Substrate processing apparatus and method for detecting conditions inside the processing container

Abstract

Efficiently detects the conditions inside the processing container. [Solution] The substrate processing apparatus comprises a processing container, an imaging unit, and a control unit. The processing container has a processing space capable of accommodating a substrate and an input / output port through which the substrate is loaded into and out of the processing space. The imaging unit captures an imaging region including the input / output port and the processing space inside the processing container exposed from the input / output port. The control unit detects the state of the substrate inside the processing container based on the brightness value of the image captured by the imaging unit.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus and a method for detecting the situation inside a processing container.

Background Art

[0002] In Patent Document 1, when loading a substrate into a processing container, an image of the substrate loading outlet of the processing container is captured using a camera provided on a transfer arm that transfers the substrate, and the situation inside the processing container is detected by comparing the captured image of the camera with a reference image.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique capable of appropriately detecting the situation inside a processing container.

Means for Solving the Problems

[0005] [[ID=4b]] A substrate processing apparatus according to an aspect of the present disclosure includes a processing container, an imaging unit, and a control unit. The processing container has a processing space capable of accommodating a substrate and a loading outlet through which the substrate is loaded into and unloaded from the processing space. The imaging unit captures an imaging region including the loading outlet and the processing space inside the processing container exposed from the loading outlet. The control unit determines the state of the substrate inside the processing container based on the luminance value of the captured image captured by the imaging unit.

Effects of the Invention

[0006] According to the present disclosure, the situation inside the processing container can be efficiently detected.

Brief Description of the Drawings

[0007] [Figure 1] Figure 1 shows the configuration of a substrate processing apparatus according to an embodiment. [Figure 2] Figure 2 shows the configuration of the liquid processing unit according to the embodiment. [Figure 3] Figure 3 is a schematic side cross-sectional view showing the configuration of a drying unit according to an embodiment. [Figure 4] Figure 4 is a schematic side cross-sectional view showing the configuration of a drying unit according to an embodiment. [Figure 5] Figure 5 is a schematic side cross-sectional view showing the configuration of a drying unit according to an embodiment. [Figure 6] Figure 6 is a cross-sectional view along the line VI-VI in Figure 3. [Figure 7] Figure 7 is an enlarged view showing the configuration of the lighting unit and its surroundings according to the embodiment. [Figure 8] Figure 8 is a cross-sectional view along the line VIII-VIII in Figure 7. [Figure 9] Figure 9 is a flowchart showing the steps of the processing performed by the substrate processing apparatus according to the embodiment. [Figure 10] Figure 10 is a flowchart showing the procedure for detecting the conditions inside the first processing container according to the embodiment. [Figure 11] Figure 11 is a flowchart showing the procedure for detecting the presence or absence of a substrate, which is performed by the control unit according to the embodiment. [Figure 12] Figure 12 is a diagram illustrating the first process according to the embodiment. [Figure 13] Figure 13 is a diagram illustrating the first process according to the embodiment. [Figure 14] Figure 14 is a diagram illustrating the first process according to the embodiment. [Figure 15] Figure 15 is a diagram illustrating the second process according to the embodiment. [Figure 16] Figure 16 is a diagram illustrating the third process according to the embodiment. [Figure 17]FIG. 17 is a diagram for explaining the third process according to the embodiment. [Figure 18] FIG. 18 is a flowchart showing the procedure of the in-container situation detection process for the second process according to the embodiment. [Figure 19] FIG. 19 is a flowchart showing the procedure of the substrate detachment presence / absence detection process executed by the control unit according to the embodiment. [Figure 20] FIG. 20 is a diagram for explaining another example of the third process according to the embodiment. [Figure 21] FIG. 21 is a diagram for explaining another example of the third process according to the embodiment. [Figure 22] FIG. 22 is a flowchart showing the procedure of the substrate presence / absence detection process executed by the control unit according to Modification Example 1 of the embodiment. [Figure 23] FIG. 23 is a diagram for explaining the fourth process according to Modification Example 1 of the embodiment. [Figure 24] FIG. 24 is a diagram for explaining the fifth process according to Modification Example 1 of the embodiment. [Figure 25] FIG. 25 is a diagram for explaining the sixth process according to Modification Example 1 of the embodiment. [Figure 26] FIG. 26 is a diagram for explaining the seventh process according to Modification Example 1 of the embodiment. [Figure 27] FIG. 27 is a diagram for explaining the eighth process according to Modification Example 1 of the embodiment. [Figure 28] FIG. 28 is a flowchart showing the procedure of the substrate detachment presence / absence detection process executed by the control unit according to Modification Example 2 of the embodiment. [Figure 29] FIG. 29 is a diagram for explaining the ninth process according to Modification Example 2 of the embodiment. [Figure 30] FIG. 30 is a diagram for explaining the tenth process according to Modification Example 2 of the embodiment.

MODE FOR CARRYING OUT THE INVENTION

[0008] The embodiments for implementing the substrate processing apparatus and processing container condition detection method according to this disclosure (hereinafter referred to as "embodiments") will be described in detail below with reference to the drawings. However, this disclosure is not limited by these embodiments. Furthermore, each embodiment can be combined as appropriate, provided that the processing content is not inconsistent. Also, the same parts are denoted by the same reference numerals in each of the following embodiments, and redundant descriptions are omitted.

[0009] Furthermore, in the embodiments described below, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not require strict "constant," "orthogonal," "perpendicular," or "parallel." In other words, each of the above expressions allows for errors and tolerances, such as manufacturing accuracy and installation accuracy.

[0010] Furthermore, in the drawings referenced below, for the sake of clarity, mutually orthogonal X, Y, and Z axis directions are sometimes defined, and a Cartesian coordinate system is shown with the positive Z axis as the vertically upward direction. Also, the direction of rotation with the vertical axis as the center of rotation is sometimes referred to as the θ direction.

[0011] Patent Document 1 discloses a technique for detecting the conditions inside a processing container by using a camera mounted on a transport arm that transports the substrate to image the substrate loading / unloading port of the processing container when loading a substrate into the processing container, and comparing the image captured by the camera with a reference image.

[0012] However, techniques that compare captured images with reference images struggle with high-speed processing and make it difficult to efficiently detect the conditions inside the processing container. Therefore, there is a need for techniques that can efficiently detect the conditions inside the processing container.

[0013] (Embodiment) <Configuration of the substrate processing system> First, the configuration of the substrate processing apparatus according to the embodiment will be described with reference to Figure 1. Figure 1 is a diagram showing the configuration of the substrate processing apparatus according to the embodiment.

[0014] As shown in Figure 1, the substrate processing apparatus 1 comprises an input / output station 2 and a processing station 3. The input / output station 2 and the processing station 3 are located adjacent to each other.

[0015] The loading / unloading station 2 comprises a carrier mounting section 11 and a transport section 12. Multiple carriers C, each capable of holding multiple semiconductor wafers (hereinafter referred to as "wafers W") in a horizontal position, are mounted on the carrier mounting section 11.

[0016] The transport section 12 is provided adjacent to the carrier mounting section 11. Inside the transport section 12, a transport device 13 and a transfer section 14 are arranged.

[0017] The transport device 13 includes a wafer holding mechanism for holding the wafer W. The transport device 13 is also capable of moving horizontally and vertically, as well as rotating about the vertical axis, and uses the wafer holding mechanism to transport the wafer W between the carrier C and the transfer unit 14.

[0018] The processing station 3 is located adjacent to the transport unit 12. The processing station 3 comprises a transport block 4, a first processing block 5, and a second processing block 6.

[0019] The transport block 4 comprises a transport area 15 and a transport device 16. The transport area 15 is, for example, a rectangular parallelepiped region extending along the direction of alignment (X-axis direction) of the loading / unloading station 2 and the processing station 3. The transport device 16 is arranged in the transport area 15.

[0020] The transport device 16 is equipped with a wafer holding mechanism for holding wafers W. The transport device 16 is capable of moving horizontally and vertically, as well as rotating about a vertical axis, and uses the wafer holding mechanism to transport wafers W between the transfer section 14, the first processing block 5, and the second processing block 6.

[0021] The first processing block 5 and the second processing block 6 are arranged adjacent to the transport area 15 on both sides of the transport area 15. Specifically, the first processing block 5 is arranged on one side (negative Y-axis side) of the transport area 15 in the direction (Y-axis direction) perpendicular to the direction (X-axis direction) in which the loading / unloading stations 2 and processing stations 3 are aligned. The second processing block 6 is arranged on the other side (positive Y-axis side) of the transport area 15 in the direction (Y-axis direction) perpendicular to the direction (X-axis direction) in which the loading / unloading stations 2 and processing stations 3 are aligned.

[0022] The first processing block 5 includes a liquid processing unit 17.

[0023] The liquid treatment unit 17 performs a cleaning process to clean the upper surface of the wafer W, which is the pattern formation surface. The liquid treatment unit 17 also performs a liquid film formation process to form a liquid film on the upper surface of the wafer W after the cleaning process. The configuration of the liquid treatment unit 17 will be described later.

[0024] The second processing block 6 includes a drying unit 18 and a supply unit 19.

[0025] The drying unit 18 performs supercritical drying on the wafer W after the liquid film formation treatment. Specifically, the drying unit 18 dries the wafer W by bringing it into contact with a processing fluid in a supercritical state (hereinafter also referred to as "supercritical fluid"). The configuration of the drying unit 18 will be described later.

[0026] The supply unit 19 supplies the processing fluid to the drying unit 18. Specifically, the supply unit 19 comprises a group of supply equipment including a flow meter, a flow regulator, a back pressure valve, a heater, etc., and a housing that accommodates the group of supply equipment. In this embodiment, the supply unit 19 supplies CO2 as the processing fluid to the drying unit 18.

[0027] The substrate processing apparatus 1 includes a control device 7. The control device 7 is, for example, a computer and comprises a control unit 71 and a storage unit 72.

[0028] The control unit 71 includes a microcomputer having a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), input / output ports, and various circuits. The CPU of this microcomputer reads and executes programs stored in the ROM to control the transport devices 13 and 16, the liquid processing unit 17, the drying unit 18, and the supply unit 19, etc.

[0029] Such a program may have been recorded on a computer-readable recording medium and installed from that recording medium into the storage unit 72 of the control device 7. Examples of computer-readable recording media include hard disks (HDs), flexible disks (FDs), compact discs (CDs), magnetic optical discs (MOs), and memory cards.

[0030] The memory unit 72 is implemented by, for example, semiconductor memory elements such as RAM and flash memory, or storage devices such as hard disks and optical discs.

[0031] <Configuration of the liquid treatment unit> Next, the configuration of the liquid treatment unit 17 will be described with reference to Figure 2. Figure 2 is a diagram showing the configuration of the liquid treatment unit 17 according to the embodiment. The liquid treatment unit 17 is configured as a single-wafer cleaning device that cleans wafers W one by one by spin cleaning, for example.

[0032] As shown in Figure 2, the liquid treatment unit 17 holds the wafer W almost horizontally in a wafer holding mechanism 25 located in an outer chamber 23 that forms a processing space, and rotates the wafer W by rotating the wafer holding mechanism 25 around a vertical axis. The liquid treatment unit 17 then inserts a nozzle arm 26 above the rotating wafer W and supplies a chemical solution and rinse solution in a predetermined order from a chemical solution nozzle 26a provided at the tip of the nozzle arm 26, thereby performing a cleaning treatment on the surface of the wafer W.

[0033] The liquid processing unit 17 has a gas supply passage 25a formed inside the wafer holding mechanism 25. The liquid processing unit 17 supplies gas, such as nitrogen gas or other inert gas, from this gas supply passage 25a to the center of the back surface of the wafer W.

[0034] The cleaning process involves, for example, first removing particles and organic contaminants with an alkaline solution, SC1 solution (a mixture of ammonia and hydrogen peroxide), followed by rinsing with a rinse solution, deionized water (DIW). Next, the native oxide film is removed with an acidic solution, diluted hydrofluoric acid (DHF), followed by rinsing with DIW.

[0035] The various chemical solutions described above are collected in the outer chamber 23 and the inner cup 24 located inside the outer chamber 23, and discharged from the drain port 23a at the bottom of the outer chamber 23 and the drain port 24a at the bottom of the inner cup 24. Furthermore, the atmosphere inside the outer chamber 23 is exhausted from the exhaust port 23b at the bottom of the outer chamber 23.

[0036] The liquid film formation process is performed after the rinsing process in the cleaning process. Specifically, the liquid treatment unit 17 supplies IPA liquid to the front and back surfaces of the wafer W while rotating the wafer holding mechanism 25. This replaces the DIW remaining on both sides of the wafer W with IPA.

[0037] At this time, the liquid processing unit 17 supplies gas to the center of the back surface of the wafer W from the gas supply passage 25a. The gas supplied to the center of the back surface of the wafer W flows along the back surface of the wafer W toward the outer periphery of the back surface of the wafer W. This prevents the IPA supplied to the surface of the wafer W from flowing to the back surface of the wafer W during the liquid film formation process in the liquid processing unit 17. After that, the liquid processing unit 17 slowly stops the rotation of the wafer holding mechanism 25.

[0038] After the liquid film formation process is complete, the wafer W, with the liquid film of IPA liquid still formed on its surface, is transferred to the transport device 16 by a transfer mechanism provided in the wafer holding mechanism 25 and unloaded from the liquid processing unit 17. The liquid film formed on the wafer W prevents the pattern from collapsing due to evaporation (vaporization) of the liquid on the upper surface of the wafer W during transport of the wafer W from the liquid processing unit 17 to the drying unit 18, or during the loading operation into the drying unit 18.

[0039] <Drying unit configuration> Next, the configuration of the drying unit 18 will be described with reference to Figures 3 to 8. Figures 3 to 5 are schematic side cross-sectional views showing the configuration of the drying unit 18 according to the embodiment. Figure 6 is a cross-sectional view taken along the line VI-VI in Figure 3. Note that Figure 3 shows the lid 32 in the standby position, Figure 4 shows the lid 32 in the open position, and Figure 5 shows the lid 32 in the closed position.

[0040] As shown in Figures 3 to 5, the drying unit 18 comprises a processing container 31, lids 32 and 33, and a plurality of support pins 34.

[0041] The processing container 31 has a processing space 31a inside that can accommodate, for example, a wafer W with a diameter of 300 mm. During the supercritical drying process for the wafer W, the processing space 31a inside the processing container 31 is pressurized.

[0042] The processing container 31 has, for example, a rectangular shape in plan view, and has an input / output port 31b on one of its multiple (in this case, four) sides that faces the transport area 15, through which wafers W are loaded into and out of the processing space 31a. The processing container 31 has a maintenance port 31c located opposite the input / output port 31b across the processing space 31a. The maintenance port 31c connects the processing space 31a to the outside. The maintenance port 31c is used, for example, when performing maintenance on the processing container 31.

[0043] The lid 32 is positioned on one end (negative Y-axis direction) of the processing container 31 in the wafer transport direction (Y-axis direction) of the wafer W.

[0044] The lid 32 is configured to be able to close the loading / unloading port 31b of the processing container 31. That is, the lid 32 is connected to a rotation mechanism 32a and a linear motion mechanism 32b. The rotation mechanism 32a allows the lid 32 to rotate between a standby position shown in Figure 3 and an open position shown in Figure 4. The linear motion mechanism 32b allows the lid 32 to move between an open position shown in Figure 4 and a closed position shown in Figure 5. This allows the lid 32 to open or close the loading / unloading port 31b. The closed position is the position where the lid 32 closes the loading / unloading port 31b via the sealing member 321. The open position is a position away from the closed position in the direction of wafer W being unloaded from the processing space 31a (for example, in the negative Y-axis direction). The standby position is a position where the lid 32 does not interfere with the wafer W transport path R (see Figure 6) in the processing space 31a. With the lid 32 in the standby position, the loading / unloading port 31b is not blocked by the lid 32, allowing the transport device 16 to load the held wafer W from the loading / unloading port 31b into the processing space 31a. Also, with the lid 32 in the standby position, a portion of the sealing member 321 faces the second insertion hole 31g, which will be described later. For example, an O-ring can be used as the sealing member 321.

[0045] The lid 33 is positioned on the other end (positive Y-axis side) of the processing container 31 in the wafer transport direction (Y-axis direction) of the wafer W. The lid 33 closes the maintenance opening 31c of the processing container 31. The lid 33 closes the maintenance opening 31c via a sealing member 331. An O-ring can be used as the sealing member 321, for example.

[0046] Thus, the processing space 31a is a space with both ends open in the direction of wafer W transport, and the processing space 31a is sealed by closing the loading / unloading port 31b and the maintenance port 31c with covers 32 and 33, respectively.

[0047] The lid 33 is provided with a supply port 35. The supply port 35 is connected to a supply line (not shown) that supplies supercritical fluid to the drying unit 18. The processing space 31a is also provided with a discharge port 36. The discharge port 36 is connected to a discharge line (not shown) that discharges supercritical fluid and other fluids from the drying unit 18.

[0048] The supply port 35 opens horizontally toward the processing space 31a. The supercritical fluid supplied from a supply line (not shown) flows horizontally through the processing space 31a from the maintenance port 31c toward the inlet / outlet 31b.

[0049] The discharge port 36 is located near the input / output port 31b. For example, the discharge port 36 may open to the bottom surface of the processing space 31a near the input / output port 31b. The supercritical fluid that has flowed through the processing space 31a toward the input / output port 31b is discharged to the outside of the processing space 31a from the discharge port 36 via a discharge line (not shown). The supercritical fluid discharged to the outside of the processing space 31a may contain IPA liquid dissolved in the supercritical fluid from the surface of the wafer W.

[0050] Multiple support pins 34 are provided on the bottom surface of the processing space 31a to support the wafer W away from the bottom surface of the processing space 31a.

[0051] Within the drying unit 18, the IPA liquid between the patterns formed on the wafer W comes into contact with the supercritical fluid under high pressure (e.g., 16 MPa), gradually dissolving into the supercritical fluid, and the spaces between the patterns are gradually replaced by the supercritical fluid. Ultimately, the spaces between the patterns are filled solely with the supercritical fluid.

[0052] Then, after the IPA liquid is removed from between the patterns, the pressure inside the processing container 31 is reduced from a high-pressure state to atmospheric pressure, causing the CO2 to change from a supercritical state to a gaseous state, and the spaces between the patterns are filled only with gas. In this way, the IPA liquid between the patterns is removed, and the drying process of the wafer W is completed.

[0053] Supercritical fluids have lower viscosity than liquids (such as IPA liquid) and also have a higher ability to dissolve liquids. Furthermore, there is no interface between the supercritical fluid and the liquid or gas in equilibrium. As a result, drying processes using supercritical fluids can dry liquids without being affected by surface tension. Therefore, according to this embodiment, it is possible to suppress the collapse of patterns during the drying process.

[0054] In this embodiment, an example is shown in which IPA liquid is used as the liquid to prevent drying and supercritical CO2 is used as the processing fluid. However, a liquid other than IPA may be used as the liquid to prevent drying, and a fluid other than supercritical CO2 may be used as the processing fluid.

[0055] The processing container 31 has a first protrusion 31d and a second protrusion 31e that protrude from the loading / unloading port 31b toward the loading / unloading port side of the processing space 31a (in this case, the negative Y-axis direction side). The first protrusion 31d protrudes from the lower part of the loading / unloading port 31b toward the negative Y-axis direction, and the second protrusion 31e protrudes from the upper part of the loading / unloading port 31b toward the negative Y-axis direction.

[0056] The first projection 31d has a first through-hole 31f that connects the upper and lower surfaces of the first projection 31d. The second projection 31e has a second through-hole 31g that connects the upper and lower surfaces of the second projection 31e at a position vertically opposite to the first through-hole 31f. A locking member 51, which will be described later, is inserted through the first through-hole 31f and the second through-hole 31g.

[0057] Furthermore, the processing container 31 has a shielding plate 42 that shields the space 311 between the first protrusion 31d and the second protrusion 31e from the negative Y-axis direction. The shielding plate 42 has a recess that is recessed toward the space 311, and the imaging unit 41 and illumination unit 44, which will be described later, are housed in this recess.

[0058] The shielding plate 42 has an opening 42a for passing the wafer W through, located opposite the input / output port 31b across the space 311. The processing container 31 may also have other shielding plates (not shown) that shield two sides of the space 311 (here, the side on the positive X-axis side and the side on the negative X-axis side).

[0059] As shown in Figures 3 and 6, the drying unit 18 includes an imaging unit 41. The imaging unit 41 images an imaging region that includes the input / output port 31b and the processing space 31a inside the processing container 31 that is exposed from the input / output port 31b, while the input / output port 31b is not blocked by the lid 32.

[0060] The imaging unit 41 is positioned so as not to overlap, in a plan view, with the wafer W transport path R to the processing space 31a via the loading / unloading port 31b. Specifically, the imaging unit 41 is positioned on the outer surface of the shielding plate 42 that does not face the space 311, and is adjacent to the opening 42a along the width direction (in this case, the X-axis direction) of the wafer W transport path R.

[0061] The shielding plate 42 has through holes 42b formed adjacent to the opening 42a along the width direction of the wafer W transport path R, and these through holes 42b are covered with a transparent member 42c. The imaging unit 41 images the imaging area from the outer surface of the shielding plate 42 through the transparent member 42c.

[0062] As described above, the drying unit 18 according to this embodiment can appropriately detect the conditions inside the processing container 31 by imaging an imaging area including the loading / unloading port 31b and the processing space 31a inside the processing container 31 that is exposed from the loading / unloading port 31b using the imaging unit 41. As a result, the drying unit 18 can detect, for example, the presence or absence of other wafers remaining inside the processing container 31 when loading wafers W into the processing container 31, thereby reducing the possibility of wafer W being damaged due to collision with other wafers.

[0063] Furthermore, since the imaging unit 41 is positioned so as not to overlap with the wafer W transport path R in a plan view, interference between the imaging unit 41 and the wafer W can be avoided even when the transport device 16 transports the wafer W from the input / output port 31b into the processing space 31a.

[0064] Furthermore, the imaging unit 41 images the imaging area from the outer surface of the shielding plate 42 through the transparent member 42c. This allows the imaging unit 41 to perform imaging processing without contacting the atmosphere in the space 311 between the imaging unit 41 and the first protrusion 31d and the second protrusion 31e, thereby suppressing malfunctions of the imaging unit 41 caused by contact with the atmosphere in the space 311.

[0065] A partition wall 43 is positioned on the shielding plate 42. The partition wall 43 is positioned on the outer surface of the shielding plate 42 to surround the outer circumference of the opening 42a, separating the opening 42a from the imaging unit 41. This allows the imaging unit 41 to perform imaging processing without contact between the imaging unit 41 and the atmosphere in the space 311 between the first protrusion 31d and the second protrusion 31e, thereby suppressing malfunctions of the imaging unit 41 caused by contact with the atmosphere in the space 311.

[0066] As shown in Figures 3 to 5, the drying unit 18 includes an illumination unit 44. The illumination unit 44 illuminates at least a predetermined area around the loading / unloading port 31b within the imaging area captured by the imaging unit 41. Specifically, the illumination unit 44 illuminates a predetermined area located above the loading / unloading port 31b within the imaging area. If the entire imaging area captured by the imaging unit 41 were illuminated, reflected light from the imaging area could interfere with the imaging process by the imaging unit 41, potentially reducing the imaging accuracy of the imaging process.

[0067] In contrast, the drying unit 18 according to this embodiment uses the illumination unit 44 to illuminate at least a predetermined area around the input / output port 31b within the imaging area, rather than the entire imaging area. As a result, the reflected light from the imaging area is weakened, improving the imaging accuracy of the imaging process by the imaging unit 41, and consequently enabling more appropriate detection of the conditions inside the processing container 31.

[0068] Here, the configuration of the lighting unit 44 and its surroundings will be described with reference to Figures 7 and 8. Figure 7 is an enlarged view showing the configuration of the lighting unit 44 and its surroundings according to this embodiment. Figure 8 is a cross-sectional view taken along line VIII-VIII in Figure 7. Note that, for the sake of explanation, the partition wall 43 in the shielding plate 42 is omitted from Figure 7.

[0069] As shown in Figures 7 and 8, the shielding plate 42 has a plurality of through holes 42d that are arranged along the width direction (here, the X-axis direction) of the wafer W transport path R, facing a predetermined area P around the loading / unloading port 31b, which is illuminated by the illumination unit 44.

[0070] The lighting unit 44 includes a fixed plate 441, a light source 442, and a light diffusion unit 443.

[0071] The fixing plate 441 is a plate-shaped member that extends in the width direction of the wafer W transport path R and faces the multiple through holes 42d in the shielding plate 42. The fixing plate 441 has a light diffusion portion 443 between it and the shielding plate 42 and is connected to the shielding plate 42 by a connecting member (not shown), such as a bolt. A recess for fixing the light source 442 is formed on the surface of the fixing plate 441 facing the shielding plate 42.

[0072] The light source 442 is fixed to the fixing plate 441 and emits light. The light source 442 is fixed, for example, to the bottom surface of a recess formed in the fixing plate 441.

[0073] The light diffusion section 443 is a plate-shaped member that extends in the width direction of the wafer transport path R of the wafer W, and is positioned between the fixed plate 441 and the shielding plate 42. The light diffusion section 443 diffuses the light emitted from the light source 442 in the width direction of the wafer transport path R of the wafer W, and irradiates a predetermined area P around the loading / unloading port 31b with a portion of the diffused light through a plurality of through holes 42d.

[0074] As described above, the illumination unit 44 according to this embodiment uses the light diffusion unit 443 to diffuse light in the width direction of the wafer transport path R, and also irradiates a predetermined area P around the loading / unloading port 31b with a portion of the diffused light through a plurality of through holes 42d. Therefore, the entire predetermined area P around the loading / unloading port 31b can be illuminated uniformly.

[0075] As shown in Figures 3 to 5, the drying unit 18 is equipped with a locking member 51. The locking member 51 is inserted through a first insertion hole 31f formed in the first projection 31d. A lifting mechanism 51a for raising and lowering the locking member 51 is connected to the locking member 51.

[0076] The operation of the locking member 51 will now be explained. First, the drying unit 18 performs the wafer loading process. During the loading process, the transport device 16 transfers the wafer W, which is held by the wafer holding mechanism, to the support pin 34. The drying unit 18 then uses the rotation mechanism 32a to rotate the lid 32 from the standby position (see Figure 3) to the open position (see Figure 4), and uses the linear motion mechanism 32b to move the lid 32 from the open position to the closed position (see Figure 5). As a result, the loading / unloading outlet 31b of the processing container 31 is closed by the lid 32, and the processing space 31a is sealed. After that, the drying unit 18 uses the lifting mechanism 51a to raise the locking member 51 so that the locking member 51 is inserted into the second insertion hole 31g formed in the second protrusion 31e.

[0077] The locking member 51 is inserted into the second insertion hole 31g and abuts against the surface of the lid 32 opposite to the surface that closes the loading / unloading port 31b, thereby restricting the movement of the lid 32 from the closed position to the open position. As a result, the locking member 51 can press the lid 33 toward the processing space 31a against the internal pressure caused by the supercritical fluid supplied to the processing space 31a. This allows the processing space 31a to remain sealed by the lid 33.

[0078] The drying unit 18 includes an exhaust duct 52. The exhaust duct 52 is positioned above the second insertion hole 31g. The exhaust duct 52 communicates with the space 311 between the first protrusion 31d and the second protrusion 31e through an exhaust hole (not shown) formed in the second protrusion 31e. The exhaust duct 52 is connected to a pump (not shown) and discharges the atmosphere of the processing space 31a through the space 311 and the exhaust hole.

[0079] Through holes 52a and 52b are formed in the exhaust duct 52 at positions corresponding to the second insertion hole 31g. Through hole 52a is formed in the bottom of the exhaust duct 52, and through hole 52b is formed in the top of the exhaust duct 52. Each of the through holes 52a and 52b is sealed with a transparent member 52c.

[0080] The drying unit 18 includes a separate imaging unit 53. The separate imaging unit 53 images the sealing member 321 when the loading / unloading port 31b is not blocked by the cover 32. Specifically, when the cover 32 is in the standby position, the separate imaging unit 53 images the sealing member 321 from above the exhaust duct 52 through the transparent member 52c and the second insertion hole 31g.

[0081] Thus, in the drying unit 18 according to this embodiment, abnormalities in the sealing member 321 can be appropriately detected by imaging the sealing member 321 using a separate imaging unit 53. This makes it possible to suppress leakage of the processing fluid from the processing container 31 caused by deterioration of the sealing member 321.

[0082] As described above, the drying unit 18 according to this embodiment can appropriately detect the conditions inside the processing container 31 by imaging an imaging area including the loading / unloading port 31b and the processing space 31a inside the processing container 31 that is exposed from the loading / unloading port 31b using the imaging unit 41. As a result, the drying unit 18 can detect, for example, the presence or absence of other wafers remaining inside the processing container 31 when loading wafers W into the processing container 31, thereby reducing the possibility of wafer W being damaged due to collision with other wafers.

[0083] <Specific operation of the substrate processing device> Next, the specific operation of the substrate processing apparatus 1 will be described with reference to Figure 9. Figure 9 is a flowchart showing the processing steps performed by the substrate processing apparatus 1 according to this embodiment. Figure 9 shows an example of the processing steps from when the wafer W is loaded into the liquid processing unit 17 until it is unloaded from the drying unit 18. Each processing step shown in Figure 9 is executed according to the control of the control unit 71.

[0084] In the substrate processing apparatus 1, first, the transport device 13 takes out the wafer W contained in the carrier C and places it on the transfer unit 14. Next, the transport device 16 takes out the wafer W from the transfer unit 14 and then transports the removed wafer W to the liquid processing unit 17 (step S101).

[0085] Next, in the substrate processing apparatus 1, the liquid processing unit 17 performs liquid processing on the wafer W (step S102). Specifically, the liquid processing unit 17 cleans the surface of the wafer W using a chemical solution and a rinsing solution, and then performs a liquid film formation process by supplying IPA liquid to the surface of the wafer W to form a liquid film.

[0086] Next, in the substrate processing apparatus 1, the wafer W after liquid processing, i.e., the wafer W on which the liquid film has been formed, is transferred from the liquid processing unit 17 to the transport device 16 (step S103).

[0087] Next, the substrate processing apparatus 1 performs a first processing container condition detection process (step S104). Details of this first processing container condition detection process will be described later.

[0088] Next, the substrate processing apparatus 1 loads the wafer W into the drying unit 18 (step S105).

[0089] Specifically, the transport device 16 removes the wafer W from the liquid processing unit 17 while holding the wafer W using the wafer holding mechanism. Then, the transport device 16 transports the wafer W, held by the wafer holding mechanism, from the input / output port 31b of the drying unit 18 into the processing space 31a in the processing container 31. The transport device 16 then transfers the wafer W to the support pins 34 inside the processing container 31. After that, the transport device 16 retracts the wafer holding mechanism.

[0090] Next, the substrate processing apparatus 1 performs a second processing container condition detection process (step S106). Details of this second processing container condition detection process will be described later.

[0091] Next, in the substrate processing apparatus 1, the drying unit 18 closes the input / output port 31b with the cover 32 (step S107).

[0092] Specifically, the drying unit 18 uses a rotation mechanism 32a to rotate the lid 32 from the standby position (see Figure 3) to the open position (see Figure 4), and a linear motion mechanism 32b to move the lid 32 from the open position to the closed position (see Figure 5). As a result, the loading / unloading port 31b of the processing container 31 is closed by the lid 32, and the processing space 31a is sealed. Subsequently, the drying unit 18 uses a lifting mechanism 51a to raise the locking member 51 so that the locking member 51 is inserted into the second insertion hole 31g formed in the second protrusion 31e.

[0093] Next, the substrate processing apparatus 1 performs supercritical drying (step S108). Specifically, the drying unit 18 dries the wafer W after the liquid film formation treatment by bringing it into contact with a processing fluid in a supercritical state.

[0094] Next, in the substrate processing apparatus 1, the transport device 16 unloads the wafer W from the drying unit 18 (step S109). Specifically, the transport device 16 holds the wafer W after supercritical drying using a wafer holding mechanism and unloads the held wafer W from the drying unit 18. After that, the transport device 16 places the wafer W on the transfer unit 14, and the transport device 13 removes the wafer W from the transfer unit 14 and returns it to the carrier C. This completes the series of substrate processing for one wafer W.

[0095] <Details of the process for detecting the conditions inside the first processing container> Next, the details of the first processing container condition detection process in step S104 will be described with reference to Figure 10. Figure 10 is a flowchart of the procedure for the first processing container condition detection process according to the embodiment. The first processing container condition detection process shown in Figure 10 is performed before step S105, that is, before the wafer W is loaded into the processing space 31a via the loading / unloading port 31b.

[0096] The control unit 71 uses the illumination unit 44 to illuminate a predetermined area P around the input / output port 31b within the imaging area (step S201).

[0097] Next, the control unit 71 uses the imaging unit 41 to image the imaging area (step S202). Specifically, with the lid 32 not blocking the input / output port 31b, the control unit 71 images the imaging area including the input / output port 31b and the processing space 31a inside the processing container 31 that is discharged from the input / output port 31b.

[0098] Next, the control unit 71 performs a substrate presence / absence detection process to detect the presence or absence of the wafer W in the processing container 31 based on the brightness value of the image captured by the imaging unit 41 (step S203).

[0099] Here, the details of the substrate presence / absence detection process will be explained with reference to Figures 11 to 17. Figure 11 is a flowchart showing the procedure of the substrate presence / absence detection process executed by the control unit 71 according to the embodiment.

[0100] As shown in Figure 11, in the substrate presence detection process, first, the control unit 71 performs a first process to extract the loading / unloading area corresponding to the loading / unloading area 31b from the imaging area based on the brightness value of the image captured by the imaging unit 41 (step S301).

[0101] Figures 12 to 14 are diagrams illustrating the first process according to the embodiment. Figures 12 to 14 illustrate an example where the wafer W is located inside the processing container 31.

[0102] For example, in the first process, as shown in Figure 12, the control unit 71 trinarizes a first region R1, which includes at least the upper edge UE and lower edge LE of the input / output port 31b, based on the brightness value of the captured image IM captured by the imaging unit 41. In Figure 12, for the sake of explanation, the wafer W is hatched and the processing container 31 is shaded.

[0103] Next, as shown in Figure 13, the control unit 71 identifies the upper edge UE and lower edge LE of the input / output port 31b from the trinarized first region R1. In the example in Figure 13, the control unit 71 sets up a pair of adjacent frames in the height direction D1 (for example, the Z-axis direction) in multiple rows (10 rows in this case) arranged in the width direction D2 (for example, the X-axis direction). Then, while lowering the pair of frames along the height direction D1, the control unit 71 identifies the positions of pixels where the difference in average brightness values ​​within the pair of frames is greater than or equal to a threshold as the upper edge UE and lower edge LE of the input / output port 31b.

[0104] Next, as shown in Figure 14, the control unit 71 cuts out the second region R2 from the first region R1 using the upper edge UE and lower edge LE of the identified loading / unloading port 31b, and applies trapezoidal correction to the second region R2 to extract the loading / unloading port area R3. Specifically, the control unit 71 applies trapezoidal correction to the second region R2 to correct the distortion of the second region R2 caused by the position of the imaging unit 41, and extracts the loading / unloading port area R3. In the example in Figure 14, the second region R2, which is distorted into a trapezoid shape due to the position of the imaging unit 41, is corrected by trapezoidal correction, and a rectangular loading / unloading port area R3 is extracted. This completes the first process.

[0105] Returning to the explanation of Figure 11, in the substrate presence / absence detection process, the control unit 71 performs a second process to determine the distribution of brightness values ​​along the height direction D1 (see Figure 13) of the loading / unloading area R3 (step S302).

[0106] Figure 15 is a diagram illustrating the second process according to the embodiment. Figure 15 shows the distribution LD of luminance values ​​along the height direction D1 of the loading / unloading area R3. In the example of Figure 15, the distribution LD of luminance values ​​is obtained by plotting the average luminance values ​​at each position in the height direction D1 of the loading / unloading area R3 on a two-dimensional coordinate plane with the position in the height direction D1 as the horizontal axis and the luminance value as the vertical axis. In the distribution LD of luminance values ​​along the height direction D1 of the loading / unloading area R3, the luminance value corresponding to the position of the wafer W is larger than the luminance value at other positions. Therefore, it is estimated that the position in the height direction D1 of the loading / unloading area R3 corresponding to the maximum value in the distribution LD of luminance values ​​is the position of the wafer W.

[0107] Returning to the explanation of Figure 11, in the substrate presence / absence detection process, the control unit 71 performs a third process to detect the presence or absence of wafers W in the processing container 31 based on the distribution LD of brightness values ​​along the height direction D1 of the loading / unloading area R3 (step S303).

[0108] Figures 16 and 17 are diagrams illustrating a third process according to the embodiment. Figure 16 shows the distribution LD of brightness values ​​when a wafer W is present in the processing container 31, and Figure 17 shows the distribution LD of brightness values ​​when there is no wafer W in the processing container 31.

[0109] As shown in Figures 16 and 17, it can be seen that when the wafer W is inside the processing container 31, the maximum value M in the brightness distribution LD is larger compared to when the wafer W is not inside the processing container 31.

[0110] Therefore, the control unit 71 detects the presence or absence of wafer W in the processing container 31 based on the maximum value M in the brightness value distribution LD. Specifically, the control unit 71 compares the maximum value M in the brightness value distribution LD with a predetermined threshold, and if it exceeds the threshold, it detects that wafer W is present in the processing container 31.

[0111] Returning to the explanation of Figure 11, if the process in step S303 detects that the wafer W is present in the processing container 31 (step S304, Yes), the control unit 71 outputs an alert (step S305) and terminates the process.

[0112] On the other hand, if the control unit 71 detects that there is no wafer W in the processing container 31 (step S304, No), it terminates the process without outputting an alert.

[0113] Furthermore, the control unit 71 may, upon detecting the presence of a wafer W in the processing container 31, halt the execution of the supercritical drying process and output an alert. For example, the control unit 71 may halt the processing from step S105 onward in Figure 9 and output an alert.

[0114] As described above, in the substrate presence / absence detection process according to the embodiment, the control unit 71 detects the presence or absence of the wafer W in the processing container 31 based on the brightness value of the image captured by the imaging unit 41.

[0115] This allows for more efficient detection of the conditions inside the processing container 31 compared to conventional techniques that compare captured images with reference images. In other words, conventional techniques require switching between multiple reference images depending on the conditions inside the processing container 31 and comparing the captured image with each reference image multiple times, making it difficult to efficiently detect the conditions inside the processing container 31.

[0116] In contrast, in the substrate presence / absence detection process according to this embodiment, the control unit 71 detects the presence or absence of the wafer W inside the processing container 31 based on the brightness value of the image captured by the imaging unit 41. This makes it possible to detect the presence or absence of the wafer W inside the processing container 31 using the brightness value of the image without switching between multiple reference images or comparing the captured image with each reference image. Therefore, according to this embodiment, the conditions inside the processing container can be detected efficiently.

[0117] <Details of the process for detecting the conditions inside the second processing container> Next, the details of the second processing container condition detection process in step S106 will be described with reference to Figure 18. Figure 18 is a flowchart showing the procedure for the second processing container condition detection process according to the embodiment. The second processing container condition detection process shown in Figure 18 is performed after the wafer W has been loaded into the processing space 31a via the loading / unloading port 31b, but before the loading / unloading port 31b is closed by the lid 32.

[0118] The control unit 71 uses the illumination unit 44 to illuminate a predetermined area P around the input / output port 31b within the imaging area (step S401).

[0119] Next, the control unit 71 uses the imaging unit 41 to image the imaging area (step S402). Specifically, with the lid 32 not blocking the input / output port 31b, the control unit 71 images the imaging area including the input / output port 31b and the processing space 31a inside the processing container 31 that is discharged from the input / output port 31b.

[0120] Next, the control unit 71 performs a substrate detachment detection process to detect whether or not the wafer W has detached from the support pins 34 inside the processing container 31, based on the brightness value of the image captured by the imaging unit 41 (step S403).

[0121] Here, the details of the substrate detachment detection process will be explained with reference to Figures 19 to 21. Figure 19 is a flowchart showing the procedure for the substrate detachment detection process executed by the control unit 71 according to the embodiment. Steps S501 and S502 in Figure 19 are the same as steps S301 and S302 in Figure 11 described above, so a detailed explanation will be omitted here.

[0122] Following the processing in step S502, the control unit 71 performs a third process to detect whether or not the wafer W has fallen off the support pins 34 inside the processing container 31, based on the distribution LD of brightness values ​​along the height direction D1 of the loading / unloading area R3 (step S503).

[0123] Figures 20 and 21 illustrate another example of the third process according to the embodiment. Figure 20 shows the distribution LD of brightness values ​​when the wafer W has not fallen off the support pins 34 inside the processing container 31, and Figure 21 shows the distribution LD of brightness values ​​when the wafer W has fallen off the support pins 34 inside the processing container 31.

[0124] As shown in Figures 20 and 21, when the wafer W has fallen out of the support pins 34 inside the processing container 31, the position of the input / output region R3 in the height direction D1, which corresponds to the maximum value M, is closer to the upper edge UE compared to when the wafer W has not fallen out.

[0125] Therefore, the control unit 71 compares the position in the height direction D1 of the loading / unloading area R3, which corresponds to the maximum value M in the brightness value distribution LD, with a predetermined normal range, and if it falls outside the normal range, it detects that the wafer W has fallen off the support pins 34 inside the processing container 31.

[0126] Returning to the explanation of Figure 19, if, as a result of the process in step S503, it is detected that the wafer W has detached from the support pins 34 inside the processing container 31 (step S504, Yes), the control unit 71 outputs an alert (step S505) and terminates the process.

[0127] On the other hand, if the control unit 71 detects that the wafer W has not fallen off the support pins 34 inside the processing container 31 (step S504, No), it terminates the process without outputting an alert.

[0128] Furthermore, the control unit 71 may stop the supercritical drying process and output an alert if it detects that the wafer W has fallen off the support pins 34 inside the processing container 31. For example, the control unit 71 may stop the process from step S107 onwards in Figure 9 and output an alert.

[0129] (modified version) Next, various modifications of the embodiment will be described with reference to Figures 22 to 30. Figure 22 is a flowchart showing the procedure for detecting the presence or absence of a substrate executed by the control unit 71 according to modification 1 of the embodiment.

[0130] As shown in Figure 22, in the substrate presence detection process, first, the control unit 71 performs a fourth process to cut out a first search area from the imaging area to search for the upper edge UE of the loading / unloading port 31b, based on the brightness value of the image captured by the imaging unit 41 (step S601).

[0131] Figure 23 is a diagram illustrating the fourth process according to the first modified embodiment. In addition, the following figures will describe an example where the wafer W is located inside the processing container 31.

[0132] For example, in the fourth process, as shown in Figure 23, the control unit 71 binarizes the imaging area based on the brightness value of the image IM captured by the imaging unit 41, and cuts out a first search area R4 from the binarized imaging area to search for the upper edge UE of the loading / unloading port 31b. Note that in Figure 23, the wafer W and the processing container 31 are hatched for ease of explanation.

[0133] Returning to the explanation of Figure 22, in the substrate presence detection process, the control unit 71 performs a fifth process to search the cut-out first search area R4 and determine the position of the upper edge UE of the loading / unloading port 31b (step S602).

[0134] Figure 24 is a diagram illustrating a fifth process according to a modified example of the embodiment. In the example of Figure 24, the control unit 71 sets luminance measurement points in multiple rows (10 rows in this case) arranged in the width direction D2 (for example, the X-axis direction). The control unit 71 then lowers the luminance measurement points along the height direction D1, measures the luminance value at each pixel at the luminance measurement points, and obtains the position of the pixel where the difference in the measured luminance values ​​is greater than or equal to a threshold. The control unit 71 then identifies the position UE1 of the upper edge UE of the input / output port 31b by the average value of the obtained pixel positions.

[0135] Returning to the explanation of Figure 22, in the substrate presence detection process, the control unit 71 performs a sixth process to determine a second search area for searching the upper and lower surfaces of the wafer W from the position UE1 of the upper edge UE of the identified loading / unloading port 31b (step S603).

[0136] Figure 25 is a diagram illustrating the sixth process according to modification 1 of the embodiment. The control unit 71 sets the upper edge US at a position offset by a first number of pixels downward in the height direction D1 from the position UE1 of the upper edge UE of the loading / unloading port 31b, and sets the lower edge LS at a position offset by a second number of pixels greater than the first number of pixels downward in the height direction D1 from the position of the upper edge US. The control unit 71 determines the region between the upper edge US and the lower edge LS as the second search region R5.

[0137] Returning to the explanation of Figure 22, in the substrate presence detection process, the control unit 71 performs a seventh process to search the second search area R5 and identify the top and bottom surfaces of the wafer W (step S604).

[0138] Figure 26 is a diagram illustrating the seventh process according to modification 1 of the embodiment. The control unit 71 sets luminance measurement points in a plurality of rows (10 rows in this case) arranged in the width direction D2 (for example, the X-axis direction). The control unit 71 then descends the luminance measurement points from the upper edge US of the second search region R5 along the height direction D1, measures the luminance value at each luminance measurement point, and obtains the position of the pixel where the difference in the measured luminance values ​​is greater than or equal to a threshold. The control unit 71 then identifies the position UW on the upper surface of the wafer W (see Figure 27) as the average value of the acquired pixel positions. The control unit 71 also ascends the luminance measurement points from the lower edge LS of the second search region R5 along the height direction D1, measures the luminance value at each luminance measurement point, and obtains the position of the pixel where the difference in the measured luminance values ​​is greater than or equal to a threshold. The control unit 71 then identifies the position LW on the lower surface of the wafer W (see Figure 27) as the average value of the acquired pixel positions. Furthermore, if the luminance measurement point descending from the upper edge US of the second search region R5 and the luminance measurement point ascending from the lower edge LS of the second search region R5 overlap, the control unit 71 sets common position coordinates on the upper and lower surfaces of the wafer W. As common position coordinates, for example, the position coordinates of the midpoint of line segments perpendicular to the upper edge US and the lower edge LS may be used.

[0139] Returning to the explanation of Figure 22, in the substrate presence / absence detection process, the control unit 71 performs an eighth process to detect the presence or absence of the wafer W in the processing container 31 based on the difference in position between the upper and lower surfaces of the identified wafer W (step S605).

[0140] Figure 27 is a diagram illustrating the eighth process according to modification 1 of the embodiment. The control unit 71 determines whether the difference d1 (=|position UW - position LW|) between the upper and lower surfaces of the wafer W is greater than 0, and detects that the wafer W is in the processing container 31 if the difference d1 is greater than 0. On the other hand, the control unit 71 detects that the wafer W is not in the processing container 31 if the difference d1 between the upper and lower surfaces of the wafer W is 0. For example, if common position coordinates are set for the upper and lower surfaces of the wafer W, the difference d1 will be 0, and therefore the control unit 71 detects that the wafer W is not in the processing container 31.

[0141] Returning to the explanation of Figure 22, if the process in step S605 detects that the wafer W is present in the processing container 31 (step S606, Yes), the control unit 71 outputs an alert (step S607) and terminates the process.

[0142] On the other hand, if the control unit 71 detects that there is no wafer W in the processing container 31 (step S606, No), it terminates the process without outputting an alert.

[0143] Figure 28 is a flowchart showing the procedure for detecting the presence or absence of substrate detachment, which is performed by the control unit 71 according to the modified embodiment 2. Steps S701 to S704 in Figure 28 are the same as steps S601 to S604 in Figure 22 described above, so a detailed explanation is omitted here.

[0144] Following the processing in step S704, in the substrate detachment detection process, the control unit 71 performs a ninth process in which it calculates the average value of the positions of the upper and lower surfaces of the identified wafer W as the position of the wafer W (step S705).

[0145] Figure 29 is a diagram illustrating the ninth process according to a modified example 2 of the embodiment. The control unit 71 calculates the average value of the position UW on the upper surface of the wafer W and the position LW on the lower surface of the wafer W as the position WP of the wafer W.

[0146] Returning to the explanation of Figure 28, in the substrate detachment detection process, the control unit 71 performs a tenth process to calculate the distance from the upper edge UE position UE1 of the input / output port 31b to the wafer W position WP (step S706).

[0147] Figure 30 is a diagram illustrating the 10th process according to a modified example 2 of the embodiment. The control unit 71 calculates the distance d2 from the position UE1 of the upper edge UE of the loading / unloading port 31b to the position WP of the wafer W.

[0148] Returning to the explanation of Figure 28, in the substrate presence / absence detection process, the control unit 71 performs an 11th process to detect whether or not the wafer W has detached from the support pins 34 inside the processing container 31, based on the calculated distance d2 (step S707). Specifically, the control unit 71 compares the distance d2 with a predetermined normal range, and if it falls outside the normal range, it detects that the wafer W has detached from the support pins 34 inside the processing container 31.

[0149] If, as a result of the process in step S707, it is detected that the wafer W has detached from the support pins 34 inside the processing container 31 (step S708, Yes), the control unit 71 outputs an alert (step S709) and terminates the process.

[0150] On the other hand, if the control unit 71 detects that the wafer W has not fallen off the support pins 34 inside the processing container 31 (step S708, No), it terminates the process without outputting an alert.

[0151] As described above, the substrate processing apparatus according to the embodiment (for example, substrate processing apparatus 1) comprises a processing container (for example, processing container 31), an imaging unit (for example, imaging unit 41), and a control unit (for example, control unit 71). The processing container has a processing space (for example, processing space 31a) capable of accommodating a substrate (for example, wafer W), and an input / output port (for example, input / output port 31b) through which the substrate is loaded into and out of the processing space. The imaging unit captures an imaging region including the input / output port and the processing space inside the processing container exposed from the input / output port. The control unit detects the state of the substrate inside the processing container based on the brightness value of the image captured by the imaging unit.

[0152] Therefore, according to the substrate processing apparatus of the embodiment, the conditions inside the processing container can be detected efficiently.

[0153] <Other> In the embodiment described above, an example was given in which the imaging unit 41 is positioned so as not to overlap with the wafer transport path R in a plan view. However, the imaging unit 41 may be configured to move between an imaging position on the wafer transport path R and a retracted position off the wafer transport path R. In this case, the imaging unit 41 moves from the retracted position to the imaging position and images the imaging area at the imaging position before the wafer W is loaded into the processing space 31a via the loading / unloading port 31b.

[0154] Alternatively, the imaging unit 41 may be provided on the transport device 16. In this case, the transport device 16 first transports the wafer W from the loading / unloading port 31b of the drying unit 18 into the processing space 31a in the processing container 31. The imaging unit 41 provided on the transport device 16 captures the imaging area before the loading / unloading port is closed by the lid 32.

[0155] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. Indeed, the embodiments described above can be embodied in a variety of forms. Furthermore, the embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0156] 1. Substrate processing apparatus 7 Control device 18 Drying Unit 31 Processing container 31a Processing space 31b Loading / unloading exit 31d 1st protrusion 31e 2nd protrusion 31f First insertion hole 31g Second insertion hole 32 Lid 32a Rotating mechanism 32b Linear motion mechanism 34 Support pins 41 Imaging Unit 42 Shielding plate 42a opening 42b Through hole 42c Transparent component 42d Through hole 43 Bulkhead 44 Lighting Section 51 Locking member 51a Lifting mechanism 52 Exhaust duct 52a through hole 52b Through hole 52c Transparent component 53 Imaging Unit 71 Control Unit 72 Memory section 321 Sealing member 441 Fixed plate 442 Light source 443 Light Diffusion Section W wafer

Claims

1. A processing container having a processing space capable of accommodating a substrate and an input / output port for loading and unloading the substrate into and out of the processing space, An imaging unit that images an imaging region including the aforementioned input / output port and the processing space within the processing container exposed from the input / output port, A control unit that detects the state of the substrate inside the processing container based on the brightness value of the image captured by the imaging unit, A substrate processing apparatus comprising:

2. The control unit, A first process involves extracting the loading / unloading area corresponding to the loading / unloading area from the imaging area based on the brightness value of the captured image, A second process for determining the distribution of luminance values ​​along the height direction of the extracted loading / unloading area, A third process for detecting the state of the substrate inside the processing container, based on the distribution of brightness values ​​along the height direction of the input / output region. Perform The substrate processing apparatus according to claim 1.

3. The control unit, In the third process, the presence or absence of the substrate in the processing container is detected as the state of the substrate based on the maximum value in the distribution of brightness values ​​along the height direction of the input / output region. The substrate processing apparatus according to claim 2.

4. The control unit, Before the substrate is loaded into the processing space via the loading / unloading port, the presence or absence of the substrate in the processing container is detected based on the brightness value of the image captured by the imaging unit. The substrate processing apparatus according to claim 1.

5. The aforementioned processing container is Support pins provided on the bottom surface of the processing space, which support the substrate It has, The control unit, In the third process, based on the position in the height direction of the input / output region corresponding to the maximum value in the distribution of brightness values ​​along the height direction of the input / output region, the state of the substrate is detected as whether or not the substrate has fallen off the support pins in the processing container. The substrate processing apparatus according to claim 2.

6. A lid configured to be able to close the aforementioned entrance / exit Furthermore, The control unit, After the substrate is loaded into the processing space through the loading / unloading port, and before the loading / unloading port is closed by the lid, the state of the substrate is detected based on the brightness values ​​of the captured image taken by the imaging unit, specifically whether or not the substrate has fallen off the support pins within the processing container. The substrate processing apparatus according to claim 5.

7. The control unit, In the first processing, based on the brightness values ​​of the captured image, a first region of the imaging area including at least the upper and lower edges of the loading / unloading port is trinarized, the upper and lower edges of the loading / unloading port are identified from the trinarized first region, a second region is cut out from the first region using the identified upper and lower edges of the loading / unloading port, and trapezoidal correction is applied to the second region to extract the loading / unloading port area. The substrate processing apparatus according to claim 2.

8. The imaging unit is It is positioned in a location that does not overlap in a plan view with the transport path of the substrate to the processing space via the aforementioned input / output port. The control unit, The trapezoidal correction is applied to the second region to correct the distortion in the second region caused by the position where the imaging unit is located, and the loading / unloading area is extracted. The substrate processing apparatus according to claim 7.

9. The imaging unit is It is positioned in a location that does not overlap in a plan view with the transport path of the substrate to the processing space via the aforementioned input / output port. The substrate processing apparatus according to claim 1.

10. The aforementioned processing container is A first protrusion extends from the lower part of the loading / unloading port toward space toward the loading / unloading space, A second protrusion extends from the upper part of the loading / unloading port toward space toward the loading / unloading space, A shielding plate that shields the space between the first protrusion and the second protrusion, It has, The aforementioned shielding plate is An opening for the substrate to pass through is located opposite the input / output port across the aforementioned space. It has, The imaging unit is The shielding plate is positioned on its outer surface, which does not face the space, and adjacent to the opening along the width direction of the substrate transport path. The substrate processing apparatus according to claim 9.

11. The aforementioned shielding plate is A through hole formed adjacent to the opening along the width direction of the transport path of the substrate, A transparent member that covers the through hole and It has, The imaging unit is The imaging area is imaged from the outer surface of the shielding plate through the transparent member. The substrate processing apparatus according to claim 10.

12. The aforementioned shielding plate is A partition wall is positioned on the outer surface of the shielding plate to surround the outer periphery of the opening, separating the opening from the imaging unit. has The substrate processing apparatus according to claim 10.

13. Illumination unit that illuminates at least a predetermined area around the loading / unloading port within the imaging area. A substrate processing apparatus according to claim 10, comprising:

14. The aforementioned shielding plate is Multiple through holes are formed in a row along the width direction of the substrate transport path, opposite to a predetermined area around the loading / unloading port. It has, The aforementioned lighting unit is A fixing plate facing the plurality of through holes in the shielding plate, A light source fixed to the aforementioned fixing plate, A light diffusion unit is positioned between the fixing plate and the shielding plate, which diffuses the light emitted from the light source in the width direction of the transport path of the substrate, and irradiates a portion of the diffused light through the plurality of through holes into a predetermined area around the transport exit. has The substrate processing apparatus according to claim 13.

15. A substrate processing apparatus comprising a processing container having a processing space capable of accommodating a substrate and an input / output port for loading and unloading the substrate into and out of the processing space, and an imaging unit for imaging an imaging region including the input / output port and the processing space within the processing container exposed from the input / output port, a step of imaging the imaging region using the imaging unit, A step of detecting the state of the substrate inside the processing container based on the brightness value of the image captured by the imaging unit. A method for detecting the conditions inside a processing container, including the method described above.

Images