Chemically amplified positive photosensitive composition, method for manufacturing a substrate with a template, and method for manufacturing a plated object.
A chemically amplified photosensitive composition with specific surfactant content and components achieves uniform film thickness, enabling precise manufacturing of plated structures in semiconductor packaging.
JP2026115987APending Publication Date: 2026-07-09TOKYO OHKA KOGYO CO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- TOKYO OHKA KOGYO CO LTD
- Filing Date
- 2024-12-27
- Publication Date
- 2026-07-09
Smart Images
Figure 2026115987000001 
Figure 2026115987000002 
Figure 2026115987000003
Abstract
To provide a chemically amplified positive-type photosensitive composition capable of forming a coating film with uniform thickness, a method for manufacturing a molded substrate using the chemically amplified positive-type photosensitive composition, and a method for manufacturing a plated object using the aforementioned chemically amplified positive-type photosensitive composition. [Solution] A chemically amplified positive-type photosensitive composition used in the process of manufacturing plated objects on a metal substrate to form a patterned resin film which is a template for plating, comprising an acid generator (A) that generates acid upon irradiation with active light or radiation, a resin (B) whose solubility in alkali increases due to the action of the acid, and a surfactant (C), wherein the content of surfactant (C) is 0.01 parts by mass or more and 0.40 parts by mass or less per 100 parts by mass of resin (B), the surfactant (C) is a silicone-based surfactant, and the surfactant (C) satisfies specific [Requirement 1].
Need to check novelty before this filing date? Find Prior Art