Heterogeneous integrated structures and heterogeneous integrated wafers

Abstract

This invention provides heterogeneous integrated structures and heterogeneous integrated wafers that achieve optical coupling using a simple structure, significantly improving the efficiency of packaging and testing optical integrated circuits. [Solution] The optical integrated circuit includes a substrate, a light source, and an optical coupling element. The light source provides first light to the optical coupling element. An optical guide device forms heterogeneous integration with the optical integrated circuit and includes a first lens and a first reflector. The first lens is placed on the substrate and aligned with the optical coupling element. The first light from the optical coupling element passes sequentially through the first lens, is reflected by the first reflector, and is transmitted to an optical fiber connector. The second light from the optical fiber connector is sequentially reflected by the first reflector, passes through the first lens, and is transmitted to the optical coupling element. Heterogeneous integrated wafers are also provided.

Description

Technical Field

[0001] The present invention relates to a heterogeneous integration structure and a heterogeneous integration wafer.

Background Art

[0002] In a general semiconductor manufacturing process, a wafer acceptance test (WAT) is a very important in-line inspection that can be used to judge the quality of the process and the quality of the die. On the other hand, the method for measuring the optical input and optical output of an optical integrated circuit is more complicated than circuit inspection, and how to perform the wafer acceptance test of the optical integrated circuit with a simple structure has become an urgent issue.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The present invention provides a heterogeneous integration structure and a heterogeneous integration wafer that achieve optical coupling using a simple structure and greatly improve the efficiency of packaging and testing of an optical integrated circuit.

Means for Solving the Problems

[0004] According to an embodiment of the present invention, a heterogeneous integration structure including an optical integrated circuit and an optical guiding device is provided. The optical integrated circuit includes a substrate, at least one light source, and at least one optical coupling element. The light source and the optical coupling element are disposed on the substrate. The light source is used to generate a first light, and the optical coupling element is disposed on the path of the first light. The optical guiding device forms a heterogeneous integration with the optical integrated circuit and includes at least one first lens and a first reflector. The first lens is disposed on the substrate and aligned with the optical coupling element. The first reflector is disposed on the substrate. The first light from the optical coupling element sequentially passes through the first lens, is reflected by the first reflector, and is transmitted to an optical fiber connector. Or, the second light from the optical fiber connector is sequentially reflected by the first reflector, passes through the first lens, and is transmitted to the optical coupling element.

[0005] According to one embodiment of the present invention, an integrated wafer is provided that includes a plurality of optical integrated circuits arranged in an array, and a plurality of optical guide devices, each forming heterogeneous integration with these optical integrated circuits. Each optical integrated circuit includes a substrate, at least one light source, and at least one optical coupling element, the light source and the optical coupling element being located on the substrate, the light source being used to generate first light, and the optical coupling element being located on the path of the first light. Each optical guide device includes at least one first lens and a first reflector. The first lens is located on the substrate and is aligned with the corresponding optical coupling element. The first reflector is located on the substrate. First light from the optical coupling element passes sequentially through the first lens, is reflected by the first reflector, and is transmitted to an optical fiber connector, or second light from the optical fiber connector is sequentially reflected by the first reflector, passes through the first lens, and is transmitted to the optical coupling element. [Effects of the Invention]

[0006] Based on the above, the heterogeneous integrated wafer provided by the embodiments of the present invention includes a plurality of heterogeneous integrated structures. The performance of each optical integrated circuit can be tested by a removable optical guide device of each heterogeneous integrated structure. In particular, by placing each optical guide device on the substrate of each optical integrated circuit, there is no need to cut the substrate. Therefore, the process of cutting the substrate can be omitted, and the structural strength of each heterogeneous integrated structure and heterogeneous integrated wafer is high.

[0007] To make the above-mentioned features and advantages of the present invention clearer and easier to understand, embodiments are described below and explained in detail with reference to the accompanying drawings. [Brief explanation of the drawing]

[0008] [Figure 1A] Figure 1A shows a schematic diagram of a heterogeneous integration structure according to one embodiment of the present invention. [Figure 1B] Figure 1B shows a schematic cross-sectional view of the substructure in Figure 1A in the XZ plane. [Figure 2] Figure 2 shows a schematic diagram of a heterogeneous integrated wafer according to one embodiment of the present invention. [Modes for carrying out the invention]

[0009] Referring to Figures 1A and 1B, Figure 1A shows a schematic diagram of a heterogeneous integrated structure according to one embodiment of the present invention. Figure 1B shows a schematic cross-sectional view of the partial structure of Figure 1A in the XZ plane.

[0010] The heterogeneous integrated structure 1 can be implemented as a heterogeneous integrated chip 1 and includes an optical integrated circuit 100 and a light guiding device 200.

[0011] The optical integrated circuit 100 includes a substrate SB, a plurality of light sources 101, and a plurality of optical coupling elements 102. These light sources 101 and these optical coupling elements 102 are arranged on the upper surface ST of the substrate SB. The substrate SB may include silicon, a III-V semiconductor, silicon nitride, lithium niobate, a polymer, etc. Each light source 101 may include, but is not limited to, a laser diode that emits laser light LA. Each light source 101 may include a light-emitting diode (LED) or a micro LED. Each optical coupling element 102 is arranged on the path of the laser light LA ​​and may be, for example, a light spot adjustment element. The light spot adjustment element may include, but is not limited to, a microlens for adjusting the light spot size and light spot shape of the laser light LA.

[0012] In some embodiments, the optical integrated circuit 100 may further include a plurality of optical modulators 103 and a plurality of waveguides 104, but is not limited thereto. In these embodiments, laser light LA ​​from each light source 101 may be transmitted sequentially to the corresponding optical modulator 103, waveguide 104 and optical coupling element 102.

[0013] The optical guide device 200 forms a heterogeneous integration with the optical integrated circuit 100 and includes a removable module 201. The removable module 201 includes a first member 201A, a second member 201B, and a third member 201C, the third member 201C may be implemented as an optical fiber connector on which a plurality of individual optical fibers 206 are arranged. The above heterogeneous integration refers to assembling and packaging multiple individually manufactured components onto a single chip in order to improve functionality. Specifically, the first member 201A and the second member 201B can be attached to and detached from each other along the Z direction, the second member 201B and the third member 201C can be attached to and detached from each other along the X direction, and the first member 201A is fixedly attached to the upper surface ST of the substrate SB, thereby realizing heterogeneous integration between the optical guide device 200 and the optical integrated circuit 100. By permanently attaching the first component 201A to the upper surface ST of the substrate SB and making each component removable, performance testing of the optical integrated circuit 100 can be easily performed.

[0014] However, the present invention is not limited thereto, and in some embodiments, the first member 201A is removable from the substrate SB.

[0015] In one comparative example, the substrate SB is cut along the dashed line CC' in Figure 1A, where the dashed line CC' corresponds to the optical outlet of each optical coupling element 102. That is, the optical outlet of each optical coupling element 102 is located above the side surface formed after cutting the substrate SB, and the first member 201A of the optical guide device 200 is positioned on the above-mentioned side surface of the substrate SB to guide the light from each optical coupling element 102. In contrast, in the embodiment of the present invention, it is not necessary to cut the substrate SB. The first member 201A may be positioned on the upper surface ST of the substrate SB, the process of cutting the substrate SB can be omitted, and the structural strength of the heterogeneous integrated structure 1 can be improved.

[0016] An optical guide device 200 according to an embodiment of the present invention further includes a plurality of lenses 202 and a first reflector 203 disposed on a first member 201A, and a plurality of lenses 204 and a second reflector 205 disposed on a second member 201B. Here, these lenses 202 and these lenses 204 are aligned with the optical coupling elements 102, respectively. The first reflector 203 and the second reflector 205 may include a high-reflectivity coating layer and are inclined at 45 degrees with respect to the upper surface ST of the substrate SB. When the first member 201A and the second member 201B are fixed to each other, the first member 201A, the second member 201B, their lenses 202, the first reflector 203, their lenses 204, and the second reflector 205 are all located on the upper surface ST of the substrate SB.

[0017] In some embodiments, the performance of the optical integrated circuit 100 can be tested by these light sources 101 providing laser light LA ​​(first light). The laser light LA ​​is transmitted to each optical coupling element 102. The laser light LA ​​from each optical coupling element 102 sequentially passes through the corresponding lens 202, is reflected by the first reflector 203, passes through the corresponding lens 204, is reflected by the second reflector 205, and is transmitted to the corresponding optical fiber 206 in the third member 201C (optical fiber connector). The laser light LA ​​from the optical coupling element 102 has a beam width BS. The beam width BS may be, for example, 10 or less. Furthermore, by arranging these lenses 202 and these lenses 204, the efficiency of coupling the laser light LA ​​into the optical fiber 206 can be greatly improved.

[0018] In some embodiments, additional laser light (second light) may be provided by other laser sources (not shown). The laser light is transmitted to each optical fiber 206 in the third member 201C. The laser light from each optical fiber 206 is sequentially reflected by the second reflector 205, passes through the corresponding lens 204, is reflected by the first reflector 203, passes through the corresponding lens 202, and is transmitted to the corresponding optical coupling element 102. By arranging these lenses 202 and these lenses 204, the efficiency of coupling the laser light to the optical coupling element 102 can be greatly improved.

[0019] In some embodiments, these lenses 202 and these lenses 204 may be microlenses. The object side and image side of the microlenses may be coated with an optical film, but the present invention is not limited thereto. In some embodiments, at least some of these lenses 202 and these lenses 204 may be metalenses, and by optimizing the size and arrangement of multiple nanostructures within the metalenses, the efficiency of coupling the laser light LA ​​to the optical fiber 206 or to the optical coupling element 102 can be greatly improved.

[0020] Note that the optical guide device 200 provided by the embodiment of the present invention is not limited to the above configuration. In some embodiments, the removable module 201 includes the first member 201A and the third member 201C and does not include the second member 201B. In these embodiments, each optical fiber 206 in the third member 201C is arranged parallel to the Z direction, and the first member 201A and the third member 201C can be fixed to and removed from each other along the Z direction. In some embodiments, the laser light LA from each optical coupling element 102 sequentially passes through the corresponding lens 202, is reflected by the first reflector 203, and is transmitted to the corresponding optical fiber 206 in the third member 201C. In some embodiments, laser light may be provided by other laser sources (not shown), the laser light is transmitted to each optical fiber 206 in the third member 201C, and the laser light from each optical fiber 206 is sequentially reflected by the first reflector 203, passes through the corresponding lens 202, and is transmitted to the corresponding optical coupling element 102.

[0021] Referring to FIG. 2, it shows a schematic diagram of a heterogeneous integration wafer according to an embodiment of the present invention.

[0022] The heterogeneous integration wafer 10 includes a plurality of optical integrated circuits 300 arranged in an array and a plurality of optical guide devices 400 that respectively form heterogeneous integration with the optical integrated circuits 300. Here, these optical integrated circuits 300 constitute a wafer, and the heterogeneous integration wafer 10 can be regarded as being formed by arranging a plurality of optical guide devices 400 on the wafer.

[0023] Each optical integrated circuit 300 can be implemented by any one of the optical integrated circuits 100 described in all the above embodiments. Further, the substrates SB of these optical integrated circuits 300 are integrally formed, and the upper surfaces ST of each substrate SB are on the same plane.

[0024] Each optical waveguide device 400 includes a removable module 401. The removable module 401 includes a first member 401A, a second member 401B, and a third member 401C. Here, the first member 401A may have the same or similar structure as the aforementioned first member 201A, the second member 401B may have the same or similar structure as the aforementioned second member 201B, and the third member 401C may have the same or similar structure as the third member 201C. For ease of understanding, in FIG. 2, only a part of the third member 401C of the removable module 401 is shown. Specifically, each optical waveguide device 400 can be implemented by any of the optical waveguide devices 200 described in all the above embodiments, and the heterogeneous integration wafer 10 can be regarded as being formed from a plurality of heterogeneous integration chips 1 arranged in an array.

[0025] In addition, each first member 401A of the heterogeneous integration wafer 10 is fixed on the upper surface ST of the substrate SB of the corresponding optical integrated circuit 300, and each first member 401A and the corresponding second member 401B can be removed, and each second member 401B and the corresponding third member 401C can be removed. Therefore, the performance of any optical integrated circuit 300 can be easily tested.

[0026] In summary, the heterogeneous integration wafer provided by the embodiments of the present invention includes a plurality of heterogeneous integration chips. The performance of each optical integrated circuit can be tested by the removable optical waveguide device of each heterogeneous integration chip. In particular, by arranging the first member of each optical waveguide device on the upper surface of the substrate of each optical integrated circuit, there is no need to cut the substrate. Therefore, the process of cutting the substrate can be omitted, and the structural strength of each heterogeneous integration chip and the heterogeneous integration wafer is high.

Industrial Applicability

[0027] The heterogeneous integration structure and the heterogeneous integration wafer of the present invention can be applied to the fields of high-performance and low-power data transmission and computing.

Explanation of Reference Numerals

[0028] 1: Heterogeneous integrated structure, heterogeneous integrated chip 10: Heterogeneous integrated wafers 100, 300: Optical integrated circuits 101: Light source 102: Optical coupling element 103: Optical modulator 104: Waveguide 200, 400: Optical guide device 201, 401: Removable modules 201A, 401A: First component 201B, 401B: Second component 201C, 401C: Third component 202, 204: Lens 203: First reflector 205: The second reflector 206: Fiber Optic BS: Beam width LA: Laser light SB: Circuit board ST:Top surface

Claims

1. An optical integrated circuit comprising a substrate, at least one light source, and at least one optical coupling element, wherein the at least one light source and the at least one optical coupling element are arranged on the substrate, the at least one light source is used to generate first light, and the at least one optical coupling element is arranged on the path of the first light, An optical guide device that forms heterogeneous integration with the aforementioned optical integrated circuit, Equipped with, The aforementioned optical guide device is The substrate is disposed on and aligned with the at least one optical coupling element, and the at least one first lens is disposed on the substrate. A first reflector arranged on the substrate, Equipped with, The first light from the at least one optical coupling element sequentially passes through the at least one first lens, is reflected by the first reflector, and is transmitted to the optical fiber connector, or the second light from the optical fiber connector is sequentially reflected by the first reflector, passes through the at least one first lens, and is transmitted to the at least one optical coupling element. Heterogeneous integration structure.

2. The substrate has an upper surface, and the at least one first lens and the first reflector are arranged on the upper surface. The heterogeneous integrated structure according to claim 1.

3. The optical integrated circuit further includes at least one optical modulator and at least one waveguide, wherein the at least one optical modulator, the at least one waveguide and the at least one optical coupling element are arranged sequentially on the first optical path. The heterogeneous integrated structure according to claim 1.

4. The optical guide device further includes a second reflector and a removable module, the removable module including a first member and a second member, the first reflector and the at least one first lens being positioned on the first member, and the second reflector being positioned on the second member. The heterogeneous integrated structure according to claim 1.

5. The optical guide device further includes at least one second lens disposed on the second member and positioned between the first reflector and the second reflector. The heterogeneous integrated structure according to claim 4.

6. At least one of the at least one first lens and at least one second lens includes a metalens. The heterogeneous integrated structure according to claim 5.

7. The substrate has an upper surface, and the first member and the second member are arranged on the upper surface. The heterogeneous integrated structure according to claim 4.

8. The first member is fixed on the upper surface of the substrate. The heterogeneous integrated structure according to claim 7.

9. The at least one optical coupling element includes a light spot adjustment element. The heterogeneous integrated structure according to claim 1.

10. The first light from the at least one optical coupling element has a beam width, and the beam width is 10 or less. The heterogeneous integrated structure according to claim 9.

11. The aforementioned heterogeneous integrated structure is formed as a heterogeneous integrated chip. The heterogeneous integrated structure according to claim 1.

12. A heterogeneous integration wafer comprising a plurality of optical integrated circuits arranged in an array, and a plurality of optical guide devices, each forming heterogeneous integration with the plurality of optical integrated circuits, Each optical integrated circuit includes a substrate, at least one light source, and at least one optical coupling element, wherein the at least one light source and the at least one optical coupling element are arranged on the substrate, the at least one light source is used to generate first light, and the at least one optical coupling element is arranged on the path of the first light. Each of the aforementioned optical guide devices, The substrate is disposed on and aligned with the corresponding at least one optical coupling element, and the at least one first lens is disposed on the substrate. A first reflector is placed on the substrate, Equipped with, The first light from the at least one optical coupling element sequentially passes through the at least one first lens, is reflected by the first reflector, and is transmitted to the optical fiber connector, or the second light from the optical fiber connector is sequentially reflected by the first reflector, passes through the at least one first lens, and is transmitted to the at least one optical coupling element. Heterogeneous integrated wafer.

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