High-reliability smart pressure sensor

Abstract

This invention provides a highly reliable smart pressure sensor and belongs to the field of sensor technology. The invention comprises a smart sensor body comprising a pressure port, a metal strain region provided on the side of the pressure port, a full-bridge pressure sensing chip, an adjustment chip wiring PCB, a PCB holder, and a metal outer shell. The metal strain region is provided on the side of the pressure port, and the inside of the pressure port has a hollow structure with one side closed. A perforated structure is provided inside the pressure port, and the full-bridge pressure sensing chip is attached to the outer wall of the metal strain region to increase the sensing area of ​​the sensor, thereby improving the responsiveness to pressure changes of the pressure medium and the sensitivity of measurement. The invention adopts an innovative substantially U-shaped contour bending structure, which allows for the creation of more deformation areas in the metal strain region. The strain in these strain areas becomes more pronounced under pressure, which can enhance the sensor's ability to detect even slight deformations and improve compatibility.

Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and specifically, to a highly reliable smart pressure sensor.

Background Art

[0002] The pressure sensor can be applied to a vehicle body stability system (ESC) or a OneBox system in an autonomous vehicle, and is used to monitor the brake hydraulic signal of a brake control unit and the pressure signal of a hydraulic linear brake system. The pressure sensor is electrically connected to an ECU so as to provide a measurement signal of the brake hydraulic pressure to a system controller. The pressure sensor is also used in an automotive air suspension system and a carbon dioxide air conditioning compressor system or other pressure measurement application scenarios.

[0003] In the conventional ESC or OneBox pressure sensor technology, since there is a small effective area capable of detecting pressure or deformation inside the sensor, the sensitivity and measurement range of the sensor are limited, and it is impossible to accommodate different types of sensing cores, resulting in low compatibility. In addition, most of the conventional probes and PCB boards are fixed by welding on both sides, and it is necessary to perform welding treatment on both sides and the top of the PCB board, which may require the PCB board to be inverted many times, not only increasing the assembly time, but also increasing the possibility of errors in the production process and reducing the production efficiency.

[0004] How to develop a highly reliable smart pressure sensor to improve these problems has become an urgent problem for those skilled in the art to solve.

Summary of the Invention

Problems to be Solved by the Invention

[0005] In order to compensate for the above-mentioned drawbacks, the present invention provides a highly reliable smart pressure sensor, aiming to improve the problems described in the above background.

Means for Solving the Problems

[0006] The present invention is realized as follows.

[0007] The present invention provides a highly reliable smart pressure sensor comprising a smart sensor body, the smart sensor body comprising a pressure port, a metal strain region provided in the pressure port, a full-bridge pressure sensing chip, an adjustment chip wiring portion PCB, a PCB holder, and a metal outer shell, the adjustment chip wiring portion PCB being welded to the PCB holder, a plastic spring bracket being provided inside the top end of the PCB holder, a spring being mounted inside the plastic spring bracket, a bent leg being provided at the bottom end of the spring, the spring being welded to the adjustment chip wiring portion PCB by the bent leg, the bottom end of the PCB holder being fixedly connected to the pressure port, a metal strain region being provided on the side of the pressure port, the inside of the pressure port being a hollow structure with one side closed, and a perforated structure being provided inside the pressure port.

[0008] Preferably, the pressure port is formed by integral machining, the perforated structure is provided as a single cylindrical perforated or substantially concave bent structure, and the substantially concave bent structure is distributed symmetrically along the center line of the metal strain region of the pressure port.

[0009] Preferably, when the perforated structure is a single cylindrical perforation, there is one area where the full-bridge pressure sensing chip can be installed, and this area is closest to the outer wall of the metal strain area of ​​the single cylindrical perforation. When the perforated structure is a bent structure with a substantially concave contour, there are four areas where the full-bridge pressure sensing chip can be installed, and these four areas are distributed symmetrically along the center line of the metal strain area of ​​the pressure port.

[0010] Preferably, the full-bridge pressure sensing chip is provided in close contact with the corresponding region of the outer wall of the metal strain region.

[0011] Preferably, the adjustment chip wiring portion PCB is fixedly mounted to a PCB holder, and the full-bridge pressure sensing chip is directly connected to the signal input terminal of the adjustment chip wiring portion PCB via aluminum bonding wires.

[0012] Preferably, the number of full-bridge pressure sensing chips is at least one, and the springs are provided at least three.

[0013] Preferably, the multiple full-bridge pressure sensing chips are connected in parallel, and the chip is a full-bridge pressure sensing chip when the perforated structure is a single cylindrical perforated or a bent structure with a substantially concave contour. The full-bridge pressure sensing chip is a DAF MEMS (Direction Active Force MEMS) sensor, and may be a single full-bridge or two half-bridge micro-strain gauge (MSG), a sputtered thin-film sensing core, a thick-film resistive sensing core, etc.

[0014] Preferably, the full-bridge pressure sensing chip is manufactured based on single-crystal silicon, polycrystalline silicon, or gallium nitride material and SOI process technology, where SOI is silicon on an insulating substrate, and the technology introduces a layer of embedded oxide between the top silicon and the back substrate.

[0015] Preferably, the full-bridge pressure sensing chip generates and transmits a corresponding SENT or other digital output signal or analog signal.

[0016] Preferably, the SENT output or other digital output signals or analog signal outputs use three springs, while dual analog outputs or I2C use four springs. [Effects of the Invention]

[0017] The beneficial effects of this invention are as follows: By dividing the perforated structure into a single cylindrical perforated structure and a bent structure with a roughly concave contour, the sensor can adapt to different application environments. By mounting the full-bridge pressure sensing chip on the outer wall of the metal thin film, the sensing area of ​​the smart sensor body can be increased, thereby improving the responsiveness to fluid pressure changes and the sensitivity of measurement. By adopting the innovative installation of a bent structure with a roughly concave contour, more optimal strain points can be created in the metal thin film, and these points become more pronounced under the action of fluid pressure, thereby increasing the sensor's ability to detect even slight deformations. Users can selectively install sensing chips according to their actual needs and specifications, resulting in better compatibility. This flexibility allows the smart sensor body to be applied to a wider range of operating conditions and environments. Different perforated structure designs allow the sensor to be applied to measuring different pressure ranges and environments, such as liquid and gas pressure, increasing the flexibility of sensor application. By providing a bent leg structure design at the bottom of the new spring, all springs can be welded on the same side, improving production efficiency and welding reliability. Welding the bent legs and the adjustment chip wiring section of the PCB on the same side reduces the number of times the PCB board needs to be flipped, simplifying the assembly process and accelerating production speed. Thus, such a sensor design can provide users with higher quality data and enhance the competitiveness of the product in the market. [Brief explanation of the drawing]

[0018] To more clearly explain the solutions of the embodiments of the present invention, the drawings that may be used in the embodiments are briefly described below. It should be understood that the drawings described below represent only one embodiment of the present invention and should not be considered as a limitation on the scope, and those skilled in the art can obtain further drawings based on these without any creative work. [Figure 1] This is a schematic diagram of the overall structure of a highly reliable smart pressure sensor according to an embodiment of the present invention. [Figure 2]It is a schematic cross-sectional structure diagram of a high-reliability smart pressure sensor according to an embodiment of the present invention. [Figure 3] It is a schematic exploded structure diagram of a high-reliability smart pressure sensor according to an embodiment of the present invention. [Figure 4] It is a schematic internal structure diagram of a high-reliability smart pressure sensor according to an embodiment of the present invention. [Figure 5] It is a schematic welding structure diagram of the bending legs of a high-reliability smart pressure sensor according to an embodiment of the present invention. [Figure 6] It is a schematic mounting structure diagram when the cylindrical hole structure of a single full-bridge DAF MEMS pressure sensing chip of a high-reliability smart pressure sensor according to an embodiment of the present invention is in the shape of a single cylindrical hole. [Figure 7] It is a schematic mounting structure diagram when the cylindrical hole structures of two full-bridge DAF MEMS pressure sensing chips of a high-reliability smart pressure sensor according to an embodiment of the present invention are in the shape of a bending structure with a substantially concave-shaped contour. [Figure 8] It is a schematic mounting structure diagram when the cylindrical hole structure of a single full-bridge DAF MEMS pressure sensing chip of a high-reliability smart pressure sensor according to an embodiment of the present invention is in the shape of a bending structure with a substantially concave-shaped contour. [Figure 9] It is a schematic mounting structure diagram when the cylindrical hole structure of the core MSG for full-bridge microfusion of a high-reliability smart pressure sensor according to an embodiment of the present invention is in the shape of a bending structure with a substantially concave-shaped contour. [Figure 10] It is a schematic mounting structure diagram when the cylindrical hole structures of two half-bridge microfusion cores MSG, sputtering thin film sensing cores, thick film resistive sensing cores, etc. of a high-reliability smart pressure sensor according to an embodiment of the present invention are in the shape of a bending structure with a substantially concave-shaped contour. [Figure 11] It is a schematic diagram of the loading surface structure in the shape of a single cylindrical hole of a high-reliability smart pressure sensor according to an embodiment of the present invention. [Figure 12] It is a schematic diagram of the strain region of the single cylindrical hole structure of a high-reliability smart pressure sensor according to an embodiment of the present invention. [Figure 13]It is a schematic diagram of the position structure of the optimal strain point in the single cylindrical hole shape of the high-reliability smart pressure sensor according to the embodiment of the present invention. [Figure 14] It is a schematic diagram of the mounting structure of the full-bridge pressure sensing chip in the single cylindrical hole shape of the high-reliability smart pressure sensor according to the embodiment of the present invention. [Figure 15] It is a schematic diagram of the force analysis of the metal strain region in the single cylindrical hole shape of the high-reliability smart pressure sensor according to the embodiment of the present invention. [Figure 16] It is a schematic diagram of the curve of elastic strain in the metal strain region in the single cylindrical hole shape of the high-reliability smart pressure sensor according to the embodiment of the present invention. [Figure 17] It is a schematic diagram of the directional deformation curve of the metal strain region in the single cylindrical hole shape of the high-reliability smart pressure sensor according to the embodiment of the present invention. [Figure 18] It is a schematic diagram of the loading surface of the bending structure with a substantially concave-shaped contour of the high-reliability smart pressure sensor according to the embodiment of the present invention. [Figure 19] It is a schematic diagram of the deformation region structure of the bending design with a substantially concave-shaped contour of the high-reliability smart pressure sensor according to the embodiment of the present invention. [Figure 20] It is a schematic diagram of the distribution of the optimal strain points of the bending structure with a substantially concave-shaped contour of the high-reliability smart pressure sensor according to the embodiment of the present invention. [Figure 21] It is a schematic diagram of the mounting structure of a single full-bridge pressure sensing chip in the bending structure with a substantially concave-shaped contour of the high-reliability smart pressure sensor according to the embodiment of the present invention. [Figure 22] It is a schematic diagram of the mounting structure of two full-bridge pressure sensing chips in the bending structure with a substantially concave-shaped contour of the high-reliability smart pressure sensor according to the embodiment of the present invention. [Figure 23] It is a schematic diagram of the mounting structure of a plurality of core bodies such as a full-bridge micromelt core body, a half-bridge microfusion core MSG, a sputtering thin film sensing core, and a thick film resistive sensing core in the bending structure with a substantially concave-shaped contour of the high-reliability smart pressure sensor according to the embodiment of the present invention. [Figure 24]This is a schematic diagram of the force analysis of the metal strain region of a bent structure with a substantially concave contour of a highly reliable smart pressure sensor according to an embodiment of the present invention. [Figure 25] This is a schematic diagram of the elastic strain curve in the metal strain region of a bending structure with a substantially concave contour of a highly reliable smart pressure sensor according to an embodiment of the present invention. [Figure 26] This is a schematic diagram of the directional deformation curve of the metal strain region in a bent structure with a substantially concave contour of a highly reliable smart pressure sensor according to an embodiment of the present invention. [Modes for carrying out the invention]

[0019] To make the objectives, technical means, and advantages of the embodiments of the present invention clearer and easier to understand, the technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the drawings of the embodiments. Of course, the embodiments described are not all embodiments, but only some embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments that those skilled in the art could obtain without creative work are all within the scope of the present invention.

[0020] <Example 1> Referring to Figures 1-6, a highly reliable smart pressure sensor comprises a smart sensor body 10, the smart sensor body 10 comprising a pressure port 11, a metal strain region 12 provided in the pressure port 11, a full-bridge pressure sensing chip 13, an adjustment chip wiring portion PCB 112, a PCB holder 15, and a metal outer shell 17, the adjustment chip wiring portion PCB 112 being welded to the PCB holder 15, a plastic spring bracket 18 being provided inside the top end of the PCB holder 15, a spring 16 being mounted inside the plastic spring bracket 18, and a bent leg 113 being provided at the bottom end of the spring 16, and the spring 16 is bent leg 11 The pressure port 11 is welded to the adjustment chip wiring section PCB 112 by 3, two of which bent legs 113 are used to connect the positive and negative terminals of the adjustment chip wiring section PCB 112, and the other bent leg 113 is used to output the signal received by the adjustment chip wiring section PCB 112. The inside of the pressure port 11 is a hollow structure with one side closed, and a perforated structure 14 is provided inside the pressure port 11. The pressure port 11 is manufactured by integral press forming, and the perforated structure 14 is provided in the form of a single cylindrical hole 141 or a bent structure 142 with a substantially concave contour, and the bent structure 142 with a substantially concave contour is distributed symmetrically along the center line of the metal strain region 12 of the pressure port 11. With the above installation, by providing a structural design of bent legs 113 at the bottom of the new spring 16, all springs 16 can be welded on the same side, increasing production efficiency and welding reliability. Welding the bent legs 113 and the adjustment chip wiring section PCB 112 on the same side reduces the number of times the PCB board needs to be flipped, simplifying the assembly process and accelerating production speed. Welding on the same side also reduces defects such as cold welding and incomplete welding that may occur during welding, thereby improving the overall reliability of the product. Compared to welding on both sides, welding on the same side provides more uniform mechanical strength to the PCB, reducing deformation or damage due to uneven welding stress. Furthermore, welding on the same side is advantageous for optimizing the heat distribution of the PCB, reducing the risk of localized hot spots and helping to improve the operational stability and lifespan of the product.

[0021] <Example 2> The full-bridge pressure sensing chip 13 is directly connected to the signal input terminal of the adjustment chip wiring section PCB 112 via aluminum bonding wire 111. The aluminum bonding wire 111 provides a connection with low resistance and low inductive reactance, which helps maintain the integrity of signal transmission and reduce signal attenuation or interference. The direct connection design simplifies the assembly process, reduces the possibility of assembly errors, shortens production time, reduces the use of additional materials such as wires and connectors, and lowers the overall cost of the system.

[0022] Furthermore, the bottom end of the PCB holder 15 is fixedly connected to the pressure port 11, and a metal strain region 12 is provided on the side of the pressure port 11, which is used to attach the full-bridge pressure sensing chip 13. The metal strain region 12 deforms after being subjected to the impact of oil pressure, and this deformation is transmitted in a timely manner to the full-bridge pressure sensing chip 13 which is in close contact with it. Due to its sensitivity to oil pressure, the metal strain region 12 can respond quickly to pressure changes, and such immediate deformation is transmitted in a timely manner to the full-bridge pressure sensing chip 13, allowing the entire system to respond to pressure changes. The metal strain region 12 can be rapidly detected, and since it can generate small displacements proportional to the applied force, it can provide accurate deformation amounts. The full-bridge pressure sensing chip 13 converts these minute deformations into electrical signals, providing highly accurate pressure readings. The deformation in the metal strain region 12 usually has a good proportional relationship, meaning the relationship between deformation and applied force is linear. This is advantageous for the linear conversion of the full-bridge pressure sensing chip 13, thereby simplifying the signal processing process and improving the predictability of the measurement results.

[0023] The number of full-bridge pressure sensing chips 13 is at least one, there are at least three springs 16, the multiple full-bridge pressure sensing chips 13 are connected in parallel, and the chip is a full-bridge pressure sensing chip 13 when the perforated structure 14 is in the shape of a single cylindrical hole 141 or a bent structure 142 with a substantially concave contour, and the full-bridge pressure sensing chip 13 is a DAF MEMS (Direction Active Force). MEMS sensors, when connected in parallel, are linked by an electronic circuit. After precisely processing their output signals, they can be used to more accurately calculate the final pressure reading. Any pressure sensing unit is affected by temperature, causing errors. If two full-bridge units have the same design, their response to temperature changes will also be the same. Therefore, when connected in parallel, the resistance changes due to temperature in both units can be canceled out in the circuit. Ideally, the two parallel-connected units can withstand the applied pressure uniformly, thus minimizing errors due to uneven pressure distribution. Each pressure sensing unit has its own unique small deviations, and by connecting the two units in parallel, these deviations can be theoretically canceled out. Since the errors of the two units are usually random and independent, averaging them reduces the overall error. As described above, by placing the outputs of two full-bridge units into a single differential signal, the signal quality can be improved, and by measuring the voltage difference between the two units, noise and interference can be further reduced.

[0024] The full-bridge pressure sensing chip 13 generates and transmits corresponding SENT or other digital output signals or analog signals. The SENT (single-edge digital transmission) output is suitable for applications requiring high signal integrity and interference immunity, while the dual analog output offers the flexibility of being compatible with conventional analog interfaces and can be applied to a wide range of control systems. The choice of such output methods allows the sensor to be better integrated into various electronic systems. The SENT or other digital output signals or analog signal output uses three springs 16, while the dual analog output or I2C uses four springs 16. The selection of the number and type of springs 16 not only provides the possibility of different types of signal output, but also allows the sensor to handle load, vibration, and mounting. This also means that the design can be optimized according to the needs of the application, thereby improving performance and reliability in various environments. The full-bridge pressure sensing chip 13 is fabricated based on single-crystal silicon, polycrystalline silicon, or gallium nitride material and SOI process technology, where SOI is silicon on an insulating substrate. This technology introduces a layer of embedded oxide between the top silicon and the back substrate to effectively reduce interference between electronic elements and improve the reliability and performance of the sensor. By using materials such as single-crystal silicon, polycrystalline silicon, or gallium nitride and combining them with the SOI process, the performance of the sensor, such as sensitivity, temperature range, and chemical resistance, can be customized according to the needs of different applications. The selection of these materials provides the sensor with the ability to operate in harsh environments.

[0025] <Example 3> When the perforated structure 14 is in the shape of a single cylindrical hole 141 (see Figures 11-17), there is only one region where the full-bridge pressure sensing chip 13 can be installed (i.e., the optimal strain point shown in the figure) (at this time, the full-bridge pressure sensing chip 13, i.e., DAF (Only MEMS sensors are selectable), the region is closest to the outer wall of the metal strain region 12 of the cylindrical hole 141, and in this structure, the pressure generated inside the metal strain region 12 can be monitored with only one full-bridge pressure sensing chip 13, in which case the deformation of the surface of the metal strain region 12 diverges outward from the center of the optimal strain point to a single point, as shown in Figure 15, and the full-bridge pressure sensing chip 13 can capture a concentrated signal, which helps to improve the accuracy and repeatability of the measurement, and such a design is particularly suitable for applications that need to monitor small-range or concentrated pressure, in which case the elastic strain and directional deformation curves in the metal strain region 12 are shown in Figures 16 and 17, respectively.

[0026] <Example 4> When the perforated structure 14 is a bent structure 142 with a roughly concave contour (see Figures 18-26), there are four areas where the full-bridge pressure sensing chip 13 can be installed. These four areas (optimal strain points) are distributed symmetrically along the center line of the metal strain region 12 of the pressurizing port 11. At these four optimal strain points, the deformation force (see Figure 15), which is the pressure signal value monitored by the full-bridge pressure sensing chip 13 and subjected to the metal strain region 12, is similar (within the allowable error range). The full-bridge pressure sensing chip 13 is in close contact with the corresponding area on the outer wall of the metal strain region 12. The above design allows for flexible adjustment of the mounting position of the full-bridge pressure sensing chip 13 as needed, as long as it is within one of four optimal strain points. When switching between multiple similar applications, this design reduces the need to redesign the sensor for each application, saving costs and time. By mounting the full-bridge pressure sensing chip 13 at four crucial optimal strain points, it ensures the provision of stable and reliable pressure monitoring data within the overall operating range of the sensor system, while maintaining sufficient flexibility to adapt to rapidly changing application demands.

[0027] The full-bridge pressure sensing chip 13 is distributed around the centerline of the pressurizing port 11, enabling it to provide more accurate pressure change data. Such multi-point monitoring can improve pressure resolution, which is especially important for applications requiring accurate pressure mapping. The symmetrical distribution along the centerline of the pressurizing port 11 in four areas helps to balance the signals under load conditions, thus reducing offset errors and providing more accurate pressure readings. The use of multiple sensing units ensures that measurement functionality can be maintained even if one unit fails, improving system reliability and stability.

[0028] The roughly concave-shaped bent structure 142 generates a complex stress distribution (see Figures 19-20), and by attaching full-bridge pressure sensing chips 13 to four critical regions (optimal strain points), such a complex stress distribution can be better monitored and analyzed. In particular, when high-precision measurement is required, if the load conditions are non-uniform or change, the four optimal strain points provide more data points and are useful for analyzing the load-bearing conditions of the entire pressurized port 11.

[0029] <Example 5> The full-bridge pressure sensing chip 13 may be a single full-bridge or two half-bridge micro-strain gauge (MSG) cores, i.e., a full-bridge micro-strain core 131 and a half-bridge micro-strain core 132, a sputtering thin-film sensing core, a thick-film resistive sensing core, etc. If the perforated structure 14 is a bent structure 142 with a roughly concave contour, a single full-bridge pressure sensing chip 13 can be replaced with one full-bridge micro-strain core 131 or two half-bridge micro-strain cores 132. Mounting can be customized according to specific application needs by selecting different numbers of full-bridge pressure sensing chips 13 and springs 16, as shown in Figures 9-10, making the sensor more compatible. Such flexibility allows the sensor to be applied to simple to complex pressure measurement scenes.

[0030] In the roughly concave-shaped bent structure 142, the multiple full-bridge pressure sensing chips 13 are divided into single-sided mounting and double-sided mounting (with the center line of the pressure port 11 as the boundary line). A schematic diagram of the attachment positions of the full-bridge pressure sensing chips 13 on the strained surface of the roughly concave-shaped bent structure 142 can be seen in Figure 21, and a schematic diagram of the attachment positions of the double full-bridge pressure sensing chips 13 on the strained surface of the roughly concave-shaped bent structure 142 can be seen in Figure 22.

[0031] Micromelt technology half-bridge strain gauges (i.e., half-bridge micromelt cores 132), full-bridge strain gauges (full-bridge micromelt cores 131), and sensing cores that construct other strain region thick-film printed resistors (sputtering thin-film sensing cores, thick-film resistive sensing cores, etc.) can also be applied to the contour bending structure (see Figure 23). A single full-bridge micromelt core 131 can span two or three optimal strain points, and the specific mounting method can be adjusted according to the length of the full-bridge micromelt core 131. Two half-bridge micromelt cores 132 each span two optimal strain points on either side of the center line of the pressurized port 11, thereby forming a signal path. Thus, this sensor is compatible with sensing chips of different specifications as needed, greatly improving the universality of the equipment.

[0032] The operating principle of this highly reliable smart pressure sensor is as follows: First, the smart sensor body 10 is mounted in the operating area. When vibration or shaking occurs from the outside, oil enters the perforated structure 14 through the pressurizing port 11. At this time, the liquid impacts the metal strain area 12, causing the metal strain area 12 to deform. This deformation is transmitted to the full-bridge pressure sensing chip 13 mounted at the optimal strain point. The full-bridge pressure sensing chip 13 transmits this signal to the adjustment chip wiring section PCB 112 via aluminum bonding wire 111. Finally, it outputs the pressure signal via bent legs 113 and spring 16, thereby achieving accurate pressure measurement. The spring 16 is welded to the adjustment chip wiring section PCB 112 via bent legs 113. Two bent legs 113 are used to connect the positive and negative poles of the adjustment chip wiring section PCB 112 and are responsible for power supply, while the other bent leg 113 is used to output the signal received by the adjustment chip wiring section PCB 112.

[0033] By incorporating a bent leg structure design at the bottom of the new spring, all springs can be welded to the same surface, increasing production efficiency and welding reliability. Furthermore, by installing the spring 16 and the plastic spring bracket, the bent leg 113 and the adjustment chip wiring section PCB 112 can be welded to the same side, reducing the number of times the PCB board needs to be inverted, simplifying the assembly process, and thereby accelerating production speed.

[0034] By dividing the perforated structure 14 into a single cylindrical hole 141 and a bent structure 142 with a roughly concave contour, the sensor can be applied to different application environments. By attaching the full-bridge pressure sensing chip 13 to the outer wall of the metal strain region 12, the sensing area of ​​the smart sensor body 10 can be increased, thereby improving the responsiveness to pressure changes and the sensitivity of measurement. By adopting the installation of the innovative roughly concave contour bent structure 142, more optimal strain points can be created in the metal strain region 12, and these points become more pronounced under the action of fluid pressure, thereby increasing the detection capability of the smart sensor body 10 to slight deformations.

[0035] Users can selectively install the sensing chip according to their actual needs and specifications, resulting in better compatibility. This flexibility allows the smart sensor body 10 to be applied to a wider range of operating conditions and environments. The different perforation structures 14 allow the sensor to be applied to measuring different pressure ranges and environments, such as liquid and gas pressure, increasing the flexibility of the sensor's application. Thus, such a sensor design can provide users with higher quality data and enhance the product's competitiveness in the market.

[0036] In the description of this invention, terms indicating direction and positional relationships such as "center," "vertical direction," "horizontal direction," "length," "width," "thickness," "top," "bottom," "front," "back," "left," "right," "perpendicular," "horizontal," "top," "bottom," "inside," "outside," "clockwise," and "counterclockwise" are merely used to facilitate and simplify the explanation of this invention based on the directions or positional relationships shown in the drawings. They do not indicate, or implicitly suggest, that the equipment or element being referred to must have a specific direction, configuration, or operation in a specific direction, and should not be considered to limit this invention.

[0037] The foregoing are merely preferred embodiments of the present invention and are not intended to limit it. To those skilled in the art, the present invention is subject to various modifications and changes. Any modifications, equivalent substitutions, improvements, etc., made without departing from the spirit and principles of the present invention should be within the scope of protection of the present invention. [Explanation of symbols]

[0038] 10. Smart Sensor Unit 11. Pressurized port 12. Metal strain region 13. Full-bridge pressure sensing chip 14, Porous structure 15. PCB holder 16. Spring 17. Metal outer shell 18. Plastic spring bracket 111. Aluminum bonding wire 112. Adjustment chip wiring section PCB 113, Bent Legs 131. Core for full bridge micro-melting 132. Core for half-bridge micro-melting 141, Single cylindrical hole 142. Bending structure with a roughly concave contour

Claims

1. A highly reliable smart pressure sensor comprising a smart sensor body (10), wherein the smart sensor body (10) comprises a pressurizing port (11), a metal strain region (12) provided in the pressurizing port (11), a full-bridge pressure sensing chip (13), an adjustment chip wiring portion PCB (112), a PCB holder (15), and a metal outer shell (17), wherein the adjustment chip wiring portion PCB (112) is welded and fixed to the PCB holder (15), and a plastic spring bracket (18) is provided inside the top end of the PCB holder (15), and the plastic spring bracket A highly reliable smart pressure sensor characterized by having a spring (16) mounted inside a t (18), a bent leg (113) provided at the bottom end of the spring (16), the spring (16) being welded to an adjustment chip wiring portion PCB (112) via the bent leg (113), the bottom end of the PCB holder (15) being fixedly connected to a pressure port (11), a metal strain region (12) provided on the side of the pressure port (11), the inside of the pressure port (11) being a hollow structure with one side closed, and a perforated structure (14) provided inside the pressure port (11).

2. The high-reliability smart pressure sensor according to claim 1, characterized in that the pressure port (11) is formed by integral machining, the hole-like structure (14) is provided in the shape of a single cylindrical hole (141) (see Figure 12) or a bent structure (142) with a substantially concave contour (see Figure 19), and the bent structure with a substantially concave contour is distributed symmetrically along the center line of the metal strain region (12) of the pressure port (11).

3. The highly reliable smart pressure sensor according to claim 2, characterized in that when the perforated structure (14) is in the shape of a single cylindrical hole (141), there is one area in which the full-bridge pressure sensing chip (13) can be installed, and this area is closest to the outer wall of the metal strain region (12) of the single cylindrical hole (141); and when the perforated structure (14) is a bent structure (142) with a substantially concave contour, there are four areas in which the full-bridge pressure sensing chip (13) can be installed, and the four areas are distributed symmetrically along the center line of the metal strain region (12) of the pressurizing port (11).

4. The highly reliable smart pressure sensor according to claim 3, characterized in that the full-bridge pressure sensing chip (13) is provided in close contact with a corresponding region of the outer wall of the metal strain region (12).

5. The highly reliable smart pressure sensor according to claim 1, characterized in that the full-bridge pressure sensing chip (13) is directly connected to the signal input terminal of the adjustment chip wiring portion PCB (112) via an aluminum bonding wire (111).

6. The highly reliable smart pressure sensor according to claim 1, characterized in that the number of full-bridge pressure sensing chips (13) is at least one, and the springs (16) are provided with at least three.

7. The high-reliability smart pressure sensor according to claim 1, characterized in that a plurality of full-bridge pressure sensing chips (13) are connected in parallel, the chip is a full-bridge pressure sensing chip (13) when the perforated structure (14) is in the shape of a single cylindrical hole (141) or a bent structure (142) with a substantially concave contour, and the full-bridge pressure sensing chip (13) is a DAF MEMS (Direction Active Force MEMS) sensor, which may be a single full-bridge or two half-bridge micro-strain gauge (MSG), a sputtered thin-film sensing core, a thick-film resistive sensing core, etc.

8. The full-bridge pressure sensing chip (13) is fabricated based on single-crystal silicon, polycrystalline silicon, or gallium nitride material and SOI process technology, wherein the SOI is silicon on an insulating substrate, and a layer of embedded oxide is introduced between the top silicon and the back substrate, characterized in that it is a highly reliable smart pressure sensor according to claim 1.

9. The highly reliable smart pressure sensor according to claim 1, characterized in that the full-bridge pressure sensing chip (13) generates and transmits a corresponding SENT or other digital output signal or analog signal.

10. The highly reliable smart pressure sensor according to claim 1, characterized in that the SENT output or other digital output signal or analog signal output uses three springs (16), and the dual analog output or I2C uses four springs (16).

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