, the manufacturing method of the electroformed mold 300 involves removing the unexposed region 362 of the photosensitive material 360, and then removing the second conductive film 322 corresponding to the unexposed region 362, which was exposed as a result of the removal of the unexposed region 362, by etching, as shown in Figure 6F. As a result, the second conductive film 322 is left only in the region covered by the base 342, and the insulating film 323 is exposed in the region not covered by the base 342. 【0089】 Next, as shown in Figure 6G, the manufacturing method for the electroformed mold 300 involves applying an insulating photosensitive material 370 onto the insulating film 323 and the base portion 342, and then curing the photosensitive material by pre-baking to evaporate the solvent in the photosensitive material 370. The photosensitive material 370 is negative type, but a positive type can also be used. When using a positive type photosensitive material 370, the light-transmitting portion 411 and the light-shielding portion 412 of the mask 410, which will be described later, should be reversed. 【0090】 Next, the manufacturing method for the electroformed mold 300 involves exposing the photosensitive material 370 to ultraviolet light K using a mask 410 having a light-transmitting portion 411 and a light-shielding portion 412 formed thereon. Here, the light-transmitting portion 411 is formed to expose a wider area than the base portion 342 and the outer periphery that forms the peripheral wall portion 343, while the light-shielding portion 412 is formed to cover the area between the base portion 342 and the outer periphery where the insulating film 323 is exposed. Exposure through the mask 410 results in the photosensitive material 370 having an exposed region 371 in the area exposed to ultraviolet light K through the light-transmitting portion 411, and an unexposed region 372 in the area not exposed to ultraviolet light K by the light-shielding portion 412. The exposed region 371 consists of the portion of the peripheral wall portion 343 corresponding to the first peripheral wall portion of the first mold portion L1 and the portion covering the periphery of the base portion 342. 【0091】 Next, as shown in Figure 6H, the manufacturing method of the electroformed mold 300 involves grinding and polishing the upper part of the base 342 and the upper part of the photosensitive material 370 to make them flat, thereby adjusting the upper surface 342a of the base 342 to be flat. 【0092】 Next, as shown in Figure 6I, the manufacturing method for the electroformed mold 300 involves forming an intermediate conductive film 331 made of a conductive material on the upper surface 342a of the base portion 342. Specifically, the formation of the intermediate conductive film 331 can be achieved by electroless plating, photolithography, or vapor deposition using a stencil mask. 【0093】 Next, as shown in Figure 6J, the manufacturing method for the electroformed mold 300 involves applying an insulating photosensitive material 380 to a thickness corresponding to the second mold section L2 (see Figure 5), and then curing the photosensitive material by pre-baking to evaporate the solvent in the photosensitive material 380. The photosensitive material 380 is negative type, but a positive type can also be used. When using a positive type photosensitive material 380, the light-transmitting section 421 and the light-shielding section 422 of the mask 420, which will be described later, should be reversed. 【0094】 Next, the manufacturing method for the electroformed mold 300 involves exposing the photosensitive material 380 to ultraviolet light K using a mask 420 having a light-transmitting portion 421 and a light-shielding portion 422. Here, the light-transmitting portion 421 is formed to expose the outer peripheral region corresponding to the peripheral wall portion 343, and the light-shielding portion 422 is formed to cover the area other than the region corresponding to the peripheral wall portion 434. Exposure through the mask 420 results in the photosensitive material 380 having an exposed region 381 in the area exposed to ultraviolet light K through the light-transmitting portion 421, and an unexposed region 382 in the area not exposed to ultraviolet light K by the light-shielding portion 422. The exposed region 381 corresponds to the second peripheral wall portion of the second mold portion L2 within the peripheral wall portion 343. 【0095】 The manufacturing method for the electroformed mold 300 involves developing the photosensitive material 380 and the photosensitive material 370 to remove the unexposed region 382 of the photosensitive material 380 and the unexposed region 372 of the photosensitive material 370, as shown in Figure 6K, leaving the exposed region 381 of the photosensitive material 380 and the exposed region 371 of the photosensitive material 370. 【0096】 Next, as shown in Figure 6L, the manufacturing method for the electroformed mold 300 involves dissolving the insulating film 323 and etching it with a solvent selected to leave the first conductive film 321 intact, thereby removing the exposed insulating film 323. As a result, the exposure region 371 of the photosensitive material 370 corresponding to the peripheral wall portion 343 is in contact with the insulating film 323, the base portion 342 is in contact with the second conductive film 322, and the void region where neither the exposure region 371 nor the base portion 342 exists is in a state where the first conductive film 321 is exposed. 【0097】 As a result, an electroforming mold 300, as shown in Figure 5, is manufactured, comprising a first mold part L1 having a base 342 positioned in contact with the second conductive film 322, a first cavity 341 formed outside the base 342, and a peripheral wall 343 (corresponding to the first peripheral wall) formed outside the first cavity 341 with photosensitive material 370 (exposure region 371), and a second mold part L2 having a second cavity 351 and a peripheral wall 343 (corresponding to the second peripheral wall) formed with photosensitive material 380 (exposure region 381). 【0098】 (Manufacturing method for electroformed products) The electroformed mold 300 manufactured as described above is used to produce the electroformed product 501 through the electroforming process shown below. 【0099】 In other words, the electroforming mold 300 is immersed in an electroplating solution together with the anode, as in Figure 6D, and an electroplating process is carried out in which electricity is passed between the anode and the first conductive film 321. As a result, the plating grows from the first conductive film 321, the plating fills the first cavity 341, and the plating that fills the first cavity 341 becomes the first electroformed part 510 of the electroformed product 501. 【0100】 In this case, the second conductive film 322 is electrically isolated from the first conductive film 321 by the insulating film 323 placed between it and the first conductive film 321, so that plating does not grow from the base 342 of the conductive material that is in contact with the second conductive film 322. 【0101】 Furthermore, the side surface 342b of the base portion 342 is electrically isolated from the first cavity portion 341 by an insulating film 332 formed of the photosensitive material 370 (exposure region 371), so that the plating grown in the first cavity portion 341 does not make electrical contact with the base portion 342. 【0102】 As the plating progresses further, the plating that has overflowed from the first cavity 341 reaches the intermediate conductive film 331, and the plating becomes electrically connected to the intermediate conductive film 331, causing the plating to begin growing from the entire surface of the intermediate conductive film 331 and filling the second cavity 351. The plating that has filled the second cavity 351 becomes the second electroformed portion 520 of the electroformed product 501. 【0103】 Here, since the base 342 of the electroformed mold 300 is formed of a conductive material, the bonding force between the intermediate conductive film 331 and the base 342 at the stepped surface between the first cavity 341 of the first layer and the second cavity 351 of the second layer is greater than the bonding force between the intermediate conductive film 131 and the base 142 when the base 342 is formed of a photosensitive material. Therefore, even if plating grows from the intermediate conductive film 331 during the manufacturing process of the electroformed product 501, and tensile or compressive stress is generated in the plating, the intermediate conductive film 331 will not peel off from the base 342. 【0104】 Furthermore, in the manufacturing process of the electroformed product 501, if the upper surface of the second electroformed section 520 is ground flat after the electroformed product 501 has been formed up to the second electroformed section 520, the electroforming mold 300 prevents the intermediate conductive film 331 from peeling off from the base 342, even if mechanical vibrations and shear stresses from grinding are transmitted to the boundary between the intermediate conductive film 331 and the base 342 via the second electroformed section 520. 【0105】 Figures 7A-7C are schematic cross-sectional views illustrating the process of separating the electroformed product 501 from the electroforming mold 300. Through the electroforming process described above, the electroformed product 501 is formed by transferring it to the electroforming mold 300, as shown in Figure 7A. Then, the peripheral wall portion 343 formed by the photosensitive material 370 (exposure region 371) and the photosensitive material 380 (exposure region 381) is removed, as shown in Figure 7B, and the insulating film 323 and the first conductive film 321 are removed by etching, and the electroformed product 501 is separated from the electroforming mold 300, as shown in Figure 7C. 【0106】 Then, by removing the photosensitive material 370 (exposure area 371) present between the first electroformed part 510 and the base part 342, and further removing the intermediate conductive film 331 by etching, the base part 342 can be separated from the electroformed product 501, and the electroformed product 501 can be manufactured. 【0107】 Furthermore, if the electroformed product to be manufactured is one in which the base 342 is integrated into the cavity 540 of the electroformed product 501 shown in Figure 4, the electroformed product can be manufactured in the state shown in Figure 7C without separating the base 342. 【0108】 The electroforming mold 300 of Embodiment 2 described above is formed in a different shape from the electroforming mold 100 of Embodiment 1 in order to manufacture an electroforming product 501 with a different shape from the electroforming product 1 shown in Embodiment 1. However, it goes without saying that the electroforming mold 300 can manufacture an electroforming product with the same shape as the electroforming product 1 by changing the arrangement of the base portion 342. 【0109】 In the electroforming mold 100 of Embodiment 1 and the electroforming mold 300 of Embodiment 2 described above, an oxidation prevention layer made of a conductive material such as gold (Au) may be formed on the exposed surface (upper surface not in contact with the base 142, 342) of the intermediate conductive films 131, 331 to prevent oxidation of the intermediate conductive films 131, 331. 【0110】 The embodiments described above are electroforming molds and methods for manufacturing electroforming molds, which produce electroforming products having a two-layer structure consisting of a first mold part L1 and a second mold part L2. However, the electroforming molds and methods for manufacturing electroforming molds according to the present invention are not limited to electroforming molds and methods for manufacturing electroforming molds that produce electroforming products with a two-layer structure, but also include electroforming molds and methods for manufacturing electroforming molds that produce electroforming products with three or more layers. [Explanation of Symbols] 【0111】 1. Electroformed products 10. First electroforming section 20 Second Electroforming Section 100 electroformed molds 110 circuit boards 121 First conductive film 122 Second conductive film 123 Gap 131 Intermediate conductive film 132 Insulating film 141 First cavity 142 Base 142a Top side 142b Side 151 2nd cavity L1 1st mold part L2 2nd mold part

Claims

[Claim 1] circuit board and A first mold portion formed on the substrate, having a first cavity corresponding to the first electroformed portion of the electroformed product and a base made of a conductive material, The present invention comprises a second mold portion formed on the first mold portion, having a second cavity portion that extends above the base portion and corresponds to the second electroformed portion of the electroformed product, The side surface of the base facing the first cavity is covered with an insulating film. An electroforming mold in which a first conductive film formed on the surface of the substrate facing the first cavity and a second conductive film formed on the surface of the base facing the substrate are electrically isolated. [Claim 2] The electroforming mold according to claim 1, wherein an intermediate conductive film is formed on the upper surface of the base facing the second cavity. [Claim 3] The electroforming mold according to claim 1, wherein the first conductive film and the second conductive film are formed with a gap between them in the in-plane direction of the surface of the substrate. [Claim 4] The electroforming mold according to claim 1, wherein the first conductive film and the second conductive film are formed in the thickness direction of the substrate via an insulating film. [Claim 5] The electroforming mold according to any one of claims 1 to 4, wherein the first conductive film and the second conductive film are formed of different materials that are electrically conductive. [Claim 6] A manufacturing method for producing an electroformed mold, comprising a first mold portion having a first cavity, a base portion and a first peripheral wall portion formed of a conductive material, and a second mold portion formed on the first mold portion having a second cavity and a second peripheral wall portion, wherein the first mold portion is integrally formed, A first conductive film is formed on the entire surface of the substrate. The first conductive film is removed, leaving at least the area that forms the first cavity and the area that forms the first peripheral wall. A second conductive film is formed on the first conductive film and on the substrate exposed after the first conductive film has been removed. The base portion is formed on the portion of the second conductive film that is in contact with the substrate. The portion of the second conductive film formed on the first conductive film and the portion surrounding the first conductive film are removed to form a gap between the first conductive film and the second conductive film in the in-plane direction of the surface of the substrate. An insulating film of photosensitive material is formed on the side surface of the base. A method for manufacturing an electroformed mold, comprising forming the first peripheral wall portion, which is made of a photosensitive material, on the outside of the base portion, on the first conductive film or on the gap between the first conductive film and the base portion. [Claim 7] A manufacturing method for producing an electroformed mold, comprising a first mold portion having a first cavity, a base portion and a first peripheral wall portion formed of a conductive material, and a second mold portion formed on the first mold portion having a second cavity and a second peripheral wall portion, wherein the first mold portion is integrally formed, A first conductive film is formed on the substrate. An insulating film is formed on the first conductive film, A second conductive film is formed on the insulating film. The base is formed on a predetermined area of ​​the second conductive film. The second conductive film is removed, leaving the portion of the second conductive film in which the base is formed, to expose the insulating film. An insulating film of photosensitive material is formed on the side surface of the base. The first peripheral wall portion, made of a photosensitive material, is formed on the insulating film, excluding the first cavity portion and the base portion. A method for manufacturing an electroforming mold, comprising removing the portion of the insulating film facing the first cavity to expose the first conductive film. [Claim 8] A method for manufacturing an electroformed mold according to claim 6 or 7, wherein an intermediate conductive film is formed on the upper surface of the base facing the second cavity.

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