Inspection system, inspection management device, inspection program creation method, and program

Abstract

To provide a technique that can improve the accuracy and efficiency of inspection in an inspection system for a component mounting substrate including a plurality of types of inspection devices.SOLUTION: An inspection system has: 1+n types of imaging means that pick up images of a component mounting substrate being an object to be inspected to acquire image data; 1+m types of inspection means that, based on the 1+n types of image data acquired by the 1+n types of imaging means, execute inspection corresponding to the image data; inspection suitability degree calculation means that, for every inspection item related to components mounted on the component mounting substrate, calculates an inspection suitability degree indicating the suitability of 1+m types of inspections performed by the 1+m types of inspection means for detecting abnormalities through the inspection items; and program creation means that, based on the inspection suitability degree, for every inspection item related to the components mounted on the component mounting substrate, determines the presence or absence of execution of the 1+m types of inspection.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an inspection system, an inspection management device, an inspection program creating method, and a program. [Background technology]

[0002] Conventionally, measurements and inspections using images of the boards have been performed in the manufacturing process of various types of boards, and when inspections are performed using multiple types of inspection devices, a system in which the inspection items defined for each component of the board are shared among multiple inspection devices is also known (Patent Document 1).

[0003] Patent Document 1 discloses a technique for selecting an inspection device for each component of a board to be inspected and for each inspection item that needs to be performed in a board inspection system equipped with multiple types of inspection devices, and reflecting the selection in the inspection program of each inspection device. This makes it possible to prevent the same inspection item from being set in multiple inspection devices in an unnecessary manner, and to prevent the occurrence of an inspection item that is not inspected by any of the inspection devices. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2012-151250 A (Patent No. 5522065) Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, in the technology described in the above Patent Document 1, which inspection device will be used for which inspection item of which component is determined based on design information such as the type of component and its arrangement on the board, etc. However, during actual inspection, unexpected influences may occur based on the state of the components mounted on the board and the state of each inspection device, and the above-mentioned allocation of inspection items is not necessarily optimal from the viewpoint of inspection accuracy and efficiency.

[0006] The present invention has been made in consideration of the above-described situation, and aims to provide a technique that makes it possible to improve the accuracy and efficiency of inspection in an inspection system for component mounting boards that is equipped with multiple types of inspection devices. [Means for solving the problem]

[0007] In order to achieve the above object, the present invention adopts the following configuration. 1+n types of imaging means for capturing an image of a component mounting board as an object to be inspected and acquiring image data; 1+m types of inspection means for carrying out inspections corresponding to the respective image data based on the 1+n types of image data acquired by each of the 1+n types of imaging means; an inspection suitability calculation means for calculating, for each inspection item related to each component mounted on the component mounting board, an inspection suitability indicating the suitability of each of the 1+m types of inspections by the 1+m types of inspection means for detecting an abnormality by the inspection item; and an inspection program creating means for creating or updating an inspection program for the component mounting board, The inspection system is characterized in that the inspection program creation means determines whether or not to conduct each of the 1+m types of inspection for each inspection item related to each of the components mounted on the component mounting board based on the inspection suitability.

[0008] The "imaging means" referred to here is not limited to a camera that detects wavelengths in the visible light region, but also includes an X-ray camera that detects X-rays, a photomultiplier sensor used for laser scanning, and the like. The "inspection means" refers to a device that performs an inspection based on image data of an object to be inspected, such as an automated optical inspection (AOI) or an automated X-ray inspection (AXI). The above "inspection items" may also include information such as the coordinates where the inspection is performed and parameters for extracting the object to be inspected. In the above, n may also be m.

[0009] According to this configuration, in a board inspection system equipped with multiple types of inspection means, it is possible to calculate the suitability of each inspection item determined for each component of the board, taking into account the difference in the measurement principle of each inspection means, and set the inspection program so that the inspection item is inspected by the inspection means according to the suitability (i.e., the most suitable). This makes it possible to improve the reliability (precision) and efficiency (speed) of the inspection.

[0010] The inspection system further includes a sample image acquisition means for acquiring 1+n types of sample images of the component mounting board captured by each of the 1+n types of imaging means, The test suitability calculation means may include a first suitability calculation unit that calculates the test suitability based on the sample image.

[0011] According to this configuration, it is possible to calculate which inspection method is more suitable for inspection based on the image captured by an actual inspection device and the actual way in which the component to be inspected is captured. For example, the shape of a component (and its surrounding solder fillet) that can be seen from the outside is generally suitable for visual inspection, but in an image actually captured by a visible light camera, there may be a secondary reflection on the fillet, it may be in a blind spot of other components, or there may be insufficient brightness / saturation. In such a case, the suitability of visual inspection is reduced (compared to the general assumption), so by taking such information into account and determining the suitability, it is possible to calculate a more accurate suitability. Then, by setting an inspection program based on this, it is possible to improve the accuracy of the inspection.

[0012] The first suitability calculation unit may also include a trained model that has been subjected to machine learning using a training data set that includes inspection image data of the component mounting board that resulted in missed detection and / or overdetection in at least any of the 1+m types of inspections that have been performed in the past.

[0013] In addition, "detection failure" means overlooking something, and "overdetection" means overlooking something. With this configuration, the suitability calculation can be efficiently performed using a learning model that is trained based on past performance data.

[0014] The inspection system further includes an inspection history acquisition means for acquiring past inspection history information including inspection results of missed detection and / or overdetection related to components of the same type as each of the components mounted on the component mounting board, The test suitability calculation means may include a second suitability calculation unit that calculates the test suitability based on the test history information.

[0015] Here, "similar parts" is not limited to parts with the same part number, but also includes other parts with similar shapes, uses, etc. With this configuration, it becomes possible to calculate a more accurate suitability for each inspection method by determining the suitability for inspection items of parts that are prone to (have a high track record of) overdetection and overdetection by taking into account such track records.

[0016] The inspection system further includes a design information acquisition unit for acquiring design information related to the component mounting board, The suitability for testing calculation means may include an initial value calculation unit that calculates an initial value of the suitability for testing based on the design information.

[0017] It has been generally known that it is possible to estimate which inspection method is suitable for each inspection item of each component mounted on a board in light of design information such as the layout and size of the components on the board. For this reason, based on such knowledge, it is possible to calculate the suitability for the first inspection and the second inspection for each inspection item of each component mounted on the component-mounted board to be inspected, and use this as an initial value. This makes it possible to calculate the suitability relatively easily, and to improve the accuracy of the inspection by calculating a more accurate suitability as appropriate according to the actual conditions of the inspection, and then updating the initial value.

[0018] In addition, the inspection suitability may be calculated individually for each of the 1+m types of inspection, and the inspection suitability calculation means may calculate all of the inspection suitabilities for the 1+m types of inspection for each inspection item related to each of the components.

[0019] Specifically, for example, the test suitability may be calculated for each of the 1+m types of tests using a value ranging from 1 to 10. This allows the suitability of each test to be calculated and compared in accordance with the actual situation, and then it is possible to determine how to allocate tests for each test item, thereby making it possible to more accurately reflect the test suitability in the test program. However, the test suitability is not limited to the above-mentioned manner of showing it, and may be shown, for example, as a ratio of the suitability of one test to another test, or may be shown by allocating values ​​so that the sum of the test suitabilities of all tests is always 100. It may also be shown by ranking the suitability of all tests.

[0020] Furthermore, the inspection program creation means may determine whether or not to implement the 1+m types of inspections for each inspection item related to each of the components mounted on the component mounting board, based on the inspection suitability, so that at least any of the 1+m types of inspections is implemented for each inspection item related to each of the components mounted on the component mounting board, and so that for an inspection item for which none of the 1+m types of inspections reaches a predetermined standard, all of the 1+m types of inspections are implemented.

[0021] For efficient inspection, it is preferable to avoid overlapping inspections between multiple inspection means, but for accurate inspection, necessary and sufficient inspections must be performed on all parts. In this regard, with the above-mentioned configuration, when the suitability of any of the inspections is such that the inspection accuracy cannot be guaranteed, it is possible to ensure coverage by overlapping all the inspections.

[0022] Furthermore, for the inspection items in which a difference in the inspection suitability of each of the 1+m types of inspections is within a predetermined range, the inspection program creation means may determine to perform one of the 1+m types of inspections so as to minimize a line tact for inspecting the component mounting board.

[0023] If the suitability of the first and second inspections is a value that does not matter which one is adopted, i.e., if the inspection accuracy is guaranteed, it is preferable to create an inspection program in which the inspection means to inspect the inspection item is to be shortest in line tact time for the entire inspection process (i.e., to improve efficiency). Specifically, inspections are allocated based on criteria such as performing the inspection with a means that does not increase the number of imaging fields even if the inspection item is allocated, and performing the inspection with a means that does not become a bottleneck by referring to past history information on the time required for the inspection. can be done.

[0024] The 1+n types of imaging means include a first imaging means which is a visible light camera and a second imaging means which is an X-ray camera, and the 1+m types of inspections include a first inspection based on first image data acquired by the first imaging means and a second inspection based on second image data acquired by the second imaging means. two A second inspection based on the image data may be included. The combination of these inspection means is suitable for inspecting component mounting boards.

[0025] The present invention also provides an apparatus for managing inspection in an inspection system including 1+n types of imaging means for capturing images of a component mounting board as an inspection target to acquire image data, and 1+m types of inspection means for carrying out inspections corresponding to the respective image data based on the 1+n types of image data acquired by each of the 1+n types of imaging means, an inspection suitability calculation means for calculating, for each inspection item related to each component mounted on the component mounting board, an inspection suitability indicating the suitability of each of the 1+m types of inspections by the 1+m types of inspection means for detecting an abnormality by the inspection item; and an inspection program creating means for creating or updating an inspection program for the component mounting board, The inspection program creation means can also be regarded as an inspection management device that determines whether or not to conduct each of the 1+m types of inspection for each inspection item related to each of the components mounted on the component mounting board based on the inspection suitability.

[0026] The present invention also provides an inspection program creation method for an inspection system including 1+n types of imaging means for capturing images of a component mounting board as an inspection target to acquire image data, and 1+m types of inspection means for carrying out inspections corresponding to each of the image data based on the 1+n types of image data acquired by each of the 1+n types of imaging means, comprising: an inspection suitability calculation step of calculating, for each inspection item related to each component mounted on the component mounting board, an inspection suitability indicating the suitability of each of the 1+m types of inspections by the 1+m types of inspection means for detecting an abnormality by the inspection item; and a step of determining whether or not to perform each of the 1+m types of inspection for each inspection item related to each of the components mounted on the component mounting board based on the inspection suitability.

[0027] The inspection program creation method further includes a sample image acquisition step of acquiring 1+n types of sample images of the component mounting board captured by each of the 1+n types of imaging means, The test suitability calculation step may include a first suitability calculation step of calculating the test suitability based on the sample image.

[0028] The inspection program creation method further includes an inspection history acquisition step of acquiring past inspection history information including inspection results of missed detection and / or overdetection for components of the same type as each of the components mounted on the component mounting board, The test suitability calculation step may include a second suitability calculation step of calculating the test suitability based on the test history information.

[0029] The inspection program creation method further includes a design information acquisition step of acquiring design information related to the component mounting board, The test suitability calculation step may include an initial value calculation step of calculating an initial value of the test suitability based on the design information.

[0030] The present invention also relates to a program for causing a computer to execute the above method, The present invention can also be regarded as a computer-readable recording medium on which such a program is non-transitoryly recorded.

[0031] The present invention can be achieved by combining the above-described configurations and processes as long as no technical contradiction occurs. Effect of the Invention

[0032] According to the present invention, it is possible to provide a technique that makes it possible to improve the accuracy and efficiency of inspection in an inspection system for component mounting boards that is equipped with multiple types of inspection devices. [Brief description of the drawings]

[0033] [Figure 1] FIG. 1 is a schematic diagram showing a schematic configuration of an inspection system according to an application example. [Diagram 2] FIG. 2 is a block diagram showing a schematic configuration of an inspection system according to an embodiment. [Diagram 3] FIG. 3 is a flowchart showing a flow of creating an inspection program in the inspection system according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0034] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, unless otherwise specified, the dimensions, materials, shapes, relative positions, and the like of the components described in each of the following embodiments are not intended to limit the scope of the present invention.

[0035] <Application Examples> (Configuration of application example) The present invention can be applied, for example, as an inspection management device for creating an inspection program for a board inspection system. FIG. 1 is a schematic diagram showing a schematic configuration of a board inspection system to which the present invention is applied. As shown in FIG. 1, a board inspection system 9 according to this application example is configured to include a plurality of inspection devices 91, 92 arranged on a production line (not shown) for component-mounted boards, an inspection management device 93 for managing the contents and results of the inspection, and a communication line such as a LAN (Local Area Network) that interconnects these devices. Note that, in this application example, a system including two types of imaging means and an inspection device equipped with each of the imaging means will be described as an example, but the number of imaging means and inspection devices is not limited to this.

[0036] Each of the inspection devices 91 and 92 is a device that inspects a component-mounted board O, which is an object to be inspected, based on image data captured by an imaging means of the component-mounted board transported from a production line by a transport roller (not shown). As shown in Fig. 1, each of the inspection devices 91 and 92 is configured to include imaging means 911 and 921, image data acquisition units 912 and 922, and inspection processing units 913 and 923. The white arrow in the figure indicates the direction in which the component-mounted board O is transported.

[0037] Here, different types of imaging means are adopted for the imaging means 911 of the inspection device 91 and the imaging means 921 of the inspection device 92, and for example, the imaging means 911 can be a visible light camera and the imaging means 921 can be an X-ray camera, etc. Then, in each inspection device, the image data obtained by the imaging means and the image data acquisition unit is subjected to a predetermined inspection program in an inspection processing unit to determine pass / fail, thereby inspecting the component mounting board O.

[0038] The inspection management device 93 can be configured, for example, by a general-purpose computer, and includes functional units, such as an inspection suitability calculation unit 931, an inspection program creation unit 932, and a storage unit 933. In addition, although not shown, it includes various input means such as a mouse and a keyboard, and output means such as a display.

[0039] The inspection suitability calculation unit 931 calculates, for each inspection item related to each component mounted on the component mounting board O, an inspection suitability indicating the suitability of the inspection by the inspection device 91 and the inspection by the inspection device 92 for detecting an abnormality by the inspection item. A specific calculation method will be described later.

[0040] Furthermore, the inspection program creation unit 932 creates an inspection program for the inspection process performed by the inspection devices 91 and 92. Here, the created inspection program includes flag information indicating whether or not the inspection items related to each component mounted on the inspection device component mounting board O are to be inspected by the inspection devices 91 and 92, respectively. That is, if the flag is ON, the inspection device will inspect the target inspection items, and if the flag is OFF, the inspection items will not be inspected. Note that "creating" a program here includes not only creating a program from scratch, but also updating an existing program.

[0041] The memory unit 933 is composed of storage means such as a RAM, an HDD, etc., and stores various information such as various design information related to the component mounting board O (components to be mounted, component layout, etc.), information related to the components (component type, component part number, lot number, component image, etc.), inspection programs (inspection items, inspection standards, etc.), past inspection image data, and past inspection result information.

[0042] (Test suitability calculation) Next, the calculation of suitability performed by the inspection suitability calculation unit 931 in this application example will be described. The inspection suitability calculation unit 931 sets an initial value of suitability (i.e., the degree to which an abnormality can be appropriately detected) for each component mounted on the component mounting board O and for each inspection item thereof based on various design information related to the component mounting board O stored in the storage unit 933. For example, for an inspection item targeting a component color or a character portion printed on a component, such as "wrong part number", inspection cannot be performed using an image captured by an X-ray camera, so the inspection suitability of the X-ray inspection device is 0. On the other hand, for a bottom-mounted component (BGA) of a board, inspection cannot be performed using a visible light image captured from the top surface of the board, so the inspection suitability of the appearance inspection device is 0.

[0043] The inspection suitability calculation unit 931 further performs a process of updating the set initial value to match the actual inspection environment. For example, an image of a non-defective sample (hereinafter simply referred to as a sample image) previously photographed by the inspection devices 91 and 92 can be acquired, and the suitability can be corrected based on the sample image to reflect the actual situation. For example, if the acquired sample image shows a lack or saturation of brightness, the inspection suitability of the inspection device that photographed the sample image is revised downward.

[0044] In this manner, the inspection suitability calculation unit 931 calculates, for each inspection item related to each component mounted on the component mounting board O, an inspection suitability indicating the suitability of the inspection by the inspection device 91 and the inspection by the inspection device 92 for detecting abnormalities using that inspection item.

[0045] Then, based on the inspection suitability calculated in this manner, inspection program creation unit 932 creates an inspection program. Here, the inspection suitability is used when deciding the allocation of inspection items so as to prevent overlapping inspection between inspection device 91 and inspection device 92 as much as possible, while ensuring coverage so that necessary and sufficient inspection is performed on all components mounted on component mounting board O.

[0046] The inspection program created by the inspection program creating unit 932 is transmitted to each of the inspection devices 91 and 92, and the inspection of the component mounting board O is started according to the inspection program created based on the inspection suitability.

[0047] According to the above-described inspection management system 9, the inspection apparatuses each having different imaging systems can be Since the testing can be divided among different test items according to their suitability, it is possible to improve both the accuracy and efficiency of testing.

[0048] <Embodiment> Hereinafter, an embodiment of the present invention will be described in more detail with reference to Figs. 2 and 3, taking as an example a system for inspecting a substrate using a visual inspection device and an X-ray inspection device.

[0049] (System Configuration) 2 is a block diagram showing an outline of the configuration of a substrate inspection system 1 according to this embodiment. The substrate inspection system 1 according to this embodiment is generally configured to include a visual inspection device 10, an X-ray inspection device 20, a data server 30, and an inspection management device 40, which are communicatively connected by a communication means (not shown).

[0050] The appearance inspection device 10 is a device that performs an appearance inspection of a component mounting board by, for example, an inspection method that combines the so-called phase shift method and color highlight method. The inspection method that combines the phase shift method and color highlight method is already known technology, so a detailed description will be omitted, but such an inspection makes it possible to accurately detect the shape of the electrode that is visible from the outside and the degree of inclination of the fillet in the land part of the board. The phase shift method is a method of restoring the three-dimensional shape of an object surface by analyzing the distortion of a pattern when a pattern light is projected onto the object surface. The color highlight method is a method of capturing the three-dimensional shape of the solder surface as two-dimensional hue information by irradiating the board with light of multiple colors (wavelengths) at different incident angles and capturing an image in a state in which color features according to the normal direction of the solder surface (the color of the light source in the regular reflection direction as seen from the camera) appear on the solder surface.

[0051] The appearance inspection device 10 generally includes the functional units of an appearance image capturing unit 110, an appearance measurement unit 120, and an appearance inspection unit 130, as well as a projector, a light source, and a stage for holding the board (none of which are shown). The appearance image capturing unit 110 captures an image of the board illuminated with light from a projector and a light source (not shown), and outputs an image for appearance inspection. The appearance measurement unit 120 measures the appearance shape of the board (components mounted thereon) based on the image for appearance inspection. The appearance inspection unit 130 performs an appearance inspection of the board (components mounted thereon), i.e., a pass / fail judgment, by comparing the measured appearance shape with an inspection standard. Note that, hereinafter, even if it is simply referred to as "inspection of the board", it also includes an inspection of the components mounted on the board.

[0052] The above-mentioned information on the appearance inspection image, the measurement values ​​of the appearance shape, and the appearance inspection results is transmitted from the appearance inspection device 10 to the data server 30 and stored in the data server 30.

[0053] The X-ray inspection device 20 is a device that measures the three-dimensional shape of a board by, for example, a method such as CT (Computed Tomography) or tomosynthesis, and judges the quality of the board based on the three-dimensional shape.

[0054] The X-ray inspection device 20 generally includes functional units, such as an X-ray image capturing unit 210, an X-ray measurement unit 220, and an X-ray inspection unit 230, as well as an X-ray source and a stage for holding a substrate (none of which are shown). The X-ray image capturing unit 210 captures X-rays emitted from an X-ray source (not shown) and transmitted through the substrate, to output a tomographic image of the substrate (hereinafter referred to as an X-ray image). The X-ray measurement unit 220 measures the three-dimensional shape of the substrate based on a plurality of X-ray images. The X-ray inspection unit 230 compares the measured three-dimensional shape with an inspection standard to inspect the three-dimensional shape of the substrate, i.e., to determine whether the substrate is good or bad.

[0055] The above X-ray images, 3D shape data, and X-ray inspection results are all stored in the X-ray inspection device 2. 0 to the data server 30 and stored in the data server 30.

[0056] The inspection management device 40 may be, for example, a general-purpose computer. That is, although not shown, it includes a processor such as a CPU or DSP, a storage unit including a main storage unit such as a read-only memory (ROM) or random access memory (RAM) and an auxiliary storage unit such as an EPROM, a hard disk drive (HDD) or removable media, an input unit such as a keyboard or a mouse, and an output unit such as a liquid crystal display. The inspection management device 40 may be configured as a single computer or may be configured as a plurality of computers that cooperate with each other.

[0057] The auxiliary storage unit stores an operating system (OS), various programs, various information related to the object to be inspected, various inspection standards, etc., and the programs stored therein are loaded into the working area of ​​the main storage unit and executed, and each component unit, etc. are controlled through the execution of the programs, thereby realizing functional units that fulfill predetermined purposes, as described below. Note that some or all of the functional units may be realized by hardware circuits such as ASICs and FPGAs.

[0058] Next, a description will be given of each functional unit of the inspection management device 40. The inspection management device 40 includes an inspection suitability calculation unit 410, a design information acquisition unit 420, a sample image acquisition unit 430, a history information acquisition unit 440, and an inspection program creation unit 450.

[0059] As described below, the inspection suitability calculation unit 410 calculates the inspection suitability based on information acquired by the design information acquisition unit 420, the sample image acquisition unit 430, and the history information acquisition unit 440. The inspection suitability is a degree indicating the suitability of the inspection by the appearance inspection apparatus 10 and the inspection by the X-ray inspection apparatus 20 for detecting an abnormality by each inspection item related to each component mounted on the board. In this embodiment, the appearance inspection suitability indicating the suitability of the inspection by the appearance inspection apparatus 10 and the X-ray inspection suitability indicating the suitability of the inspection by the X-ray inspection apparatus 20 are each calculated as a value from 0 to 10.

[0060] In detail, the test suitability calculation unit 410 further includes the functional units of an initial value calculation unit 411, an image information reflection unit 412, and a history information reflection unit 413.

[0061] The design information acquisition unit 420 acquires design information of the board, such as the shape and size of the components (and lands) to be mounted on the board to be inspected, and the positional relationship of each component, from the data server 30. The sample image acquisition unit 430 acquires sample image data of a non-defective sample of the board to be inspected, which is captured by the appearance inspection device 10 and the X-ray inspection device 20, from the data server 30. The history information acquisition unit 440 acquires information on past inspection history including inspection results of missed detection and / or overdetection for components of the same type as each component to be mounted on the board, from the data server 30. Note that the term "same type of components" as used here is not limited to components with the same component number, but also includes other components with similar shapes, uses, etc.

[0062] The inspection program creation unit 450 creates an inspection program for the inspection process performed by the visual inspection apparatus 10 and the X-ray inspection apparatus 20. The creation of the inspection program will be described in detail later. Note that the "creation" of a program here includes not only creating a program from scratch, but also updating an existing program.

[0063] The initial value calculation unit 411 calculates an initial value of the inspection suitability based on the design information acquired by the design information acquisition unit 420. Specifically, for an inspection item that requires identification of the part color or characters printed on the part, such as "wrong part number", X-ray inspection cannot be applied, so the X-ray inspection suitability is set to 0 and the appearance inspection suitability is set to 10. On the other hand, for an inspection item that requires identification of the part color or characters printed on the part, such as "wrong part number", the X-ray inspection suitability is set to 0 and the appearance inspection suitability is set to 10. For inspection items relating to parts to which visual inspection cannot be applied, such as parts that are covered with a shield or parts that are not covered with a shield, the suitability for visual inspection is set to 0, and the suitability for X-ray inspection is set to 10. In addition, for inspections relating to solder shape, such as front fillets, the suitability for visual inspection may be set to be higher than the suitability for X-ray inspection (for example, suitability for visual inspection = 7, suitability for X-ray inspection = 4, etc.). However, even for inspection items relating to solder shape, the suitability for visual inspection is set to be lower for those that are likely to be in the blind spot of the visual inspection or to be affected by secondary reflections from the fillets of adjacent parts due to the positional relationship between the target part and adjacent parts.

[0064] The image information reflecting unit 412 calculates a corrected inspection suitability by correcting the initial value of the inspection suitability calculated by the initial value calculating unit 411 using the data acquired by the sample image acquiring unit 430. Specifically, for example, when there is a component in which secondary reflection or blind spots are confirmed in the sample image of the appearance inspection, or when the image has insufficient brightness / saturation, the image calculates a corrected inspection suitability by correcting the appearance inspection suitability of the component downward. In addition, for example, when the sample image of the X-ray inspection has a large noise due to the components on the back side of the board, the image information reflecting unit 412 calculates a corrected inspection suitability by correcting the X-ray inspection suitability downward. Note that such processing based on the sample image may be performed by determining based on brightness or noise amount in image processing on the sample image, or a value may be obtained by inputting the sample image into a learned model that has been learned based on past inspection results. In this embodiment, the image information reflecting unit 412 corresponds to the first suitability calculating unit.

[0065] The history information reflecting unit 413 calculates a correction inspection suitability by further correcting the initial value of the inspection suitability or the correction inspection suitability, using information on the past inspection history acquired by the history information acquiring unit 440. Specifically, for example, in a case where overlooking has frequently occurred in past appearance inspections of the same type of parts as the inspection target, a correction inspection suitability by downwardly correcting the appearance inspection suitability may be calculated. Note that, in a case where there is no particular history information to be reflected, the history information reflecting unit 413 does not need to calculate the correction inspection suitability. In this embodiment, the history information reflecting unit 413 corresponds to a second suitability calculating unit.

[0066] (Inspection program creation process) Next, referring to Fig. 3, a process flow for creating an inspection program in the inspection management system 1 of this embodiment will be described. Fig. 3 is a flowchart showing the process flow. As shown in Fig. 3, first, the parts to be inspected, the inspection items for the parts, and the inspection standards that are the basis for determining whether the inspection items are good or bad are registered, and an initial program is created (S101). This process may be performed by a user through manual input, or may be performed by the inspection program creation unit 450 of the inspection management device 40.

[0067] Next, images of non-defective samples of the board are captured by the visual inspection device 10 and the X-ray inspection device 20, respectively, and the sample image data is stored in the data server 30 (S102).

[0068] Next, the inspection management device 40 acquires design information of the inspection target board from the data server 30 by the design information acquisition unit 420 (S103). If the design information of the inspection target board is not stored in the data server 30 in advance, the design information may also be registered at this stage. Next, the inspection management device 40 calculates an initial value of the inspection suitability based on the design information acquired in step S103 by the initial value calculation unit 411 of the inspection suitability calculation unit 410 (S104). The calculation of the initial value of the inspection suitability is as described above, so a description thereof will be omitted here.

[0069] Next, the inspection management device 40 acquires the sample image of the inspection target board captured in step S102 from the data server 30 through the sample image acquisition unit 430 (S105). Based on the sample image information acquired in step S105, the corrected inspection suitability is calculated (S106). The calculation of the corrected inspection suitability by the image information reflecting unit 412 is as described above, and therefore a description thereof will be omitted here.

[0070] Next, the inspection management device 40 acquires information on past inspection history including missed detection and / or overdetection inspection results for components of the same type as each component mounted on the board from the data server 30 through the history information acquisition unit 440 (S107). Next, the inspection management device 40 calculates the correction inspection suitability based on the history information acquired in step S107 through the history information reflection unit 413 of the inspection suitability calculation unit 410 (S108). The calculation of the correction inspection suitability by the history information reflection unit 413 is as described above, and therefore will not be described here.

[0071] Next, the inspection management device 40 updates the initial program by the inspection program creation unit 450 using the inspection suitability calculated through the processes of steps S104 to S108. More specifically, first, for each inspection item related to each component mounted on the board, the inspection ON / OFF is determined to determine whether or not to perform inspection by the visual inspection device 10 and the X-ray inspection device 20 (S109). Specifically, while ensuring coverage so that necessary and sufficient inspection is performed for all components mounted on the board, the inspection ON / OFF of each inspection device is determined so that the same inspection items are not inspected redundantly by the visual inspection device 10 and the X-ray inspection device 20 as much as possible. This improves the efficiency of the inspection and also prevents a situation in which an inspection with low inspection suitability results in overlooking.

[0072] Incidentally, the ON / OFF of the inspection items can be determined by reflecting, for example, the following policies: That is, "For each possible defect type, only the inspection items with high inspection suitability are turned ON", "For defect types that only have inspection items with low inspection suitability in any of the inspection devices (for example, visual inspection suitability = 5, X-ray inspection suitability = 4, etc.), inspection is turned ON in all of the inspection devices to prevent oversight", etc. Also, flexible settings can be made according to the case, such as "For front fillet inspection, inspection is performed by the X-ray inspection device 20 only when a defect is judged to be defective by the visual inspection device 10".

[0073] Next, the inspection management device 40 checks whether the inspection program for which the ON / OFF of the inspection has been determined in step S109 can be updated to further shorten the line tact (S110). Specifically, when the inspection suitability of both the visual inspection device 10 and the X-ray inspection device 20 meets a predetermined standard and the inspection accuracy of the target inspection item is guaranteed in either case (for example, visual inspection suitability = 8, X-ray inspection suitability 8, etc.), the ON / OFF of the inspection is updated so as to minimize the line tact of the entire inspection process (i.e., to improve efficiency). For example, the inspection program can be updated based on criteria such as "perform the inspection with the inspection device that does not increase the number of imaging fields even if the corresponding inspection item is performed" and "predict the time required for the inspection of similar inspection items by referring to past history information and perform the inspection with the device that does not become a bottleneck."

[0074] The inspection management device 40 stores the inspection program thus created (updated) in the data server 30 (or each inspection device) (S111), and ends a series of inspection program creation processes. Then, the visual inspection device 10 and the X-ray inspection device 20 inspect the board according to the inspection program.

[0075] According to the inspection management system of the present embodiment, in an inspection system for component-mounted boards equipped with a visual inspection device and an X-ray inspection device, it is possible to calculate the inspection suitability for each inspection item related to each component mounted on the board, and based on this, create an inspection program that can perform efficient inspection while ensuring inspection coverage. Therefore, it is possible to improve inspection efficiency while ensuring inspection accuracy.

[0076] <Other> The above examples are merely illustrative of the present invention, and the present invention is not limited to the above specific forms. Various modifications and combinations of the present invention are possible within the scope of the technical concept. For example, the systems in the above examples are configured to include two types of inspection devices corresponding to two types of imaging means, but the present invention can also be applied to systems including inspection devices equipped with other imaging means. Conversely, a single inspection device may be configured to include multiple imaging means and corresponding inspection means. In addition, the above examples have been described as systems including inspection devices, but the present invention can also be viewed as a management device for an inspection system including the above inspection devices.

[0077] In addition, in the flow of the inspection program creation process of the above embodiment, the order of the processes from step S105 to step S108 may be changed. Furthermore, any or all of the processes of step S106, step S108, and step S110 may not be performed.

[0078] In addition, in the above embodiment, the configuration had an inspection management device 40 for creating inspection programs, separate from the visual inspection device 10 and the X-ray inspection device 20. However, without providing a separate inspection management device 40, it is also possible to provide each functional unit of the inspection management device 40 in either the visual inspection device 10 or the X-ray inspection device 20 and have them process each of the above steps.

[0079] In the above embodiment, the appearance inspection device 10 has been described as an inspection device using a combination of the phase shift method and the color highlight method, but it may also be an appearance inspection device that performs inspection using only the phase shift method or only the color highlight method.

[0080] Furthermore, the present invention is not limited to the combination of a visual inspection device and an X-ray inspection device, but can also be applied to a combination of a laser scan measurement device and an X-ray inspection device.

[0081] <Appendix 1> a component mounting board as an object to be inspected, and 1+n types of imaging means (110, 210) for acquiring image data; and 1+m types of inspection means (10, 20) for carrying out inspections corresponding to the respective image data based on the 1+n types of image data acquired by the 1+n types of imaging means; an inspection suitability calculation means (410) for calculating, for each inspection item related to each component mounted on the component mounting board, an inspection suitability indicating the suitability of each of the 1+m types of inspections by the 1+m types of inspection means for detecting an abnormality by the inspection item; and an inspection program creation means (450) for creating or updating an inspection program for the component mounting board, the inspection program creation means determines whether or not to perform each of the 1+m types of inspection for each inspection item related to each of the components mounted on the component mounting board based on the inspection suitability. An inspection system (1).

[0082] <Appendix 2> The component mounting board (O), which is the object to be inspected, is imaged and image data is acquired. A device (93) for managing an inspection in an inspection system (9) including imaging means (911, 921) and 1+m types of inspection means (91, 92) for performing inspections corresponding to each of the 1+n types of image data based on the 1+n types of image data acquired by each of the 1+n types of imaging means, For each inspection item related to each component mounted on the component mounting board, an inspection suitability calculation means (931) for calculating inspection suitability indicating suitability of each of the 1+m types of inspections by the 1+m types of inspection means for detecting the abnormality; and an inspection program creation means (932) for creating or updating an inspection program for the component mounting board, the inspection program creation means determines whether or not to perform each of the 1+m types of inspection for each inspection item related to each of the components mounted on the component mounting board based on the inspection suitability. An inspection management device comprising:

[0083] <Appendix 3> An inspection program creation method for an inspection system including 1+n types of imaging means for capturing images of a component mounting board as an inspection target to acquire image data, and 1+m types of inspection means for carrying out inspections corresponding to each of the image data based on the 1+n types of image data captured by each of the 1+n types of imaging means, comprising: an inspection suitability calculation step (S104, S106, S108) of calculating, for each inspection item related to each component mounted on the component mounting board, an inspection suitability indicating the suitability of each of the 1+m types of inspections by the 1+m types of inspection means for detecting an abnormality by the inspection item; and an inspection execution determination step (S109) of determining whether or not to execute each of the 1+m types of inspection for each inspection item related to each of the components mounted on the component mounting board based on the inspection suitability. [Explanation of symbols]

[0084] 1, 9... Circuit Board Inspection System 10. Visual inspection equipment 110...Exterior image capturing unit 120...Appearance measurement section 130... Visual Inspection Department 20. X-ray inspection equipment 210 X-ray image capturing unit 220 X-ray measurement section 230 X-ray Inspection Department 30 Data Server 40, 93... Inspection management device 410, 931: Inspection suitability calculation unit 450, 932 Inspection Program Creation Department 91, 92: Inspection equipment 911, 921... Imaging means O...Component mounting board

Claims

1. 1+n types of imaging means for capturing an image of a component mounting board as an object to be inspected and acquiring image data; a sample image acquisition means for acquiring 1+n types of sample images of the component mounting board captured by each of the 1+n types of imaging means; 1+m types of inspection means for carrying out inspections corresponding to the 1+n types of image data based on the 1+n types of image data acquired by each of the 1+n types of imaging means; an inspection suitability calculation means for calculating, for each inspection item related to each component mounted on the component mounting board, an inspection suitability indicating the suitability of each of the 1+m types of inspections by the 1+m types of inspection means for detecting an abnormality by the inspection item; and an inspection program creating means for creating or updating an inspection program for the component mounting board, the test suitability calculation means includes a first suitability calculation unit that calculates the test suitability reflecting a real state of an actual test environment based on the sample image; The inspection program creation means determines whether or not to perform each of the 1+m types of inspection for each inspection item related to each of the components mounted on the component mounting board based on the inspection suitability. The inspection system is characterized by the above.

2. The first suitability calculation unit includes a trained model obtained by performing machine learning using a training data set including inspection image data relating to the component mounting board that has been subjected to detection oversight and / or overdetection in at least one of the 1+m types of inspections performed in the past.

2. The inspection system according to claim 1 .

3. The method further includes an inspection history acquisition means for acquiring past inspection history information including inspection results of missed detection and / or overdetection for components of the same type as each of the components mounted on the component mounting board, The test suitability calculation means includes a second suitability calculation unit that calculates the test suitability based on the test history information.

3. An inspection system according to claim 1 or 2.

4. The device further includes a design information acquisition unit for acquiring design information related to the component mounting board, the suitability for testing calculation means includes an initial value calculation unit that calculates an initial value of the suitability for testing based on the design information; 4. An inspection system according to claim 1, wherein the inspection system comprises:

5. The inspection suitability is calculated individually for each of the 1+m types of inspections, the inspection suitability calculation means calculates all of the inspection suitabilities of the 1+m types of inspection for each inspection item related to each of the components.

5. An inspection system according to claim 1, characterized in that it comprises:

6. the inspection program creation means determines whether or not to perform the 1+m types of inspections for each inspection item related to each of the components mounted on the component mounting board based on the inspection suitability, so that at least any of the 1+m types of inspections is performed for each inspection item related to each of the components mounted on the component mounting board, and so that for an inspection item for which none of the inspection suitabilities of the 1+m types of inspections reaches a predetermined standard, all of the 1+m types of inspections are performed. An inspection system according to any one of claims 1 to 5, characterized in that

7. the inspection program creation means determines, for the inspection items in which the difference in the inspection suitability of each of the 1+m types of inspections is within a predetermined range, to perform any one of the 1+m types of inspections so as to minimize the line tact time for the inspection of the component mounting board. An inspection system according to any one of claims 1 to 5, characterized in that

8. The 1+n types of imaging means include a first imaging means which is a visible light camera and a second imaging means which is an X-ray camera, The 1+m types of inspections include a first inspection based on first image data acquired by the first imaging means and a second inspection based on first image data acquired by the second imaging means.

5. An inspection system according to claim 1, characterized in that it comprises:

9. 1 + n types of imaging means for capturing an image of a component mounting board as an object to be inspected and acquiring image data; 1+m types of inspection means for carrying out inspections corresponding to the 1+n types of image data based on the 1+n types of image data acquired by each of the 1+n types of imaging means; an inspection suitability calculation means for calculating, for each inspection item related to each component mounted on the component mounting board, an inspection suitability indicating the suitability of each of the 1+m types of inspections by the 1+m types of inspection means for detecting an abnormality by the inspection item; and an inspection program creating means for creating or updating an inspection program for the component mounting board, the inspection program creation means determines whether or not to perform the 1+m types of inspections for each inspection item related to each of the components mounted on the component mounting board based on the inspection suitability, so that at least any of the 1+m types of inspections is performed for each inspection item related to each of the components mounted on the component mounting board, and so that for an inspection item for which none of the inspection suitabilities of the 1+m types of inspections reaches a predetermined standard, all of the 1+m types of inspections are performed. The inspection system is characterized by the above.

10. 1+n types of imaging means for capturing an image of a component mounting board as an object to be inspected and acquiring image data; a sample image acquisition means for acquiring 1+n types of sample images of the component mounting board captured by each of the 1+n types of imaging means; An apparatus for managing inspections in an inspection system including 1+m types of inspection means for carrying out inspections corresponding to each of the 1+n types of image data acquired by each of the 1+n types of imaging means, comprising: an inspection suitability calculation means for calculating, for each inspection item related to each component mounted on the component mounting board, an inspection suitability indicating the suitability of each of the 1+m types of inspections by the 1+m types of inspection means for detecting an abnormality by the inspection item; and an inspection program creating means for creating or updating an inspection program for the component mounting board, the inspection suitability calculation means calculates the inspection suitability reflecting the actual state of an actual inspection environment based on at least the sample image; the inspection program creation means determines whether or not to perform each of the 1+m types of inspection for each inspection item related to each of the components mounted on the component mounting board based on the inspection suitability. An inspection management device comprising:

11. 1+n types of imaging means for capturing an image of a component mounting board as an object to be inspected and acquiring image data; a sample image acquisition means for acquiring 1+n types of sample images of the component mounting board captured by each of the 1+n types of imaging means; A method for creating an inspection program in an inspection system including 1+m types of inspection means for performing inspections corresponding to each image data based on 1+n types of image data acquired by each of the 1+n types of imaging means, comprising: an inspection suitability calculation step of calculating, for each inspection item related to each component mounted on the component mounting board, an inspection suitability indicating the suitability of each of the 1+m types of inspections by the 1+m types of inspection means for detecting an abnormality by the inspection item; and a step of determining whether or not to perform each of the 1+m types of inspections for each inspection item related to each of the components mounted on the component mounting board based on the inspection suitability, The test suitability calculation step includes a first suitability calculation step of calculating the test suitability reflecting a real state of an actual test environment based on the sample image. How to create an inspection program.

12. The method further includes an inspection history acquisition step of acquiring past inspection history information including inspection results of missed detection and / or overdetection for components of the same type as each of the components mounted on the component mounting board, The test suitability calculation step includes a second suitability calculation step of calculating the test suitability based on the test history information.

12. The inspection program creating method according to claim 11,

13. The method further includes a design information acquisition step of acquiring design information related to the component mounting board, the test suitability calculation step includes an initial value calculation step of calculating an initial value of the test suitability based on the design information.

13. The inspection program creating method according to claim 11 or 12, further comprising:

14. A method for obtaining image data by imaging a component mounting board, which is an object to be inspected, comprising the steps of: imaging a component mounting board; Means, A method for creating an inspection program in an inspection system including 1+m types of inspection means for performing inspections corresponding to each image data based on 1+n types of image data acquired by each of the 1+n types of imaging means, comprising: an inspection suitability calculation step of calculating, for each inspection item related to each component mounted on the component mounting board, an inspection suitability indicating the suitability of each of the 1+m types of inspections by the 1+m types of inspection means for detecting an abnormality by the inspection item; and a step of determining whether or not to perform the 1+m types of inspections for each inspection item related to each component mounted on the component mounting board based on the inspection suitability, so that at least one of the 1+m types of inspections is performed for each inspection item related to each component mounted on the component mounting board, and for an inspection item for which none of the inspection suitabilities of the 1+m types of inspections reaches a predetermined standard, all of the 1+m types of inspections are performed. How to create an inspection program.

15. A program for causing a computer to execute each step of the inspection program creating method according to any one of claims 11 to 14.

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