Electrospun tissue repair scaffold material with suture management

JP2026520456APending Publication Date: 2026-06-23NFS IP HOLDINGS LLC +1

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
NFS IP HOLDINGS LLC
Filing Date
2024-05-24
Publication Date
2026-06-23

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Abstract

Electrospun onlay for rotator cuff repair and related procedures. The onlay includes an opening and a conduit extending toward the opening, the longitudinal axis of which of the conduits is aligned with the opening. The opening and the conduit are configured so that one or more surgical sutures can be inserted through them. The scaffold material is electrospun from one or more biocompatible polymers. When used, the onlay functions as a tissue growth scaffold material, promoting tendon-bone reattachment.
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