Semiconductor cooling mechanism

Abstract

To provide a semiconductor cooling mechanism that effectively enhances the cooling effect. [Solution] The regulated air outlet of the non-contact cooling system communicates with the regulated air inlet of the cooling pad body and is used to transport regulated air to the cooling pad body. The cooling patch system includes a cold poultice module and a cooling host, with multiple cooling air holes provided inside the cooling pad body, and the cooling air holes communicating with each other to the regulated air inlet. The cold poultice module includes a cold poultice bag and a cold air conduction block, the cold air conduction block includes a cold air conduction part and a cold air transfer part, the cold air conduction part is located outside the cold poultice bag and the cold air transfer part is located inside the cold poultice bag. A cold storage material is contained inside the cold poultice bag, the low-temperature end face of the cooling host is attached to the cold air conduction part, and the cooling host transfers cold air to the cold storage material via the cold air conduction block. The cold poultice module is located inside the cooling pad body, and the contact surface of the cold poultice bag avoids the cooling air holes.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor cooling, and particularly to a semiconductor cooling mechanism.

Background Art

[0002] Based on the relationship between environmental temperature and the thermal balance of the human body, generally, a living environment of 35°C or higher and a working environment of 32°C or higher are regarded as high-temperature environments. In a high-temperature environment, abnormal changes may occur in a person's physiological functions, especially functions such as body temperature regulation, water and salt metabolism, and blood circulation. For example, excessive sweating increases the burden on the cardiovascular system. If the high temperature exceeds the limit of the human body's tolerance, in the mild case, concentration decreases and work efficiency becomes low, but in the severe case, heat stroke is caused, and in a more serious case, sudden death may occur, posing a danger to the personal safety of workers and causing unnecessary economic losses.

[0003] In an outdoor environment without air conditioning, especially for those who work for a long time in a high-temperature environment, such as police officers working in the sweltering summer weather, construction site workers working under the scorching sun, and maintenance workers performing maintenance work at high altitudes outdoors, etc., they often have to continue working for a certain period while overcoming various discomforts caused by high temperature. When working in a high-temperature environment wearing ordinary clothes, a person sweats, and the sweat is transferred to the surface of the clothes by diffusion and transmission, and a part of the heat is taken away by the evaporation of the sweat. However, since the evaporation source for the evaporation of sweat is limited, the heat taken away is also limited. In particular, when working continuously in a high-temperature environment for a certain period, ordinary clothes cannot achieve the effect of lowering the temperature within a certain period.

[0004] To address the above problems, existing technologies have produced cooling clothing to regulate body temperature. However, currently available cooling clothing typically employs a single cooling method, such as air cooling or liquid cooling, resulting in very limited cooling effects on the human body. For example, the Chinese invention patent "Temperature Control and Dehumidification Device in the Microspace of Portable Protective Clothing" (publication number CN117045006A) adjusts the temperature and humidity inside the protective clothing using a hybrid air supply method, creating a comfortable internal environment. This maintains the protective effect of the protective clothing while adjusting the user's comfort inside the protective clothing through the parallel adjustment of hybrid air supply and humidity / heat within the protective clothing. Furthermore, the Chinese utility model "Phase-Change Cooling Clothing with Excellent Cooling Effect" (publication number CN220343733U) achieves a cooling effect by using a water pump to inject ice water into a liquid circulation channel and then into an ice water bag, allowing the ice water to absorb heat from the body during the circulation process. Therefore, there is a need for cooling clothing that can effectively enhance the cooling effect. [Overview of the project] [Problems that the invention aims to solve]

[0005] The object of the present invention is to provide a semiconductor cooling mechanism that effectively enhances the cooling effect and overcomes the shortcomings of the prior art by using liquid cooling and air cooling in combination to achieve the objective of cooling. [Means for solving the problem]

[0006] To achieve this objective, the technical solutions employed by the present invention are as follows.

[0007] A semiconductor cooling mechanism comprising a cooling pad body, a cooling patch system, and a non-contact cooling system, The cooling pad body has a pre-conditioned air inlet, the pre-conditioned air outlet of the non-contact cooling system communicates with the pre-conditioned air inlet, and the non-contact cooling system is used to transport pre-conditioned air to the cooling pad body. The cooling patch system includes a cooling patch module and a cooling host, the regulated air inlet is located on the cooling pad body, a plurality of cooling air vents are provided on the inside of the cooling pad body, and the cooling air vents communicate with each other to the regulated air inlet. The semiconductor cooling mechanism comprises a cold compress module including a cold compress bag and a cold air conduction block, the cold air conduction block including a cold air conduction section and a cold air transfer section, the cold air conduction section being located outside the cold compress bag, the cold air transfer section being located inside the cold compress bag, a cold storage material being contained inside the cold compress bag, the low-temperature end face of the semiconductor cooling sheet of the cooling host being attached to the cold air conduction section, the cooling host transferring cold air to the cold storage material via the cold air conduction block, the cold compress module being located inside the cooling pad body, and the contact surface of the cold compress bag avoiding the cooling air vents.

[0008] Preferably, the cross-sectional area of ​​the cold air transmission section is greater than or equal to the cross-sectional area of ​​the cold air conduction section.

[0009] Preferably, the cold air conduction part is provided protruding from the central part of the outside of the cold air transmission part.

[0010] Preferably, the cold damp cloth module further comprises a plastic pressure plate fitted outside the cold air conduction section and attached to the outer surface of the cold air conduction section. The inner wall of the cold compress bag is attached to the outer surface of the plastic pressure plate.

[0011] Preferably, a plurality of parallel protrusions are provided on the rear side surface of the cold air transmission section, and the plastic pressing plate is attached to the outer surface of the cold air transmission section via the protrusions.

[0012] Preferably, a plurality of inwardly recessed escape prevention grooves are arranged on the rear side surface of the cold air transmission section, and the plastic pressing plate is attached to the outer surface of the cold air transmission section via the escape prevention grooves.

[0013] Preferably, the escape prevention groove comprises a connecting portion and a protruding portion that are connected in order from the outside to the inside, and the height of the protruding portion is greater than the height of the connecting portion.

[0014] Preferably, at least two escape prevention grooves are provided, and the two escape prevention grooves are located on both sides of the cold air conduction section.

[0015] Preferably, the cooling host is located outside the cooling pad body. The cold air conducting portion penetrates the cooling pad body and is then attached to the low-temperature end face of the cooling host.

[0016] Preferably, the cooling host comprises a cooling shell, a semiconductor cooling sheet, a radiator, and a heat dissipation fan, wherein the semiconductor cooling sheet, the radiator, and the heat dissipation fan are all mounted inside the cooling shell. The semiconductor cooling sheet has a high-temperature end face and a low-temperature end face, the high-temperature end face is attached to the radiator, and multiple heat dissipation channels are provided inside the radiator. The outlet of the heat dissipation fan is directed towards the inlet of the heat dissipation channels. The cooling shell is provided with an air inlet, a heat dissipation outlet, and a cold air conduction outlet. The cold air conduction outlet is located on the inner wall of the cooling shell and is used to accommodate the cold air conduction portion while avoiding the low-temperature edge of the semiconductor cooling sheet. The air inlet is positioned close to the inlet of the heat dissipation fan, and the heat dissipation outlet is positioned close to the outlet of the heat dissipation channel.

[0017] Preferably, the heat dissipation fan is a centrifugal fan, and both the air inlet and the heat dissipation outlet are located on the outer wall of the cooling shell.

[0018] Preferably, the heat dissipation fan is an axial fan, the air inlet is located on the bottom wall of the cooling shell, and the heat dissipation outlet is located on the top wall of the cooling shell.

[0019] Preferably, the cooling pad body includes an exhaust layer, an air duct layer, and a heat insulation outer layer, which are arranged in sequence from the inside to the outside. A plurality of the air cooling holes are arranged in the exhaust layer, and the adjusted air inlet and the air cooling holes communicate with each other through the air duct layer.

[0020] Preferably, the adjusted air inlet is located at the lower part of the cooling pad body, and the aperture diameter of the air cooling holes gradually decreases from top to bottom.

[0021] Preferably, the air duct layer is a 3D support structure, and a plurality of intertwined support ribs are arranged in the 3D support structure.

[0022] Preferably, a windproof strip surrounding an air retaining cavity protrudes from the edge of the air duct layer, and air supply notches communicating with the adjusted air inlet are opened in the windproof strip. A plurality of support blocks protrude from the inner side of the air duct layer, and the surface of the support blocks abuts against the outside of the exhaust layer.

[0023] Preferably, a heat dissipation auxiliary outlet is opened at the upper edge of the cooling pad body, and the adjusted air inlet and the heat dissipation auxiliary outlet communicate with each other through the air duct layer. The cooling host is arranged in the cooling pad body, the cooling host is located in the air duct layer, and after the cold air conduction part penetrates through the exhaust layer, it is attached to the low-temperature end face of the cooling host. The cooling host includes a semiconductor cooling element and a heat dissipation element, which are arranged in sequence from the inside to the outside. The semiconductor cooling element has a high-temperature end face and a low-temperature end face. The low-temperature end face is attached to the cold air conduction part, and the high-temperature end face is attached to the heat dissipation element. A plurality of heat conduction channels extending in the vertical direction are opened in the heat dissipation element, and the air duct layer, the heat conduction channels, and the heat dissipation auxiliary outlet communicate with each other in sequence.

[0024] Preferably, the cooling host further includes a mounting shell and a mounting cover. Both the mounting shell and the mounting cover surround a mounting cavity for mounting the semiconductor cooling element and the heat dissipation element. The mounting shell is located inside the semiconductor cooling element, and the mounting cover is located outside the heat dissipation element. Avoidance openings are provided at both the upper and lower parts of the mounting cavity. The avoidance opening at the lower part of the mounting cavity is used to avoid the inlet of the heat conduction channel, and the avoidance opening at the upper part of the mounting cavity is used to avoid the outlet of the heat conduction channel. A cold air conduction mounting port is provided at the central part of the mounting shell. The cold air conduction mounting port avoids the low-temperature end face of the semiconductor cooling element and is used to accommodate the cold air conduction part.

[0025] Preferably, the air duct layer includes an inner orientation layer and an outer orientation layer, and the inner orientation layer is located inside the outer orientation layer. The inner orientation layer is a 3D support structure, and a plurality of intertwined support ribs are arranged in the 3D support structure. Windproof ribs protrude from the inner edge of the outer orientation layer. The outer orientation layer and the inner orientation layer together surround an air storage cavity through the windproof ribs. Air intake notches communicating with each other are provided on the side surface of the windproof rib at the adjusted air inlet, and heat dissipation notches communicating with each other are provided on the upper part of the windproof rib at the heat dissipation auxiliary outlet. The heat conduction channel of the heat dissipation element is located above the heat dissipation notch.

[0026] Preferably, orientation ribs are provided protruding from the inner edge of the outer orientation layer at the upper part of the windproof rib. The windproof rib and the orientation rib together surround a heat dissipation cavity. The air storage cavity and the heat dissipation cavity communicate with each other through the heat dissipation notch, and the outlet of the heat dissipation cavity communicates with the heat dissipation auxiliary outlet.

[0027] Preferably, the shape of the heat dissipation cavity is Y-shaped, and the outlets of the heat dissipation cavity are located on both sides of the upper part of the oriented outer layer. The auxiliary heat dissipation outlet is positioned in close proximity to the outlet of the heat dissipation cavity.

[0028] Preferably, the cooling pad body further comprises a breathable mesh inner layer, and the breathable mesh inner layer, the exhaust layer, the air duct layer, and the heat insulating outer layer are arranged in order from the inside to the outside.

[0029] Preferably, the cooling pad body further comprises a fixing belt connected to the heat insulating outer layer.

[0030] Preferably, at least two of the cooling patch systems are arranged. [Effects of the Invention]

[0031] The technical solutions provided by the present invention may include the following beneficial effects.

[0032] 1. When the semiconductor cooling mechanism of this solution is in operation, the conditioned air acts on the cooling pad body, and by using both the low-temperature fluid formed by the cold storage material and the airflow formed by the conditioned air, it removes heat from the human body. By creating a dual combination of flow fields of low-temperature fluid and low-temperature airflow on the human body, the wearer can feel the flow of the conditioned air, assuming direct contact with the cold compress bag containing the cold storage material. This further enhances the coolness felt by the wearer, allowing them to feel the cooling effect more strongly, and thus further contributes to satisfying the wearer's experience.

[0033] 2. The cold compress module of this solution comprises a cold compress bag and a cold air conduction block, the cold air conduction block comprising a cold air conduction section and a cold air transfer section. The cold air transfer section of the cold air conduction block is in direct contact with the cold storage material in the cold compress bag, thereby reducing heat loss during the process of the cold storage material entering and leaving the cold compress bag through pipes, etc., and more efficiently transferring the cold air generated by the semiconductor cooling sheet of the cooling host directly to the cold storage material, thereby improving the conversion rate of the cooling host. [Brief explanation of the drawing]

[0034] [Figure 1] This is a schematic diagram of the semiconductor cooling mechanism of the present invention. [Figure 2] This is a cross-sectional view of a cold damp cloth module in the semiconductor cooling mechanism of the present invention. [Figure 3] This is a schematic diagram of the cold air conduction block in the semiconductor cooling mechanism of the present invention. [Figure 4] This is a schematic diagram of the first embodiment of a contact-type cooling pad in the semiconductor cooling mechanism of the present invention. [Figure 5] This is a partially exploded view of the structure of a first embodiment of a contact-type cooling pad in a semiconductor cooling mechanism of the present invention. [Figure 6] This is a schematic diagram of a second embodiment of a contact-type cooling pad in the semiconductor cooling mechanism of the present invention. [Figure 7] This is a partially exploded view of the structure of a second embodiment of a contact-type cooling pad in the semiconductor cooling mechanism of the present invention. [Figure 8] This is a schematic diagram of one embodiment of the air duct layer in the semiconductor cooling mechanism of the present invention. [Figure 9] This is a schematic diagram of another embodiment of the air duct layer in the semiconductor cooling mechanism of the present invention. [Figure 10] This is a schematic diagram of a third embodiment of a contact-type cooling pad in the semiconductor cooling mechanism of the present invention. [Figure 11] This is a partially exploded view of the structure of a third embodiment of a contact-type cooling pad in the semiconductor cooling mechanism of the present invention. [Figure 12]This is an exploded view of a structural embodiment of a non-contact cooling system in a semiconductor cooling mechanism of the present invention. [Figure 13] This is an exploded view of a structural embodiment of a non-contact cooling system in a semiconductor cooling mechanism of the present invention. [Figure 14] This is an exploded view of a structural embodiment of a non-contact cooling system in a semiconductor cooling mechanism of the present invention. [Figure 15] This is an exploded view of a structural embodiment of a non-contact cooling system in a semiconductor cooling mechanism of the present invention. [Figure 16] This is a schematic partial structural diagram of the semiconductor cooling mechanism of the present invention.

[0035] In the diagram above, the arrows indicate the direction of airflow. [Modes for carrying out the invention]

[0036] Embodiments of the present invention are described in detail below, and examples are shown in the accompanying drawings, where identical or similar reference numerals throughout the drawings represent identical or similar elements, or elements having identical or similar functions. The embodiments described below with reference to the accompanying drawings are illustrative and used solely to illustrate the present invention and should not be construed as limiting the invention.

[0037] This technical solution provides a semiconductor cooling mechanism comprising a cooling pad body 11, a cooling patch system, and a non-contact cooling system 2.

[0038] The cooling pad body 11 has a pre-conditioned air inlet, the pre-conditioned air outlet 212 of the non-contact cooling system 2 communicates with the pre-conditioned air inlet, and the non-contact cooling system 2 is used to transport pre-conditioned air to the cooling pad body 11.

[0039] The cooling patch system includes a cold compress module 12 and a cooling host 13, the regulated air inlet is located in the cooling pad body 11, a plurality of cooling air holes 1111 are provided inside the cooling pad body 11, and the cooling air holes 1111 communicate with each other to the regulated air inlet.

[0040] The cold compress module 12 includes a cold compress bag 121 and a cold air conduction block 122, the cold air conduction block 122 includes a cold air conduction section 1221 and a cold air transfer section 1222, the cold air conduction section 1221 is located outside the cold compress bag 121 and the cold air transfer section 1222 is located inside the cold compress bag 121, a cold storage material is contained inside the cold compress bag 121, the low-temperature end face of the semiconductor cooling sheet 132 of the cooling host 13 is attached to the cold air conduction section 1221, the cooling host 13 transfers cold air to the cold storage material via the cold air conduction block 122, the cold compress module 12 is located inside the cooling pad body 11 and the contact surface 1211 of the cold compress bag 121 avoids the cooling air vents 1111.

[0041] Currently available cooling clothing typically uses a single cooling method, either air cooling or liquid cooling, resulting in very limited cooling effects on the human body. Therefore, to enhance the cooling effect of existing wearable cooling products, this technological solution proposes a semiconductor cooling mechanism that utilizes a cold storage material (such as water or gel that can store and release cold air) to achieve the purpose of cooling, combining cold compresses and air cooling, further contributing to a more satisfying user experience. Furthermore, since the wearable product of this solution is designed in the form of a cooling pad, it can be worn alone or flexibly combined with products such as backpacks or car seat cushions, making it applicable to a wider range of scenarios and further improving the applicability of the cooling pad.

[0042] Specifically, as shown in Figures 1 to 16, the semiconductor cooling mechanism of this solution comprises a cooling pad body 11 worn on the human body, a cooling patch system (i.e., a cold compress module 12 for storing a cold storage material and a cooling host 13 for transferring cold air to the cold storage material), and a non-contact cooling system 2 for generating conditioned air. When the semiconductor cooling mechanism of this solution is in operation, the conditioned air acts on the cooling pad body 11, and by using both the low-temperature fluid formed by the cold storage material and the airflow formed by the conditioned air, it removes heat from the human body, creating a dual combination of flow fields of low-temperature fluid and low-temperature airflow for the human body. Assuming that the wearer is in direct contact with the cold compress bag 121 containing the cold storage material, the wearer can feel the flow of conditioned air, further enhancing the coolness felt by the wearer and making the cooling effect feel stronger, thus further contributing to the wearer's satisfaction with the user experience.

[0043] Furthermore, in the cold compress module 12 of this technical solution, the cold air transfer section 1222 of the cold air conduction block 122 is in direct contact with the cold storage material in the cold compress bag 121. This reduces heat loss during the process of the cold storage material entering and leaving the cold compress bag 121 through pipes, etc., and more efficiently transfers the cold air generated by the semiconductor cooling sheet 132 in the cooling host 13 directly to the cold storage material, thereby improving the conversion rate of the cooling host 13.

[0044] In one embodiment, to make the semiconductor cooling mechanism of this solution more convenient to wear, the adjusted air outlet 212 of the non-contact cooling system 2 and the adjusted air inlet of the cooling pad body 11 are detachably connected via a hollow elastic band.

[0045] In this solution, the "inside" of the cooling pad body 11 refers to the side that comes into direct contact with the wearer's body surface. The cold air conduction block 122 in this solution may be an aluminum block.

[0046] Preferably, the cross-sectional area of ​​the cold air transmission section 1222 is greater than or equal to the cross-sectional area of ​​the cold air conduction section 1221.

[0047] As shown in Figure 3, this not only reduces the space occupied by the cooling host 13, but also increases the contact surface area 1211 of the cold compress bag 121, thereby improving the cooling effect of the cold compress bag 121.

[0048] Preferably, the cold air conduction section 1221 is provided protruding from the central part of the outside of the cold air transmission section 1222. This helps to uniformly transmit cold air in the cold air conduction section 1221.

[0049] Preferably, the cold compress module 12 further comprises a plastic pressure plate 123 fitted outside the cold air conduction section 1221 and attached to the outer surface of the cold air transmission section 1222. The inner wall of the cold compress bag 121 is attached to the outer surface of the plastic pressure plate 123.

[0050] In order to achieve a sealed installation between the cold compress bag 121 and the cold air conduction block 122, this solution further adds a plastic pressing plate 123 inside the cold compress module 12, and as shown in Figure 2, the inner wall of the cold compress bag 121 and the outer surface of the plastic pressing plate 123 are pressed and fixed together to improve the airtightness of the cold compress bag 121.

[0051] The plastic pressing plate 123 of this solution is formed by injection molding onto the outer surface of the cold air transmission section 1222.

[0052] Preferably, a plurality of parallel protrusions 12221 are provided on the rear side surface of the cold air transmission section 1222, and the plastic pressing plate 123 is attached to the outer surface of the cold air transmission section 1222 via the protrusions 12221.

[0053] In a preferred embodiment of this technical solution, in order to improve the airtightness of the cold damp cloth bag 121 by improving the adhesion between the plastic pressing plate 123 and the cold air conduction block 122, a plurality of parallel protrusions 12221 are further provided on the rear side surface of the cold air transmission section 1222, and as shown in Figure 3, the adhesion between the plastic pressing plate 123 and the cold air conduction block 122 is improved by increasing the contact area between the cold air transmission section 1222 and the plastic pressing plate 123.

[0054] Preferably, the cross-sectional shape of the protrusion 12221 is triangular.

[0055] Preferably, a plurality of inwardly recessed escape prevention grooves 12222 are arranged on the rear side surface of the cold air transmission section 1222, and the plastic pressing plate 123 is attached to the outer surface of the cold air transmission section 1222 via the escape prevention grooves 12222.

[0056] In another preferred embodiment of the present technical solution, in order to improve the airtightness of the cold damp cloth bag 121 by improving the adhesion between the plastic pressing plate 123 and the cold air conduction block 122, the present solution further provides a plurality of inwardly recessed escape prevention grooves 12222 on the rear side surface of the cold air transmission section 1222, as shown in Figure 3. This not only increases the contact area between the cold air transmission section 1222 and the plastic pressing plate 123, but also effectively prevents separation between the plastic pressing plate 123 and the rear side surface of the cold air transmission section 1222, thereby improving the adhesion between the plastic pressing plate 123 and the cold air conduction block 122.

[0057] Preferably, the escape prevention groove 12222 comprises a connecting portion 12222a and a protruding portion 12222b that are connected in order from the outside to the inside, with the height of the protruding portion 12222b being greater than the height of the connecting portion 12222a. This further helps to prevent separation between the plastic pressure plate 123 and the rear side surface of the cold air transmission portion 1222.

[0058] Preferably, the cross-sectional shape of the projection 12222b is one of a circle, an ellipse, a rectangle, a triangle, or a trapezoid.

[0059] Preferably, at least two escape prevention grooves 12222 are provided, with each of the two escape prevention grooves 12222 located on either side of the cold air conduction section 1221. This further helps to improve the adhesion between the plastic pressure plate 123 and the cold air conduction block 122.

[0060] Preferably, the cooling host 13 is located outside the cooling pad body 11. The cold air conduction section 1221 penetrates the cooling pad body 11 and is then attached to the low-temperature end face of the cooling host 13.

[0061] The cooling host 13 in this solution may be an external cooling host. Specifically, the cold compress module 12 and the cooling host 13 may be positioned inside and outside the cooling pad body 11, respectively. The cold air conduction section 1221 penetrates the cooling pad body 11 and is then attached to the low-temperature end face of the cooling host 13. This directs the contact surface 1211 of the cold compress module 12 and the cooling air holes 1111 on the inside of the cooling pad body 11 toward the wearer, ensuring that the cold storage material and conditioned air reliably act on the human body.

[0062] Preferably, the cooling host 13 comprises a cooling shell 131, a semiconductor cooling sheet 132, a radiator 133, and a heat dissipation fan 134, wherein the semiconductor cooling sheet 132, the radiator 133, and the heat dissipation fan 134 are all mounted inside the cooling shell 131. The semiconductor cooling sheet 132 has a high-temperature end face and a low-temperature end face, the high-temperature end face is attached to the radiator 133, a plurality of heat dissipation channels 1331 are opened inside the radiator 133, and the outlet of the heat dissipation fan 134 is directed toward the inlet of the heat dissipation channels 1331. The cooling shell 131 is provided with an air inlet 1311, a heat dissipation outlet 1312, and a cold air conduction outlet 1313. The cold air conduction outlet 1313 is located on the inner wall of the cooling shell 131 and is used to accommodate the cold air conduction section 1221 while avoiding the low-temperature end face of the semiconductor cooling sheet 132. The air inlet 1311 is located close to the inlet of the heat dissipation fan 134, and the heat dissipation outlet 1312 is located close to the outlet of the heat dissipation channel 1331.

[0063] In the external cooling host of the above embodiment, the cooling host 13 comprises a cooling shell 131, a semiconductor cooling sheet 132, a radiator 133, and a heat dissipation fan 134, and as shown in Figures 4 to 7, it employs a semiconductor cooling method to transfer cold air to the cold air conduction section 1221. Specifically, the semiconductor cooling sheet 132 is made using the Peltier effect. The Peltier effect refers to the phenomenon in which, when a direct current flows through a galvanic couple made of two semiconductor materials, one end of the galvanic couple absorbs heat and the other end dissipates heat. In other words, the semiconductor cooling sheet 132 is made of two semiconductor materials, forming a high-temperature end and a low-temperature end, where the low-temperature end continuously absorbs heat to achieve cooling, and the high-temperature end continuously dissipates heat. In this technical solution, a semiconductor cooling sheet 132 is used as a cooling material in the cooling device, eliminating the need for complex mechanical cooling structures, effectively simplifying the overall structure of the cooling host 13, and reducing the overall volume of the cooling host 13. This facilitates low-noise cooling, and is safe, reliable, convenient, practical, low-cost to manufacture, and has a wide range of applications. Furthermore, a low-temperature end face is provided at the low-temperature end of the semiconductor cooling sheet 132, and a high-temperature end face is provided at the high-temperature end of the semiconductor cooling sheet 132. The low-temperature end face and the cold air conduction section 1221 are attached to each other, and the high-temperature end face and the radiator 133 are attached to each other. This helps to conduct heat and cold air directly and effectively, thereby improving the cooling effect of the cooling host 13.

[0064] Specifically, the heat dissipation process of the cooling host 13 in this solution involves outside air entering the cooling shell 131 through the air inlet 1311, then being guided by the heat dissipation fan 134 into the heat dissipation channel 1331 of the radiator 133, carrying the heat from the heat dissipation channel 1331 to the heat dissipation outlet 1312, and finally being discharged from the cooling host 13.

[0065] Preferably, the heat dissipation fan 134 is a centrifugal fan, and both the air inlet 1311 and the heat dissipation outlet 1312 are located on the outer wall of the cooling shell 131.

[0066] In the above embodiment, preferably, as shown in Figures 4-5, the heat dissipation fan 134 is a centrifugal fan, and the air inlet 1311 and heat dissipation outlet 1312 are located on the outer wall of the cooling shell 131 opposite the low-temperature end face of the semiconductor cooling sheet 132, so that the heat dissipation airflow helps to influence the cold air transfer effect of the cooling host 13.

[0067] Preferably, the heat dissipation fan 134 is an axial flow fan, the air inlet 1311 is located on the bottom wall of the cooling shell 131, and the heat dissipation outlet 1312 is located on the top wall of the cooling shell 131.

[0068] In the above embodiment, more preferably, as shown in Figures 6 to 7, the heat dissipation fan 134 is an axial flow fan, and the heat dissipation outlet 1312 and air inlet 1311 are located at the upper and lower ends of the cooling shell 131, respectively, to facilitate the rapid removal of heat.

[0069] Preferably, the cooling pad body 11 comprises an exhaust layer 111, an air duct layer 112, and an insulating outer layer 113, arranged in order from the inside to the outside. Multiple cooling air holes 1111 are arranged in the exhaust layer 111, and the adjusted air inlet and the cooling air holes 1111 are in communication with each other via the air duct layer 1112. In order to allow the wearer to more directly experience the cooling effect of the conditioned air, the structure of the cooling pad body 11 is also optimized in this solution. Here, the arrangement of the air duct layer 112 helps to store a large amount of conditioned air better within the cooling pad body 11, thereby increasing the airflow from the cooling air holes 1111 and making the cooling effect more pronounced. The insulating outer layer 113 is mainly installed to prevent the conditioned air from being lost from outside the cooling pad body 11, and also helps to shield the wearer from the temperature of the external environment to some extent, thus further enhancing the cooling effect of the cooling pad. In one embodiment, the material of the insulating outer layer 113 may be polyester fiber, but is not limited thereto.

[0070] Preferably, the adjusted air inlet is located at the bottom of the cooling pad body 11, and the diameter of the cooling air holes 1111 gradually decreases from top to bottom.

[0071] In a preferred embodiment of this technical solution, the regulated air inlet is located at the bottom of the cooling pad body 11, so that the non-contact cooling system 2 is attached to the bottom of the cooling pad body 11, making it convenient to wear on the human body. Based on the above wearing method, in order to ensure a uniform cooling effect of the cooling pad body 11, this solution specifically reduces the diameter of the cooling air holes 1111 from top to bottom. When the diameter of the holes is increased, the air resistance caused by the regulated airflow generated by the non-contact cooling system 2 can be reduced, so that the regulated airflow can more easily reach the top of the cooling pad body 11, which corresponds to the airflow from the cooling air holes 1111 at the bottom of the cooling pad body 11, ensuring a uniform cooling effect.

[0072] Preferably, the air duct layer 112 is a 3D support structure, and a plurality of intertwined support ribs are arranged within the 3D support structure. To ensure the storage of regulated airflow by the air duct layer 112, in the first embodiment of this technical solution, the air duct layer 112 is a 3D support structure, and as shown in Figure 8, the three-dimensional space of the air duct layer 112 is supported by multiple intertwined support ribs inside, which helps to store a large amount of regulated air while not affecting the airflow in the air duct layer 112 and avoiding an increase in air resistance.

[0073] Preferably, a windproof strip 1121 surrounding the air-retaining cavity is provided protruding from the edge of the air duct layer 112, and an air supply notch 11211 communicating with the adjusted air inlet is provided in the windproof strip 1121. Multiple support blocks 1122 are provided protruding from the inside of the air duct layer 112, and the surfaces of the support blocks 1122 abut against the outside of the exhaust layer 111. To ensure the storage of the regulated airflow by the air duct layer 112, in a second embodiment of this technical solution, the air duct layer 112 has a 3D support structure, and as shown in Figure 9, a windbreak strip 1121 is provided protruding from its edge, thereby better achieving the storage of a large amount of regulated air and preventing the loss of airflow from locations other than the cooling air vents 1111.

[0074] In the above embodiment, more preferably, a plurality of support blocks 1122 are provided protruding from the inside of the air duct layer 112, so that an effective storage space for conditioned air can be secured within the air duct layer 112.

[0075] Preferably, a heat dissipation auxiliary outlet is provided at the upper edge of the cooling pad body 11, and the adjusted air inlet and the heat dissipation auxiliary outlet are in communication with each other via the air duct layer 1112. The cooling host 13 is placed inside the cooling pad body 11, the cooling host 13 is located inside the air duct layer 112, and the cold air conduction portion 1221 penetrates the exhaust layer 111 and is then attached to the low-temperature end face of the cooling host 13. The cooling host 13 comprises a semiconductor cooling element 135 and a heat dissipation element 136 arranged in order from the inside to the outside. The semiconductor cooling element 135 has a high-temperature end face and a low-temperature end face, the low-temperature end face is attached to the cold air conduction part 1221, and the high-temperature end face is attached to the heat dissipation element 136. Multiple vertically extending heat conduction channels are provided within the heat dissipation element 136, and the air duct layer 112, the heat conduction channels, and the heat dissipation auxiliary outlet are in sequential communication with each other.

[0076] The cooling host 13 in this solution may be an internal cooling host. Specifically, as shown in Figures 10 to 11, the cooling host 13 comprises a semiconductor cooling element 135 and a heat dissipation element 136 arranged in order from the inside to the outside, and similarly employs a semiconductor cooling method to transmit cold air to the cold air conduction section 1221. However, since the cooling host 13 in this solution is located inside the cooling pad body 11 and the cooling host 13 is located inside the air duct layer 112, the cooling host 13 can be structurally omitted by using a portion of the adjusted air entering the air duct layer 112 to dissipate heat from the heat dissipation element 136, thereby making the cooling host 13 more compact and lowering the cost.

[0077] Specifically, the heat dissipation process of the cooling host 13 in this solution involves the adjusted air generated by the non-contact cooling system 2 entering the air duct layer 112 of the cooling pad body 11 from the adjusted air inlet, a portion of which passes through the cooling air holes 1111 to form an exhaust flow inside the cooling pad body 11, the remaining portion of which enters the heat conduction channel (not shown) of the heat dissipation element 136, carrying the heat from the heat conduction channel to the heat dissipation auxiliary outlet and discharging it from the cooling pad body 11.

[0078] Preferably, the cooling host 13 further comprises a mounting shell 137 and a mounting cover 138. The mounting shell 137 and the mounting cover 138 both surround a mounting cavity for mounting the semiconductor cooling element 135 and the heat dissipation element 136, with the mounting shell 137 located inside the semiconductor cooling element 135 and the mounting cover 138 located outside the heat dissipation element 136. Avoidance openings are provided at both the top and bottom of the mounting cavity; the avoidance opening at the bottom of the mounting cavity is used to avoid the entrance to the heat conduction channel, and the avoidance opening at the top of the mounting cavity is used to avoid the exit to the heat conduction channel. A cold air conduction mounting port 1371 is provided in the central part of the mounting shell 137, and the cold air conduction mounting port 1371 is used to accommodate the cold air conduction portion 1221 while avoiding the low-temperature end face of the semiconductor cooling element 135.

[0079] In the internal cooling host of the above embodiment, in order to ensure effective adhesion between the cooling host 13 and the cold air conduction section 1221, the present solution further adds a mounting shell 137 and a mounting cover 138 inside the cold air host 13. Here, in order to mount the internal cooling host and the cold air conduction section 1221, a cold air conduction mounting port 1371 is opened in the center of the mounting shell 137, and avoidance openings are opened at the top and bottom of the mounting cavity enclosed by both the mounting shell 137 and the mounting cover 138 in order to ensure that a portion of the conditioned air can effectively enter the heat conduction channel.

[0080] Preferably, the air duct layer 112 comprises an orientation inner layer 1123 and an orientation outer layer 1124, wherein the orientation inner layer 1123 is located inside the orientation outer layer 1124. The orientation inner layer 1123 is a 3D support structure, and a plurality of intertwined support ribs are arranged within the 3D support structure. A windbreak rib 11241 is provided protruding from the inner edge of the orientation outer layer 1124, and the orientation outer layer 1124 and the orientation inner layer 1123 together surround the air storage cavity via the windbreak rib 11241. An air intake notch 11241a is provided on the side of the windbreak rib 11241, communicating with the adjusted air inlet, and a heat dissipation notch 11241b is provided on the upper part of the windbreak rib 11241, communicating with the heat dissipation auxiliary outlet. The heat conduction channel of the heat dissipation element 136 is located above the heat dissipation notch 11241b.

[0081] In the above embodiment of the internal cooling host, the specific structure of the air duct layer 112 is also preferably optimized. Specifically, in the adjusted air supply process of this embodiment, adjusted air generated by the non-contact cooling system 2 enters the cooling pad body 11 from the adjusted air inlet, passes through the inlet notch 11241a and enters the air storage cavity of the air duct layer 112. Here, a portion of the adjusted air passes through the orientation inner layer 1123 and then through the cooling air holes 1111 to form an exhaust flow inside the cooling pad body 11. The remaining portion of the adjusted air passes through the heat dissipation notch 11241b and enters the heat conduction channel (not shown) of the heat dissipation element 136, carrying the heat from the heat conduction channel to the heat dissipation auxiliary outlet and discharging from the cooling pad body 11. By optimizing the above structure, the conditioned air used to form the exhaust flow and the conditioned air that carries heat through the heat conduction channel can be effectively separated, and the conditioned air that carries heat can pass through the cooling air vents 1111 to form the exhaust flow, thereby preventing to some extent a decrease in the coolness felt by the wearer.

[0082] Preferably, an orientation rib 11242 is provided protruding from the inner edge of the orientation outer layer 1124, located above the windbreak rib 11241, and both the windbreak rib 11241 and the orientation rib 11242 surround the heat dissipation cavity, the air storage cavity and the heat dissipation cavity communicate with each other via the heat dissipation notch 11241b, and the outlet of the heat dissipation cavity communicates with the heat dissipation auxiliary outlet.

[0083] In the above embodiment of the internal cooling host, more preferably, orientation ribs 11242 are further provided protruding from the inner edge of the orientation outer layer 1124, and both the windbreak ribs 11241 and the orientation ribs 11242 surround the heat dissipation cavity and play a role in concentrating and guiding the conditioned air that carries heat and discharging it.

[0084] Preferably, the shape of the heat dissipation cavity is Y-shaped, and the outlets of the heat dissipation cavity are located on both sides of the upper part of the orientation outer layer 1124. The auxiliary heat dissipation outlet is positioned close to the outlet of the heat dissipation cavity. This helps to guide and expel the conditioned air that carries heat to both sides of the top of the cooling pad body 11, avoiding direct discharge of hot air from the wearer's body surface.

[0085] Preferably, the cooling pad body 11 further comprises a breathable mesh inner layer 114, and the breathable mesh inner layer 114, the exhaust layer 111, the air duct layer 112, and the heat insulating outer layer 113 are arranged in order from the inside to the outside.

[0086] Preferably, the mesh count of the breathable mesh inner layer 114 is 16 to 20 mesh. Furthermore, in order to enhance the wearer's comfort, as shown in Figure 11, this solution further includes a breathable mesh inner layer 114 with 16 to 20 mesh counts, positioned inside the exhaust layer 111, while balancing the cooling effect and comfort of the cooling pad.

[0087] Preferably, the material of the breathable mesh inner layer 114 in this solution may be nylon, but is not limited thereto.

[0088] Preferably, the cooling pad body 11 further comprises a fixing belt 115 connected to the heat insulating outer layer 113. Furthermore, in order to enhance the wearing stability of the cooling pad body 11 and its ability to fit products such as backpacks and car seat cushions, the solution further adds fixing belts 115 to the cooling pad body 11. Also, when the wearer wears the cooling pad body 11 of the solution alone, in order to improve the fit to the body surface, the solution ensures that the cooling effect of the cooling pad is effectively transmitted to the body surface by connecting the fixing belts 115 in particular to the insulating outer layer 113.

[0089] Preferably, at least five fixing belts 115 are arranged, with any three fixing belts 115 evenly distributed on the top of the insulating outer layer 113, and the remaining two fixing belts 115 arranged on both sides of the insulating outer layer 113, respectively.

[0090] In a more preferred embodiment of this technical solution, as shown in Figure 16, the positioning of the fixing belt 115 is also optimized to allow the cooling pad to be used in a wider range of application scenarios.

[0091] Preferably, the non-contact cooling system 2 comprises a fixed shell 21 and a cooling fan 22, the cooling fan 22 being mounted inside the fixed shell 21. The fixed shell 21 is provided with an air intake 211 and a controlled air outlet 212, the inlet of the cooling fan 22 is located close to the air intake 211, and the outlet of the cooling fan 22 is located close to the controlled air outlet 212, and the air intake 211 and the controlled air outlet 212 are located on two different side walls of the fixed shell 21.

[0092] Specifically, the non-contact cooling system 2 of this solution comprises a fixed shell 21 and a cooling fan 22, the cooling fan 22 being used to introduce outside air into the cooling pad body 11 and to transport the conditioned air toward the cooling pad body 11. In this solution, the air intake 211 and conditioned air outlet 212 opened in the fixed shell 21 are located on its two different side walls, which helps a large amount of outside air to enter the non-contact cooling system 2 smoothly.

[0093] Preferably, the air intake 211 and the adjusted air outlet 212 are located on two opposing side walls of the fixed shell 21. Alternatively, the air intake 211 and the adjusted air outlet 212 are located on two adjacent side walls of the fixed shell 21, respectively.

[0094] As shown in Figures 12 and 13, the air intake 211 and the regulated air outlet 212 are located on two adjacent or two opposing sides of the fixed shell 21, respectively, which helps reduce interference with the airflow and further helps a large volume of outside air to enter the non-contact cooling system 2 smoothly.

[0095] The number of air intake ports 211 can be set according to the actual demand for the amount of conditioned air, but is not limited to this.

[0096] Preferably, the cooling fan 22 is either an axial fan or a centrifugal fan.

[0097] Preferably, the non-contact cooling system 2 further comprises an air orientation plate 23 mounted within the fixed shell 21 and positioned between the outlet of the cooling fan 22 and the regulated air outlet 212.

[0098] In this solution, as shown in Figure 14, an air orientation plate 23 is further arranged in the non-contact cooling system 2 to ensure that outside air flows in a constant direction and to increase the conversion rate of the adjusted air in the non-contact cooling system 2.

[0099] Preferably, the non-contact cooling system 2 further comprises a semiconductor cooling module 24 mounted within the fixed shell 21 and positioned at the outlet of the cooling fan 22. The semiconductor cooling module 24 comprises a semiconductor cooler, a cooling block 241, and a heat dissipation block 242. The semiconductor cooler has opposing low-temperature end faces and high-temperature end faces, the low-temperature end face and the cooling block 241 are attached to each other, and the high-temperature end face and the heat dissipation block 242 are attached to each other. A heat dissipation air outlet 213 is further provided in the aforementioned fixed shell 21. Both the cooling block 241 and the heat dissipation block 242 are provided with heat exchange channels. The inlets of the heat exchange channels in the cooling block 241 and the heat exchange channels in the heat dissipation block 242 are located close to the outlet of the high-temperature fan 22. The outlet of the heat exchange channel in the cooling block 241 is located close to the regulated air outlet 212. The outlet of the heat exchange channel in the heat dissipation block 242 is located close to the heat dissipation air outlet 213.

[0100] In a more preferred embodiment of this technical solution, in order to further enhance the cooling effect of the cooling pad, a semiconductor cooling module 24 may be added to the non-contact cooling system 2. As shown in Figure 15, the outside air entering the non-contact cooling system 2 is first cooled by the semiconductor cooling module 24, and then enters the cooling pad body 11 as cooled, conditioned air, thereby allowing the wearer to be even more satisfied with the user experience.

[0101] Preferably, the non-contact cooling system 2 further comprises a hollow air-oriented cover 25. The air orientation cover 25 is detachably attached to the outside of the fixed shell 21, the adjusted air outlet 212 communicates with the inlet of the air orientation cover 25, and the adjusted air outlet 212 communicates with the adjusted air inlet via the air orientation cover 25. The cross-sectional area of ​​the inlet of the air orientation cover 25 is larger than the cross-sectional area of ​​the outlet of the air orientation cover 25.

[0102] In a more preferred embodiment of this technical solution, an air orientation cover 25 may be further positioned at the regulated air outlet 212 of the fixed shell 21, as shown in Figures 14-15, where the inlet and outlet cross-sectional areas of the air orientation cover 25 are different, thereby effectively increasing the velocity of the regulated air entering the cooling pad body 11 and making the cooling experience brought about by the airflow even more intense.

[0103] Preferably, the non-contact cooling system 2 further comprises a mounting bag 26, the fixed shell 21 is mounted inside the mounting bag 26, the mounting bag 26 has a mesh surface, and the mesh surface is positioned close to the air intake port 211.

[0104] Preferably, the mesh count of the mesh surface is 6 to 10 meshes.

[0105] Preferably, at least two non-contact cooling systems 2 are provided, and each of the two non-contact cooling systems 2 is positioned on both sides of the contact cooling pad 1. As a result, as shown in Figure 16, the amount of conditioned air supplied is increased, improving the perceived coolness brought about by the flow of air created by the conditioned air.

[0106] To further explain, at least two of the cooling patch systems are arranged.

[0107] The technical principles of the present invention are described above in conjunction with specific embodiments. These descriptions are for illustrative purposes only and should not be construed as limiting the scope of protection of the present invention in any way. Based on the description herein, those skilled in the art can conceive of other specific embodiments of the present invention without creative work, and any of these embodiments fall within the scope of protection of the present invention. [Explanation of Symbols]

[0108] 11 Cooling pad main unit, 111 Exhaust layer 1111 Cooling air vent 112 Air duct layer 1121 Windproof Strip 11211 Intake Notch 1122 Support Block 1123 Oriented Inner Layer 1124 Oriented outer layer 11241 Windproof Rib 11241a Inlet Notch 11241b Heat dissipation notch 11242 Oriented Ribs 113 Insulating outer layer 114 Breathable mesh inner layer 115 Fixing belt 12 Cold compress modules 121 Cold compress bag 1211 Contact surface 122 Cold air conduction block 1221 Cold air conduction section 1222 Cold air transmission section 12221 Convex Strip 12222 Escape prevention groove 12222a Communication part 12222b Protrusion 123 Plastic pressure plate 13 Cooling Host 131 Cooling Shell 1311 Air Inlet 1312 Heat dissipation outlet 1313 Cold air conduction outlet 132 Semiconductor Cooling Sheet 133 Radiator 1331 Heat dissipation channel 134 Cooling fan 135 Semiconductor cooling element 136 Heat dissipation elements 137 Mounting Shell 1371 Cold air conduction mounting port 138 Mounting cover 2. Non-contact cooling system 21 Fixed Shell 211 Air supply port 212 Adjusted air outlet 22 Cooling Fan 23 Air orientation plate 24 Semiconductor Cooling Modules 241 Cooling block 242 Heat dissipation block 25 Air-Oriented Cover 26 Mounting Bags

Claims

1. A semiconductor cooling mechanism comprising a cooling pad body, a cooling patch system, and a non-contact cooling system, The cooling pad body has a pre-conditioned air inlet, the pre-conditioned air outlet of the non-contact cooling system communicates with the pre-conditioned air inlet, and the non-contact cooling system is used to transport pre-conditioned air to the cooling pad body. The cooling patch system includes a cooling patch module and a cooling host, the regulated air inlet is located on the cooling pad body, a plurality of cooling air vents are provided on the inside of the cooling pad body, and the cooling air vents communicate with each other to the regulated air inlet. The semiconductor cooling mechanism is characterized in that the cold compress module includes a cold compress bag and a cold air conduction block, the cold air conduction block includes a cold air conduction part and a cold air transmission part, the cold air conduction part is located outside the cold compress bag, the cold air transmission part is located inside the cold compress bag, a cold storage material is contained inside the cold compress bag, the low-temperature end face of the semiconductor cooling sheet of the cooling host is attached to the cold air conduction part, the cooling host transmits cold air to the cold storage material via the cold air conduction block, the cold compress module is located inside the cooling pad body, and the contact surface of the cold compress bag avoids the cooling air vent.

2. The semiconductor cooling mechanism according to claim 1, characterized in that the cross-sectional area of ​​the cold air transmission section is greater than or equal to the cross-sectional area of ​​the cold air conduction section.

3. The semiconductor cooling mechanism according to claim 1, characterized in that the cold air conduction part is provided protruding from the central part of the outside of the cold air transmission part.

4. The cold compress module further comprises a plastic pressure plate fitted outside the cold air conduction section and attached to the outer surface of the cold air conduction section. The semiconductor cooling mechanism according to claim 1, characterized in that the inner wall of the cold compress bag is attached to the outer surface of the plastic pressure plate.

5. The semiconductor cooling mechanism according to claim 4, characterized in that a plurality of parallel protrusions are provided on the rear side surface of the cold air transmission section, and the plastic pressing plate is attached to the outer surface of the cold air transmission section via the protrusions.

6. The semiconductor cooling mechanism according to claim 4, characterized in that a plurality of inwardly recessed escape prevention grooves are arranged on the rear side surface of the cold air transmission section, and the plastic pressing plate is attached to the outer surface of the cold air transmission section via the escape prevention grooves.

7. The semiconductor cooling mechanism according to claim 6, characterized in that the escape prevention groove comprises a communicating portion and a protruding portion that communicate sequentially from the outside to the inside, and the height of the protruding portion is greater than the height of the communicating portion.

8. The semiconductor cooling mechanism according to claim 6, characterized in that at least two escape prevention grooves are provided, and the two escape prevention grooves are each located on both sides of the cold air conduction section.

9. The cooling host is located outside the cooling pad body, The semiconductor cooling mechanism according to claim 1, characterized in that the cold air conducting portion penetrates the cooling pad body and is then attached to the low-temperature end face of the cooling host.

10. The cooling host comprises a cooling shell, a semiconductor cooling sheet, a radiator, and a heat dissipation fan, the semiconductor cooling sheet, the radiator, and the heat dissipation fan all being mounted within the cooling shell. The semiconductor cooling sheet has a high-temperature end face and a low-temperature end face, the high-temperature end face is attached to the radiator, multiple heat dissipation channels are provided inside the radiator, and the outlet of the heat dissipation fan is directed toward the inlet of the heat dissipation channels. The cooling shell is provided with an air inlet, a heat dissipation outlet, and a cold air conduction outlet. The cold air conduction outlet is located on the inner wall of the cooling shell and is used to avoid the low-temperature edge of the semiconductor cooling sheet and to accommodate the cold air conduction portion. The semiconductor cooling mechanism according to claim 9, characterized in that the air inlet is located close to the inlet of the heat dissipation fan, and the heat dissipation outlet is located close to the outlet of the heat dissipation channel.

11. The semiconductor cooling mechanism according to claim 10, characterized in that the heat dissipation fan is a centrifugal fan, and both the air inlet and the heat dissipation outlet are located on the outer wall of the cooling shell.

12. The semiconductor cooling mechanism according to claim 10, characterized in that the heat dissipation fan is an axial flow fan, the air inlet is located at the bottom wall of the cooling shell, and the heat dissipation outlet is located at the top wall of the cooling shell.

13. The cooling pad body comprises an exhaust layer, an air duct layer, and an insulating outer layer, arranged in order from the inside to the outside. The semiconductor cooling mechanism according to claim 1, characterized in that a plurality of cooling air holes are arranged in the exhaust layer, and the adjusted air inlet and the cooling air holes are in communication with each other via the air duct layer.

14. The semiconductor cooling mechanism according to claim 13, characterized in that the adjusted air inlet is located at the bottom of the cooling pad body, and the diameter of the cooling air holes gradually decreases from top to bottom.

15. The semiconductor cooling mechanism according to claim 13, characterized in that the air duct layer is a 3D support structure, and a plurality of intertwined support ribs are arranged within the 3D support structure.

16. A windbreak strip is provided protruding from the edge of the air duct layer, surrounding the air-retaining cavity, and an air supply notch is provided in the windbreak strip, communicating with the adjusted air inlet. The semiconductor cooling mechanism according to claim 13, characterized in that a plurality of support blocks are provided protruding from the inside of the air duct layer, and the surfaces of the support blocks abut against the outside of the exhaust layer.

17. A heat dissipation auxiliary outlet is provided at the upper edge of the cooling pad body, and the adjusted air inlet and the heat dissipation auxiliary outlet are in communication with each other via the air duct layer. The cooling host is placed within the cooling pad body, the cooling host is located within the air duct layer, and the cold air conduction portion penetrates the exhaust layer and is then attached to the low-temperature end face of the cooling host. The cooling host comprises a semiconductor cooling element and a heat dissipation element arranged in order from the inside to the outside, the semiconductor cooling element having a high-temperature end face and a low-temperature end face, the low-temperature end face being attached to the cold air conduction part and the high-temperature end face being attached to the heat dissipation element. The semiconductor cooling mechanism according to claim 13, characterized in that a plurality of vertically extending heat conduction channels are provided within the heat dissipation element, and the air duct layer, the heat conduction channels, and the heat dissipation auxiliary outlet are in sequential communication.

18. The cooling host further comprises a mounting shell and a mounting cover, The mounting shell and the mounting cover both surround a mounting cavity for mounting the semiconductor cooling element and the heat dissipation element, the mounting shell is located inside the semiconductor cooling element, and the mounting cover is located outside the heat dissipation element. Avoidance openings are provided at both the top and bottom of the mounting cavity; the avoidance opening at the bottom of the mounting cavity is used to avoid the entrance to the heat conduction channel, and the avoidance opening at the top of the mounting cavity is used to avoid the exit to the heat conduction channel. The semiconductor cooling mechanism according to claim 17, characterized in that a cold air conduction mounting port is provided in the central part of the mounting shell, and the cold air conduction mounting port is used to accommodate the cold air conduction portion while avoiding the low-temperature end face of the semiconductor cooling element.

19. The air duct layer comprises an orientation inner layer and an orientation outer layer, the orientation inner layer being located inside the orientation outer layer, The orientation inner layer is a 3D support structure, and within the 3D support structure, a plurality of intertwined support ribs are arranged. Windbreak ribs are provided protruding from the inner edge of the orientation outer layer, and the orientation outer layer and the orientation inner layer together surround the air storage cavity via the windbreak ribs. On the side of the windbreak rib, an intake notch is provided that communicates with the adjusted air inlet, and on the upper part of the windbreak rib, a heat dissipation notch is provided that communicates with the heat dissipation auxiliary outlet. The semiconductor cooling mechanism according to claim 18, characterized in that the heat conduction channel of the heat dissipation element is located above the heat dissipation notch.

20. The semiconductor cooling mechanism according to claim 19, characterized in that an orientation rib is provided protruding from the inner edge of the orientation outer layer, located above the windbreak rib, both the windbreak rib and the orientation rib surround a heat dissipation cavity, the air storage cavity and the heat dissipation cavity communicate with each other via the heat dissipation notch, and the outlet of the heat dissipation cavity communicates with the heat dissipation auxiliary outlet.

21. The shape of the heat dissipation cavity is Y-shaped, and the outlets of the heat dissipation cavity are located on both sides of the upper part of the orientation outer layer. The semiconductor cooling mechanism according to claim 20, characterized in that the auxiliary heat dissipation outlet is positioned in close proximity to the outlet of the heat dissipation cavity.

22. The semiconductor cooling mechanism according to claim 13, wherein the cooling pad body further comprises a breathable mesh inner layer, and the breathable mesh inner layer, the exhaust layer, the air duct layer, and the heat insulating outer layer are arranged in order from the inside to the outside.

23. The semiconductor cooling mechanism according to claim 13, characterized in that the cooling pad body further comprises a fixing belt connected to the heat insulating outer layer.

24. The semiconductor cooling mechanism according to claim 1, characterized in that at least two of the cooling patch systems are arranged.

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