Temperature detection device

Abstract

A temperature sensing device for an induction cooktop and a method for assembling the temperature sensing device are described. An exemplary temperature sensing device includes a sensor package containing one or more sensors, a plunger assembly configured to hold the sensor package, and a support base configured to provide a physical support for the plunger assembly.

Description

Technical Field

[0001] Cross - Reference to Related Applications This application claims the benefit and priority under 35 U.S.C. § 119 to U.S. Provisional Patent Application No. 63 / 486,632, filed on February 23, 2023, entitled "TEMPERATURE SENSING DEVICE", which is hereby incorporated by reference in its entirety.

[0002] The present disclosure generally relates to temperature sensing devices, and more particularly to methods and devices for accurately sensing the temperature of any cooking appliance made of different types of materials.

Background Art

[0003] In related technologies, there are several existing induction heating cookers (IH cookers) that utilize temperature sensing for heating control. However, existing IH cookers are often limited by variations in the types of cooking appliances used. At the same time, since temperature measurement varies depending on the type of material, inconsistent results are generated from related temperature sensors.

[0004] Accurate measurement of the temperature of a cooking appliance is essential for accurate temperature control of the cooking appliance being used. Accurate measurement of the rate of change of the temperature of a cooking appliance is essential for safety (e.g., preventing temperature rise during startup or in an empty cooking appliance) and for reducing overshoot of the set temperature and minimizing temperature fluctuations (i.e., to know the amount of electrical power required to change the temperature by a certain amount).

[0005] Therefore, there is a need for a temperature sensing device that can provide accurate and precise temperature measurements for controlling the temperature of a cooking appliance while operating widely with different types of materials and working with a minimum time lag (i.e., the time from reaching the desired temperature until the temperature sensor or system reaches this temperature).

Summary of the Invention

[0006] To address the aforementioned shortcomings, a temperature sensing device for an induction cooktop and a method for assembling the temperature sensing device are described. In a particular example, the temperature sensing device includes a sensor package containing one or more sensors, a plunger assembly configured to hold the sensor package, and a support base configured to physically support the plunger assembly.

[0007] The above features and other preferred features, including various novel details of embodiments and combinations of elements, are described in more detail hereby with reference to the accompanying drawings and are pointed out in the claims. It will be understood that certain methods and apparatus are shown only as examples and not as limitations. As will be understood by those skilled in the art, the principles and features described herein may be used in a variety of numerous embodiments.

[0008] Various embodiments in accordance with this disclosure will be described with reference to the drawings. [Brief explanation of the drawing]

[0009] [Figure 1] This shows exemplary sensor response time and time constant response to a stepwise change in temperature according to one embodiment. [Figure 2] This shows an exemplary thermal response of an aluminum pot to input power according to one embodiment. [Figure 3] An exemplary configuration for arranging a temperature sensor subsystem inside a stove, according to one embodiment, is shown. [Figure 4A] A cross-sectional view of an exemplary architecture of a temperature sensor subsystem according to one embodiment is shown. [Figure 4B] Figure 4A shows a cross-sectional view of an exemplary architecture of a temperature sensor subsystem according to one embodiment. [Figure 5] An exploded view of an exemplary plunger assembly according to one embodiment is shown. [Figure 6] An exemplary support base and additional sensors according to one embodiment are shown. [Figure 7]An exemplary electronic device included in a temperature sensor subsystem according to one embodiment is shown. [Modes for carrying out the invention]

[0010] The drawings and the following description relate only to some embodiments. Those skilled in the art will readily recognize from the following considerations that alternative embodiments of the structures and methods described herein are feasible alternatives that can be employed without departing from the principles described herein.

[0011] Next, specific embodiments will be referenced in detail, with examples shown in the accompanying drawings. Note that, where applicable, similar or identical reference numerals may be used in the drawings to indicate similar or identical functions. The drawings represent embodiments of sensor designs disclosed for illustrative purposes only. Those skilled in the art will readily recognize from the following discussion that alternative embodiments of the structures and methods described herein can be employed without departing from the principles described herein.

[0012] In general, accurately and precisely measuring the temperature of cooking utensils is essential to prevent overheating and undercooking in food preparation. One of the challenges in achieving precise temperature measurement lies in the numerous containers used in cooking utensils. For example, the material of the cooking utensil, as well as its dimensions such as thickness and size, affect the heating and temperature measurement process.

[0013] In addition to accurate and precise temperature measurement, response time is also a crucial element for proper temperature control. Response time is important for the performance of the control loop, and especially for the safety of the cooking system during the initial heating phase to the set temperature of an unknown cookware. The response time of a cookware sensor generally refers to the time required to detect a 99.3% (or near-99.3%) stepwise change in temperature. For contact sensors such as thermocouples (TCs), resistance temperature detectors (RTDs), and thermistors, measurement is generally performed by immersing the sensor in boiling water and recording the time (which may be five times) it takes to reach 99.3% of the signal. Figure 1 shows an exemplary sensor response time and time constant response to a stepwise change in temperature according to one embodiment.

[0014] In the case of photodiode sensors, the response time is limited by the rate at which charge accumulates within the semiconductor. Because photodiodes have a short response time, they are suitable for detecting rapid temperature changes, but because they depend on emissivity, they require either a known emissivity coating on the cookware or a means where the absolute temperature is unknown until the sensor, such as a contact sensor, is calibrated.

[0015] Despite the relatively slow response times of contact sensors (e.g., TCs, RTDs, thermistors), these sensors may be oversampled (e.g., sampled at a rate exceeding the Nyquist rate), and their dynamic response may be measured. A model of the contact sensor may be used to estimate the actual temperature from a few samples. The rate of change of the sensor temperature may be determined by the delay of the nominal sampling rate (e.g., twice the minimum reading may be required to determine the slope), or it may be determined immediately by implementing an analog differentiator.

[0016] IH cooktop controllers may have different, and somewhat contradictory, performance priorities for different operating states. Specifically, the nominal cooktop operation can be divided into two distinct stages: (1) initial heating of an unknown cookware to the set temperature, and (2) maintaining the temperature of a known cookware at the set temperature.

[0017] Under the initial heating phase, the goal is to bring a cookware with an unknown heat capacity to a set temperature as quickly as possible in a safe and controlled manner. This is the first stage of the control loop, starting after the user inputs the set temperature and ending when the cookware approaches that temperature. The challenge at this stage is that the heating time may be too short because the system does not have information about the heat capacity or other physical properties of the cookware. At this stage, response time (or time constant) is more important than precision to avoid dangerous situations such as the spontaneous combustion of canola oil, which can occur in as little as 1.2 seconds in an aluminum pot with a thin wall thickness (e.g., 1 mm wall thickness, with an input power of, e.g., 10 kW).

[0018] Figure 2 shows an exemplary thermal response of a cooker to a 10 kW input power according to one embodiment. In the figure, the Y axis represents temperature (°K) and the X axis represents time (seconds). At the end of the initial heating stage, the temperature of the cooker may be at or near the setpoint, and the system may have data or knowledge regarding the thermal response of the cooker to the power input at this point.

[0019] The temperature maintenance phase aims to maintain the temperature of the cooking appliance at the setpoint as accurately as possible in a safe and controlled manner. This is the second phase of the control loop and begins when the cooking appliance reaches or is close to the setpoint. It is also the main operating phase of the stove. Accuracy is more important than detection speed at this phase. This is because the stove already has information about the cooking appliance's thermal response to the power input and can modulate the supplied power to maintain the temperature at the setpoint. During the temperature maintenance phase, power regulation is more important than in the initial heating phase, where the best performance (fastest heating) is achieved by supplying the cooking appliance with full power.

[0020] Several options are available to modulate the power supplied to cooking appliances. - Modulate the amplitude of coil excitation at the nominal frequency (i.e., the frequency labeled on the oscillator's output). This technique provides the highest resolution control over power and does not require additional characterization of the cooking appliance. Possible solutions to this technique include variable amplifier architecture and amplifier heat dissipation. - Power is supplied to the cooking appliance at the nominal frequency and with a 100% amplitude duty cycle control by pulse width modulating the power switch. Possible solutions to this technique include the switching speed of the power electronics, the heat dissipation of the switch, and the remaining electromagnetic shielding (EMI shielding) of the system from switching transient events. - Modulate the frequency of coil excitation at 100% amplitude to effectively modulate the skin depth of power transfer to the cooking appliance. In this technique, the coil can be driven at 100% power. In this technique, some characterization of the cooking appliance's thermal response to various frequencies may be required, which may be performed as part of the initial heating stage.

[0021] Sensor architecture A temperature sensing system is disclosed herein. In one embodiment, the temperature sensing system can be part of a stove element that supplies a large amount of power (and thus is also referred to as the "temperature sensor subsystem" of an IH stove). In some embodiments, the temperature sensor subsystem can be used to control the cooking appliance to an accurate temperature with a very high rise rate and a very low lag. The temperature sensor subsystem may be disposed at the center of the stove coil within the IH stove, thereby enabling the temperature sensor included in the subsystem to consistently contact the cooking appliance disposed on the stove element. The temperature sensor may sometimes also be referred to throughout this specification as a "contact sensor". In some embodiments, the temperature sensor subsystem can automatically detect whether a cooking appliance is placed on the stove element to determine whether to operate the temperature sensor subsystem. If the stove is accidentally turned on when no cooking appliance is placed on the stove element, the power output from the temperature sensor subsystem and the main coil may not operate for safety reasons.

[0022] In some exemplary embodiments, the temperature sensor subsystem may be actively driven by utilizing an internal heater within the sensor subsystem itself. In one example, the sensor disclosed herein may be a self-heating flow sensor that uses an internal heater within the flow sensor itself to generate heat. Here, the flow sensor is a transducer that generates an electrical signal proportional to the total velocity applied to the surface of the sensor. In some embodiments, this actively driven approach combines the rapid response time of the temperature differential approach for sensing with the accuracy of a contact sensor having a small thermal time constant that is in direct contact with the cooking appliance. In an exemplary application, during the preheating stage of the contact sensor, when the user enters the temperature setpoint of the IH cooker, the contact sensor may be rapidly heated to that setpoint by a control system utilizing a proportional integral derivative (PID) control loop. Since the thermal response of the contact sensor is known, the heating can be performed rapidly and safely. During operation, the contact sensor may be in contact with the cooking appliance, and a certain amount of stable (short-term) electrical power may be provided to maintain the contact sensor at the target temperature due to environmental losses.

[0023] During the heating stage of the cooking appliance, when the contact sensor stabilizes at the set temperature, the high-power cooker coil for heating the cooking appliance can be turned on at 100% power. The temperature of the cooking appliance can increase linearly with a gradient dependent on the heat capacity. When the cooking appliance reaches the contact sensor temperature, the coil controller can cut off the power and stop the heating process in the cooking appliance. The trigger for this power cut-off may be, in some cases, not the absolute temperature of the contact sensor (which is limited by its response time), but the direction of the heat flux to the contact sensor (which can change as soon as the cooking appliance exceeds the temperature of the contact sensor). Here, the heat flux refers to the flow of thermal energy. Two exemplary methods for measuring the heat flux are - Intermittently cut off power to the sensor heater and observe the rate of temperature change. The cookware is at the set temperature when the rate of change switches from negative (the sensor is heated by the sensor's internal heater) to positive (the sensor is passively heated by contact with the pot). A control sensor, which has the same shape as the contact sensor but is thermally insulated from the cookware, may be used as the other end of a differential measurement to eliminate environmental influences. - Monitor the commanded power output of the sensor controller. The cooking appliance is in the sensor temperature state when the commanded power switches from positive to negative. The control system may account for heat flux leakage into the environment. This is a function of the system implementation and may vary further between individual devices. Calibration may be required.

[0024] By detecting the change in heat flux to the contact sensor at a set temperature, rather than the absolute temperature of the cooking appliance, the problem of thermal lag due to the contact resistance and heat capacity of the contact sensor can be avoided. Determining the heat flux may require at least two samples, and therefore the sensor's sampling rate can be maximized during this operational phase.

[0025] During the cooking phase, once the temperature of the cooking utensil stabilizes at the temperature of the contact sensor, the heater power to the contact sensor is turned off, and it becomes a passive contact sensor. Since the temperature does not change rapidly during the cooking operation phase, the response time of the contact sensor is not very important. The contact sensor can sample slowly (e.g., on the order of 2 Hz), and the coil controller can maintain the temperature of the cooking utensil at the set value using a conventional PID loop or other control mechanism.

[0026] It should be noted that the above description is merely an example of several exemplary embodiments, and the temperature sensor subsystems disclosed herein are not limited to these embodiments and other different embodiments can be implemented.

[0027] Several features Hereinafter, the following are some identified features of the disclosed temperature sensor subsystem (or contact sensor) and associated induction cooktop. Physical characteristics: - The sensor package (i.e., the temperature sensor and any nearby accessories such as the sensor cap) is in contact with the bottom surface of the cookware. - The sensor can be displaced vertically and at a slight angle to maintain contact with cookware of various sizes and shapes across a range of physical placements on the cooking surface. - The sensor package is thermally isolated from the stove element with a minimum resistance of a predefined value. Safety / Performance Features: - The sensor can detect the position of cooking utensils, so it will not activate when it is not in contact with a pot. - The upper surface of the contact sensor can withstand continuous contact with the container at temperatures exceeding 250°C. - Other components of the contact sensor (excluding the top surface) can withstand temperatures exceeding 100°C. User interaction features: - The movable and fixed stove components are easy to clean and do not trap food particles. - Exposed components (sensor caps, sliding lamps, etc.) are scratch-resistant to prevent scratches on the surface of cooking utensils. Features related to assembly / manufacturing: - The sensor package requires minimal calibration per unit. - The contact sensor can be verified before being installed on the stovetop. - The range of fastener types and sizes is kept to a minimum. - The use of adhesives is minimal, and the adhesives used can withstand specific temperatures (e.g., temperatures above 100°C). - The sensor assembly methodology allows for the repair and replacement of components.

[0028] Mechanical design and integration Figure 3 shows an exemplary induction cooktop 300 including an embedded temperature sensor subsystem (TSSY) 310 according to one embodiment. As shown, the temperature sensor subsystem 310 may be located in the center of the cooktop coils 320 within the induction cooktop 300. Here, the temperature sensor included in the temperature sensor subsystem 310 is in consistent contact with the cookware, regardless of its placement on the cooktop elements. The induction cooktop 300 may have a glass surface 330, which may be made of low thermal expansion glass ceramic. As shown in the figure, in some embodiments, the induction cooktop 300 may include a set of control switches 340, the number of which may correspond to the number of cooktop coils 320. The control switches may allow the user to control each cooktop coil 320 to turn on / off and / or set to a specific temperature or heating level. Although four cooktop coils 320 are shown in Figure 3, in actual use, there may be any number of cooktop coils 320 in the induction cooktop 300. Different stove coils 320 may have the same or different sizes. Furthermore, although each stove coil 320 in Figure 3 is shown to have the TSSY 310 disclosed herein, in actual applications, one or more stove coils 320 may not have the associated TSSY 310.

[0029] Furthermore, while the TSSY310 is shown as being positioned at the center of the stove coil, it should be noted that this disclosure is not limited to such a configuration. In practical applications, the TSSY may be positioned at any possible location. Also, while the TSSY310 is shown as being integrated with the stove coil, this disclosure is not limited to such a configuration. In some embodiments, the TSSY310 may be part of a remote sensing system.

[0030] As will be explained in more detail later, when no cookware is placed, the contact sensor contained in the TSSY310 may be pushed up to a horizontal plane on the surface of the stove element by a spring located below, as can be seen further in Figure 4A. When part of the cookware is placed on the stove element, the weight of the cookware loads the contact sensor, causing it to move to a lower level (for example, to keep the top surface of the TSSY coplanar with the surface of the stove element). The pressing force from the spring below allows the contact sensor in the TSSY310 to consistently contact the bottom surface of the cookware. The specific structure of the TSSY310 will be explained in more detail with reference to Figures 4A-6.

[0031] Figures 4A and 4B show different cross-sectional views of an exemplary TSSY310 according to one embodiment. As shown in the figures, the TSSY310 includes a temperature sensor package 402 located at the top center of the temperature sensor subsystem 310. The sensor package 402 includes one or more contact sensors 404, the contact sensors 404 may be further packaged and protected by a sensor cap 406. The sensor cap 406 may be a circular cap and may have the shape of a typical glass bottle cap, except that the bottom edge of the cap extends as a lip. As shown in Figures 4A and 4B, the lip portion of the sensor cap 406 may be further held by a sliding inclined portion 408, which allows the sensor cap 406 to tighten onto the sensor package 402. In some embodiments, the sensor cap 406 may be a metal cover configured to adhere strongly to the contact sensor(s) 404. The upper metal cover of the sensor cap 406 may be made flat with filled edges to provide a more stable bond. In one embodiment, the metal cover may be a thin sheet of non-ferrous metal having the lowest thermal mass, such as stainless steel 316.

[0032] The sliding inclined portion 408 may have a conical shape at the top and a large recess at the bottom of its outer surface (i.e., the surface facing away from the sensor package 402). The inclination of the conical top may vary and have an angular range between 20 and 70 degrees (or another value less than 20 degrees or greater than 70 degrees). The recess at the bottom of the sliding inclined portion 408 may be curved and rounded, and may have a shape that matches the upper edge of the molded elastic diaphragm (or gasket) 410, as seen in Figures 4A and 4B. The inner surface of the conical portion of the sliding inclined portion 408 (i.e., the surface facing the sensor package 402) may have a recess for clamping the lip portion of the sensor cap 406. Below the recess, a set of female threads may be configured along the inner surface of the sliding inclined portion 408, as shown in Figures 4A and 4B.

[0033] In some embodiments, one or more auxiliary sensors 412 may also be included below the sensor package 402. The auxiliary sensors may have different functions. In one embodiment, the auxiliary sensor may be configured to detect changes in heat flux as described above. In some embodiments, the auxiliary sensor 412 may be located inside the chamber portion of the sensor holding unit 414, as shown in Figures 4A and 4B. The sensor holding unit 414 may also provide physical support to the upper sensor package 402. Furthermore, the sensor holding unit 414 may have a central hollow portion through which cables or wires for the contact sensor(s) 404 and auxiliary sensor(s) 412 may pass to connect to a power supply unit and / or a control unit (not shown).

[0034] As shown in Figures 4A and 4B, in some embodiments, the outer surface of the sensor holding unit 414 (i.e., the surface facing the inside of the sliding inclined portion 408) may also have a set of threads, the set of threads may be sized and shaped to match the threads of the sliding inclined portion 408. Including threads along the inner surface of the sliding inclined portion 408 and threads along the outer surface of the sensor holding unit 414 allows for a better seal between the sensor holding unit 414 and the sliding inclined portion 408, thereby preventing the ingress of liquids, food or environmental contaminants into the sensor package 402 and / or auxiliary sensor(s) 412. O-rings or other sealing mechanisms may also be included between the sliding inclined portion 408 and the sensor cap 406.

[0035] In some embodiments, the diaphragm assembly may be configured to allow free movement of the temperature sensor package and the sliding inclined portion 408 while protecting internal components from impacts of liquids, food, or environmental contaminants. Briefly, the elastic diaphragm described herein may be a silicon elastic diaphragm that provides a watertight seal between the movable sensor package and the static glass or ceramic stove. As shown in Figures 4A and 4B, the diaphragm assembly may include, among other components, an upper collar 420, a lower collar 422, an O-ring 424, and an elastic diaphragm 410. In some embodiments, the upper collar 420, the lower collar 422, the O-ring 424, and the elastic diaphragm 410 may have a circular shape, as well as certain other components included in the TSSY310.

[0036] As shown in Figures 4A and 4B, the elastic diaphragm 410 may have vertical positioning ends molded to match the inner surface of the upper collar 420. The positioning ends may be fixedly attached to the inner surface of the upper collar 420, for example, by using adhesive or by overmolding two separate materials. The expanded portion of the elastic diaphragm 410 does not need to be flat and may rather be molded to have a corrugated shape, as seen in Figures 4A and 4B. The corrugated shape of the diaphragm 410 can provide more space for stretching and thus can provide flexibility that allows the sensor package 402 and the sliding inclined portion 408 to move freely along the vertical direction. Furthermore, the concave portions of the corrugated shape of the diaphragm 410 can also accommodate small amounts of liquid, food, or environmental contaminants if they get mixed in during cooking.

[0037] In some embodiments, the elastic diaphragm 410 may be configured to seal the movable sensor package in a manner that allows the seal to be removed during repair. This makes it possible to clean the system while maintaining its waterproofness and to repair internal components without damaging the temperature sensor subsystem.

[0038] The O-ring 424 may be positioned along a recess formed in the upper part of the outer surface of the upper collar 420. Below the recess, the outer surface of the upper collar 420 may further include a set of threads, which may coincide with a set of threads formed along the inner surface of the lower collar 422, as seen in Figures 4A and 4B. The upper collar 420 and the lower collar 422 can form a collar assembly because their threads coincide. The O-ring 424 can further seal the collar assembly to the glass 426, thereby preventing liquids, food, or environmental contaminants from entering the stove.

[0039] As described elsewhere in this specification, the temperature sensor subsystem 310 disclosed herein further includes a plunger 430 for holding a sensor package 402 and auxiliary sensors 412. The sensor package 402 and auxiliary sensors 412 may be attached to the plunger 430 via a flexible bumper 432. The flexible bumper 432 has a top, a neck, and a bottom, as seen in Figures 4A and 4B. The top may have a flat surface that provides support for the sensor holding unit 414. The bottom may be shaped to coincide with the circular hollow portion at the top of the plunger 430. The flexible bumper 432 may also include a central hollow portion that allows wires or cables for the sensors to pass through. The flexible bumper 432 may allow the sensor package 402 to automatically align with the bottom surface of a cookware. A specific structure of the plunger 430 is further described in Figure 5.

[0040] Figure 5 shows an exploded view of a plunger assembly according to one embodiment. As shown, the plunger assembly includes a plunger 430, a plunger support 442, and a spring 434 positioned between the plunger 430 and the plunger support 442. The temperature sensor subsystem also includes a support base 440, which may be molded together with the plunger support 442 as a single piece. The plunger 430 may include an inner row portion and an outer cap portion positioned on one side (e.g., the top). During assembly, at least a portion of the spring 434 (e.g., the top) may be held between the inner portion and the outer cap portion of the plunger 430. As shown in Figure 5, there are several projections 446 along the bottom edge of the cap portion of the plunger 430, which extend outward. During assembly, these projections 446 may pass through openings or slits 444 positioned along the side of the plunger support 442. The opening 444 of the plunger support 442 may be closed by the upper edge of the opening 444 when the projection 446 is assembled, thus restricting the minimum and maximum vertical movement of the plunger. The driving force for moving the plunger 430 along the vertical direction may include the upward force from the spring 434 and the downward force when the cookware is loaded onto the stove element.

[0041] The number of projections 446 and openings 444 is not limited to three, as shown in Figure 5, but may be a different number. The shape and size of the openings may also vary and are not limited in this disclosure.

[0042] It should also be noted that in some embodiments, the plunger assembly may not be movable. In such circumstances, the spring does not need to be included in the plunger assembly, and certain structural modifications may be further made to the plunger support and the plunger itself to eliminate the spring that controls the movement. Furthermore, if the plunger assembly is not movable, the top surface of the temperature sensor subsystem is not necessarily on the stovetop when cookware cannot be placed on the stovetop element. This can be achieved by configuring the diaphragm in a different shape, among possible modifications to the components included in the diaphragm assembly disclosed herein and / or other components included in the temperature sensor subsystem. For example, the disclosed temperature sensor subsystem may not necessarily include a flexible bumper.

[0043] In some embodiments, the temperature sensor subsystem 310 disclosed herein may also include an optical sensor 450, as shown in Figures 4A, 4B, and 6. The optical sensor 450 may be a packaged reflective sensor that transmits and receives signals. In some embodiments, the optical sensor 450 may be configured to determine a vertical calibration position in order to determine the minimum mass of a cookware that is permitted by the temperature sensor subsystem. In some embodiments, the optical sensor 450 may be mounted on a support base 440, as shown in Figures 4A, 4B, and 6.

[0044] In some embodiments, the support base 440 may be further attached to the coil frame (also called the "coil form") of the induction cooktop.

[0045] Assembly process In some embodiments, when assembling the different components of the temperature sensor subsystem, the diaphragm 410 may be attached to the glass using threaded clamp collars 420 and 422 and an O-ring 424 or room-temperature curing silicone (from which a syringe can be dispensed). The packaged temperature sensor subsystem may then be mounted to the coil form included in the induction cooktop. The glass and the mounted diaphragm may be installed from above.

[0046] electronic equipment Figure 7 shows exemplary electronic equipment included in a temperature sensor subsystem according to one embodiment. As shown, the sensor package 402 and the optical sensor 450 included in the temperature sensor subsystem may be connected to a printed circuit board assembly (PCBA), which may be further connected to the control hardware and software of the induction cooktop 300. The control hardware and software of the induction cooktop 300 may be configured to control temperature sensing and the heating process during actual cooking. In one embodiment, the control hardware and software of the induction cooktop 300 can adjust the supplied power to maintain the temperature at a set value as described above.

[0047] In some embodiments, the sensor package 402 and the optical sensor 450 may use different numbers of channels when electronically connected to the same PCBA. In some embodiments, the sensor package 402 and the optical sensor 450 may be electronically connected to different PCBAs. This disclosure does not limit how the sensor package 402, auxiliary sensors 412, and optical sensor 450 are electronically connected to the control hardware and software of the induction cooktop 300.

[0048] In some embodiments, the electronics of the disclosed temperature sensor subsystem may be configured to have a communication unit including a wireless communication unit that enables wireless control of the disclosed temperature sensor subsystem. For example, through an app installed on a mobile device, a user can wirelessly set the set temperature of the disclosed temperature sensor subsystem, adjust the power level, and perform other actions.

[0049] Basic functions of a temperature sensor As described above, the temperature sensor subsystem disclosed herein can provide accurate and precise temperature measurement for any container with a very high rise rate (e.g., more than 4°C per second) and a very low delay (e.g., - seconds). Therefore, when configuring the temperature sensor, the selected sensor may be configured to have the smallest possible heat capacity, and then the fastest response time to changes in the temperature / power input of the cookware. The temperature sensor may also be configured to be non-ferrous and therefore have little to no interaction with the coil magnetic field. If components in the temperature sensing system are self-heated by the field generated by the main coil, protection or field formation may be used to minimize the effects of self-heating. Furthermore, the temperature sensor may also be configured to have good thermal contact with the cookware.

[0050] Other considerations In some embodiments, the disclosed temperature sensor system may be further improved by miniaturization, circular design, adjusted size, non-ferrous design, etc. For example, the disclosed temperature sensor system may be made as small as possible and may have a circular contour with a central wire, as seen in Figures 3 to 6. Furthermore, the power density and wiring size may be adjusted to suit power requirements. Being non-ferrous, the temperature sensor subsystem disclosed herein can use type T thermocouples, non-ferrous RTDs, or other similar temperature sensing solutions.

[0051] The structure and arrangement of the elements of the apparatus as shown in the exemplary embodiments are illustrative only. Although only a certain number of embodiments are described in detail in this disclosure, those skilled in the art who study this disclosure will readily understand that many modifications are possible (e.g., changes in size, dimensions, structure, shape, and proportions, such as various elements, parameter values, mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the enumerated subject matter.

[0052] Furthermore, elements shown as being formed as a single unit may be constructed from multiple parts, or from elements shown as being able to be formed from multiple parts; the operation of the assembly may be reversed or otherwise modified; the length or width of the structure and / or members, connectors, or other elements of the system may be modified; and the nature or number of adjustment or mounting positions provided between elements may be modified. It should be noted that the elements and / or assemblies of the system may be constructed from any of the wide variety of materials that provide sufficient strength or durability. Accordingly, any such modifications shall be within the scope of this disclosure. Other substitutions, modifications, changes, and omissions may be made in the design, operating conditions, and arrangement of the exemplary embodiments without departing from the spirit of this subject matter.

[0053] The features and functions of the various embodiments may be arranged in various combinations and permutations, all of which are considered to be within the scope of the disclosed invention. Therefore, the embodiments described are illustrative in all respects and should not be considered limiting. Furthermore, the configurations, materials, and dimensions described herein are illustrative and not limiting in any way. Similarly, while physical descriptions are provided for illustrative purposes, they are not intended to be bound by any particular theory or mechanism, nor to limit the claims accordingly.

[0054] In this description and throughout the following claims, unless the context explicitly indicates otherwise, the meanings of “a,” “an,” and “the” should also be understood to include multiple referents. In this description and throughout the following claims, unless the context explicitly indicates otherwise, the meaning of “in” includes “in” and “on.” Finally, in this description and throughout the following claims, the meanings of “and” and “or” include both conjunction and disjunction, and may be used interchangeably unless the context explicitly indicates otherwise. The phrase “exclusive or” may be used to indicate a situation in which only the disjunctive meaning applies.

[0055] Each numerical value presented herein is intended to represent, for example, the minimum or maximum value within a range of the corresponding parameter in a table, chart, or graph. Therefore, if added to the claims, the numerical values ​​provide clear support for claiming a range that may be above or below the numerical value, in accordance with the teachings herein. If not included in the claims, each numerical value presented herein should not be considered limiting in any way.

[0056] The terms and expressions used herein are for illustrative purposes only, not limitation, and the use of such terms and expressions is not intended to exclude any equivalent of any feature or part thereof that is illustrated and described. Furthermore, although specific embodiments of the invention have been described, it will be apparent to those skilled in the art that other embodiments incorporating the concepts disclosed herein can be used without departing from the spirit and scope of the invention.

Claims

1. A temperature sensing device for induction cooktops, A sensor package containing one or more sensors, A plunger assembly configured to hold the sensor package, The temperature sensing device includes a support base configured to provide a physical support for the plunger assembly.

2. The temperature sensing device according to claim 1, wherein the plunger assembly includes a movable plunger, a fixed plunger support, and a spring disposed between the plunger and the plunger support.

3. The temperature sensing device according to claim 1, wherein the one or more sensors include at least one self-heating flux sensor.

4. The temperature sensing device according to claim 1, further comprising one or more auxiliary sensors disposed between the sensor package and the plunger assembly.

5. The temperature sensing device according to claim 4, wherein one or more auxiliary sensors are arranged inside the chamber of the sensor holding unit.

6. The temperature sensing device according to claim 5, further comprising a flexible bumper disposed between the sensor holding unit and the plunger assembly.

7. The temperature sensing device according to claim 6, wherein each of the sensor holding unit, the flexible bumper, and the plunger assembly has a central hollow portion that allows one or more cables or wires to pass through.

8. The temperature sensing device according to claim 2, wherein the plunger has an inner column portion and an outer cap portion located above the plunger.

9. The temperature sensing device according to claim 8, wherein at least a portion of the spring is held between the inner column portion and the outer cap portion of the plunger when the plunger assembly is assembled.

10. The temperature sensing device according to claim 9, wherein the outer cap portion of the plunger includes a pair of protrusions arranged along the lower edge of the cap portion.

11. The temperature sensing device according to claim 10, wherein the plunger support includes a corresponding pair of openings located on the side surface of the plunger support.

12. The temperature sensing device according to claim 11, wherein the projection is restricted to pass through an opening located on the side surface of the plunger support and to move within the opening along the predetermined direction.

13. The temperature sensing device according to claim 5, further comprising a sliding inclined portion for holding the sensor package and the sensor holding unit together by enclosing the sensor package and the sensor holding unit in a circular shape.

14. The temperature sensing device according to claim 13, wherein the sliding inclined portion has a conical shape at the upper part of the sliding inclined portion.

15. The temperature sensing device according to claim 13, further comprising a sensor cap for covering one or more sensors, wherein the side portion of the sensor cap is disposed between the sensor holding unit and the sliding inclined portion.

16. The temperature sensing device according to claim 15, wherein the sensor cap includes a thin non-ferrous sheet.

17. The temperature sensing device according to claim 13, further comprising a diaphragm assembly for attaching the sensor package and the plunger assembly to the cooktop base of the induction cooktop.

18. The temperature sensing device according to claim 17, wherein the diaphragm assembly includes an upper collar, a lower collar, an O-ring, and an elastic diaphragm.

19. The temperature sensing device according to claim 18, wherein the diaphragm includes an upper edge portion that extends into a recess located at the lower edge of the sliding inclined portion.

20. A method for assembling a temperature sensing device, wherein the temperature sensing device includes a temperature sensor subsystem comprising a sensor package, a sensor holding unit, a flexible bumper, a plunger assembly, and a support base, and the method is The plunger assembly is attached to the support base, The flexible bumper is positioned inside the upper hollow portion of the plunger included in the plunger assembly, The sensor holding unit is placed on the flexible bumper, and the sensor package is placed on the sensor holding unit. The method comprising using a sliding inclined portion to fasten the sensor package and the sensor holding unit.

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