Adhesive compound, adhesive tape, joint, and method for electrically attaching and detaching the joint.

Abstract

We provide an adhesive compound that allows for a greater reduction in adhesive strength by applying voltage. [Solution] The present invention relates to an adhesive compound, an adhesive tape, a joint, a method for electrically attaching and detaching a joint, and the use of the adhesive compound or adhesive tape for joining components in electronic devices, automobiles, medical devices and dental devices. The adhesive compound comprises a) at least one primary ionic liquid having a pH of 7 or less, and b) at least one secondary ionic liquid having a pH greater than 7, wherein the pure mixture of all ionic liquids contained in the adhesive compound and having a) a pH of 7 or less and b) a pH greater than 7 has a pH between 5.5 and 9.

Claims

1. a) At least one primary ionic liquid having a pH of 7 or less, b) At least one second ionic liquid having a pH greater than 7, An adhesive compound containing, An adhesive compound wherein a) a pure mixture of total ionic liquids having a pH less than 7 and b) a pH greater than 7 has a pH between 5.5 and 9.

2. The adhesive compound according to claim 1, wherein the pure mixture of ionic liquids a) and b) has a pH value of 6.5 to 9, preferably 7 to 9, more preferably 7 to 8.5, very preferably 7.3 to 8.2, and more specifically 7.5 to 8.

3. As the first ionic liquid a), an ionic liquid having a pH of 7 or less is included, this ionic liquid a) contains an imidazolium-based cation, and / or this ionic liquid a) has the following anions, namely hexafluorophosphate (PF － , ２ , ２ , － － ), bis(trifluoromethylsulfonyl)imide (CF ３ SO ２ ), TFSI), bis(fluorosulfonyl)imide ((FSO ２ N － , FSI), trifluoromethanesulfonate (CF ２ ), OTf, triflate), acetate (CH ２ COO － ), methylsulfate (CH ３ OSO ３ － ), tetrafluoroborate (BF ３ COO － ), acetate (CH ３ OSO ３ － ), tetrafluoroborate (BF ４ － ), thiocyanate (SCN － ), benzoate and dicyanamide (N(CN) ２ － ), the adhesive compound according to claim 1 or 2, containing an anion selected from the group consisting of).

4. a) As a primary ionic liquid having a pH of 7 or less, 1-butyl-3-methylimidazolium hexafluorophosphate (BMIM-PF ６ ), at least one ionic liquid selected from the group consisting of 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide (EMIM-FSI), 1-butyl-3-methylimidazolium bis(fluorosulfonyl)imide (BMIM-FSI), and 1-butyl-3-methylimidazolium benzoate (BMIM-benzoate), more preferably 1-butyl-3-methylimidazolium hexafluorophosphate (BMIM-PF ６ The liquid comprises at least one ionic liquid selected from the group consisting of ) and 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide (EMIM-FSI), and 1-butyl-3-methylimidazolium hexafluorophosphate (BMIM-PF ６ The adhesive compound according to any one of claims 1 to 3, wherein the following is particularly preferred.

5. The second ionic liquid b) includes an ionic liquid having a pH greater than 7, wherein this ionic liquid b) contains a cation selected from the group consisting of imidazolium-based cations and pyrrolidinium-based cations, and / or this ionic liquid b) contains the following anion, namely acetate (CH4). ３ COO － ), ethyl sulfate (CH ３ CH ２ OSO ３ － ), diethyl phosphate, octanoate, benzoate, tricyanomethanide (C(CN) ３ － ) and dicyanamide (N(CN) ２ － The adhesive compound according to any one of claims 1 to 4, comprising an anion selected from the group consisting of ).

6. b) as a second ionic liquid having a pH greater than 7, 1-ethyl-3-methylimidazolium dicyanamide (EMIM-N(CN) ２ ), comprising at least one ionic liquid selected from the group consisting of 1-ethyl-3-methylimidazolium benzoate, 1-ethyl-3-methylimidazolium diethyl phosphate and 1-ethyl-3-methylimidazolium ethyl sulfate, and 1-ethyl-3-methylimidazolium dicyanamide (EMIM-N(CN) ２ The adhesive compound according to any one of claims 1 to 5, wherein the following is particularly preferred.

7. An adhesive compound according to any one of claims 1 to 6, comprising at least one type of poly(meth)acrylate.

8. The poly(meth)acrylate is based on a monomer composition containing more than 15% by weight of at least one acrylamide as a nitrogen-containing (meth)acrylate monomer, and the acrylamide is preferably dimethylaminopropyl acrylamide, dimethylaminopropyl methacrylamide, N-(1-methylundecyl)acrylamide, N-(n-butoxymethyl)acrylamide, N-(butoxymethyl)methacrylamide, N-(ethoxymethyl)acrylamide, N-(n-octadecyl)acrylamide, or N,N-dialkyl-substituted amide. The adhesive compound according to claim 7, for example, selected from the group consisting of N,N-dimethylacrylamide, N,N-dimethylmethacrylamide, N,N-diethylacrylamide and N,N-diethylmethacrylamide, N-benzylacrylamide, N-isopropylacrylamide, N-tert-butylacrylamide, N-tert-octylacrylamide, N-methylolacrylamide, and N-methylolmethacrylamide, more preferably selected from the group consisting of N,N-dimethylacrylamide and N,N-diethylacrylamide.

9. The adhesive compound according to claim 7 or 8, wherein the monomer composition comprises 5% to 35% by weight, preferably 8% to 35% by weight, of at least one hydroxyl-containing (meth)acrylate monomer, the hydroxyl-containing (meth)acrylate monomer is preferably selected from the group consisting of 4-hydroxybutyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxybutyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate, 2-hydroxyisopropyl acrylate, and 2-hydroxyethyl acrylamide, more preferably selected from the group consisting of 4-hydroxybutyl acrylate, 2-hydroxyisopropyl acrylate, and 2-hydroxyethyl acrylate, and the hydroxyl-containing (meth)acrylate monomer is very preferably 4-hydroxybutyl acrylate.

10. The monomer composition comprises 5% to 85% by weight of at least one (meth)acrylate monomer that does not contain further functional groups, and the at least one (meth)acrylate monomer that does not contain further functional groups is n-butyl acrylate, n-butyl methacrylate, n-pentyl acrylate, n-pentyl methacrylate, n-hexyl acrylate, n-hexyl methacrylate, n-heptyl acrylate, n-octyl acrylate, n-octyl methacrylate, n-nonyl acrylate, isobutyl acrylate, isooctyl acrylate, isooctyl methacrylate, 2-ethyl methacrylate The adhesive compound according to any one of claims 7 to 9, wherein the (meth)acrylate monomer, selected from the group consisting of xyl acrylate, 2-ethylhexyl methacrylate, 2-propylheptyl acrylate, and 2-propylheptyl methacrylate, and which does not contain any further functional groups, is more preferably selected from the group consisting of n-butyl acrylate, n-hexyl acrylate, n-octyl acrylate, isooctyl acrylate, 2-ethylhexyl acrylate, and 2-propylheptyl acrylate, with n-butyl acrylate and / or 2-ethylhexyl acrylate being very preferred.

11. An adhesive tape comprising at least one adhesive compound layer D of the adhesive compound according to any one of claims 1 to 10.

12. The adhesive tape according to claim 11, wherein the adhesive tape is an adhesive transfer tape and comprises the adhesive compound layer D.

13. At least the next layer: - Second adhesive compound layer C; and - At least one conductive carrier layer T disposed between layers D and C; The adhesive tape according to claim 11, further comprising:

14. At least the next layer: - Second adhesive compound layer C; and - At least one first conductive carrier layer T disposed between layers D and C; and - At least one second conductive carrier layer T' disposed on the surface of the adhesive compound layer D opposite to the first conductive carrier layer T; and - A third adhesive compound layer C' is disposed on the surface of the second carrier layer T' opposite to the first adhesive compound layer D; The adhesive tape according to claim 11, further comprising:

15. At least the next layer: - First base material A; and • Second base material B; and - An adhesive tape according to any one of claims 11 to 14, which is placed between base material A and base material B to join base materials A and B together; Includes, In particular, the adhesive tape is designed to be conductive at one or more contact points between base material A and base material B, or at least one of each base material, or at two different contact points between the adhesive tape and the base material. zygote.

16. A method for electrically attaching and detaching a joint according to claim 15, comprising at least the following method steps: i.) Apply a voltage to two different conductive contacts of the joint, where the voltage is preferably between 1 and 50V, step, Methods that include...

17. Use of an adhesive compound according to any one of claims 1 to 10 or an adhesive tape according to any one of claims 11 to 14 for joining components in electronic devices, automobiles, medical devices and dental devices.

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