electronic machinery

Abstract

The present invention provides an electronic device that can suppress the conduction of heat generated at a light source to a liquid crystal panel or the like. [Solution] The electronic device comprises a light guide plate, a light source that irradiates light onto the light guide plate, a liquid crystal panel facing the light guide plate in the thickness direction and irradiated with light transmitted from the light source through the light guide plate, a back plate located on the opposite side of the liquid crystal panel from the light guide plate in the thickness direction, a driver component provided on the liquid crystal panel to control the display of the liquid crystal panel, a first wiring board provided on the support surface on the back side of the surface of the back plate that faces the light guide plate in the thickness direction and electrically connected to the driver component, a second wiring board provided on the support surface of the back plate and electrically connected to the light source and the first wiring board, and a heat conductive member provided on the support surface of the back plate so as to cover at least a part of the second wiring board. At least a part of the first wiring board is exposed and not covered by the heat conductive member.

Description

Technical Field

[0005] ,

[0001] The present disclosure relates to an electronic device including a liquid crystal panel.

Background Art

[0002] In an electronic device including a liquid crystal panel, heat is generated when the liquid crystal panel operates, for example, when an image is displayed on the liquid crystal panel. Since there is a risk that the heat generated in the backlight that irradiates light onto the liquid crystal panel is conducted to other components, it is desirable to suppress this heat conduction to a low level.

[0003] Patent Document 1 discloses a video display device that suppresses heat conduction to a circuit board by conducting the heat generated in a backlight through an anisotropic thermal conductivity sheet (or a heat conduction member) such as a graphite sheet to a heat dissipation part.

Prior Art Documents

Patent Documents

[0004]

Patent Document ①

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the video display device disclosed in Patent Document 1, the heat conduction member is attached over the entire surface of the video display device behind the backlight. However, the heat conduction member is relatively expensive. Therefore, it is desirable that the area to which the heat conduction member is attached be as small as possible.

[0006] Therefore, an object of the present disclosure is to solve the above problems and provide an electronic device capable of heat diffusion with a small-area heat conduction member.

Means for Solving the Problems

[0007] To achieve the aforementioned objectives, the electronic device relating to this disclosure may employ, for example, the following configurations (1) to (10).

[0008] (1) One example of the configuration of the electronic device disclosed herein is: Light guide plate and A light source that irradiates light onto the light guide plate, A liquid crystal panel facing the light guide plate in the thickness direction, to which light transmitted from the light source through the light guide plate is irradiated, A back plate located on the opposite side of the liquid crystal panel from the light guide plate in the thickness direction, A driver component provided in the liquid crystal panel for controlling the display of the liquid crystal panel, A first wiring board is provided on the support surface on the back side of the surface of the back plate that faces the light guide plate in the thickness direction, and is electrically connected to the driver component. A second wiring board is provided on the support surface of the back plate and is electrically connected to the light source and the first wiring board, A heat conductive member provided on the support surface of the back plate so as to cover at least a portion of the second wiring board, At least a portion of the first wiring board is exposed and not covered by the heat conductive member.

[0009] According to the configuration of (1) above, at least a portion of the first wiring board is not covered by the heat conductive member and is exposed. This makes it possible to reduce the area of ​​the heat conductive member provided on the support surface compared to a configuration in which the entire surface of the support surface is covered by the heat conductive member. This allows heat to be diffused with a small area of ​​heat conductive member. In addition, it is possible to suppress the cost increase of electronic equipment that would be caused by having a large area of ​​heat conductive member.

[0010] According to the configuration of (1) above, at least a portion of the second wiring board electrically connected to the light source is covered with a heat conductive member. This allows the heat generated in the light source to be diffused by the heat conductive member. As a result, the localized concentration of heat generated in the light source on the liquid crystal panel can be mitigated.

[0011] The amount of heat generated by the driver component is less than the amount of heat generated by the light source. Therefore, the conduction of heat generated in the driver component through the first wiring board is less than the conduction of heat generated in the light source through the second wiring board. According to the configuration of (1) above, the heat conducting member does not cover at least a portion of the first wiring board, where heat conduction is thus small. This makes it possible to suppress the need for an excessively large area for the heat conducting member.

[0012] (2) In the configuration described in (1) above, Viewed along the thickness direction, the heat conductive member may overlap with at least a portion of the light source.

[0013] According to the configuration of (2) above, when heat generated in the light source is conducted along the thickness direction, it is easy to diffuse the heat in the heat conducting member.

[0014] (3) In the configuration described in (1) or (2) above, The heat conductive member does not need to cover the entirety of the first wiring board.

[0015] According to the configuration of (3) above, the area of ​​the heat conductive member provided on the support surface can be reduced compared to the configuration in which the heat conductive member covers the first wiring board.

[0016] (4) In any one of the above configurations (1) to (3), The light source may be located next to the light guide plate in an orthogonal direction perpendicular to the thickness direction, and may also be located at the orthogonal end of the liquid crystal panel when viewed along the thickness direction. The light guide plate may be a light guide plate that converts the direction of propagation of light irradiated from the light source from the orthogonal direction to the thickness direction and guides it to the liquid crystal panel.

[0017] According to the configuration of (4) above, the amount of heat generated from the light source becomes locally large at the end portion in the orthogonal direction of the liquid crystal panel. Even in such a case, most of the heat generated in the light source is conducted to the heat conduction member through the second wiring substrate and diffused by the heat conduction member. Thereby, local concentration of heat can be alleviated.

[0018] (5) In the configuration of (4) above, the light source may be located at one end portion in the orthogonal direction of the liquid crystal panel when viewed along the thickness direction, and the driver component may be located at the other end portion in the orthogonal direction of the liquid crystal panel when viewed along the thickness direction.

[0019] According to the configuration of (5) above, the light source and the driver component, which are both heat-generating components, are arranged apart from each other. Thereby, concentration of heat can be suppressed.

[0020] (6) In any one of the configurations of (1) to (5) above, the heat conduction member may be a graphite sheet.

[0021] According to the configuration of (6) above, for example, heat can be diffused more efficiently compared to the case where the heat conduction member is a ceramic sheet or the like.

[0022] (7) In any one of the configurations of (1) to (6) above, electronic components may be mounted on the first wiring substrate on the support surface, and electronic components may not be mounted on the second wiring substrate on the support surface.

[0023] If electronic components are mounted on the second wiring board, irregularities will occur on the second wiring board due to the electronic components. These irregularities may hinder the heat conductive material from covering the second wiring board. This may reduce the effectiveness of heat diffusion by the heat conductive material. According to the configuration of (7) above, since no electronic circuit board is mounted on the second wiring board, the reduction in the effectiveness of heat diffusion described above is less likely to occur.

[0024] (8) In any one of the configurations described in (1) to (7) above, The second wiring board on the support surface may have an elongated shape that extends along the support surface of the back plate.

[0025] According to the configuration described in (8) above, the area occupied by the second wiring board can be reduced.

[0026] (9) In any one of the configurations described in (1) to (8) above, One example of the configuration of the electronic device of this disclosure may include a housing located on the opposite side of the back plate from the back plate in the thickness direction, The housing may have a first opening that penetrates the housing in the thickness direction. The first wiring board may have a first bent portion that is bent in the thickness direction and passes through the first opening.

[0027] According to the configuration of (9) above, the first wiring board can be wired into the interior of the housing through the first opening. This makes it possible to shorten the wiring length of the first wiring board compared to a configuration in which the first wiring board wraps around the outer edge of the housing and is wired into the interior of the housing.

[0028] (10) In any one of the configurations described in (1) to (9) above, One example of the configuration of the electronic device of this disclosure may include a housing located on the opposite side of the back plate from the back plate in the thickness direction, The housing may have a second opening that penetrates the housing in the thickness direction. The first wiring board may have a second bend that curves from a first direction along the support surface of the back plate to a second direction that is along the support surface of the back plate and intersects the first direction. Viewed along the thickness direction, the second bent portion may be positioned to overlap the second opening.

[0029] In the second bend of the first wiring board, the first wiring boards may overlap twice in the thickness direction. In the portion where the first wiring boards overlap twice, bending in the thickness direction of the first wiring board is likely to occur. When such bending occurs, there is a risk that the first wiring board will push the liquid crystal panel or housing in the thickness direction. According to the configuration of (10) above, the second bend is positioned to overlap the second opening when viewed along the thickness direction. Therefore, when bending in the thickness direction occurs in the second bend, the bent second bend can be received by the second opening. As a result, the pushing of the liquid crystal panel or housing by the first wiring board in the thickness direction can be reduced. [Effects of the Invention]

[0030] According to the electronic device described herein, heat can be diffused using a small-area heat-conducting member. [Brief explanation of the drawing]

[0031] [Figure 1] This is a schematic front view showing an electronic device according to an embodiment of the present disclosure. [Figure 2] This is a schematic exploded perspective view showing the main body. [Figure 3] This is a schematic plan view of the display unit, heat conductive material, and double-sided tape as seen from the display unit side. [Figure 4] This is a schematic bottom view of the display unit, heat conductive material, and double-sided tape as seen from the housing side. [Figure 5] Figure 3 is a cross-sectional view showing the VV section. [Figure 6]This is a schematic cross-sectional view of the XY section at the locations of the housing, substrate, and the first and second openings of the first wiring board. [Figure 7] This is a schematic cross-sectional view of the location corresponding to Figure 5 in an electronic device according to another embodiment of the present disclosure. [Modes for carrying out the invention]

[0032] Embodiments of this disclosure will be described below with reference to the drawings. However, the present invention is not limited by these embodiments. Furthermore, substantially identical components are denoted by the same reference numerals in the drawings. The drawings are schematic, and the proportions of the dimensions, etc., do not necessarily correspond to those of reality.

[0033] Furthermore, for the sake of clarity, terms such as "up," "down," and "height" may be used below to indicate direction, assuming the state of normal use. However, this does not mean that the usage state of the electronic device related to this disclosure is limited.

[0034] (Embodiment) The configuration of an electronic device according to the embodiments of this disclosure will now be described. Examples of electronic devices according to the embodiments of this disclosure include game consoles, smartphones, and personal computers. The following description will explain the configuration of a game console as an example of an electronic device.

[0035] In this embodiment, the electronic device is a portable device used while placed on a surface such as the floor or a tabletop, or while held in the user's hand. The electronic device may perform game processing. The game processing is not limited to being performed on the electronic device itself, but may also be performed on a separate console or in the cloud. In this case, for example, images or videos resulting from the processing on the separate console or in the cloud are displayed on the display unit of the electronic device.

[0036] Figure 1 is a schematic front view showing an electronic device according to an embodiment of the present disclosure.

[0037] In this specification and in each figure, for the sake of explanation, the depth direction of the electronic device 1 is referred to as the X direction, the width direction of the electronic device 1 is referred to as the Y direction, and the height direction of the electronic device 1 is referred to as the Z direction. The X, Y, and Z directions intersect each other (in this embodiment, they are orthogonal to each other). The X direction, which is the depth direction of the electronic device 1, is an example of the thickness direction. The Y direction, which is the width direction of the electronic device 1, is an example of an orthogonal direction.

[0038] As shown in Figure 1, the electronic device 1 comprises a main body 11 and two controllers 12 that can be attached to and detached from the main body 11. In this embodiment, the two controllers 12 are attached to both sides of the main body 11 in the Y direction. Known means such as fitting, sliding, or magnets can be used to attach and detach the two controllers 12 from the main body 11. Note that the number of controllers 12 in the electronic device 1 is not limited to two. Furthermore, the electronic device 1 may not even have controllers 12.

[0039] The two controllers 12 are used to operate the electronic device 1. The two controllers 12 may be connected by wires to the main unit 11 (more specifically, to the main board 31 located in the internal space 3G of the housing 3 described later in the main unit 11 (see Figure 6)), and the electronic device 1 may be remotely controlled via a network such as the internet. In this case, multiple users in different locations can play games run on the electronic device 1.

[0040] Each of the two controllers 12 includes, for example, a stick and an operation button for performing operations. In this embodiment, each of the two controllers 12 includes a stick 121 and an operation button 122.

[0041] In this embodiment, the main body 11 is generally shaped like a rectangular parallelepiped. However, the shape of the main body 11 is not limited to a generally rectangular parallelepiped.

[0042] Figure 2 is a schematic exploded perspective view showing the main body.

[0043] As shown in Figure 2, the main body 11 comprises a housing 3, a display unit 4, a heat conductive member 51, double-sided tape 6, and a retaining sheet 7.

[0044] The housing 3 has an internal space 3G (see Figure 6). Various components, such as the main circuit board 31, are arranged in the internal space 3G.

[0045] Housing 3 may be composed of a single component, or it may be composed of multiple components combined together.

[0046] The housing 3 has a recess 3A. The recess 3A is recessed in the X direction from the upper surface 3B of the housing 3. The recess 3A has a bottom surface 3Aa and a stepped surface 3Ab. Viewed along the X direction, the stepped surface 3Ab surrounds the bottom surface 3Aa. In the X direction, the stepped surface 3Ab is located between the upper surface 3B and the bottom surface 3Aa.

[0047] The bottom surface 3Aa is provided with a first opening 3C, a second opening 3D, a groove 3E, and a recess 3F. The first opening 3C and the second opening 3D penetrate the wall of the outer wall constituting the housing 3, including the bottom surface 3Aa, in the X direction. As a result, the internal space 3G of the housing 3 (see Figure 6) is connected to the outside of the housing 3 via the first opening 3C and the second opening 3D. The groove 3E and the recess 3F are recessed in the X direction from the bottom surface 3Aa. The groove 3E extends along the Y direction. The recess 3F is connected to the groove 3E.

[0048] The display unit 4 is positioned in the recess 3A. Double-sided tape 6 is attached to the stepped surface 3Ab of the recess 3A. As a result, the outer edge of the display unit 4, when viewed along the X direction, is attached to the stepped surface 3Ab of the recess 3A by the double-sided tape 6. A well-known type of double-sided tape 6 is used. The configuration of the display unit 4 will be described in more detail later.

[0049] The heat conductive member 51 has thermal diffusing properties. In this embodiment, the heat conductive member 51 is a graphite sheet. The heat conductive member 51 is located between the housing 3 and the display unit 4 in the X direction. The heat conductive member 51 is attached to the display unit 4. Note that the heat conductive member 51 only needs to have thermal diffusing properties and is not limited to a graphite sheet. For example, the heat conductive member 51 may be a ceramic sheet. The attachment position of the heat conductive member 51 to the display unit 4 will be mentioned later in the detailed description of the configuration of the display unit 4.

[0050] The retaining sheet 7 is attached to the bottom surface 3Aa of the housing 3. The retaining sheet 7 functions as a cushion for the display unit 4 located in the recess 3A. The retaining sheet 7 is made of, for example, polyurethane foam. The retaining sheet 7 is positioned so as not to overlap with the first wiring board 47 and the second wiring board 48 (see Figure 4), which will be described later, when viewed along the X direction.

[0051] The configuration of the display unit 4 will be described in detail below. Figure 3 is a schematic plan view of the display unit, heat conductive member, and double-sided tape as seen from the display unit side. Figure 4 is a schematic bottom view of the display unit, heat conductive member, and double-sided tape as seen from the housing side. Figure 5 is a cross-sectional view showing the VV section of Figure 3.

[0052] As shown in Figures 3 to 5, the display unit 4 comprises a light source 41, a back plate 42, a reflector 43, a light guide plate 44, a liquid crystal panel 45, a driver component 46, a first wiring board 47, a second wiring board 48, and an electronic component 49.

[0053] As shown in Figure 5, the back plate 42, reflector 43, light guide plate 44, and liquid crystal panel 45 are stacked in this order along the X direction. In the X direction, the back plate 42 is closest to the bottom surface 3Aa of the housing 3, and the liquid crystal panel 45 is furthest from the bottom surface 3Aa of the housing 3.

[0054] In this embodiment, the light source 41 is a light-emitting diode (LED). However, the light source 41 is not limited to LEDs; any known type can be used.

[0055] The light source 41 is located next to the light guide plate 44 in the Y direction. Viewed along the X direction, the light source 41 is located at the Y-edge of the liquid crystal panel 45. Multiple light sources 41 are arranged in a line along the Z direction (in other words, the depth direction of the paper in Figure 5). The light sources 41 irradiate light toward the light guide plate 44 along the Y direction.

[0056] The back panel 42 is located in the X direction on the opposite side of the liquid crystal panel 45 from the light guide plate 44. In this embodiment, the back panel 42 comprises a resin plate and a metal bezel surrounding the resin plate. However, the configuration of the back panel 42 is not limited to the above configuration. For example, the back panel 42 may comprise a metal plate and a resin bezel surrounding the metal plate, or it may consist only of a metal plate.

[0057] The reflector 43 is a plate for reflecting light.

[0058] The light guide plate 44 is located on the opposite side of the housing 3 from the back plate 42 in the X direction. The light guide plate 44 is a plate that transmits light. The light guide plate 44 is, for example, a translucent acrylic plate, but is not limited to this.

[0059] In this embodiment, light irradiated from the light source 41 along the Y direction onto the light guide plate 44 is diffused within the light guide plate 44. As a result, the surface of the light guide plate 44 illuminates, and the light travels along the X direction towards the liquid crystal panel 45. In other words, in this embodiment, the light guide plate 44 converts the direction of propagation of light irradiated from the light source 41 from the Y direction to the X direction and guides it to the liquid crystal panel 45. The backlight is composed of the light source 41, the reflector 43, and the light guide plate 44. Light that travels in the X direction away from the liquid crystal panel 45 is reflected by the reflector 43. As a result, both sides of the light guide plate 44 in the X direction illuminate.

[0060] The liquid crystal panel 45 is positioned opposite the light guide plate 44 in the X direction. Light transmitted from the light source 41 through the light guide plate 44 is shone onto the liquid crystal panel 45. The liquid crystal panel 45 comprises an optical sheet 451, a first polarizing plate 452, a first panel 453, a second panel 454, a second polarizing plate 455, an adhesive 456, a cover glass 457, and a glass shatterproof film 458.

[0061] The optical sheet 451, the first polarizing plate 452, the first panel 453, the second panel 454, the second polarizing plate 455, the adhesive 456, the cover glass 457, and the glass shatterproof film 458 are laminated in this order along the X direction. In the X direction, the optical sheet 451 is closest to the light guide plate 44, and the glass shatterproof film 458 is furthest from the light guide plate 44.

[0062] The optical sheet 451 has a structure in which one or more films are laminated. The films include, for example, a diffusion film, a brightness-enhancing film, a polarization-separating film, a lens film for focusing light, and a phosphor film for increasing the range of colors that can be expressed. In this embodiment, the optical sheet 451 has a structure in which three of the above-mentioned films are laminated.

[0063] The first panel 453 and the second panel 454 are sandwiched between the first polarizing plate 452 and the second polarizing plate 455.

[0064] The first polarizer 452 and the second polarizer 455 transmit only light along the X direction. The first polarizer 452 and the second polarizer 455 absorb and do not transmit light along directions other than the X direction (for example, light along the Y direction).

[0065] The first panel 453 comprises a liquid crystal layer having liquid crystal molecules and a pair of alignment films sandwiching the liquid crystal layer. Driver components 46 are electrically connected to the pair of alignment films. The second panel 454 is configured similarly to the first panel 453.

[0066] The cover glass 457 protects the liquid crystal panel 45 from external impacts. The cover glass 457 is attached to the second polarizing plate 455 by adhesive 456.

[0067] The glass shatterproof film 458 is attached to the cover glass 457 to reduce the scattering of fragments of the cover glass 457 in the event that the cover glass 457 breaks due to an external impact.

[0068] The structure of the liquid crystal panel 45 is not limited to the structure described above, but can be any known structure. For example, in this embodiment, the liquid crystal panel 45 comprises two panels (a first panel 453 and a second panel 454), but it may also comprise a single panel.

[0069] The driver component 46 is provided on the liquid crystal panel 45. In this embodiment, the driver component 46 is supported by the first panel 453 of the liquid crystal panel 45. The driver component 46 is electrically connected to the alignment films provided by the first panel 453 and the second panel 454. In this embodiment, a heat conductive member 52 is attached to the driver component 46. The heat conductive member 52 is a graphite sheet, similar to the heat conductive member 51, but is not limited to a graphite sheet.

[0070] The driver component 46 applies voltage to each pixel of the first panel 453 and the second panel 454, and controls the applied voltage, according to instructions from the main board 31 (see Figure 6). In this way, the driver component 46 controls the display of the liquid crystal panel 45.

[0071] Viewed along the X direction, the driver component 46 is located at the Y-direction end of the liquid crystal panel 45, opposite to the light source 41. In other words, the light source 41 is located at one Y-direction end of the liquid crystal panel 45 when viewed along the X direction, and the driver component 46 is located at the other Y-direction end of the liquid crystal panel 45 when viewed along the X direction.

[0072] The first wiring board 47 and the second wiring board 48 are both flexible printed circuit boards.

[0073] The first wiring board 47 is positioned in the recess 3F of the housing 3 (see Figure 2).

[0074] As shown in Figure 4, the first wiring board 47 includes a mounting section 471, a first connection section 472, and a second connection section 473.

[0075] An electronic component 49 is mounted on the mounting section 471. As shown in Figures 4 and 5, the mounting section 471 is provided on the support surface 42B on the back side of the surface 42A of the back plate 42 that faces the reflector 43 in the X direction. The mounting section 471 is attached to the support surface 42B.

[0076] As shown in Figure 4, the first connecting portion 472 extends from the mounting portion 471. The first connecting portion 472 has a first bent portion 47A and a second bent portion 47B. The first bent portion 47A and the second bent portion 47B are the folded parts of the first connecting portion 472, respectively. The first bent portion 47A is located in a position that overlaps with the first opening 3C when viewed along the X direction. The second bent portion 47B is located in a position that overlaps with the second opening 3D when viewed along the X direction. In Figure 4, the first connecting portion 472 in a folded state is shown by a solid line, and the first connecting portion 472 in an unbent state is shown by a dashed-dot line.

[0077] The first connecting portion 472 extends from the mounting portion 471 along the support surface 42B in the Z direction toward the second opening 3D. The first connecting portion 472 is bent at the second bending portion 47B, changing direction from the Z direction to the Y direction. That is, at the second bending portion 47B, the first connecting portion 472 bends from the Z direction along the support surface 42B to the Y direction, which is along the support surface 42B and intersects the Z direction (in this embodiment, it is perpendicular to the Z direction). The Z direction is an example of a first direction, and the Y direction is an example of a second direction. The first connecting portion 472, after changing direction, extends along the Y direction on the support surface 42B toward the first opening 3C. The second bending portion 47B is the shape obtained by folding and bending the first connecting portion 472. On the other hand, the first bending portion 47A is a folded shape but not a folded shape. In this embodiment, the first connecting portion 472 is folded back by approximately 180 degrees at the second bending portion 47B. On the other hand, in this embodiment, the first connecting portion 472 is folded by approximately 90 degrees at the first bending portion 47A.

[0078] Figure 6 is a schematic cross-sectional view showing the XY cross-section at the locations of the housing, substrate, and the first and second openings of the first wiring board.

[0079] As shown in Figure 6, the first connecting portion 472 is bent at the first bending portion 47A, changing direction from the Y direction to the X direction. The reoriented first connecting portion 472 passes through the first opening 3C and enters the internal space 3G of the housing 3. In other words, the first connecting portion 472 bends in the X direction and passes through the first opening 3C. A connector 474 is provided at the tip of the first connecting portion 472 (in other words, the end of the first connecting portion 472 opposite to the end connected to the mounting portion 471). The connector 474 is electrically connected to the main board 31 located in the internal space 3G of the housing 3.

[0080] As shown in Figure 4, the second connecting portion 473 extends from the mounting portion 471 along the support surface 42B in the Y direction.

[0081] As shown in Figure 5, the second connector 473 is bent from the Y direction to the X direction on the outside of the back plate 42 when viewed along the X direction. The bent second connector 473 extends in the X direction toward the first panel 453, on the outside of the reflector 43, light guide plate 44, optical sheet 451, and first polarizer plate 452 when viewed along the X direction. The first connector 472, which extends in the X direction, is bent from the X direction to the Y direction at a position adjacent to the first panel 453 and is electrically connected to the driver component 46 supported by the first panel 453.

[0082] The second wiring board 48 is positioned in the groove 3E of the housing 3 (see Figure 2). As shown in Figure 5, the second wiring board 48 comprises a first portion 481 and a second portion 482.

[0083] As shown in Figure 4, the first portion 481 is provided on the support surface 42B of the back plate 42. The first portion 481 is electrically connected to the mounting portion 471 of the first wiring board 47. The first portion 481 has an elongated shape that extends from the mounting portion 471 along the support surface 42B in the Y direction. No electronic components are mounted on the first portion 481.

[0084] As shown in Figure 5, the first portion 481 is bent from the Y direction to the X direction on the outside of the back plate 42 when viewed along the X direction. The bent first portion 481 extends in the X direction toward the light guide plate 44 on the outside of the reflector plate 43 when viewed along the X direction. The first portion 481 extending in the X direction is connected to the second portion 482 at a position adjacent to the light guide plate 44. In this embodiment, the first portion 481 and the second portion 482 are constructed as a single unit, but the first portion 481 and the second portion 482 may be separate units.

[0085] The second part 482 is adjacent to the light guide plate 44 and the optical sheet 451 in the Y direction. The light source 41 is mounted on the second part 482. In other words, the second wiring board 48 is electrically connected to the light source. The second part 482 is attached to the light guide plate 44 by double-sided tape 483 in the vicinity of the position where the light source 41 is mounted. In this embodiment, the double-sided tape 483 is transparent. This reduces color unevenness of the light passing through the light guide plate 44. For example, the chromaticity can be lowered compared to when the double-sided tape 483 is white. In particular, the chromaticity is greatly reduced in the x-value of the x-value and y-value of chromaticity in the XYZ color system.

[0086] As described above, the first wiring board 47 is electrically connected to the main board 31, and the second wiring board 48 is electrically connected to the first wiring board 47. The main board 31 has an arithmetic unit mounted on it and controls the operation of the electronic device 1. The driver component 46 controls the display of the liquid crystal panel 45 based on instructions from the main board 31, as described above. The light source 41 is turned on and off based on instructions from the main board 31 or the driver component 46.

[0087] As shown in Figure 4, the heat conductive member 51 is attached to the support surface 42B of the back plate 42 so as to cover at least a portion of the second wiring board 48 on the support surface 42B. In this embodiment, the heat conductive member 51 is attached to the portion of the second wiring board 48 on the support surface 42B that is not near the first wiring board 47. In other words, in this embodiment, the heat conductive member 51 covers a portion of the second wiring board 48 on the support surface 42B. The heat conductive member 51 may cover the entire second wiring board 48 on the support surface 42B.

[0088] The heat conductive member 51 does not cover at least a portion of the first wiring board 47 on the support surface 42B. In other words, at least a portion of the first wiring board 47 is exposed and not covered by the heat conductive member 51. In this embodiment, the heat conductive member 51 does not cover the entire first wiring board 47. That is, in this embodiment, the entire first wiring board 47 is exposed and not covered by the heat conductive member 51. Note that the heat conductive member 51 may cover only a portion of the first wiring board 47 on the support surface 42B, and not the rest.

[0089] As shown in Figure 5, when viewed along the X direction, the heat conductive member 51 overlaps with the light source 41. In this embodiment, when viewed along the X direction, the heat conductive member 51 overlaps with the entire light source 41, but it may also overlap with only a part of the light source 41.

[0090] (Another embodiment) In the embodiment described above, the light source 41 is located next to the light guide plate 44 in the Y direction. Also, when viewed along the X direction, the light source 41 is located at the Y-edge of the liquid crystal panel 45. The light guide plate 44 converts the direction of light emitted from the light source 41 from the Y direction to the X direction and guides it to the liquid crystal panel 45. In other words, in the embodiment described above, the backlight composed of the light source 41, reflector 43, and light guide plate 44 is an edge-lit type. However, the backlight is not limited to the edge-lit type.

[0091] For example, instead of the light guide plate 44, a diffuser plate may be provided to diffuse the light emitted from the light source 41 in the X direction and guide it to the liquid crystal panel 45, and the light source 41 may be located on the opposite side of the liquid crystal panel 45 from the diffuser plate 44A in the X direction. In other words, instead of the light guide plate, a diffuser plate may be provided to diffuse the light emitted from the light source and guide it to the liquid crystal panel, and the light source may be located on the opposite side of the liquid crystal panel from the diffuser plate in the thickness direction. That is, the backlight may be a direct-lit type.

[0092] Figure 7 is a schematic cross-sectional view of the location corresponding to Figure 5 in an electronic device according to another embodiment of the present disclosure.

[0093] As shown in Figure 7, in the electronic device according to another embodiment, the light source 41 is located between the diffuser plate 44A and the reflector plate 43 in the X direction. Multiple light sources 41 are arranged in the Y and Z directions. In other words, multiple light sources 41 are arranged on the YZ plane. The light sources 41 irradiate the diffuser plate 44A with light.

[0094] In an electronic device according to another embodiment, a diffuser plate 44A is provided instead of the light guide plate 44. For example, the diffuser plate 44A in the electronic device according to another embodiment has fine irregularities on its surface. When light strikes these irregularities, the light is scattered in multiple directions. This causes the light to diffuse. Note that the light guide plate 44 shown in Figure 5 may also have the aforementioned irregularities.

[0095] Furthermore, by appropriately combining any of the embodiments and modifications described above, the respective effects can be achieved. [Explanation of symbols]

[0096] 1 Electronic equipment 3 Housing 3C 1st opening 3D 2nd aperture 41 Light source 42 Back plate 42B Support surface 44 Light guide plate 45 LCD panels 46 Driver parts 47. First Wiring Board 47A First bending section 47B Second bending section 48 Second Wiring Board 49 Electronic Components 51 Heat conductive material

Claims

1. Light guide plate and A light source that irradiates light onto the light guide plate, A liquid crystal panel facing the light guide plate in the thickness direction, to which light transmitted from the light source through the light guide plate is irradiated, A back plate located on the opposite side of the liquid crystal panel from the light guide plate in the thickness direction, A driver component provided in the liquid crystal panel for controlling the display of the liquid crystal panel, A first wiring board is provided on the support surface on the back side of the surface of the back plate that faces the light guide plate in the thickness direction, and is electrically connected to the driver component. A second wiring board is provided on the support surface of the back plate and is electrically connected to the light source and the first wiring board, A heat conductive member provided on the support surface of the back plate so as to cover at least a portion of the second wiring board, An electronic device in which at least a portion of the first wiring board is exposed and not covered by the heat conductive member.

2. The electronic device according to claim 1, wherein, when viewed along the thickness direction, the heat conductive member overlaps with at least a portion of the light source.

3. The electronic device according to claim 1 or 2, wherein the heat conductive member does not cover the entirety of the first wiring board.

4. The light source is located adjacent to the light guide plate in an orthogonal direction perpendicular to the thickness direction, and is located at the orthogonal end of the liquid crystal panel when viewed along the thickness direction. The electronic device according to claim 1 or 2, wherein the light guide plate is a light guide plate that converts the direction of propagation of light irradiated from the light source from the orthogonal direction to the thickness direction and guides it to the liquid crystal panel.

5. The light source is located at one end of the liquid crystal panel in the orthogonal direction when viewed along the thickness direction, The electronic device according to claim 4, wherein the driver component is located at the other end of the liquid crystal panel in the orthogonal direction when viewed along the thickness direction.

6. The electronic device according to claim 1 or 2, wherein the heat conductive member is a graphite sheet.

7. Electronic components are mounted on the first wiring board on the support surface. The electronic device according to claim 1 or 2, wherein no electronic components are mounted on the second wiring board on the support surface.

8. The electronic device according to claim 1 or 2, wherein the second wiring board on the support surface has an elongated shape that extends along the support surface of the back plate.

9. The housing is located on the opposite side of the light guide plate from the back plate in the thickness direction, The housing has a first opening that penetrates the housing in the thickness direction, The electronic device according to claim 1 or 2, wherein the first wiring board has a first bent portion that is bent in the thickness direction and passes through the first opening.

10. The housing is located on the opposite side of the light guide plate from the back plate in the thickness direction, The housing has a second opening that penetrates the housing in the thickness direction, The first wiring board has a second bend that curves from a first direction along the support surface of the back plate to a second direction that is along the support surface of the back plate and intersects the first direction, The electronic device according to claim 1 or 2, wherein, when viewed along the thickness direction, the second bent portion is provided in a position that overlaps with the second opening.

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