Encapsulating resin composition and electronic component device

Abstract

To provide a encapsulating resin composition with excellent fluidity and curability. [Solution] A sealing resin composition containing an epoxy resin, a phenolic curing agent, a curing accelerator, an ester compound having three or more phenolic hydroxyl groups, and an inorganic filler.

Description

Technical Field

[0001] The present disclosure relates to a resin composition for sealing and an electronic component device.

Background Art

[0002] Since epoxy resins are superior to other thermosetting resins in terms of moldability, adhesiveness, electrical properties, mechanical properties, moisture resistance, etc., epoxy resin compositions are generally used as encapsulating resins for semiconductor devices. In recent years, due to the miniaturization of electronic devices and the high integration of semiconductor elements, the shape of semiconductor elements has become more complex. Therefore, the resin composition for sealing used to encapsulate semiconductor elements is required to have higher fluidity than ever before. In addition, due to the thinning of bonding wires in recent years, wire deformation is likely to occur along with the flow of the resin composition for sealing during encapsulation. From this point as well, high fluidity is required for the resin composition for sealing (see, for example, Patent Documents 1 and 2).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, when the fluidity of the resin composition for sealing is increased, the curability tends to decrease, and generally, fluidity and curability are in a trade-off relationship. The present disclosure has been made in view of the above conventional circumstances, and an object thereof is to provide a resin composition for sealing excellent in fluidity and curability and an electronic component device using the same.

Means for Solving the Problems

[0005] The specific means for achieving the aforementioned objectives are as follows: <1> A encapsulating resin composition comprising an epoxy resin, a phenolic curing agent, a curing accelerator, an ester compound having three or more phenolic hydroxyl groups, and an inorganic filler. <2> The molar ratio of the ester compound to the curing accelerator is 0.1 or more. <1> The sealing resin composition described above. <3> The curing accelerator is a compound containing phosphorus or an imidazole compound. <1> or <2> The sealing resin composition described above. <4> An element and a seal for the element. <1> ~ <3> An electronic component device comprising a cured product of a sealing resin composition according to any one of the items. [Effects of the Invention]

[0006] According to one embodiment of the present disclosure, it is possible to provide a sealing resin composition with excellent fluidity and curability, and an electronic component device obtained using the same. [Modes for carrying out the invention]

[0007] The present disclosure is described in detail below. However, the present disclosure is not limited to the following embodiments. In the following embodiments, the components (including elemental steps, etc.) are not essential unless otherwise explicitly stated. The same applies to numerical values ​​and their ranges, and do not limit the present disclosure.

[0008] In this disclosure, the term "process" includes not only processes that are independent of other processes, but also processes that cannot be clearly distinguished from other processes, provided that the purpose of such process is achieved. In this disclosure, the numerical range indicated using "~" includes the numbers before and after "~" as the minimum and maximum values, respectively. In numerical ranges described in stages within this disclosure, the upper or lower limit of one numerical range may be replaced with the upper or lower limit of another numerical range described in stages. Furthermore, in numerical ranges described within this disclosure, the upper or lower limit of that range may be replaced with the values ​​shown in the examples. In this disclosure, each component may contain multiple types of the corresponding substance. If multiple types of the substance corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple types of substances present in the composition, unless otherwise specified. In this disclosure, each component may include multiple types of particles. If multiple types of particles corresponding to each component are present in the composition, the particle size of each component refers to the value for a mixture of such multiple types of particles present in the composition, unless otherwise specified.

[0009] In the notation of groups of atoms in this disclosure, the notation that does not specify substitution or unsubstituted includes both those with and without substituents. In this disclosure, the number of structural units represents an integer value for a single molecule, but represents a rational number, which is the average value, for an aggregate of multiple types of molecules. In this disclosure, the carbon number means the total number of carbon atoms contained in the entire group, and if the group does not have substituents, it represents the number of carbon atoms that form the skeleton of the group, and if the group has substituents, it represents the total number of carbon atoms that form the skeleton of the group plus the number of carbon atoms in the substituents.

[0010] <Sealing resin composition> The encapsulating resin composition of this disclosure contains an epoxy resin, a phenolic curing agent, a curing accelerator, an ester compound having three or more phenolic hydroxyl groups, and an inorganic filler. Hereinafter, the "ester compound having three or more phenolic hydroxyl groups" is also referred to as the "specific ester compound." The above configuration results in a encapsulating resin composition with excellent fluidity and curability. The reason for this is not entirely clear, but it can be inferred as follows.

[0011] The phenolic hydroxyl groups of specific ester compounds interact with resins such as epoxy resins and phenolic curing agents, as well as inorganic fillers, thereby improving the affinity between the resin and the inorganic filler, resulting in a resin composition with excellent fluidity and curability. To promote this interaction, the specific ester compound should have three or more phenolic hydroxyl groups.

[0012] The following describes each component constituting the encapsulating resin composition. The encapsulating resin composition of this disclosure contains an epoxy resin, a phenolic curing agent, a curing accelerator, a specific ester compound, and an inorganic filler, and may optionally contain various additives such as coupling agents, stress relievers, mold release agents, colorants, flame retardants, and ion exchangers.

[0013] (Epoxy resin) The type of epoxy resin is not particularly limited as long as it contains epoxy groups in its molecule. Specific examples of epoxy resins are listed below, but epoxy resins are not limited to these examples.

[0014] Specifically, novolac-type epoxy resins (phenol novolac-type epoxy resins, orthocresol novolac-type epoxy resins, etc.) are obtained by condensing or co-condensing a novolac resin obtained by condensing or co-condensing a novolac resin obtained by phenol compounds selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene under an acidic catalyst with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, or propionaldehyde, and then epoxidizing the novolac resin. Copolymer epoxy resins that have been modified; diphenylmethane-type epoxy resins that are diglycidyl ethers of bisphenol A, bisphenol F, etc.; biphenyl-type epoxy resins that are diglycidyl ethers of alkyl-substituted or unsubstituted biphenols; stilbene-type epoxy resins that are diglycidyl ethers of stilbene-based phenol compounds; sulfur atom-containing epoxy resins that are diglycidyl ethers of bisphenol S, etc.; epoxy resins that are glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl ester-type epoxy resins that are glycidyl esters of polycarboxylic acid compounds such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidylamine-type epoxy resins in which the active hydrogen bonded to the nitrogen atom of aniline, diaminodiphenylmethane, isocyanuric acid, etc. is replaced with a glycidyl group; dicyclopentadiene-type epoxy resins that are epoxidized from a copolymer resin of dicyclopentadiene and a phenol compound;Alicyclic epoxy resins such as vinylcyclohexene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, and 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane, which have epoxidized olefin bonds within the molecule; paraxylylene-modified epoxy resins, which are glycidyl ethers of paraxylylene-modified phenol resins; metaxylylene-modified epoxy resins, which are glycidyl ethers of metaxylylene-modified phenol resins; terpene-modified epoxy resins, which are glycidyl ethers of terpene-modified phenol resins; and dicyclopentadiene-modified phenol resins, which are glycidyl ethers of dicyclo Examples of epoxy resins include: pentadiene-modified epoxy resins; cyclopentadiene-modified epoxy resins, which are glycidyl ethers of cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified epoxy resins, which are glycidyl ethers of polycyclic aromatic ring-modified phenolic resins; naphthalene-type epoxy resins, which are glycidyl ethers of naphthalene ring-containing phenolic resins; halogenated phenol novolac-type epoxy resins; hydroquinone-type epoxy resins; trimethylolpropane-type epoxy resins; linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid; and aralkyl-type epoxy resins, which are epoxidized aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins. Furthermore, aminophenol-type epoxy resins, which are glycidyl ethers of aminophenols, can also be cited as epoxy resins. These epoxy resins may be used individually or in combination of two or more types.

[0015] Among the epoxy resins mentioned above, it is preferable to include a biphenyl-type epoxy resin from the viewpoint of fluidity. The proportion of biphenyl-type epoxy resin in the total epoxy resin is preferably 20% by mass or more, more preferably 25% by mass or more, and even more preferably 30% by mass or more.

[0016] The biphenyl-type epoxy resin is not particularly limited as long as it is an epoxy resin having a biphenyl skeleton. For example, an epoxy resin represented by the following general formula (II) is preferred.

[0017] [ka]

[0018] In formula (II), R 8 '' represents a hydrogen atom, an alkyl group with 1 to 12 carbon atoms, or an aromatic group with 4 to 18 carbon atoms, and these may all be the same or all different. 'n' is an average value, representing a number between 0 and 10.

[0019] The stilbene-type epoxy resin is not particularly limited as long as it is an epoxy resin having a stilbene skeleton. For example, an epoxy resin represented by the following general formula (III) is preferred.

[0020] [ka]

[0021] In formula (III), R 9 and R 10 represents a hydrogen atom or a monovalent organic group with 1 to 18 carbon atoms, and these may all be the same or different. n is the average value and represents a number between 0 and 10.

[0022] The diphenylmethane type epoxy resin is not particularly limited as long as it is an epoxy resin having a diphenylmethane skeleton. For example, an epoxy resin represented by the following general formula (IV) is preferred.

[0023] [ka]

[0024] In formula (IV), R 11 and R 12represents a hydrogen atom or a monovalent organic group with 1 to 18 carbon atoms, and these may all be the same or different. n is the average value and represents a number between 0 and 10.

[0025] Sulfur atom-containing epoxy resins are not particularly limited as long as they contain sulfur atoms. For example, epoxy resins represented by the following general formula (V) are included.

[0026] [ka]

[0027] In formula (V), R 13 represents a hydrogen atom or a monovalent organic group with 1 to 18 carbon atoms, and these may all be the same or different. n is the average value and represents a number between 0 and 10.

[0028] The novolac-type epoxy resin is not particularly limited as long as it is an epoxy resin obtained by epoxidizing a novolac-type phenolic resin. For example, epoxy resins represented by the following general formula (VI) are included.

[0029] [ka]

[0030] In formula (VI), R 14 R represents a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, and these may all be the same or different. 15 '' represents a monovalent organic group with 1 to 18 carbon atoms, and each group may be identical or different. 'i' independently represents an integer from 0 to 3. 'n' is the average value, representing a number from 0 to 10.

[0031] The dicyclopentadiene-type epoxy resin is not particularly limited as long as it is an epoxy resin obtained by epoxidizing a compound having a dicyclopentadiene skeleton as a raw material. For example, epoxy resins represented by the following general formula (VII) can be cited.

[0032] [Chemical formula]

[0033] In formula (VII), R 16 represents a monovalent organic group having 1 to 18 carbon atoms, and they may all be the same or different. i independently represents an integer of 0 to 3. n is an average value and represents a number of 0 to 10.

[0034] The triphenylmethane type epoxy resin is not particularly limited as long as it is an epoxy resin obtained from a compound having a triphenylmethane skeleton as a raw material. For example, an epoxy resin obtained by glycidyl etherifying a triphenylmethane type phenol resin obtained from an aromatic aldehyde compound and a phenolic compound is preferable, and an epoxy resin represented by the following general formula (VIII) is more preferable.

[0035] [Chemical formula]

[0036] In formula (VIII), R 17 and R 18 represent a monovalent organic group having 1 to 18 carbon atoms, and they may all be the same or different. i independently represents an integer of 0 to 3, and k independently represents an integer of 0 to 4. n is an average value and represents a number of 0 to 10.

[0037] The copolymer type epoxy resin obtained by epoxidizing a novolak resin obtained from a naphthol compound, a phenol compound, and an aldehyde compound is not particularly limited as long as it is an epoxy resin obtained from a compound having a naphthol skeleton and a compound having a phenol skeleton as raw materials. For example, an epoxy resin represented by the following general formula (IX) can be mentioned.

[0038] [Chemical formula]

[0039] In formula (IX), R 19~R 21 represents a monovalent organic group having 1 to 18 carbon atoms, and each group may be identical or different. i is an independent integer from 0 to 3, j is an independent integer from 0 to 2, and k is an independent integer from 0 to 4. l and m are average values, numbers from 0 to 10, and (l+m) is a number from 0 to 10. The end of the epoxy resin represented by formula (IX) is either formula (IX-1) or (IX-2) below. In formulas (IX-1) and (IX-2), R 19 ~R 21 The definitions of i, j and k are given by R in equation (IX). 19 ~R 21 The definitions of i, j, and k are the same. n is either 1 (when bonded via a methylene group) or 0 (when not bonded via a methylene group).

[0040] [ka]

[0041] Examples of epoxy resins represented by the above general formula (IX) include random copolymers containing l structural units and m structural units randomly, alternating copolymers containing them alternately, copolymers containing them regularly, and block copolymers containing them in a block-like manner. Any one of these types may be used alone or two or more types may be used in combination.

[0042] As a copolymer epoxy resin, Epiclon HP-5000 (DIC Corporation, trade name), which is a methoxynaphthalene-cresol-formaldehyde cocondensation epoxy resin containing the following two structural units in a random, alternating, or blocky order, is also preferred. For example, an epoxy resin represented by the following general formula can be cited. In the following general formula, n and m are each average values ​​and are numbers from 0 to 10, and (n+m) is a number from 0 to 10, preferably n and m are each average values ​​and are numbers from 1 to 9, and (n+m) is a number from 2 to 10.

[0043] [ka]

[0044] The aralkyl epoxy resin is not particularly limited as long as it is an epoxy resin made from a phenol resin synthesized from at least one selected from the group consisting of phenol compounds such as phenol and cresol and naphthol compounds such as naphthol and dimethylnaphthol, and dimethoxyparaxylene, bis(methoxymethyl)biphenyl, or derivatives thereof. For example, an epoxy resin obtained by glycidyl etherification of a phenol resin synthesized from at least one selected from the group consisting of phenol compounds such as phenol and cresol and naphthol compounds such as naphthol and dimethylnaphthol, and dimethoxyparaxylene, bis(methoxymethyl)biphenyl, or derivatives thereof is preferred, and epoxy resins represented by the following general formulas (X) and (XI) are more preferred.

[0045] [ka]

[0046] In equations (X) and (XI), R 38 R represents a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, and these may all be the same or different. 37 , R 39 ~R 41 'i' represents a monovalent organic group with 1 to 18 carbon atoms, and each group may be identical or different. 'i' is an independent integer between 0 and 3, 'j' is an independent integer between 0 and 2, 'k' is an independent integer between 0 and 4, and 'l' is an independent integer between 0 and 4. 'n' is the average value, and each number is an independent number between 0 and 10.

[0047] In the above general formulas (II) to (XI), R 8 ~R 21 and R 37 ~R 41 Regarding this, "they may all be the same or all different" means, for example, the 8 to 88 R in equation (II) 8 This means that all of them may be the same or different. 9 ~R21 and R 37 ~R 41 Even if the number of each element in the formula is the same, they may be different. It means that it is okay to be there. Also, R 8 ~R 21 and R 37 ~R 41 These can be the same or different. For example, R 9 and R 10 All of them may be the same or different. Furthermore, the monovalent organic group having 1 to 18 carbon atoms in general formulas (III) to (XI) is preferably an alkyl group or an aryl group.

[0048] In the above general formulas (II) to (XI), n is an average value, and it is preferable that each is independently in the range of 0 to 10. When n is 10 or less, the melt viscosity of the resin component does not become too high, the viscosity of the sealing resin composition during melt molding decreases, and the occurrence of filling defects, deformation of bonding wires (gold wires connecting the element and leads) tends to be suppressed. It is more preferable that n be set in the range of 0 to 4.

[0049] The epoxy equivalent of the epoxy resin is not particularly limited. From the viewpoint of balancing various properties such as moldability, heat resistance, and electrical reliability, the epoxy equivalent of the epoxy resin is preferably 40 g / eq to 1000 g / eq, more preferably 45 g / eq to 500 g / eq, and even more preferably 50 g / eq to 350 g / eq. The epoxy equivalent of the epoxy resin shall be the value measured according to the method conforming to JIS K 7236:2009.

[0050] The epoxy resin may be solid or liquid at 25°C. If the epoxy resin is solid at 25°C, its softening point or melting point is not particularly limited. From the viewpoint of balancing moldability and heat resistance, the softening point or melting point of the epoxy resin is preferably 40°C to 180°C. Furthermore, from the viewpoint of ease of handling during the manufacture of the encapsulating resin composition, the softening point or melting point of the epoxy resin is preferably 50°C to 130°C. In this disclosure, the softening point refers to the value measured by the ring-and-ball method in JIS K 7234:1986. In this disclosure, the melting point refers to the value measured in accordance with the visual method specified in JIS K 0064:1992.

[0051] The total content of epoxy resin in the sealing resin composition is preferably 0.5% to 60% by mass, more preferably 2% to 50% by mass, and even more preferably 3% to 45% by mass, from the viewpoint of strength, fluidity, heat resistance, moldability, etc.

[0052] (Hardening agent) Phenolic curing agents may be used individually or in combination of two or more types. In this disclosure, the curing agent is defined as any compound that has a structure capable of reacting with the epoxy resin contained in the encapsulating resin composition and curing the encapsulating resin composition. Even compounds that are present in small amounts and contribute little to the curing reaction of the encapsulating resin composition are considered to be included as curing agents.

[0053] Examples of phenolic curing agents include phenolic resins and polyhydric phenolic compounds having two or more phenolic hydroxyl groups in one molecule. Specifically, these include polyhydric phenolic compounds such as resorcinol, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenols; novolac-type phenolic resins obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenolic compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene with an aldehyde compound such as formaldehyde, acetaldehyde, or propionaldehyde under an acidic catalyst; and phenolic resins synthesized from the above phenolic compounds with dimethoxyp-xylene, bis(methoxymethyl)biphenyl, etc. Examples include aralkyl-type phenolic resins such as ol-aralkyl resins and naphthol-aralkyl resins; para-xylylene and / or meta-xylylene-modified phenolic resins; melamine-modified phenolic resins; terpene-modified phenolic resins; dicyclopentadiene-type phenolic resins and dicyclopentadiene-type naphthol resins synthesized by copolymerization of the above phenolic compounds with dicyclopentadiene; cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified phenolic resins; biphenyl-type phenolic resins; triphenylmethane-type phenolic resins obtained by condensation or co-condensation of the above phenolic compounds with aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde under an acidic catalyst; and phenolic resins obtained by copolymerizing two or more of these. These phenolic curing agents may be used individually or in combination of two or more types.

[0054] Examples of aralkyl-type phenolic resins include phenolic aralkyl resins synthesized from phenolic compounds with dimethoxyp-xylene, bis(methoxymethyl)biphenyl, etc., and naphthol aralkyl resins. Aalkyl-type phenolic resins may be further copolymerized with other phenolic resins. Examples of copolymerized aralkyl-type phenolic resins include copolymerized phenolic resins of triphenylmethane-type phenolic resin and aralkyl-type phenolic resin, copolymerized phenolic resins of salicylaldehyde-type phenolic resin and aralkyl-type phenolic resin, and copolymerized phenolic resins of novolac-type phenolic resin and aralkyl-type phenolic resin.

[0055] The aralkyl-type phenolic resin is not particularly limited as long as it is synthesized from at least one compound selected from the group consisting of phenol compounds and naphthol compounds, and dimethoxyp-xylene, bis(methoxymethyl)biphenyl, or derivatives thereof. For example, phenolic resins represented by the following general formulas (XII) to (XIV) are preferred.

[0056] [ka]

[0057] In equations (XII) to (XIV), R 23 R represents a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, and these may all be the same or different. 22 , R 24 , R 25 and R 28 R represents a monovalent organic group having 1 to 18 carbon atoms, and each of them may be identical or different. 26 and R 27 '' represents a hydroxyl group or a monovalent organic group having 1 to 18 carbon atoms, and each of these may be the same or different. 'i' is an independent integer between 0 and 3, 'j' is an independent integer between 0 and 2, 'k' is an independent integer between 0 and 4, and 'p' is an independent integer between 0 and 4. 'n' is the average value, and each of these is an independent number between 0 and 10.

[0058] From the viewpoint of adhesion to the lead frame and heat resistance of the sealing resin composition of this disclosure, the aralkyl type phenolic resin is preferably a phenolic resin represented by general formula (XIII). From the viewpoint of adhesion to the lead frame and heat resistance of the sealing resin composition of this disclosure, it is preferable that both i and k in general formula (XIII) are 0.

[0059] The dicyclopentadiene-type phenolic resin is not particularly limited as long as it is a phenolic resin obtained from a compound having a dicyclopentadiene skeleton as a raw material. For example, a phenolic resin represented by the following general formula (XV) can be mentioned.

[0060] [ka]

[0061] In formula (XV), R 29 '' represents a monovalent organic group with 1 to 18 carbon atoms, and each group may be identical or different. 'i' independently represents an integer from 0 to 3. 'n' is the average value, representing a number from 0 to 10.

[0062] Triphenylmethane-type phenolic resins can be obtained using aromatic aldehyde compounds as raw materials. The phenolic resin is not particularly limited as long as it is a phenolic resin. For example, a phenolic resin represented by the following general formula (XVI) is preferred.

[0063] [ka]

[0064] In formula (XVI), R 30 and R 31 '' represents a monovalent organic group with 1 to 18 carbon atoms, and each group may be identical or different. 'i' is an independent integer between 0 and 3, and 'k' is an independent integer between 0 and 4. 'n' is the average value, a number between 0 and 10.

[0065] The copolymerized phenol resin of a triphenylmethane-type phenol resin and an aralkyl-type phenol resin is not particularly limited as long as it is a copolymerized phenol resin of a phenol resin obtained from a compound having a benzaldehyde skeleton as a raw material and an aralkyl-type phenol resin. For example, a phenol resin represented by the following general formula (XVII) is preferred.

[0066] [ka]

[0067] In formula (XVII), R 32 ~R 34 represents a monovalent organic group with 1 to 18 carbon atoms, and each group may be identical or different. Each i is an independent integer from 0 to 3, each k is an independent integer from 0 to 4, and each q is an independent integer from 0 to 5. l and m are the average values, and each is an independent number from 1 to 11.

[0068] The novolac-type phenolic resin is not particularly limited as long as it is a phenolic resin obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenolic compounds and naphthol compounds with an aldehyde compound under an acidic catalyst. For example, a phenolic resin represented by the following general formula (XVIII) is preferred.

[0069] [ka]

[0070] In formula (XVIII), R 35 R represents a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, and these may all be the same or different. 36 '' represents a monovalent organic group with 1 to 18 carbon atoms, and each group may be identical or different. 'i' independently represents an integer from 0 to 3. 'n' is the average value, representing a number from 0 to 10.

[0071] In the above general formulas (XII) to (XVIII), R 22 ~R 36 The statement "they may all be identical or all different" refers, for example, to the i Rs in equation (XII). 22 This means that all of them may be identical or mutually different. 23 ~R 36 Regarding this as well, it means that the number of each element included in the formula may all be the same or they may be different from each other. Also, R 22 ~R 36 These can be the same or different. For example, R 22 and R 23 All of them may be the same or different, R 30 and R 31 All of them may be the same or different.

[0072] In the above general formulas (XII) to (XVIII), n is preferably in the range of 0 to 10. If it is 10 or less, the melt viscosity of the resin component will not become too high, the viscosity of the sealing resin composition during melt molding will also be low, and filling defects, deformation of bonding wires (gold wires connecting the element and leads) will be less likely to occur. The average n in one molecule is preferably set in the range of 0 to 4.

[0073] The hydroxyl group equivalent of the phenolic curing agent is not particularly limited. From the viewpoint of balancing various properties such as moldability, heat resistance, and electrical reliability, it is preferably 10 g / eq to 1000 g / eq, and more preferably 30 g / eq to 500 g / eq. The hydroxyl equivalent of phenolic curing agents refers to the value calculated based on the hydroxyl value measured in accordance with JIS K 0070:1992.

[0074] When the phenolic curing agent is solid at 25°C, its softening point or melting point is not particularly limited. From the viewpoint of moldability and heat resistance, the softening point or melting point of the phenolic curing agent is preferably 40°C to 180°C. Furthermore, from the viewpoint of handling during the manufacture of the encapsulating resin composition, the softening point or melting point of the phenolic curing agent is preferably 50°C to 130°C.

[0075] The equivalent ratio of phenolic hydroxyl groups (active hydrogen) of the phenolic curing agent to the epoxy groups of the epoxy resin in the sealing resin composition (moles of phenolic hydroxyl groups (active hydrogen) of the phenolic curing agent / moles of epoxy groups of the epoxy resin) is not particularly limited, but for example it can be 0.5 to 1.2, 0.5 to 1.0, 0.55 to 0.9, or 0.6 to 0.8.

[0076] In addition to phenolic curing agents, other curing agents may be included. Examples of other curing agents include amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, and blocked isocyanate curing agents.

[0077] When the curing agent contains other curing agents, from the viewpoint of fluidity, the content of the phenolic curing agent relative to the total mass of the curing agent is preferably 60% to 100% by mass, more preferably 70% to 100% by mass, even more preferably 80% to 100% by mass, particularly preferably 90% to 100% by mass, and may be 100% by mass.

[0078] (Specific ester compounds) A specific ester compound is an ester compound having three or more phenolic hydroxyl groups. A specific ester compound may be used alone or in combination of two or more. The number of phenolic hydroxyl groups in a specific ester compound may be 3 to 5.

[0079] The specific ester compound preferably includes a compound represented by the following formula (1).

[0080] [ka]

[0081] In formula (1), R represents an alkyl group, and n represents an integer between 3 and 5.

[0082] The alkyl group represented by R may be linear, branched, or cyclic, but it is preferably linear from the viewpoint of fluidity. The number of carbon atoms in the alkyl group is preferably 1 to 18, more preferably 1 to 10, and even more preferably 1 to 3, from the viewpoint of fluidity.

[0083] In formula (1), n ​​is preferably 3 or 4, and more preferably 3. The hydroxyl group attached to the phenyl group may be at any position. When n is 3, the hydroxyl group attached to the phenyl group may be at positions 2,3,4,2,3,5,2,3,6,2,4,5,2,4,6,3,4,5, or 3,4,6, with 3,4,5 being more preferable. When the compound represented by formula (1) has a hydroxyl group at positions 3,4,5, this compound is a gallic acid ester. When n is 4, the hydroxyl group attached to the phenyl group may be at positions 2,3,4,5, 2,3,4,6, or 2,3,5,6.

[0084] Examples of compounds represented by formula (1) include methyl gallate, ethyl gallate, and propyl gallate.

[0085] From the viewpoint of moldability, the molecular weight of the specific ester compound is preferably 50 to 600, more preferably 100 to 550, and even more preferably 150 to 500.

[0086] From the viewpoint of moldability, the melting point of the specific ester compound is preferably 50°C to 250°C, more preferably 60°C to 240°C, and even more preferably 70°C to 230°C.

[0087] From the viewpoint of balancing fluidity and curability, the molar ratio of the specific ester compound to the curing accelerator (specific ester compound / curing accelerator) in the sealing resin composition may be 0.1 or higher, 0.2 or higher, 0.3 or higher, 0.4 or higher, 0.5 or higher, 0.6 or higher, 0.7 or higher, 0.8 or higher, 0.9 or higher, or 1.0 or higher. Furthermore, from the viewpoint of curability, the molar ratio (specific ester compound / curing accelerator) is preferably 10.0 or less, more preferably 9.0 or less, and even more preferably 8.0 or less.

[0088] (Curing accelerator) The type of curing accelerator is not particularly limited and can be selected according to the type of epoxy resin, the desired properties of the encapsulating resin composition, etc. One type of curing accelerator may be used alone, or two or more types may be used in combination. Specific examples of curing accelerators are listed below, but the invention is not limited to these. Examples of curing accelerators include diazabicycloalkenes such as 1,5-diazabicyclo[4.3.0]nonene-5 (DBN) and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 2-heptadecylimidazole; derivatives of the cyclic amidine compounds; phenol novolac salts of the cyclic amidine compounds or their derivatives; and quinone compounds such as maleic anhydride, 1,4-benzoquinone, 2,5-tholquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, and phenyl-1,4-benzoquinone. Compounds having intramolecular polarization obtained by adding compounds with π bonds, such as zophenylmethane; cyclic amidinium compounds such as tetraphenylborate salt of DBU, tetraphenylborate salt of DBN, tetraphenylborate salt of 2-ethyl-4-methylimidazole, and tetraphenylborate salt of N-methylmorpholine; tertiary amine compounds such as pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; derivatives of the above tertiary amine compounds; ammonium salt compounds such as tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, and tetrapropylammonium hydroxide; The following compounds containing the element phosphorus: primary phosphines such as ethylphosphine and phenylphosphine, secondary phosphines such as dimethylphosphine and diphenylphosphine, tributylphosphine, triphenylphosphine, diphenyl(p-tolyl)phosphine, tris(alkylphenyl)phosphine, tris(alkoxyphenyl)phosphine, tris(alkylalkoxyphenyl)phosphine, tris(dialkylphenyl)phosphine, tris(trialkylphenyl)phosphine, tris(tetraalkylphenyl)phosphine, tris(dialkoxyphenyl)phosphine, tris(trialkoxyphenyl)phosphine, tris(tetraalkoxyphenyl)phosphine, trialkylphosphine, dialkylarylphosphine, alkyldiarylphosphine, trinaphthylphosphine, tris(benzyl)phosphine, and other tertiary phosphines; phosphine compounds such as complexes of the above organophosphines with organoborons; and the above organophosphines or the above phosphine compounds with maleic anhydride, 1,4-benzoquinone, 2,5-tholquinone, 1,4-naphthoquinone, Compounds having intramolecular polarization obtained by adding compounds having π bonds, such as quinone compounds like 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, anthraquinone, and diazophenylmethane; and the aforementioned organophosphine or the aforementioned phosphine compound to 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-chlorophenol. Compounds having intramolecular polarization obtained by reacting halogenated phenol compounds such as phenolic iodide, 3-iodide, 2-iodide, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5-dimethylphenol, 4-bromo-2,6-di-t-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, and 4-bromo-4'-hydroxybiphenyl, followed by a dehalogenation step;Tetrasubstituted phosphonium compounds such as tetraphenylphosphonium, tetraphenylborate salts of tetrasubstituted phosphoniums such as tetraphenylphosphonium tetra-p-tolylborate, and salts of tetrasubstituted phosphoniums with phenolic compounds; phosphobetaine compounds; adducts of phosphonium compounds with silane compounds; These are some examples. Suitable curing accelerators include compounds containing phosphorus, with triphenylphosphine, tributylphosphine, quinone compound adducts of triphenylphosphine, and quinone compound adducts of tributylphosphine being more preferred. Imidazole compounds are also suitable curing accelerators.

[0089] The content of the curing accelerator is preferably 0.1 to 8 parts by mass, more preferably 0.3 to 7 parts by mass, and even more preferably 0.5 to 6 parts by mass, based on 100 parts by mass of the total amount of epoxy resin and curing agent. By setting the content of the curing accelerator within the above numerical range, the curing speed of the sealing resin composition of this disclosure becomes appropriate, and the manufacture of molded articles becomes easier.

[0090] (Inorganic filler) The encapsulating resin composition of this disclosure contains an inorganic filler. The inclusion of an inorganic filler in the encapsulating resin composition tends to reduce its hygroscopicity and improve its strength in the cured state. When the encapsulating resin composition is used as an encapsulant for semiconductor packages, it is preferable that it contains an inorganic filler.

[0091] The inorganic materials constituting the inorganic filler are not particularly limited. Specific examples of inorganic materials include silica such as spherical silica and crystalline silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, aluminum nitride, boehmite, beryllia, magnesium oxide, zirconia, zircon, fossilite, steatite, spinel, mullite, titania, talc, clay, mica, and titanates. Inorganic fillers composed of inorganic materials having flame-retardant properties may be used. Examples of inorganic materials having flame-retardant properties include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as magnesium-zinc composite hydroxides, and zinc borate. Inorganic fillers may be used individually or in combination of two or more types.

[0092] The shape of the inorganic filler is not particularly limited and can be, for example, in powder, spherical, or fibrous form. From the viewpoint of fluidity during molding of the sealing resin composition and mold wear resistance, a spherical shape is preferred.

[0093] The average particle size of the inorganic filler is not particularly limited. From the viewpoint of balancing viscosity, packing properties, etc., of the sealing resin composition, the volume average particle size of the inorganic filler is preferably 0.1 μm to 50 μm, more preferably 0.3 μm to 40 μm, and even more preferably 0.5 μm to 30 μm. The volume-average particle size of inorganic fillers is determined by a laser diffraction scattering particle size distribution analyzer. It can be measured as the uniform particle size (D50).

[0094] The particle size of the inorganic filler may be top-cut, may be top-cut at 100 μm or less, may be top-cut at 85 μm or less, may be top-cut at 75 μm or less, may be top-cut at 53 μm or less, may be top-cut at 20 μm or less, or may be top-cut at 10 μm or less. The particle size of the top cut can be determined from the particle size distribution when the volume-average particle size (D50) described above is measured.

[0095] If the sealing resin composition contains an inorganic filler, its content is not particularly limited. The inorganic filler content relative to the entire sealing resin composition is preferably 30% to 95% by mass, more preferably 40% to 95% by mass, and even more preferably 50% to 95% by mass. When the inorganic filler content is 30% by mass or more of the total encapsulating resin composition, the properties of the cured product, such as the coefficient of thermal expansion, thermal conductivity, and elastic modulus, tend to improve. When the inorganic filler content is 95% by mass or less of the total encapsulating resin composition, the increase in viscosity of the encapsulating resin composition is suppressed, fluidity improves, and moldability tends to be better.

[0096] The inorganic filler content relative to the entire encapsulating resin composition is preferably 68% to 90% by volume, more preferably 70% to 88% by volume, and even more preferably 72% to 86% by volume. When the inorganic filler content is 68% or more by volume of the total encapsulating resin composition, the properties of the cured product, such as the coefficient of thermal expansion, thermal conductivity, and elastic modulus, tend to improve. When the inorganic filler content is 90% or less by volume of the total encapsulating resin composition, the increase in viscosity of the encapsulating resin composition is suppressed, and the fluidity tends to improve, resulting in better moldability.

[0097] (Various additives) The encapsulating resin composition of this disclosure may contain various additives in addition to the above-mentioned components, such as coupling agents, stress relievers, mold release agents, colorants, flame retardants, and ion exchangers. Furthermore, the encapsulating resin composition of this disclosure may contain a siloxane compound having structural units with epoxy and alkoxy groups and a degree of polymerization of 2. In addition to the additives exemplified below, the encapsulating resin composition may also contain various additives well known in the art, as needed.

[0098] (Coupling agent) The encapsulating resin composition of this disclosure may contain a coupling agent. The type of coupling agent is not particularly limited, and known coupling agents can be used. Examples of coupling agents include silane coupling agents and titanium coupling agents. One type of coupling agent may be used alone, or two or more types may be used in combination.

[0099] Silane coupling agents are not particularly limited and include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-(2-aminoethyl)aminopropyltrimethoxysilane, 3-(2-aminoethyl)aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-ureidopropyltriethoxysilane, octenyltrimethoxysilane, glycidoxyoctyltrimethoxysilane, methacryloxyoctyltrimethoxysilane, and the like.

[0100] Examples of titanium coupling agents include isopropyl triisostearoyl titanate, isopropyl tris(dioctyl pyrophosphate) titanate, isopropyl tri(N-aminoethyl-aminoethyl) titanate, tetraoctyl bis(ditridecyl phosphite) titanate, tetra(2,2-diallyloxymethyl-1-butyl)bis(ditridecyl phosphite) titanate, bis(dioctyl pyrophosphate) oxyacetate titanate, bis(dioctyl pyrophosphate) ethylene titanate, isopropyl trioctanoyl titanate, isopropyl dimethacrylate isostearoyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl isostearoyl diacrylic titanate, isopropyl tri(dioctyl phosphate) titanate, isopropyl tricumylphenyl titanate, and tetraisopropyl bis(dioctyl phosphite) titanate.

[0101] When the sealing resin composition contains a coupling agent, the content of the coupling agent is preferably 0.001 to 10 parts by mass, more preferably 0.01 to 8 parts by mass, and even more preferably 0.05 to 5 parts by mass, per 100 parts by mass of the inorganic filler contained in the sealing resin composition, from the viewpoint of adhesion at the interface between the epoxy resin and the inorganic filler.

[0102] (Stress reliever) The sealing resin composition of this disclosure may contain stress-relieving agents such as silicone oil and silicone rubber particles. By including a stress-relieving agent in the sealing resin composition, package warping deformation and the occurrence of package cracks can be further reduced. Examples of stress-relieving agents include commonly used and known stress-relieving agents (flexible agents). Specifically, examples of stress-relieving agents include thermoplastic elastomers such as silicone-based, styrene-based, olefin-based, urethane-based, polyester-based, polyether-based, polyamide-based, and polybutadiene-based agents; rubber particles such as natural rubber (NR), acrylonitrile-butadiene copolymer (NBR), acrylic rubber, urethane rubber, and silicone powder; and rubber particles having a core-shell structure such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, and methyl methacrylate-butyl acrylate copolymer. One type of stress-relieving agent may be used alone, or two or more types may be used in combination. Among these, silicone-based stress-relieving agents are preferred. Examples of silicone-based stress-relieving agents include those having epoxy groups, those having amino groups, and those modified with polyether. Triphenylphosphine oxide can also be used as a stress relaxant.

[0103] If the sealing resin composition contains a stress-relaxing agent, the amount of the stress-relaxing agent is preferably 5 to 60 parts by mass, and more preferably 10 to 55 parts by mass, per 100 parts by mass of epoxy resin contained in the sealing resin composition.

[0104] (Release agent) The sealing resin composition of this disclosure may contain a release agent when a mold is used during molding, from the viewpoint of release from the mold. The release agent is not particularly limited, and conventionally known ones can be used. Examples of release agents include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid esters, and polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene. One type of release agent may be used alone, or two or more types may be used in combination.

[0105] When the sealing resin composition of this disclosure contains a release agent, the content of the release agent is preferably 0.01 to 15 parts by mass, and more preferably 0.1 to 10 parts by mass, per 100 parts by mass of epoxy resin contained in the sealing resin composition. When the amount of release agent is 0.01 parts by mass or more per 100 parts by mass of epoxy resin, sufficient release properties tend to be obtained. When it is 15 parts by mass or less, better release properties tend to be obtained.

[0106] (Coloring agent) The encapsulating resin composition of this disclosure may contain a colorant. Examples of known colorants include carbon black, organic dyes, organic pigments, titanium dioxide, red lead, and red iron oxide. The amount of colorant can be appropriately selected depending on the purpose. One type of colorant may be used alone, or two or more types may be used in combination.

[0107] If the sealing resin composition contains a coloring agent, its content is preferably 0.01% to 5% by mass, and more preferably 0.05% to 4% by mass.

[0108] (Flame retardant) The sealing resin composition of this disclosure may contain a flame retardant. The flame retardant is not particularly limited, and conventionally known ones can be used. Examples of flame retardants include organic or inorganic compounds containing halogen atoms, antimony atoms, nitrogen atoms, or phosphorus atoms, and metal hydroxides. One type of flame retardant may be used alone, or two or more types may be used in combination.

[0109] When the resin composition for sealing of the present disclosure contains a flame retardant, its content is not particularly limited as long as it is an amount sufficient to obtain a desired flame retardant effect. The content of the flame retardant is preferably 1 part by mass to 300 parts by mass, more preferably 2 parts by mass to 150 parts by mass, with respect to 100 parts by mass of the epoxy resin contained in the resin composition for sealing.

[0110] (Ion exchanger) The resin composition for sealing of the present disclosure may contain an ion exchanger. When the resin composition for sealing is used as a sealing material for a semiconductor package, it is preferable to contain an inorganic ion exchanger from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of an electronic component device including the element to be sealed. The ion exchanger is not particularly limited, and conventionally known ones can be used. Specifically, hydrotalcite compounds and hydrated oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, and bismuth can be mentioned. The ion exchanger may be used alone or in combination of two or more. Specifically, as the ion exchanger, hydrotalcite represented by the following general formula (A) can be mentioned.

[0111] Mg (1-X) Al X (OH)2(CO3) X / 2 ·mH2O···(A) (0 < X ≦ 0.5, m is a positive number)

[0112] When the resin composition for sealing of the present disclosure contains an ion exchanger, its content is not particularly limited as long as it is an amount sufficient to capture ions such as halogen ions. The content of the ion exchanger is preferably 0.1 part by mass to 30 parts by mass, more preferably 1 part by mass to 10 parts by mass, with respect to 100 parts by mass of the epoxy resin contained in the resin composition for sealing.

[0113] (Physical properties of the resin composition for sealing or its cured product) From the viewpoint of fluidity, the sealing resin composition of this disclosure preferably has a spiral flow (SF) of 100 cm or more, more preferably 105 cm or more, and even more preferably 110 cm or more, as determined by the following method. The upper limit of the spiral flow is not particularly limited and may be 200 cm or less.

[0114] Spiral flow measurement is performed by using a spiral flow measurement mold conforming to EMMI-1-66, molding the sealing resin composition in a transfer molding machine under the conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 180 seconds, and determining the flow distance.

[0115] From the viewpoint of fluidity, the sealing resin composition of this disclosure preferably has a disk flow (DF) of 60 mm or more, more preferably 65 mm or more, and even more preferably 70 mm or more, determined by the following method. The upper limit of the disk flow is not particularly limited and may be 100 mm or less.

[0116] Disk flow (DF) is measured using a flat plate mold for disk flow measurement, which has an upper mold measuring 200mm(W) × 200mm(D) × 25mm(H) and a lower mold measuring 200mm(W) × 200mm(D) × 15mm(H). 5g of sealing resin composition, weighed on a balance scale, is placed in the center of the lower mold heated to 175°C. After 5 seconds, the upper mold, also heated to 175°C, is closed, and compression molding is performed under conditions of a load of 78N and a curing time of 180 seconds. The major diameter (mm) and minor diameter (mm) of the molded product are measured with calipers, and the average value (mm) is calculated.

[0117] From the viewpoint of curability, the heat hardness of the cured product of the sealing resin composition of this disclosure is preferably 60 or higher, more preferably 65 or higher, and even more preferably 70 or higher. Furthermore, there is no particular upper limit to the heat hardness, and it may be 100 or less, 95 or less, or 90 or less.

[0118] The thermal hardness of the cured product is measured immediately after molding using a Shore D hardness tester (e.g., manufactured by Ueshima Seisakusho Co., Ltd.) by molding the sealing resin composition into a disc with a diameter of 50 mm and a thickness of 3 mm using a transfer molding machine at a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 180 seconds.

[0119] From the viewpoint of fluidity, the gel time of the sealing resin composition at 175°C is preferably 15 seconds or more, more preferably 18 seconds or more, even more preferably 20 seconds or more, and particularly preferably 21 seconds or more. From the viewpoint of curability, the gel time is preferably 80 seconds or less, more preferably 77 seconds or less, and even more preferably 74 seconds or less.

[0120] Geltime places 0.5g of the sealing resin composition on a hot plate preheated to 175°C. The time taken to allow the sealing resin composition to lose its viscosity is measured from the time it has been left to stand. It is preferable to heat the sealing resin composition while periodically stirring it with a spatula or the like. "Loss of viscosity of the sealing resin composition" refers to the phenomenon in which the sealing resin composition breaks or breaks when kneaded with a spatula or the like.

[0121] (Method for manufacturing encapsulating resin composition) The method for producing the sealing resin composition is not particularly limited. A common method involves thoroughly mixing predetermined amounts of components using a mixer or the like, then melt-kneading them using a mixing roll, extruder, or the like, followed by cooling and pulverization. More specifically, for example, a method involves uniformly stirring and mixing predetermined amounts of the above-mentioned components, then kneading them using a kneader, roll, extruder, or the like that has been preheated to 70°C to 140°C, followed by cooling and pulverization.

[0122] The sealing resin composition is preferably solid at 25°C. When the sealing resin composition is solid at 25°C, the shape of the sealing resin composition is not particularly limited and can be in the form of powder, granules, tablets, etc. When the sealing resin composition is in tablet form, the dimensions and mass should preferably be such that they are suitable for the molding conditions of the package, from the viewpoint of ease of handling.

[0123] (Applications of encapsulating resin compositions) The applications of the encapsulating resin composition of this disclosure are not particularly limited, and it can be used, for example, as an encapsulating material for electronic components and devices in various mounting technologies. Furthermore, the encapsulating resin composition of this disclosure can be used in various applications where it is desirable for the resin composition to have good fluidity and curability, such as resin molded articles for various modules, resin molded articles for motors, resin molded articles for automotive applications, and encapsulating materials for protective materials for electronic circuits.

[0124] <Electronic Components and Devices> The electronic component device of this disclosure comprises an element and a cured product of the sealing resin composition for sealing the element.

[0125] An electronic component device may include a support member for mounting elements. Support members include lead frames, pre-wired tape carriers, wiring boards, glass, and Examples include recon wafers and organic substrates. Among the above support members, lead frames are preferred from the viewpoint of adhesion to the cured product of the sealing resin composition. The lead frame may have elements mounted on one side.

[0126] Examples of elements found in electronic component devices include active elements such as silicon chips, transistors, diodes, and thyristors, and passive elements such as capacitors, resistors, and coils.

[0127] The following are some examples of the specific configurations of electronic component devices, but they are not limited to these. (1) General resin-encapsulated ICs such as DIP (Dual Inline Package), PLCC (Plastic Leaded Chip Carrier), QFP (Quad Flat Package), SOP (Small Outline Package), SOJ (Small Outline J-lead Package), TSOP (Thin Small Outline Package), and TQFP (Thin Quad Flat Package), which have a structure in which elements are fixed on a lead frame, the terminal parts of the elements such as bonding pads are connected to the lead parts using wire bonding, bumps, etc., and then encapsulated using an encapsulation resin composition; (2) A TCP (Tape Carrier Package) having a structure in which elements connected to a tape carrier using bumps are sealed with a sealing resin composition; (3) COB (Chip On Board) modules, hybrid ICs, multi-chip modules, etc., having a structure in which elements connected to wiring formed on a support member using wire bonding, flip-chip bonding, solder, etc., are sealed with a sealing resin composition; (4) BGA (Ball Grid Array), CSP (Chip Size Package), MCP (Multi Chip Package), SiP (System in a Package), etc., which have a structure in which an element is mounted on the surface of a support member having terminals for connecting a wiring board formed on the back surface, the element and the wiring formed on the support member are connected using bumps or wire bonding, and then the element is sealed with a sealing resin composition.

[0128] The method for encapsulating the element using the encapsulation resin composition is not particularly limited, and known methods can be applied. For example, low-pressure transfer molding is a common encapsulation method, but injection molding, compression molding, casting, etc., may also be used. [Examples]

[0129] [Examples 1-3 and Comparative Examples 1-2] After pre-mixing (dry blending) the materials in the proportions (parts by mass) shown in Table 1, the mixture was kneaded for approximately 15 minutes using a twin-screw roller (roll surface temperature: approximately 80°C), cooled, and then pulverized to produce a powdered sealing resin composition.

[0130] The details of the materials in Table 1 are as follows: • Epoxy resins: Epoxy resin A (naphthalene type, epoxy equivalent 250 g / eq), and epoxy resin B (biphenyl type, epoxy equivalent 192 g / eq)

[0131] • Hardener: Hardener A (phenol aralkyl resin, hydroxyl group equivalent 156 g / eq) • Curing accelerator: Curing accelerator A (adduct of triphenylphosphine and 1,4-benzoquinone)

[0132] • Specific ester compounds: methyl gallate, ethyl gallate, or propyl gallate • 2244THBP: 2,2',4,4'-Tetrahydroxybenzophenone

[0133] • Release agent: Polyethylene oxide wax • Coloring agent: Carbon black • Coupling agent: γ-glycidoxypropyltrimethoxysilane

[0134] • Inorganic filler: Spherical silica particles A with a volume-average particle diameter of 27.5 μm, and spherical silica particles B with a volume-average particle diameter of 0.5 μm.

[0135] <<Evaluation of encapsulating resin compositions>> The properties of the encapsulating resin compositions prepared in Examples 1-3 and Comparative Examples 1-2 were measured and evaluated by the following method. The evaluation results are shown in Table 1.

[0136] <Gel Time (GT) Measurement> For 3g of the sealing resin composition, measurements were performed at 180°C using a Curlastometer from JSR Trading Co., Ltd., and the time until the torque curve rose was defined as the gel time (seconds).

[0137] <Measurement of spiral flow (SF)> Using a spiral flow measurement mold conforming to EMMI-1-66, the sealing resin composition was molded using a transfer molding machine under the conditions of a mold temperature of 180°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds, and the flow distance (cm) was determined.

[0138] <Measurement of hardness at temperature> The sealing resin composition was molded into a 50 mm diameter x 3 mm thickness disc using a transfer molding machine at a mold temperature of 180°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds. Immediately after molding, the thermal hardness (Shore D) of the test specimen was measured using a Shore D hardness tester (manufactured by Ueshima Seisakusho Co., Ltd.).

[0139] [Table 1]

[0140] As shown in Table 1, the spiral flow of the encapsulating resin compositions of Examples 1 to 3 is higher than that of the encapsulating resin compositions of Comparative Examples 1 and 2. This indicates that the encapsulating resin compositions of Examples 1 to 3 have excellent fluidity. Furthermore, the thermal hardness of the cured products obtained from the encapsulating resin compositions of Examples 1 to 3 is comparable to that of the cured product obtained from the encapsulating resin composition of Comparative Example 1, indicating that the encapsulating resin compositions of Examples 1 to 3 maintain their curability without deterioration. Similarly, a comparison between Comparative Example 2 and Examples 1-3 shows that the thermal hardness of the cured products obtained from the encapsulating resin compositions of Examples 1-3 is about the same as that of the cured product obtained from the encapsulating resin composition of Comparative Example 2, indicating that the curability of the encapsulating resin compositions of Examples 1-3 is maintained without deterioration.

[0141] [Examples 4, 5 and Comparative Examples 3-5] The materials in the formulations (parts by mass) shown in Tables 2 and 3 were pre-mixed (dry blended), then kneaded in a twin-screw extruder with the internal temperature adjusted to 70°C to 100°C, cooled, and then pulverized to obtain a sealing resin composition.

[0142] The details of the materials in Tables 2 and 3 are as follows:

[0143] • Epoxy resins: Epoxy resin B (biphenyl type, epoxy equivalent 192 g / eq), and epoxy resin C (biphenyl type, epoxy equivalent 172 g / eq)

[0144] • Hardener: Hardener B (triphenylmethane-type phenolic resin, hydroxyl group equivalent 104 g / eq) • Curing accelerator B: Adduct of tributylphosphine and 1,4-benzoquinone

[0145] • Specific ester compound: Propyl gallate • 2,3-dihydroxynaphthalene

[0146] • Release agent: Polyethylene oxide wax • Coloring agent: Carbon black • Coupling agent: γ-glycidoxypropyltrimethoxysilane

[0147] • Inorganic filler: Spherical alumina particles A with a volume-average particle size of 4.6 μm, and spherical alumina particles B with a volume-average particle size of 0.3 μm.

[0148] <<Evaluation of encapsulating resin compositions>> The properties of the encapsulating resin compositions prepared in Examples 4 and 5 and Comparative Examples 3 to 5 were measured and evaluated by the following methods. The evaluation results are shown in Tables 2 and 3.

[0149] <Gel Time (GT) Measurement> The gel time (seconds) was determined by measuring the time it took for the resin to lose its viscosity after placing 0.5 g of the sealing resin composition on a hot plate preheated to 175°C.

[0150] <Measurement of spiral flow (SF)> Using a spiral flow measurement mold conforming to EMMI-1-66, the sealing resin composition was molded in a transfer molding machine under the conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 180 seconds, and the flow distance (cm) was determined.

[0151] <Disk Flow (DF) Measurement> Using a flat plate mold for disc flow measurement, which has an upper mold measuring 200mm(W)×200mm(D)×25mm(H) and a lower mold measuring 200mm(W)×200mm(D)×15mm(H), 5g of sealing resin composition, weighed on a balance scale, was placed in the center of the lower mold heated to 175°C. After 5 seconds, the upper mold, also heated to 175°C, was closed, and compression molding was performed under conditions of a load of 78N and a curing time of 180 seconds. The major diameter (mm) and minor diameter (mm) of the molded product were measured with calipers, and the average value (mm) was defined as the disc flow.

[0152] <Measurement of hardness at temperature> The sealing resin composition was molded into a 50 mm diameter x 3 mm thickness disc using a transfer molding machine at a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 180 seconds. Immediately after molding, the thermal hardness (Shore D) of the test specimen was measured using a Shore D hardness tester (manufactured by Ueshima Seisakusho Co., Ltd.).

[0153] [Table 2]

[0154] [Table 3]

[0155] From the evaluation results in Table 2, Comparative Example 4, which used the same mass parts of 2,3-dihydroxynaphthalene instead of gallic acid ester, and Comparative Example 3, which did not contain gallic acid ester, both showed lower spiral flow and disc flow values ​​than Example 4. From this, it can be seen that the sealing resin composition of Example 4 has superior fluidity compared to Comparative Examples 3 and 4. Furthermore, the thermal hardness of the cured product obtained from the sealing resin composition of Example 4 is comparable to that of the cured products obtained from the sealing resin compositions of Comparative Examples 3 and 4, indicating that the sealing resin composition of Example 4 maintains its curability without any decrease.

[0156] As shown in the evaluation results in Table 3, Comparative Example 5, which used the same amount of 2,3-dihydroxynaphthalene instead of gallic acid ester, and Comparative Example 3, which did not contain gallic acid ester, both showed lower spiral flow and disc flow values ​​than Example 5. From this, it can be seen that the sealing resin composition of Example 5 has superior fluidity compared to Comparative Examples 3 and 5. Furthermore, the thermal hardness of the cured product obtained from the sealing resin composition of Example 5 is comparable to that of the cured products obtained from the sealing resin compositions of Comparative Examples 3 and 5, indicating that the sealing resin composition of Example 5 maintains its curability without any decrease.

Claims

1. A encapsulating resin composition comprising an epoxy resin, a phenolic curing agent, a curing accelerator, an ester compound having three or more phenolic hydroxyl groups, and an inorganic filler.

2. The encapsulating resin composition according to claim 1, wherein the molar ratio of the ester compound to the curing accelerator is 0.1 or more.

3. The encapsulating resin composition according to claim 1 or claim 2, wherein the curing accelerator is a compound containing a phosphorus element or an imidazole compound.

4. An electronic component device comprising an element and a cured product of the sealing resin composition according to claim 1 or claim 2 for sealing the element.

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