Lighting devices and headlamps

Abstract

The lighting device according to the embodiment includes a heat dissipation plate including a recess, a circuit board disposed in the recess and having a pad, a light source unit disposed on the heat dissipation plate and including a bonding pad and a light-emitting element, a connecting member connecting the pad of the circuit board and the bonding pad of the light source unit, and a sealing portion disposed on the connecting member, wherein the sealing portion includes a first sealing portion that forms the outer edge and a second sealing portion disposed inside the outer edge, and the first sealing portion and the second sealing portion contain the same resin composition.

Description

Technical Field

[0001] The embodiments relate to a lighting device and a headlamp having the same.

Background Art

[0002] Applications of lighting include vehicle lighting, backlights for displays and signs. Light-emitting diodes (LEDs) have advantages such as low power consumption, semi-permanent life, fast response speed, safety, and environmental friendliness compared to light sources such as fluorescent lamps and incandescent lamps. The light-emitting diodes are applied to various lighting devices such as various display devices, indoor lights, or outdoor lights.

[0003] Recently, as a vehicle light source, a lamp adopting a light-emitting diode has been proposed. Compared with an incandescent lamp, the light-emitting diode is advantageous in that it has low power consumption. In addition, since the light-emitting diode has a small size, the degree of freedom in the design of the lamp can be increased, and it also has economic efficiency due to its semi-permanent life. However, since the emission angle of the light emitted from the light-emitting diode is small, when using the light-emitting diode as a vehicle lamp, there is a requirement for an increase in the light-emitting area of the lamp using the light-emitting diode. As a prior art related to a lighting device, Korean Patent Publication No. 10-2023-0010550 (January 19, 2023) is disclosed.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The embodiments provide a lighting device having improved reliability. The embodiments provide a headlamp having the lighting device.

Means for Solving the Problems

[0005] The lighting device according to the embodiment includes a heat dissipation plate including a recess; a circuit board disposed in the recess and having a pad; a light source unit disposed on the heat dissipation plate and including a bonding pad and a light-emitting element; a connecting member connecting the pad of the circuit board and the bonding pad of the light source unit; and a sealing portion disposed on the connecting member, wherein the sealing portion includes a first sealing portion that forms the outer edge and a second sealing portion disposed inside the outer edge, and the first sealing portion and the second sealing portion may contain the same resin composition.

[0006] According to embodiments of the invention, the resin composition comprises a base resin and a filler, the base resin comprises an oligomer, a monomer and a photoinitiator, the oligomer is present in an amount of 45% to 65% by weight of the total weight of the resin composition, the monomer is present in an amount of 30% to 50% by weight of the total weight of the resin composition, the photoinitiator is present in an amount of 1% to 5% by weight of the total weight of the resin composition, and the filler is present in an amount of 2% to 10% by weight of the total weight of the resin composition. The modulus of the resin composition after curing may be in the range of 100 MPa to 8000 MPa. The thixotropy of the resin composition before curing may be in the range of 2 to 4. The particle size of the filler may be in the range of 5 μm to 30 μm.

[0007] According to an embodiment of the invention, the connecting member includes one end connected to the bonding pad of the light source, the other end connected to the pad of the circuit board, and a center portion extending from the one end toward the other end, and the first sealing portion includes a 1-1 sealing portion located near the one end, a 1-2 sealing portion located near the other end, and a 1-3 sealing portion connecting the 1-1 sealing portion and the 1-2 sealing portion, and the 1-1 sealing portion, the 1-2 sealing portion and the 1-3 sealing portion may be integrally formed.

[0008] According to an embodiment of the invention, the maximum height of the second sealing portion may be in the range of more than 1 to 5 times the maximum height of the first sealing portion.

[0009] According to embodiments of the invention, the maximum height of the 1-2 sealing section may be greater than or equal to the maximum height of the 1-1 sealing section. The maximum height of the 1-2 sealing section may be in the range of 1 to 2.5 times the maximum height of the 1-1 sealing section.

[0010] According to an embodiment of the invention, the second sealing portion and the connecting member are separated by a first interval, the first interval being defined by the distance between the maximum height of the connecting member and the second sealing portion, and the first interval may be in the range of 100 μm to 200 μm.

[0011] According to an embodiment of the invention, the 1-1 sealing portion and the light-emitting element are separated by a second interval, and the second interval may be in the range of 0.8 mm to 1 mm.

[0012] According to an embodiment of the invention, the light emitted from the light-emitting element and the first sealing portion form a first angle, the light emitted from the light-emitting element and the second sealing portion form a second angle, and at least one of the first angle and the second angle may be 30° or less.

[0013] According to an embodiment of the invention, the connecting member includes one end connected to the bonding pad of the light source, the other end connected to the pad of the circuit board, and a center portion extending from the one end toward the other end, and the first sealing portion includes a 1-1 sealing portion located near the one end, a 1-2 sealing portion located near the other end, and a 1-3 sealing portion connecting the 1-1 sealing portion and the 1-2 sealing portion, and the 1-1 sealing The sealing portion includes a 1-1a sealing portion and a 1-1b sealing portion, wherein the 1-1a sealing portion is positioned closer to one end than the 1-1b sealing portion, the 1-2 sealing portion includes a 1-2a sealing portion and a 1-2b sealing portion, wherein the 1-2a sealing portion is positioned closer to the other end than the 1-2b sealing portion, and the 1-1 sealing portion may include a 1-3a sealing portion and a 1-3b sealing portion. According to an embodiment of the invention, the 1-1a sealing portion, the 1-2a sealing portion and the 1-3a sealing portion form a first outer peripheral edge, the 1-1b sealing portion, the 1-2b sealing portion and the 1-3b sealing portion form a second outer peripheral edge, and the first outer peripheral edge and the second outer peripheral edge can be separated.

[0014] According to an embodiment of the invention, the second sealing portion is arranged inside the first outer peripheral edge. The height of the first outer peripheral edge may be greater than or equal to the height of the second outer peripheral edge.

[0015] A headlamp according to an embodiment of the invention includes a housing and a light source module disposed inside the housing, wherein the light source module may include the lighting device disclosed above. [Effects of the Invention]

[0016] The lighting device according to the embodiment includes a sealing section. The sealing section protects the connecting member connected to the light source and prevents the connecting member from being damaged by external impacts. This improves the reliability of the lighting device.

[0017] The sealing portion includes a first sealing portion and a second sealing portion. The first sealing portion forms the outer periphery of the sealing portion. The second sealing portion is located inside the outer periphery. The first sealing portion and the second sealing portion are formed from a resin composition. The resin composition includes an oligomer, a monomer, a photoinitiator, and a filler. The oligomer, the monomer, the photoinitiator, and the filler are included in a set weight percent. This allows for control of the thixotropy and elasticity of the resin composition. Specifically, the resin composition can satisfy the thixotropy required by the first sealing portion. Furthermore, the resin composition can satisfy the elasticity required by the second sealing portion. Therefore, the first sealing portion and the second sealing portion can be formed from the same resin composition. Furthermore, the first sealing portion and the second sealing portion can be formed by the same process. This improves the process efficiency of forming the sealing portion.

[0018] The heights of the first and second sealing sections are set to a specific height. The first sealing section protects the surface of the light-emitting element and suppresses light interference. The second sealing section covers the surface of the connecting member and protects the connecting member. This improves the reliability of the lighting device and reduces its size. [Brief explanation of the drawing]

[0019] [Figure 1] Figure 1 is a perspective view of a lighting device according to an embodiment, in which a connecting member is arranged between the light source and the circuit board. [Figure 2] Figure 2 is a side cross-sectional view of the lighting device having a sealing section in Figure 1. [Figure 3] Figure 3 is a partially enlarged view showing the light source, circuit board, and connecting members in the lighting device shown in Figure 1. [Figure 4]Figure 4 is a plan view of the lighting device having a sealing portion in FIG. 3. [Figure 5] Figure 5 is a plan view of the lighting device having a plurality of sealing portions in FIG. 3. [Figure 6] Figure 6 is a side cross-sectional view for explaining the connection of the light source portion of the lighting device of FIG. 5, the connecting member, and the heat dissipation plate. [Figure 7] Figure 7 is an enlarged view of the A region in FIG. 6. [Figure 8] Figure 8 is a photograph in which the light source portion of the lighting device according to the embodiment, the connecting member, and the heat dissipation plate are connected. [Figure 9] Figure 9 is a drawing for explaining the thickness ratio of the sealing portion in the A-A' region of FIG. 9. [Figure 10] Figure 10 is another plan view of the lighting device of FIG. 3. [Figure 11] Figure 11 is a side cross-sectional view for explaining the connection of the light source portion of the lighting device of FIG. 10, the connecting member, and the heat dissipation plate. [Figure 12] Figure 12 is an enlarged view of the B region in FIG. 11. [Figure 13] Figure 13 is a perspective view of a headlamp to which the lighting device according to the embodiment is applied.

Embodiments for Carrying Out the Invention

[0020] Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.

[0021] The technical concept of the present invention is not limited to the embodiments described, but can be embodied in a variety of different forms, and within the scope of the technical concept of the present invention, one or more components between embodiments can be selectively combined and substituted. Furthermore, unless otherwise clearly specifically defined, terms used in the embodiments of the present invention (including technical and scientific terms) can be interpreted in a way that is generally understood by a person with ordinary skill in the art to which the present invention belongs, and commonly used terms, such as those defined in dictionaries, can be interpreted considering their meaning in the context of the technology in question.

[0022] Furthermore, the terminology used in the embodiments of the present invention is for illustrative purposes only and is not intended to limit the invention. In this specification, singular forms may also include plural forms unless otherwise specified, and when it is written as "at least one (or more) of A and B, C", it may include one or more of all possible combinations of A, B, and C. In addition, terms such as first, second, A, B, (a), (b), etc., may be used in the description of the components of the embodiments of the present invention. Such terms are used to distinguish a component from other components, and the terms do not limit the nature or order of the component.

[0023] Furthermore, when it is stated that one component is “connected,” “joined,” or “connected” to another component, this includes not only cases where the component is directly connected, joined, or connected to the other component, but also cases where it is “connected,” “joined,” or “connected” by another component between that component and the other component.

[0024] Furthermore, when it is stated that a component is formed or positioned "above or below" each component, "above or below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or positioned between the two components. Also, when expressed as "above or below," it can include not only the upward direction relative to one component, but also the downward direction.

[0025] The following describes an embodiment of the lighting device with reference to the drawings.

[0026] Referring to Figures 1 to 9, the lighting device according to the embodiment may include a heat dissipation plate 101, a circuit board 110 disposed on the heat dissipation plate 101, a light source unit 130 disposed on the heat dissipation plate 101 and including a light-emitting element 131, connecting members 141 and 142 connecting the light source unit 130 and the circuit board 110, and a sealing unit 200 that seals the connecting members 141 and 142.

[0027] The aforementioned lighting device can be applied to a variety of lamp devices that require illumination. For example, the lighting device can be applied to vehicle lamps, household lighting devices, and industrial lighting devices. For example, the lighting device can be applied to vehicle lamps. The lighting device can be applied to headlamps, side mirror lights, side maker lights, fog lamps, tail lamps, brake lights, daytime running lights, vehicle interior lighting, door scuffs, rear combination lamps, and backup lamps. The lighting device can also be applied to indoor or outdoor advertising devices, display devices, and electric vehicles.

[0028] The heat dissipation plate 101 supports the circuit board 110. Heat generated on the circuit board 110 can be transferred by the heat dissipation plate 101. The heat dissipation plate 101 contains metal. For example, the heat dissipation plate 101 may consist of a laminated structure of multiple metal layers. The heat dissipation plate 101 may consist of a single layer or multiple layers. The heat dissipation plate 101 may include ceramic material, AlN, or aluminum material having an anodized surface layer. The metal layer may include at least one of Al, Ni, Mo, Cu, Cu-alloy, Cu-W, Ag, or Au. The heat dissipation plate 101 includes a heat dissipation section 102 and a side section 103. The heat dissipation section 102 includes a recess section 108. The circuit board 110 is placed in the recess section 108. The area of ​​the heat dissipation section 102 may be larger than the area of ​​the circuit board 110. The side portion 103 is bent backward from the edge of the heat dissipation portion 102. One or more side portions 103 may be arranged along the outside of the heat dissipation portion 102. An open space 109 is provided inside the side portion 103 and below the heat dissipation portion 102, or other structures may be attached. The heat dissipation plate 101 may be a support plate.

[0029] The recess 108 is formed to a predetermined depth from the upper surface of the heat dissipation portion 102 of the heat dissipation plate 101. The depth of the recess 108 may be the same as or different from the thickness of the circuit board 110. For example, the depth of the recess 108 may be less than the thickness of the circuit board 110. The top view shape of the recess 108 may be the same as the top view shape of the circuit board 110. For example, the top view shape of the recess 108 may include a polygonal shape.

[0030] The circuit board 110 is inserted into the recess 108. The bottom surfaces of the circuit board 110 and the recess 108 may be bonded together by an adhesive member 155. The adhesive member 155 may include a thermally conductive adhesive. The top surface of the circuit board 110 may be coplanar with the top surface of the heat dissipation plate 101. As an alternative example, the top surface of the circuit board 110 may be positioned higher than the top surface of the heat dissipation plate 101. As shown in Figure 6, the adhesive member 155 is positioned around the outside of the recess 108. This causes the surface of the heat dissipation portion 102 to be bonded to the circuit board 110.

[0031] The circuit board 110 may include a resin material or a metal material. For example, the circuit board 110 may include one of the following: a ceramic PCB, an MCPCB (Metal Core PCB), a flexible PCB (FPCB, Flexible PCB), and a resin PCB. The circuit board 110 may include a circuit layer having a metal layer at the bottom and a pad at the top, a protective layer of insulating material to protect the upper circuit layer, and an insulating layer between the metal layer and the circuit layer. The circuit board 110 may be provided as an MCPCB having a metal layer at the bottom. The circuit board 110 can also transfer heat to the heat dissipation plate 101.

[0032] The circuit board 110 may be fastened to the heat dissipation portion 102 by fastening means 119. The fastening means 119 may include one or more screws. The circuit board 110 and the heat dissipation portion 102 are fastened and tightly secured by the screws. When the circuit board 110 is fixed by the fastening means 119, the adhesive member 155 can be removed. This makes it easier to separate the circuit board 110.

[0033] The circuit board 110 may include a plurality of pads. The pads 111, 112 may include a first pad 111 and a second pad 112 spaced apart from each other. The first pad 111 and the second pad 112 are connected by the circuit layer of the circuit board 110 to a connector 115 located on top of the circuit board 110. The connector 115 is supplied with drive signals and power from an external source. The pads 111, 112 and the connector 115 may be located on both edges of the circuit board 110. The fastening means 119 may be located in the area between the pads 111, 112 and the connector 115. The first pad 111 and the second pad 112 are located adjacent to one side of the circuit board 110. The pads 111, 112 can be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, and Au and their selective alloys.

[0034] The light source unit 130 may be positioned on the heat dissipation unit 102. The light source unit 130 may be adjacent to the recess 108. The light source unit 130 may be adjacent to one side of the circuit board 110. One side of the circuit board 110 may be positioned between the pads 111, 112 and the light source unit 130. The light source unit 130 may include a support member 133 and at least one light-emitting element 131 positioned on the support member 133. Multiple light-emitting elements 131 may be sealed by a resin member 132. The support member 133 may include a ceramic substrate or a semiconductor substrate. The support member 133 can support the multiple light-emitting elements 131. The support member 133 may also include a conductive pattern. The multiple light-emitting elements 131 are electrically connected by the conductive pattern. The support member 133 can electrically connect each of the multiple light-emitting elements 131 to bonding pads 134, 135. The anode terminal and cathode terminal of each of the multiple light-emitting elements 131 are electrically connected to the first and second bonding pads 134 and 135.

[0035] A protective element (not shown) for protecting the light-emitting element 131 may be placed on the support member 133. The protective element can be embodied by a thyristor, a Zener diode, or TVS (Transient voltage suppression). This protects the light-emitting element 131 from ESD (electrostatic discharge). The support member 133 can be made of ceramic material or MCPCB material. The light source unit 130 can transfer heat generated from the light-emitting element 131 to the heat dissipation plate 101 via the support member 133. The support member 133 and the heat dissipation plate 101 may be bonded together with an adhesive. The adhesive 138 may include a thermally conductive adhesive having metal powder or inorganic powder in the resin material. For example, the adhesive 138 may include a TIM (Thermal interface material).

[0036] The adhesive 138 may be arranged along the lower surface and lower side of the support member 133. The adhesive 138 is arranged on the outer side of the support member 133 and can come into contact with each side of the support member 133.

[0037] The light-emitting elements 131 may be arranged in a unidirectional array or in at least one column. The plurality of light-emitting elements 131 may be connected in series with each other. The plurality of light-emitting elements 131 may include at least one of blue, green, or red LED chips. The plurality of light-emitting elements 131 may be flip-chip or wire-bonded. The light-emitting elements 131 may include a plurality of semiconductor layers made of compound semiconductors of group II and group VI elements and / or compound semiconductors of group III and group V elements. At least one or all of the plurality of semiconductor layers may include compound semiconductors of the series such as AlInGaN, InGaN, AlGaN, GaN, GaAs, InGaP, AllnGaP, InP, and InGaAs.

[0038] The resin member 132 may include silicone or epoxy. The resin member 132 may include a transparent layer and / or a phosphor layer (not shown) on the light-emitting element 131. A reflective wall (not shown) may be included around the transparent layer and / or the phosphor layer. The resin member 132 may further include a convex lens (not shown). The phosphor layer may include at least one or more of yellow phosphor, green phosphor, blue phosphor, and red phosphor. When the phosphor layer is placed on the light-emitting element 131, the phosphor layer may be exposed on the upper surface of the light source unit 130. The light source unit 130 may emit white light.

[0039] Referring to Figures 3 to 5, the light-emitting element 131 is positioned on one upper side of the support member 133. Bonding pads 134 and 135 are exposed on the other upper side of the support member 133. The bonding pads 134 and 135 may include a first bonding pad 134 connected to the cathodes of the plurality of light-emitting elements 131 and a second bonding pad 135 connected to the anodes of the plurality of light-emitting elements 131. The first bonding pad 134 may have color-coded markings and function as a cathode terminal, and the second bonding pad 135 may function as an anode terminal. The first bonding pad 134 and the second bonding pad 135 can be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, and Au and their selective alloys.

[0040] The first bonding pad 134 and the first pad 111 are connected by a first connecting member 141, and the second bonding pad 135 and the second pad 112 are connected by a second connecting member 142. The first connecting member 141 and the second connecting member 142 may be formed of wire. The first connecting member 141 and the second connecting member 142 may include at least one of Au, Al, Ag, and Ni. The first connecting member 141 and the second connecting member 142 have one end 41 bonded to the first bonding pad 134 and the second bonding pad 135, respectively, and the other end 43 bonded to the first pad 111 and the second pad 112, respectively. The first connecting member 141 and the second connecting member 142 include a center portion 42 extending from one end 41 toward the other end 43. The center portion 42 extends from the other side of the light source portion 130 to one side of the circuit board 110. The center portion 42 extends over the recess portion 108 between the circuit board 110 and the heat dissipation portion 102. The height of the one end 41 may be set higher than the height of the other end 43. The height of the center portion 42 may be set higher than the one end 41.

[0041] The light source unit 310 and the circuit board 110 are electrically connected by the first connecting member 141 and the second connecting member 142. The connecting members 141 and 142 include wires with a width greater than their thickness, i.e., ribbon-shaped wires. As a result, the connecting members 141 and 142 may be damaged by external impacts. Furthermore, if the connecting members 141 and 142 are exposed to the outside, they may corrode by reacting with substances in the air. This may degrade the electrical connection characteristics between the light source unit 310 and the circuit board 110. To prevent the above-mentioned problems, the lighting device according to this embodiment includes a sealing section.

[0042] Referring to Figures 4 to 7, the lighting device according to the embodiment includes the sealing portion 200. The sealing portion 200 is positioned on the connecting members 141 and 142. The sealing portion 200 surrounds the connecting members 141 and 142. The sealing portion 200 contains a resin composition. More specifically, the sealing portion 200 includes a base resin and a plurality of fillers disposed inside the base resin. The base resin may include an acrylic resin. The base resin may include a photocurable resin. The base resin may include an oligomer, a monomer, and a photoinitiator. The resin composition hardens by a reaction of the oligomer, the monomer, and the photoinitiator. The oligomer may include a urethane acrylate, and the monomer may include an acrylate. The photoinitiator may include a known photoinitiator for UV curing. The fillers are disposed inside the base resin. The fillers are dispersed inside the base resin. The fillers may include spherical or (nano)wire-shaped particles. The particle size of the filler may be 5 μm or larger. More specifically, the particle size of the filler may be between 5 μm and 30 μm. The filler may contain metals or nonmetals. For example, the filler may contain aluminum (Al) or silica (Si). The oligomer, the monomer, and the filler are included in a set weight percentage relative to the total weight percentage of the resin composition.

[0043] The weights of the oligomer, monomer, and filler relate to the thixotropy (TI), elasticity, viscosity, and adhesive strength of the resin composition. Specifically, the thixotropy of the resin composition before curing and the elasticity and viscosity of the resin composition after curing change depending on the weight range of the oligomer, monomer, and filler. The oligomer may be present in an amount of 40% by weight or more relative to the total weight (100% by weight) of the resin composition. Specifically, the oligomer may be present in an amount of 45% to 65% by weight relative to the total weight of the resin composition. Since the oligomer is present in the weight percentage range, the viscosity of the resin composition after curing decreases and the elasticity increases. The monomer may be present in an amount of 30% by weight or more relative to the total weight of the resin composition. Specifically, the monomer may be present in an amount of 30% to 50% by weight relative to the total weight of the resin composition. Since the monomer is present in the weight percentage range, the viscosity of the resin composition after curing decreases. Furthermore, the adhesive strength between the sealing portion and the heat dissipation plate 101 and the circuit board 110 is increased.

[0044] The filler may be present in an amount of 1% by weight or more relative to the total weight of the resin composition. More specifically, the filler may be present in an amount of 2% to 10% by weight relative to the total weight of the resin composition. Because the filler is present in the above weight range, the thixotropy of the resin composition before curing increases. This facilitates the manufacturing process of the sealing portion. In addition, the viscosity of the resin composition after curing decreases.

[0045] The photoinitiator may be present in an amount of 1% by weight or more relative to the total weight of the resin composition. Specifically, the photoinitiator may be present in an amount of 1% to 5% by weight relative to the total weight of the resin composition. The properties of the resin composition are controlled by the weight ratio of the oligomer, the monomer, the filler, and the photoinitiator.

[0046] More specifically, the thixotropy of the resin composition before curing is controlled. More specifically, the thixotropy of the resin composition before curing may be 2 to 4. Since the thixotropy satisfies the above range, the sealing portion can be easily formed. This will be explained in detail below. The elasticity of the resin composition after curing is controlled. More specifically, the modulus of the resin composition after curing may be 100 MPa or more. More specifically, the modulus of the resin composition after curing may be 100 MPa to 8000 MPa. This prevents the sealing portion from being damaged by external impacts.

[0047] Referring to Figure 4, the sealing portion 200 includes a first sealing portion 210 and a second sealing portion 220. The first sealing portion 210 is positioned on the edge of the sealing portion 200. The first sealing portion 210 can form the outer peripheral edge of the sealing portion 200. The sealing portion 200 can form an internal region where the second sealing portion 220 is positioned by the first sealing portion 210. The first sealing portion 210 is divided into a 1-1 sealing portion 211, a 1-2 sealing portion 212, and a 1-3 sealing portion 213 depending on its position.

[0048] The 1-1 sealing portion 211 is positioned close to the light source portion 130. The 1-1 sealing portion 211 is positioned close to the one end 41. The 1-2 sealing portion 212 is positioned close to the circuit board 110. The 1-2 sealing portion 213 is positioned close to the other end 43. The 1-3 sealing portion 213 connects the 1-1 sealing portion 211 and the 1-2 sealing portion 212. The 1-1 sealing portion 211, the 1-2 sealing portion 212, and the 1-3 sealing portion 213 are separated according to their positions and formed integrally. The 1-1 sealing portion 211, the 1-2 sealing portion 212, and the 1-3 sealing portion 213 form the outer periphery of the sealing portion 200. As a result, the 1 sealing portion 210 can act as a dam for the sealing portion 200.

[0049] The first sealing portion 210 contains the resin composition. More specifically, the first sealing portion 210 is formed when the resin composition hardens. The resin composition has the physical properties described above. More specifically, the resin composition has a thixotropy within a set range. This allows the fluidity of the first sealing portion 210 to be controlled before it hardens. Therefore, after placing the second sealing portion 220 inside the first sealing portion 210, the first sealing portion 210 and the second sealing portion 220 can be hardened simultaneously. Furthermore, the material of the first sealing portion 210 and the material of the second sealing portion 220 can be the same. Therefore, the process efficiency of forming the sealing portion 200 is improved.

[0050] If the thixotropy of the resin composition is 2 or less, when the second sealing portion 220 is placed inside the first sealing portion 210, the first sealing portion 210 may be pushed outwards. This makes it difficult for the first sealing portion 210 to function as a dam. This requires a separate curing step for the first sealing portion 210, or a step to increase the height of the first sealing portion 210. This may reduce the efficiency of the process for forming the sealing portion 200. Furthermore, if the thixotropy of the resin composition exceeds 4, the viscosity and modulus of the cured resin composition may change. This may cause the sealing portion 200 to be damaged by external impacts.

[0051] The second sealing portion 220 is located in the internal region of the sealing portion 200. More specifically, the second sealing portion 220 is located in the inner region of the first sealing portion 210. The first sealing portion 210 forms the outer peripheral edge of the sealing portion 200. The second sealing portion 220 is located inside the outer peripheral edge. The second sealing portion 220 may be a protective layer that protects the connecting members 141 and 142. The second sealing portion 220 is located while covering the connecting members 141 and 142. This prevents the connecting members 141 and 142 from being damaged by external impacts. The second sealing portion 220 contains the resin composition. More specifically, the second sealing portion 220 is formed when the resin composition hardens. More specifically, the resin composition forming the second sealing portion 220 is the same as the resin composition forming the first sealing portion 210.

[0052] The resin composition has the physical properties described above. Specifically, the resin composition has a viscosity and modulus within a set range. Specifically, the modulus of the second sealing portion 220 formed by curing the resin composition may be 100 MPa to 8000 MPa. This allows for control of the elasticity of the second sealing portion. Therefore, the connecting members 141 and 142 are protected by the sealing portion 200. That is, since the sealing portion 200 is protected from external impacts, the connecting members 141 and 142 can be easily protected by the sealing portion 200. The first sealing portion 210 and the second sealing portion 220 are formed from the same resin composition. Specifically, the resin composition has a thixotropy, viscosity, and modulus within a set range. This allows the resin composition to satisfy all the physical properties required by the first sealing portion 210 and the second sealing portion 220. Specifically, the resin composition satisfies the thixotropy required by the first sealing portion 210. Furthermore, the resin composition satisfies the modulus required by the second sealing portion 220.

[0053] As a result, the first sealing portion 210 and the second sealing portion 220 can be formed using the same resin composition and in the same process. For example, the first sealing portion 210 is applied to form the outer edge of the sealing portion 200. Subsequently, the second sealing portion 220 is applied to the interior of the outer edge. Subsequently, the first sealing portion 210 and the second sealing portion 220 can be cured simultaneously. Therefore, the process time for forming the sealing portion 200 is shortened. This improves process efficiency.

[0054] The first sealing portion 210 and the second sealing portion 220 may have a set height relative to the upper surface of the circuit board 110 or the upper surface of the heat dissipation plate 101. The height of the first sealing portion 210 can be defined by the thickness of the first sealing portion 210. Similarly, the height of the second sealing portion 220 can be defined by the thickness of the second sealing portion 220. The heights H2 of the first sealing portion 210 and the second sealing portion 220 may be different. Specifically, relative to the upper surface of the circuit board 110 or the upper surface of the heat dissipation plate 101, the height H2 of the second sealing portion 220 is greater than the height of the first sealing portion 210. Specifically, the maximum height of the second sealing portion 220 is greater than the maximum height of the first sealing portion 210. The height H2 of the second sealing portion may be 2, 3, or 4 times or more the height of the first sealing portion 210. More specifically, the height H2 of the second sealing portion 220 may be more than 1 to 5 times the height of the first sealing portion 210.

[0055] If the height H2 of the second sealing portion is 1x or less of the height of the first sealing portion, the second sealing portion 220 will not be able to completely cover the connecting members 141 and 142. As a result, the sealing portion 200 may be exposed to the outside when the connecting members 141 and 142 are in contact with each other. Alternatively, if the height H2 of the second sealing portion 220 is 1x or less of the height of the first sealing portion 210, the distance between the connecting members 141 and 142 and the second sealing portion 220 will be reduced. As a result, external impacts may be transmitted to the connecting members 141 and 142. As a result, the connecting members 141 and 142 may be damaged by external impacts. The height H1-1 of the first-1 sealing portion and the height H1-2 of the first-2 sealing portion may be the same or different. For example, the height H1-2 of the first-2 sealing portion may be greater than or equal to the height H1-1 of the first-1 sealing portion. In other words, the height H1-2 of the first-second sealing portion may be the same as or greater than the height H1-1 of the first-first sealing portion. Specifically, the height H1-2 of the first-second sealing portion may be 1 to 1.5 times, 1 to 2 times, or 1 to 2.5 times the height H1-1 of the first-first sealing portion. If the height H1-1 of the first-first sealing portion and the height H1-2 of the first-second sealing portion are formed to be the same or similar, the process of forming the first sealing portion 210 can be made easier. If the height H1-2 of the first-second sealing portion is greater than the height H1-1 of the first-first sealing portion, the height deviation of the second sealing portion is reduced. The first-first sealing portion 211 is positioned higher than the first-second sealing portion 212. As a result, a step may be formed in the outer peripheral region of the second sealing portion 220. Since the height H1-2 of the first-second sealing section is set to be greater than the height H1-1 of the first-first sealing section, the height difference of the second sealing section 220 can be reduced.

[0056] The second sealing portion 220 and the connecting members 141 and 142 can be separated. The distance between the second sealing portion 220 and the connecting members 141 and 142 can be defined by a first interval G1. The first interval G1 is defined by the height spacing of the second sealing portion 220. The first interval G1 can be defined by the spacing between the highest points of the connecting members 141 and 142 and the highest point of the second sealing portion 220. The first interval G1 may be 100 μm or more. Specifically, the first interval G1 may be 100 μm to 200 μm, 120 μm to 180 μm, or 140 μm to 160 μm. If the first interval G1 is less than 100 μm, the amount of sealing portion placed between the second sealing portion 220 and the connecting members 141 and 142 will be reduced. As a result, external shocks are transmitted through the second sealing portion 220 to the connecting members 141 and 142. Consequently, the reliability of the lighting device is reduced. When the first spacing G1 exceeds 200 μm, the height of the second sealing portion 220 increases. As a result, the thickness of the lighting device is increased by the second sealing portion 220.

[0057] The 1-1 sealing portion 211 and the light-emitting element 131 can be separated. The distance between the 1-1 sealing portion 211 and the light-emitting element 131 can be defined by a second interval G2, which is defined by the distance between the connecting members 141 and 142 in the longitudinal direction. The second interval G2 may be 0.8 mm or more. More specifically, the second interval G2 may be between 0.8 mm and 1 mm. If the second interval G2 is less than 0.8 mm, the 1-1 sealing portion 211 may be positioned in the area where the light-emitting element 131 is located during the process of forming the sealing portion. Also, if the second interval G2 exceeds 1 mm, the distance between the light-emitting element 131 and the bonding pads 134 and 135 increases. This increases the size of the light source portion 130. This increases the size of the lighting device.

[0058] The heights H2 of the first sealing section 210 and the second sealing section 220 are limited by the directional angle of the light-emitting element 131. Specifically, the directional angle of the light-emitting element 131 may be 120° or more. As a result, the first angle θ1 formed between the light emitted from the light-emitting element 131 and the first sealing section 210 may be 30° or less. Also, the second angle θ2 formed between the light emitted from the light-emitting element 131 and the second sealing section 220 may be 30° or less. As a result, the Lambertian radiation of the light-emitting element 131 is not interfered with by the sealing section 200. Therefore, the brightness and luminous efficiency of the lighting device are improved.

[0059] Figures 8 and 9 are diagrams illustrating the sealing portion and the thickness profile of the sealing portion of the lighting device according to the embodiment.

[0060] Referring to Figures 8 and 9, the sealing portion 200 includes a first sealing portion 210 and a second sealing portion 220. The first sealing portion 210 and the second sealing portion 220 are formed from the same resin composition. However, the first sealing portion 210 and the second sealing portion 220 are applied in different orders. Also, the first sealing portion 210 and the second sealing portion 220 are positioned at different heights. Therefore, they are separated by the boundary between the first sealing portion 210 and the second sealing portion 220.

[0061] Referring to Figure 9, the maximum height H2 of the second sealing portion 220 is greater than the heights H1-1 and H1-2 of the first sealing portion 210. More specifically, the height of the second sealing portion 220 that contacts the first sealing portion 210 is less than the height of the first sealing portion 210. However, the height of the second sealing portion 220 gradually increases to become greater than the height of the first sealing portion 210. The second sealing portion 220 is arranged in a shape that gradually increases and then decreases in height.

[0062] The first sealing portion 210 is formed from the resin composition. As a result, the first sealing portion has a thixotropy within a pre-set range during curing. Therefore, the first sealing portion does not collapse when filling the second sealing portion. Consequently, the second sealing portion does not overflow outside the first sealing portion. As a result, the second sealing portion is not located outside the first sealing portion.

[0063] The lighting device according to the embodiment includes a ceiling section 200.

[0064] The sealing portion 200 protects the connecting members 141 and 142. This prevents the connecting members 141 and 142 from being damaged by external impacts. This improves the reliability of the lighting device. The sealing portion 200 includes a first sealing portion 210 and a second sealing portion 220. The first sealing portion 210 forms the outer periphery of the sealing portion 200. The second sealing portion 220 is located inside the outer periphery.

[0065] The first sealing portion 210 and the second sealing portion 220 are formed from a resin composition. The resin composition comprises an oligomer, a monomer, a photoinitiator, and a filler. The oligomer, monomer, photoinitiator, and filler are included in a set weight percent. This allows for control of the thixotropy and elasticity of the resin composition. Specifically, the resin composition can satisfy the thixotropy required by the first sealing portion 210. Furthermore, the resin composition can satisfy the elasticity required by the second sealing portion 220. Therefore, the first sealing portion 210 and the second sealing portion 220 can be formed from the same resin composition. Also, the first sealing portion 210 and the second sealing portion 220 can be formed by the same process. This improves the process efficiency of forming the sealing portion 200.

[0066] Furthermore, the heights of the first sealing portion 210 and the second sealing portion 220 are set relative to the upper surface of the circuit board 110 or the upper surface of the heat dissipation plate 101. In addition, the first sealing portion 210 and the light-emitting element 131 are separated by a set interval, and the second sealing portion 220 may have an interval to protect the surfaces of the connecting members 141 and 142. This improves the reliability of the lighting device and reduces its size.

[0067] The following describes a lighting device according to another embodiment, with reference to Figures 10 to 12. Descriptions of the same aspects as those described in the previous embodiment will be omitted. The same reference numerals will be used for the same components.

[0068] Referring to Figures 10 to 12, the lighting device includes the sealing section 200. The sealing section 200 includes a first sealing section 210 and a second sealing section 220. The first sealing section 210 is divided into a 1-1 sealing section 211, a 1-2 sealing section 212, and a 1-3 sealing section 213 depending on its position. The 1-1 sealing section 211 is positioned close to the light source section 130. The 1-1 sealing section 211 is positioned close to the one end 41. The 1-2 sealing section 212 is positioned close to the circuit board 110. The 1-2 sealing section 213 is positioned close to the other end 43.

[0069] The first- to third sealing portions 213 connect the first-first sealing portion 211 and the first-second sealing portion 212. The first-first sealing portion 211, the first-second sealing portion 212, and the first-third sealing portion 213 are separated according to their positions and formed integrally. The first-first sealing portion 211, the first-second sealing portion 212, and the first-third sealing portion 213 form the outer periphery of the sealing portion 200. As a result, the first sealing portion 210 can act as a dam for the sealing portion 200. The first-first sealing portion 211, the first-second sealing portion 212, and the first-third sealing portion 213 can each include two sealing portions. For example, the first-first sealing portion 211 can include the first-firsta sealing portion 211a and the first-firstb sealing portion 211b. The 1-1a sealing portion 211a is positioned inward of the 1-1b sealing portion 211b. More specifically, the 1-1a sealing portion 211a is positioned closer to the one end 41 than the 1-1b sealing portion 211b. More specifically, the 1-1b sealing portion 211b is positioned closer to the light source portion 130 than the 1-1a sealing portion 211a. More specifically, the 1-2 sealing portion 212 may include the 1-2a sealing portion 212a and the 1-2b sealing portion 221b. The 1-2a sealing portion 212a is positioned inward of the 1-2b sealing portion 212b. More specifically, the 1-2a sealing portion 212a is positioned closer to the other end 43 than the 1-2b sealing portion 212b.

[0070] The first to third sealing portion 213 may include the first to third sealing portion and the first to third sealing portion. The first to third sealing portion 213a is positioned inward of the first to third sealing portion 213b.

[0071] The 1-1a sealing portion 211a, the 1-2a sealing portion 212a, and the 1-3a sealing portion are connected. The 1-1a sealing portion 211a, the 1-2a sealing portion 212a, and the 1-3a sealing portion 213a are integrally formed. The first sealing portion 210 has a first outer edge formed by the 1-1a sealing portion 211a, the 1-2a sealing portion 212a, and the 1-3a sealing portion 213a.

[0072] The 1-1b sealing portion 211b, the 1-2b sealing portion 212b, and the 1-3b sealing portion are connected. The 1-1b sealing portion 211b, the 1-2b sealing portion 212b, and the 1-3b sealing portion 213b are integrally formed. The first sealing portion 210 has a second outer periphery formed by the 1-1b sealing portion 211b, the 1-2b sealing portion 212b, and the 1-3b sealing portion 213b. The first outer periphery and the second outer periphery are separated. The first outer periphery is positioned inward from the second outer periphery. That is, the first outer periphery is positioned closer to one end 41 and the other end 43 of the connecting members 141 and 142 than to the second outer periphery.

[0073] The second sealing portion 220 is positioned inside the first outer edge. The first outer edge prevents the second sealing portion 220 from overflowing outside the first sealing portion 210. The second outer edge further prevents the second sealing portion 220 from overflowing. When applying the second sealing portion 220, errors in the amount of resin composition applied may occur. This may cause the second sealing portion 220 to overflow outside the first outer edge. The resin composition that overflows outside the first outer edge is prevented from flowing outside the first sealing portion 210 by the second outer edge. This prevents the resin composition from flowing into the light source 130 during the process.

[0074] The height of the 1-1a sealing section 211a and the height of the 1-1b sealing section 211b may be the same. The height of the 1-2a sealing section 212a and the height of the 1-2b sealing section 211b may be the same. The height of the 1-3a sealing section 213a and the height of the 1-3b sealing section 213b may be the same. As another example, the height of the 1-1a sealing section 211a and the height of the 1-1b sealing section 211b may be different. Specifically, the height of the 1-1a sealing section 211a may be greater than the height of the 1-1b sealing section 211b. The height of the 1-2a sealing section 212a and the height of the 1-2b sealing section 211b may be different. Specifically, the height of the 1-2a sealing section 212a may be greater than the height of the 1-2b sealing section 211b. The heights of the 1-3a sealing portion 213a and the 1-3b sealing portion 213b may be different. Specifically, the height of the 1-3a sealing portion 213a may be greater than the height of the 1-3b sealing portion 213a. That is, the height of the first outer edge may be greater than the height of the second outer edge.

[0075] The first outer edge acts as the main dam, and the second outer edge acts as an auxiliary dam. This increases the height of the first outer edge to prevent overflow of the second sealing section 220. The height of the second outer edge is relatively reduced. This further prevents overflow of the second sealing section 220. It also allows for a reduction in the size of the sealing section. The lighting device according to another embodiment includes multiple outer edges. This prevents overflow of the second sealing section 220 caused by errors in the amount of coating applied during the process. Therefore, the reliability of the lighting device according to another embodiment is improved.

[0076] Referring to Figure 13, a vehicle headlamp 90 having a lighting device according to an embodiment includes a light source module 10 and a housing 92. The light source module 10 is positioned inside the housing 92 and emits light laterally. The emitted light is reflected outward through the inner surface 92A of the housing 92. The light source module 10 includes the lighting device described above. The housing 92 may be made of a metal or a non-metallic material. The non-metallic material may be made of a plastic material. The housing 92 may also be a reflector of the headlamp. The inner surface 92A of the housing 92 may be a surface coated with a highly reflective material or may include a reflective layer having an anti-reflective (AR) material. For example, the highly reflective material may include at least one of metals, such as Al, Ag, and Au. The anti-reflective material may include at least one of MgF2, Al2O3, SiO, SiO2, TiO2+ZrO2, TiO2, and ZrO2. The reflective layer on the inner surface 92A may be a single layer or a multilayer.

[0077] The headlamp 90 may include an inner lens and / or an outer lens that projects light emitted through the housing 92. The light distribution pattern of the light emitted from the light source module 10 can be adjusted depending on the shape of the inner lens and the number of light source units. The light source module 10 selectively emits light for a high beam pattern and a low beam pattern. The high beam pattern or the low beam pattern is automatically turned on or off depending on the driving mode or driving conditions.

[0078] The internal surface 92A of the housing 92 may include a partially dome shape or a partially ellipsoidal paraboloid. The internal surface 92A may have a plurality of facets. The facets may be free-form, flat, and / or curved (e.g., concave or convex) members. In some examples, a single facet may have a free-form portion and / or a flat portion and / or a curved portion (e.g., any combination thereof). In some embodiments, the facet (or at least the inward-facing surface on the facet) may be at least approximated or, in some cases, determined by an algebraic equation. For example, the shape of the facet or the inward-facing surface may be expressed by one or more quintic algebraic equations (of course, other equations of any degree are also possible). In at least one exemplary embodiment, the surface of the facet (or, for example, a coating) has a high reflectivity (e.g., a reflectivity of 80% or more). Unlimited examples of facets and / or coatings on facets include aluminum and silver, but other reflective materials may also be used.

[0079] The inner surface 92A of the housing 92 is spaced laterally from the light source module 10, and the light emitted from the light source module 10 is reflected by the inner surface 92A and focused on the output side of the housing 92, where it is irradiated as a high beam or low beam. The outside of the housing 92 may include various features and accessories for mounting or connecting the headlamp 90 inside the vehicle. The outside of the housing 92 may also have an electrical interface, such as a socket, for connecting power and / or signals. The housing 92 and cavity 95 described above are examples and can be modified into various shapes. The housing 92 according to this embodiment can function as a reflector for the left and right headlamps 90.

[0080] The features, structures, and effects described in the above-described embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to one embodiment. Furthermore, the features, structures, and effects exemplified in each embodiment can be combined or modified and implemented in other embodiments by a person with ordinary skill in the art to which the embodiment belongs. Therefore, such combinations and modifications should be interpreted as being within the scope of the present invention. In addition, although the above has focused on embodiments, these are merely examples and do not limit the present invention. A person with ordinary skill in the art to which the present invention belongs can make various modifications and applications not exemplified above, as long as they do not deviate from the essential characteristics of these embodiments. For example, each component specifically presented in the embodiments can be modified and implemented. And the differences related to such modifications and applications should be interpreted as being within the scope of the present invention as defined in the appended claims.

Claims

1. A heat dissipation plate including a recessed section, A circuit board having a pad is arranged in the recess portion, A light source unit is disposed on the heat dissipation plate and includes a bonding pad and a light-emitting element, A connecting member that connects the pad of the circuit board and the bonding pad of the light source unit, The connecting member includes a sealing portion, The sealing portion includes a first sealing portion that forms the outer edge and a second sealing portion that is disposed inside the outer edge. A lighting device in which the first sealing portion and the second sealing portion contain the same resin composition.

2. The aforementioned resin composition comprises a base resin and a filler, The base resin comprises an oligomer, a monomer, and a photoinitiator. The oligomer is present in an amount of 45% to 65% by weight relative to the total weight of the resin composition. The monomer is present in an amount of 30% to 50% by weight relative to the total weight of the resin composition. The photoinitiator is present in an amount of 1% to 5% by weight relative to the total weight of the resin composition. The lighting device according to claim 1, wherein the filler is contained in an amount of 2% to 10% by weight relative to the total weight of the resin composition.

3. The lighting device according to claim 1, wherein the modulus of the resin composition after curing is 100 MPa to 8000 MPa.

4. The lighting device according to claim 3, wherein the thixotropy of the resin composition before curing is 2 to 4.

5. The lighting device according to claim 2, wherein the particle size of the filler is 5 μm to 30 μm.

6. The aforementioned connecting member is One end is connected to the bonding pad of the light source unit, The other end is connected to the pad of the circuit board, A center portion extending from one end toward the other end, The first sealing part is, The first-first sealing portion is located near the aforementioned end, The first and second sealing portions are located close to the other end, The first-1 sealing portion and the first-2 sealing portion are connected by a first-3 sealing portion, The lighting device according to claim 1, wherein the 1-1 sealing portion, the 1-2 sealing portion, and the 1-3 sealing portion are integrally formed.

7. The lighting device according to claim 6, wherein the maximum height of the second sealing section is more than 1 to 5 times the maximum height of the first sealing section.

8. The lighting device according to claim 6, wherein the maximum height of the first- and second ceiling sections is greater than or equal to the maximum height of the first- and first ceiling sections.

9. The lighting device according to claim 8, wherein the maximum height of the first- and second ceiling sections is 1 to 2.5 times the maximum height of the first- and first ceiling sections.

10. The second sealing portion and the connecting member are separated by a first interval. The first interval is defined as the distance between the maximum height of the connecting member and the second sealing portion. The lighting device according to claim 6, wherein the first interval is 100 μm to 200 μm.

11. The sealing portion 1-1 and the light-emitting element are separated by a second interval. The lighting device according to claim 6, wherein the second interval is 0.8 mm to 1 mm.

12. The light emitted from the light-emitting element and the first sealing portion form a first angle. The light emitted from the light-emitting element and the second sealing portion form a second angle. The lighting device according to claim 1, wherein at least one of the first angle and the second angle is 30° or less.

13. The aforementioned connecting member is One end is connected to the bonding pad of the light source unit, The other end is connected to the pad of the circuit board, A center portion extending from one end toward the other end, The first sealing part is, The first-first sealing portion is located near the aforementioned end, The first and second sealing portions are located close to the other end, The first-1 sealing portion and the first-2 sealing portion are connected by a first-3 sealing portion, The 1-1 sealing portion includes the 1-1a sealing portion and the 1-1b sealing portion, The first-1a sealing portion is positioned closer to one end than the first-1b sealing portion, The first- and second sealing parts include the first- and second-a sealing parts and the first- and second-b sealing parts. The first-2a sealing portion is positioned closer to the other end than the first-2b sealing portion. The lighting device according to claim 1, wherein the 1-1 sealing portion includes the 1-3a sealing portion and the 1-3b sealing portion.

14. The 1-1a sealing portion, the 1-2a sealing portion, and the 1-3a sealing portion form a first outer peripheral edge. The 1-1b sealing portion, the 1-2b sealing portion, and the 1-3b sealing portion form a second outer peripheral edge. The lighting device according to claim 13, wherein the first outer edge and the second outer edge are separated.

15. The lighting device according to claim 14, wherein the second sealing portion is arranged inside the first outer peripheral edge.

16. The lighting device according to claim 14, wherein the height of the first outer edge is greater than or equal to the height of the second outer edge.

17. Housing and The housing includes a light source module disposed inside the housing, The light source module is a headlamp including the lighting device described in any one of claims 1 to 16.

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