Encapsulant composition and organic electronic device including same

Abstract

The sealant composition according to the present invention includes a radical curable compound having at least one radical curable functional group, and has a composition polarizability of 1.8 or less, where the composition polarizability is the sum of the product of "compound polarizability for each radical curable compound" constituting the sealant composition and "weight ratio of the radical compound to the sealant composition", and the compound polarizability can be calculated by the following general formula 1. [General formula 1] Compound polarizability=(the sum of the number of carbons and the number of oxygens contained in the molecular structure of the radical curable compound) / (the number of carbons minus the number of oxygens contained in the molecular structure of the radical curable compound)

Description

[Technical field]

[0001] The present invention relates to an encapsulant composition and an organic electronic device containing the same. [Background technology]

[0002] A touch sensor is a type of input device that is installed in an image display device such as a liquid crystal display (LCD), a field emission display (FED), a plasma display panel (PDP), an electroluminescence device (ELD), an electrophoretic display, etc., and allows a user to input predetermined information by applying pressure (pressing or touching) to the touch panel while looking at the image display device.

[0003] Recently, as display devices have become larger and thinner, the form factor of the structure of the touch sensor used in the display devices has changed. Accordingly, display devices in which a touch sensor is directly formed on a sealing layer have been developed.

[0004] On the other hand, as the display device becomes thinner, the distance between the touch sensor electrode constituting the touch sensor and the upper electrode in the image display device becomes narrower, which may cause a problem of generating a parasitic current and reducing the touch sensitivity of the touch sensor.

[0005] Therefore, the main issue to be solved is to reduce the dielectric constant of the sealing layer to increase the touch sensitivity of the user. Summary of the Invention [Problem to be solved by the invention]

[0006] The problem to be solved by the present invention is to provide an encapsulant composition capable of realizing excellent touch sensitivity based on the characteristics of a low dielectric constant. The technical problem of the present invention is not limited to the technical problem mentioned above, and other technical problems not mentioned should be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0007] The present invention can be modified in various ways and can have various embodiments, and a specific embodiment will be described in detail with reference to the drawings. However, this does not limit the present invention to the specific embodiment, and it should be understood that the present invention includes all modifications, equivalents, or alternatives within the spirit and technical scope of the present invention.

[0008] When an element such as a layer, region, or substrate is referred to as being "on" another component, it should be understood that this may be directly on the other element, or there may be intermediate elements in between.

[0009] However, the terms used in this application are used to describe specific embodiments and are not intended to limit the present invention. A singular expression includes a plural expression unless otherwise clearly explained in the context. In this application, the terms "include" or "have" are intended to specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and should be understood not to preclude the presence or additional possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0010] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs. Terms that are defined in commonly used dictionaries should be interpreted to have the same meaning as they have in the context of the relevant art, and should not be interpreted in an ideal or overly formal sense unless expressly defined in this application.

[0011] <Sealant composition>

[0012] The present application relates to an encapsulant composition for an organic electronic device. The encapsulant composition may be an encapsulant that is applied to seal or encapsulate an organic electronic device, such as an OLED. In one example, the encapsulant composition of the present application may be applied to seal or encapsulate the front surface of an organic electronic device. Thus, after the encapsulant composition is applied for encapsulation, it may be in a form that seals the front surface of an organic electronic device.

[0013] As used herein, the term "organic electronic device" refers to an article or device having a structure including an organic material layer that generates an alternating current of charge using holes and electrons between a pair of opposing electrodes, examples of which include, but are not limited to, photovoltaic cells, rectifiers, transmitters, and organic light-emitting diodes (OLEDs). In one embodiment of the present application, the organic electronic device may be an OLED.

[0014] The present application provides an encapsulant composition that is applied directly onto a top-emitting organic electronic device so as to come into contact with the device, and thus has excellent optical properties after curing and prevents deterioration of the device due to outgassing generated during curing of the composition. In particular, the encapsulant composition of the present application must have excellent dischargeability, spreadability, and low viscosity for application to an inkjet process, and must have high surface hardness after curing to prevent damage during the process of forming an inorganic layer in the encapsulating layer, and must have excellent touch sensitivity in a thin-film organic electronic device based on its low dielectric constant characteristics. Therefore, the present application can provide a composition for encapsulating an organic electronic device that can simultaneously achieve the optical properties, device reliability, low viscosity, high hardness, and low dielectric constant by using a specific composition as described below.

[0015] In the present application, the encapsulant composition may include a radical curable compound. The radical curable compound means a composition that can be cured by radical polymerization upon irradiation with light, and may have at least one radical curable functional group. Here, the light to be irradiated may be, for example, electromagnetic waves such as microwaves, infrared rays (IR), ultraviolet rays (UV), X-rays, or gamma rays, as well as particle beams such as alpha-particle beams, proton beams, neutron beams, and electron beams. As an example, the radically curable functional group is not limited unless otherwise specified, but as an example, the (meth)acrylic group may be an acrylic group or a methacrylic group, and more specifically, the polyfunctional aliphatic compound may be a polyfunctional aliphatic (meth)acrylic compound, the monofunctional alicyclic compound may be a monofunctional alicyclic (meth)acrylic compound, the polyfunctional alicyclic compound may be a polyfunctional alicyclic (meth)acrylic compound, and the monofunctional aliphatic compound may be a monofunctional aliphatic (meth)acrylic compound.

[0016] In one embodiment, the sealant composition of the present application includes a radically curable compound having at least one radically curable functional group, and the composition has a polarizability of 1.8 or less, 1.79 or less, 1.78 or less, 1.77 or less, 1.76 or less, 1.75 or less, 1.74 or less, 1.73 or less, 1.72 or less, 1.71 or less, 1.7 or less, 1.69 or less, 1.68 or less, 1.67 or less, 1.66 or less, 1.65 or less, 1.64 or less, 1.63 or less, 1.6 2 or less, 1.61 or less, 1.6 or less, 1.59 or less, 1.58 or less, 1.57 or less, 1.56 or less, 1.55 or less, 1.54 or less, 1.53 or less, 1.52 or less, 1.51 or less, 1.5 or less, 1.49 or less, 1.48 or less, 1.47 or less, 1.46 or less, 1.45 or less, 1.44 or less, 1.43 or less, 1.42 or less, 1.41 or less, 1.4 or less, 1.39 or less, 1.38 or less, 1.37 or less, or 1.36 or less. The lower limit of the polarizability of the composition may be 1 or more.

[0017] Here, the composition polarizability is the sum of the values ​​obtained by multiplying the "compound polarizability of each radically curable compound" constituting the sealant composition by the "parts by weight of the radically curable compound relative to 100 parts by weight of the sealant composition (i.e., the weight ratio of the radically curable compound to the sealant composition)", and the compound polarizability can be calculated by the following general formula 1.

[0018] [General formula 1]

[0019] Compound polarizability=(the sum of the number of carbons and the number of oxygens contained in the molecular structure of the radical curable compound) / (the number of carbons minus the number of oxygens contained in the molecular structure of the radical curable compound)

[0020] In formula 1, the number of carbons (or hydrogens) contained in the molecular structure of the radical curable compound indicates the sum of all the carbons (or hydrogens) in the structural formula of the radical curable compound. For example, when a sealant composition is composed of a radical curable compound (X), a radical curable compound (Y) and a radical curable compound (Z), the polarizability of the composition can be calculated as (polarizability of compound X*weight ratio of compound X to the sealant composition)+(polarizability of compound Y*weight ratio of compound Y to the sealant composition)+(polarizability of compound Z*weight ratio of compound Z to the sealant composition). Here, the weight ratio of the radical curable compound is calculated based on the total weight of all the components contained in the sealant composition, including not only the radical curable compound but also the photoinitiator and surfactant.

[0021] That is, the present application can provide a composition as intended by the present application by controlling the composition polarizability of the radically curable compound that constitutes the composition.

[0022] In one example, the radical curable compound may include an alicyclic compound (X). Here, the alicyclic compound may be a monomer having one or more ring structures in a molecular structure as an alicyclic hydrocarbon system, and may not include an aromatic group such as a benzene ring. As one example, the alicyclic compound (X) may include a bicyclic or tricyclic compound. A bicyclic or tricyclic compound is a ring having two or three rings bonded to each other in a molecular structure, and each ring shares at least one common atom or bond, unlike rings connected through covalent bonds between atoms belonging to different rings. More specifically, the bicyclic or tricyclic compound may be a spiro compound, a fused-ring compound, or a bridged-ring compound, and as one example, the bicyclic or tricyclic compound may be a carbobicyclo compound. A carbobicyclo compound means a compound in which all atoms constituting the two bonded rings are carbon atoms. In this way, the composition according to the present application contains the alicyclic compound (X) having a bulky structure, which increases the molar volume of the composition and prevents polarization through steric hindrance, thereby realizing low dielectric constant characteristics of the composition.

[0023] In one example, the alicyclic compound (X) may be included in an amount of 10 to 100% by weight based on the sealing material composition, and more specifically, may be included in an amount of 13% by weight or more, 15% by weight or more, 17% by weight or more, 20% by weight or more, 23% by weight or more, 25% by weight or more, 27% by weight or more, 30% by weight or more, 33% by weight or more, 35% by weight or more, 37% by weight or more, 40% by weight or more, 43% by weight or more, 45% by weight or more, 47% by weight or more, 50% by weight or more, 53% by weight or more, 55% by weight or more, 57% by weight or more, 60% by weight or more, 63% by weight or more. It may be contained in an amount of 65% by weight or more, 68% by weight or more, 70% by weight or more, 73% by weight or more, or 75% by weight or more, and may be 97% by weight or less, 95% by weight or less, 93% by weight or less, 90% by weight or less, 87% by weight or less, 85% by weight or less, 83% by weight or less, 80% by weight or less, 77% by weight or less, 75% by weight or less, 73% by weight or less, 70% by weight or less, 67% by weight or less, 65% by weight or less, 63% by weight or less, 60% by weight or less, 55% by weight or less, 50% by weight or less, 45% by weight or less, or 40% by weight or less. Through the composition of the sealant composition, the present application can effectively prevent interference between circuits by adjusting the dielectric constant of the composition to a low level. Generally, various methods can be adopted in the industry to reduce the dielectric constant, but this is separate from the realization of inkjet properties. According to the present application, it is possible to provide a sealant composition that maintains the inkjetting properties, has excellent curing sensitivity after curing, and at the same time, can realize a low dielectric constant and moisture barrier properties.

[0024] In one embodiment, the alicyclic compound (X) may include a monofunctional alicyclic compound (X1). Here, the monofunctional alicyclic compound (X1) means that the alicyclic compound has one functional group in the molecule, and examples of the monofunctional alicyclic compound (X1) include, but are not limited to, isobornyl(meth)acrylate, 1,3-adamantanediol(meth)acrylate, 2-methyl-2-adamantyl(meth)acrylate, 2-ethyl-2-adamantyl(meth)acrylate, 1-adamantyl(meth)acrylate, etc. Also, the compound may include the following formula 1, and an example of the compound of formula 1 may be 2-isopropyl-5-methylcyclohexyl(meth)acrylate.

[0025] [ka]

[0026] In the above formula 1, R1 and R2 may each independently be a straight or branched alkyl group having 1 to 6 carbon atoms.

[0027] As an example, R1 and R2 may be, but are not limited to, a methyl group, an isopropyl group, or a t-butyl group. In particular, when the alkyl group has a branched structure, the dipole moment may be lowered, so that an aliphatic compound (Y) having a branched alkyl group may be more preferable.

[0028] In addition, as one example, the monofunctional alicyclic compound (X1) may be included in an amount of 10 to 60% by weight based on the sealing material composition, more specifically, the monofunctional alicyclic compound (X1) may be included in an amount of 12% by weight or more, 14% by weight or more, 16% by weight or more, 18% by weight or more, 20% by weight or more, 22% by weight or more, 30% by weight or more, 35% by weight or more, or 40% by weight or more, and may be included in an amount of 58% by weight or less, 56% by weight or less, 54% by weight or less, 52% by weight or less, 50% by weight or less, 48% by weight or less, 46% by weight or less, 44% by weight or less, 42% by weight or less, 30% by weight or less, or 25% by weight or less.

[0029] In one embodiment, the aliphatic compound (X) may include a polyfunctional alicyclic compound (X2). Here, the polyfunctional alicyclic compound (X2) is an alicyclic compound having two or more functional groups in the molecule, and examples of the polyfunctional alicyclic compound (X2) include, but are not limited to, tricyclodecane dimethanol diacrylate and tricyclodecane dimethanol di(meth)acrylate.

[0030] In one example, the polyfunctional alicyclic compound (X2) may be contained in an amount of 20 to 120 parts by weight relative to 100 parts by weight of the monofunctional alicyclic compound (X1). In detail, the lower limit of the polyfunctional alicyclic compound (X2) may be 23 parts by weight or more, 25 parts by weight or more, 27 parts by weight or more, 30 parts by weight or more, 33 parts by weight or more, 35 parts by weight or more, 37 parts by weight or more, 40 parts by weight or more, 50 parts by weight or more, 60 parts by weight or more, 70 parts by weight or more, 75 parts by weight or more, 80 parts by weight or more, or 90 parts by weight or more relative to 100 parts by weight of the monofunctional alicyclic compound (X1), and the upper limit may be 110 parts by weight or less, 105 parts by weight or less, 100 parts by weight or less, 95 parts by weight or less, 93 parts by weight or less, 91 parts by weight or less, 90 parts by weight or less, 80 parts by weight or less, 70 parts by weight or less, 60 parts by weight or less, 50 parts by weight or less, or 45 parts by weight or less.

[0031] In one embodiment, the radical curable compound may include an aliphatic compound (Y) having a linear or branched alkyl group. Here, the aliphatic compound (Y) having a linear or branched alkyl group means a monomer having a linear or branched alkyl group in the molecular structure as an aliphatic hydrocarbon, and may be distinguished from the alicyclic compound (X) in that it does not have a cyclic structure in the molecular structure, and may not have an aromatic group. In particular, when the alkyl group in the aliphatic compound (Y) has a branched structure, the dipole moment may be low, so that the aliphatic compound (Y) having a branched alkyl group may be more preferable.

[0032] As one example, the aliphatic compound (Y) having a linear or branched alkyl group may be included in an amount of 30 to 300 parts by weight based on 100 parts by weight of the monofunctional alicyclic compound (X1). Specifically, the lower limit of the aliphatic compound (Y) having a linear or branched alkyl group relative to 100 parts by weight of the monofunctional alicyclic compound (X1) may be 35 parts by weight or more, 40 parts by weight or more, 45 parts by weight or more, 50 parts by weight or more, 55 parts by weight or more, 60 parts by weight or more, 61 parts by weight or more, 62 parts by weight or more, 70 parts by weight or more, 80 parts by weight or more, 100 parts by weight or more, 200 parts by weight or more, or 250 parts by weight or more, and the upper limit may be 280 parts by weight or less, 270 parts by weight or less, 260 parts by weight or less, 200 parts by weight or less, 150 parts by weight or less, 100 parts by weight or less, 90 parts by weight or less, 80 parts by weight or less, 70 parts by weight or less, 60 parts by weight or less, or 50 parts by weight or less.

[0033] In one example, the aliphatic compound (Y) having a linear or branched alkyl group may be contained in an amount of 5 to 250 parts by weight relative to 100 parts by weight of the alicyclic compound (X). In detail, the lower limit of the aliphatic compound (Y) having a linear or branched alkyl group relative to 100 parts by weight of the alicyclic compound (X) may be 15 parts by weight or more, 25 parts by weight or more, 35 parts by weight or more, 45 parts by weight or more, 55 parts by weight or more, 60 parts by weight or more, 80 parts by weight or more, 100 parts by weight or more, 120 parts by weight or more, or 140 parts by weight or more, and the upper limit may be 200 parts by weight or less, 150 parts by weight or less, 100 parts by weight or less, 70 parts by weight or less, 50 parts by weight or less, or 30 parts by weight or less.

[0034] In one specific example, the aliphatic compound (Y) having a linear or branched alkyl group may include a monofunctional aliphatic compound (Y1), where the monofunctional aliphatic compound (Y1) means an aliphatic compound having one functional group in the molecule.

[0035] Also, as an example, the monofunctional aliphatic compound (Y1) may include an aliphatic compound having an alkyl group having 12 to 24 carbon atoms. For example, it may be n-dodecyl(meth)acrylate, isododecyl(meth)acrylate, n-tridecyl(meth)acrylate, isotridecyl(meth)acrylate, n-pentadecyl(meth)acrylate, isopentadecyl(meth)acrylate, n-hexadecyl(meth)acrylate, isohexadecyl(meth)acrylate, n-heptadecyl(meth)acrylate, isoheptadecyl(meth)acrylate, stearyl(meth)acrylate, isooctadecyl(meth)acrylate, n-nonadecyl(meth)acrylate, isononadecyl(meth)acrylate, n-dodecyl(meth)acrylate, etc., but is not limited thereto. In this way, by introducing an aliphatic compound having a long chain skeleton, the polarity of the entire molecule can be reduced, thereby realizing a low dielectric constant of the composition.

[0036] In one example, the monofunctional aliphatic compound (Y1) may be included in an amount of 20 to 120 parts by weight relative to 100 parts by weight of the monofunctional alicyclic compound (X1). In detail, the lower limit of the monofunctional aliphatic compound (Y1) may be 25 parts by weight or more, 30 parts by weight or more, 35 parts by weight or more, 40 parts by weight or more, 45 parts by weight or more, 47 parts by weight or more, 50 parts by weight or more, 60 parts by weight or more, 70 parts by weight or more, 80 parts by weight or more, or 90 parts by weight or more relative to 100 parts by weight of the monofunctional alicyclic compound (X1), and the upper limit may be 110 parts by weight or less, 107 parts by weight or less, 105 parts by weight or less, 103 parts by weight or less, 100 parts by weight or less, 97 parts by weight or less, 95 parts by weight or less, 93 parts by weight or less, 91 parts by weight or less, 80 parts by weight or less, 70 parts by weight or less, 60 parts by weight or less, or 50 parts by weight or less.

[0037] In one embodiment, the aliphatic compound (Y) having a linear or branched alkyl group may include a polyfunctional aliphatic compound (Y2). Here, the polyfunctional aliphatic compound (Y2) means an aliphatic compound having at least two functional groups in the molecule.

[0038] In addition, in one example, the polyfunctional aliphatic compound (Y2) may include a difunctional to octafunctional aliphatic compound, and examples thereof include hexanediol di(meth)acrylate, tripropylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane ethoxy tri(meth)acrylate (meth), glycerin propoxylated tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol hexa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, and the like, and may include two or more of these, but are not limited thereto.

[0039] In one example, the polyfunctional aliphatic compound (Y2) may be included in an amount of 20 to 200 parts by weight based on 100 parts by weight of the monofunctional alicyclic compound (X1). In detail, the lower limit of the polyfunctional aliphatic compound (Y2) may be 23 parts by weight or more, 25 parts by weight or more, 27 parts by weight or more, 30 parts by weight or more, 33 parts by weight or more, 35 parts by weight or more, 37 parts by weight or more, 40 parts by weight or more, 80 parts by weight or more, 100 parts by weight or more, 130 parts by weight or more, or 160 parts by weight or more, and the upper limit may be 195 parts by weight or less, 193 parts by weight or less, 190 parts by weight or less, 187 parts by weight or less, 185 parts by weight or less, 183 parts by weight or less, 180 parts by weight or less, 178 parts by weight or less, 175 parts by weight or less, 173 parts by weight or less, 170 parts by weight or less, 168 parts by weight or less, 100 parts by weight or less, 80 parts by weight or less, or 50 parts by weight or less, relative to 100 parts by weight of the monofunctional alicyclic compound (X1).

[0040] As described above, the present application provides a specific composition for the encapsulant composition, which can be applied to an organic electronic device by inkjet printing, and the applied encapsulant composition can provide an organic layer having excellent curing sensitivity after curing. If the curing sensitivity is insufficient, uncured portions are generated or outgassing occurs within the composition, which can cause serious durability and reliability problems due to the characteristics of the encapsulant composition of the present application that is directly applied to an organic electronic device. In addition, the encapsulant composition can realize low dielectric constant characteristics.

[0041] In the present specification, the term "monomer" may refer to a compound having a weight average molecular weight in the range of 150 to 1,000 g / mol, 173 to 980 g / mol, 188 to 860 g / mol, 210 to 823 g / mol, or 330 to 780 g / mol. The present invention improves the degree of curing completion after curing of the sealant by adjusting the weight average molecular weight of the monomer contained in the sealant composition to a low value, and prevents the composition from becoming too viscous, which makes the inkjet process impossible, and at the same time provides moisture barrier properties and excellent curing sensitivity. In the present specification, the weight average molecular weight means a converted value relative to standard polystyrene measured by GPC (Gel Permeation Chromatograph). In one example, a column made of a metal tube having a length of 250 to 300 mm and an inner diameter of 4.5 to 7.5 mm is filled with 3 to 20 mm polystyrene beads. When a diluted solution of the substance to be measured in THF solvent is passed through the column, the weight average molecular weight can be indirectly measured based on the time it takes to flow out. The amount of particles separated by size and exiting the column can be plotted over time to detect the amount.

[0042] In one embodiment, the sealant composition according to the present invention may include a photoinitiator. The photoinitiator may be a photoradical initiator, and the specific type may be appropriately selected in consideration of the curing speed, etc. For example, a benzoin-based, hydroxyketone-based, aminoketone-based, or phosphine oxide-based photoinitiator may be used, and specific examples thereof include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylaniline acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propan-1-one, 4-(2-hydroxyethoxy)phenyl-2-(hydroxy-2-propyl)ketone, benzophenone, p-phenylene, and the like. nylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone, 2-aminoanthraquinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, benzyl dimethyl ketal, acetophenone dimethyl ketal, p-dimethylaminobenzoic acid ester, oligo[2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone], and 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide can be used. The photoinitiator can be used alone or in combination of two or more.

[0043] In one example, the photoinitiator may be included in an amount of 0.01 to 10% by weight, more specifically, 0.01 to 5% by weight, based on the encapsulant composition. By adjusting the content range of the photoinitiator, physical and chemical damage to the organic electronic device can be minimized due to the characteristics of the encapsulant composition of the present application that is directly applied onto the organic electronic device.

[0044] In one embodiment, the sealant composition may include a surfactant, which may be, but is not limited to, a silicone-based surfactant, a fluorine-based surfactant, or an acrylic-based surfactant.

[0045] Specific examples of silicone surfactants include BYK-Chemie's BYK-077, BYK-085, BYK-300, BYK-301, BYK-302, BYK-306, BYK-307, BYK-310, BYK-320, BYK-322, BYK-323, BYK-325, BYK-330, BYK-331, BYK-333, BYK- 335, BYK-341v344, BYK-345v346, BYK-348, BYK-354, BYK-355, BYK-356, BYK-358, BYK-361, BYK-370, BYK-371, BYK-375, BYK-380 or BYK-390. Specific examples of the fluorine-based surfactant include those manufactured by DIC (DaiNippon Ink & Chemicals) F-114, F-177, F-410, F-411, F-450, F-493, F-494, F-443, F-444, F-445, F-446, F-4 70, F-471, F-472SF, F-474, F-475, F-477, F-478, F-479, F-480SF, F-482, F-483, F-484, F-486, F- 487, F-172D, MCF-350SF, TF-1025SF, TF-1117SF, TF-1026SF, TF-1128, TF-1127, TF-1129, TF-1126, TF-1130, TF-1116SF, TF-1131, TF1132, TF1027SF, TF-1441, or TF-1442, but are not limited thereto. In order to control the surface tension of the sealant composition according to the present invention, the surfactant added to the composition may be included in an amount of 0.1 to 1 wt % based on the sealant composition.

[0046] In addition to the above-mentioned components, the sealant composition according to the present application may contain various additives within a range that does not affect the effects of the above-mentioned invention. For example, the sealant composition may contain an antifoaming agent, a tackifier, an ultraviolet stabilizer, an antioxidant, etc. in an appropriate range depending on the desired physical properties.

[0047] In a specific example of the present application, the sealant composition of the present application may be liquid at room temperature, for example, 25° C. In one example, the sealant composition may be a solvent-free liquid. Here, the solvent-free type means that the sealant composition contains 0.05% or less of a solvent. In one example, the sealant composition may be an ink composition. That is, the sealant composition of the present application may be designed to have appropriate physical properties when ejected onto a substrate using inkjet printing that enables non-contact patterning.

[0048] In one example, the encapsulant composition may have a viscosity of 50 cP or less, 1 to 46 cP, 3 to 44 cP, 4 to 38 cP, 5 to 33 cP, or 14 to 24 cP, as measured with a Brookfield DV-3 at a temperature of 25° C., 90% torque, and a shear rate of 20 rpm. By controlling the viscosity of the composition within the above range, the present application can realize physical properties that allow inkjetting when applied to an organic electronic device, and can provide a thin-film encapsulant with excellent coating properties.

[0049] As described in detail below, the sealing composition can be irradiated with light to induce crosslinking and form an organic layer. The light irradiation is performed by applying light having a wavelength range of about 250 to about 450 nm or about 300 to about 450 nm at an intensity of 300 to 6,000 mJ / cm. 2 or 500~4,000mJ / cm 2 The method can include irradiating the substrate with an amount of light of

[0050] In this case, as described below, the organic layer may have a thickness of 25 μm or less. For example, the thickness may be 23 μm or less, 22 μm or less, 21 μm or less, or 20 μm or less, and the lower limit may be 1 μm or more, or 2 μm or more. The present application provides a thin organic electronic device by providing a thin organic layer.

[0051] In a specific example of the present application, the sealant composition may have a surface energy of a cured product after curing within a range of 10 to 50 mN / m, 12 to 45 mN / m, 15 to 40 mN / m, 18 to 35 mN / m, or 20 mN / m to 30 mN / m. The surface energy may be measured by a method known in the art, for example, by the Ring Method. In the present application, by satisfying the above surface energy range, ejection from an inkjet head in an inkjet process becomes easy.

[0052] For example, the surface energy (γsurface, mN / m) can be calculated as γsurface=γdispersion+γpolar, and can be measured using a drop shape analyzer (Drop Shape Analyzer, DSA100 product of KRUSS). For example, the surface energy can be measured by applying the sealant composition to be measured to a SiNx substrate with a thickness of about 50 μm and a thickness of 4 cm. 2 After forming a sealing film (spin coater), the film was dried at room temperature for about 10 minutes in a nitrogen atmosphere and then exposed to a 1000mW / cm 2 with an intensity of 4000mJ / cm 2After curing, the film is UV-cured through a light amount of 10 ...

[0053] In a specific example of the present application, the sealing material composition may have a dielectric constant of 2.8 or less, 2.79 or less, 2.78 or less, 2.77 or less, 2.76 or less, 2.75 or less, 2.74 or less, 2.73 or less, 2.72 or less, 2.71 or less, 2.7 or less, 2.69 or less, or 2.68 or less at a frequency of 110 to 250 kHz and a temperature of 25° C. As an example, each dielectric constant may be measured at a frequency of 150 to 250 kHz, and more specifically, at a frequency of 250 kHz.

[0054] As an example, the dielectric constant is set to about 1,000 mJ / cm by depositing aluminum on glass to a thickness of about 50 nm and coating the sealant composition thereon by inkjet printing. 2 The organic layer is then cured with UV light at a dose of about 1000 .mu.m to form an organic layer having a thickness of about 20 .mu.m, and aluminum is then deposited on the organic layer to a thickness of about 50 nm. The impedance / gain-phase measurement can be performed using an HP 4194A impedance / gain-phase measuring instrument.

[0055] The dielectric constant of the film mass-produced by the conventional technology is in the range of about 3.4 to 4.5, and the parasitic capacitance between electrodes makes it unsuitable for use in large displays. In addition, the thinner the thickness, the higher the dielectric constant value tends to be, but the present application can have a low dielectric constant value as described above even with a thickness of 20 μm or less. In this way, the organic layer formed from the composition having the above configuration satisfies the above dielectric constant range, so that even if a thin organic layer is applied to an organic electronic device described below, no interference problem occurs between circuits, and therefore an organic electronic device that can be made thin can be provided. Since lowering the dielectric constant is advantageous for improving the sensitivity of a touch sensor, the lower limit of the dielectric constant is not particularly limited, but may be, for example, 0.01 or 0.1.

[0056] In specific examples of the present application, after curing, the modulus may be 1.5 GPa or more, 1.7 GPa or more, 1.9 GPa or more, 2.1 GPa or more, 2.2 GPa or more, 2.3 GPa or more, 2.4 GPa or more, 2.5 GPa or more, 2.6 GPa or more, or 2.7 GPa or more at 25° C. By satisfying such a modulus, the surface hardness is excellent, and damage to the organic layer, which is the cured product of the encapsulant composition, can be prevented in a process such as CVD for forming an inorganic layer.

[0057] The modulus is 1000 mW / cm2 when the sealant composition is applied to a glass substrate at a predetermined thickness and exposed to an LED UV lamp. 2 The hardness of the cured specimen may be measured by curing the specimen under UV conditions of 20 cm in length and width and 3 μm in thickness. In particular, the hardened specimen may be loaded for 5 seconds with a nanoindenter HM-2000 (Fisher), held for 2 seconds, and then unloaded for 5 seconds, and the measurement conditions may be Experimental mode: Indentation Mode (using Berkovitz), Control mode: Force control, Maximum force: 2 mN, 250 kHz, and 25° C.

[0058] In addition, in a specific example of the present application, the encapsulant composition may have a light transmittance of 90% or more, 92% or more, or 95% or more in the visible light region after curing. In the above range, the present application provides an organic electronic device with high resolution, low power consumption, and long life by applying the encapsulant composition to a top-emitting organic electronic device. In addition, the encapsulant composition of the present application may have a haze of 3% or less, 2% or less, or 1% or less according to a JIS K7105 standard test after curing, and the lower limit is not particularly limited, but may be 0%. Within the above haze range, the encapsulant composition may have excellent optical properties after curing. In the present specification, the above-mentioned light transmittance or haze may be measured in a state in which the encapsulant composition is cured in an organic layer, or may be an optical property measured when the organic layer has a thickness of 2 to 20 μm. In a specific example of the present application, the above-mentioned moisture adsorbent or inorganic filler may not be included in order to realize the optical properties.

[0059] <Organic electronic devices>

[0060] The present application also relates to an organic electronic device. As shown in FIG. 1, an exemplary organic electronic device 3 may include a substrate 31, an organic electronic element 32 formed on the substrate 31, and an organic layer 33 that seals the front surface of the organic electronic element 32 and is formed of the above-mentioned sealant composition.

[0061] In a specific example of the present application, the organic electronic element 32 may include a first electrode layer, an organic material layer formed on the first electrode layer and including at least an emission layer, and a second electrode layer formed on the organic material layer. The first electrode layer may be a transparent electrode layer or a reflective electrode layer, and the second electrode layer may also be a transparent electrode layer or a reflective electrode layer. More specifically, the organic electronic element 32 may include a reflective electrode layer formed on a substrate, an organic material layer formed on the reflective electrode layer and including at least an emission layer, and a transparent electrode layer formed on the organic material layer.

[0062] In this application, the organic electronic element 32 may be an organic light emitting diode.

[0063] In one example, the organic electronic device according to the present application may be a top emission type, but is not limited thereto, and may be applied to a bottom emission type.

[0064] The organic electronic device 3 may further include an inorganic layer 35 between the organic electronic element 32 and the organic layer to protect the electrodes and the light-emitting layer of the organic electronic element 32. The inorganic layer 35 may be a protective layer formed by chemical vapor deposition (CVD). As an example, the inorganic layer 35 may be one or more metal oxides or nitrides selected from the group consisting of Al, Zr, Ti, Hf, Ta, In, Sn, Zn, and Si. The inorganic layer may have a thickness of 10 to 70 nm or about 20 to about 60 nm. As an example, the inorganic layer 35 of the present application may be an inorganic material that does not contain a dopant or an inorganic material that contains a dopant. The dopant that can be doped may be one or more elements selected from the group consisting of Ga, Si, Ge, Al, Sn, Ge, B, In, Tl, Sc, V, Cr, Mn, Fe, Co, and Ni, or oxides of the elements, but is not limited thereto.

[0065] As one example, the organic electronic device 3 may further include an inorganic layer 34 formed on the organic layer 33. The inorganic layer 34 may be made of the same or different material as the inorganic layer 35 formed between the organic electronic element 32 and the organic layer, and the inorganic layer 34 may be formed in the same manner as the inorganic layer 35.

[0066] The organic layer may have a thickness of 25 μm or less. For example, the thickness may be 23 μm or less, 22 μm or less, 21 μm or less, or 20 μm or less, and the lower limit may be 1 μm or more, or 2 μm or more. The present application provides a thin organic electronic device by providing a thin organic layer.

[0067] As one example, the organic electronic device 3 of the present application may include a sealing structure including the above-mentioned organic layer 33 and inorganic layer 34, and the sealing structure may include at least one or more organic layers 33 and at least one or more inorganic layers 34, and the organic layers 33 and the inorganic layers 34 may be repeatedly stacked. For example, the organic electronic device may have a structure of substrate / organic electronic element / inorganic layer / (organic layer / inorganic layer)n, where n may be a number within a range of 1 to 100. FIG. 1 is a cross-sectional view illustrating an example where n is 1.

[0068] In one embodiment, the display device may include an encapsulation structure 36 including at least one organic layer and at least one inorganic layer, and a touch sensor 37 formed on the encapsulation structure.

[0069] In one embodiment, the touch sensor 37 may be formed directly on the encapsulation structure 36. That is, the touch sensor 37 and the encapsulation structure 36 may be directly in contact with each other without a separate layer such as an adhesive layer or a bonding layer being interposed between them. Such a laminated structure may be referred to as a TOE (Touch On Encapsulation) structure. By having such a TOE structure, the thickness of the organic electronic device may be reduced compared to the conventional art.

[0070] Meanwhile, as the organic electronic device becomes thinner, the distance between the electrode for the touch sensor 37 (i.e., the conductive layer) and the electrode for the organic electronic element in contact with the touch panel becomes narrower, which may cause a problem of a parasitic current being generated between them, resulting in a decrease in the sensitivity of the touch sensor. Therefore, the TOE structure requires an organic layer for the encapsulant having a low dielectric constant, particularly to prevent a decrease in touch sensitivity, and the present application provides an encapsulant composition in response to this need.

[0071] The touch sensor 37 means a device capable of recognizing input information obtained through contact with a user, and may be a sensor known in the related technical field. For example, the sensor may be a capacitance-type sensor that recognizes touch based on static electricity generated from a part of the user's body that is in contact (e.g., a hand) and the resulting change in current; or a pressure-reducing sensor that recognizes touch based on a change in electric capacitance that occurs when the conductive layers of the upper and lower plates of the touch sensor come into contact with each other due to pressure applied by the user. The configuration of a sensor that can recognize a user's touch in each manner may be known in the related technical field.

[0072] In one example, the touch sensor 37 may include a conductive layer (not shown) on one or both sides. The material of the conductive layer is not particularly limited, and may be, for example, a transparent conductive film such as ITO or a metal nanowire. The conductive layer may have a channel through which electricity flows and a non-channel region through which electricity does not flow. Such regions may be formed by a method such as etching or photolithography.

[0073] In one example, the organic electronic device 3 may further include a cover substrate (not shown) on the top surface. That is, the organic electronic device 3 according to the present invention may include an encapsulation structure 36, a touch sensor 37, and a cover substrate in this order. In this case, the cover substrate and the touch sensor may be collectively referred to as a touch panel. An encapsulant may be positioned on the touch panel to implement a TOE structure.

[0074] The cover substrate may have light transmissivity, for example, a transmittance of 80% or more for visible light. When the cover substrate has light transmissivity, the type of material contained in the cover substrate is not particularly limited. For example, the cover substrate may include a polymer resin or a glass component. In one example, when it is necessary to impart a flexible property, the cover substrate may include a polymer resin. For example, the cover substrate may include, but is not particularly limited to, a polyester film such as PC (Polycarbonate), PEN (poly(ethylene naphthalate)) or PET (poly(ethylene terephthalate)); an acrylic film such as PMMA (poly(methylmethacrylate), or a polyolefin film such as PE (polyethylene) or PP (polypropylene); a polyimide film; or a polyamide film.

[0075] <Method of manufacturing organic electronic device>

[0076] The present application also relates to a method for manufacturing an organic electronic device.

[0077] In one embodiment, the manufacturing method may include forming an organic layer 33 on a substrate 31 having an organic electronic element 32 formed thereon, so that the above-mentioned encapsulant composition encapsulates the front surface of the organic electronic element 32.

[0078] The substrate 31 of the organic electronic device 32 may be manufactured by forming a reflective electrode or a transparent electrode on a substrate 31 such as glass or a polymer film by a method such as vacuum deposition or sputtering, and then forming an organic material layer on the reflective electrode. The organic material layer may include a hole injection layer, a hole transport layer, a light emitting layer, an electron injection layer, and / or an electron transport layer. Then, a second electrode is further formed on the organic material layer. The second electrode may be a transparent electrode or a reflective electrode.

[0079] The manufacturing method of the present application may further include a step of forming an inorganic layer 35 on the first electrode, the organic material layer, and the second electrode formed on the substrate 31. Then, the above-mentioned organic layer 33 is applied to the substrate 31 to cover the front surface of the organic electronic device 32. At this time, the step of forming the organic layer 33 is not particularly limited, and the above-mentioned sealant composition may be applied to the front surface of the substrate 31 by a process such as inkjet printing, gravure coating, spin coating, screen printing, or reverse offset coating.

[0080] Also, the method may further include a step of irradiating the organic layer with light. In the present invention, a curing process may be performed on the organic layer that seals the organic electronic device. The curing process may be performed, for example, in a heating chamber or a UV chamber, and preferably in a UV chamber. In one example, the above-mentioned encapsulant composition may be applied by inkjet printing, and the applied encapsulant composition may be irradiated with light to induce crosslinking, thereby forming an organic layer. This may be performed in the wavelength range of 250 to 450 nm and 300 to 6,000 mJ / cm as described above. 2 The organic layer can be formed by irradiating the film with light in a range of the amount of light.

[0081] The manufacturing method of the present application may further include a step of forming an inorganic layer 34 on the organic layer 33. The step of forming the inorganic layer 34 may be performed using a method known in the art, and may be the same as or different from the method of forming the inorganic layer (35 in FIG. 1) described above.

[0082] In addition, a step of disposing a touch sensor 37 on the organic layer 33 or inorganic layer (35, 34), i.e., the sealing structure 36, can be added. Effect of the Invention

[0083] As described above, the encapsulant composition according to the embodiment of the present invention can improve the touch sensitivity of the adjacent touch sensor and provide excellent protection against the external environment. However, the effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description. [Brief description of the drawings]

[0084] [Figure 1] 1 is a cross-sectional view of an organic electronic device according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0085] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, the same reference numerals are used to refer to the same components in the drawings in order to facilitate an overall understanding, and duplicate descriptions of the same components will be omitted.

[0086] <Experimental Example>

[0087] 1. Composition polarizability

[0088] The composition polarizability is the sum of the product of the "compound polarizability of each radically curable compound" constituting the sealant composition and the "parts by weight of the radically curable compound relative to 100 parts by weight of the sealant composition (i.e., the weight ratio of the radically curable compound relative to the sealant composition)", and the compound polarizability was calculated by the following general formula 1.

[0089] That is, when the sealant composition is composed of a radically curable compound (X), a radically curable compound (Y), and a radically curable compound (Z), the polarizability of the composition can be calculated by (polarizability of compound X*weight ratio of compound X to the sealant composition)+(polarizability of compound Y*weight ratio of compound Y to the sealant composition)+(polarizability of compound Z*weight ratio of compound Z to the sealant composition). Here, the weight ratio of the curable compound is calculated based on the total weight of all components contained in the sealant composition, and includes not only the radically curable compound but also the photoinitiator, surfactant, etc.

[0090] [General formula 1]

[0091] Compound polarizability=(the sum of the number of carbons and the number of oxygens contained in the molecular structure of the radical curable compound) / (the number of carbons minus the number of oxygens contained in the molecular structure of the radical curable compound)

[0092] 2.Curing rate

[0093] The sealant compositions prepared according to the examples and comparative examples were inkjet coated onto cleaned bare glass, and then exposed to 1,000 mJ / cm 2 UV light using an LED UV lamp in a N2 atmosphere. 2 The curing was carried out with a light amount of 10 ... -1 The cure rate was measured via the integral of the area.

[0094] Curing rate (%)=(1-1420cm -1 Organic layer integral value of the region / 1420cm -1 Area composition integral value) x 100

[0095] 3. Dielectric constant

[0096] An aluminum plate (conductive plate) was deposited on the cleaned bare glass to a thickness of 150 nm. The sealing material compositions prepared in the Examples and Comparative Examples were inkjet coated on the deposited aluminum plate surface, and the coated compositions were exposed to an LED UV lamp at 1,000 mJ / cm. 2 Curing was performed with a light amount of 1000 nm to form an organic layer with a thickness of 10 μm. An aluminum plate (conductive plate) was again deposited on the organic layer with a thickness of 150 nm to prepare a test specimen. Then, the dielectric constant of the prepared test specimen was measured under conditions of 250 kHz and 25°C using an impedance / gain-phase measuring device HP 4194A. In this application, the dielectric constant may refer to a relative value (ratio) to the dielectric constant in a vacuum, assuming that the dielectric constant in a vacuum is 1.

[0097] <Example>

[0098] Examples 1 to 3

[0099] The compositions according to Examples 1 to 3 were prepared by mixing the compositions and contents (each part by weight is based on 100 parts by weight of the composition) shown in Table 1 below at 25° C. for 3 hours or more.

[0100] Comparative Examples 1 to 3

[0101] The compositions and contents (parts by weight based on 100 parts by weight of the composition) shown in Table 1 below were prepared and mixed at 25° C. for 3 hours or more to prepare the compositions according to Comparative Examples 1 to 3.

[0102] [Table 1]

[0103] Table 2 below summarizes the data of the experimental examples according to the above-mentioned Examples and Comparative Examples.

[0104] [Table 2]

[0105] Although the present invention has been described with reference to the embodiments, those skilled in the art will understand that the present invention can be modified and changed in various ways without departing from the spirit and scope of the present invention as set forth in the claims below. [Explanation of symbols]

[0106] 3:Organic electronic devices 31: Substrate 32: Organic electronic devices 36: Sealing structure 35: Inorganic layer 33:Organic layer 34: Inorganic layer 37: Touch sensor

Claims

1. A sealant composition comprising a radical curable compound having at least one acrylic group, The radical curable compound includes a monofunctional alicyclic compound (X1), a polyfunctional alicyclic compound (X2), and an aliphatic compound (Y) having a linear or branched alkyl group, The aliphatic compound (Y) having a linear or branched alkyl group includes a monofunctional aliphatic compound (Y1), The monofunctional aliphatic compound (Y1) is contained in an amount of 20 to 97 parts by weight based on 100 parts by weight of the monofunctional alicyclic compound (X1), The composition polarizability is 1.6 or less (here, the composition polarizability is the sum of the product of the "compound polarizability of each radical curable compound" constituting the sealant composition and the "weight ratio of the radical curable compound to the sealant composition"). The compound polarizability is calculated by the following general formula 1: A sealant composition having a dielectric constant of 2.8 or less at a temperature of 25° C. and at any one of frequencies of 110 to 250 kHz after curing: [General formula 1] Compound polarizability=(the total value of the number of carbon atoms and the number of oxygen atoms contained in the molecular structure of the radical curable compound) / (the total value of the number of carbon atoms minus the number of oxygen atoms contained in the molecular structure of the radical curable compound).

2. The sealant composition according to claim 1, wherein the monofunctional alicyclic compound (X1) is contained in an amount of 10 to 60% by weight.

3. 2. The sealant composition according to claim 1, comprising 20 to 120 parts by weight of the polyfunctional alicyclic compound (X2) per 100 parts by weight of the monofunctional alicyclic compound (X1).

4. 2. The sealant composition according to claim 1, comprising 30 to 300 parts by weight of an aliphatic compound (Y) having a linear or branched alkyl group per 100 parts by weight of the monofunctional alicyclic compound (X1).

5. The sealant composition according to claim 1, wherein the monofunctional aliphatic compound (Y1) comprises an aliphatic compound having an alkyl group having 12 to 24 carbon atoms.

6. The aliphatic compound (Y) having a linear or branched alkyl group includes a polyfunctional aliphatic compound (Y2), The polyfunctional aliphatic compound (Y2) is contained in an amount of 20 to 200 parts by weight based on 100 parts by weight of the monofunctional alicyclic compound (X1). The sealant composition according to any one of claims 1 to 5.

7. The sealant composition of claim 1 further comprising a photoinitiator.

8. The sealant composition of claim 1 further comprising a surfactant.

9. The sealant composition according to claim 1 , which is a solventless ink composition.

10. An organic electronic device comprising: a substrate; an organic electronic element formed on the substrate; and an organic layer sealing a front surface of the organic electronic element and formed from the encapsulant composition according to any one of claims 1 to 9.

11. 11. The organic electronic device of claim 10, further comprising an inorganic layer formed between the organic electronic element and the organic layer or on the organic layer.

12. A method for manufacturing an organic electronic device, comprising: forming an organic layer on a substrate having an organic electronic element formed thereon, the organic layer being formed with the encapsulant composition according to any one of claims 1 to 9 so as to encapsulate a front surface of the organic electronic element.

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