A compact, adjustable spray nozzle for precisely targeting areas for cleaning, particle removal, and improving hardware cleanliness.

Abstract

Embodiments of the present disclosure generally relate to fluid nozzles used in semiconductor manufacturing. The fluid nozzle includes a nozzle body disposed between an inlet surface and an outlet surface. The body includes a threaded region, a central axis of symmetry, and a port. The threaded region is located between the inlet surface and the outlet surface. The central axis of symmetry extends through the nozzle body along the port axis. The port extends through the nozzle body along the port axis. The port axis extends through the nozzle body between the inlet surface and the outlet surface. A first angle is formed between the port axis and the central axis of symmetry. The port outlet surface is perpendicular to the port axis, adjacent to the outlet surface, and forms a second angle with respect to the outlet surface.

Description

Technical Field

[0001]

[0001] Embodiments of the present invention generally relate to nozzles, and more specifically, to an adjustable substrate processing tool nozzle for use in semiconductor processing.

Background Art

[0002]

[0002] Integrated circuits are typically formed on a substrate by successive deposition of conductive, semiconductive, or insulating layers on a silicon substrate. Manufacture includes depositing a fill layer over a non-planar surface and planarizing the fill layer until the non-planar surface is exposed. A conductive fill layer may be deposited over a patterned insulating layer to fill trenches or holes within the insulating layer. The fill layer is then polished until the raised pattern of the insulating layer is exposed. After planarization, portions of the conductive fill layer remaining between the raised patterns of the insulating layer form vias, plugs, and lines that provide conductive paths between thin film circuits on the substrate. In addition, planarization may be required to planarize a dielectric layer on the substrate surface for photolithography.

[0003]

[0003] Chemical mechanical polishing (CMP) is one recognized planarization method. This planarization method includes mounting a substrate on a carrier head or polishing head of a CMP apparatus. The exposed surface of the substrate is disposed against a rotating polishing disk pad or belt pad. The carrier head applies a controllable load to the substrate such that the device side of the substrate is biased toward the polishing pad. A polishing slurry (and polishing particles if a standard pad is used) containing at least one chemical reactant is supplied to the surface of the polishing pad.

[0004]

[0004] Typically, the substrate is held below the carrier head relative to the film in the retaining ring. Furthermore, when the substrate is in the carrier head, a gap exists between the outer edge of the substrate and the inner circumference of the retaining ring. In addition, a gap also exists between the outer edge of the film and the inner circumference of the retaining ring. Polishing slurry and organic residues can accumulate in these gaps and other areas close to the outer edge of the substrate during processing. Such residues can remain on the substrate edge and / or be displaced during processing, causing defects in the substrate and affecting the efficiency of the CMP equipment. The location of these gaps varies depending on the cleaning equipment. Therefore, equipment that can be adjusted to various sizes and configurations is needed. [Overview of the project]

[0005]

[0005] In one embodiment, a fluid nozzle is provided. The fluid nozzle includes a nozzle body disposed between an inlet surface and an outlet surface. The body includes a threaded region, a central axis of symmetry, and a port. The threaded region is located between the inlet surface and the outlet surface. The central axis of symmetry extends through the nozzle body along the port axis. The port extends through the nozzle body along the port axis. The port axis extends through the nozzle body between the inlet surface and the outlet surface. A first angle is formed between the port axis and the central axis of symmetry. The port outlet surface is perpendicular to the port axis, adjacent to the outlet surface, and forms a second angle with respect to the outlet surface.

[0006]

[0006] In another embodiment, a fluid nozzle is provided. The fluid nozzle includes a nozzle body disposed between an inlet surface and an outlet surface. The body includes a threaded region, a fixed region, a central axis of symmetry, and a port. The threaded region is located adjacent to the inlet surface. The fixed region is located between the outlet surface and the threaded region. The central axis of symmetry extends through the nozzle body between the inlet surface and the outlet surface. The port extends through the nozzle body along the port axis. The port axis extends through the nozzle body between the inlet surface and the outlet surface. A first angle is formed between the port axis and the central axis of symmetry. The port outlet surface includes the outlet, is perpendicular to the port axis, adjacent to the outlet surface, and forms a second angle with respect to the outlet surface.

[0007]

[0007] In another embodiment, a fluid nozzle is provided. The fluid nozzle includes a nozzle body positioned between an inlet surface and an outlet surface. The body includes a threaded region, a central axis of symmetry, and a port. The threaded region is positioned between the inlet surface and the outlet surface. The central axis of symmetry extends through the nozzle body between the inlet surface and the outlet surface. The port extends through the nozzle body along a port axis. The port axis is parallel to the central axis of symmetry and offset therefrom. The port axis extends through the nozzle body between the inlet surface and the outlet surface. The port has a port outlet surface that is perpendicular to the port axis and adjacent to the outlet surface.

[0008]

[0008] To enable a more detailed understanding of the above-described features of the Disclosure, a more detailed description of the Disclosure, which has been briefly summarized above, can be obtained by referring to embodiments, some of which are shown in the accompanying drawings. However, it should be noted that the accompanying drawings show only exemplary embodiments and should not be considered to limit the scope of the Disclosure, and other equally valid embodiments are permitted. [Brief explanation of the drawing]

[0009] [Figure 1]

[0009] An upper plan view of a chemical mechanical polishing (CMP) system according to one embodiment is shown. [Figure 2A]

[0010] A partial side view of a carrier head according to one embodiment is shown. [Figure 2B]

[0011] Figure 2A shows a bottom view of the carrier head according to one embodiment. [Figure 3A]

[0012] A top plan view of a load cup according to one embodiment is shown. [Figure 3B]

[0013] A schematic side view of the nozzle spray pattern according to one embodiment is shown. [Figure 4A-4D]

[0014] Schematic side views of nozzles according to several embodiments are shown. [Figure 5]

[0015] A schematic side view of the nozzle spray pattern according to one embodiment is shown. [Modes for carrying out the invention]

[0010]

[0016] For ease of understanding, the same reference numerals have been used where possible to indicate identical elements common to the figures. It is assumed that elements and features of one embodiment may be usefully incorporated into other embodiments without further description.

[0011]

[0017] This disclosure relates to an adjustable fluid nozzle configured to remove debris from a substrate carrier head, and in particular to remove debris from gaps within the carrier head. The cleaning can be performed when the substrate is in the carrier head, before the substrate is loaded into the carrier head, or after the substrate has been unloaded from the carrier head.

[0012]

[0018] The adjustable fluid nozzle has desirable properties for penetrating and effectively cleaning the narrow gap within the carrier head, between the hydrophobic film of the carrier head and the inner circumference of the retaining ring. The adjustable fluid nozzle is configured to direct the fluid flow by setting the orientation of the nozzle. An example of a desirable property is that the nozzle can maintain a steady flow of fluid under standard operating conditions. According to one or more embodiments of this disclosure, the adjustability of the nozzle allows for a wide range of combinations of sprayers and carrier heads.

[0013]

[0019] Figure 1 shows a top plan view of a chemical mechanical polishing (CMP) system 100 according to one embodiment disclosed herein. While the CMP system is shown in Figure 1 and herein, the concepts disclosed herein may also be applicable to other substrate processing devices. The CMP system 100 includes a polishing section 102 and a wash-and-dry section 104 that process (e.g., wash and / or polish) a substrate 108. The CMP system 100 also includes other sections that perform other processes on the substrate 108. As used herein, substrates include articles used to make electronic devices or circuit components. Substrates include semiconductor substrates (e.g., silicon-containing substrates, patterned or unpatterned substrates, glass plates, masks, etc.). The pass-through 110 is an opening between the polishing section 102 and the wash-and-dry section 104 that is adapted for the transfer of the substrate 108.

[0014]

[0020] The polishing section 102 includes one or more polishing stations 114 (e.g., individual polishing stations 114A to 114D). Each of the polishing stations 114 includes a polishing pad (e.g., individual polishing pads 116A to 116D). To perform various polishing processes, the polishing pads rotate in contact with the surface of the substrate 108. To process the substrate, one or more slurries (not shown) are applied between the substrate 108 and the polishing pads 116A to 116D.

[0015]

[0021] The polishing section 102 includes a plurality of carrier heads 120 that maintain the substrate 108 in contact with polishing pads 116A to 116D during polishing. Each of the polishing stations 114A to 114D may include a single head (e.g., individual carrier heads 120A to 120D). The carrier heads 120A to 120D secure the substrate 108 within the carrier head as the carrier heads 120A to 120D are transported in and out of the polishing stations 114A to 114D. For example, the carrier heads 120A to 120D secure the substrate 108 within the carrier head as the carrier heads 120A to 120D are transported between load cups 124 (e.g., individual load cups 124A, 124B) and the polishing stations 114A to 114D. Load cups 124A and 124B transport the substrate 108 between the carrier heads 120A to 120D and the substrate changers 130 (for example, individual changers 130A and 130B). The first substrate changer 130A rotates in a first direction 132A, and the second changer 130B rotates in a second direction 132B (which may be the same as or opposite to the first direction 132A).

[0016]

[0022] The cleaning and drying section 104 includes a robot 136, which transports the substrate 108 between the substrate changers 130A and 130B at various access locations 172A and 172B via a pass-through 110. The robot 136 also transports the substrate 108 between a station (not shown) within the cleaning and drying section 104 and the substrate changers 130A and 130B.

[0017] Figures 2A and 2B show side and bottom views of a carrier head 120 (which may be any of the carrier heads 120A to 120D in Figure 1) according to some embodiments. The carrier head 120 includes a retaining ring 206 for holding a substrate 108 beneath a film 204. The film 204 is a flexible hydrophobic film 204. The film 204 has an outer circumference 205 surrounded by an inner circumference 207 of the retaining ring 206. A gap 216 is formed between the inner circumference 207 of the retaining ring 206 and the outer circumference 205 of the film 204. In some embodiments, the gap 216 is about 0.5 mm to about 3 mm, for example, about 1 mm to about 2 mm. The carrier head 120 includes one or more independently controllable pressurizable chambers 202 defined by the film 204. During processing, as the carrier head 120 rotates the substrate 108 and presses it against the polishing pad 116 (Figure 1), polishing slurry, fragments, and residues may accumulate on the edges of the substrate 108, the inner circumference 207, the beveled areas of the substrate, and other locations (such as within the gaps 216). These residues and particles may accumulate over time and be released during processing, potentially causing scratches on the substrate 108.

[0018]

[0024] Figure 3A shows a top plan view of a load cup 124 (e.g., 124A or 124B) according to one embodiment. The load cup 124 includes a ring-shaped substrate station 350. The substrate station 350 moves vertically to position a substrate 108 onto a blade 334 of a substrate changer 130 (e.g., 130A, 130B) and to remove the substrate 108 from the blade 334. The blade 334 is rotatable to access locations 172A, 172B for loading and unloading the substrate 108 by a robot 136 (Figure 1).

[0019]

[0025] The substrate station 350 includes notches (e.g., 352A, 352B, 352C) for receiving the blade 334. The substrate 108 is placed on a raised feature of the substrate station 350. As the substrate station 350 moves upward to remove the substrate 108 from the blade 334, the substrate 108 is positioned inside a number of pins 354 that create a pocket for centering the substrate 108.

[0020]

[0026] The load cup 124 includes a sprayer 356 having a plurality of different nozzles (e.g., 358A, 358B, 358C, 358D) configured to spray a fluid (e.g., deionized water) onto a blade 334, a substrate 108 on the blade 334 (not shown in Figure 3A), a substrate 108 on the carrier head 120, and / or a carrier head 120 located above the load cup 124 (not shown in Figure 3A). The sprayer 356 includes a set of first nozzles 358A arranged around the outer portion of the sprayer 356 for, for example, rinsing the substrate 108, and a set of second nozzles 358B arranged in an array along the diameter of the sprayer 356 for, for example, rinsing the membrane 204 of the carrier head 120 when the substrate 108 is positioned above the load cup 124. The atomizer 356 includes a set of third nozzles 358C on the outer portion of the atomizer 356, which are configured to spray onto the location of the carrier head 120 (e.g., the gap 216 between the outer circumference 205 of the membrane 204 and the inner circumference 207 of the retaining ring 206) when the carrier head 120 is positioned on the load cup 124 (with or without the substrate 108). The third nozzles 358C (e.g., spray nozzles) are also configured to spray onto the outer edge of the substrate 108 (e.g., the gap between the outer edge of the substrate 108 and the inner circumference 207 of the retaining ring 206) while the substrate 108 is held within the carrier head 120. The third nozzles 358C are connected to a rinse solution (e.g., deionized water) at room temperature (e.g., approximately 10°C to approximately 40°C). Each of the third nozzles 358C is connected to an atomizer. The fourth set of nozzles 358D is located on the outer part of the sprayer 356, adjacent to each of the third nozzles 358C on the upper surface of the sprayer 356.

[0021]

[0027] FIG. 3B shows a partial cross-sectional view of the atomizer 356 having a nozzle 358. The nozzle 358 according to some embodiments is configured to spray a fluid flow 370 into the gap 216. The nozzle 358 can be rotated to adjust the flow 370 by the angle θ. The flow 370 has a first adjustment end 370a to a second adjustment end 370b so that it can target the gap 216 within the range defined by the angle θ. In other words, when the gap 216 is somewhere between the first adjustment end 370a and the second adjustment end 370b, the flow 370 can target the gap 216. The diameter of the stream 370 is between about 2 mm and 5 mm, for example 3 mm. The nozzle 358 is adjusted by screwing the nozzle 358 into the atomizer 356. The nozzle 358 receives fluid through an internal channel 374 within the atomizer 356. The internal channel 374 and the fluid are at a pressure between about 1 psi and about 80 psi, for example about 40 psi. The flow rate through the internal channel 374 is from about 1 liter per minute (L / min) to about 3 L / min, for example about 2 L / min. The flow rate of the fluid through the nozzle 358 is between about 2 liters per minute (L / min) and about 5 L / min, for example about 3 L / min. The pressure is adjustable to obtain desired flow characteristics. The flow 370 is a laminar flow of fluid that can be sprayed into the gap 216 when the nozzle 358 is at a distance between about 50 mm and 200 mm from the gap 216. The nozzle 358 is adjusted according to the distance that the flow 370 needs to travel by selecting the exact nozzle 358 size and adjusting the flow pressure, and also depends on the fluid used in the flow path 370. The flow 370 according to some other embodiments may have a conical shape, a square shape, and / or a flat fan shape. The size selection and adjustability of the nozzle 358 will be further described later.

[0022]

[0028] Figures 4A, 4B, 4C, and 4D show cross-sections of several embodiments of the nozzle 358, illustrated as nozzle 400 (400a, 400b, 400c, and 400d). In the following description, the reference number "400" is used when referring to all of the nozzles "400a," "400b," "400c," and "400d." The nozzle 400 includes an outlet surface 401 having a port outlet 402 and an inlet surface 431. The outlet surface 401 has an outlet surface diameter 413 between approximately 3 mm and approximately 17 mm, for example between 10 mm and approximately 31 mm, and in yet another example, approximately 8 mm. The inlet surface 431 has an inlet surface diameter 415 between 3 mm and approximately 17 mm, for example between 10 mm and approximately 31 mm, and in yet another example, approximately 8 mm. The fluid nozzle 400 also includes a nozzle body 407 positioned between the inlet surface 431 and the outlet surface 401 of the nozzle 400. The body 407 includes a threaded area 409, a centrally symmetrical axis 421 extending through the nozzle body 407, and a port 404 extending through the body 407. The body 407 may include one of PEEK (polyetheretherketone), brass, stainless steel, and / or PVDF (polyvinylidene fluoride). The body 407 may also include any other material that does not contaminate the metal. In some embodiments, the nozzle 400 may also include an O-ring and a fixing area 408 adjacent to the threaded area 409. The fixing area 408 of the nozzle 400 includes a fixing feature 405. The fixing feature 405 acts as a depth stop when the nozzle 400 is tightened into the sprayer 356. The fixing feature 405 also includes the method of fixing the nozzle 400. In some embodiments, the fixing feature 405 is a 7 / 16 hexagonal pattern arranged along the edge of the body 407 that allows the nozzle 400a to be tightened into the sprayer 356. In other embodiments, other sizes and patterns are possible, such as 9 / 16 hexagonal patterns and / or square patterns. In other embodiments, the fixing feature 405 is a knurled section located on the outside of the body 407, which allows the nozzle 400a to be tightened and secured inside the sprayer 356 without the need for tools, i.e., rotated without tools. The threaded area 409 is located between the inlet surface 431 and the fixing feature 405.

[0023]

[0029] The central symmetry axis 421 extends through the center of the nozzle body 407 between the inlet surface 431 and the outlet surface 401. The port 404 extends along the port axis 423 through the nozzle body 407 between the inlet surface 431 and the outlet surface 401. According to some embodiments, the nozzle 400 also includes a first angle 425 formed between the port axis 423 and the central symmetry axis 421. The port 404 includes a port outlet surface 406 within the port outlet 402. The port outlet surface 406 is perpendicular to the port axis 423, adjacent to the outlet surface 401, and forms a second angle 427 with respect to the outlet surface 401.

[0024]

[0030] In the conventional nozzle design, the atomizer 356 was limited to a specific carrier head 120 held at a specific height. The improved adjustable nozzle 400 described herein allows the use of combinations of multiple carrier heads 120 and atomizers 356 at a single substrate station 350 by simply adjusting the nozzle 400 by rotation and pressure adjustment of the flow 370. Previously, if the array was not complete, the operating conditions were not adjusted, and / or the height of the carrier head 120 was not within a certain range, the flow 370 could not target the gap 216 and / or the flow 370 did not become a laminar flow.

[0025]

[0031] The nozzle 400 described herein can be adjusted according to the specific device in which it is installed. For example, in some embodiments where the first angle 425 is 5°, the angle θ is equal to about 10°, giving the nozzle 400 an adjustable range of about 2 mm to about 25 mm that targets a specific area of the carrier head 120. The outlet port surface 406 is also perpendicular to the port axis 423, which also helps to maintain the laminar flow from the flow 370.

[0026]

[0032] The threaded area 409 of the nozzle 400a includes the threads 419 and is located between the entrance surface 431 and the fixed feature 405. For example, the threaded area may be between approximately 0.2" and 0.4" in size. The threads 419 of the threaded area 409 are a standard thread pattern, and for example, the threads may be 1 / 8” NPT threads, 1 / 4” NPT threads, and / or 1 / 2” NPT threads, but other sizes are intended. The nozzle 400a may also include an alignment feature 411. The alignment feature 411 is indicated by a chamfer between the inlet face 431 and the threaded area 409 and assists in the alignment and centering of the nozzle 400a during installation. The threads 419 of the threaded area allow the nozzle 400 to require only one turn to be secured to the sprayer 356, but it may also require more turns, e.g., three turns, to be secured to the sprayer. The nozzle 400 can be further rotated to adjust the nozzle 440 so that it targets, for example, the gap 216 of the carrier head 120.

[0027]

[0033] The port 404 of the nozzle 400 has a port diameter 417. The port diameter 417 is between approximately 0.3 mm and approximately 2.5 mm, for example, 1 mm. The port 404 is a hole along the port axis 423 passing through the nozzle 400, starting at the port inlet 433 and ending at the port outlet 402. The port outlet 402 includes a port outlet surface 406. The port outlet surface 406 is perpendicular to the port axis 423 to ensure uniform flow. Although the port 404 is illustrated as a circular port 404, in other embodiments the nozzle 400 may have a different shape to generate the flow 370.

[0028]

[0034] Figure 4A shows several embodiments of a nozzle 400a in which the port outlet 402 is located approximately in the center of the outlet surface 401, but the port inlet center 441 is offset perpendicularly from the axis of symmetry 421 along the inlet surface 431 by an inlet offset 443. As shown, the fluid nozzle 400a includes a first angle 425 formed between the port axis 423 and the axis of symmetry 421. The port outlet surface 406 of the port outlet 402 is perpendicular to the port axis 423, adjacent to the outlet surface 401, and forms a second angle 427 with respect to the outlet surface 401. The second angle 427 is approximately the same as the first angle 425. In this embodiment, the first angle 425 is between approximately 0.25° and 10°, for example, between approximately 2° and 6°. In this embodiment, the inlet offset 443 is between approximately 0.5 mm and 10 mm, for example, 5 mm.

[0029]

[0035] Figure 4B shows several embodiments of a nozzle 400b in which the port outlet 402 is offset from the center of the outlet surface 401, but the port inlet 433 is located approximately in the center of the inlet surface 431. As shown, the fluid nozzle 400b includes a first angle 425 formed between the port axis 423 and the axis of symmetry 421. In this embodiment, the port inlet 433 is located approximately in the center of the inlet surface 431, but the port outlet 445 is offset perpendicularly from the axis of symmetry 421 along the outlet surface 401 by an outlet offset 447. In this embodiment, the first angle is between approximately 0.25° and 10°, for example, between approximately 2° and approximately 6°. In this embodiment, the outlet offset 447 is between approximately 1 mm and approximately 10 mm, for example, 3 mm.

[0030]

[0036] Figure 4C shows several embodiments of a nozzle 400c in which the port outlet 402 is offset from the center of the outlet surface 401 and the port inlet 433 is offset from the center of the inlet surface 431. In this embodiment, the port outlet center 445 is offset from the axis of symmetry 421 by the outlet offset 447, and the port inlet center 441 is offset from the axis of symmetry 421 by the inlet offset 443. The port outlet surface 406 of the port outlet 402 is perpendicular to the port axis 423, adjacent to the outlet surface 401, and forms a second angle 427 with respect to the outlet surface 401. In this embodiment, the first angle is between approximately 0.25° and approximately 20°, or between approximately 0.25° and approximately 10°, or between approximately 10° and approximately 20°. In this embodiment, the inlet offset 443 is between approximately 0.5 mm and approximately 15 mm, for example 7 mm, and the outlet offset 447 is between approximately 0.5 mm and approximately 15 mm, for example 7 mm. By offsetting the port inlet 433 and port outlet 402 from the central axis of symmetry 421, a larger angle θ can be achieved so that a single nozzle 400c can cover a large target range of 100 mm.

[0031]

[0037] Figure 4D shows several embodiments of a nozzle 400d in which the port outlet 402 is offset from the center of the outlet surface 401, the inlet 433 is offset from the center of the inlet surface 431, and the port axis 423 is approximately parallel to the axis of symmetry 421. Both the port outlet center 445 and the port inlet center 441 are offset approximately equally from the axis of symmetry 421 by the outlet offset 443 and inlet offset 447. The inlet offset 443 and outlet offset 447 are between approximately 0.5 mm and approximately 15 mm, for example, 7 mm. In this embodiment, the target of the flow 370 can be adjusted for very precise applications.

[0032]

[0038] Figure 5 shows several embodiments of nozzle 500, which may be nozzle 358 (Figures 3A, 3B). Nozzle 500 has a port 504 having a port profile 535. Similar to the nozzle 400 described above, nozzle 500 includes an outlet surface 501 having a port outlet 502 and an inlet surface 531. The outlet surface 501 has an outlet surface diameter 513 between about 3 mm and about 25 mm, for example between 20 mm. In some embodiments, the outlet surface 501 has an outlet surface diameter 513 between about 10 mm and about 35 mm, for example between 31 mm. The inlet surface 531 has an inlet surface diameter 515 between about 3 mm and about 25 mm, for example between 20 mm. In some embodiments, the inlet surface 531 has an inlet surface diameter 515 between about 10 mm and about 35 mm, for example between 31 mm. The fluid nozzle 500 also includes a nozzle body 507, a threaded region 509, a central symmetry axis 521, a fixed region 508 including a fixed feature 505, and a first angle 525 formed between the port axis 523 and the central symmetry axis 521. In some embodiments, the first angle 525 is between about 0.25° and about 20°, or between about 0.25° and about 10°, or between about 10° and about 20°. The port 504 includes a port outlet surface 506 within the port outlet 502. The port outlet surface 506 is perpendicular to the port axis 523, adjacent to the outlet surface 501, and forms a second angle 527 with respect to the outlet surface 501. The nozzle 500 also includes a port outlet diameter 537 and a port inlet diameter 539. The port inlet diameter 539 is between about 0.3 mm and about 2.5 mm, for example, 1 mm. The port outlet diameter 537 is the diameter of the port outlet 502 perpendicular to the port axis 523. The port outlet diameter 537 is between approximately 0.3 mm and approximately 2.5 mm, for example, approximately 1 mm.

[0033]

[0039] Port 504 extends along the port axis 523, through the nozzle body 507, and through the inlet surface 531 and the outlet surface 501. According to some embodiments, the port 504 of the nozzle 500 is not uniform and includes a port profile 535. In some embodiments, the port profile 535 is a tapered profile in which the port inlet diameter 539 is greater than the port outlet diameter 537 and the profile 535 decreases in a linear manner. In some embodiments, the port profile 535 is a curved profile in which the port outlet diameter 537 is smaller than the port inlet diameter 539 and the profile 535 decreases in a concave curve. In some embodiments, the port profile 535 is a curved profile in which the port outlet diameter 537 is smaller than the port inlet diameter 539 and the profile 535 decreases in a convex curve. The profile 535 improves the hydrodynamics of the flow 370 and increases the velocity of the flow 370.

[0034]

[0040] The adjustable fluid nozzle is an improvement that allows for adjustment of the cleaning action, specifically targeting gaps within the carrier head. The ability to quickly adjust the fluid nozzle reduces the need for specific load cup configurations to clean parts of the carrier head. The advantageous combination of adjustability and characteristics for through-cleaning of the carrier head reduces costs and increases manufacturing output.

[0035]

[0041] The above description applies to the implementations of the Disclosure, but other implementations and further implementations of the Disclosure may be devised, provided that they do not deviate from the basic scope of the Disclosure, and the scope of the Disclosure is defined by the following claims.

Claims

1. A fluid nozzle for use in chemical mechanical polishing (CMP) systems, A nozzle body positioned between the inlet surface and the outlet surface, A threaded region is disposed between the inlet surface and the outlet surface, A central axis of symmetry extending through the nozzle body between the inlet surface and the outlet surface, A port extending along the port axis through the nozzle body, The port shaft extends through the nozzle body between the inlet surface and the outlet surface, A first angle is formed between the port axis and the central axis of symmetry, The port outlet surface is perpendicular to the port axis, adjacent to the outlet surface, and forms a second angle with respect to the outlet surface. Ports and Nozzle body A fluid nozzle, including one.

2. The fluid nozzle according to claim 1, wherein the nozzle body further comprises a material containing PEEK.

3. The fluid nozzle according to claim 1, wherein the port includes a port inlet on the inlet surface and a port outlet adjacent to the port outlet surface.

4. The fluid nozzle according to claim 1, wherein the nozzle body further includes a fixed region having a fixed feature.

5. The fluid nozzle according to claim 3, wherein the port outlet is offset from the central axis of symmetry.

6. The fluid nozzle according to claim 3, wherein the port inlet has a diameter between approximately 1 mm and 5 mm.

7. The fluid nozzle according to claim 5, wherein the port inlet is offset by an inlet offset distance from the central axis of symmetry.

8. The fluid nozzle according to claim 1, wherein the first angle is between approximately 0.25° and approximately 10°.

9. The fluid nozzle according to claim 1, wherein the first angle is between approximately 10° and 20°.

10. The fluid nozzle according to claim 4, wherein the fixed feature is a hexagonal pattern.

11. The fluid nozzle according to claim 1, further comprising a fixing feature that enables toolless rotation of the nozzle body.

12. The fluid nozzle according to claim 1, wherein the port inlet diameter is larger than the port outlet diameter.

13. The fluid nozzle according to claim 12, wherein the port outlet diameter is between approximately 0.3 mm and approximately 2.5 mm.

14. The fluid nozzle according to claim 1, wherein the port further includes a tapered profile.

15. A fluid nozzle for use in chemical mechanical polishing (CMP) systems, A nozzle body positioned between an inlet surface including a port inlet and an outlet surface, A screw region located adjacent to the aforementioned entrance surface, A fixing area disposed between the outlet surface and the threaded area, A central axis of symmetry extending through the nozzle body between the inlet surface and the outlet surface, A port extending along the port axis through the nozzle body, The port shaft extends through the nozzle body between the inlet surface and the outlet surface, A first angle is formed between the port axis and the central axis of symmetry, The port outlet surface is perpendicular to the port axis, adjacent to the outlet surface, forms a second angle with respect to the outlet surface, and the port outlet surface includes the outlet. Ports and Nozzle body A fluid nozzle, including one.

16. The fluid nozzle according to claim 15, wherein the nozzle body further comprises a material containing PEEK.

17. The fluid nozzle according to claim 15, wherein the outlet is offset by a certain distance from the axis of symmetry, and the axis of symmetry is parallel to the port axis.

18. The fluid nozzle according to claim 15, wherein the first angle is between approximately 0.25° and 20°.

19. The fluid nozzle according to claim 15, wherein the fixed region includes a hexagonal pattern.

20. A fluid nozzle for use in chemical mechanical polishing (CMP) systems, A nozzle body positioned between the inlet surface and the outlet surface, A threaded region is disposed between the inlet surface and the outlet surface, A central axis of symmetry extending through the nozzle body between the inlet surface and the outlet surface, A port extending along the port axis through the nozzle body, The port axis is parallel to the axis of central symmetry and offset from the axis of central symmetry. The port shaft extends through the nozzle body between the inlet surface and the outlet surface, The port has a port outlet surface that is perpendicular to the port axis and adjacent to the outlet surface. Ports and Nozzle body A fluid nozzle, including one.

Images