solid phase bonding device

Abstract

Even when the hardness of the first and second workpieces differs, high bonding quality is maintained. [Solution] In the solid-state bonding apparatus 1, when the pressure sensor 17 detects a predetermined specific load P, the control device 30 calculates a first temperature T1 for heating the first workpiece W10 and a second temperature T2 for heating the second workpiece W20 from the data stored in the storage device 33, controls the first heating mechanism so that the temperature measured by the first temperature sensor 18 becomes the first temperature T1, and controls the second heating mechanism so that the temperature measured by the second temperature sensor 19 becomes the second temperature T2.

Description

Technical Field

[0001] The present disclosure relates to a solid-phase bonding device.

Background Art

[0002] Japanese Patent No. 7242112 (Patent Document 1) discloses a solid-phase point bonding device including a pressurizing mechanism including a pressing part and an energizing mechanism including a pair of electrodes. The solid-phase point bonding device disclosed in Japanese Patent No. 7242112 (Patent Document 1) is configured to energize two metal plates formed of a first workpiece and a second workpiece by a pair of electrodes to heat each metal plate, and press the two metal plates in a direction orthogonal to the metal plates by the pressing part. A bonding method that bonds in a solid state in a low-temperature range without melting the metal as disclosed in Japanese Patent No. 7242112 (Patent Document 1) is hereinafter also referred to as solid-phase bonding.

[0003] The pressing part is composed of, for example, a pair of pressurizing shafts. In solid-phase bonding, after forming protrusions by pressing the first workpiece and the second workpiece with a pair of pressurizing shafts, while supplying power to the pair of electrodes, further pressing the pair of pressurizing shafts, the first workpiece and the second workpiece are bonded in a solid state.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Here, when pressing the first and second workpieces with a pair of pressure shafts, it is possible that the hardness of the materials differs between the first and second workpieces. However, when the hardness of the first and second workpieces differs, the material with lower hardness may undergo plastic flow before the material with higher hardness, potentially leading to insufficient plastic flow in the higher-hardness material before joining. As a result, poor joining of the materials may occur at the contact surface between the first and second workpieces. Therefore, it is desirable to maintain high joining quality even when the hardness of the first and second workpieces differs.

[0006] The purpose of this disclosure is to maintain high bonding quality even when the hardness of the first workpiece and the second workpiece differs. [Means for solving the problem]

[0007] The solid-state bonding apparatus of this disclosure comprises a pair of pressurizing members that press conductive first and second workpieces from both sides in the thickness direction; a detection device that detects the load when the pair of pressurizing members press the first and second workpieces; a first heating mechanism for heating the first workpiece; a second heating mechanism for heating the second workpiece; a first temperature sensor for measuring the temperature of the first workpiece; a second temperature sensor for measuring the temperature of the second workpiece; a control device; and a storage device for storing data indicating the material properties of the first and second workpieces. When the detection device detects a predetermined specific load, the control device calculates a first temperature for heating the first workpiece and a second temperature for heating the second workpiece corresponding to the specific load from the data stored in the storage device, controls the first heating mechanism so that the temperature measured by the first temperature sensor becomes the first temperature, and controls the second heating mechanism so that the temperature measured by the second temperature sensor becomes the second temperature. [Effects of the Invention]

[0008] According to this disclosure, when the detection device detects a predetermined specific load, the control device calculates a first temperature for heating the first workpiece and a second temperature for heating the second workpiece corresponding to the specific load from data stored in the storage device, controls the first heating mechanism so that the temperature measured by the first temperature sensor becomes the first temperature, and controls the second heating mechanism so that the temperature measured by the second temperature sensor becomes the second temperature. In this way, the temperature of the first and second workpieces can be changed to correspond to the specific load, so that high bonding quality can be maintained even if the hardness of the first and second workpieces differs. [Brief explanation of the drawing]

[0009] [Figure 1] This diagram schematically shows a solid-phase bonding apparatus according to Embodiment 1. [Figure 2] This is a schematic diagram showing the structure of the electrode. [Figure 3] This is a diagram illustrating the joining process. [Figure 4] This figure shows the relationship between flow stress and temperature in each workpiece. [Figure 5] This flowchart shows the control actions performed by the control device. [Modes for carrying out the invention]

[0010] The embodiments of this disclosure will be described in detail below with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions will not be repeated.

[0011] [Embodiment 1] Figure 1 is a schematic diagram showing a solid-state bonding apparatus 1 according to Embodiment 1. As shown in Figure 1, when the X, Y, and Z axes are defined, the X-axis direction is the left-right direction of the solid-state bonding apparatus 1, the Y-axis direction is the up-down direction of the solid-state bonding apparatus 1, and the Z-axis direction is the front-back direction of the solid-state bonding apparatus 1. The solid-state bonding apparatus 1 is a device that bonds multiple workpieces W10 and W20, which are stacked on top of each other, without melting them, by applying current to the multiple workpieces W10 and W20 to form softened regions at the interfaces of the multiple workpieces W10 and W20, and then plastically deforming these softened regions.

[0012] Multiple workpieces W10 and W20 include a first workpiece W10 and a second workpiece W20. Each workpiece W10 and W20 is made of a metal such as iron or aluminum. Each workpiece W10 and W20 is formed, for example, in a flat plate shape. However, each workpiece W10 and W20 may be made of a material other than metal, as long as it is conductive and suitable for solid-state bonding.

[0013] As shown in Figure 1, the solid-phase bonding apparatus 1 comprises a solid-phase bonding device 10, a control device 30, and a display device 70. The solid-phase bonding device 10 comprises a pair of pressurizing shafts 11 and 12, a first electrode 21a, a second electrode 21b, a third electrode 22a, a fourth electrode 22b, actuators 15 and 16, a first heating device 41, a second heating device 42, a pressure sensor 17, a first temperature sensor 18, and a second temperature sensor 19. The "pressurizing shaft" may also be referred to as a "pressurizing member" or a "pressing member."

[0014] The pair of pressurizing shafts 11 and 12 includes a first pressurizing shaft 11 positioned on the side that presses the first workpiece W10, and a second pressurizing shaft 12 positioned on the side that presses the second workpiece W20. The pair of pressurizing shafts 11 and 12 can pressurize the first workpiece W10 and the second workpiece W20 from both sides in the thickness direction when the plate-shaped workpieces are stacked. The first pressurizing shaft 11 is driven by an actuator 15 as a drive source. The second pressurizing shaft 12 is driven by an actuator 16 as a drive source. The second pressurizing shaft 12 may be fixed instead of being driven by a drive source. Thus, one of the pair of pressurizing shafts 11 and 12 can be a fixed shaft.

[0015] The first press shaft 11 is capable of pressing the first workpiece W10 so that the first workpiece W10 undergoes plastic deformation. Specifically, the first press shaft 11 is capable of pressing the first workpiece W10 so that a projection is formed on the first workpiece W10. The first press shaft 11 is made of, for example, tungsten carbide. In this embodiment, the first press shaft 11 is formed in a cylindrical shape. The first press shaft 11 has a pressing surface for pressing the first workpiece W10. The pressing surface is the end face of the first press shaft 11. The pressing surface is formed in a circular shape.

[0016] The second pressure shaft 12 has the same configuration as the first pressure shaft 11. The central axis of the second pressure shaft 12 is located on the extension of the central axis of the first pressure shaft 11, and the pressing surface of the second pressure shaft 12 is positioned to face the pressing surface of the first pressure shaft 11. Note that the first pressure shaft 11 and the second pressure shaft 12 may have shapes other than cylindrical.

[0017] The first electrode 21a and the second electrode 21b are arranged around the first pressurizing shaft 11. The first electrode 21a and the second electrode 21b can energize the first workpiece W10 while in contact with it. The first heating device 41 supplies power to the first electrode 21a and the second electrode 21b. The first electrode 21a, the second electrode 21b, and the first heating device 41 function as a first heating mechanism for heating the first workpiece W10. The first electrode 21a and the second electrode 21b are made of, for example, copper.

[0018] The third electrode 22a and the fourth electrode 22b are arranged around the second pressing shaft 12. The first electrode 21a and the second electrode 21b can energize the second workpiece W20 while being in contact with the second workpiece W20. The second heating device 42 supplies power to the third electrode 22a and the fourth electrode 22b. The third electrode 22a, the fourth electrode 22b, and the second heating device 42 function as a second heating mechanism for heating the second workpiece W20. The third electrode 22a and the fourth electrode 22b are made of, for example, copper.

[0019] The first temperature sensor 18 is arranged at a position where it can measure the temperature of the portion of the first workpiece W10 pressed by the first pressing shaft 11. The first temperature sensor 18 is arranged, for example, near the end of the first pressing shaft 11. The first temperature sensor 18 may be any type of sensor as long as it can detect the temperature of the first workpiece W10. The second temperature sensor 19 is arranged at a position where it can measure the temperature of the portion of the second workpiece W20 pressed by the second pressing shaft 12. The second temperature sensor 19 is arranged, for example, near the end of the second pressing shaft 12. The second temperature sensor 19 may be any type of sensor as long as it can detect the temperature of the second workpiece W20.

[0020] The pressure sensor 17 is a sensor that detects the load when the pair of pressing shafts 11 and 12 press the first workpiece W10 and the second workpiece W20. The pressure sensor 17 is provided, for example, on the actuator 15. In this embodiment, a load cell is used as the pressure sensor 17. Note that the installation location of the pressure sensor 17 is not limited to the actuator 15. The pressure sensor 17 may be installed on the other actuator 16, or may be installed on both of the actuators 15 and 16. The pressure sensor 17 may be provided on the first pressing shaft 11 or the second pressing shaft 12.

[0021] The control device 30 includes an arithmetic unit 31, a memory 32, a storage device 33, and an input / output interface 34. These components are connected via a bus.

[0022] The arithmetic unit 31 is an arithmetic entity (computer) that executes predetermined processing. The arithmetic unit 31 is composed of a processor such as a CPU (Central Processing Unit), MPU (Micro-Processing Unit), TPU (Tensor Processing Unit), or GPU (Graphics Processing Unit), for example. Note that a processor, which is an example of the arithmetic unit 31, has a function of executing predetermined processing by executing a predetermined program, but a part or all of these functions may be implemented using a dedicated hardware circuit such as an ASIC (Application Specific Integrated Circuit) or FPGA (Field-Programmable Gate Array). The "processor" is not limited to a narrow sense processor that executes processing in a stored program manner such as a CPU, MPU, TPU, or GPU, and may include a hardwired circuit such as an ASIC or FPGA. Further, the arithmetic unit 31 is not limited to a Neumann type computer such as a CPU or GPU, and may be composed of a non-Neumann type computer such as a quantum computer or an optical computer. The arithmetic unit 31 as described above can also be read as a processing circuit (Processing Circuitry) that executes predetermined processing. Note that the arithmetic unit 31 may be composed of one chip or a plurality of chips. Further, the processor and related processing circuits may be composed of a plurality of computers interconnected by wire or wirelessly via a local area network or a wireless network, for example. The processor and related processing circuits may be composed of a cloud computer that remotely performs arithmetic operations based on input data and outputs the arithmetic operation results to another device located at a remote position.

[0023] The memory 32 includes a storage area (for example, a working area) for storing program code or work memory when the arithmetic unit 31 executes various programs. Examples of memory 32 include volatile memory such as DRAM and SRAM, or non-volatile memory such as ROM and flash memory.

[0024] The storage device 33 stores various programs or data executed by the arithmetic unit 31. For example, the storage device 33 stores control programs 330 that control various devices executed by the arithmetic unit 31. The storage device 33 may be one or more non-transitory computer-readable media or one or more computer-readable storage media. Examples of storage devices 33 include HDDs (Hard Disk Drives) and SSDs (Solid State Drives).

[0025] The input / output interface 34 receives values ​​acquired by the acquisition units, such as the pressure sensor 17, the first temperature sensor 18, and the second temperature sensor 19. A display device 70 is connected to the input / output interface 34. The display device 70 displays various information based on commands from the control device 30. The display device 70 includes a touch panel. The touch panel is an example of an input device.

[0026] The structure of the electrodes will be explained in detail. Figure 2 is a schematic diagram showing the structure of the electrodes. Figure 2 shows a cross-section of the first pressure shaft 11 viewed from the Y-axis direction. Figure 2 describes the first electrode 21a and the second electrode 21b, which are arranged around the first pressure shaft 11. Note that the third electrode 22a and the fourth electrode 22b, which are arranged around the second pressure shaft 12, have the same structure as the first electrode 21a and the second electrode 21b.

[0027] As shown in Figure 2, the first electrode 21a and the second electrode 21b are formed in a semi-circular shape. The first electrode 21a and the second electrode 21b are arranged so that their semi-circular ends face each other with respect to the first pressurizing shaft 11. The control device 30 controls the first heating device 41 while the first electrode 21a and the second electrode 21b are in contact with the first workpiece W10, and heats the first workpiece W10 by passing current from the first electrode 21a to the second electrode 21b.

[0028] Furthermore, the control device 30 controls the second heating device 42 while the third electrode 22a and the fourth electrode 22b are in contact with the second workpiece W20, and heats the second workpiece W20 by passing current from the third electrode 22a to the fourth electrode 22b. Note that the shape of the electrodes does not have to be a semicircular shape. For example, the shape of the electrodes may be a rectangle divided in half, a rhombus divided in half, etc., as long as the first pressure shaft 11 and the second pressure shaft 12 are arranged symmetrically. The shape of the electrodes may also be different on the left and right sides.

[0029] Next, the joining process will be explained. Figure 3 is a diagram illustrating the joining process. The control device 30 executes the joining process in the order shown in Figures 3(A) to (D). As shown in Figure 3(A), the first electrode 21a, second electrode 21b, third electrode 22a, and fourth electrode 22b are fixed to a pair of pressurizing shafts 11 and 12 by springs 50. The biasing force of the springs 50 acts on each workpiece W10 and W20 via the first electrode 21a, second electrode 21b, third electrode 22a, and fourth electrode 22b. The springs 50 are not shown in Figures 3(B) and later.

[0030] As shown in Figure 3(A), the control device 30 moves a pair of pressurizing shafts 11 and 12 toward each workpiece W10 and W20. At this time, each workpiece W10 and W20 is held between the first electrode 21a and the second electrode 21b and the third electrode 22a and the fourth electrode 22b. A contact load of, for example, 1 kN acts on each workpiece W10 and W20 as a biasing force by the spring 50. The first electrode 21a and the second electrode 21b are biased to a position that protrudes approximately 1 mm toward the first workpiece W10 from the first pressurizing shaft 11. The third electrode 22a and the fourth electrode 22b are biased to a position that protrudes approximately 1 mm toward the second workpiece W20 from the second pressurizing shaft 12. The pair of pressurizing shafts 11 and 12 and the first electrode 21a, second electrode 21b, third electrode 22a, and fourth electrode 22b are a mechanism that is driven as a whole by a drive source (actuator 15, 16).

[0031] Next, as shown in Figure 3(B), the control device 30 moves the pair of pressurizing shafts 11 and 12 toward each workpiece W10 and W20, and applies a load to each workpiece W10 and W20 to form protrusions. Each workpiece W10 and W20 forms protrusions W11 and W21 as a result of the load applied to form the protrusions.

[0032] Next, the control device 30 supplies current to each of the protrusions W11 and W21, as shown in Figure 3(C). The control device 30 supplies current to each of the protrusions W11 and W21 formed on the contact portion of each workpiece W10 and W20, thereby softening the contact portion of each protrusion W11 and W21. Specifically, the control device 30 controls the first heating device 41 while the first electrode 21a and the second electrode 21b are in contact with the first workpiece W10, and heats the first workpiece W10 by supplying current from the first electrode 21a to the second electrode 21b.

[0033] Furthermore, the control device 30 controls the second heating device 42 while the third electrode 22a and the fourth electrode 22b are in contact with the second workpiece W20, and heats the second workpiece W20 by passing current from the third electrode 22a to the fourth electrode 22b. Next, as shown in Figure 3(D), the control device 30 pushes the pair of pressurizing shafts 11 and 12 to the joining position while applying current to each of the protrusions W11 and W21, thereby joining the workpieces W10 and W20 at the contact portion.

[0034] In this way, the solid-phase bonding apparatus 1 applies a voltage to the first electrode 21a and the second electrode 21b using the first heating device 41, thereby causing a current to flow from the first electrode 21a through the first workpiece W10 to the second electrode 21b. Furthermore, the solid-phase bonding apparatus 1 applies a voltage to the third electrode 22a and the fourth electrode 22b using the second heating device 42, thereby causing a current to flow from the third electrode 22a through the second workpiece W20 to the fourth electrode 22b. This allows the solid-phase bonding apparatus 1 to heat the first workpiece W10 and the second workpiece W20 separately.

[0035] Next, the relationship between flow stress and temperature in each workpiece W10 and W20 will be explained. Figure 4 shows the relationship between flow stress and temperature in each workpiece W10 and W20. Flow stress is the stress necessary for a material to undergo plastic deformation in response to a load. The data in Figure 4 is stored in the storage device 33 based on prior experiments, etc. As shown in Figure 4, each workpiece W10 and W20 undergoes plastic deformation when a specific load P, which has been set in advance, is applied by the first pressure shaft 11 and the second pressure shaft 12.

[0036] Since the hardness of the materials differs between the first workpiece W10 and the second workpiece W20, the temperatures required for plastic deformation also differ. For example, the second workpiece W20 is harder than the first workpiece W10. Therefore, the temperature at which the first workpiece W10 is subjected to a specific load P is T1, while the temperature at which the second workpiece W20 is subjected to a specific load P is T2, which is higher than T1. Thus, even when the hardness of the first workpiece W10 and the second workpiece W20 differ, it is desirable to maintain high joining quality by adjusting the temperature of each workpiece W10 and W20 to the temperature required for plastic deformation. The specific control details are described below.

[0037] Figure 5 is a flowchart showing the control actions performed by the control device 30 (arithmetic unit 31). The processes in the flowchart of Figure 5 are repeatedly called and executed as subroutines from the main routine in the control of the control device 30. First, in step S (hereinafter simply referred to as "S") 1, the control device 30 sets up the first and second pressing shafts 11 and 12 to apply a specific load P to each workpiece W10, W20. The specific load P can be input in advance by the user, for example, from a display device 70 such as a touch panel.

[0038] Next, the control device 30 calculates a first temperature T1 for heating the first workpiece W10 and a second temperature T2 for heating the second workpiece W20, corresponding to the specific load P, from the data stored in the storage device 33 as shown in Figure 4 (S2). The first temperature T1 is the temperature corresponding to the flow stress of the first workpiece W10 when solid-state bonding is performed with the specific load P applied. The second temperature T2 is the temperature corresponding to the flow stress of the second workpiece W20 when solid-state bonding is performed with the specific load P applied. The second temperature T2 is higher than the first temperature T1.

[0039] Next, the control device 30 raises the temperature of the first workpiece W10 and the second workpiece W20 (S3). Specifically, the control device 30 controls the first heating device 41 while the first electrode 21a and the second electrode 21b are in contact with the first workpiece W10, and heats the first workpiece W10 by passing a current from the first electrode 21a to the second electrode 21b. The control device 30 also controls the second heating device 42 while the third electrode 22a and the fourth electrode 22b are in contact with the second workpiece W20, and heats the second workpiece W20 by passing a current from the third electrode 22a to the fourth electrode 22b.

[0040] Next, the control device 30 determines whether the first workpiece W10 and the second workpiece W20 have reached temperature T1 based on the measurements from the first temperature sensor 18 and the second temperature sensor 19 (S4). If the control device 30 determines that the first workpiece W10 and the second workpiece W20 have not reached temperature T1 (NO in S4), it returns to the process in S3. If the control device 30 determines that the first workpiece W10 and the second workpiece W20 have reached temperature T1 (YES in S4), it proceeds to the process in S5.

[0041] In S5, the control device 30 raises the temperature of only the second workpiece W20. Specifically, the control device 30 controls the second heating device 42 while the third electrode 22a and the fourth electrode 22b are in contact with the second workpiece W20, and heats the second workpiece W20 to a temperature T2 by passing current from the third electrode 22a to the fourth electrode 22b.

[0042] Next, the control device 30 determines whether the first workpiece W10 has reached temperature T1 based on the measurement value of the first temperature sensor 18 and whether the second workpiece W20 has reached temperature T2 based on the measurement value of the second temperature sensor 19 (S6). If the control device 30 determines that the first workpiece W10 is not at temperature T1 and the second workpiece W20 is not at temperature T2 (NO in S6), it returns to the process in S5. If the control device 30 determines that the first workpiece W10 is at temperature T1 and the second workpiece W20 is at temperature T2 (YES in S6), it proceeds to the process in S7.

[0043] In S7, the control device 30 moves the first pressurizing shaft 11 and the second pressurizing shaft 12 by controlling the actuators 15 and 16 so that the load P set in S1 becomes the load, thereby applying a load to the first workpiece W10 and the second workpiece W20.

[0044] Next, the control device 30 determines whether the measurement value of the pressure sensor 17 has reached the specified load P (S8). If the control device 30 determines that the measurement value of the pressure sensor 17 has not reached the specified load P (NO in S8), it returns to the process in S7. If the control device 30 determines that the measurement value of the pressure sensor 17 has reached the specified load P (YES in S8), it returns the process to the main routine. Note that the measurement value of the pressure sensor 17 reaching the specified load P also means that the amount of pressure applied by the pair of pressurizing shafts 11 and 12 has reached a predetermined specified amount.

[0045] According to the solid-state bonding apparatus 1 of Embodiment 1, when the pressure sensor 17 detects a predetermined specific load P, the control device 30 calculates a first temperature T1 for heating the first workpiece W10 and a second temperature T2 for heating the second workpiece W20 from the data stored in the storage device 33, corresponding to the specific load P. The control device 30 also controls the first heating device 41, which is the first heating mechanism, so that the temperature measured by the first temperature sensor 18 becomes the first temperature T1, and controls the second heating device 42, which is the second heating mechanism, so that the temperature measured by the second temperature sensor 19 becomes the second temperature T2. As a result, the temperatures of the first workpiece W10 and the second workpiece W20 can be changed to correspond to the specific load P, so that high bonding quality can be maintained even if the hardness of the first workpiece W10 and the second workpiece W20 are different.

[0046] <Summary> (1) The present disclosure includes a pair of pressurizing members (first pressurizing shaft 11, second pressurizing shaft 12) that press conductive first workpiece W10 and second workpiece W20 from both sides in the thickness direction, a detection device (pressure sensor 17) that detects the load when the pair of pressurizing members (first pressurizing shaft 11, second pressurizing shaft 12) press the first workpiece W10 and second workpiece W20, a first heating mechanism (first electrode 21a, second electrode 21b, first heating device 41) that heats the first workpiece W10, a second heating mechanism (third electrode 22a, fourth electrode 22b, second heating device 42) that heats the second workpiece W20, a first temperature sensor 18 that measures the temperature of the first workpiece W10, a second temperature sensor 19 that measures the temperature of the second workpiece W20, a control device 30, and a storage device 33 that stores data indicating the material properties of the first workpiece W10 and second workpiece W20. When the detection device (pressure sensor 17) detects a predetermined specific load P, the control device 30 calculates a first temperature T1 for heating the first workpiece W10 and a second temperature T2 for heating the second workpiece W20 corresponding to the specific load P from the data stored in the storage device 33. The control device 30 controls the first heating mechanism (first electrode 21a, second electrode 21b, first heating device 41) so that the temperature measured by the first temperature sensor 18 becomes the first temperature T1, and controls the second heating mechanism (third electrode 22a, fourth electrode 22b, second heating device 42) so that the temperature measured by the second temperature sensor 19 becomes the second temperature T2.

[0047] According to the solid-phase bonding apparatus 1 of this disclosure, the temperature of the first workpiece W10 and the second workpiece W20 can be changed to a temperature corresponding to a specific load P, so that high bonding quality can be maintained even when the hardness of the first workpiece W10 and the second workpiece W20 are different.

[0048] (2) In the solid-state bonding apparatus 1 of (1), the data includes the relationship between the flow stress required for plastic deformation and the temperature. The control device 30 uses the data stored in the storage device 33 to calculate the target temperature when a specific load P is applied, which is the first temperature T1 corresponding to the flow stress of the first workpiece W10 and the second temperature T2 corresponding to the flow stress of the second workpiece W20.

[0049] According to the solid-state bonding apparatus 1 of this disclosure, by using data including the relationship between flow stress and temperature required for plastic deformation, it is possible to easily calculate a first temperature T1 corresponding to the flow stress of the first workpiece W10 and a second temperature T2 corresponding to the flow stress of the second workpiece W20 as target temperatures when a specific load P is applied.

[0050] (3) In the solid-state bonding apparatus 1 of (1) or (2), the pair of pressurizing members include a first pressurizing shaft 11 positioned on the side that presses the first workpiece W10 and a second pressurizing shaft 12 positioned on the side that presses the second workpiece W20. The first temperature sensor 18 is positioned to measure the temperature of the portion of the first workpiece W10 that is pressed by the first pressurizing shaft 11, and the second temperature sensor 19 is positioned to measure the temperature of the portion of the second workpiece W20 that is pressed by the second pressurizing shaft 12.

[0051] According to the solid-phase bonding apparatus 1 of this disclosure, the temperature of the portion of the first workpiece W10 pressed by the first pressing shaft 11 and the temperature of the portion of the second workpiece W20 pressed by the second pressing shaft 12 can be measured.

[0052] (4) In the solid-state bonding apparatus 1 of (3), the first heating mechanism includes a first electrode 21a and a second electrode 21b arranged around the first pressurizing shaft 11, and a first heating device 41 that supplies power to the first electrode 21a and the second electrode 21b. The second heating mechanism includes a third electrode 22a and a fourth electrode 22b arranged around the second pressurizing shaft 12, and a second heating device 42 that supplies power to the third electrode 22a and the fourth electrode 22b. The control device 30 controls the first heating device 41 while the first electrode 21a and the second electrode 21b are in contact with the first workpiece W10, and heats the first workpiece W10 by passing a current from the first electrode 21a to the second electrode 21b. The control device 30 controls the second heating device 42 while the third electrode 22a and the fourth electrode 22b are in contact with the second workpiece W20, and heats the second workpiece W20 by passing a current from the third electrode 22a to the fourth electrode 22b.

[0053] According to the solid-phase bonding apparatus 1 of this disclosure, the first workpiece W10 and the second workpiece W20 can be heated individually, so that high bonding quality can be maintained even when the hardness of the first workpiece W10 and the second workpiece W20 are different.

[0054] (5) In the solid-state bonding apparatus 1 described in (1) to (4), if the second temperature T2 is higher than the first temperature T1, the control device 30 controls the first heating mechanism (first electrode 21a, second electrode 21b, first heating device 41) and the second heating mechanism (third electrode 22a, fourth electrode 22b, second heating device 42) so that the second workpiece W20 reaches the second temperature T2 after the first temperature sensor 18 and the second temperature sensor 19 have reached the first temperature T1.

[0055] According to the solid-phase bonding apparatus 1 of this disclosure, since only the second workpiece W20 is heated after the first temperature T1 is reached, heat is prevented from being transferred to the first workpiece W10 due to a rapid rise in the temperature of the second workpiece W20, and high bonding quality can be maintained even when the hardness of the first workpiece W10 and the second workpiece W20 are different.

[0056] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of this disclosure is indicated by the claims rather than by the description of the embodiments above, and all modifications within the meaning and scope equivalent to the claims are intended to be included. [Explanation of Symbols]

[0057] 1 Solid-phase bonding apparatus, 10 Solid-phase bonding equipment, 11 First pressurizing shaft, 12 Second pressurizing shaft, 15, 16 Actuators, 17 Pressure sensor, 18 First temperature sensor, 19 Second temperature sensor, 21a First electrode, 21b Second electrode, 22a Third electrode, 22b Fourth electrode, 30 Control device, 31 Calculation unit, 32 Memory, 33 Storage device, 34 Input / Output interface, 41 First heating device, 42 Second heating device, 50 Spring, 70 Display device, 330 Control program, P Specific load, T1 First temperature, T2 Second temperature, W10 First workpiece, W20 Second workpiece.

Claims

1. A pair of pressurizing members that press a conductive first workpiece and a second workpiece from both sides in the thickness direction, A detection device for detecting the load when the pair of pressurizing members press against the first workpiece and the second workpiece, A first heating mechanism for heating the first workpiece, A second heating mechanism for heating the second workpiece, A first temperature sensor for measuring the temperature of the first workpiece, A second temperature sensor for measuring the temperature of the second workpiece, Control device and The system includes a storage device that stores data indicating the material properties of the first workpiece and the second workpiece, The control device is When the detection device detects a predetermined specific load, it calculates a first temperature for heating the first workpiece and a second temperature for heating the second workpiece, corresponding to the specific load, from the data stored in the storage device. The first heating mechanism is controlled so that the temperature measured by the first temperature sensor becomes the first temperature. A solid-phase bonding apparatus that controls the second heating mechanism so that the temperature measured by the second temperature sensor becomes the second temperature.

2. The aforementioned data includes the relationship between flow stress and temperature required for plastic deformation. The solid-phase bonding apparatus according to claim 1, wherein the control device uses the data stored in the storage device to calculate a first temperature corresponding to the flow stress of the first workpiece and a second temperature corresponding to the flow stress of the second workpiece as target temperatures when the specific load is applied.

3. The pair of pressurizing members includes a first pressurizing shaft positioned on the side that presses the first workpiece, and a second pressurizing shaft positioned on the side that presses the second workpiece. The solid-phase bonding apparatus according to claim 1 or claim 2, wherein the first temperature sensor is positioned to measure the temperature of the portion of the first workpiece that is pressed by the first pressure shaft, and the second temperature sensor is positioned to measure the temperature of the portion of the second workpiece that is pressed by the second pressure shaft.

4. The first heating mechanism includes a first electrode and a second electrode arranged around the first pressurizing shaft, and a first heating device that supplies power to the first electrode and the second electrode. The second heating mechanism includes a third electrode and a fourth electrode arranged around the second pressurizing shaft, and a second heating device that supplies power to the third electrode and the fourth electrode. The control device is The first heating device is controlled while the first electrode and the second electrode are in contact with the first workpiece, and the first workpiece is heated by passing a current from the first electrode to the second electrode. The solid-phase bonding apparatus according to claim 3, wherein the second heating device is controlled while the third electrode and the fourth electrode are in contact with the second workpiece, and the second workpiece is heated by passing a current from the third electrode to the fourth electrode.

5. The solid-phase bonding apparatus according to claim 1 or 2, wherein the control device controls the first heating mechanism and the second heating mechanism so that the second workpiece reaches the second temperature after the first temperature and the second temperature sensors have reached the first temperature, when the second temperature is higher than the first temperature.

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