Measuring instruments and connection structures

JP2026097574APending Publication Date: 2026-06-16MITUTOYO CORP

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
MITUTOYO CORP
Filing Date
2024-12-04
Publication Date
2026-06-16

AI Technical Summary

Benefits of technology

【0007】 本発明によれば、部材の接着不良による測定機器の検出の精度低下を防止できる測定機器を提供することができるという効果を奏する。

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Abstract

To provide a measuring instrument that can prevent a decrease in detection accuracy due to poor adhesion of components. [Solution] This measuring instrument S100 comprises a main body 10, a measuring probe 20 movable relative to the main body 10, a movable member 30 provided to move together with the measuring probe 20, a scale member 40 fixed to a part of the movable member 30, and a detection member 50 that electrically detects the displacement of the scale member 40. The movable member 30 and the scale member 40 are fixed to each other by being bonded together with an adhesive S in an adhesive region R where the movable member 30 and the scale member 40 overlap. In the adhesive region R, a through hole 30h is formed in at least one of the movable member 30 and the scale member 40 into which the adhesive S enters.
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Claims

1. The main body and A measuring probe that is movable relative to the main body, A movable member provided to move together with the measuring probe, A scale member fixed to a part of the aforementioned movable member, A detection member for electrically detecting the displacement of the scale member, Equipped with, The movable member and the scale member are fixed to each other by being bonded together with an adhesive in the adhesive region where the movable member and the scale member overlap. In the bonding region, one or more through holes or one or more recesses into which the adhesive enters are formed in at least one of the movable member and the scale member. Measuring equipment.

2. The maximum length inside the through hole or recess is 20% or more of the length of the adhesive region in a direction perpendicular to the extending direction of the scale member. The measuring instrument according to claim 1.

3. The area of ​​the through hole or the area of ​​the recess is 20% or more of the area of ​​the adhesive region. The measuring instrument according to claim 1 or 2.

4. The total area of ​​the multiple through holes or the total area of ​​the multiple recesses is 20% or more of the area of ​​the adhesive region. The measuring instrument according to claim 1 or 2.

5. Of the movable member and the scale member, the thickness of the movable member or the scale member in which the through hole is formed is greater than the thickness of the gap in which the adhesive is filled. The measuring instrument according to claim 1 or 2.

6. The aforementioned adhesive is a photocurable adhesive that hardens when exposed to light. The through hole is formed in at least one of the movable member and the scale member. The measuring instrument according to claim 1 or 2.

7. A measuring probe is provided so as to be movable relative to the main body, A movable member provided to move together with the measuring probe, A scale member fixed to a part of the aforementioned movable member, Equipped with, The movable member and the scale member are fixed to each other by being bonded together with an adhesive in the adhesive region where the movable member and the scale member overlap. In the bonding region, one or more through holes or one or more recesses into which the adhesive enters are formed in at least one of the movable member and the scale member. Connection structure.

8. The aforementioned adhesive is a photocurable adhesive that hardens when exposed to light. The through hole is formed in at least one of the movable member and the scale member. The connection structure according to claim 7.