Active heat dissipation mechanism

Abstract

To provide an active heat dissipation mechanism capable of improving heat dissipation performance. [Problem] An active heat dissipation mechanism includes a heat conduction panel body including a refrigerant flow space within which a refrigerant is filled and flows. The refrigerant flow space includes a first refrigerant flow path that forms an evaporation area where the refrigerant changes from liquid to gas, and a plurality of second refrigerant flow paths that are provided in a condensation area formed in another portion of the first refrigerant flow path and direct the flow of liquid-phase refrigerant to the evaporation area. The second refrigerant flow paths protrude above the refrigerant flow space, and their adjacent surfaces are in surface contact with each other. The second refrigerant flow paths form independent flow paths for the liquid-phase refrigerant using a plurality of strength reinforcement parts that are provided in a straight line and inclined toward the first refrigerant flow path.

Description

[Technical Field]

[0001] The present invention relates to an active heat dissipation apparatus, and more particularly to an active heat dissipation apparatus that can improve heat dissipation performance by actively transferring heat generated from a heat-generating device (e.g., electronic device) through a phase change of a refrigerant, which is more effective than the thermal conductivity of the refrigerant itself. [Background technology]

[0002] Wireless communication technology, for example, MIMO (Multiple-Input Multiple-Output) technology, is a technology that dramatically increases data transmission capacity by using multiple antennas. It is a spatial multiplexing technique in which a transmitter transmits different data through each transmitting antenna, and a receiver separates the transmitted data through appropriate signal processing.

[0003] Therefore, by simultaneously increasing the number of transmitting and receiving antennas, channel capacity increases, allowing for the transmission of more data. For example, if the number of antennas is increased to 10, approximately 10 times the channel capacity can be secured using the same frequency band compared to the current single antenna system. In the case of a transmitting / receiving device that applies such MIMO technology, as the number of antennas increases, the number of transmitters and filters also increases.

[0004] As the number of transmitters and filters increases, the number of heat-generating elements also increases. Therefore, in order to prevent a decrease in the performance of the antenna device, MIMO technology is being researched on heat dissipation structures that can effectively dissipate the heat generated by multiple heat-generating elements.

[0005] FIG. 1 is an exploded perspective view showing an example of an antenna device according to the prior art.

[0006] A heat-generating device (eg, an electronic device) can be implemented with an antenna device, as shown in FIG.

[0007] As shown in Figure 1, a conventional antenna device is provided in the form of a rectangular parallelepiped housing that is open at the front and relatively thin from front to back, and includes an antenna housing main body 10 on the rear of which a plurality of heat dissipation fins 11 are integrally formed, a main board (not shown) stacked on the rear inside the antenna housing main body 10, and an antenna board 15 stacked on the front inside the antenna housing main body 10.

[0008] The main board is mounted with multiple power supply related component elements for calibration power supply control, and the heat generated by the elements during the power supply process is dissipated to the outside through multiple heat dissipation fins 11 at the rear of the antenna housing main body 10.

[0009] A PSU board 40 with a PSU element mounted thereon is stacked or placed at the same height below the main board, and heat generated from the PSU element is also designed to be dissipated to the outside through multiple heat dissipation fins 11 at the rear of the antenna housing body 10.

[0010] A plurality of RF filters (not shown) are arranged on the front surface of the main board, and the rear surface of the antenna board 15 is arranged so as to be stacked on the front surface of the plurality of RF filters.

[0011] A plurality of patch-type or dipole-type radiating elements 17 may be mounted on the front surface of the antenna board 15, and a radome panel 50 may be provided on the front surface of the antenna housing main body 10 to protect the internal components from the outside while facilitating smooth radiation from the radiating elements.

[0012] However, conventional antenna devices are designed with a radome panel 50 at the front, and the system heat generated inside must be uniformly dissipated to the rear of the antenna housing body 10, which requires improving the heat dissipation performance of the multiple heat dissipation fins 11.

[0013] Here, one method to be considered for improving the heat dissipation performance of the plurality of heat dissipation fins 11 is to use a material with better thermal conductivity, form it integrally with the antenna housing body 10, and manufacture it so that its outermost tip is as far away as possible from the heat-generating element, which is the heat source, into the external space.

[0014] However, there is a limit to how much the material of the heat dissipation fins 11 themselves can improve thermal conductivity. Furthermore, even if the outermost tips of the heat dissipation fins 11 are spaced far away from the heat-generating element, the heat concentration phenomenon at the area adjacent to the heat-generating element where the heat flows in cannot be eliminated, which increases the thickness of the product and hinders slimming down the product.

[0015] Meanwhile, in the related heat dissipation technology field, a thermally conductive material (metal) generally adopted as the material of the plurality of heat dissipation fins 11 is an aluminum (Al) alloy material.

[0016] Among metal materials, silver (Au, 418.6), copper (Cu, 372.1), and gold (Ag, 295.3) have higher thermal conductivity (unit: W / mK) than aluminum (Al), but these are relatively more expensive than aluminum, so they cannot be widely adopted for covering a wide heat dissipation area due to economic (cost) reasons.

[0017] However, since pure aluminum (Al) alone cannot satisfy the strength and flexibility requirements, it is generally processed and manufactured in the form of an aluminum alloy mixed with silicon and magnesium. In this case, there is a problem that its use is very limited in the manufacture of small or simple shaped parts due to its poor castability. Although aluminum has a lower cost than the above-mentioned silver, copper, and gold, it still has the disadvantage of a high manufacturing cost.

[0018] In addition, it is difficult for the heat dissipation fins 11 made of aluminum alloy to overcome the material limitations mentioned above. Recently, however, a refrigerant-type heat dissipation system has been attracting attention. This system uses a phase change material as a refrigerant to fill a closed space, and then dissipates heat through the temperature difference between the latent heat and sensible heat used when the refrigerant changes phase.

[0019] The key element for maximizing the heat dissipation performance in such a refrigerant-type heat dissipation system is the phase-changing refrigerant, and the aluminum alloy heat dissipation fins 11 simply form a closed refrigerant flow space where the refrigerant changes phase and flows, and also play a role in transferring as much heat generated from the heat-generating element to the refrigerant as possible through their own thermal conductivity.

[0020] Therefore, the most desirable design point in terms of improving heat dissipation performance is that the heat dissipation fins, which form the refrigerant flow space filled with the refrigerant, which is a phase change material, should be processed and designed so that the physical distance from the heat generating element to the refrigerant is minimized. However, the heat dissipation fins 11 that have been researched and developed to date are still made of expensive aluminum alloy material, as this is the most widely used material.

[0021] However, in the case of pure aluminum, the elongation rate related to the workability of the metal is good, and it is possible to manufacture a heat dissipation fin 11 with a minimized thickness. However, in the case of heat dissipation fin 11 made of an aluminum alloy material, in order to complement strength and flexibility, the elongation rate is lower and there is a limit to how much the thickness can be minimized.

[0022] In addition, if the metal material of the heat dissipation fins 11 is aluminum, and if the refrigerant is water, an oxidation reaction occurs with the water during the initial filling of the refrigerant, producing aluminum oxide. During this process, some of the refrigerant is replaced by hydrogen, increasing the internal pressure. Therefore, in order to prevent such a chemical reaction, a special refrigerant such as Honeywell refrigerant or CFC (Freon gas) must be selected for the heat dissipation mechanism of an aluminum material, but this has the disadvantage of limiting the range of refrigerant options.

[0023] On the other hand, a phase change refers to a change in the inherent state of a liquid / gas / solid when it accumulates a large amount of energy or releases stored thermal energy.

[0024] A phase change is a change in the physical arrangement of molecules, not a chemical reaction such as chemical bonding or formation. When energy is added to a substance, the heat that does not cause a phase change is called sensible heat, and the heat used to cause a phase change is called latent heat.

[0025] However, heat dissipation mechanisms have a problem in that the pressure increases as the temperature increases because the relationship between temperature and pressure is proportional. If the pressure increases due to the high temperature generated by the heat-generating element inside a sealed heat dissipation mechanism, the heat dissipation mechanism itself may burst. To solve this problem, it is necessary to prevent the pressure from increasing, and the heat dissipation mechanism requires an internal volume large enough to achieve pressure equilibrium during the phase change circulation process of the material.

[0026] In addition, the refrigerant filled inside the heat dissipation mechanism must be selected to be a type that does not react chemically with the metal material of the heat dissipation mechanism, so as to prevent an increase in the internal pressure of the heat dissipation mechanism.

[0027] For example, if the metal material making up the heat dissipation mechanism is aluminum (Al), and the refrigerant is water, an oxidation reaction occurs with water during the initial filling of the refrigerant, producing aluminum oxide. During this process, some of the refrigerant is replaced by hydrogen, increasing the internal pressure. To prevent this chemical reaction, special refrigerants such as Honeywell refrigerants or CFCs (freon gases) are usually selected for aluminum heat dissipation mechanisms.

[0028] However, recently, many countries have been restricting the use of special refrigerants such as water-free Honeywell refrigerants or CFCs (freon gases), as mentioned above. This is because such special refrigerants have the risk of leaking water to the outside when the heat dissipation mechanism is damaged due to an increase in internal pressure or when the product is damaged during transportation, transfer, or installation, which can pollute the atmosphere and the external environment.

[0029] However, if special refrigerants are excluded from the list of usable refrigerants, the use of heat dissipation mechanisms made of aluminum, which is commonly used because it has higher thermal conductivity than other metal materials, is limited.As a result, the heat dissipation mechanism manufacturing industry has recently been actively researching alternative metal materials and heat dissipation designs for heat dissipation mechanisms.

[0030] Meanwhile, as a research document related to the above-mentioned disadvantages, the following is a brief introduction to the paper by co-author Liqiang Deng published in the International Journal of Thermal Sciences (published on August 15, 2022, hereinafter referred to as the "previous paper") entitled "Thermal study of the natural air cooling using roll bond flat heat pipe as plate fin under multi-heat source condition."

[0031] Figure 2 is a schematic diagram showing the manufacturing process of the Roll Bond Flat Heat Pipe (hereinafter referred to as "RBFHP") described in the previous paper (see Fig. 4 in the previous paper), and Figure 3 is a schematic diagram of the test equipment for the RBFHP in Figure 2 (see Fig. 6 in the previous paper).

[0032] As shown in Figure 2, the RBFHP in the previous paper uses a pre-designed mold to print non-adhesive graphite on the first aluminum sheet, then laminate it on the second aluminum sheet. The two aluminum sheets are then rolled and joined in the order of hot rolling, cold rolling, and annealing, and an inlet pipe is soldered. High-pressure gas is then injected into the plate from the inlet to inflate the non-adhered portion and form it in a self-connected chamber.

[0033] The previous paper concluded that the RBFHP formed as described above performed better than a general aluminum plate (fin) under the test conditions shown in Figure 3 (four evenly distributed heat source test).

[0034] However, as mentioned above, the RBFHP in the previous paper is manufactured using the roll bonding method, which means that it is difficult to place the refrigerant (especially the liquid refrigerant) close to the joining end (i.e., the edge) located closest to the heat source.

[0035] That is, in the roll bonding method, the edges are necessarily bonded, but at least the overlapping portion of the bond must be separated from the heat source (heat generating element), which causes thermal resistance due to the material itself.

[0036] The reason why the manufacturing method of the RBFHP in the previous paper was limited to the roll bonding method or why this method was adopted was due to the optimal method for forming an internal chamber using two aluminum panel sheets, and it is thought that this method was unavoidably adopted because it is practically impossible to bend the aluminum sheet itself.

[0037] Meanwhile, the RBFHP in the previous paper has a honeycomb structure to maximize the area where the vaporized refrigerant near the heat source moves to the condensation region where it condenses. However, this not only lengthens the flow section where the vapor refrigerant quickly moves to the top end farthest from the heat source, but also creates problems such as large flow resistance due to the overlap of the return path of the liquid refrigerant condensed in the condensation region with the flow section of the vapor refrigerant. Summary of the Invention [Problem to be solved by the invention]

[0038] In order to solve the above-mentioned technical problems, an object of the present invention is to provide an active heat dissipation mechanism that can improve the heat dissipation performance of a heat-generating device (electronic device).

[0039] Another object of the present invention is to provide an active heat dissipation mechanism that can maximize the heat transport capacity of the refrigerant filled inside.

[0040] It is yet another object of the present invention to provide an active heat dissipation mechanism that is easy to manufacture.

[0041] Another object of the present invention is to provide an active heat dissipation mechanism that can expand the range of use of water as a refrigerant, and can produce low-cost products by replacing aluminum (Al), which has a relatively high thermal conductivity, with a metal material having a low thermal conductivity, while achieving the same or better heat dissipation performance as existing mechanisms.

[0042] Another object of the present invention is to provide an active heat dissipation mechanism that can fully satisfy national regulations by adopting and applying water as a phase-changeable refrigerant.

[0043] The technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0044] One embodiment of the active heat dissipation mechanism according to the present invention comprises a heat conduction panel body including a refrigerant flow space, into which a refrigerant is filled and flows, formed by bending or joining at least one metal panel member. The refrigerant flow space is located adjacent to a press-fit portion provided on a rear surface of a heat dissipation housing main body, which is a heat dissipation target. The refrigerant flow space includes a first refrigerant flow path that forms an evaporation region where the refrigerant changes from a liquid phase to a gas phase, and a plurality of second refrigerant flow paths that are provided in a condensation region formed in another portion of the first refrigerant flow path and direct the liquid-phase refrigerant to the evaporation region. The second refrigerant flow paths protrude into the refrigerant flow space so that their adjacent surfaces are in surface contact with each other. The second refrigerant flow paths are provided in a linear shape inclined toward the first refrigerant flow path to physically separate them from adjacent second refrigerant flow paths, and each of the plurality of inclined guides has a plurality of strength reinforcements formed thereon, forming independent flow paths for the liquid-phase refrigerant.

[0045] Here, the plurality of strength reinforcement portions may be provided as linear reinforcement portions, and one end of the reinforcement portions that contacts the first refrigerant flow path may always be located lower than the other end in the direction of gravity.

[0046] In addition, the plurality of strength reinforcing portions may be formed on the plurality of inclined guides that protrude from the refrigerant flow space so as not to contact each other in a thickness direction and define the space of the adjacent second refrigerant flow path.

[0047] The plurality of strength reinforcing portions may be formed to protrude further toward the refrigerant flow space than the plurality of inclined guides.

[0048] In addition, when the heat conduction panel body is disposed vertically or inclined with respect to at least the direction of gravity with respect to the heat dissipation housing main body in which the press-fit portion is formed, a fixing joint that reduces the refrigerant flow space may be further formed at an outer corner portion of the lower end portion of the heat conduction panel body with respect to the direction of gravity.

[0049] In addition, the fixed joint may be configured to join the plurality of strength reinforcing portions and the mutual surface contact portions at the same time.

[0050] In addition, the first refrigerant flow path may further include an absorber having a predetermined absorption rate, and the uppermost water surface of the liquid-phase refrigerant among the refrigerant absorbed in the absorber may be moved upward in proportion to the area occupied by the fixed joint in the direction of gravity.

[0051] In addition, the first refrigerant flow path may further include an absorbent having a predetermined absorption rate, and the area occupied by the fixed joint may be set in consideration of the absorption rate of the absorbent.

[0052] The heat conduction panel body may include one heat conduction panel forming one side of the refrigerant flow space and another heat conduction panel forming the other side of the refrigerant flow space, and the second refrigerant flow path may be defined by the plurality of inclined guides and the plurality of strength reinforcements formed symmetrically on the one heat conduction panel and the other heat conduction panel, respectively, and protruding to be in surface contact with each other above the refrigerant flow space.

[0053] The second refrigerant flow path may be defined as a space between adjacent strength reinforcement portions among the plurality of strength reinforcement portions.

[0054] Also, the second refrigerant flow path may be defined as a space in the thickness direction of the refrigerant flow space, and adjacent second refrigerant flow paths may be separated by the plurality of strength reinforcing portions.

[0055] The refrigerant flow space can be formed by joining a single metal panel member after bending, or by joining two metal panel members. [Effects of the Invention]

[0056] According to one embodiment of the active heat dissipation mechanism of the present invention, the following various effects can be achieved.

[0057] First, it minimizes the heat concentration phenomenon caused by the rising air current at the rear of the heat dissipation housing body and enables active heat transfer through the phase change of the refrigerant, thereby achieving the effect of significantly improving the overall heat dissipation performance.

[0058] Secondly, the gas-liquid circulation cycle of the refrigerant filled inside is shortened to maximize the heat transport capacity, thereby improving the heat dissipation performance.

[0059] Third, the material of the heat conduction panel body, which forms the refrigerant flow space where the refrigerant changes phase and flows, is changed to SUS, a metal material with lower resistance than aluminum, which achieves even higher heat dissipation performance than existing aluminum materials.

[0060] Fourth, the refrigerant can be selectively used only as water, which can ensure design diversity for product use and manufacturing, especially in countries that regulate the use of refrigerants.

[0061] Fifth, even when using a metal material with low thermal conductivity compared to a metal material with relatively high thermal conductivity, it is possible to manufacture a heat dissipation mechanism with the same or better heat dissipation performance, thereby achieving the effects of reducing manufacturing costs and simplifying the manufacturing process. [Brief explanation of the drawings]

[0062] [Figure 1] FIG. 10 is an exploded perspective view showing an example of an antenna device according to the prior art. [Figure 2]This is a schematic diagram (see Fig. 4 in the previous paper) showing the manufacturing process of the Roll Bond Flat Heat Pipe (hereinafter abbreviated as "RBFHP") that was published in the previous paper. [Figure 3] This is a schematic diagram of the RBFHP test equipment in Figure 2 (Fig. 6 in the previous paper). [Figure 4a] 1 is a perspective view showing an example of installation of an active heat dissipation mechanism on a rear surface of an antenna device according to an embodiment of the present invention; [Figure 4b] 1 is a perspective view showing an example of installation of an active heat dissipation mechanism on a rear surface of an antenna device according to an embodiment of the present invention; [Figure 5a] FIG. 4b is an exploded perspective view showing the rear part of the antenna device of FIG. 4a. [Figure 5b] 4c is an exploded perspective view showing the rear part of the antenna device of FIG. 4b. [Figure 6] 5b is an exploded perspective view showing an installation shape of an active heat dissipation mechanism according to an embodiment of the present invention relative to a press-fit portion formed on the rear surface of the antenna device of FIG. 5a. FIG. [Figure 7] 7A and 7B are cross-sectional views and partial enlarged views showing the installation shape of an active heat dissipation mechanism according to one embodiment of the present invention relative to the press-fit portion of FIG. 6. [Figure 8] 7 is a cutaway perspective view and a partially enlarged view thereof showing the installation shape of an active heat dissipation mechanism according to one embodiment of the present invention relative to the press-fit portion of FIG. 6. FIG. [Figure 9] 9 is a cutaway perspective view showing the internal structure of a single active heat dissipation mechanism in the configuration of FIG. 8. FIG. [Figure 10] FIG. 5B is a rear cross-sectional view showing the internal structure for explaining the trench structure of FIGS. 4a and 5a. [Figure 11] 4a and 5a, is a partial perspective view showing an installation shape of an active heat dissipation mechanism according to an embodiment of the present invention relative to a press-fit portion. [Figure 12] 1A to 1C are perspective views illustrating a manufacturing process of an active heat dissipation mechanism according to an embodiment of the present invention. [Figure 13]13 is a plan view showing the heat conduction panel body before bending in the configuration of the active heat dissipation mechanism according to the embodiment of the present invention shown in FIG. 12. FIG. [Figure 14] 1A and 1B are an enlarged perspective view and an enlarged plan view showing a press-fit end portion and a modified example thereof of an active heat dissipation mechanism and its configuration according to an embodiment of the present invention; [Figure 15] FIG. 15 is a cross-sectional view showing the configurations of (d) and (e) in FIG. 14 with the absorber removed. [Figure 16] 1A and 1B are perspective views of an active heat dissipation mechanism according to an embodiment of the present invention before and after bending, and partially enlarged views thereof. [Figure 17] 1A and 1B are perspective views of an active heat dissipation mechanism according to an embodiment of the present invention before and after bending, and partially enlarged views thereof. [Figure 18] FIG. 2 is a plan view of an active heat dissipation mechanism according to an embodiment of the present invention after bending. [Figure 19] FIG. 19 is a cross-sectional view taken along line CC in FIG. 18. [Figure 20] FIG. 2 is a perspective view illustrating an example of an absorber in the configuration of an active heat dissipation mechanism according to an embodiment of the present invention. [Figure 21] FIG. 2 is a perspective view illustrating an example of an absorber in the configuration of an active heat dissipation mechanism according to an embodiment of the present invention. [Figure 22a] 20A and 20B are development views of a heat conduction panel body according to a first modified example 200T-1 and a second modified example 200T-2 of a partial configuration of one embodiment of the present invention before bending. [Figure 22b] 20A and 20B are development views of a heat conduction panel body according to a first modified example 200T-1 and a second modified example 200T-2 of a partial configuration of one embodiment of the present invention before bending. [Figure 23a] 10A and 10B are perspective and plan views illustrating additional embodiments of active heat dissipation mechanisms in accordance with an embodiment of the present invention. [Figure 23b] 10A and 10B are perspective and plan views illustrating additional embodiments of active heat dissipation mechanisms in accordance with an embodiment of the present invention. [Figure 24a]Perspective view and plan view showing an additional embodiment of an active heat dissipation mechanism according to an embodiment of the present invention. [Figure 24b] Perspective view and plan view showing an additional embodiment of an active heat dissipation mechanism according to an embodiment of the present invention. [Figure 25] Cross-sectional view showing the installation shapes of the press-fitting parts of the active heat dissipation mechanism 200D, a of Comparative Example 200D and the active heat dissipation mechanism 200, b according to an embodiment of the present invention. [Figure 26] Cross-sectional view taken along line A-A of FIG. 4b and a partial enlarged view thereof. [Figure 27] Notch perspective view taken along line A-A of FIG. 4b and a partial enlarged view thereof. [Figure 28] Notch perspective view taken along line B-B of FIG. 4b and a partial enlarged view thereof. [Figure 29] Perspective view showing an active heat dissipation mechanism according to another embodiment of the present invention. [Figure 30] Exploded perspective view of FIG. 29. [Figure 31] Notch perspective view (a) of FIG. 29, a partial enlarged view (b) thereof, and a cross-sectional view (c) of the corresponding part. [Figure 32] Cross-sectional view showing the coupling shape of the press-fitting part of the active heat dissipation mechanism according to another embodiment of the present invention. [Figure 33] Comparison graph (a) and comparison diagram (b) comparing the temperatures of the heating element 140 between the active heat dissipation mechanism 200D of the comparative example in FIG. 25 and the active heat dissipation mechanism 200 according to an embodiment of the present invention. [Figure 34] Table of results of measuring the time taken for each of the comparative example 200D composed of the heat conduction panel bodies 200D-1 and 200D-2 made of aluminum material and the active heat dissipation mechanism 200 according to an embodiment of the present invention made of SUS material to reach 50°C, 60°C, and 70°C. [Figure 35]1 is a graph comparing the temperature at each heat source (heat generating element) position of a general aluminum heat dissipation fin (AL6063_REF) that does not use a refrigerant, two products with specifications that are presumed to be RBFHPs from a previous paper (Roll Bonding Fin (292×115 and 310×90)), and an active heat dissipation mechanism (PTX (310×90)) according to an embodiment of the present invention. [Figure 36] 1 is a flowchart illustrating a method for manufacturing an active heat dissipation mechanism according to an embodiment of the present invention. [Figure 37] 10 is a flowchart illustrating a method for manufacturing an active heat dissipation mechanism according to another embodiment of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION

[0063] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of an active heat dissipation mechanism according to the present invention will be described in detail with reference to the accompanying drawings.

[0064] When assigning reference numerals to components in each drawing, it should be noted that the same components are assigned the same numerals whenever possible, even if they are displayed in different drawings. Furthermore, when describing embodiments of the present invention, if a detailed description of related known structures or functions is deemed to hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0065] In describing components of embodiments of the present invention, terms such as "first," "second," "A," "B," "(a)," and "(b)" may be used. These terms are used to distinguish a component from other components and do not limit the nature, order, or sequence of the components. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be construed as having a meaning consistent with the meaning they have in the context of the relevant art, and should not be construed as idealized or overly formal unless expressly defined in this application.

[0066] 1. Installation of heat dissipation mechanism - antenna device Figures 4a and 4b are perspective views showing two examples of installation of an active heat dissipation mechanism on the rear surface of an antenna device according to one embodiment of the present invention, and Figures 5a and 5b are exploded perspective views showing the rear surface of the antenna device of Figures 4a and 4b, respectively.

[0067] Generally, heat-generating devices (electronic devices) are manufactured in various forms throughout industry. The applicant of the present invention is a company engaged in the manufacturing of other wireless communication equipment. Among wireless communication equipment, a representative heat-generating device (electronic device) is an antenna device. Hereinafter, an antenna device will be described as a specific example.

[0068] However, the active heat dissipation mechanism according to the embodiments of the present invention described below should not be interpreted as being limited to being applied only to antenna devices.

[0069] The antenna device 100 to which the active heat dissipation mechanism 200, 1200 according to the embodiments of the present invention is applied includes a heat dissipation housing main body 110 formed in a rectangular parallelepiped shape that forms an accommodation space that is open to the front, is elongated in the vertical direction, and has a thin front-to-rear accommodation width, as shown in Figures 4a and 4b.

[0070] The heat dissipating housing body 110 may be made of a thermally conductive material (especially a metal material) so as to be in surface thermal contact with the heat generating element (for example, see reference numeral 140 in Figures 22 and 23 described later) and to transfer heat effectively.

[0071] Although not shown in the drawing, inside the accommodation space of the heat dissipation housing main body 110, a main board (see reference numeral "120" in FIG. 7) having multiple MBF (Micro Bellows Filter) elements mounted on the front side and a type of heat generating element 140 mounted on the back side may be stacked via a clamshell (see reference numeral "125" in FIG. 7) as a substrate for a PAU (Power Amplifier Unit) and a DTU (Digital Transceiving Unit).

[0072] Here, the main board 120 may be defined as a heat-generating element 140 that generates a large amount of heat when driven, such as an RFIC element or a PA (Power Amplifier) ​​element. However, it should be noted that the present embodiment only describes an electronic device as an antenna device, and the heat-generating element 140 is not limited to the above configuration. For example, a semiconductor or a PC CPU, which are typical heat-generating elements, may also be used as the heat-generating element 140.

[0073] A radome panel 50 is installed on the front surface of the receiving space of the heat dissipating housing body 110 to protect the radiating element realized by the antenna element from the outside and to facilitate radiation from the radiating element.

[0074] However, among electronic devices, the antenna device has a relatively high need for heat dissipation, as described above, because the radome panel 50, which is not suitable for heat dissipation, is provided on the front surface of the heat dissipation housing main body 110. Therefore, it can be said that the need for concentrated heat dissipation through the remaining parts of the heat dissipation housing main body 110 excluding the front surface is even greater, and an effective heat dissipation design through a limited heat dissipation area is required.

[0075] Meanwhile, an active heat dissipation mechanism 200, 1200 according to the embodiments of the present invention may be provided on the rear surface of the heat dissipation housing main body 110.

[0076] The active heat dissipation mechanism 200, 1200 according to the embodiments of the present invention is provided in the form of a heat dissipation fin, and strictly speaking, unlike the fixed type heat dissipation fins 200F-1, 200F-2 described later, it can be characterized in that it is provided in the form of a thin vapor chamber type filled with a refrigerant, which is a substance that can change phase when heated from the outside.

[0077] Here, the active heat dissipation mechanism 200 according to the embodiments of the present invention may be provided with an absorber 300 inside, which absorbs the liquid phase refrigerant from the refrigerant and holds it in a position close to the heat generating element 140, thereby promoting evaporation of the liquid phase refrigerant into the gas phase refrigerant.

[0078] However, the concept of retaining the liquid refrigerant by the absorber 300 is not limited to simply absorbing and storing the liquid refrigerant, but will be understood to include the concept of using the absorption force (or capillary force) to cause at least the liquid refrigerant to flow in the opposite direction (upward) to the direction of gravity above the water surface.

[0079] Generally, a well-known vapor chamber is provided with a wick member having a wick structure with a plurality of pores formed therein. The wick member may be made of sintered metal powder to form a plurality of pores that allow the liquid refrigerant filled inside a panel member made of a thermally conductive material to move toward the heating element by capillary force, and allow the gas refrigerant to freely flow to the outside.

[0080] However, the wick member is not limited to the sintered metal wick member described above, and may be defined as a concept including any possible material, such as the absorber 300, regardless of its name, such as a fiber material, as long as it can absorb and disperse or promote evaporation of the liquid refrigerant. This will be described in more detail later.

[0081] 2-1. First installation example (one embodiment of the present invention) and installation to the press-fit portion Figure 6 is an exploded perspective view showing the installation shape of an active heat dissipation mechanism according to one embodiment of the present invention relative to the press-fit portion formed on the rear surface of the antenna device of Figure 5a, Figure 7 is an exploded perspective view showing the installation shape of an active heat dissipation mechanism according to one embodiment of the present invention relative to the press-fit portion formed on the rear surface of the antenna device of Figure 6, Figure 8 is a cross-sectional view and a partially enlarged view thereof showing the installation shape of an active heat dissipation mechanism according to one embodiment of the present invention relative to the press-fit portion of Figure 6, Figure 9 is a cutaway perspective view and a partially enlarged view thereof showing the installation shape of an active heat dissipation mechanism according to one embodiment of the present invention relative to the press-fit portion of Figure 8, Figure 10 is a cutaway perspective view showing the internal structure of a single active heat dissipation mechanism in the configuration of Figure 8, Figure 11 is a rear side cross-sectional view showing the internal structure to explain the trench structure of Figures 4a and 5a, and Figure 12 is a partial perspective view showing the installation shape of an active heat dissipation mechanism according to one embodiment of the present invention relative to the press-fit portion of the configuration of Figures 4a and 5a.

[0082] As shown in Figures 4a and 5a, the rear surface of the heat dissipation housing body 110 realized in the first installation example may be provided with a trench structure 170, which has an open area separating the center portion between the left and right ends into upper and lower portions.

[0083] Here, a plurality of press-fit portions 150 may be provided on the rear surface of the heat dissipation housing main body 110 corresponding to the left and right sides of the trench structure 170 so that a plurality of active heat dissipation mechanisms 200 according to an embodiment of the present invention are arranged in an upward inclined manner toward the left and right ends, respectively. That is, the press-fit portions 150 are provided to face left and right, respectively, from the center of the trench structure 170, and the active heat dissipation mechanisms 200 fixed thereto may be arranged in a vertical pattern with a pair of them forming a "V" shape.

[0084] Meanwhile, the active heat dissipation mechanism 200 according to one embodiment of the present invention is provided in a plurality of units, all of which are formed in the same rectangular shape extending in the same length direction. When active heat dissipation mechanisms 200 of the same size are installed in a plurality of press-fit portions 150 as shown in FIG. 4a, one inverted triangular location at the top of the rear surface of the heat dissipation housing main body 110 and two right-angled triangular locations on the left and right lower rear surfaces of the heat dissipation housing main body 110 are not occupied by the active heat dissipation mechanisms 200, and fixed heat dissipation fins 200F-1 and 200F-2 can be arranged therein.

[0085] Here, the fixed heat dissipation fins 200F-1 and 200F-2 may include, as shown in FIG. 4a, upper fixed heat dissipation fins 200F-1 arranged on the upper side of the rear portion of the heat dissipation housing main body 110 that is not occupied by the active heat dissipation mechanism 200 according to one embodiment of the present invention, and lower fixed heat dissipation fins 200F-2 arranged on the left and right lower sides of the rear portion of the heat dissipation housing main body 110 that is not occupied by the active heat dissipation mechanism 200 according to one embodiment of the present invention.

[0086] Unlike the active heat dissipation mechanisms 200, 1200 according to the embodiments of the present invention, the fixed heat dissipation fins 200F-1, 200F-2 are provided in the form of general heat sink fins that do not contain a refrigerant inside, and may be made of aluminum or aluminum alloy material, which has excellent thermal conductivity among metal materials.

[0087] In the area where the trench structure 170 formed on the rear surface of the heat dissipation housing main body 110 realized in the first installation example is provided and in the area (inverted triangular area, 130) where the upper fixed heat dissipation fin 200F-1 of the fixed heat dissipation fins 200F-1 and 200F-2 is provided, a heat transfer medium 135 formed in a general vapor chamber type may be provided.

[0088] A predetermined refrigerant may be filled inside the vapor chamber type heat transfer medium 135. That is, the vapor chamber type heat transfer medium 135 may be embedded in the rear surface of the heat dissipating housing body 110 so that the refrigerant can be filled inside.

[0089] Furthermore, the area corresponding to the trench structure 170 may be filled with a predetermined coolant, similar to the heat transfer medium 135 provided in the inverted triangular area 130 described above.

[0090] However, as shown in FIG. 5a, the trench structure 170 is formed long in the vertical direction (gravity direction) from the lower vertex of the inverted triangular region 130 provided on the rear surface of the heat dissipation housing main body 110, and the liquid phase refrigerant filled inside the trench structure 170 needs to be evenly distributed and retained in the vertical length direction.

[0091] For this purpose, a main body absorber 350 may be further provided inside the trench structure 170 to facilitate uniform refrigerant vaporization across the entire vertical length by heat transferred from the heating element 140 or the inside of the heat dissipating housing main body 110, as well as to retain a uniform amount of liquid refrigerant regardless of vertical position.

[0092] The absorbent body 350 may be made of either nonwoven fabric itself, nonwoven fabric bonded to the inside of a braided metal material, or a metal sintered body formed by sintering metal powder. When a fibrous material such as nonwoven fabric absorbs a liquid such as a liquid-phase refrigerant, it is difficult for it to maintain its vertical length (in the direction of gravity) due to the weight of the liquid. Therefore, the shape can be maintained by the braided copper wire material described above. To the extent that the shape of the absorbent body 350 can be maintained, the nonwoven fabric may be bonded to the inside of the braided copper wire material, or the braided copper wire material may be provided in a spiral shape around the outer periphery of the nonwoven fabric.

[0093] However, the main body absorber 350 provided in the trench structure 170 can be interpreted as being functionally identical to the absorber 300 of the active heat dissipation mechanisms 200 and 1200 according to the embodiments of the present invention described below, and in particular, can be considered to have the same function in that it can cause the liquid refrigerant filled inside each to flow above the naturally formed water surface of the liquid refrigerant.

[0094] Here, the heat transfer medium 135 and the trench structure 170 may be provided independently without being connected to each other.

[0095] In particular, the liquid-phase refrigerant filled inside the trench structure 170 on the rear side of the heat dissipating housing main body 110 undergoes a phase change to evaporate into a gaseous state in a vaporization zone located relatively lower than the trench structure 170 due to a temperature change caused by heat transferred from the heating element 140, thereby allowing partial heat dissipation.

[0096] In addition, even in the inverted triangular region 130 where the upper fixed heat dissipation fin 200F-1, which is a condensation zone located relatively higher, the main body absorber 350 causes a phase change from a liquid state to a gas state, thereby allowing partial heat dissipation.

[0097] The gas-phase refrigerant vaporized in the trench structure 170 and the inverted triangular region 130 undergoes a phase change to liquefy through heat exchange with the outside air, and undergoes repeated gas-liquid circulation, thereby performing a partial heat dissipation function on the back surface of the heat dissipation housing main body 110.

[0098] For reference, the refrigerant filled in the refrigerant flow space corresponding to the inside of the active heat dissipation mechanism 200 according to the embodiments of the present invention described below and the refrigerant filled in the inverted triangular region 130 and trench coupling structure 170 described above are independent of each other, and refrigerants of the same specifications or different specifications may be filled depending on the heat generation amount and mounting position of the heat generating element 140.

[0099] Meanwhile, the back surface of the heat dissipation housing main body 110 realized in the first installation example may be formed with a press-fit portion 150 for press-fit installation of multiple active heat dissipation mechanisms 200 according to one embodiment of the present invention, as shown in Figures 4a and 5a.

[0100] As described above, the active heat dissipation mechanism 200 according to an embodiment of the present invention realized in the first installation example is arranged with an upward inclination toward the left and right ends centered on the trench structure 170, and the press-in portions 150 may also be provided in multiple numbers, and each may be arranged to form a "V" shape based on the trench structure 170.

[0101] That is, the active heat dissipation mechanism 200 according to one embodiment of the present invention can be press-fitted into a plurality of press-fit portions 150 formed on the rear surface of the heat dissipation housing main body 110 using a press-fitting method, as shown in Figures 4a, 5a, and 6 to 11.

[0102] At this time, although not shown in the drawings, it is preferable that the press-fit portion 150 is press-fitted after being treated with thermal epoxy in order to improve heat transfer efficiency.

[0103] Here, as shown in FIG. 10, the press-fit portion 150 may be recessed from front to rear so that the heat-generating surface of the heat-generating element 140 is accommodated in the inner surface corresponding to the rear side of the heat-dissipating housing main body 110, or may be disposed so as to pass through at least one of the heat-generating mold mating surfaces 145 formed to protrude from rear to front toward the heat-generating surface of the heat-generating element 140.

[0104] Also, as shown in FIG. 11, the press-in portion 150 may be formed at an incline such that the rear end of the heat dissipation plate portion 203 described later is positioned higher than the press-in end portion 201 described later, so that the refrigerant (especially, liquid-phase refrigerant) filled inside the active heat dissipation mechanism 200 according to one embodiment of the present invention can be easily collected downward in the direction of gravity by gravity.

[0105] More specifically, as shown in the coordinate diagram of FIG. 11, as described above, the press-fit portion 150 can be formed on the rear portion of the heat dissipation housing main body 110 at a predetermined angle (see arrow "a") based on the coordinate Y displayed horizontally to the left and right, in that the left and right sides are each formed to be inclined upward based on the trench structure 170.

[0106] Also, as shown in the coordinate diagram of FIG. 11, the press-fit portion 150 may be formed such that the rear end of the active heat dissipation mechanism 200 according to an embodiment of the present invention, which is press-fitted into the press-fit portion 150, is inclined upward at a predetermined angle (see arrow "b") based on the coordinate X.

[0107] Therefore, when the refrigerant filled in the refrigerant flow space of the active heat dissipation mechanism 200 according to one embodiment of the present invention is a liquid refrigerant (liquid phase refrigerant), it naturally flows toward the press-in end 201 located in the direction of gravity, and when the refrigerant is a gaseous refrigerant (gas phase refrigerant), it can naturally diffuse and flow from the press-in end 201 toward the heat dissipation plate portion 203.

[0108] However, as long as the condensed liquid refrigerant is guided uniformly by a plurality of second refrigerant flow paths 220 or a plurality of inclined guides 215 described below, it is not necessary to form the press-fit portion 150 at an inclination at a predetermined angle (see arrows a and b in Figure 11) based on the rear surface of the heat dissipation housing main body 110 as described above.

[0109] 2-2. Example of second installation As shown in Figures 4b and 5b, multiple active heat dissipation mechanisms 1200 according to another embodiment of the present invention may be arranged vertically and linearly on the rear side of the heat dissipation housing main body 110 realized in the second installation example.

[0110] Therefore, on the back surface of the heat dissipation housing main body 110 realized in the second installation example, the press-fit portions 150 provided for coupling with the active heat dissipation mechanism 1200 according to another embodiment of the present invention are also arranged in a vertically linear direction, and each press-fit portion 150 can be formed parallel to and spaced apart by a predetermined distance in the horizontal direction.

[0111] Here, the rear structure of the heat dissipation housing main body 110 realized in the first installation example shown in Figures 4a and 5a is a structure in which multiple active heat dissipation mechanisms 200 according to one embodiment of the present invention are spaced apart in a "V" shape based on the trench structure 170 to achieve the effect of uniformly dissipating heat generated from the heat generating elements 140, which are concentrated on the left and right sides based on the middle part of the left and right width direction, respectively. Meanwhile, the rear structure of the heat dissipation housing main body 110 realized in the second installation example shown in Figures 4b and 5b is designed so that multiple active heat dissipation mechanisms 1200 according to another embodiment of the present invention are arranged vertically in a long manner, so that the rising air current of hot air due to heat dissipation does not encounter flow resistance in the upward direction.

[0112] For the sake of convenience, the active heat dissipation mechanism 200 provided on the rear surface of the heat dissipation housing main body 110 realized in the first installation example will be defined as "the active heat dissipation mechanism 200 according to one embodiment of the present invention," and the active heat dissipation mechanism 1200 provided on the rear surface of the heat dissipation housing main body 110 realized in the second installation example will be defined as "the active heat dissipation mechanism 1200 according to another embodiment of the present invention," and will be described separately. However, since the only difference between the respective embodiments 200, 1200 is their external shape and the shape in which they are provided, it can be said that it is natural that they can be mixed and installed regardless of the installation examples described above.

[0113] 3. First refrigerant flow path (comprehensive flow path) and second refrigerant flow path (liquid-phase refrigerant guide flow path) Figure 12 is an oblique view showing the manufacturing process of an active heat dissipation mechanism according to one embodiment of the present invention, Figure 13 is a plan view showing the heat conduction panel body before bending, which is part of the configuration of the active heat dissipation mechanism according to one embodiment of the present invention shown in Figure 12, Figure 14 is an enlarged oblique view and an enlarged plan view showing the press-fit end and its modified example, which are part of the active heat dissipation mechanism according to one embodiment of the present invention and its configuration, and Figure 15 is a cross-sectional view showing the state in which the absorber 300 has been removed, which is part of the configuration of (d) and (e) of Figure 14.

[0114] As shown in Figures 12 to 15, an active heat dissipation mechanism 200 according to one embodiment of the present invention comprises heat conduction panel bodies 200-1 and 200-2, which are single metal panel members and have a refrigerant flow space inside which a refrigerant is filled and flows through a bending process (S20) and a joining process (S40) (see Figure 33 described below).

[0115] That is, the active heat dissipation mechanism 200 according to one embodiment of the present invention can be manufactured by bending the heat conduction panel bodies 200-1 and 200-2, which are single metal panel members, based on a predetermined arbitrary reference line T shown in FIG. 10 (bending process (S20)) and then bonding them (bonding process (S40)) to form a sealed refrigerant flow space 205 therein.

[0116] That is, the heat conduction panel bodies 200-1 and 200-2 are single metal panel members that can be molded in a predetermined manner to form the refrigerant flow space 205. In particular, the active heat dissipation mechanism 200 according to one embodiment of the present invention can directly form at least the first refrigerant flow path 210 (described later) in the refrigerant flow space 205, into which the refrigerant is filled and flows, through bending (comprising a bending process (S20) and a joining process (S40) (described later)) among other predetermined methods.

[0117] Here, the refrigerant flow space 205 is provided in a portion located relatively lower with respect to the direction of gravity so as to facilitate collection (retention) or storage of the liquid phase refrigerant, and may include a first refrigerant flow path 210 that forms an evaporation region in which the liquid phase refrigerant (liquid phase refrigerant) changes phase to a gas phase refrigerant (gas phase refrigerant), and a second refrigerant flow path 220 that is provided in a condensation region, which is another portion of the first refrigerant flow path 210, and that guides the flow of the liquid phase refrigerant that has changed phase from the gas phase refrigerant (gas phase refrigerant) to the evaporation region.

[0118] That is, when the portion where the first refrigerant flow path 210 is provided and formed through the bending (bending process (S20)) is defined as an evaporation region where the liquid phase refrigerant of the refrigerant evaporates, and the remaining portion of the evaporation region is defined as a condensation region, the second refrigerant flow path 220 can be provided in the condensation region.

[0119] In particular, the first refrigerant flow path 210 is a portion of a single metal panel member that has been deformed through bending in the above-mentioned predetermined manner, and is formed so that the liquid phase refrigerant is trapped in the refrigerant by sandwiching it against the heating element 140 or the press-fit portion 150 in which the heating element 140 is provided by a distance determined by the material thickness of the metal panel member.

[0120] In this case, the first refrigerant flow path 210 is a portion where the liquid refrigerant is stored and held among the refrigerant filled in the refrigerant flow space 205, and may be arranged vertically in the direction of gravity or with at least its upper and lower ends inclined relative to the direction of gravity. Therefore, the liquid refrigerant stored in the first refrigerant flow path 210 has its water surface located at least in a portion closer to the lower end of the inclined upper and lower ends. This principle is also applied to active heat dissipation mechanisms 1200 according to other embodiments of the present invention, which will be described later.

[0121] More specifically, the active heat dissipation mechanism 200 according to one embodiment of the present invention can be manufactured by bending (bending process (S20)) single heat conduction panel bodies 200-1, 200-2 based on a predetermined arbitrary reference line T (see details of FIG. 12) described below, and then joining (joining process (S40)) the single heat conduction panel bodies 200-1, 200-2 so that a sealed refrigerant flow space 205 is formed therein.

[0122] Therefore, the first refrigerant flow path 210 is a portion deformed in shape through the bending (bending process (S20)), and can be defined as a refrigerant filling and flow space in which the liquid phase refrigerant is filled, sandwiched between the heating element 140 or the press-fit portion 150 in which the heating element 140 is provided, by a distance determined by the material thickness of the metal panel member.

[0123] However, the definition of the first refrigerant flow path 210 in the active heat dissipation mechanism 200 according to one embodiment of the present invention is defined differently from the first refrigerant flow path 1210 of the active heat dissipation mechanism 1200 according to another embodiment of the present invention described below. Here, it is significant that the first refrigerant flow path 210 includes a common technical configuration as a press-in end 201 that is directly inserted into the evaporation area or press-in portion 150, which is one widthwise end of the heat conduction panel body 200-1, 200-2 that receives heat from the heat-generating element 140 that is the heat dissipation target.

[0124] For example, the active heat dissipation mechanism according to the present invention is not necessarily limited to the manufacturing method of the bending method of the embodiment 200 described above.

[0125] That is, as shown in Figures 4b and 5b and Figures 23 to 29 described below, it is also possible to manufacture an active heat dissipation mechanism 1200 according to another embodiment of the present invention, in which a sealed refrigerant flow space 205 is formed inside by joining two separated metal panel members using a joining method (joining process (S40)).

[0126] As described above, the first refrigerant flow path 1210 in the active heat dissipation mechanism 1200 according to another embodiment of the present invention is manufactured using a bonding method, which differs from the active heat dissipation mechanism 200 according to one embodiment of the present invention, and the position or arrangement characteristics based on the separation distance according to the material thickness described above cannot be directly applied to the active heat dissipation mechanism 1200 according to another embodiment of the present invention. Specific characteristics of the active heat dissipation mechanism 1200 according to another embodiment of the present invention will be described in more detail below.

[0127] On the other hand, multiple second refrigerant flow paths 220 are formed within the condensation region excluding the first refrigerant flow path 210, and the liquid phase refrigerant that has condensed from a gas state to a liquid state from the other widthwise end of the heat conduction panel bodies 200-1 and 200-2 can act as a flow path to the first refrigerant flow path 210 side due to surface tension or gravity.

[0128] More specifically, when the gaseous refrigerant (gas-phase refrigerant) is condensed into a liquid state (liquid-phase refrigerant) through a heat exchange process with the outside air in the condensation region, the volume of the second refrigerant flow path 220 gradually increases at various positions within the refrigerant flow space 205 where the condensation occurs, and when the refrigerant flows in the direction of gravity, a uniform amount of liquid-phase refrigerant flows and is supplied to the first refrigerant flow path 210.

[0129] In particular, the second refrigerant flow path 220 can be defined as a space between a plurality of inclined guides 215, as described below. When the liquid phase refrigerant condensed in the condensation region flows toward the first refrigerant flow path 210, dispersed flow can be inhibited on the side of the second refrigerant flow path 220 adjacent to the second refrigerant flow path 220, which is a self-flow path, due to surface tension.

[0130] That is, the plurality of inclined guides 215 have a flow space narrower than the second refrigerant flow path 220, and therefore, due to the action of surface tension, flow toward the adjacent second refrigerant flow path 220 is suppressed.

[0131] In this way, by preventing the dispersed flow of the condensed liquid refrigerant by the multiple inclined guides 215 and the second refrigerant flow path 220, the liquid refrigerant can be prevented from falling straight down in the direction of gravity. Furthermore, since the lower ends of each of the inclined guides 215 and the second refrigerant flow path 220 are connected at uniform intervals to the first refrigerant flow path 210, the liquid refrigerant condensed in the condensation region can be supplied to the first refrigerant flow path 210 in a uniform amount without being concentrated.

[0132] Furthermore, the plurality of second refrigerant flow paths 220 may be defined between the plurality of inclined guides 215 formed to protrude into the refrigerant flow space 205 from the opposing surfaces of the thermal conduction panel bodies 200-1 and 200-2.

[0133] As shown in (a) of Figure 12, the active heat dissipation mechanism 200 according to one embodiment of the present invention can simultaneously form the above-mentioned first refrigerant flow path 210 and second refrigerant flow path 220 and a plurality of inclined guides 215 (described later) for realizing these, through a pressing process (S10) before a bending process (S20) (described later) on heat conduction panel bodies 200-1 and 200-2 made of a single member of a predetermined thermally conductive material.

[0134] In this case, if the thermal conduction panel bodies 200-1 and 200-2 are formed as rectangles with a width in the horizontal direction smaller than the length in the vertical direction as shown in FIG. 12 before the bending process (S20), the arbitrary reference line T is positioned so as to cross the center of the left and right ends in the vertical direction, and can serve as a reference for the bending process (S20, see FIGS. 12(b) and 12(c)) described later.

[0135] In this case, the center portions of the left and right ends of the thermal conduction panel bodies 200-1 and 200-2 are intermediate portions, which can be understood as the boundary between the one side thermal conduction panel 200-1 and the other side thermal conduction panel 200-2.

[0136] As shown in (b) and (c) of Figure 12, one thermal conduction panel 200-1 corresponding to the left side and the other thermal conduction panel 200-2 corresponding to the right side can be bent using a bending jig (not shown) so that they contact each other based on an arbitrary reference line T.

[0137] In this case, in addition to the first refrigerant flow path 210 and the second refrigerant flow path 220, a third refrigerant flow path 230 can be formed additionally depending on the embodiment, and multiple strength reinforcement parts 240 required for the bonding process (S40, see Figure 12 (d)) described below can be formed so as to face each other and make surface contact.

[0138] As shown in (d) of Figure 12, when the thermal conduction panel 200-1 on one side and the thermal conduction panel 200-2 on the other side of the thermal conduction panel bodies 200-1 and 200-2 are brought into surface contact with each other, they can be joined together using a predetermined joining method along their edges, and each of the multiple strength reinforcement parts 240 that are in surface contact with each other can be joined together using a predetermined joining method.

[0139] At this time, one end and the other end of the first refrigerant flow path 210 formed through the bending process (S20) may be formed so as to be connected to the refrigerant flow space 205 and the outside for the refrigerant filling process and the caulking process described later, and the remaining portion (heat dissipation plate portion 203) may be hermetically coupled so that the refrigerant flow space 205 is completely isolated from the outside.

[0140] 12, the active heat dissipation mechanism 200 according to an embodiment of the present invention includes a thermal conduction panel body 200-1, 200-2, which includes a first thermal conduction panel 200-1 forming a left end portion before the bending process (S20) and a second thermal conduction panel 200-2 forming a right end portion before the bending process (S20), based on an arbitrary reference line T defined as a vertical straight line. Here, the first thermal conduction panel 200-1 and the second thermal conduction panel 200-2 can be understood to define the thermal conduction panel body 200-1, 200-2 before the bending process (S20).

[0141] However, the thermal conduction panel bodies 200-1 and 200-2 can be redefined as the configuration after the bending step (S20) described below.

[0142] For example, the heat conduction panel bodies 200-1 and 200-2 are parts formed by the bending process (S20) and joining process (S40) described later, and can be defined as a part defined by the press-in end 201 that is press-fitted into the press-in portion 150 formed at an upward inclination on the left and right sides, respectively, centered on the trench structure 170 formed on the back surface of the heat dissipation housing main body 110, which is the heat dissipation target, and the edge ends of the heat conduction panel bodies 200-1 and 200-2 excluding the press-in end 201, and includes a heat dissipation plate portion 203 that dissipates heat by phase change of the refrigerant and heat exchange with the external air (outside air).

[0143] However, the heat dissipation plate portion 203 is preferably defined as the entire region that dissipates heat after heat exchange between the refrigerant (particularly, gas-phase refrigerant) filled inside and the external air (outside air) excluding the above-mentioned press-fit end portion 201. The heat exchange between the gas-phase refrigerant in the heat dissipation plate portion 203 and the outside air means that the gas-phase refrigerant is condensed and changes phase to a liquid-phase refrigerant.

[0144] Meanwhile, the heat dissipation plate part 203 may have a plurality of strength reinforcing parts 240 formed on the inner surface of the one side heat conduction panel 200-1 and the inner surface of the other side heat conduction panel 200-2 spaced apart in the thickness direction so as to protrude into the refrigerant flow space 205.

[0145] Furthermore, as will be described later, the plurality of strength reinforcement portions 240 are formed simultaneously with the second refrigerant flow path 220, the third refrigerant flow path 230, and the plurality of inclined guides 215 through the pressing process (S10). When observed from the outside after the bending process (S20) and the joining process (S40), it can be understood that the strength reinforcement portions 240 are formed by being recessed from the outside to the inside of the heat sink portion 203.

[0146] The first refrigerant flow path 210 is located below the direction of gravity, and when the refrigerant that has been phase-changed to mainly liquid refrigerant (liquid-phase refrigerant) in the refrigerant flow space 205 flows downward along the direction of gravity, the first refrigerant flow path 210 collects the refrigerant on the same inclined guide 215, and can be defined as a flow path that plays a role in uniformly moving and dispersing the liquid-phase refrigerant throughout the evaporation region where the refrigerant is changed to a gas phase by heat transferred from the heating element 140 of the heat-dissipating housing main body 110. Here, the uniform movement and dispersion of the liquid-phase refrigerant among the functions of the first refrigerant flow path 210 can be understood as a concept that means transporting the liquid-phase refrigerant at least in a direction different from the direction of gravity by the absorber 300 described below.

[0147] Furthermore, among the functions of the first refrigerant flow path 210, the uniform movement and dispersion of the liquid refrigerant may be understood as a concept meaning that the liquid refrigerant is supplied and transported evenly by a plurality of second refrigerant flow paths 220 or a plurality of inclined guides 215 formed at an angle to the single first refrigerant flow path 210. This will be described in more detail in the description of the absorber 300.

[0148] An absorber 300, which will be described later, is inserted inside the first refrigerant flow path 210, thereby facilitating the collection and dispersion of the liquid refrigerant and its transport in a direction different from the direction of gravity.

[0149] Here, after the bending process (S20), the first refrigerant flow paths 210 may be formed symmetrically in the thickness direction of the refrigerant flow space 205 with respect to an arbitrary reference line T as shown in Fig. 13. Therefore, the first refrigerant flow path 210 may be newly defined as a flow path including the arbitrary reference line T, which is the reference for the bending process (S20).

[0150] 4. First refrigerant flow path and press-fit end portion, and second refrigerant flow path and heat sink portion As shown in Figures 14 to 16, the thermal conduction panel bodies 200-1 and 200-2 are formed by bending the one-side thermal conduction panel 200-1 and the other-side thermal conduction panel 200-2 based on an arbitrary reference line T to form a first refrigerant flow path 210 inside and a press-fit end 201 that is connected to the press-fit portion 150 formed on the back surface of the heat dissipation housing main body 110, which is the heat dissipation target, on the outside.

[0151] Also, the thermal conduction panel bodies 200-1 and 200-2 may further include a heat dissipation plate portion 203, which is defined as the remaining portion excluding the press-fit end portion 201, as defined above.

[0152] After the bending process (S20), the heat dissipation plate part 203 can seal the refrigerant flow space 205 by joining the edges of the one side heat conduction panel 200-1 and the other side heat conduction panel 200-2 to each other in a predetermined joining manner.

[0153] The predetermined joining method may be either a welding method or a bonding method. Preferably, among the welding methods, a laser welding method may be adopted. However, the laser welding method does not necessarily have to be adopted, and any joining method may be adopted as long as it has a sealing force sufficient to prevent leakage of the refrigerant filled inside.

[0154] Meanwhile, the end of the press-fit end 201 that is inserted into the press-fit portion 150 can be bent to have either a round cross section (see (b) and (d) of FIG. 14, (a) of FIG. 15) or a flat cross section (see (c) and (e) of FIG. 14, (b) of FIG. 15), as shown in FIGS. 14 and 15.

[0155] More specifically, the press-fit end 201 can be formed to have a semicircular rounded cross-section with a radius of R1, as shown in Figures 14(b) and (d) and Figure 15(a), or it can be formed to have corners with a rounded cross-section with a radius smaller than R1 and the remainder having a flat end, as shown in Figures 14(c) and (e) and Figure 15(b).

[0156] In the case of the press-fit end 201 realized to have an R1 value (see (a) of Figure 15), it can be formed through a single bending process (S20), which has the advantage of being process-wise, but has the disadvantage that the volume occupied by the first refrigerant flow path 210 relative to the press-fit portion 150 is relatively small.

[0157] Conversely, in the case of the press-fit end 201 realized to have an R2 value (see (b) of Figure 15), while it has a process disadvantage in that it is formed through two bending processes (S20), it has the advantage that the volume occupied by the first refrigerant flow path 210 is relatively large compared to the press-fit portion 150.

[0158] In this case, the outer surface of the press-fit end 201 may be fitted into the press-fit portion 150 formed on the rear surface of the heat dissipating housing body 110 by a press-fit method after thermal epoxy treatment.

[0159] Furthermore, when the press-fit end 201 is inserted into the press-fit portion 150, at least a portion of the first refrigerant flow path 210 may flow into the inside of the tip of the press-fit portion 150. The installation structure of the active heat dissipation mechanism 200 according to one embodiment of the present invention and the active heat dissipation mechanism 1200 according to another embodiment of the present invention relative to the press-fit portion 150 will be described in more detail later.

[0160] On the other hand, as shown in Figures 12 to 15, the multiple second refrigerant flow paths 220 can play a role in guiding the refrigerant that has changed phase to a gaseous state (gas-phase refrigerant), flowed toward the heat sink portion 203, exchanged heat with the outside air, and then condensed back into a liquid state (liquid-phase refrigerant) so that it can flow naturally toward the first refrigerant flow path 210.

[0161] More specifically, as shown in Figures 12 to 15, the second refrigerant flow path 220 is provided in a condensation region formed in another portion of the first refrigerant flow path 210, and can be defined as the space between a plurality of inclined guides 215 that guide the flow of liquid-phase refrigerant that has been changed from a gas phase to a liquid phase to an evaporation region.

[0162] Here, as shown in FIG. 13, the plurality of inclined guides 215 defining the second refrigerant flow path 220 may be provided in a form that protrudes from each inner surface of the one-side thermal conduction panel 200-1 and the other-side thermal conduction panel 200-2 toward the refrigerant flow space 205 after the bending process (S20) described below.

[0163] The plurality of inclined guides 215 may be provided in a linear form inclined downward in the direction of gravity toward the first refrigerant flow path 210. Therefore, the liquid refrigerant condensed on the heat dissipation plate 203 side can naturally aggregate and then flow toward the first refrigerant flow path 210 along between the plurality of inclined guides 215 inclined downward, thereby increasing the circulation speed of the liquid refrigerant.

[0164] Here, the plurality of second refrigerant flow paths 220 or the plurality of inclined guides 215 may be arranged in parallel with adjacent second refrigerant flow paths 220 or inclined guides 215. Generally, the liquid refrigerant condensed in a wide condensation region having an area larger than the evaporation region limited to the first refrigerant flow path 210 can be dispersed through the second refrigerant flow paths 220 or inclined guides 215 arranged in parallel in a fine and uniform manner, thereby providing the advantage of uniform heat dissipation throughout the entire condensation region.

[0165] In addition, a plurality of inclined guides 215 may be formed on each of the one-side thermal conduction panel 200-1 and the other-side thermal conduction panel 200-2, but the ends of the inclined guides 215 protruding toward the refrigerant flow space 205 may be spaced apart from each other without being joined together within the refrigerant flow space 205.

[0166] In this way, since the second refrigerant flow path 220 serves to guide the flow of the liquid refrigerant in the direction of gravity, it is preferable that the second refrigerant flow path 220 has a size in the thickness direction that allows the flow to naturally form in the direction of gravity without being stopped by surface tension, which is an inherent property of liquid. Furthermore, the second refrigerant flow path 220 may be formed such that, after the liquid refrigerant has aggregated to a predetermined size or larger, dispersion flow due to surface tension or gravity is suppressed toward the adjacent second refrigerant flow path 220.

[0167] Furthermore, at least one of the two ends of the plurality of second refrigerant flow paths 220 or the plurality of inclined guides 215 is connected to the evaporation area or the first refrigerant flow path 210 formed within the evaporation area, but the end connected to the evaporation area or the first refrigerant flow path 210 formed within the evaporation area (i.e., one of the two ends) is located relatively lower in the direction of gravity than the other end of the two ends.

[0168] Therefore, when at least one of the one end and the other end of the plurality of second refrigerant flow paths 220 is defined as "one end," the one end may have the same meaning as a "lower end" located on the lower side based on the direction of gravity, and conversely, when the other of the one end and the other end of the plurality of second refrigerant flow paths 220 is defined as "the other end," the other end may have the same meaning as an "upper end" located on the upper side based on the direction of gravity.

[0169] Furthermore, as described above, the plurality of second refrigerant flow paths 220 or the plurality of inclined guides 215 may be formed such that at least one of their ends is connected to the first refrigerant flow path 210, but their ends are connected in a straight line.

[0170] The linear shape of the plurality of second refrigerant flow paths 220 not only minimizes the distance between one end of the first refrigerant flow path 210, which is located closest to the heating element 140 and receives heat, and the other end, which is the outermost end of the condensation area where condensation actively occurs through heat exchange with the outside air, but also proves to be an optimal shape that can minimize the overlap length (flow resistance length) between the flow path of the liquid phase refrigerant and the flow path of the gas phase refrigerant.

[0171] For example, although not shown in the drawings, the differences between the second refrigerant flow path 220 formed in a honeycomb structure, with only consideration given to ensuring the heat dissipation area of ​​the condensation region corresponding to the heat dissipation plate portion 203, and the second refrigerant flow path 220 having a straight line shape can be briefly explained as follows.

[0172] In other words, if the second refrigerant flow path 220 has a honeycomb structure, when the liquid refrigerant is supplied with heat in the evaporation region corresponding to the press-in end 201 and changes phase to gas refrigerant, and then diffuses and flows toward the outer end, it acts as a flow resistance that prevents the refrigerant from flowing in a straight line toward the other end of the heat sink portion 203 corresponding to the minimum distance, making it difficult to expect active gas-liquid circulation.

[0173] In contrast, the active heat dissipation mechanism 200 according to one embodiment of the present invention differs in that it employs a linear structure in which gas-liquid circulation is smooth without any additional flow resistance from the first refrigerant flow path 210 (i.e., one end in the width direction) to the outer end (i.e., the other end in the width direction), which is the end of the condensation region, and a gas-liquid flow separation structure, which will be described later.

[0174] That is, in the active heat dissipation mechanism 200 according to one embodiment of the present invention, the second refrigerant flow path 220 is different from the honeycomb structure in that, in order to guide the liquid-phase flow of the liquid-phase refrigerant that has undergone a phase change from the gas-phase refrigerant in the refrigerant flow space 205, the second refrigerant flow path 220 is formed so that multiple paths do not branch off from the other widthwise end toward the first refrigerant flow path 210, which is located relatively lower in the direction of gravity.

[0175] This indicates that the heat dissipation mechanism is completely different from the honeycomb structure of the RBFHP in the "Prior Paper" already introduced in the "Background Technology of the Invention" section, which is arranged in the form of a refrigerant flow path.

[0176] In other words, the RBFHP in the previous paper uses roll bonding to join the edges of two material sheets, so even if the refrigerant is filled inside, the heat transferred from the heating element is essentially transferred to the liquid-phase refrigerant first, which raises concerns about a decrease in the heat flow rate due to the thermal resistance of the material itself along the length of the edges where the refrigerant is joined.On the other hand, after the liquid-phase refrigerant receives heat and is converted into gas-phase refrigerant, the honeycomb structure lengthens the flow path toward the outer edge, creating resistance to the condensed liquid-phase refrigerant's flow in the opposite direction, making it difficult to expect active gas-liquid circulation.

[0177] In contrast, in the case of the active heat dissipation mechanism 200 according to one embodiment of the present invention, the first refrigerant flow path 210 filled with liquid refrigerant is positioned adjacent to the heat-generating element 140 or the press-fit portion 150 in which the heat-generating element 140 is provided, so as to be spaced apart by the thickness of the heat-conducting panel bodies 200-1, 200-2 formed through the bending process (S20) of a single metal panel member. In addition, a straight structure and a gas-liquid flow separation structure are applied, in which gas-liquid circulation is smooth without any additional flow resistance from the first refrigerant flow path 210 (i.e., one end in the width direction) to the outer end (i.e., the other end in the width direction), which is the end of the condensation area, thereby realizing a completely different heat dissipation mechanism.

[0178] That is, the second refrigerant flow paths 220 are formed so that a plurality of them do not branch off from the other end in the width direction toward one end in the width direction, which is the first refrigerant flow path 210 located relatively lower in the direction of gravity, in order to guide the liquid-phase flow of the liquid-phase refrigerant that has undergone a phase change from the gas-phase refrigerant in the refrigerant flow space.

[0179] Meanwhile, as described above, the plurality of inclined guides 215 are flow paths that guide the flow of the liquid refrigerant in the direction of gravity, and not only define the second refrigerant flow paths 220 between each of the inclined guides 215, but also function to define the third refrigerant flow paths 230, which correspond to the separated portions in the thickness direction, as described below.

[0180] In this case, assuming that the first refrigerant flow path 210 is positioned relatively lower in the direction of gravity by tilt adjustment of the entire heat dissipation housing main body 110, it is preferable that the multiple inclined guides 215 are patterned at an incline with respect to the first refrigerant flow path 210 so as to form a flow path through which the liquid phase refrigerant (liquid phase refrigerant) flows.

[0181] Here, the second refrigerant flow path 220 defined as the space adjacent to the plurality of inclined guides 215 may be a refrigerant flow path that extends from the first refrigerant flow path 210 corresponding to the arbitrary reference line T toward the widthwise end sides of the heat conduction panel bodies 200-1 and 200-2 while inclining upward. This is to allow the liquid-phase refrigerant liquefied on the heat dissipation plate portion 203 side to easily move by its own weight to the first refrigerant flow path 210 side where the absorber 300 is provided.

[0182] 5.Third coolant flow path 16 and 17 are perspective views and partially enlarged perspective views of an active heat dissipation mechanism according to one embodiment of the present invention before and after bending, FIG. 18 is a plan view of an active heat dissipation mechanism according to one embodiment of the present invention after bending, and FIG. 19 is a cross-sectional view taken along line CC in FIG. 18.

[0183] The active heat dissipation mechanism 200 according to one embodiment of the present invention may further include a third refrigerant flow path 230, as shown in FIGS.

[0184] Here, when the bending process (S20) and the joining process (S40) of the thermal conduction panel bodies 200-1 and 200-2 are completed, a portion of one surface of the one thermal conduction panel 200-1 and a portion of one surface of the other thermal conduction panel 200-2 are joined to each other based on an arbitrary reference line T, thereby forming a refrigerant flow space 205. The refrigerant flow space 205 can form the first refrigerant flow path 210, the second refrigerant flow path 220, and the third refrigerant flow path 230, which is added depending on the embodiment, simultaneously with the joining process (S40).

[0185] 17, the second refrigerant flow path 220 is defined as being formed between adjacent inclined guides 215 in each of the one-side heat conduction panel 200-1 and the other-side heat conduction panel 200-2, excluding the thickness direction of the refrigerant flow space 205, whereas the third refrigerant flow path 230 can be defined as the space between the inclined guides 215 formed in the one-side heat conduction panel 200-1 and the inclined guides 215 formed in the other-side heat conduction panel 200-2 in the thickness direction of the refrigerant flow space 205. However, it should be noted that when defining the second refrigerant flow path 220, excluding the thickness direction means that the direction used as the basis for the definition is not the thickness direction, and should not be interpreted as excluding the volume occupied by the thickness direction as the corresponding volume and space.

[0186] More specifically, the third refrigerant flow path 230 may be formed in a region where the thickness of the refrigerant flow space 205 is smaller than that of the second refrigerant flow path 220 when the inclined guides 215 are formed to protrude further into the refrigerant flow space 205 than the second refrigerant flow path 220. That is, the third refrigerant flow path 230 may be defined as a region whose thickness is smaller than that of the second refrigerant flow path 220 due to the plurality of inclined guides 215.

[0187] Furthermore, the third refrigerant flow path 230 can be defined as a portion where a plurality of inclined guides 215 are formed on the facing surfaces of the one side thermal conduction panel 200-1 and the other side thermal conduction panel 200-2 of the thermal conduction panel bodies 200-1 and 200-2, and is not joined but separated from each other within the refrigerant flow space 205.

[0188] The third refrigerant flow path 230 may serve to provide a gas flow path for the refrigerant filled in the refrigerant flow space 205 to be phase-changed into a gas phase refrigerant in the evaporation region, which is the first refrigerant flow path 210, and then to be easily diffused and flowed throughout the heat dissipation plate 203. The gas phase refrigerant evaporated in the first refrigerant flow path 210, which is the evaporation region, moves to the heat dissipation plate 203 side and is smoothly and evenly dispersed through the third refrigerant flow path 230, so that it can be condensed while dissipating heat.

[0189] For example, when the liquid phase refrigerant flows naturally through the space between the inclined guides 215 adjacent to the second refrigerant flow path 220, the gas phase refrigerant flows actively through the third refrigerant flow path 230, which is the space not occupied by the liquid phase refrigerant.

[0190] However, it is preferable to understand that this does not mean that the liquid phase refrigerant is completely separated from the gas phase refrigerant and is not occupied through the third refrigerant flow path 230, but rather that the gas phase refrigerant flows more actively through the third refrigerant flow path 230.

[0191] That is, since the phase change of the refrigerant is not completely separated into liquid phase refrigerant and gas phase refrigerant, it is difficult to define them precisely, but generally, the second refrigerant flow path 220 is a path through which the liquid phase refrigerant mainly flows since it has a relatively large size in the thickness direction, and the third refrigerant flow path 230 can be a path through which the gas phase refrigerant mainly flows.

[0192] More specifically, since gas phase refrigerant is more active than liquid phase refrigerant, the third refrigerant flow path 230, which has a relatively small thickness dimension, can be the main flow path, and for liquid phase refrigerant, taking into account its own surface tension, the second refrigerant flow path 220, which has a relatively larger thickness dimension than the third refrigerant flow path 230, can be the main flow path.

[0193] Meanwhile, the third refrigerant flow passage 230 may be defined as a refrigerant flow passage that connects the spaces of the second refrigerant flow passages 220 that are spaced apart from each other in parallel.

[0194] For example, the second refrigerant flow path 220 may be formed in a predetermined pattern by processing one side and the other side of the thermal conduction panel bodies 200-1 and 200-2 in the pressing process (S10) before bending so that the one side thermal conduction panel 200-1 and the other side thermal conduction panel 200-2 protrude to a portion where a refrigerant flow space is formed based on an arbitrary reference line T in the middle portion where the first refrigerant flow path 210 is provided, but is separated by the third refrigerant flow path 230 formed so as not to come into surface contact with each other after bending. Of course, it should be noted that the meaning of "separator" here does not mean a complete physical and spatial separation, but rather refers to the shape and positional division of the second refrigerant flow path 220 and the third refrigerant flow path 230.

[0195] Meanwhile, as shown in FIG. 16, the thermal conduction panel bodies 200-1 and 200-2 may be joined such that the one side thermal conduction panel 200-1 and the other side thermal conduction panel 200-2, which correspond to both ends in the width direction, are bent and come into surface contact with each other based on an arbitrary reference line T.

[0196] As described above, the first refrigerant flow path 210, the second refrigerant flow path 220, and the third refrigerant flow path 230 are formed symmetrically in the one-side heat conduction panel 200-1 and the other-side heat conduction panel 200-2 with respect to an arbitrary reference line T, and the thickness direction size of each has an internal size that is twice the depth of the depression formed in the one-side heat conduction panel 200-1 and the other-side heat conduction panel 200-2 through the pressing process (S10) described below.

[0197] More specifically, as shown in FIG. 19, the first refrigerant flow path 210 is a portion formed through the bending process (S20) described below, and is a portion forming a press-fit end 201 that comes into direct surface contact with the heat-generating surface of the heat-generating element 140 through the press-fit portion 150 of the heat-dissipating housing main body 110, and the size of the outer surface of the portion forming the press-fit end 201 can be formed to be approximately larger than or the same as the thickness 220L of the second refrigerant flow path 220.

[0198] Furthermore, the maximum size 220L of the second refrigerant passage 220 in the thickness direction may be larger than the maximum size 230L of the third refrigerant passage 230 in the thickness direction, as shown in FIG.

[0199] This is because, during the pressing process (S10) performed before the bending process (S20) of the thermal conduction panel bodies 200-1 and 200-2, the second refrigerant flow path 220 is not pressed, and only the edge portion forming the heat dissipation plate portion 203, the plurality of inclined guides 215, the third refrigerant flow path 230, and the plurality of strength reinforcement portions 240 described later are pressed and molded.

[0200] 6. Multiple reinforced strength parts Meanwhile, as shown in Figures 16 to 19, the active heat dissipation mechanism 200 according to one embodiment of the present invention may further include a plurality of strength reinforcement parts 240 formed on at least one of the one-side heat conduction panel 200-1 and the other-side heat conduction panel 200-2, protruding by a predetermined length from the inner surfaces of the one-side heat conduction panel 200-1 and the other-side heat conduction panel 200-2 toward the refrigerant flow space 205, but formed facing each other.

[0201] More specifically, when a single metal panel member is bent and joined to form the refrigerant flow space 205, the one-side heat conduction panel 200-1 before bending forms one-side widthwise and lengthwise edge edges based on an arbitrary reference line T, and the other-side heat conduction panel 200-2 before bending forms the other-side widthwise and lengthwise edge edges based on an arbitrary reference line T.

[0202] Similarly, when two metal panel members are joined to form a refrigerant flow space 205, the one-side heat conduction panel 200-1 before joining can form one-side widthwise and lengthwise edges based on the edge where the above-mentioned first refrigerant flow path 210 is formed, and the other-side heat conduction panel 200-2 before joining can form the other-side widthwise and lengthwise edges based on the edge where the above-mentioned first refrigerant flow path 210 is formed.

[0203] Here, the plurality of strength reinforcing portions 240 may be formed on at least one of the one-side heat conduction panel 200-1 and the other-side heat conduction panel 200-2 constituting the condensation area, excluding the evaporation area forming the above-mentioned arbitrary reference line T or the first refrigerant flow path 210.

[0204] The plurality of strength reinforcing parts 240 are generally formed on at least one of the one-side heat conduction panel 200-1 and the other-side heat conduction panel 200-2, which are planar in shape, and serve to reinforce the strength to prevent sagging or squeezing caused by external pressure or internal pressure due to a phase change of the refrigerant.

[0205] Here, the plurality of strength reinforcement portions 240 may be formed such that their tip surfaces protrude further than the tips of the plurality of inclined guides 215 toward the refrigerant flow space 205 corresponding to the thickness direction of the thermal conduction panel bodies 200-1 and 200-2 after bending.

[0206] At this time, it is preferable that the amount by which the tip surfaces of the plurality of strength reinforcing portions 240 protrude toward the refrigerant flow space 205 is at least such an extent that the mutually facing portions of the one-side thermal conduction panel 200-1 and the other-side thermal conduction panel 200-2 are in surface contact with each other so that they can be joined to each other in a predetermined joining method during the joining process (S40) after the bending process (S20) described below.

[0207] However, it is not necessary that the plurality of strength reinforcing portions 240 are in surface contact with each other after bending, and they may be spaced apart from each other within the refrigerant flow space 205, as in the case of the inclined guide 215 described above.

[0208] However, if the plurality of strength reinforcement portions 240 are limited to a configuration in which they are joined to each other via a mutual welding method or the like during the joining process (S40) described below, it is preferable that they are formed to protrude so as to be in surface contact with each other above the refrigerant flow space 205.

[0209] In this case, the plurality of strength reinforcing portions 240 may be processed by sheet metal processing during the pressing process (S10) so as to be smaller than the minimum thickness within the refrigerant flow space 205 formed by at least the plurality of second refrigerant flow paths 220.

[0210] Here, the minimum thickness within the refrigerant flow space 205 formed by the second refrigerant flow path 220 can be interpreted as the same as the thickness-wise size of the third refrigerant flow path 230, in that the second refrigerant flow path 220 is defined as the space between two adjacent inclined guides 215 among the multiple inclined guides 215, excluding the thickness direction, as shown in Figure 17.

[0211] As described above, in the active heat dissipation mechanism 200 according to one embodiment of the present invention, the plurality of strength reinforcement portions 240 are processed and formed to be at least smaller than the thickness of the third refrigerant flow path 230 (or the minimum thickness of the second refrigerant flow path 220), thereby further increasing the contact surface area with the gas phase refrigerant flowing freely through the third refrigerant flow path 230, thereby achieving the effect of enabling refrigerant condensation in a shorter time.

[0212] In addition, as shown in FIG. 13, the plurality of strength reinforcement portions 240 are formed symmetrically with respect to an arbitrary reference line T on the one side thermal conduction panel 200-1 and the other side thermal conduction panel 200-2, but may be formed only on the plurality of inclined guides 215.

[0213] Here, the plurality of inclined guides 215 are also processed into the planar shape of the one-side thermal conduction panel 200-1 and the other-side thermal conduction panel 200-2 through the pressing process (S10), thereby temporarily reinforcing the strength, and the plurality of strength reinforcing parts 240 are again processed on the plurality of primarily processed inclined guides 215, thereby performing the function of secondary reinforcement of the strength.

[0214] However, depending on the embodiment, as in yet another embodiment described later (see 200T-1 in FIG. 20a and 200T-2 in FIG. 20b), the inclined guide 215 may be formed in another portion (i.e., a portion unrelated to the inclined guide 215) of the inclined guide 215. This will be described in more detail later in the description of the embodiment.

[0215] Here, the plurality of strength reinforcing parts 240 are formed on the mutually facing surfaces of the one side heat conduction panel 200-1 and the other side heat conduction panel 200-2 of the heat conduction panel bodies 200-1 and 200-2, and may be arranged such that their leading end surfaces face each other within the refrigerant flow space 205 or the first through third refrigerant flow paths 210 to 230. Furthermore, the plurality of strength reinforcing parts 240 arranged to face each other may be joined at their facing and contacting surfaces by laser welding.

[0216] In particular, the plurality of strength reinforcement portions 240 are preferably formed on the third refrigerant flow path 230, which mainly serves as a flow path for the gas-phase refrigerant so that the condensation surface area where the gas-phase refrigerant that has changed phase to a gas state comes into contact and condenses during flow is increased. However, since the third refrigerant flow path 230 can be defined as the space between the plurality of inclined guides 215 in the thickness direction as described above, this can be considered to be the same as defining the plurality of strength reinforcement portions 240 as being formed on the plurality of inclined guides 215.

[0217] Here, the plurality of strength reinforcing portions 240 may be formed in any shape as long as they are capable of reinforcing the strength of the one-side thermal conduction panel 200-1 and the other-side thermal conduction panel 200-2. As shown in Figures 16 and 17, the strength reinforcing portions 240 may include dot reinforcing portions 242 having a circular cross-sectional shape, and line reinforcing portions 241 having a semicircular cross-section only at the longitudinal end portions and extending in a straight line in the longitudinal direction.

[0218] More specifically, the plurality of line reinforcement portions 241 are formed elongated in the width direction of the thermal conduction panel bodies 200-1 and 200-2, and are formed on a plurality of inclined guides 215, so that they can be arranged facing each other when the one-side thermal conduction panel 200-1 and the other-side thermal conduction panel 200-2 are joined after bending.

[0219] Similarly, the plurality of dot reinforcement portions 242 are formed in the gaps between the plurality of line reinforcement portions 241, but are formed on the plurality of inclined guides 215, and can be arranged facing each other when the one-side thermal conduction panel 200-1 and the other-side thermal conduction panel 200-2 are joined after bending.

[0220] Here, the plurality of line reinforcing portions 241 and the plurality of dot reinforcing portions 242 may be alternately arranged one by one on one inclined guide 215.

[0221] However, it is not necessary that the plurality of strength reinforcement portions 240 be divided into a plurality of line reinforcement portions 241 and a plurality of dot reinforcement portions 242, but it can be said that they can be arranged at uniform intervals across the entire heat sink portion 203 in an elliptical shape similar to the dot reinforcement portions 242, as shown in Figure 20a described below.

[0222] 7. Absorbent 20 and 21 are perspective views showing examples of an absorber in the configuration of an active heat dissipation mechanism according to one embodiment of the present invention.

[0223] As shown in Figures 11 and 14, 20 and 21, the active heat dissipation mechanism 200 according to one embodiment of the present invention may further include an absorber 300 that absorbs the liquid phase refrigerant from the refrigerant introduced through the second refrigerant flow path 220 and then uniformly distributes the liquid phase refrigerant in the direction of gravity or in the first refrigerant flow path 210 that is arranged at an angle to the direction of gravity.

[0224] More specifically, the absorber 300 is located close to the press-fit portion 150 provided on the rear portion of the heat dissipation housing main body 110, which is the heat dissipation target, and is arranged within the first refrigerant flow path 210, which forms an evaporation region that changes the refrigerant from a liquid phase to a gas phase, and can play a role in raising at least the liquid phase refrigerant above its absorption point by capillary force or absorption force.

[0225] For this purpose, the absorber 300 may include a plurality of pores (not shown) that absorb and retain the liquid refrigerant while dispersing the liquid refrigerant in the direction of gravity or at least in the direction opposite to the direction of gravity (i.e., downward).

[0226] Such an absorber 300 can maintain the absorption rate for the liquid-phase refrigerant through the plurality of pores, while being prevented from deformation due to sagging in the direction of gravity through a support structure (for example, a skeleton support portion 320) described later.

[0227] The absorber 300 here is a metal sintered body formed by sintering metal powder, and is a concept that includes a wick member having a wick structure installed inside a general vapor chamber, but is not limited to this. The concept can include any material or configuration that can maximize heat dissipation performance by collecting and transporting liquid phase refrigerant from top to bottom on the first refrigerant flow path 210 arranged at an angle with respect to the direction of gravity, thereby raising the thermal conductivity material limit of existing general heat sink fins.

[0228] On the other hand, it is preferable that the absorber 300 be installed as close as possible to the press-in end 201 side, which has a relatively narrow width in the refrigerant flow space 205, in that the closer it is to the press-in end 201 side, the more easily the phase change from liquid phase refrigerant to gas phase refrigerant can be actively caused by the heat transferred from the heating element 140.

[0229] However, it is obvious that the absorber 300 does not necessarily have to be installed so as to be close only to the press-in end 201 side, but can also be installed so as to be evenly distributed throughout the heat sink portion 203, which corresponds to the evaporation area where the refrigerant can evaporate, excluding the press-in end 201.

[0230] However, in the case of the active heat dissipation mechanism 200 according to one embodiment of the present invention, the heat conduction panel bodies 200-1 and 200-2 formed from a single member are bent, and then the portions corresponding to the edge portions of the heat dissipation plate portion 203 are joined together, and then the absorber 300 is installed through the open portions at both ends on the first refrigerant flow path 210 side. Therefore, for reasons of manufacturing method, the evaporation area of ​​the refrigerant may be limited to the first refrigerant flow path 210.

[0231] Here, the absorber 300 may include any one of a nonwoven fabric having a plurality of pores (a kind of wick structure), a nonwoven fabric supported by a metal wire or a metal braid, and a metal sintered body formed by sintering a metal powder. Here, as with the main body absorber 350, the metal material may include a copper material having excellent thermal conductivity, and the nonwoven fabric may be supported by a thin copper metal wire or a copper wire braid formed by braiding this metal wire.

[0232] That is, the absorber 300 may be a nonwoven fabric made of a fiber material. In this case, the nonwoven fabric itself is very flexible, and when a liquid refrigerant is absorbed, it may be difficult to maintain its shape in the vertical direction due to the weight of the absorbed liquid refrigerant. Therefore, the nonwoven fabric may be supported by copper wires or a braided copper wire material.

[0233] Here, the nonwoven fabric is configured to be inserted inside the braided body made of copper wire material and maintains its shape, thereby playing a role in stably fixing the nonwoven fabric provided as the absorber 300 on the first refrigerant flow path 210 arranged in the direction of gravity (i.e., vertically) or at an angle to the direction of gravity, and preventing it from moving.

[0234] However, the support structure does not necessarily have to be such that the nonwoven fabric is inserted inside the braided body made of copper wire. It is also possible to adopt a support structure in which a single strand of copper wire passes through the nonwoven fabric in the vertical direction or wraps around the nonwoven fabric in a spiral shape.

[0235] In this absorber 300, as long as it can maintain its shape despite the load of the liquid refrigerant held therein, the nonwoven fabric may be bonded to the inside of a braided body made of copper wire, or the copper wire itself or a braided body made of copper wire may be provided in a spiral shape around the outer periphery of the nonwoven fabric.

[0236] More specifically, as shown in Figures 20 and 21, the absorber 300 may include an absorbent body portion 310 that has a predetermined absorption rate for liquid refrigerant but is deformed in shape by an external force, including a predetermined gravity or greater, and a skeleton maintaining portion 320 that is connected to the absorbent body portion 310 and prevents the absorbent body portion 310 from being deformed in shape by the external force.

[0237] Here, the absorbent body 310 may be made of any one of the above-mentioned nonwoven fabric, cotton, and sponge, which form a plurality of pores (a kind of wick structure). The absorbent body 310 made of nonwoven fabric, cotton, and sponge can be arranged vertically in the direction of gravity due to the characteristics of the material, but when liquid is contained in the pores, the weight of the liquid may cause the outer shape (shape) to deform, such as dripping in the direction of gravity.

[0238] In this way, if the absorbent body portion 310 sags due to the incorporation of liquid and the position of its uppermost end changes from above the first refrigerant flow path 210 to below, this can lead to a problem in that the evaporation area is reduced by the amount of change.

[0239] The skeleton support part 320 serves to prevent deformation, such as the sagging phenomenon, of the absorbent body part 310. To this end, the skeleton support part 320 may be in the form of a tube that forms a hollow (not shown) in which the absorbent body part 310 is located.

[0240] Preferably, the skeleton support part 320 is made of a metal material having a predetermined thermal conductivity or higher, since it is configured to transfer heat transferred from the external heating element 140 to the internal absorbing body part 310. For example, the metal material forming the skeleton support part 320 may be a copper material.

[0241] In addition, the skeleton support part 320 may be braided in a tube shape using a metal wire as shown in FIG. 20 (see reference numeral "321"), or may be provided in a spiral shape using a single metal wire wound around the outer periphery of the absorbent body part 310 as shown in FIG. 21 (see reference numeral "322").

[0242] More specifically, as shown in FIG. 20, the skeleton support part 321 may be provided by braiding metal (copper) wires in a tubular form so that the liquid refrigerant, which is guided to the first refrigerant flow path 210 through each of the plurality of second refrigerant flow paths 220, can permeate the absorbent body part 310 therein.

[0243] In this case, the skeleton maintaining part 321, which is a braided body braided in a tube shape, may be braided to have gaps through which at least the liquid phase refrigerant of the refrigerant is transferred by surface tension from the outside to the absorbent body part 310. In this case, the gas phase refrigerant, which has been phase-changed from the liquid phase refrigerant by the absorbent body part 310, can be easily dispersed to the outside through the gaps in the braid.

[0244] 21, the skeleton support portion 322 may be provided as a single metal (copper) panel (or wire) wound around the outside of the absorbent body portion 310 in a spiral shape.

[0245] Here, it is preferable that the metal panel (or metal wire) has enough shape retention to prevent downward sagging due to gravity even when the absorbent body portion 310 contains a sufficient amount of liquid-phase refrigerant.

[0246] Meanwhile, as shown in FIG. 20, the absorbent body 300 may have a cylindrical skeleton support portion 321, and the absorbent body portion 310 may be formed in a columnar shape so as to be inserted into the cylindrical skeleton support portion 321.

[0247] As described above, in the active heat dissipation mechanism 200 according to one embodiment of the present invention, the absorber 300 is formed by separately manufacturing and combining the absorbent body portion 310 and the skeleton support portion 320. However, it is not necessary to additionally provide the skeleton support portion 320. In fact, it may be sufficient to provide only the absorbent body portion 310 if the absorbent body portion 310 itself has the ability to maintain its shape and does not sag or deform even when liquid refrigerant is contained in it.

[0248] The absorbent 300 according to the above-described embodiments includes an absorbent body portion 310 made of any one of nonwoven fabric, cotton, and sponge, and a framework support portion 320 made of a metal (copper) wire material braided in a tubular form or wound in a spiral form, thereby preventing downward dripping of the liquid refrigerant regardless of the amount contained in the absorbent body portion 310, and allowing a uniform amount of liquid refrigerant to undergo phase change in the first refrigerant flow path 210.

[0249] Furthermore, the active heat dissipation mechanism 200 according to an embodiment of the present invention may further include a plurality of absorber fixing guides 250 as shown in FIG.

[0250] The plurality of absorber fixing guides 250 can serve to stably fix the absorber 300, which is arranged long in the direction of gravity (i.e., vertically), within the refrigerant flow space 205 (particularly, the first refrigerant flow path 210). In particular, the plurality of absorber fixing guides 250 serve to prevent the absorber 300 from sagging in the direction of gravity when absorbing liquid-phase refrigerant, in a case where the absorber 300 is made of only a nonwoven fabric that is not supported by a metallic braid such as the skeleton support part 320.

[0251] Such a plurality of absorber fixing guides 250 can be molded simultaneously with the above-mentioned first to third refrigerant flow paths 210-230 and a plurality of inclined guides 215 or a plurality of strength reinforcing portions 240 during the pressing step (S10).

[0252] More specifically, the absorber fixing guides 250 are formed to protrude toward the refrigerant flow space 205 to prevent the absorber 300, which is made of nonwoven fabric and may sag in the direction of gravity when it absorbs the liquid-phase refrigerant. When the edges of the one-side thermal conduction panel 200-1 and the other-side thermal conduction panel 200-2 are joined together in the joining process (S40), the absorber 250 can be held down and stably fixed.

[0253] Here, when the absorbent body 300 is supported by a nonwoven fabric positioned inside a braided body made of a metal material, it is natural that the structure that is substantially supported by the multiple absorbent body fixing guides 250 can be the outer surface of the braided body.

[0254] In addition, the plurality of absorber fixing guides 250 press the outer surface of the absorber 300 or braided body, which is made of a nonwoven fabric whose outer shape is easily deformed by external force, and simultaneously serve to secure a predetermined space for the flow of the refrigerant in a gaseous state (gas-phase refrigerant) evaporated in the first refrigerant flow path 210.

[0255] In this way, the absorber 300 is installed inside the first refrigerant flow path 210, and the liquid-phase refrigerant that is condensed and liquefied from the heat dissipation plate portion 203 side moves to a portion close to the heating element 140 and is retained therein by the absorption force (or capillary force) of the absorber 300, and then changes phase to a gas-phase refrigerant by the heat transferred from the heating element 140, and the gas-phase refrigerant can be diffused and flowed again throughout the entire heat dissipation plate portion 203 according to the principle of gas diffusion.

[0256] The gas phase refrigerant moved to the heat dissipation plate portion 203 side is smoothly and evenly dispersed throughout the heat dissipation plate portion 203 through the third refrigerant flow path 230, and is condensed while dissipating heat through heat exchange with the outside air.The condensed liquid phase refrigerant can then be easily moved again toward the first refrigerant flow path 210, which is in the direction of gravity, along the second refrigerant flow path 220, which has a relatively larger thickness than the multiple inclined guides 215.

[0257] The heat generated from the heating element 140 is first transferred to the first refrigerant flow path 210 side where the absorber 300 is provided, and the refrigerant stored on the first refrigerant flow path 210 side where the absorber 300 is provided is mostly in a liquid state inside the absorber 300, and then changes phase to a gas phase due to the heat transferred from the heating element 140, and then flows throughout the heat dissipation plate portion 203 of the thermal conduction panel bodies 200-1 and 200-2, preferably via the third refrigerant flow path 230, to dissipate heat.

[0258] In the following, one cycle is defined as one circulation phenomenon of the refrigerant in which the liquid phase refrigerant changes phase to gas phase refrigerant on the press-in end 201 side, then diffuses and flows toward the heat sink 203 side, and then changes phase to liquid phase refrigerant again on the heat sink 203 side, and then flows back toward the press-in end 201 side, and the time required to complete one cycle is defined and explained as the "gas-liquid circulation cycle time."

[0259] It can be understood that the specific shapes and arrangement designs of the first refrigerant flow path 210, 1210, second refrigerant flow path 220, 1220, and third refrigerant flow path 230, the plurality of inclined guides 215, 1215, and the plurality of strength reinforcement portions 240, 1240 included in the active heat dissipation mechanism 200 according to one embodiment of the present invention described above, the plurality of modified examples 200T-1 to 200T-5 described below, and the active heat dissipation mechanism 1200 according to another embodiment of the present invention described below, are all designed with the ultimate goal of maximizing heat dissipation performance by minimizing the cycle time of the above-mentioned gas-liquid circulation and activating the gas-liquid circulation.

[0260] 8. First and second modified examples 22a and 22b are development views of a thermal conduction panel body according to a first modified example 200T-1 and a second modified example 200T-2 of a partial configuration of one embodiment of the present invention before bending.

[0261] The differences from the embodiment 200 of the present invention already described with reference to the first modified example 200T-1 and the second modified example 200T-2 shown in FIGS. 22a and 22b will be described as follows.

[0262] That is, in the first modified example 200T-1 of the present invention, as shown in FIG. 22a, a plurality of strength reinforcement portions 240 may be provided only on a plurality of inclined guides 215 separating the second refrigerant flow path 220, as in the above-described embodiment 200, and some of the plurality of strength reinforcement portions 240' may be designed to be provided on an outer portion unrelated to the second refrigerant flow path 220 or the third refrigerant flow path 230 and the plurality of inclined guides 215, unlike the above-described embodiment 200.

[0263] Furthermore, referring to Figure 22b, when comparing the active heat dissipation mechanism 200T-2 according to the second modified example of the present invention with the active heat dissipation mechanism 200 according to one embodiment of the present invention shown in Figures 9 to 21, it can be seen that there are the following differences.

[0264] That is, as shown in FIG. 22b, the active heat dissipation mechanism 200T-2 according to the second modified example of the present invention may have only a plurality of inclined guides 215 formed on one of the one-side thermal conduction panel 200-1 and the other-side thermal conduction panel 200-2, and only a plurality of strength reinforcement portions 240 in the form of dot reinforcement portions 242 formed on the other of the one-side thermal conduction panel 200-1 and the other-side thermal conduction panel 200-2.

[0265] In this case, the heat conduction panel bodies 200-1 and 200-2 of the active heat dissipation mechanism 200T-2 according to the second modified example may be arranged so that the tip surfaces of the plurality of joints 240 and the tip surfaces of the plurality of inclined guides 215 are almost in contact with each other or in surface contact with each other in the refrigerant flow space 205 after the bending process (S20).

[0266] More specifically, in the active heat dissipation mechanism 200T-2 according to the second modified example, one of the one-side heat conduction panel 200-1 and the other-side heat conduction panel 200-2, which correspond to the left and right sides of the first refrigerant flow path 210 that serves as a comprehensive passage for the refrigerant, has a plurality of second refrigerant flow paths 220, defined as gaps between the plurality of inclined guides 215, formed inclined toward the corresponding widthwise end portion in one 200-2, and the other 200-1 may have a plurality of dot reinforcement portions 242 facing each other on the tip surfaces of the plurality of inclined guides 215 formed to separate the plurality of second refrigerant flow paths 220 after the bending process (S20) described below.

[0267] In this case, the other heat conduction panel 200-2 does not need to be provided with a separate strength reinforcement portion 240, and it can be understood that the multiple inclined guides 215 provided to separate the second refrigerant flow path 220 themselves also serve as the strength reinforcement portion 240.

[0268] That is, in the case of the above-described embodiment 200 of the present invention, the plurality of strength reinforcement portions 240 are provided in the form of a plurality of line reinforcement portions 241 and a plurality of dot reinforcement portions 242 mixed together without distinction between the one-side thermal conduction panel 200-1 corresponding to the left side of the thermal conduction panel bodies 200-1 and 200-2 and the other-side thermal conduction panel 200-2 corresponding to the right side thereof. However, in the active heat dissipation mechanism 200T-2 according to the second modified example of the present invention shown in FIG. 22b, different strength reinforcement elements are provided in the one-side thermal conduction panel 200-1 corresponding to the left side of the thermal conduction panel bodies 200-1 and 200-2 and the other-side thermal conduction panel 200-2 corresponding to the right side thereof.

[0269] In this case, the surface portion of the other heat conduction panel 200-2 having the plurality of inclined guides 215 is preferably located lower in the direction of gravity, since this is advantageous for guiding the smooth flow of liquid-phase refrigerant. On the other hand, the surface portion of the one-side heat conduction panel 200-1 having the plurality of dot reinforcement portions 242 is preferably located higher in the direction of gravity, since this is advantageous for guiding the smooth flow of gas-phase refrigerant.

[0270] Here, the mutual joining of the multiple dot reinforcement portions 242 by welding (see the joining process (S40) described below) has the advantage of increasing the overall rigidity of the thermal conduction panel bodies 200-1, 200-2 after the bending process (S20), as described above.

[0271] However, as described above, the active heat dissipation mechanism 200 of the present invention and its modified examples 200T-1 to 200T-2 are filled with a refrigerant and have as their core structural components a technical configuration that improves heat dissipation performance through the phase change of the refrigerant, and therefore the internal structural design of the heat conduction panel bodies 200-1 and 200-2 must also be optimally adapted to their installation position, gravity, and the phase change of the refrigerant.

[0272] 9. Additional Embodiments 23a to 24b are perspective and plan views showing additional embodiments of active heat dissipation mechanisms according to an embodiment of the present invention.

[0273] More specifically, Figures 23a and 24a show an additional embodiment (hereinafter abbreviated as "bending type additional embodiment") manufactured by bending the thermal conduction panel bodies 200-1 and 200-2 made of a single metal panel member based on an arbitrary reference line T through the above-mentioned bending process (S20), and Figures 23b and 24b show an additional embodiment (hereinafter abbreviated as "joining type additional embodiment") manufactured by joining the thermal conduction panel bodies 200-1 and 200-2 made of two metal panel members during the joining process (S40) described below without the above-mentioned bending process (S20).

[0274] Here, it can be understood that the bending type additional embodiment of Figures 23a and 24a and the joining type additional embodiment of Figures 23b and 24b are all the same in terms of the internal configuration of the refrigerant flow space 205 (e.g., multiple inclined guides 215 and the first and second refrigerant flow paths 210 and 220, etc.), except for the external structure of the one-side caulking end 207a and the other-side caulking end 207 of the bending type additional embodiment 200E-1a formed at both longitudinal ends of the thermal conduction panel bodies 200-1 and 200-2 for the caulking finishing process that is essential for the bending process (S20).

[0275] As shown in Figures 23a to 24b, active heat dissipation mechanisms 200E-1a and 200E-1b according to additional embodiments of the present invention may have a plurality of inclined guides 215 arranged in a straight line on one heat conduction panel body 200-1 and the other heat conduction panel body 200-2 arranged on the left and right sides of the drawings based on an arbitrary reference line T or a press-fit end 201 having a first refrigerant flow path 210.

[0276] In this case, assuming that the press-fit end 201 of the heat conduction panel body 200-1, 200-2 manufactured through the bending process (S20) or the joining process (S40) is inserted into the press-fit portion 150 arranged perpendicular to the direction of gravity (vertical direction) with respect to the rear portion of the heat dissipation housing main body 110, which is the heat dissipation target, or at least the press-fit portion 150 arranged inclined in the direction of gravity with respect to the rear portion of the heat dissipation housing main body 110, the multiple inclined guides 215 and the multiple second refrigerant flow paths 210 defined thereby can also be arranged inclined so that one of the ends closest to the first refrigerant flow path 210 is always located downward based on the direction of gravity.

[0277] Meanwhile, each of the plurality of inclined guides 215 may be formed with a single line reinforcement portion 241 among the strength reinforcement portions 240 .

[0278] More specifically, when a plurality of inclined guides 215 are formed in a straight line shape so as to have a predetermined length and width, the line reinforcement portion 241 formed on each of the plurality of inclined guides 215 can be processed and formed in a straight line shape that is smaller than the length and width of the inclined guide 215 corresponding to each formation position.

[0279] It can be said that it is natural that such a plurality of inclined guides 215 and line reinforcement portions 241 can be formed simultaneously when forming the sheet metal in the pressing step (S10).

[0280] In this case, at least the line reinforcement portions 241 are formed symmetrically so that they can face each other on the refrigerant flow space 205 at least after bending and when joining is completed, but they can be formed to protrude further toward the refrigerant flow space 205 than the multiple inclined guides 215 so that they can be joined to each other on the refrigerant flow space 205.

[0281] The line reinforcement portions 241 formed in this manner are joined to each other in the refrigerant flow space 205, thereby serving to form independent flow paths of the liquid refrigerant, each formed by a plurality of inclined guides 215.

[0282] Here, the meaning that each independent flow path is formed by a plurality of strength reinforcement parts 240, i.e., line reinforcement parts 241, means that a plurality of inclined guides 215 are provided in a straight line from the outer end of the heat sink part 203 to the press-fit end part 201, and each of these inclined guides 215 is formed to protrude so as to be in surface contact with each other on the refrigerant flow space 205, thereby forming a structure that prevents the liquid refrigerant from flowing toward the adjacent second refrigerant flow path 220.

[0283] In the active heat dissipation mechanisms 200E-1a and 200E-1b according to additional embodiments of the present invention, the description has been limited to the provision of only the first refrigerant flow path 210 corresponding to the evaporation region and the second refrigerant flow path 220, which is the main flow path of the liquid refrigerant. However, a separate third refrigerant flow path (not shown) may not be necessary to the extent that the gas refrigerant can flow freely through the empty space not occupied by the liquid refrigerant while the liquid refrigerant is guided through the second refrigerant flow path 220.

[0284] Meanwhile, the active heat dissipation mechanisms 200E-1a and 200E-1b according to additional embodiments of the present invention may further include the above-described absorber 300 on the side of the press-in end 201 corresponding to the first refrigerant flow path 210. The absorber 300 may have different uppermost water levels of the liquid refrigerant depending on a predetermined absorption rate (absorption capacity) possessed by the absorber 300 itself.

[0285] Here, when the joined heat conduction panel bodies 200-1, 200-2 are installed in the press-fit portion 150 at an incline relative to the direction of gravity, the liquid refrigerant is concentrated and stored in the lower portion of both longitudinal ends, and the uppermost water surface of the liquid refrigerant absorbed by the absorber 300 can move relatively to the lower portion.

[0286] In order to raise the top water level of the liquid phase refrigerant absorbed by the absorber 300, it is necessary to adopt an absorber 300 with a higher absorption rate (absorption capacity) or to raise the water level of the liquid phase refrigerant stored on the first refrigerant flow path 210 side.

[0287] This is because when the uppermost water level of the liquid phase refrigerant is determined as the upper end of the absorber 300, the absorber 300 functions most efficiently in terms of providing an expansion of the substantial evaporation area.

[0288] The active heat dissipation mechanisms 200E-1a and 200E-1b according to additional embodiments of the present invention are, as described above, intended to further raise the topmost water level of the liquid refrigerant absorbed by the absorber 300, and may further include a fixed joint 208F formed on the heat conduction panel bodies 200-1 and 200-2.

[0289] More specifically, when the heat conduction panel bodies 200-1 and 200-2 are arranged vertically or inclined with respect to at least the direction of gravity relative to the heat dissipation housing main body 110 in which the press-fit portion 150 is formed, the fixing joint portion 208F is formed at the outer corner portion of the lower end portion of the heat conduction panel bodies 200-1 and 200-2 with respect to the direction of gravity, thereby reducing the refrigerant flow space 205.

[0290] That is, the fixing joint 208F is provided in a triangular shape at the outer corner of the lower end of the heat dissipation plate part 203 of the one-side heat conduction panel 200-1 and the other-side heat conduction panel 200-2, and during the joining process (S40), the mutual surface contact parts are joined together with the plurality of strength reinforcement parts 240, thereby reducing the space in which the liquid refrigerant is stored and effectively raising the water level of the liquid refrigerant stored in the first refrigerant flow path 210.

[0291] Therefore, the fixed joint 208F can be understood as a configuration that causes the uppermost water surface of the liquid phase refrigerant among the refrigerants absorbed in the absorber 300 to move upward proportionally relative to the direction of gravity, compared to the area it occupies.

[0292] Furthermore, it can be said that the area occupied by the fixed joint 208F can be set in consideration of the absorption rate (absorption capacity) of the absorber 300 provided in the first refrigerant flow path 210, as a matter of course.

[0293] However, since the amount of heat dissipation per unit area can vary depending on the area occupied by the fixed joint 208F, differences also occur in the amount of liquid-phase refrigerant flowing into the first refrigerant flow path 210, and the water surface of the liquid-phase refrigerant on the independent flow paths formed by each inclined guide 215 may not be uniform.

[0294] 10. Comparison of Comparative Examples with the Present Invention FIG. 25 is a cross-sectional view showing the installation shapes of a comparative example 200D, a and an active heat dissipation mechanism 200, b according to one embodiment of the present invention relative to a press-fit portion.

[0295] 10-1.SUS material and bending molding In the following, in order to facilitate a smooth comparison between the active heat dissipation mechanism 200 according to one embodiment of the present invention and the active heat dissipation mechanism 200D according to a comparative example, it should be made clear that the illustration in Figure 25 assumes that the press-fit end 201 of the active heat dissipation mechanism 200 according to one embodiment of the present invention is inserted and fixed into a press-fit portion 150 having the same specifications (i.e., shape and size).

[0296] First, for a detailed comparison between the active heat dissipation mechanism 200 according to one embodiment of the present invention shown in (b) of Figure 25 and the comparative example 200D shown in (a) of Figure 25, the specifications of the active heat dissipation mechanism 200D according to the comparative example will be described in detail.

[0297] The active heat dissipation mechanism 200D according to the comparative example is manufactured by joining two panel members made of aluminum (Al) material, which has extremely high thermal conductivity, through a predetermined joining process, and is described assuming that a refrigerant flow space 205 is formed in which a refrigerant is filled and flows through a phase change.

[0298] As is well known, aluminum (Al) material has a thermal conductivity of 230 and a specific gravity of 2.7. In the present invention, the thickness of one panel member is 0.5T (hereinafter, "T" means "mm" as a unit of length), and the total thickness of the two panel members is 1T, which means that the thickness inserted into the press-fit portion 150 provided near the heat-generating element 140, which is the target of heat dissipation, is 1T.

[0299] More specifically, as shown in FIG. 22(a), the limit thickness of the one-side thermal conduction panel 200D-1 and the other-side thermal conduction panel 200D-2 of the comparative example 200D is set to 0.5T, which is the limit thickness that cannot be made thinner due to the product strength design requirements and safety design requirements while taking into account the aluminum material, and the internal width of the pair of slot ribs 150a, 150b forming the press-fit portion 150 is formed to 1T, which is twice the combined thickness of 0.5T of the one-side thermal conduction panel 200D-1 and the other-side thermal conduction panel 200D-2 of the comparative example 200D, and such a press-fit portion 150 of the same shape and size is also applied to the active heat dissipation mechanism 200 according to one embodiment of the present invention.

[0300] Here, the meaning of the strength design requirements and safety design requirements for products made of aluminum material is that aluminum material itself has better elongation and processability than SUS material and can be manufactured below the above-mentioned limit thickness, but it must have the strength to stably retain the refrigerant filled inside. For this reason, it means that the aluminum metal panel member needs to be subjected to additional processes such as heat treatment, cold working, or alloying.

[0301] In particular, when aluminum material is used as the main constituent material of the thermal conduction panel body as in Comparative Example 200D, it has the advantage of excellent thermal conductivity, but in addition to the problem of increased costs due to the high cost mentioned above, it also has the following various disadvantages.

[0302] First, in the case of the comparative example 200D, which is made of aluminum heat conduction panel bodies 200D-1 and 200D-2, the selection of refrigerant is very limited. That is, when aluminum comes into contact with water, it can undergo a chemical reaction that generates hydrogen and turns into aluminum oxide. In particular, the generation of some hydrogen leads to a problem of increasing the internal pressure of the refrigerant flow space 205.

[0303] Secondly, the increase in internal pressure of the refrigerant flow space 205 of the comparative example 200D, which is made of aluminum heat conduction panel bodies 200D-1 and 200D-2, not only increases the risk of damage to the completed active heat dissipation mechanism 200D itself, but also causes the gap between the one-side heat conduction panel 200D-1 and the other-side heat conduction panel 200D-2 to rise, resulting in a trembling phenomenon during gas-liquid circulation of the refrigerant, and further creating a problem of hindering smooth gas-liquid circulation. To prevent these problems, it is necessary to form a reinforcing element such as the strength reinforcing part 240 of the embodiment 200 according to the present invention described above during the pressing process (S10).

[0304] Third, due to the first and second problems mentioned above, the refrigerants that can be used in the aluminum comparative example 200D are limited to special refrigerants such as Honeywell refrigerants or CFCs (freon gas), but as various countries have recently been actively considering regulating the use of refrigerants to prevent environmental pollution, there is a problem that this goes against the international trend to prevent environmental pollution. In other words, when producing a product such as the aluminum comparative example 200D, it may not be possible to release or apply the product in each country that has the above-mentioned usage restrictions.

[0305] Fourth, when the heat conduction panel bodies 200D-1 and 200D-2 made of aluminum have a limiting thickness, there is a problem in that there is a design limit for positioning the refrigerant close to the heat generating element, as described above. That is, pure aluminum has good elongation due to its characteristics, but when a metal panel member made of aluminum is manufactured through heat treatment, cold working, alloying, or other methods in accordance with the strength and safety design requirements for stably retaining the refrigerant inside without floating up, as described above, the strength increases but the workability in the press process decreases. Therefore, assuming that the refrigerant flow space 205 of the same thickness is formed, it is impossible to form the plurality of strength reinforcing portions 240 provided in the embodiment 200 of the present invention by press processing to prevent shivering during gas-liquid circulation of the refrigerant.

[0306] Fifth, when a limit thickness is set for the one-side thermal conduction panel 200D-1 and the other-side thermal conduction panel 200D-2 as described above, as in the active heat dissipation mechanism 200 according to an embodiment of the present invention, the closest position of the refrigerant flow space 205, which corresponds to the first refrigerant flow path 210 where the liquid-phase refrigerant intended to be positioned closest to the heating element 140, is set outside the press-fit portion 150. This problem leads to a problem that the distance between the heating element 140 and the liquid-phase refrigerant becomes large, thereby diluting the advantages of aluminum, which has excellent thermal conductivity.

[0307] Therefore, in comparative example 200D, although the metal material of the metal panel members constituting the thermal conduction panel bodies 200D-1 and 200D-2 is aluminum, the description will be limited to the case where the metal panel members are manufactured from an alloy aluminum material having a tensile strength equal to or greater than the above-mentioned specified value.

[0308] As mentioned above, aluminum materials including alloy aluminum have excellent thermal conductivity of 230 as well as low specific gravity, making them one of the most widely used thermally conductive metal materials for heat dissipation elements.

[0309] However, as mentioned above, although aluminum has excellent thermal conductivity and specific gravity, it has problems such as being relatively expensive compared to the original cost and having limited types of refrigerant that can be filled inside.

[0310] Therefore, the active heat dissipation mechanism 200 according to one embodiment of the present invention is made of SUS (stainless steel), a material that is less expensive than aluminum, and its core component is a design change to provide heat dissipation performance similar to that of aluminum.

[0311] More specifically, the active heat dissipation mechanism 200D according to the comparative example may include two components, as shown in (a) of Figure 25, in which a refrigerant flow space 205 is formed in which a refrigerant is filled and flows, and flat heat conduction panel bodies 200D-1 and 200D-2 made of aluminum material.

[0312] This is different from the active heat dissipation mechanism 200 according to one embodiment of the present invention, which is formed by bending a single member to form a plurality of refrigerant flow paths 210 to 230 corresponding to the refrigerant flow space 205 described above.

[0313] However, even when the heat conduction panel bodies 200D-1 and 200D-2 are joined together to form two components, as in the active heat dissipation mechanism 200D of the comparative example, it can be said that the active heat dissipation mechanism 200 according to one embodiment of the present invention is also formed by welding the two heat conduction panel bodies 200D-1 and 200D-2 together to form the first refrigerant flow path 210, the second refrigerant flow path 220, and the third refrigerant flow path 230, and to the extent that an absorber 300 can be provided in the area corresponding to the first refrigerant flow path 210, as in the active heat dissipation mechanism 200 of one embodiment of the present invention.

[0314] That is, the active heat dissipation mechanism 200D according to the comparative example is formed by combining two heat conduction panel bodies 200D-1 and 200D-2 facing each other, and the above-mentioned refrigerant flow space 205 may be formed therein.

[0315] Here, the active heat dissipation mechanism 200 according to one embodiment of the present invention is different from the comparative example 200D, which is made of two members, in that it is made of a single member and is bent symmetrically on the left and right.

[0316] Here, in the case of the active heat dissipation mechanism 200D according to the comparative example, unlike the active heat dissipation mechanism 200 according to one embodiment of the present invention, two separate components (thermal conduction panel bodies 200D-1 and 200D-2) are joined using a predetermined joining method to form a refrigerant flow space 205 therein. The reason for this is that, as mentioned above, in the case of aluminum material, the elongation rate is low during the metal processing process in which alloy aluminum is processed to ensure a certain level of strength, making precise additional processing very difficult.

[0317] For example, when the thermal conduction panel bodies 200D-1 and 200D-2 made of aluminum material are bent through the bending process (S20) as in one embodiment of the present invention 200, the processability is very poor, so the radius of curvature of the portion forming the press-fit end 201 has to be made relatively large.

[0318] Such an increase in the radius of curvature of the press-fit end 201 not only requires that the groove size (i.e., the size between a pair of slot ribs 150a, 150b) of the press-fit portion 150 manufactured for installation on the back surface of the heat dissipation housing main body 110, which is the heat dissipation target, must also be made larger. As a result, the size of the thermal conduction panel bodies 200D-1, 200D-2 themselves must increase, leading to a significant decrease in the number of installations per unit area on the back surface of the heat dissipation housing main body 110.

[0319] More specifically, the elongation rate of metal panel members made of aluminum material is generally 40% or more, the higher the purity, which is even greater than the 35% elongation rate of metal panel members made of SUS material (see JIS standards SUS304, SUS316, SUS321, SUS410), so it is expected to have good processability as well.

[0320] However, as described above, when aluminum metal panel members are manufactured through heat treatment, cold working, alloying, or other methods in accordance with the strength and safety design requirements of the product, the elongation rate is low and the processability is poor.

[0321] Here, the low workability of the aluminum metal panel member manufactured by the above-mentioned heat treatment, cold working, or alloying methods means that, due to the above-mentioned limiting thickness, it is difficult to reduce the distance between the inner surface of the press-fit portion 150, through which heat is transferred from the heating element 140, and the refrigerant flow space 205, through which the liquid refrigerant evaporates (an additional processing process is required), and it is not easy to process and form reinforcing elements, such as the multiple strength reinforcing portions 240 in one embodiment of the present invention 200, through a press process to prevent the vibration phenomenon of the one-side heat conduction panel 200D-1 and the other-side heat conduction panel 200D-2 that occurs during gas-liquid circulation of the refrigerant (poor workability).

[0322] That is, referring to (a) of FIG. 25, comparative example 200D will be explained. Assuming that further processing is difficult due to the limit thickness set by the design requirement, and the width between the pair of slot ribs 150a, 150b constituting the press-fit portion 150 is designed to be twice the limit thickness, the refrigerant flow space 205 where the heating element 140 and the liquid refrigerant are closest to each other will be spaced further outward than the outer end of the press-fit portion 150 (the outer end of the pair of slot ribs 150a, 150b), resulting in a difference in the heat transfer rate and amount.

[0323] For example, as shown in (a) of Figure 25, when the material of the metal panel member constituting the heat conduction panel bodies 200D-1 and 200D-2 inside 150c of a pair of slot ribs 150a and 150b of the press-fit portion 150 is aluminum, and at least a portion of the refrigerant flow space 205 corresponding to the first refrigerant flow path is not located inside the slot ribs 150a and 150b of the press-fit portion 150 and is formed with a thickness of 1T, which is twice the limit thickness of 0.5T, as in the active heat dissipation mechanism 200 according to one embodiment of the present invention shown in (b) of Figure 25, the heat conduction panel bodies 200-1 and 200-2 made of SUS material can be processed and formed with a thickness that includes a thickness of twice 0.15T inside 150c of the pair of slot ribs 150a and 150b of the press-fit portion 150, but allows a portion of the first refrigerant flow path 210 to be located therein.

[0324] On the other hand, if the metal panel members constituting the thermal conduction panel bodies 200D-1 and 200D-2 are manufactured with a maximum thickness based on the design requirements, as in the comparative example 200D shown in (a) of Figure 25, it is difficult to process the multiple strength reinforcement portions 240 and corresponding reinforcement elements through a press process due to the low processability caused by the increased strength, and there is a disadvantage that the internal structure or reinforcement elements of the refrigerant flow space must be processed using other processing methods for the metal panel member (e.g., etching process or turning process).

[0325] In contrast, in the case of one embodiment 200 shown in Figure 25 (b), the metal panel member made of SUS material not only has a very good elongation ratio in itself, but also has excellent processability, so that the first to third refrigerant flow paths 210 to 230 and the internal structure of the refrigerant flow space 205 including a plurality of strength reinforcement portions 240 can be simultaneously formed using a single pressing process. The mutual contact portions of the plurality of strength reinforcement portions 240 are welded together through a joining process, which prevents the one side heat conduction panel 200-1 and the other side heat conduction panel 200-2 from vibrating or expanding and contracting during gas-liquid circulation of the refrigerant, thereby advantageously preventing unnecessary consumption of energy required to evaporate the liquid phase refrigerant.

[0326] Furthermore, in the case of the active heat dissipation mechanism 200D according to the comparative example, as described above, the press-in end 201 is formed to have the material thickness (0.5T×2) of the two heat conduction panel bodies 200D-1 and 200D-2 themselves, and since it is not easy to process, if it is simply connected to the press-in portion 150 through a press-fitting method, the fixing force to the heat dissipation housing main body 110 is weak.In order to supplement this fixing force, after the press-in end 201 is fitted and connected to the press-in portion 150, the fixing force must be further increased through a welding connection method, which is a cumbersome process.

[0327] Meanwhile, even when the refrigerant flow space 205 is formed inside the thermal conduction panel bodies 200D-1 and 200D-2 made of aluminum, as mentioned above, there are very limited types of refrigerant that can be filled into the refrigerant flow space 205. For example, if distilled water is used as the refrigerant, it will chemically react with the aluminum material and will not function as a refrigerant, so distilled water must be excluded from the selectable refrigerants.

[0328] In order to solve the various problems of the heat conduction panel bodies 200D-1 and 200D-2 of the comparative example 200D, which are made of the aluminum material described above, the active heat dissipation mechanism 200 of one embodiment of the present invention proposes various shape designs and features for the heat conduction panel bodies 200-1 and 200-2, which are made of SUS (stainless steel), but which can ensure heat dissipation performance equivalent to that achieved when the aluminum material is used.

[0329] More specifically, in the active heat dissipation mechanism 200 according to one embodiment of the present invention, as shown in (b) of Figure 25, the press-in end 201 can be formed to have a predetermined curvature (for example, see "R1" or "R2" in Figures 15 and 16) by bending the heat conduction panel bodies 200-1 and 200-2 made of a single material based on an arbitrary reference line T through a bending process (S20), and at least a portion of the first refrigerant flow path 210 of the refrigerant flow space 205 can be formed to flow further inward than the tips of a pair of slot ribs 150a and 150b that constitute the press-in portion 150.

[0330] In this case, the material of the thermal conduction panel bodies 200-1 and 200-2 in the embodiment 200 of the present invention may be limited to a metal material having an elongation ratio that satisfies the following conditions.

[0331] More specifically, as one of the conditions, assuming that the configuration corresponding to the thermal conduction panel body is provided in the form of a panel made of aluminum material like the RBFHP of the prior art, and is inserted with twice the thickness without any empty space inside a pair of slot ribs 150a, 150b of the press-fit portion 150 formed on the back surface of the heat dissipation housing main body 110, which is the heat dissipation target, the metal material of the thermal conduction panel bodies 200-1, 200-2 in one embodiment of the present invention 200 can be limited to a metal material having an elongation rate that can be bent to a thickness that is 1 / 6 or less of the twice the thickness of the thermal conduction panel body of the RBFHP of the prior art described above.

[0332] For example, when the thickness of the aluminum heat conduction panel bodies 200D-1 and 200D-2 of the comparative example 200D or the RBFHP of the prior paper is 0.5T as described above and inserted into the press-fit portion 150, twice the thickness (1T) is inserted. However, the thickness of the heat conduction panel bodies 200-1 and 200-2 in the active heat dissipation mechanism 200 according to one embodiment of the present invention can be adopted as 0.15T, which is less than 1 / 6 of 1T.

[0333] In addition, it is preferable that the metal material adopted as the thermal conduction panel body 200-1, 200-2 in one embodiment of the present invention 200 has an elongation rate that allows it to be bent so that at least a portion of the first refrigerant flow path 210 is inserted inside the tip of the press-fit portion 150, as described above.

[0334] Furthermore, the metal material may be limited to have an elongation ratio that allows forming a plurality of strength reinforcing portions 240 on a plurality of inclined guides 215 during processing through the pressing process (S10).

[0335] Furthermore, the metal material adopted for the thermal conduction panel bodies 200-1 and 200-2 in one embodiment of the present invention 200 may be limited to one having thermal conductivity that is 1 / 10 or less than that of aluminum material (230 W / mK level). In fact, it is already known that the thermal conductivity of SUS material (described later) is 20 W / mK level, which is 1 / 10 or less than that of aluminum.

[0336] 10-2. Advantages of selecting water as a refrigerant The material that best satisfies the above-mentioned limitations on elongation and thermal conductivity may be the aforementioned stainless steel material. In the active heat dissipation mechanism 200 according to an embodiment of the present invention, when the heat conduction panel bodies 200-1 and 200-2 are made of stainless steel, the limitations on elongation and thermal conductivity described above can be overcome, and distilled water can be additionally used as an acceptable refrigerant.

[0337] That is, the refrigerant filled in the refrigerant flow space 205 of the heat conduction panel bodies 200-1 and 200-2 made of SUS material can be defined as a refrigerant that does not chemically react with the metal material having the above-mentioned elongation rate, except for a refrigerant that chemically reacts with an aluminum panel.

[0338] A representative example of a refrigerant that meets this definition is distilled water (water), as described above. When distilled water is used as a refrigerant, it has advantages over other refrigerants in terms of cost, heat of vaporization, and surface tension. In particular, the high latent heat and sensible heat of distilled water means that it can exhibit sufficient heat transport capacity even when the pressure-insertion end 201 is positioned relatively high in the direction of gravity, which leads to the advantage of ensuring diversity in the fixing design of the pressure-insertion end 201 regardless of the inclination direction of the second refrigerant flow path 220.

[0339] More specifically, the refrigerant filled in the refrigerant flow space 205 may be distilled water (water) that does not undergo any chemical reaction when it comes into contact with the thermal conduction panel bodies 200-1 and 200-2, which are made of a metal material, and that can change phase from a liquid state to a gas state or from a gas state to a liquid state depending on the thermal conductivity of the thermal conduction panel bodies 200-1 and 200-2 themselves.

[0340] The "chemical reaction" in this case is a concept that includes the additional generation of a substance that is "corroded" by the water used as the refrigerant or that changes the internal pressure corresponding to the refrigerant flow space 205.

[0341] However, since it is extremely rare for no chemical reaction to occur at all when substances come into contact with each other, especially after a long period of time has passed, it is preferable to broadly interpret the concept of "chemical reaction" here as a reaction that affects the phase change conditions of water by at least changing the internal pressure of the refrigerant flow space 205.

[0342] Here, the water serving as the refrigerant may include any one of natural water, distilled water, and ultrapure water. However, when water is used, since natural water may contain organic and inorganic substances, it is preferable to use distilled water that has been purified after being vaporized or ultrapure water from which the organic and inorganic substances have been removed.

[0343] Here, ultrapure water refers to pure water from which aqueous electrolytes, microorganisms, organic matter, and dissolved gases have been removed through advanced water purification methods such as reverse osmosis (RO), ion exchange resin, activated carbon filter, and sterilization, and has a resistivity of 18 MΩ.cm or more.

[0344] Furthermore, if water is selected and adopted as the refrigerant, as can be inferred from the problems of comparative example 200D, the metal material of the heat conduction panel bodies 200-1 and 200-2 should be limited to a material that does not undergo any chemical reaction when in contact with water.

[0345] Therefore, in the active heat dissipation mechanism 200 according to one embodiment of the present invention, the metal material of the heat conduction panel bodies 200-1 and 200-2 is a metal material that does not undergo any chemical reaction with water, which serves as a refrigerant, and may include SUS (stainless steel), where SUS is the standard name for stainless steel included in the JIS standard.

[0346] In addition, the active heat dissipation mechanism 200 according to one embodiment of the present invention has a larger elongation rate than the comparative example 200D made of alloy aluminum material or the RBFHP of the previous paper. Therefore, when the press-fit end 201 is formed to have an outer shape larger than the groove size of the press-fit portion 150 and then fitted into the press-fit portion 150 using a press-fitting method, sufficient fixing force can be formed without the need for additional processes such as a separate welding process.

[0347] The adoption of the press-fitting method of joining the press-fit end 201 to the press-fit portion 150 as described above has the advantage of preventing damage to the absorber 300 made of a fibrous material such as nonwoven fabric due to welding heat in advance, in the event that an additional welding process is required.

[0348] In this way, the first to third refrigerant flow paths 210 to 230 of one embodiment of the present invention 200 are filled with refrigerant, and the refrigerant actively undergoes phase change and dissipates heat due to the heat transferred from the heating element 140 provided inside the heat dissipation housing main body 110, thereby maximizing heat dissipation performance.

[0349] In particular, as shown in FIG. 25, in one embodiment of the present invention 200, compared to comparative example 200D, at least a portion of the first refrigerant flow path 210 flows inside the groove formed by the press-fit portion 150 (i.e., inside the tip of the press-fit portion 150), and the refrigerant absorbed and collected in the absorber 300 of the first refrigerant flow path 210 can receive heat in closer proximity to the heat-generating element 140, which results in a more active phase change in the evaporation region, resulting in the advantage of ensuring heat dissipation performance second only to that achieved when aluminum is used as a material.

[0350] 10-3. Hydrophobic coating materials However, when the refrigerant filled in the refrigerant flow space 205 is distilled water, the very high surface tension of water can lead to a problem of reduced fluidity due to the inner surface of the refrigerant flow space 205 being formed to be somewhat thin.

[0351] In order to solve the problem of reduced fluidity of the liquid-phase refrigerant, the active heat dissipation mechanism 200 according to one embodiment of the present invention can solve the problem by coating the portions corresponding to the inner surfaces of the heat conduction panel bodies 200-1 and 200-2, which form the refrigerant flow space, with a hydrophobic coating material.

[0352] The first refrigerant flow path 210 provides a comprehensive flow path regardless of the state of the filled refrigerant, and is a flow path where the liquid refrigerant is mainly absorbed by the absorber 300, so there is no major problem. However, the second refrigerant flow path 220 and the third refrigerant flow path 230 provide a flow path where the liquid refrigerant flows along the surface, and a coating layer using a hydrophobic coating material is formed on the inner surface of the heat conduction panel bodies 200-1 and 200-2 which form the refrigerant flow space 205 to ensure smoother fluidity of the liquid refrigerant.

[0353] However, it is not necessary to form the coating layer using a hydrophobic coating material, and it may be possible to apply a hydrophilic coating material depending on the type of refrigerant or the characteristics of the flow path.

[0354] 11. Other embodiments of the present invention (joining manufacturing) and arrangement structure of the heat dissipating housing body Figure 26 is a cross-sectional view taken along line AA of Figure 4b and a partially enlarged view thereof, Figure 27 is a cutaway oblique view taken along line AA of Figure 4b and a partially enlarged view thereof, Figure 28 is a cutaway oblique view taken along line BB of Figure 4b and a partially enlarged view thereof, Figure 29 is a perspective view showing an active heat dissipation mechanism according to another embodiment of the present invention, Figure 30 is an exploded perspective view of Figure 29, Figure 31 is a cutaway oblique view (a) of Figure 29 and a partially enlarged view (b) thereof and a cross-sectional view (c) of the relevant part, and Figure 32 is a cross-sectional view showing the connection shape of an active heat dissipation mechanism according to another embodiment of the present invention with a press-fit portion.

[0355] Up until now, the active heat dissipation mechanism 200 according to one embodiment of the present invention shown in Figures 4a, 5a, and 7 to 24b, and some of its modified examples 200T-1 to 200T-2 and additional embodiment 200E-1a have been described on the assumption that the first refrigerant flow path 210 is formed by bending a single metal panel member or by using a manufacturing method of a bending process (S20).

[0356] However, the manufacturing method of the active heat dissipation mechanism of the present invention is not necessarily limited to the embodiment 200 using the above-mentioned bending process (S20). Below, we will propose and explain an active heat dissipation mechanism 1200 according to another embodiment of the present invention, in which a refrigerant flow space 1205 having a first refrigerant flow path 1210 and a second refrigerant flow path 1220 (including a third refrigerant flow path in some embodiments) is formed by joining two separated metal panel members using a joining method, as shown in Figures 4b and 5b, 23b and 24b, and 26 to 32.

[0357] 26 to 32, in the active heat dissipation mechanism 1200 according to another embodiment of the present invention, the heat conduction panel bodies 1200-1 and 1200-2 can be formed by joining two separated metal panel members (similar to the joining process (S40) described below) to form the refrigerant flow space 1205. This is an operation in which a single metal panel member is bent and then joined, which differs from the active heat dissipation mechanism 200 according to an embodiment of the present invention in that it is manufactured using a different manufacturing method than the active heat dissipation mechanism 200 according to the present invention, which forms the refrigerant flow space 205.

[0358] The active heat dissipation mechanism 1200 according to this other embodiment of the present invention can be coupled to the rear portion of the heat dissipation housing main body 110 realized in the first installation example shown in Figures 4a and 5a, but will be described assuming that it is coupled to and installed on the rear portion of the heat dissipation housing main body 110 realized in the second installation example, as shown in Figures 4b and 5b, which includes a press-fit portion 150 shape that is compatible with the different shape of the press-fit end 201 side due to the differences in the manufacturing method described above.

[0359] As shown in Figures 26 to 29, a plurality of press-fit portions 150 are arranged vertically in the rear portion of the heat dissipation housing main body 110 realized in the second installation example, and a plurality of active heat dissipation mechanisms 1200 according to another embodiment of the present invention can be formed so as to be spaced apart in the left-right width direction.

[0360] In this way, when multiple active heat dissipation mechanisms 1200 according to another embodiment of the present invention are installed on the rear portion of the heat dissipation housing main body 110 realized in the second installation example, compared to the active heat dissipation mechanism 200 according to one embodiment of the present invention which is installed in a relatively "V" shaped pattern, the flow resistance of external air (outside air) is minimized in the vertical direction, allowing for smooth inflow of outside air, while the flow resistance to the rising air current caused by the heat emitted from each active heat dissipation mechanism 1200 is also minimized.

[0361] In addition, a single press-fit portion 150 may be arranged vertically long on the rear portion of the heat dissipation housing main body 110 realized in the second installation example, but it may be arranged so that it is divided into two or three sections vertically, taking into account the limitations of the liquid phase refrigerant dispersion force or rising force of the first refrigerant flow path 1210.In this case, a plurality of fixed heat dissipation fins 200F may be provided in the lower end section, which is an area with less need for heat dissipation.

[0362] The active heat dissipation mechanism 1200 according to another embodiment of the present invention, which is provided on the rear surface of the heat dissipation housing main body 110 realized in this second installation example, may also include a one-side heat conduction panel 1200-1 that forms one thickness-wise side of the refrigerant flow space 1205 after manufacturing by the joining process (S40), and an other-side heat conduction panel 1200-2 that forms the other thickness-wise side of the refrigerant flow space 1205 after joining.

[0363] Here, the first refrigerant flow path 1210 and the second refrigerant flow path 1220 may be formed symmetrically with respect to the joint surfaces of the one side thermal conduction panel 1200-1 and the other side thermal conduction panel 1200-2.

[0364] However, the first refrigerant flow path 1210 and the second refrigerant flow path 1220 provided on one side forming the one-side heat conduction panel 1200-1 and the other side forming the other-side heat conduction panel 1200-2 are not necessarily limited to being symmetrically formed, and do not exclude being asymmetrically formed as in several modified examples 200T-1 to 200T-2 of the active heat dissipation mechanism 200 according to one embodiment of the present invention shown in Figures 22a and 22b.

[0365] Meanwhile, in the active heat dissipation mechanism 1200 according to another embodiment of the present invention, the first refrigerant flow path 1210 is a portion where the liquid refrigerant is stored and held among the refrigerant filled in the refrigerant flow space 1205, and its upper and lower ends are arranged vertically in the direction of gravity, with the liquid refrigerant's water surface being located at least at the portion closest to the lower end of the upper and lower ends of the first refrigerant flow path 1210 described above.

[0366] The joining surface of the one-side thermal conduction panel 1200-1 and the other-side thermal conduction panel 1200-2 can be defined as the edge portion, which is the area where joining is possible, including both the press-in end portion 1201 corresponding to the evaporation area and the heat dissipation plate portion 1203 corresponding to the condensation area.

[0367] In other words, in the case of the active heat dissipation mechanism (200, etc.) according to one embodiment of the present invention, the portion joined by the joining process (S40) described below is the edge of the heat dissipation plate portion 203 excluding the press-fit end portion 201 side, which is the portion formed by the bending process (S20), and it should be made clear in advance that this differs in some respects from the joined portion of the active heat dissipation mechanism 1200 according to other embodiments of the present invention, which joins and seals two separated metal panel members.

[0368] More specifically, in the active heat dissipation mechanism 1200 according to another embodiment of the present invention, the heat conduction panel bodies 1200-1 and 1200-2 are joined at the edge portions of the one-side heat conduction panel 1200-1 and the other-side heat conduction panel 1200-2, and the first refrigerant flow path 1210 is formed inside one of the widthwise ends (the one end being the left end in reference to FIG. 26) of the edge portions, and a press-fit end 1201 is formed outside one of the widthwise ends (the one end) of the edge portions to be coupled to a press-fit portion 150 formed on the back surface of the heat dissipation housing main body 110, which is the heat dissipation target.

[0369] In addition, the heat conduction panel bodies 1200-1 and 1200-2 are formed by joining the edge portions of the one-side heat conduction panel 1200-1 and the other-side heat conduction panel 1200-2, and the second refrigerant flow path 1220 is formed inside one of the edge portions (the other end, which is the right end in reference to Figure 26) except for the press-fit end 1201 where the first refrigerant flow path 1210 is formed, among the one end and the other end in the width direction of the edge portions, and a heat dissipation plate portion 1203 for exchanging heat with the outside air can be formed outside the other (the other end) of the one end and the other end in the width direction of the edge portions.

[0370] 4b and 5b, an active heat dissipation mechanism 1200 according to another embodiment of the present invention is provided in a press-fit portion 150 that is vertically elongated and disposed on the rear surface of the heat dissipation housing body 110. Therefore, the outer ends of the press-fit end 1201 corresponding to the front end and the heat dissipation plate portion 1203 corresponding to the rear end can be parallel to each other.

[0371] Therefore, the technical feature mentioned in the description of the active heat dissipation mechanism (200, etc.) according to one embodiment of the present invention, that "among the multiple inclined guides 215, the first refrigerant flow path 210 is relatively positioned lower in the direction of gravity than the second refrigerant flow path 220," has even greater significance when defining the inclination formation direction of the second refrigerant flow path 1220 in the active heat dissipation mechanism 1200 according to another embodiment of the present invention.

[0372] In other words, the fact that the first refrigerant flow path 1210 is located lower in the direction of gravity than the second refrigerant flow path 1220 means that the portion of one end and the other end of the second refrigerant flow path 1220 corresponding to the outer end of the heat sink portion 1203 is formed at an incline so as to be located at a higher position in the direction of gravity than the portion corresponding to the press-fit end 1201 where the first refrigerant flow path 1210 is provided.

[0373] Furthermore, an active heat dissipation mechanism 1200 according to another embodiment of the present invention may further include an auxiliary absorber 301 for improving the absorption rate of the liquid refrigerant in the absorber 300, as shown in Figures 29 and 30.

[0374] Here, the auxiliary absorber 301 also plays a basic role of increasing the absorption rate of the absorber 300 itself, like the active heat dissipation mechanism 200 according to one embodiment of the present invention described above. However, if it extends further above the upper end of the heat dissipation housing main body 110 to cover the upper end portion of the heat dissipation housing main body 110, like the active heat dissipation mechanism 1200 according to another embodiment of the present invention, it can play a role in easily capturing and absorbing the liquid phase refrigerant that has condensed on the heat dissipation plate portion 1203 side corresponding to the upper side of the heat dissipation housing main body 110 at the upper end side of the absorber 300.

[0375] In the active heat dissipation mechanism 1200 according to another embodiment of the present invention, two auxiliary absorbers 301 (301-1, 301-2) may be further provided at two locations, one relatively at the upper side and one relatively at the lower side, as shown in Figures 29 and 30.

[0376] More specifically, the auxiliary absorber 301 can be fixedly installed in auxiliary absorber installation portions 1261, 1262 which are formed by deforming a portion of the second refrigerant flow path 1220 so as to have a wider width.

[0377] When two auxiliary absorbents 301 (see drawing reference numbers 301-1 and 301-2) are provided, it is natural that the auxiliary absorbent installation portions 1261, 1262 can also be formed in two locations corresponding to the respective positions of the auxiliary absorbents 301, as shown in Figure 30.

[0378] The auxiliary absorbent body 301 may include an upper auxiliary absorbent body 301-1 whose lower end is connected close to the upper end side of the absorbent body 300 described above, and a lower auxiliary absorbent body 301-2 whose lower end is connected close to the middle part of the absorbent body 300.

[0379] In addition, the upper auxiliary absorber 301-1 and the lower auxiliary absorber 301-2 may each be provided with a pair of auxiliary absorbers 301-1A, 301-1B, 301-2A, and 301-2B made of nonwoven fabric at auxiliary absorber installation portions 1261 and 1262 formed on one side thermal conduction panel 1200-1 and the other side thermal conduction panel 1200-2, respectively.

[0380] Meanwhile, the refrigerant flow space 1205 may be provided with a plurality of fixing ribs 1263 for stably fixing the auxiliary absorber 301, as shown in FIG.

[0381] The fixing ribs 1263 may be formed across the auxiliary absorbent body installation parts 1261, 1262 in the width direction, and both ends may be separately joined to the outer ends of the auxiliary absorbent body installation parts 1261, 1262 in the width direction by welding.

[0382] Here, the auxiliary absorber installation parts 1261, 1262 are formed in the shape of grooves that are processed from the inner surfaces of the one side heat conduction panel 1200-1 and the other side heat conduction panel 1200-2 to the outside, respectively, to further increase the thickness of the refrigerant flow space 1205. Gaps may be provided between the auxiliary absorber installation parts 1261, 1262 and the plurality of fixing ribs 1263, allowing the auxiliary absorber 301 to be inserted and fixed, and the auxiliary absorber 301 can be installed through these gaps.

[0383] Such a plurality of fixing ribs 1263 can prevent the auxiliary absorber 301 from coming off in the thickness direction of the refrigerant flow space 1205.

[0384] Meanwhile, the active heat dissipation mechanism 1200 according to another embodiment of the present invention is formed by joining two metal panel members, one heat conduction panel 1200-1 and the other heat conduction panel 1200-2, together in a state where their edge portions, including the portion corresponding to the press-fit end 1201, are in surface contact with each other. Furthermore, since the panels are made of SUS material with good elongation, they can be joined using a press-fit method in which they are restrainedly fitted into a plurality of press-fit portions 150 formed on the rear surface of the heat dissipation housing main body 110, as shown in FIG. 32.

[0385] In this case, it is preferable that the press-fitting is performed so that at least half of the portion corresponding to the first refrigerant flow path 1210 (or absorber 300) is positioned further inward than the outer ends of the pair of slot ribs 150a, 150b that form the press-fit portion 150, while including at least the butt-jointed edge portion.

[0386] As such, the active heat dissipation mechanism 1200 according to another embodiment of the present invention is made of SUS material with good elongation, and has the advantage that even if an absorber 300 made of a fibrous material such as nonwoven fabric, which is somewhat heat-sensitive, is provided on the first refrigerant flow path 1210 side, it can be firmly fixed to the back surface of the heat dissipation housing main body 110 using a simple connection method such as a press-fitting method without using a welding process.

[0387] Furthermore, when compared with the comparative example 200D shown in (b) of Figure 25, which is manufactured using the same joining method, the active heat dissipation mechanism 1200 according to another embodiment of the present invention can be expected to substantially improve heat dissipation performance due to the phase change of the refrigerant according to one embodiment of the present invention in that, even considering the same insertion thickness of the press-fit portion 150, the first refrigerant flow path 1210 can be installed close to the press-fit portion 150 while maintaining a first refrigerant flow path 1210 of at least 0.7T, which is obtained by subtracting a thickness of 0.3T (0.15T x 2) from the insertion thickness of 1T (0.5T x 2).

[0388] 12. Comparison of Experimental Data Between Comparative Examples and the Present Invention FIG. 33 shows a comparative graph (a) and a comparative diagram (b) comparing the temperatures of the heat generating element 140 in the active heat dissipation mechanism 200D according to the comparative example and the active heat dissipation mechanism 200 according to one embodiment of the present invention.

[0389] In order to confirm the heat dissipation performance of the active heat dissipation mechanism 200 according to one embodiment of the present invention, the applicant of the present invention installed active heat dissipation mechanisms according to the comparative example 200D and one embodiment of the present invention 200 in the same number or shape of press-fit portions 150 on the back of the same heat dissipation housing main body 110, and after mounting five heating elements 140 with an input power of 25W on the main board, obtained the temperature results of each heating element 140 as shown in Figure 33.

[0390] As shown in Figure 33, the temperature difference between the comparison example 200D and the embodiment 200 for each of the five heating elements 140 is a minimum of 0.2°C (see heating element 1) and a maximum of 2.1°C (see heating element 4), indicating that the heating element temperature of the active heat dissipation mechanism 200 according to one embodiment of the present invention is measured lower.

[0391] The result that the measured temperature of the heat generating element was relatively low, on the contrary, confirms that the heat dissipation performance of the active heat dissipation mechanism 200 according to one embodiment of the present invention is superior to that of the comparative example 200D.

[0392] FIG. 34 is a table showing the results of measuring the time it takes for two shaped RBFHP products (Roll Bonding Fin (292×115 and 310×90)) from the prior paper and an active heat dissipation mechanism (PTX (310×90)) according to one embodiment of the present invention to reach 50°C, 60°C, and 70°C, respectively. FIG. 35 is a graph comparing the temperature at each heat source (heat generating element) position for a general aluminum heat dissipation fin (AL6063_REF) that does not use a refrigerant, two products presumably the RBFHP from the prior paper (Roll Bonding Fin (292×115 and 310×90) and an active heat dissipation mechanism (PTX (310×90)) according to one embodiment of the present invention).

[0393] The test to obtain the results table of Figure 34 was conducted by immersing parts of two products with shape specifications from the previous paper and a prototype of the active heat dissipation mechanism 200 according to one embodiment of the present invention in a water tank that corresponds to the same heat source, and then obtaining the temperature rise time of the parts that were not immersed in the water tank.

[0394] However, in order to confirm that the above-mentioned results do not differ due to differences in the shape of the product itself, two shapes of RBFHP were selected from the previous paper, and a prototype of the active heat dissipation mechanism 200 according to one embodiment of the present invention was manufactured with the same shape (size) and measured.

[0395] As shown in Figure 34, the time required to reach a specific temperature for two RBFHP products from a previous paper made of the same aluminum material that utilize the phase change of a refrigerant is generally faster for the product with a shape that is longer than it is wide (Roll Bonding Fin, 310 x 90) than for the other product (Roll Bonding Fin, 292 x 115) (i.e., the time to reach 50°C is faster at 1 second, the time to reach 60°C is faster at 25 seconds, and the time to reach 70°C is faster at 36 seconds).

[0396] This is presumably due to the active diffusion of the gas phase refrigerant when the evaporation and condensation regions of the refrigerant are separated, but the condensation region is slightly separated from the evaporation region or is separated to some extent. Therefore, it can be an important indicator for slimming the front and rear thickness of the antenna device (or electronic device) in that it can reduce the size in the width direction to some extent.

[0397] Furthermore, when comparing the time it takes to reach each temperature between the two RBFHP products in the above-mentioned prior paper, an active heat dissipation mechanism according to one embodiment of the present invention (200, PTX, 310x90) and a product with the same shape and specifications (Roll Bonding Fin, 310x90), it can be seen that the target temperature is reached in a remarkably short time, as shown in Figure 32.

[0398] That is, in the case of the active heat dissipation mechanism (200, PTX, 310x90) according to one embodiment of the present invention, it took only 8 seconds to reach the maximum target temperature of 70°C, which is nearly 5 times faster than the time it took for the RBFHP Roll Bonding Fin, 310x90 specification product in the previous paper to reach the minimum target temperature of 50°C, and when compared to the same maximum target temperature, it was confirmed that it reached the maximum target temperature nearly 10 times faster.

[0399] This result proves that the active heat dissipation mechanism (300, PTX, 310x90) according to one embodiment of the present invention has much more active gas-liquid circulation within the refrigerant flow space than the RBFHP Roll Bonding, 310x90 product in the previous paper.

[0400] In other words, it is presumed that this is due to the fact that the active heat dissipation mechanism 200 according to one embodiment of the present invention has minimized the separation distance of the refrigerant flow space 205 (more specifically, the first refrigerant flow path 210), which actually dissipates heat, compared to the RBFHP products of the prior art. This is considered to be a good result that shows that the reduction in the separation distance between the liquid phase refrigerant among the refrigerants filled in the refrigerant flow space 205 and the heating element 140 can be a more realistic cause of improved heat dissipation performance due to the excellent thermal conductivity of the material of the metal panel member itself.

[0401] In this way, it is obvious that if the time required for the entire condensation zone, excluding the evaporation zone, to reach the target temperature is minimized, heat can be dissipated more quickly and with higher efficiency.

[0402] Meanwhile, the purpose of the test that derived the results of Figure 34 is to measure the temperature at each heat source (heat generating element) position of a heat dissipation part that is generally formed long in the vertical direction, such as an antenna device, and to confirm the suitability of the active heat dissipation mechanism (200, PTX, 310x90) according to one embodiment of the present invention for installation on an antenna device compared to a general aluminum heat dissipation fin (AL6063_REF) that does not use a phase change of a refrigerant and two products of specifications that are presumed to be RBFHPs in the previous paper (Roll Bonding Fin (292x115 and 310x90)).

[0403] To derive accurate results, as shown in Figure 35, heat sources (heat generating elements) with uniform power input (25W) were placed at five equal intervals above and below, and the above four products were used alternately as heat dissipation fins to dissipate heat.

[0404] As a result, as shown in Figure 35, in the case of a general aluminum heat dissipation fin product (AL6063_REF), compared to the two specifications of the Roll Bonding Fin (292x115 and 310x90) presumed to be RBFHPs in the previous paper, it was confirmed that the temperatures of the heat sources from the bottom to the third in the middle were relatively high, while the temperatures of the fourth heat source from the bottom and the top heat source were relatively low.

[0405] While it is difficult to pinpoint the exact cause of these results, it can be assumed that the two RBFHP products in the previous paper are more susceptible to the influence of rising air currents, which appear to be relatively hot outside air, at higher positions. As a result, it is not desirable from the perspective of heat dissipation performance to apply the RBFHP in the previous paper to the entire heat dissipation area that is long in the vertical direction, such as an antenna device, and it is preferable to design it so that it is arranged crosswise with the general aluminum heat dissipation fin (AL6063_REF) product mentioned above to achieve optimal performance at each position.

[0406] In contrast, the active heat dissipation mechanism (200, PTX, 310x90) according to one embodiment of the present invention exhibits good heat source temperature values ​​regardless of the height of the heat source, so it is natural that it has the advantage of being uniformly applicable to all heat dissipation areas that are formed long in the vertical direction, such as an antenna device.

[0407] As such, the active heat dissipation mechanism 200 according to one embodiment of the present invention overcomes recent international regulations and limitations on refrigerant use and selection, while providing the advantage of maximizing the heat dissipation performance of the product itself.

[0408] 13. Manufacturing method of one embodiment of the present invention and other embodiments FIG. 36 is a flowchart showing a method for manufacturing an active heat dissipation mechanism according to one embodiment of the present invention, and FIG. 37 is a flowchart showing a method for manufacturing an active heat dissipation mechanism according to another embodiment of the present invention.

[0409] A manufacturing method of an active heat dissipation mechanism according to an embodiment of the present invention includes a pressing process (S10) in which a single component, heat conduction panel bodies 200-1 and 200-2 made of a heat conductive material, are pressed together to form a first refrigerant flow path 210, a second refrigerant flow path 220, and a third refrigerant flow path 230, each recessed to a predetermined depth, as shown in FIG.

[0410] The pressing process (S10) can be defined as a process for manufacturing single thermal conduction panel bodies 200-1 and 200-2 having the same standards and specifications so that the above-mentioned first to third refrigerant flow paths 210 to 230 and the plurality of strength reinforcement portions 240 are symmetrically formed when they are mutually bent based on an arbitrary reference line T as shown in FIG. 12.

[0411] Meanwhile, a manufacturing method of an active heat dissipation mechanism according to one embodiment of the present invention may include, after a pressing process (S10), a bending process (S20) of bending one heat conduction panel 200-1 on one side in the width direction and the other heat conduction panel 200-2 on the other side in the width direction based on an arbitrary reference line T based on the first refrigerant flow path 210, and, after the bending process (S20), a joining process (S40) of joining edge portions corresponding to the heat dissipation plate portions 203 of the one heat conduction panel 200-1 and the other heat conduction panel 200-2 to a plurality of strength reinforcement portions 240 formed in the second refrigerant flow path 220 and the third refrigerant flow path 230.

[0412] Here, the joining process (S40) is performed for the purpose of sealing the refrigerant flow space 205 into which the refrigerant is filled, and since the press-in end 201 corresponding to the first refrigerant flow path 210 side is already sealed by the bending process (S20), it can be interpreted as a process of joining along the edge corresponding to the heat sink portion 203, as described above.

[0413] Meanwhile, the manufacturing method of the active heat dissipation mechanism according to the embodiments of the present invention may further include an absorber installation process (S30) before the joining process (S40), in which an absorber 300 that absorbs and moves the liquid phase refrigerant through capillary force is installed in the portion corresponding to the first refrigerant flow path 210 near the press-fit end 201.

[0414] In this case, the absorber 300 may be inserted through one of the openings at both longitudinal ends of the first refrigerant flow path 210 formed through the bending process (S20), and then the refrigerant is filled in through the refrigerant filling process (S50) described below, and then one of the open ends is sealed by a caulking operation to prevent leakage of the refrigerant inside.

[0415] More specifically, the absorber installation process (S30) is a process that is performed during the execution of the bending process (S20), and can be defined as a process of inserting the absorber 300 into the first refrigerant flow path 210 that has been partially formed before the bending process (S20) is completed.

[0416] That is, referring to the drawing shown in FIG. 12, in the bending process (S20), the one side heat conduction panel 200-1 and the other side heat conduction panel 200-2 are bent by a certain angle based on an arbitrary reference line T as shown in FIG. 12(b) to partially form the first refrigerant flow path 210, and then the absorber 300 is disposed in the portion where the first refrigerant flow path 210 is to be formed, and then an additional bending process (S20) as shown in FIG. 12(c) is performed, followed by the joining process (S40) as shown in FIG. 12(d).

[0417] At this time, once the bending process (S20) is completed, the absorber 300 can be stably fixed to the portion corresponding to the first refrigerant flow path 210 by the plurality of absorber fixing guides 250 formed in the portion of the first refrigerant flow path 210.

[0418] Thereafter, when the one-side heat conduction panel 200-1 and the other-side heat conduction panel 200-2 are joined along their edges through the joining process (S40) as described above, both longitudinal ends corresponding to one end and the other end of the press-fit end 201 constituting the first refrigerant flow path 210 are left open. One of the open ends may be caulked for a later evacuation process (not shown), which will be described later. After that, a refrigerant may be filled in a refrigerant filling process (S50), which will be described later. Then, the other open end, which is not caulked, may be sealed by a caulking operation to prevent leakage of the refrigerant inside. This may be described later in a caulking finishing process (not shown).

[0419] Furthermore, the manufacturing method of the active heat dissipation mechanism according to an embodiment of the present invention may further include, after the joining process (S40), a refrigerant filling process (S50) of filling a refrigerant through one or the other longitudinal end (i.e., either one of the open ends) of the first refrigerant flow path 210, and, after the refrigerant filling process (S50), a heat dissipation mechanism fastening process (S60) of installing the heat dissipation mechanism in the press-fit portion 150 of the heat dissipation housing main body 110 by a press-fitting method.

[0420] The refrigerant filling process (S50) can be performed through any one of the openings formed at one end and the other end (i.e., both ends) of the first refrigerant flow path 210 in the longitudinal direction, and after the refrigerant is filled, it can be completely sealed to prevent leakage of the refrigerant.

[0421] However, the manufacturing method of the active heat dissipation mechanism according to an embodiment of the present invention may further include a cleaning process (not shown) before the absorber installation process (S30) in which one of the openings formed at both ends of the first refrigerant flow path 210 is sealed by caulking and the refrigerant flow space is cleaned, and a vacuum process (not shown) after the cleaning process and before or after the refrigerant filling process (S50) in which the refrigerant flow space is vacuumized through one of the openings formed at both ends of the first refrigerant flow path that is not caulked.

[0422] Here, the cleaning process may be performed by sequentially immersing the active heat dissipation mechanism 200 according to an embodiment of the present invention in a deposition solution, an ultrasonic solution, a rinse solution, and a vapor degreasing solution, and finally drying the device to remove moisture. The evacuation process may be performed by either a process of pumping the inside of a device that generally operates by vacuum, filling the device with a refrigerant, heating and evaporating the refrigerant, and then evacuation again (a heating evacuation method), or a process of filling the device with a refrigerant, temporarily freezing (solidifying) the refrigerant, and then evacuation (a freezing evacuation method).

[0423] For reference, the former method of vacuuming, which involves filling (injecting) a refrigerant after creating a vacuum, is a method that utilizes the fact that a change in the degree of vacuum occurs when filling (injecting) a refrigerant, and that after first creating a high vacuum, the state changes to a low vacuum when the refrigerant is filled. Since it is a cheaper process, it can be mainly applied to mass production and manufacturing of low-cost products where price is more important than quality.

[0424] Furthermore, the latter method, which involves filling (injecting) a liquid refrigerant and freezing the liquid refrigerant, followed by a vacuum process, involves filling the liquid refrigerant after a primary vacuum, freezing it, and then performing a secondary vacuum. Although this method involves more complicated processes than the former method, it has the advantages of a fast reaction rate, minimizing NCG, and being advantageous for high-vacuum products that can increase Qmax. Furthermore, the freezing process of the liquid refrigerant reduces the vacuum equipment capacity and increases the vacuum pumping speed, making it suitable for small-lot production and the manufacture of high-value products.

[0425] Once the evacuation process is complete, a finishing caulking process (not shown) may be further included in which the remaining openings of the first refrigerant flow path 210 that were left uncaulked during the evacuation process are caulked.

[0426] In particular, in the active heat dissipation mechanism 200 according to one embodiment of the present invention, as shown in FIG. 13, a portion of the press-fit end 201 corresponding to one end and the other end of the first refrigerant flow path 210 is protruded further outward to form one-side caulking end 207a and another-side caulking end 207b. During the caulking operation and the caulking finishing process performed after the above-mentioned joining process (S40), the open portion is sealed using a predetermined caulking member made of an elastic material, and the protruding portion is crimped using a crimping caulking tool (not shown) to completely seal it. After that, the crimped portion is cut and removed to perform the caulking operation.

[0427] Furthermore, the manufacturing method of an active heat dissipation mechanism according to one embodiment of the present invention may further include at least one of a leak test process (not shown) for testing whether or not the refrigerant leaks after the caulking finishing process, a performance test process (not shown) for finally testing the performance of the active heat dissipation mechanism 200 of the present invention, and a reliability test process for testing the reliability of the active heat dissipation mechanism 200 of the present invention.

[0428] Meanwhile, although not shown in the drawings, the manufacturing method of the active heat dissipation mechanism according to one embodiment of the present invention may further include a coating process (not shown) of coating a hydrophobic coating material on one surface of the thermal conduction panel bodies 200-1, 200-2 that form the refrigerant flow space 205 through which the refrigerant filled by the refrigerant filling process (S50) flows, before the bending process (S20) (or the absorber installation process (S30)).

[0429] Here, we assume that the refrigerant is water (distilled water) and the explanation is limited to a hydrophobic coating material as the raw material for the coating layer, but it goes without saying that hydrophilic coating materials can be used depending on the type of refrigerant used or the refrigerant flow path.

[0430] Meanwhile, as shown in FIG. 37, the manufacturing method of the active heat dissipation mechanism 1200 according to another embodiment of the present invention can differ from the manufacturing method of the active heat dissipation mechanism (200, etc.) according to one embodiment of the present invention, which includes the above-mentioned bending process (S20), as follows.

[0431] That is, a manufacturing method of an active heat dissipation mechanism 1200 according to another embodiment of the present invention may include a pressing process (S10) in which two separated metal panel members are pressed together to form refrigerant flow spaces each having a first refrigerant flow path 1210 and a second refrigerant flow path 1220 at a predetermined depth, a joining process (S40) in which, after the pressing process (S10), the heat conduction panel bodies 1200-1 and 1200-2 made of the two separated metal panel members are joined along their edges to simultaneously form refrigerant flow spaces corresponding to the first refrigerant flow path 1210 and the second refrigerant flow path 1220, and a refrigerant filling process (S50) in which refrigerant is filled into the refrigerant flow spaces.

[0432] In a manufacturing method of an active heat dissipation mechanism (200, etc.) according to one embodiment of the present invention, a press process (S10) is performed using a single metal panel member to form a refrigerant flow space having a first refrigerant flow path 210 and a second refrigerant flow path 220, and the edge portions, excluding the press-fit end portion 201 formed through the bending process (S20), are manufactured in a state that allows them to be joined in the subsequent joining process (S40).

[0433] In contrast, in a manufacturing method of an active heat dissipation mechanism 1200 according to another embodiment of the present invention, two separated metal panel members are each formed from sheet metal through a pressing process (S10) to form the portions corresponding to the first refrigerant flow path 1210 and the second refrigerant flow path 1220 along with their outer edge portions, and then the edges of the two separated metal panel members can be immediately joined using a joining process (S40) without the above-mentioned bending process (S20).

[0434] Of course, it can be said that in the manufacturing method of the active heat dissipation mechanism 1200 according to other embodiments of the present invention, an absorber installation process (S30) of providing an absorber 300 or an auxiliary absorber 301 can be carried out before the bonding process (S40).

[0435] Furthermore, when the active heat dissipation mechanism 1200 according to another embodiment of the present invention is provided with a plurality of strength reinforcement portions 1240, the joining process (S40) may be interpreted as a concept including a process of joining the edge portions of two separated metal panel members in a predetermined manner while simultaneously joining the plurality of strength reinforcement portions 1240 to each other.

[0436] However, in the manufacturing method of the active heat dissipation mechanism 1200 according to other embodiments of the present invention, it is natural that one end and the other end of the part corresponding to the press-fit end 1201 are formed to be open in order to carry out the cleaning process and vacuum process that are performed after the joining process (S40), and then the caulking finishing process can be performed.

[0437] According to the active heat dissipation mechanism 200, 1200 of the embodiments of the present invention having such a configuration, heat transfer and heat release are performed through the active phase change of the refrigerant filled inside, thereby overcoming the material limitations of the heat sink fins themselves that perform conventional heat dissipation and achieving higher heat dissipation performance, thereby providing the advantage of significantly improving the performance of antenna devices or similar electronic devices.

[0438] The above describes in detail an embodiment of an active heat dissipation mechanism according to the present invention with reference to the accompanying drawings. However, the present invention is not limited to the above embodiment, and it is obvious that various modifications and equivalent implementations are possible by those skilled in the art. Therefore, the true scope of the present invention is determined by the claims set forth below.

[0439] The present invention provides an active heat dissipation mechanism that can actively transfer heat generated from a heat-generating device (e.g., electronic device) through a phase change of a refrigerant, which is more effective than the heat conduction properties of the refrigerant itself, thereby improving heat dissipation performance. [Explanation of symbols]

[0440] 100: Antenna device 110: Heat dissipation housing body 200: Active heat dissipation mechanism 200-1: One-sided heat conduction panel 200-2: Other side heat conduction panel 201: Press-fit end 203: Heat sink portion 205: Refrigerant flow space 207a, 207b: Caulking end 208F: Fixed joint 210: First refrigerant flow path 215: Inclined guide 220: Second refrigerant flow path 230: Third refrigerant flow path 240: Multiple strength reinforcement parts 241: Line reinforcement part 242: Dot reinforcement part 250: Absorbent body fixing guide 300: absorbent body 301: auxiliary absorbent body 301-1: Upper auxiliary absorbent body 301-2: Lower auxiliary absorbent body 1200: Active heat dissipation mechanism 1261, 1262: Auxiliary absorber installation section 1263: Multiple fixed ribs T: Arbitrary reference line S10: Pressing process S20: Bending process S30: Absorber installation process S40: Joining process S50: Refrigerant filling process S60: Heat dissipation mechanism fastening process

Claims

1. The heat transfer panel body includes a refrigerant flow space in which a refrigerant is filled and flows by bending or joining at least one metal panel member, The refrigerant flow space is a first refrigerant flow path that is located adjacent to a press-fit portion provided on a rear surface of a heat-dissipating housing main body, which is a heat dissipation target, and that forms an evaporation region in which the refrigerant changes from a liquid phase to a gas phase; a plurality of second refrigerant flow paths provided in a condensation region formed at another portion of the first refrigerant flow path and directing a flow of liquid-phase refrigerant to the evaporation region; Equipped with The second refrigerant flow path protrudes into the refrigerant flow space, and faces that contact each other are in surface contact with each other. The second refrigerant flow path has a plurality of inclined guides that are provided in a linear shape inclined toward the first refrigerant flow path for physical separation from the adjacent second refrigerant flow path, and a plurality of strength reinforcement portions formed on each of the plurality of inclined guides, forming independent flow paths for the liquid refrigerant.

2. 2. The active heat dissipation mechanism of claim 1, wherein the plurality of strength reinforcement portions are provided as linear reinforcement portions, and one of the ends that contacts the first refrigerant flow path is always located lower than the other end in the direction of gravity.

3. 2. The active heat dissipation mechanism of claim 1, wherein the plurality of strength reinforcement portions protrude onto the refrigerant flow space so as not to contact each other in the thickness direction, and are formed on the plurality of inclined guides that define the space of adjacent second refrigerant flow paths.

4. 4. The active heat dissipation mechanism according to claim 3, wherein the plurality of strength reinforcing portions are formed to protrude further toward the refrigerant flow space than the plurality of inclined guides.

5. When the heat conduction panel body is disposed vertically or tilted with respect to at least the direction of gravity with respect to the heat dissipation housing main body in which the press-fit portion is formed, 2. The active heat dissipation mechanism of claim 1, further comprising a fixing joint formed at an outer corner of a lower end of the heat conduction panel body relative to a gravity direction, the fixing joint reducing the refrigerant flow space.

6. 6. The active heat dissipation mechanism according to claim 5, wherein the fixed joint is formed by joining the plurality of strength reinforcing portions and mutual surface contact portions simultaneously.

7. the first refrigerant flow path is further provided with an absorber having a predetermined absorption rate, 6. The active heat dissipation mechanism of claim 5, wherein the uppermost water surface of the liquid phase refrigerant among the refrigerants absorbed in the absorber is moved upward in proportion to the area occupied by the fixed joint, based on the direction of gravity.

8. the first refrigerant flow path is further provided with an absorber having a predetermined absorption rate, The active heat dissipation mechanism according to claim 5 , wherein the area occupied by the fixed joint is set in consideration of the absorption rate of the absorber.

9. The heat conduction panel body is a heat conduction panel that forms one side of the refrigerant flow space; an other heat conduction panel forming another side of the refrigerant flow space; Equipped with 2. The active heat dissipation mechanism of claim 1, wherein the second refrigerant flow path is defined by the plurality of inclined guides and the plurality of strength reinforcement portions, which are symmetrically formed on the one-side heat conduction panel and the other-side heat conduction panel, respectively, and are protruded to be in surface contact with each other above the refrigerant flow space.

10. The active heat dissipation mechanism according to claim 9 , wherein the second coolant flow path is defined as a space between adjacent ones of the plurality of reinforcement portions.

11. 10. The active heat dissipation mechanism according to claim 9, wherein the second refrigerant flow path is defined as a space in the thickness direction of the refrigerant flow space, and adjacent second refrigerant flow paths are separated by the plurality of strength reinforcing portions.

12. 10. The active heat dissipation mechanism according to claim 9, wherein the refrigerant flow space is formed by joining a single metal panel member after bending, or by joining two metal panel members.

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