Photocurable adhesive composition with improved adhesion performance to low surface energy substrates
A one-component photocurable adhesive composition with polybutadiene urethane acrylate and polydimethylsiloxane difunctional (meth)acrylate oligomers addresses poor adhesion and safety issues in LSE substrates, providing strong bonding and simplifying the manufacturing process.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- HENKEL KGAA
- Filing Date
- 2024-05-29
- Publication Date
- 2026-06-26
AI Technical Summary
Existing adhesives for low surface energy (LSE) substrates face challenges with poor adhesive properties and safety concerns, particularly in medical applications, due to the use of activators and solvents that are hazardous and require multiple steps.
A one-component photocurable adhesive composition comprising polybutadiene urethane acrylate oligomer, (meth)acrylate monomer, polyurethane acrylate oligomer, and photocurable polydimethylsiloxane difunctional (meth)acrylate oligomer, which provides high adhesion to LSE substrates without activators or primers, using a simplified process.
The composition achieves strong adhesive bonding to LSE substrates, enhancing manufacturing safety and efficiency by eliminating the need for solvents and reducing process steps while maintaining high tensile lap shear strength.
Smart Images
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