Non-contact temperature sensor for mirrors, projection lens, and method for measuring the temperature of mirrors.

JP2026520486APending Publication Date: 2026-06-23CARL ZEISS SMT GMBH

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
CARL ZEISS SMT GMBH
Filing Date
2024-05-24
Publication Date
2026-06-23

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Abstract

The present invention relates to a mirror device (100) for a microlithography projection exposure apparatus (600, 700), comprising at least one mirror (101), which includes a mirror body (102) and a reflective surface (103) formed on the mirror body (102), and having at least one recess (104) that extends from the back of the mirror body (102) far from the reflective surface (103) through the mirror body (102) toward the reflective surface (103), and the recess (104) having a measurement area (105) at its end toward the reflective surface (103) that is thermally connected to the reflective surface (103), and a sensor unit (106), the mirror device (100). The sensor unit (106) is formed as an infrared temperature sensor and is configured to non-contact determine the temperature of the measurement area (105).
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Claims

1. A mirror device (100) for a microlithography projection exposure apparatus (600, 700), comprising at least one mirror (101), the mirror (101) comprising a mirror body (102) and a reflective surface (103) formed on the mirror body (102), the presence of at least one recess (104) extending from the back surface of the mirror body (102) far from the reflective surface (103) through the mirror body (102) toward the reflective surface (103), and the recess (104) having a measurement area (105) at its end toward the reflective surface (103) that is thermally connected to the reflective surface (103), and a sensor unit (106), wherein the sensor unit (106) is formed as an infrared temperature sensor and is configured to non-contact determine the temperature of the measurement area (105).

2. A mirror device (100) according to claim 1, characterized in that the at least one recess is in the form of a hole.

3. A mirror device (100) according to claim 1 or 2, characterized in that the sensor unit (106) is arranged to be separated from the mirror body (102).

4. A mirror device (100) according to any one of claims 1 to 3, characterized in that the mirror body (102) is mounted on a frame (107) and the sensor unit (106) is arranged on the frame (107).

5. A mirror device (100) according to any one of claims 1 to 3, characterized in that the mirror body (102) is supported by a bearing and the sensor unit (106) is arranged on the bearing.

6. A mirror device (100) according to any one of claims 1 to 5, wherein the sensor unit (106) includes an optical system (108), an infrared detector (109), and an electronic circuit (110) associated with the infrared detector, and the optical system (108) is arranged between the measurement area (105) and the infrared detector.

7. A mirror device (100) according to claim 6, wherein the optical system (108) includes at least one lens element (111).

8. A mirror device (100) according to any one of claims 1 to 7, characterized in that the sensor unit (106) is at least partially housed in the recess (104).

9. A mirror device (100) according to any one of claims 6 to 8, wherein the optical system (108) includes a light guide (112) in which at least a specific area is housed in the recess (104) or a light guide (112) that penetrates the recess (104) in the direction of the measurement area (105).

10. A mirror device (100) according to any one of claims 1 to 7, characterized in that the sensor unit (106) is positioned outside the recess (104), and a deflection mirror (113) is further positioned outside the recess (104) so ​​that the measurement signal from the measurement area (105) is deflected toward the optical system (108) and / or the infrared detector (109).

11. A mirror device (100) according to any one of claims 1 to 10, characterized in that a target (114) is formed in the measurement area (105), and the target (114) has a higher emissivity to infrared rays than the inner wall (115) of the recess (104) or the area other than the bottom of the recess (104).

12. A mirror device (100) according to any one of claims 1 to 11, characterized in that there are a plurality of recesses (104) formed apart from each other and extending from the back surface of the mirror body (102) in the direction of the reflective surface (103), and a sensor unit (106) in the form of an infrared temperature sensor is associated with each of the recesses (104).

13. A projection exposure lens for a microlithography projection exposure apparatus (600, 700), wherein a mask (621, 704) is imaged onto a lithography object by a plurality of mirror devices (100), and at least one of the mirror devices (100) is in the form of a mirror device (100) according to any one of claims 1 to 12.

14. A method for measuring the temperature of a mirror (101) of a microlithography projection exposure apparatus (600, 700), wherein the mirror (101) includes a mirror body (102) and a reflective surface (103) formed on the mirror body (102), at least one recess (104) is formed on the mirror body (102) extending from the back surface of the mirror body (102) toward the reflective surface (103), a thermally connected measurement area (105) is positioned at the end of the recess on the reflective surface (103) side, an infrared measurement signal is acquired non-contact with respect to the measurement area (105) using a sensor unit (106) in the form of an infrared temperature sensor, and a temperature value of the measurement area is derived from the infrared measurement signal.