Encapsulating sheet and system board for system board on which the processor is mounted.
A multilayer encapsulating sheet with polyethylene and polypropylene resins enhances adhesion and recyclability by minimizing gaps and irregularities, addressing adhesion issues in system boards.
JP2026111396APending Publication Date: 2026-07-03DAI NIPPON PRINTING CO LTD
Patent Information
- Application Number
- JP2024226745
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2026-07-03
Smart Images
Figure 2026111396000001_ABST
Abstract
The present invention provides a sealing sheet that can improve adhesion to a functional layer even when a functional layer is laminated on the surface of the sealing sheet. [Solution] The sealing material sheet 1 for a system board on which a processor is mounted has a multilayer structure comprising a core layer 11 and a skin layer 12a, wherein the core layer 11 contains polyethylene resin as the base resin and the skin layer 12a contains polypropylene resin as the base resin.
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Citation Information
Patent Citations
An electronic circuit board assembly comprising an EMI shield structure and a thermal pad
JP2017536693A