Removable adhesive tape

Abstract

The present invention relates to a curable and electrochemically peelable adhesive tape comprising an adhesive composition comprising a) at least one epoxide compound; b) a curing agent comprising one or more compounds having at least one epoxide-reactive group and no disulfide functional group; c) a restorative agent comprising one or more compounds comprising at least one disulfide functional group and optionally at least one epoxide-reactive group selected from hydroxyl; thiol; amine; or carboxyl; d) a toughening agent; and d) an electrolyte, wherein the composition is characterized in that the molar ratio of epoxide-reactive groups to epoxide groups is 0.6:1 to 1.3:1.

Claims

1. a) At least one epoxide compound; b) A curing agent comprising one or more compounds having at least one epoxide reactive group and not having a disulfide functional group; c) A repair agent comprising one or more compounds having at least one disulfide functional group and optionally at least one epoxide reactive group selected from hydroxyl; thiol; amine; or carboxyl; d) Toughening agents; and d) Electrolytes A curable and electrochemically removable adhesive tape comprising an adhesive composition containing, The aforementioned composition is a tape in which the molar ratio of epoxide-reactive groups to epoxide groups is 0.6:1 to 1.3:

1.

2. The composition is determined based on the weight of the composition. 15-50% by weight of a) at least one epoxide compound; b) a curing agent comprising 0.01 to 25% by weight of one or more compounds having at least two epoxide reactive groups and no disulfide functional groups; c) the repair agent in an amount of 0.01 to 10% by weight; d) the toughening agent in an amount of 0.01 to 10% by weight; e) the electrolyte in an amount of 0.5 to 15% by weight; and 0-55% by weight (g) rheology control agent, Includes, The tape according to claim 1, wherein the composition has a molar ratio of epoxide-reactive groups to epoxide groups of 0.6:1 to 1.3:

1.

3. The composition is determined based on the weight of the composition. a) at least one epoxide compound in an amount of 20 to 50% by weight, preferably 20 to 40% by weight; The curing agent comprises one or more compounds having at least two epoxide-reactive groups and no disulfide functional groups, in an amount of 5 to 25% by weight, preferably 5 to 20% by weight; c) the restorative agent in an amount of 1 to 10% by weight, preferably 2 to 8% by weight; d) the toughening agent in an amount of 1 to 10% by weight, preferably 3 to 9% by weight; e) the electrolyte in an amount of 0.5 to 10% by weight, preferably 0.5 to 5% by weight; and 1 to 55% by weight, preferably 15 to 55% by weight of the rheology control agent (g) Includes, The tape according to claim 2, characterized in that the composition has a molar ratio of epoxide-reactive groups to epoxide groups of 0.75:1 to 0.95:1 or 1.05:1 to 1.3:

1.

4. The tape according to any one of claims 1 to 3, wherein the epoxide compound is selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, and mixtures thereof.

5. b) The tape according to any one of claims 1 to 4, wherein the curing agent comprises or comprises a thiol-functional compound selected from the group consisting of pentaerythritol tetramercaptoacetate (PETMP), tris-(3-mercaptopropionate) (TMP), trimethylolpropane trimercaptoacetate (TMPMP), tris(2-(mercaptopropionyloxy)ethyl) isocyanate, glycol dimercaptoacetate, and mixtures thereof.

6. The tape according to any one of claims 1 to 5, wherein the repair agent comprises a compound selected from the group consisting of bis(4-aminophenyl) disulfide; bis(2-aminophenyl) disulfide; 2-amino-4-chlorophenyl disulfide; and mixtures thereof.

7. The tape according to any one of claims 1 to 5, wherein the repair agent comprises a compound selected from the group consisting of 3,3'-dithiopropionic acid; 4,4'-dithiobutyric acid; bis-(10-carboxydecyl) disulfide; 2,2'-dithiobisethaneamine (cystamine); (2R)-2-amino-3-[[(2R)-2-amino-2-carboxyethyl]disulfanyl]propanoic acid (L-cystine); and mixtures thereof.

8. The tape according to any one of claims 1 to 5, wherein the repair agent comprises a liquid mercaptan-terminated polysulfide polymer.

9. The tape according to any one of claims 1 to 8, wherein the toughening agent is a liquid thiol-terminated polysulfide polymer.

10. The toughening agent is defined by formula I: 【Chemistry 1】 The tape according to claim 9, having the chemical structure.

11. The electrolytes are 1-ethyl-3-methyl-1H-imidazole-3-ummethanesulfonate; 1-ethyl-3-methyl-1H-imidazole-3-ummethylsulfate; 1-methylimidazolium bis(trifluoromethylsulfonyl)imide; 3-methylimidazolium bis(trifluoromethylsulfonyl)imide; 1-ethyl-3 - Methylimidazolium bis(trifluoromethylsulfonyl)imide; 1-Propyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide; 1-Butyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide; 1-Butyl-2,3-dimethylimidazolium bis(trifluoromethylsulfonyl)imide; 1-Hexyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide; 1-Octyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide; 1-Methyl-3-octylimidazolium bis(trifluoromethylsulfonyl)imide; 1-Decyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide; 1-Dodecyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide; Tetraethylphosphonium bis(trifluoromethylsulfonyl)imide; Tetrabutylphosphonium bis(trifluoromethylsulfonyl) The electrolyte is selected from the group consisting of bis(trifluoromethylsulfonyl)imide; tetraoctylphosphonium bis(trifluoromethylsulfonyl)imide; trihexyl(tetradecyl)phosphonium bis(trifluoromethylsulfonyl)imide; tridecyl(tetradecyl)phosphonium bis(trifluoromethylsulfonyl)imide; tributyl(methyl)phosphonium diethyl phosphate; tributyl(ethyl)phosphonium diethyl phosphate; tetraoctylphosphonium diethyl phosphate; and mixtures thereof, preferably the electrolyte is 1-ethyl-3-methyl-1H-imidazole-3-ummethanesulfonate; 1-ethyl-3-methyl-1H-imidazole-3-ummethyl sulfate; trihexyl(tetradecyl)phosphonium bis(trifluoromethylsulfonyl)imide; tributyl(methyl)phosphonium diethyl phosphate; tributyl(ethyl)phosphonium diethyl phosphate;A tape according to any one of claims 1 to 10, selected from the group consisting of and mixtures thereof.

12. The tape according to any one of claims 2 to 11, wherein the rheology control agent comprises a nonconductive filler selected from the group consisting of calcium carbonate, calcium oxide, calcium metasilicate, fumed silica, silica, talcam, barium sulfate, and mixtures thereof.

13. A first substrate having a conductive surface; and A second substrate having a conductive surface; A combined structure including, A bonding structure in which the cured tape according to any one of claims 1 to 12 is disposed between the first and second substrates.

14. A method for peeling off a bonded structure according to claim 13, i) A step of applying a voltage to both surfaces to form an anode interface and a cathode interface; and ii) Step of peeling off both surfaces A method that includes this.

15. The method according to claim 14, wherein the voltage applied in step i) is 0.5 to 100V, and is preferably applied for 1 second to 60 minutes.

16. A method for processing a combined structure according to claim 13, i) A step of applying a voltage to both surfaces to form an anode interface and a cathode interface; ii) A step of providing a first substrate having the cured tape, which is formed by peeling off both surfaces and placing it on the conductive surface of the substrate; iii) A step of bringing the first substrate into contact with the third substrate such that the curing tape is interposed between the first substrate and the third substrate, and iv) A step of heat-treating the cured tape to bond the first and third substrates together. A method that includes this.

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