Fingerprint module

Abstract

This invention provides a fingerprint module. [Solution] The fingerprint module includes a first circuit board, a second circuit board connected to one side of the first circuit board, a chip connected to the side of the second circuit board away from the first circuit board, a light guide ring connected between the outer circumference of the chip and the first circuit board, and an annular light-emitting element connected to the first circuit board. The first circuit board, the second circuit board, and the light guide ring together form an annular groove that fits the light-emitting element, the light-emitting element is located within the annular groove, a light-receiving surface is formed on the side of the light guide ring facing the light-emitting element, and a light-emitting surface is formed on the side of the light guide ring away from the first circuit board. The fingerprint module of the present invention can effectively solve the problem of uneven light emission.

Description

Technical Field

[0001] The present invention belongs to the technical field of fingerprint recognition, and particularly relates to a fingerprint module.

Background Art

[0002] In fingerprint recognition technology, a fingerprint pattern of a finger can be collected by a fingerprint sensor device, and then by comparing the fingerprint pattern with the fingerprint information stored in the system, it can be determined whether it is correct, and further identity recognition can be realized. Therefore, fingerprint recognition has characteristics such as being easy to use and having high security, and can be used in scenes such as unlocking a device, waking up, and payment.

[0003] In related technologies, in order to meet the diversified usage needs of users, some fingerprint modules are further provided with a light-emitting element and a light guide component for refracting the light rays from the light-emitting element to the outside. A certain distance is required between the light-emitting element and the light guide component so that the emitted light can reach each part of the light-receiving surface of the light guide component. As a result, the volume of the fingerprint module is relatively large, and the problem that the brightness at different parts of the light guide ring becomes non-uniform is also likely to occur.

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present invention is to provide a fingerprint module that can solve the problem that it is difficult for a light-emitting fingerprint module in at least related technologies to have characteristics such as a small size and uniform brightness.

Means for Solving the Problems

[0005] The present invention provides the following solution: The fingerprint module includes a first circuit board, a second circuit board connected to one side of the first circuit board, a chip connected to the side of the second circuit board away from the first circuit board, an annular light guide ring connected between the outer circumference of the chip and the first circuit board, and a light-emitting element connected to the first circuit board. The first circuit board, the second circuit board, and the light guide ring are collectively formed to surround an annular groove that fits the light-emitting element, the light-emitting element is located within the annular groove, a light-receiving surface is formed on the side of the light guide ring facing the light-emitting element, and a light-emitting surface is formed on the side of the light guide ring away from the first circuit board.

[0006] Furthermore, the second circuit board and the light-emitting element are installed with a gap between them. The side of the light-emitting element facing the second circuit board has a light output surface, and the second circuit board has a reflective section that directly faces the light output surface. The area of ​​the light output surface, the area of ​​the reflective section, and the area of ​​the light-receiving surface increase in this order.

[0007] Furthermore, a solder resist ink layer is connected to the outer periphery of the second circuit board, and at least a portion of the solder resist ink layer is a reflective area.

[0008] Furthermore, the solder resist ink layer is one of the following colors: white, yellow, red, green, and blue.

[0009] Furthermore, the light guide ring is made of a light-transmitting plastic or glass material.

[0010] Furthermore, a light-diffusing sheet is attached to the area where the light-receiving surface is located.

[0011] Furthermore, the light guide ring includes a first light guide portion connected to a first circuit board and a second light guide portion bent and connected to the first light guide portion. One end of the second light guide portion that is separated from the first light guide portion is connected to a chip, and both the first and second light guide portions are provided with light-receiving surfaces.

[0012] Furthermore, a decorative member is further connected to the outer circumference of the light guide ring. The decorative member includes a main body connected to the outside of the light guide ring, a first connecting portion connected to the tip of the main body and extending in a first direction, and a second connecting portion connected to the bottom end of the main body and extending in the opposite direction to the first direction. The first connecting portion abuts against the top of the light guide ring, and the second connecting portion is fixed to the first circuit board.

[0013] Furthermore, the first circuit board is one of the following: a soft board, a hard board, and a soft-hard bonding board.

[0014] Furthermore, the second circuit board is made of a hard plate. [Effects of the Invention]

[0015] The present invention has the following advantageous effects. By arranging the light-emitting elements in a ring shape, and having the light-emitting elements surround the outer circumference of the second circuit board and the inside of the light-guide ring, light from the light-emitting elements can reach each part of the light-guide ring uniformly, thereby achieving uniform illumination of the fingerprint module. In addition, because the fingerprint module of the present invention has a simple structure and a clever design, its volume can be made smaller. [Brief explanation of the drawing]

[0016] [Figure 1] This is a schematic diagram of the overall structure of the fingerprint module related to the present invention in the planar direction. [Figure 2] This is a schematic cross-sectional view of one embodiment of the fingerprint module according to the present invention. [Figure 3] This is a schematic cross-sectional view of another embodiment of the fingerprint module related to the present invention. [Modes for carrying out the invention]

[0017] The present invention is described in detail below, and examples of embodiments are shown in the drawings, where consistent identical or similar reference numerals indicate identical or similar elements or elements having identical or similar functions. The embodiments described below with reference to the drawings are illustrative and are used only to illustrate the present invention and do not allow for the understanding of limitations of the present invention. All other embodiments obtained by those skilled in the art without creative work based on embodiments of the present invention are included within the scope of protection of the present invention.

[0018] In describing the present invention, it should be noted that the directions or positional relationships indicated by terms such as "center," "vertical direction," "horizontal direction," "length," "width," "thickness," "top," "bottom," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," "clockwise," "counterclockwise," "axial direction," "circumferential direction," and "radial direction" are the directions or positional relationships shown in the drawings and are used solely to facilitate and simplify the description of the present invention. They do not indicate or imply that such devices or elements must have a specific direction, a specific directional structure, or operation, and therefore should not be understood as limitations on the present invention.

[0019] Furthermore, terms such as "first," "second," etc., are used merely to describe the purpose and should not be understood as indicating or implying relative importance or implicitly pointing to the number of designated technical features. Thus, features limited by "first," "second," etc., may explicitly or implicitly include one or more such features. In the description of this invention, unless otherwise clearly and specifically limited, "multiple" refers to two or more. [Examples]

[0020] As shown in FIGS. 1 to 3, in this embodiment, the fingerprint module includes a first circuit board 1, a second circuit board 2 connected to one side of the first circuit board 1, a chip 3 connected to the side of the second circuit board 2 away from the first circuit board 1, a light guide ring 5 connected between the outer peripheral side of the chip 3 and the first circuit board 1, and a light-emitting element 4 in an annular shape connected to the first circuit board 1. The first circuit board 1, the second circuit board 2, and the light guide ring 5 jointly form an annular groove a that fits the light-emitting element 4. The light-emitting element 4 is located in the annular groove a. An incident light surface 51 is formed on the side of the light guide ring 5 facing the light-emitting element 4, and an outgoing light surface 52 is formed on the side of the light guide ring 5 away from the first circuit board 1.

[0021] Specifically, the light-emitting element 4 in this embodiment may be an LED lamp. The LED lamp has a small volume, a light weight, does not occupy excessive space inside the fingerprint module, is easy to install, and is advantageous for realizing the weight reduction of the fingerprint module. The LED lamp can also emit lights of different colors, meeting the diversified display needs and aesthetic needs of users. The light-emitting element 4 can be installed in an annular shape and fixed in the annular groove a surrounded by the first circuit board 1, the second circuit board 2, and the light guide ring 5. That is, by surrounding the outer periphery of the second circuit board 2 and the inner side of the light guide ring 5 with the light-emitting element 4, the light from the light-emitting element 4 can reach each part of the light guide ring 5 uniformly, realizing uniform light emission of the fingerprint module. Moreover, the fingerprint module of this embodiment has a simple structure and a clever design, so its volume can be made smaller.

[0022] As shown in FIG. 2, in one embodiment, the first circuit board 1, the second circuit board 2, the chip 3, and the light guide ring 5 jointly form an annular groove a. The second circuit board 2 and the light-emitting element 4 in the annular groove a are installed at an interval. A light output surface 41 is provided on the side of the light-emitting element 4 facing the second circuit board 2. A reflection part 211 facing the light output surface 41 is formed on the second circuit board 2. The areas of the light output surface 41, the reflection part 211, and the incident light surface 51 increase in this order.

[0023] Specifically, the light-emitting element 4 of this embodiment may be an LED lamp that emits light from its side surface. The light output surface 41 is located on the side close to the second circuit board 2 of the light-emitting element 4. The light emitted from the light-emitting element 4 can first reach the reflection portion 211 of the second circuit board 2 and then be reflected to the light incident surface 51 of the light guide ring 5. That is, when the distance between the light-emitting element 4 and the light guide ring 5 is not increased, the propagation path of the light rays between the light-emitting element 4 and the light guide ring 5 can be lengthened, thereby achieving the effect of astigmatism.

[0024] As can be understood, in this embodiment, the projected area of the chip 3 may be larger than the projected area of the second circuit board 2, and the top of the light-emitting element 4 faces the edge on the bottom side of the chip 3. Thus, in some embodiments, the edge on the bottom side of the chip 3 can also be set as the reflection portion 211. That is, some light can first be reflected by the chip 3 after the light rays reaching the second circuit board 2, and then be reflected from the chip 3 to the light incident surface 51 of the light guide ring 5. By installing it in this way, the propagation path of the light rays between the light-emitting element 4 and the light guide ring 5 is further increased, the light diffusion effect is improved, and thereby the luminance of the light output from each part of the light output surface 52 is made more uniform. Of course, in yet another embodiment, the light output surface 41 may be provided at the top of the light-emitting element 4. Thus, after the optical fiber reaches the reflection portion 211 at the bottom of the chip 3, it is reflected to the light incident surface 51, and then refracted multiple times in the light guide ring 5, and finally can be emitted from the light output surface 52. Also, the light output surface 41 may be provided on the side away from the second circuit board 2 of the light-emitting element 4. That is, the light from the light-emitting element 4 can be directly emitted to the light guide ring 5. It is not limited here.

[0025] As shown in FIG. 3, in this embodiment, a light diffusion sheet 7 is attached to the location where the light incident surface 51 is located. By applying the light diffusion sheet 7, the light diffusion effect of the light guide ring 5 can be improved, and the light rays emitted from the light guide ring 5 can be made more uniform and soft.

[0026] As shown in Figure 3, in another embodiment, the light guide ring 5 includes a first light guide portion 53 connected to the first circuit board 1 and a second light guide portion 54 bent and connected to the first light guide portion 53, with one end of the second light guide portion 54 spaced apart from the first light guide portion 53 connected to the chip 3, and both the first light guide portion 53 and the second light guide portion 54 are provided with a light-receiving surface 51. That is, the projected area of ​​the chip 3 may be equal to the projected area of ​​the second circuit board 2, the first circuit board 1, the second circuit board 2 and the light guide ring 5 are formed to directly surround the annular groove a, and the light-emitting element 4 may be installed in a manner that emits light from one side or in a manner that emits light from multiple sides. The light emitted by the light-emitting element 4 is emitted directly to the light-receiving surface 51, or is reflected by the reflector portion 211 of the second circuit board 2 before being emitted to the light-receiving surface 51. Next, the light rays pass through the light diffusion sheet 7, are refracted within the first light guide section 53 and / or the second light guide section 54, and finally reach outside the fingerprint module. This ensures uniform illumination of the fingerprint module.

[0027] In this embodiment, a solder resist ink layer 21 is connected to the outer periphery of the second circuit board 2, and at least a portion of the solder resist ink layer 21 is a reflective portion 211. Specifically, a solder resist ink layer 21 can be provided on the outside of both the first circuit board 1 and the second circuit board 2. The presence of the solder resist ink layer 21 can protect the circuits on the first circuit board 1 and the second circuit board 2, and light rays can be directly reflected by the solder resist ink layer 21, resulting in a good reflective effect. The connections between the first circuit board 1 and the second circuit board 2, between the first circuit board 1 and the light-emitting element 4, and between the second circuit board 2 and the chip 3 may all be made by soldering. Furthermore, in this embodiment, the solder resist ink layer 21 may be one of the following colors: white, yellow, red, green, and blue. Preferably, the solder resist ink layer 21 is white, which has good light reflection and light scattering effects and is advantageous for improving the uniformity and reliability of the light emission of the fingerprint module.

[0028] In this embodiment, the light guide ring 5 may be a translucent plastic or glass material, which has good light guiding performance and low production and processing costs. Here, the material of the plastic material may be PC. The light guide ring 5 may be bonded to the first circuit board 1 with an adhesive, which provides good connection stability.

[0029] In this embodiment, an insulating layer 31 is further provided on the side of the chip 3 that is separated from the second circuit board 2. The insulating layer 31 can protect the chip 3 and the decorative chip 3, and can also transmit user fingerprint information to the chip 3 for detection. In this embodiment, the insulating layer 31 is one of a paint-curing member, a glass member, and a ceramic member. That is, the insulating layer may be a spray paint layer or a cover plate. Preferably, the insulating layer 31 is a paint-curing member, and by spraying paint onto the surface of the chip 3 and forming the necessary paint-curing member after the paint has hardened, the paint-curing member can not only insulate but also repel oil and waterproof. Of course, the insulating layer 31 may also be a glass member, and the glass member may be directly bonded to the surface of the chip 3 with an adhesive, which is advantageous for improving production efficiency as it has a simple structure and is easy to assemble.

[0030] In this embodiment, a decorative member 6 is further connected to the outer circumference of the light guide ring 5. The decorative member 6 includes a main body portion 61 connected to the outside of the light guide ring 5, a first connecting portion 62 connected to the tip of the main body portion 61 and extending in a first direction, and a second connecting portion 63 connected to the bottom end of the main body portion 61 and extending in the opposite direction to the first direction. The first connecting portion 62 abuts against the top of the light guide ring 5, and the second connecting portion 63 is fixed to the first circuit board 1. That is, the second connecting portion 63 and the first circuit board 1 may be bonded and fixed together with an adhesive, and the first connecting portion 62 abuts against the outer edge of the top of the light guide ring 5. The main body portion 61, the first connecting portion 62, and the second connecting portion 63 may be integrally molded metal members, and the material of the metal members may be aluminum or stainless steel. The decorative member 6 formed from the metal members conforms precisely to the shapes of the light guide ring 5 and the first circuit board 1. The installation of the decorative component 6 makes the external appearance of the fingerprint module more aesthetically pleasing and robust.

[0031] In this embodiment, the first circuit board 1 is one of a soft board, a hard board, and a soft-hard bonding board. Preferably, the first circuit board 1 is a soft board, which is advantageous for improving the feel when the user performs fingerprint operations. The second circuit board 2 may be a hard board, and the fingerprint module can combine feel and texture. As can be understood, in the actual production application process, a person skilled in the art can select a hard board or a soft board as the material for the first circuit board 1 and / or the second circuit board 2 as needed. Furthermore, a person skilled in the art can set the overall front view structure of the fingerprint module to a rectangle, rounded rectangle, circle, ellipse, or other polygonal structure commonly used in the art as needed. A person skilled in the art can also adjust the dimensional parameters of devices such as the first circuit board 1, the second circuit board 2, and the chip 3 as needed, but is not limited herein.

[0032] The above describes only embodiments of the present application. Those skilled in the art may make various modifications, provided they do not deviate from the creative concept of the present application; however, these modifications should all be understood to fall within the scope of protection of the present application.

Claims

1. A fingerprint module comprising a first circuit board, a second circuit board connected to one side of the first circuit board, a chip connected to the side of the second circuit board away from the first circuit board, a light guide ring connected between the outer periphery of the chip and the first circuit board, and an annular light-emitting element connected to the first circuit board, A fingerprint module characterized in that the first circuit board, the second circuit board, and the light guide ring are collectively formed to surround an annular groove that fits the light-emitting element, the light-emitting element is located within the annular groove, a light-receiving surface is formed on the side of the light guide ring facing the light-emitting element, and a light-emitting surface is formed on the side of the light guide ring away from the first circuit board.

2. The fingerprint module according to claim 1, wherein the second circuit board and the light-emitting element are installed with a gap between them, the side of the light-emitting element facing the second circuit board has a light output surface, the second circuit board has a reflective portion facing the light output surface, and the area of ​​the light output surface, the area of ​​the reflective portion, and the area of ​​the light-receiving surface increase in this order.

3. The fingerprint module according to claim 2, wherein a solder resist ink layer is connected to the outer periphery of the second circuit board, and at least a portion of the solder resist ink layer is the reflective portion.

4. The fingerprint module according to claim 3, characterized in that the solder resist ink layer is one of white, yellow, red, green, and blue.

5. The fingerprint module according to claim 1, characterized in that the light guide ring is made of a light-transmitting plastic or glass material.

6. The fingerprint module according to claim 1, characterized in that a light-diffusing sheet is attached to the area where the light-receiving surface is located.

7. The fingerprint module according to claim 7, wherein the light guide ring includes a first light guide portion connected to the first circuit board and a second light guide portion bent and connected to the first light guide portion, one end of the second light guide portion spaced apart from the first light guide portion is connected to the chip, and both the first light guide portion and the second light guide portion have the light-receiving surface.

8. A decorative member is further connected to the outer circumference of the light guide ring, and the decorative member includes a main body connected to the outside of the light guide ring, a first connecting portion connected to the tip of the main body and extending in a first direction, and a second connecting portion connected to the bottom end of the main body and extending in the opposite direction to the first direction, wherein the first connecting portion abuts against the top of the light guide ring, and the second connecting portion is fixed to the first circuit board, characterized in that the fingerprint module is as described in claim 1.

9. The fingerprint module according to claim 1, characterized in that the first circuit board is one of a soft board, a hard board, and a soft-hard bonding board.

10. The fingerprint module according to claim 1, characterized in that the second circuit board is a hard plate.

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