Adhesive compound, adhesive tape, joint, and method for electrically attaching and detaching the joint.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- TESA SE
- Filing Date
- 2025-11-25
- Publication Date
- 2026-06-15
Smart Images

Figure 2026096937000001_ABST
Abstract
Claims
[Claim 1] a) At least one primary ionic liquid having a pH of 7 or less, b) At least one second ionic liquid having a pH greater than 7, An adhesive compound containing, An adhesive compound wherein a) a pure mixture of total ionic liquids having a pH less than 7 and b) a pH greater than 7 has a pH between 5.5 and 9. [Claim 2] The adhesive compound according to claim 1, wherein the pure mixture of ionic liquids a) and b) has a pH value of 6.5 to 9, preferably 7 to 9, more preferably 7 to 8.5, very preferably 7.3 to 8.2, and more specifically 7.5 to 8. [Claim 3] As the first ionic liquid a), an ionic liquid having a pH of 7 or less is included, this ionic liquid a) contains an imidazolium-based cation, and / or this ionic liquid a) has the following anions, namely hexafluorophosphate (PF - , 2 , 2 , - - ), bis(trifluoromethylsulfonyl)imide (CF 3 SO 2 ), TFSI), bis(fluorosulfonyl)imide ((FSO 2 N - , FSI), trifluoromethanesulfonate (CF 2 ), OTf, triflate), acetate (CH 2 COO - ), methylsulfate (CH 3 OSO 3 - ), tetrafluoroborate (BF 3 COO - ), acetate (CH 3 OSO 3 - ), tetrafluoroborate (BF 4 - ), thiocyanate (SCN - ), benzoate and dicyanamide (N(CN) 2 - ), the adhesive compound according to claim 1 or 2, containing an anion selected from the group consisting of). [Claim 4] a) As a primary ionic liquid having a pH of 7 or less, 1-butyl-3-methylimidazolium hexafluorophosphate (BMIM-PF 6 ), at least one ionic liquid selected from the group consisting of 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide (EMIM-FSI), 1-butyl-3-methylimidazolium bis(fluorosulfonyl)imide (BMIM-FSI), and 1-butyl-3-methylimidazolium benzoate (BMIM-benzoate), more preferably 1-butyl-3-methylimidazolium hexafluorophosphate (BMIM-PF 6 The liquid comprises at least one ionic liquid selected from the group consisting of ) and 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide (EMIM-FSI), and 1-butyl-3-methylimidazolium hexafluorophosphate (BMIM-PF 6 The adhesive compound according to any one of claims 1 to 3, wherein the following is particularly preferred. [Claim 5] The second ionic liquid b) includes an ionic liquid having a pH greater than 7, wherein this ionic liquid b) contains a cation selected from the group consisting of imidazolium-based cations and pyrrolidinium-based cations, and / or this ionic liquid b) contains the following anion, namely acetate (CH4). 3 COO - ), ethyl sulfate (CH 3 CH 2 OSO 3 - ), diethyl phosphate, octanoate, benzoate, tricyanomethanide (C(CN) 3 - ) and dicyanamide (N(CN) 2 - The adhesive compound according to any one of claims 1 to 4, comprising an anion selected from the group consisting of ). [Claim 6] b) as a second ionic liquid having a pH greater than 7, 1-ethyl-3-methylimidazolium dicyanamide (EMIM-N(CN) 2 ), comprising at least one ionic liquid selected from the group consisting of 1-ethyl-3-methylimidazolium benzoate, 1-ethyl-3-methylimidazolium diethyl phosphate and 1-ethyl-3-methylimidazolium ethyl sulfate, and 1-ethyl-3-methylimidazolium dicyanamide (EMIM-N(CN) 2 The adhesive compound according to any one of claims 1 to 5, wherein the following is particularly preferred. [Claim 7] An adhesive compound according to any one of claims 1 to 6, comprising at least one type of poly(meth)acrylate. [Claim 8] The poly(meth)acrylate is based on a monomer composition containing more than 15% by weight of at least one acrylamide as a nitrogen-containing (meth)acrylate monomer, and the acrylamide is preferably dimethylaminopropyl acrylamide, dimethylaminopropyl methacrylamide, N-(1-methylundecyl)acrylamide, N-(n-butoxymethyl)acrylamide, N-(butoxymethyl)methacrylamide, N-(ethoxymethyl)acrylamide, N-(n-octadecyl)acrylamide, or N,N-dialkyl-substituted amide. The adhesive compound according to claim 7, for example, selected from the group consisting of N,N-dimethylacrylamide, N,N-dimethylmethacrylamide, N,N-diethylacrylamide and N,N-diethylmethacrylamide, N-benzylacrylamide, N-isopropylacrylamide, N-tert-butylacrylamide, N-tert-octylacrylamide, N-methylolacrylamide, and N-methylolmethacrylamide, more preferably selected from the group consisting of N,N-dimethylacrylamide and N,N-diethylacrylamide. [Claim 9] The adhesive compound according to claim 7 or 8, wherein the monomer composition comprises 5% to 35% by weight, preferably 8% to 35% by weight, of at least one hydroxyl-containing (meth)acrylate monomer, the hydroxyl-containing (meth)acrylate monomer is preferably selected from the group consisting of 4-hydroxybutyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxybutyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate, 2-hydroxyisopropyl acrylate, and 2-hydroxyethyl acrylamide, more preferably selected from the group consisting of 4-hydroxybutyl acrylate, 2-hydroxyisopropyl acrylate, and 2-hydroxyethyl acrylate, and the hydroxyl-containing (meth)acrylate monomer is very preferably 4-hydroxybutyl acrylate. [Claim 10] The monomer composition comprises 5% to 85% by weight of at least one (meth)acrylate monomer that does not contain further functional groups, and the at least one (meth)acrylate monomer that does not contain further functional groups is n-butyl acrylate, n-butyl methacrylate, n-pentyl acrylate, n-pentyl methacrylate, n-hexyl acrylate, n-hexyl methacrylate, n-heptyl acrylate, n-octyl acrylate, n-octyl methacrylate, n-nonyl acrylate, isobutyl acrylate, isooctyl acrylate, isooctyl methacrylate, 2-ethyl methacrylate The adhesive compound according to any one of claims 7 to 9, wherein the (meth)acrylate monomer, selected from the group consisting of xyl acrylate, 2-ethylhexyl methacrylate, 2-propylheptyl acrylate, and 2-propylheptyl methacrylate, and which does not contain any further functional groups, is more preferably selected from the group consisting of n-butyl acrylate, n-hexyl acrylate, n-octyl acrylate, isooctyl acrylate, 2-ethylhexyl acrylate, and 2-propylheptyl acrylate, with n-butyl acrylate and / or 2-ethylhexyl acrylate being very preferred. [Claim 11] An adhesive tape comprising at least one adhesive compound layer D of the adhesive compound according to any one of claims 1 to 10. [Claim 12] The adhesive tape according to claim 11, wherein the adhesive tape is an adhesive transfer tape and comprises the adhesive compound layer D. [Claim 13] At least the next layer: - Second adhesive compound layer C; and - At least one conductive carrier layer T disposed between layers D and C; The adhesive tape according to claim 11, further comprising: [Claim 14] At least the next layer: - Second adhesive compound layer C; and - At least one first conductive carrier layer T disposed between layers D and C; and - At least one second conductive carrier layer T' disposed on the surface of the adhesive compound layer D opposite to the first conductive carrier layer T; and - A third adhesive compound layer C' is disposed on the surface of the second carrier layer T' opposite to the first adhesive compound layer D; The adhesive tape according to claim 11, further comprising: [Claim 15] At least the next layer: - First base material A; and • Second base material B; and - An adhesive tape according to any one of claims 11 to 14, which is placed between base material A and base material B to join base materials A and B together; Includes, In particular, the adhesive tape is designed to be conductive at one or more contact points between base material A and base material B, or at least one of each base material, or at two different contact points between the adhesive tape and the base material. zygote. [Claim 16] A method for electrically attaching and detaching a joint according to claim 15, comprising at least the following method steps: i.) Apply a voltage to two different conductive contacts of the joint, where the voltage is preferably between 1 and 50V, step, Methods that include... [Claim 17] Use of an adhesive compound according to any one of claims 1 to 10 or an adhesive tape according to any one of claims 11 to 14 for joining components in electronic devices, automobiles, medical devices and dental devices.