Electronic component coating sheets, laminated sheets, and electronic component mounting substrates

The electronic component coating sheet addresses poor adhesion and reworkability issues by optimizing molecular weight and functional group concentration, ensuring strong adhesion at room temperature and easy peeling at elevated temperatures for improved reworkability.

JP2026109906AActive Publication Date: 2026-07-02TOYO INK MFG CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
TOYO INK MFG CO LTD
Filing Date
2024-12-20
Publication Date
2026-07-02

AI Technical Summary

Technical Problem

Existing electronic component coating sheets exhibit poor adhesion strength at room temperature, leading to inadequate reworkability when malfunctions occur on circuit boards, as the adhesive strength at room temperature is low after curing.

Method used

The development of an electronic component coating sheet with specific adhesive strength and fracture stress properties, allowing for easy peeling at elevated temperatures, ensuring excellent adhesion and reworkability by adjusting the weight-average molecular weight, functional group concentration, and curable compound composition.

Benefits of technology

The coating sheet provides enhanced adhesion at room temperature and allows for easy peeling at elevated temperatures, improving reworkability and maintaining adhesion strength during rework without residue.

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Abstract

The present invention provides an electronic component coating sheet, a laminated sheet, and an electronic component mounting substrate having the coating layer, which can form a coating layer with excellent reworkability and adhesion at room temperature. [Solution] An electronic component mounting substrate 10 comprising a substrate 1, an electronic component 2, and a coating layer 3 covering at least a part of the electronic component 2 and the substrate 1, wherein the electronic component coating sheet for forming the coating layer 3 has an adhesive strength of 2.0 N / cm or more, measured by 180-degree peeling at 25°C of a cured product formed by bonding the electronic component coating sheet to a polyimide substrate, and further, (ii) when the adhesive strength measured by 180-degree peeling at 25°C of a cured product formed by bonding the electronic component coating sheet to a polyimide substrate is A [N / cm], and the adhesive strength measured by 180-degree peeling at Tg + 40°C of the cured product of the electronic component coating sheet is B [N / cm], the ratio is 0.15
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