Electronic component coating sheets, laminated sheets, and electronic component mounting substrates
The coating sheet addresses poor adhesion and reworkability issues by ensuring strong adhesion at room temperature and easy peeling at elevated temperatures, enhancing maintenance efficiency.
JP2026110537APending Publication Date: 2026-07-02TOYO INK MFG CO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- TOYO INK MFG CO LTD
- Filing Date
- 2025-12-11
- Publication Date
- 2026-07-02
AI Technical Summary
Technical Problem
Existing electronic component coating sheets exhibit poor adhesion strength at room temperature, leading to inadequate reworkability when malfunctions occur on circuit boards.
Method used
Development of an electronic component coating sheet with specific adhesive strength and fracture stress properties, allowing for easy peeling at elevated temperatures, ensuring excellent adhesion and reworkability.
Benefits of technology
The coating sheet provides enhanced adhesion at room temperature and facilitates easy removal at higher temperatures, improving reworkability and maintaining structural integrity during maintenance.
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Smart Images
Figure 2026110537000001_ABST
Abstract
The present invention provides an electronic component coating sheet, a laminated sheet, and an electronic component mounting substrate having the coating layer, which can form a coating layer with excellent reworkability and adhesion at room temperature. [Solution] An electronic component coating sheet for forming the coating layer 3 of an electronic component mounting substrate 10 comprising a substrate 1, an electronic component 2, and a coating layer 3 covering at least a part of the electronic component 2 and the substrate 1, wherein (i) the adhesive strength of the cured product of the electronic component coating sheet bonded to a polyimide substrate is 2.0 N / cm or more when measured by 180-degree peeling at 25°C, and (ii) when the adhesive strength of the cured product of the electronic component coating sheet bonded to a polyimide substrate is A [N / cm] and the adhesive strength of the cured product of the electronic component coating sheet is B [N / cm] when measured by 180-degree peeling at Tg + 40°C, the ratio is 0.15
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