Working device analysis system, working device analysis method, and data collection device

Abstract

A work device analysis method that includes: acquiring work history information from a work device in which is installed a work unit that carries out work for producing an electronic circuit substrate (ST1); generating, from the acquired work history information, a first file that includes an operation event log of the work device, and a second file that includes a production log for the electronic circuit substrate (ST2-ST4); determining whether maintenance of a work unit is necessary from the first file (ST5); and estimating the condition of the work unit from the second file (ST6).

Description

[Technical field]

[0001] The present disclosure relates to a working device analysis system, a working device analysis method, and a data collection device for analyzing the state of a working device used to manufacture electronic circuit boards. [Background technology]

[0002] Working units such as suction nozzles and component mounting heads used in working devices such as component mounting devices for manufacturing electronic component circuit boards become dirty, worn, distorted, or otherwise deteriorated during repeated manufacturing operations, resulting in problems such as reduced mounting accuracy. For this reason, the working units are inspected or maintained periodically. Inspection or maintenance is performed by interrupting the manufacturing operations. For this reason, in order to prevent a decrease in production efficiency, it is desirable to perform inspection or maintenance less frequently and at an appropriate time.

[0003] Patent Document 1 discloses that while the component mounting device is in operation, log data such as the amount of correction of the pickup position when the suction nozzle picks up an electronic component and error events in which the suction nozzle fails to pick up a component are collected, and when a certain amount of log data is accumulated, an equipment diagnostic system diagnoses whether the operating device is malfunctioning. Then, based on the diagnosis results, it is determined whether maintenance is required, and maintenance work is instructed. This makes it possible to properly diagnose malfunctions in the operating device and perform maintenance without interrupting manufacturing operations. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2020-27329 A Summary of the Invention

[0005] However, in the conventional techniques including Patent Document 1, although it is possible to diagnose malfunctions of a work device without interrupting manufacturing operations, the amount of log data used for diagnosis is enormous. Therefore, when the device to be diagnosed is installed in a facility different from that of the work device, there is a problem in that a large load is imposed on sending and receiving data.

[0006] In view of the above, an object of the present disclosure is to provide a work implement analysis system, a work implement analysis method, and a data collection device that are capable of appropriately analyzing the state of a work implement.

[0007] The operating device analysis system disclosed herein includes an acquisition unit that acquires work history information from a operating device equipped with a work unit that performs work to manufacture an electronic circuit board, a file generation unit that generates a first file including an operation event log of the operating device and a second file including a manufacturing log of the electronic circuit board from the acquired work history information, a maintenance necessity determination unit that determines whether or not maintenance is required for the operating unit from the first file, and a condition estimation unit that estimates the condition of the operating unit from the second file.

[0008] The operating device analysis method disclosed herein includes acquiring work history information from a operating device equipped with a working unit that performs work to manufacture an electronic circuit board, generating a first file including an operation event log of the operating device and a second file including a manufacturing log of the electronic circuit board from the acquired work history information, determining whether or not maintenance is required for the operating unit from the first file, and estimating the condition of the operating unit from the second file.

[0009] A data collection device according to the present disclosure includes an acquisition unit that acquires work history information from a maintenance device equipped with a work unit that performs work for manufacturing an electronic circuit board, a file generation unit that generates a first file including an operation event log of the maintenance device and a second file including a manufacturing log of the electronic circuit board from the acquired work history information, and a transmission unit that transmits the first file and the second file; The transmission unit transmits the first file to a maintenance necessity determination device that determines whether or not the task unit needs maintenance, and transmits the second file to a condition estimation device that estimates the condition of the task unit. .

[0010] According to the present disclosure, the state of a work implement can be appropriately analyzed. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a diagram illustrating a configuration of a working tool analysis system according to an embodiment of the present disclosure. [Diagram 2] FIG. 2 is a configuration explanatory diagram of a component mounting device according to an embodiment of the present disclosure. [Diagram 3] FIG. 3 is a block diagram showing a configuration of a working device analysis system according to an embodiment of the present disclosure. [Figure 4] FIG. 4 is a flow diagram of a working device analysis method according to one embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] An embodiment of the present disclosure will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation, and can be appropriately changed according to the specifications of the operating device analysis system, the component mounting line, the component mounting device, the component supply device, etc. In the following, the same or corresponding elements in all the drawings are given the same reference numerals, and duplicated explanations are omitted. In FIG. 2, the X-axis (direction perpendicular to the paper surface in FIG. 2) in the board transport direction and the Y-axis (left-right direction in FIG. 2) perpendicular to the board transport direction are shown as two axes perpendicular to each other in the horizontal plane. In addition, the Z-axis (up-down direction in FIG. 2) is shown as the height direction perpendicular to the horizontal plane.

[0013] First, the configuration of the operating device analysis system 1 will be described with reference to Fig. 1. Fig. 1 is a configuration explanatory diagram of the operating device analysis system 1 according to an embodiment of the present disclosure. The operating device analysis system 1 includes a factory F and a support center S established at a location away from the factory F. The factory F is provided with two component mounting lines L1, L2, each of which is configured by connecting a plurality of component mounting devices M1-M3. Each of the component mounting lines L1, L2 has a function of manufacturing electronic circuit boards by sequentially mounting electronic components (hereinafter referred to as "components D"; see Fig. 2) on the circuit boards using the component mounting devices M1-M3.

[0014] Each of the component mounting devices M1 to M3 is connected to a manufacturing management device 3 via an in-house communication network 2 such as a LAN (Local Area Network). The factory F is also provided with a mail receiving device 4 for receiving e-mails sent from the support center S. The number of component mounting lines L1, L2 installed in the factory F does not need to be two, but may be one, or three or more. The number of component mounting devices M1 to M3 constituting the component mounting lines L1, L2 does not need to be three, but may be one, two, or four or more. In addition to the manufacturing management device 3, each of the component mounting lines L1, L2 may be provided with a line management device for managing the manufacture of electronic circuit boards in the component mounting lines L1, L2.

[0015] 1, the support center S is located at a position where it can efficiently analyze the necessity of maintenance of operation units for a plurality of factories F (customers) and provide various types of support to personnel in each factory F. The support center S is provided with a maintenance management device 5 and a mail server 6.

[0016] The mail server 6 is connected to the maintenance management device 5 via an on-premise communication network 7 such as a LAN. The manufacturing management device 3 and the maintenance management device 5 exchange information via an off-premise communication network 8 such as the Internet or a mobile communication line. The mail receiving device 4 and the mail server 6 exchange information such as e-mail via an off-premise communication network 9.

[0017] The off-premise communication network 8 and the off-premise communication network 9 may share the same off-premise communication network. The manufacturing management device 3 and the maintenance management device 5 may exchange information via the cloud instead of directly exchanging information. That is, information transmitted from the manufacturing management device 3 and the maintenance management device 5 may be stored in the cloud, and information may be transmitted from the cloud to the manufacturing management device 3 and the maintenance management device 5 upon request. In addition to email, information may be notified using a communication tool that uses a data communication line, or information may be exchanged by accessing from the touch panel 22 (see FIG. 2) of the manufacturing management device 3 or the component mounting devices M1 to M3.

[0018] Next, the configuration of component mounting apparatuses M1 to M3 will be described with reference to Fig. 2. Fig. 2 is a configuration explanatory diagram of component mounting apparatus M1 (M2, M3) according to an embodiment of the present disclosure. The component mounting apparatuses M1 to M3 have the same configuration. Below, the component mounting apparatus M1 will be described.

[0019] The component mounting device M1 is a work device having a function of mounting a component D on a circuit board B. A board transport mechanism 12 provided on the upper surface of a base 11 transports the circuit board B from the positive to negative direction of the X-axis, positions it, and holds it. A head moving mechanism 13 provided above the base 11 moves a mounting head 14, which is detachably attached via a plate 13a, in the positive and negative directions of the X-axis and the positive and negative directions of the Y-axis. A suction nozzle 15 is detachably attached to the lower end of the mounting head 14.

[0020] A plurality of tape feeders 16 are mounted in a line along the X-axis on a feeder base 17a provided on an upper portion of a carriage 17 coupled to the base 11 on the side of the board transport mechanism 12. A plurality of slots for mounting the tape feeders 16 are provided on the feeder base 17a. A feeder address is set for each of the plurality of slots for mounting the tape feeders 16. The carriages 17 are mounted at the feeder arrangement positions (positive and negative directions of the Y-axis in FIG. 2) provided at the front and rear of the component mounting device M1. In the component mounting device M1, the mounting positions of the tape feeders 16 can be identified by the feeder arrangement positions provided at the front and rear and the feeder address.

[0021] Carrier tape 18, which stores components D to be supplied to component mounting device M1, is wound and stored on reel 19 and held on dolly 17. Carrier tape 18 inserted into tape feeder 16 is pitch-fed at regular intervals by tape feed mechanism 16a built into tape feeder 16. As a result, components D stored on carrier tape 18 are sequentially supplied toward component supply port 16b provided at the top of tape feeder 16.

[0022] In the component mounting operation, mounting head 14 is moved above tape feeder 16 by head moving mechanism 13, and picks up component D supplied to component supply port 16b of tape feeder 16 by vacuum suction with suction nozzle 15 (arrow a in FIG. 2). Mounting head 14 holding component D is moved above circuit board B held by board transport mechanism 12 by head moving mechanism 13, and mounts component D at a predetermined component mounting position Ba on circuit board B (arrow b in FIG. 2).

[0023] In FIG. 2, the plate 13a is provided with a board recognition camera 20 with an optical axis directed in the negative direction of the Z axis. The board recognition camera 20 moves in the positive and negative directions of the X axis and the Y axis together with the mounting head 14 by the head moving mechanism 13. The board recognition camera 20 moves above the tape feeder 16 to capture an image of the component D supplied to the component supply port 16b. The recognition processing unit 36 ​​(see FIG. 3) performs image recognition of the captured image and calculates a supply position deviation amount from a (predetermined) regular supply position where the component D supplied to the component supply port 16b is expected to be supplied. Based on the calculated supply position deviation amount, the suction position (stop position of the mounting head 14) when the suction nozzle 15 picks up the component D is corrected. The recognition processing unit 36 ​​also detects a supply error in which the component D is not supplied to the component supply port 16b and the component D cannot be recognized.

[0024] 2, the mounting head 14 is equipped with a flow sensor 14a that measures the flow rate of air flowing in from the suction nozzle 15. When the suction nozzle 15 normally picks up the component D, less air flows in from the suction nozzle 15, and the vacuum pressure of the suction nozzle 15 decreases. On the other hand, if a suction error occurs, such as the suction nozzle 15 being unable to hold the component D or picking up the component in an abnormal position, air flows in from the suction nozzle 15. As a result, the vacuum pressure of the suction nozzle 15 does not decrease.

[0025] The presence or absence of a suction error (suction error) is detected based on the result of measuring the air flow rate by the flow rate sensor 14a. Note that a vacuum gauge (pressure gauge) may be provided instead of the flow rate sensor 14a, and the presence or absence of a suction error (suction error) may be determined based on the result of measuring the vacuum pressure by the vacuum gauge. Also, by measuring the flow rate of air flowing in from the suction nozzle 15 after component mounting by the flow rate sensor 14a, a mounting error in which the mounting head 14 returns home without being able to mount the component D on the circuit board B is detected.

[0026] 2, a component recognition camera 21 with its optical axis facing upward is attached to the upper surface of the base 11 between the board transport mechanism 12 and the tape feeder 16. The component recognition camera 21 captures an image of the underside of the component D held by the suction nozzle 15 (or the suction nozzle 15 that failed to hold the component D) when the suction nozzle 15 that picked up the component D passes above. The recognition processing unit 36 ​​performs image recognition on the captured image, and judges whether the posture of the component D held by the suction nozzle 15 is normal or abnormal, or whether a recognition error has occurred that prevents the component D that should be held by the suction nozzle 15 from being recognized. The component recognition camera 21 may capture an image of the side surface of the component D in addition to the underside.

[0027] Furthermore, the recognition processing unit 36 ​​performs image recognition on the captured image, and calculates the amount of deviation of the suction position of the component D held by the suction nozzle 15 attached to the component mounting device M1 (working device) from a normal holding position, which is an expected (predetermined) normal suction position. When the component D is mounted at the component mounting position Ba on the circuit board B, a mounting position correction and a mounting attitude correction are executed based on the amount of deviation of the suction position.

[0028] 2, a touch panel 22 operated by an operator is provided in front of the component mounting device M1 at a position where the operator works. Various information is displayed on the display unit of the touch panel 22. The operator also inputs data or operates the component mounting device M1, etc., using operation buttons, which are an input unit displayed on the display unit.

[0029] The mounting head 14, suction nozzle 15, and tape feeder 16 are appropriately selected according to the type of component D to be mounted on the circuit board B, and attached to the component mounting apparatus M1. In this way, the mounting head 14 that mounts the component D on the circuit board B, the suction nozzle 15 that is attached to the mounting head 14 and picks up the component D, and the tape feeder 16 (component supplying device) that supplies the component D to the mounting head 14 are work units that are attached to the component mounting apparatus M1 (working device) and perform work to manufacture an electronic circuit board.

[0030] Next, the configuration of the operation device analysis system 1 will be described with reference to Fig. 3. Fig. 3 is a block diagram showing the configuration of the operation device analysis system 1. The component mounting devices M1 to M3 (operation devices) provided on the component mounting lines L1 and L2 have the same configuration. Below, the component mounting device M1 on the component mounting line L1 will be described.

[0031] 3, component mounting apparatus M1 includes a mounting control unit 30, a board transport mechanism 12, a head moving mechanism 13, a mounting head 14, a tape feeder 16, a board recognition camera 20, a component recognition camera 21, and a touch panel 22. The mounting control unit 30 includes a mounting memory unit 31, a recognition processing unit 36, a mounting operation processing unit 37, a suitability determination unit 38, and an on-premise communication unit 39. The on-premise communication unit 39 transmits and receives data to and from other component mounting apparatuses M2 and M3 and the manufacturing management apparatus 3 via the on-premise communication network 2. The mounting memory unit 31 is a storage device, and stores mounting data 32, operation parameters 33, positional deviation information 34, malfunction list information 35, and the like.

[0032] The mounting data 32 is created for each type of electronic circuit board to be manufactured, and includes data such as the type, size, and mounting position Ba (XY coordinates) of the component D to be mounted on the circuit board B. The mounting data 32 stored in the mounting memory unit 31 of the component mounting device M1 includes at least data necessary for the component mounting work by that work device. The recognition processing unit 36 ​​performs image recognition on the image captured by the board recognition camera 20 of the component supply port 16b of the tape feeder 16, calculates a correction value for the suction position of the suction nozzle 15, and stores the correction value in the mounting memory unit 31 as the operation parameter 33.

[0033] 3, the recognition processing unit 36 ​​performs image recognition on the image captured by the component recognition camera 21 of the component D held by the suction nozzle 15, calculates the amount of deviation of the suction position from the correct holding position, and stores the calculated amount of deviation in the mounting storage unit 31 as position deviation information 34. The recognition processing unit 36 ​​also calculates the component mounting position Ba and the mounting posture correction value when mounting the component D on the circuit board B based on the amount of deviation of the suction position, and stores the calculated amount of deviation in the mounting position in the mounting storage unit 31 as operation parameters 33.

[0034] The recognition processing unit 36 ​​also performs image recognition on the imaging results to detect supply errors or recognition errors, etc. The recognition processing unit 36 ​​creates a manufacturing log in which the detected supply error is associated with information identifying the tape feeder 16 in which the supply error was detected, the type of component D that was being supplied, and the carrier tape 18, and transmits the manufacturing log to the manufacturing management device 3 as work history information. The recognition processing unit 36 ​​also creates a manufacturing log in which the detected recognition error is associated with information identifying the component D that was not held, the suction nozzle 15 that was not held, and the mounting head 14, and transmits the manufacturing log to the manufacturing management device 3 as work history information.

[0035] 3, mounting operation processing unit 37 controls board transport mechanism 12, head moving mechanism 13, mounting head 14, and tape feeder 16 to execute a component mounting operation based on mounting data 32, operation parameters 33, and positional deviation information 34 stored in mounting memory unit 31. In addition, every time mounting operation processing unit 37 mounts component D on circuit board B, it transmits a manufacturing log to manufacturing management device 3 as work history information, which associates component D with a correction value (operation parameter 33) used in the component mounting operation, the flow rate value of flow sensor 14a when component D was adsorbed, the pressure value of the vacuum gauge when component D was adsorbed, and the current value when tape feeder 16 was operated.

[0036] Furthermore, when the mounting operation processing unit 37 detects an operation error during the component mounting operation, it transmits a manufacturing log in which the content of the operation error and the time of occurrence are associated with each other to the manufacturing management device 3 as operation history information. Examples of the operation error include a suction error in which the suction nozzle 15 cannot pick up the component D, a recognition error in which the component recognition camera 21 cannot recognize the component D picked up and held by the suction nozzle 15, a mounting error in which the mounting head 14 cannot mount the component D on the circuit board B and returns it, and a supply error in which the board recognition camera 20 cannot recognize the component D supplied by the tape feeder 16 (component supply device). Note that, when the component mounting lines L1 and L2 are provided with a mounting inspection device that inspects the component D mounted on the circuit board B in addition to the component mounting devices M1 to M3, the mounting operation processing unit 37 may detect the mounting error based on the presence or absence of the component D inspected by the mounting inspection device or the amount of positional deviation.

[0037] Furthermore, when an operation event occurs, such as a work stop event that temporarily suspends the component mounting operation due to a work error or a work resume event that resumes the component mounting operation after an operator performs error recovery work, the mounting operation processing unit 37 transmits an operation event log that associates the content of the operation event with the occurrence time, etc., as work history information to the manufacturing management device 3. The operation event log for the work stop event contains information that identifies the relevant work units, such as the tape feeder 16, the mounting head 14, and the suction nozzle 15, as details of the work error that caused the work to be stopped.

[0038] 3, the manufacturing management device 3 includes a manufacturing processing unit 40. The manufacturing processing unit 40 includes a manufacturing storage unit 41, an acquisition unit 47, a file generation unit 48, a transmission processing unit 49, an on-premise communication unit 50, and an off-premise communication unit 51.

[0039] The on-premise communication unit 50 transmits and receives data to and from the component mounting devices M1 to M3 on the component mounting lines L1 and L2 via the on-premise communication network 2. The off-premise communication unit 51 transmits and receives data to and from the maintenance management device 5 installed in the support center S via the off-premise communication network 8. The manufacturing storage unit 41 is a storage device, and stores mounting data 42, work history information 43, a first file 44, a second file 45, malfunction list information 46, and the like.

[0040] 3, the mounting data 42 stored in the manufacturing storage unit 41 is the same as the mounting data 32 stored in the mounting storage unit 31 of the component mounting device M1 described above. However, the mounting data 42 includes data necessary for the component mounting operations of all of the component mounting devices M1 to M3 provided in the component mounting lines L1 and L2.

[0041] The acquiring unit 47 successively acquires the work history information transmitted from each of the component mounting devices M1 to M3 (working devices) included in the component mounting lines L1, L2, and stores the information in the manufacturing storage unit 41 as the work history information 43.

[0042] The acquisition unit 47 collects work history information from a line management device from other than the component mounting devices M1 to M3 at predetermined times such as when the type of electronic circuit board to be manufactured is changed or when the worker shift is changed. Examples of devices that collect work history information from other than the component mounting devices M1 to M3 include a line management device having a function of collecting work history information for each component mounting line L1, L2, a production scheduler that stores a production plan or worker shifts, or a production simulator that estimates an optimal production plan. In other words, the acquisition unit 47 acquires work history information 43 while the mounting devices are operating or at predetermined times.

[0043] The acquisition unit 47 also collects maintenance history information that is the result of maintenance of the operation unit. The maintenance history information may be input by an operator, or the results of maintenance work performed by an automatic maintenance work unit (not shown) that automatically performs maintenance work may be collected as the maintenance history information. The results of maintenance performed at a support center S located away from the factory F may also be acquired as the maintenance history information. Examples of the automatic maintenance work unit include a nozzle cleaning unit that cleans the nozzles provided in the mounting head 14, a feeder maintenance unit that adjusts the feed mechanism of the tape feeder 16, and a head maintenance unit that inspects or adjusts the sliding properties of the mounting head 14. The maintenance history information may include identification information of the operation unit, the date and time of maintenance, the location of maintenance, the number of times maintenance has been performed, and clearing of the operation history information, in addition to the results of the work.

[0044] 3, file generation unit 48 creates a first file 44 including operation event logs and maintenance history information of component mounting devices M1-M3 (working devices) from mounting data 42 and work history information 43 stored in manufacturing storage unit 41. File generation unit 48 also creates a second file 45 including a manufacturing log of the electronic circuit board from mounting data 42 and work history information 43 stored in manufacturing storage unit 41.

[0045] The manufacturing log of the electronic circuit board included in the work history information 43 collected from the component mounting devices M1-M3 includes the number of times the components D have been mounted by the component mounting devices M1-M3 that mount the components D on the electronic circuit board, and the number of recognition errors, suction errors, mounting errors, and supply errors that caused mistakes in mounting the components D. The manufacturing log of the electronic circuit board also includes positional deviation information 34 from the correct holding position of the components D held by the suction nozzles 15 attached to the component mounting devices M1-M3. The manufacturing log of the electronic circuit board also includes the size of the components D mounted on the electronic circuit board.

[0046] 3, the file generating unit 48 generates a second file 45 including a manufacturing log of the electronic circuit board. For example, the file generating unit 48 generates the second file 45 including information tallying up the number of times that the component D was mounted and the number of times that the component D was mismounted for each combination of work units such as the tape feeder 16, the mounting head 14, and the suction nozzle 15. Note that the second file 45 may include an error rate calculated based on the number of mismounts and the number of suctions, in addition to the total value of each type of number of times for each predetermined period (e.g., each day).

[0047] In addition, the file generating unit 48 performs statistical processing on the correction amount of the suction position of the suction nozzle 15 when the component D is taken out from the tape feeder 16 and the correction amount of the mounting position of the suction nozzle 15 when the component D is mounted on the circuit board B, and generates a second file 45 including information calculated by calculating a moving average or a standard deviation. That is, the file generating unit 48 performs statistical processing on the manufacturing log of the electronic circuit board to generate the second file 45. The manufacturing log of the electronic circuit board is created for each component mounting position Ba of the circuit board B of the electronic circuit board manufactured by mounting hundreds to thousands of components. For this reason, the data amount of the manufacturing log of the electronic circuit board is enormous. On the other hand, the data amount of the information created by statistically processing the manufacturing log of the electronic circuit board is significantly smaller than the original data amount.

[0048] 3, file generation unit 48 creates second file 45 including information obtained by collecting sizes such as length, width, and thickness of components D to be mounted on an electronic circuit board from mounting data 42. As with the information generated by statistically processing the manufacturing log of an electronic circuit board, the amount of data on the sizes of components D collected from mounting data 42 is significantly less than the amount of original data. In addition, by creating the second file by extracting only information on the sizes of components D required for the health estimation process of a work unit from mounting data 42 including customer information, it is possible to prevent leakage of customer information.

[0049] In FIG. 3, the transmission processing unit 49 transmits the first file 44 and the second file 45 generated by the file generation unit 48 to the maintenance management device 5 via the off-premise communication unit 51. That is, the transmission processing unit 49 and the off-premise communication unit 51 are a transmission unit that transmits the first file 44 and the second file 45 to the maintenance management device 5. The file generation unit 48 generates the first file 44 and the second file 45 at a preset time, such as a predetermined time once a week. The transmission processing unit 49 transmits the generated first file 44 and the second file 45 to the maintenance management device 5. That is, the first file 44 and the second file 45 are transmitted to the maintenance management device 5 at a preset time (for example, 8:00 every Wednesday).

[0050] 3, the maintenance management device 5 includes a maintenance processing unit 60, an outside communication unit 61, an inside communication unit 62, and a display unit 63. The maintenance processing unit 60 includes a maintenance memory unit 64, a maintenance necessity determination unit 67, a condition estimation unit 68, a report creation unit 69, and a malfunction list creation unit 70. The maintenance memory unit 64 is a storage device, and stores a first file 65, a second file 66, and the like.

[0051] The off-premise communication unit 61 transmits and receives data to and from the manufacturing management device 3 installed in the factory F via the off-premise communication network 8. The on-premise communication unit 62 transmits and receives data to and from the mail server 6 via the on-premise communication network 7. The display unit 63 is a display device such as a liquid crystal panel, and displays various data and information.

[0052] The first file 44 and the second file 45 transmitted from the manufacturing management device 3 of the factory F are received by the maintenance storage unit 64 via the off-premise communication unit 61. The received first file 44 and second file 45 are associated with information identifying the transmitting factory F or the manufacturing management device 3, and are stored as the first file 65 and the second file 66 in the maintenance storage unit 64. The maintenance storage unit 64 accumulates not only the latest information transmitted from the manufacturing management device 3, but also information for a predetermined period including previously transmitted information. In addition, the first file 44 and the second file 45 are periodically transmitted to the maintenance management device 5 installed in the support center S not only from one factory F, but also from multiple factories F.

[0053] 3, the maintenance necessity determining unit 67 determines whether or not maintenance is required for the operational units (such as the tape feeder 16, the mounting head 14, and the suction nozzle 15) from the first file 65 stored in the maintenance memory unit 64. Specifically, the maintenance necessity determining unit 67 determines that maintenance is required for an operational unit whose cumulative number of occurrences related to a work stoppage event or whose total number of occurrences in a predetermined period exceeds a predetermined judgment criterion number.

[0054] In FIG. 3, the condition estimation unit 68 executes a condition estimation process to estimate the condition of the task unit from the second file 66 stored in the maintenance storage unit 64. Specifically, the condition estimation unit 68 estimates that the task unit is malfunctioning or is becoming malfunctioning from various information contained in the second file 66, and determines whether or not an inspection is necessary to determine whether or not maintenance of the task unit is necessary. For example, the condition estimation unit 68 determines that an inspection of the task unit is necessary when the error rate for each predetermined period is on the rise, when the error rate is not increasing but the correction amount is on the rise, or when the variation (standard deviation) of the correction amount becomes larger than the judgment criterion. The predetermined period is, for example, the number of days that have passed since the date and time of the previous maintenance or the time of shipment (time of delivery). This number of days is set by each task unit on a daily, weekly, monthly, or yearly basis.

[0055] The condition estimation unit 68 may also estimate a malfunction of the work unit using a malfunction diagnosis model created in advance by machine learning based on the parameters and error occurrence status (number or frequency, etc.) included in the second file 66. The condition estimation unit 68 also associates information on the size of the part D (such as a recommended size range) with information on the inspection of the determined work unit based on the size of the part D included in the second file 66, for example, when a malfunction tendency becomes apparent when the part D is large or small.

[0056] 3, a report creation unit 69 creates a report to be sent to an administrator of factory F based on information on an operation unit requiring maintenance determined by the maintenance necessity determination unit 67 or information on an operation unit requiring inspection due to a malfunction estimated by the health estimation unit 68. The report includes information identifying the operation unit requiring maintenance or inspection, the reason for requiring maintenance or inspection, and, in the case of inspection, a recommended inspection method such as cleaning. The report created by the report creation unit 69 is sent to the mail server 6 via the on-site communication unit 62. The mail server 6 sends the report as an e-mail to a specified destination at a preset time. The e-mail sent from the mail server 6 is received by a mail receiving device 4 installed in the factory F.

[0057] 3, the malfunction list creation unit 70 creates a list of malfunctioning task units (malfunction list) based on information on task units requiring maintenance determined by the maintenance necessity determination unit 67 or information on task units requiring inspection due to a malfunction estimated by the health estimation unit 68. The malfunction list includes information identifying the task units requiring inspection or maintenance, reasons for the estimation of the malfunction, and usage restrictions such as the recommended size range of part D. The malfunction list created by the malfunction list creation unit 70 is transmitted to the manufacturing management device 3 of factory F via the off-premises communication unit 61.

[0058] In addition, when the component mounting devices M1 to M3 are provided with operational units that require inspection or maintenance, the malfunction list information also includes the location where the operational units are provided, which is identified from the manufacturing log information from the component mounting devices M1 to M3. In addition, among the malfunction lists, there may be a malfunction list created based on the maintenance necessity determination unit 67 and a malfunction list created based on the health estimation unit 68. In this case, the malfunction list created based on the health estimation unit 68 can be used to create a maintenance plan because the operational units will soon require inspection or maintenance. In addition, the malfunction list created based on the maintenance necessity determination unit 67 can be used to create a production plan to prevent the operational units from being used in production because they require inspection or maintenance.

[0059] The manufacturing management device 3 stores the received malfunction list in the manufacturing memory unit 41 as malfunction list information 46, and transmits it to the component mounting devices M1 to M3 (working devices) on the component mounting lines L1 and L2. The malfunction list received by the component mounting devices M1 to M3 is stored in the mounting memory unit 31 as malfunction list information 35.

[0060] In FIG. 3, the suitability judgment unit 38 of the component mounting devices M1 to M3 judges whether or not the operation unit attached to the component mounting devices M1 to M3 is included in the malfunction list information 35 when changing the setup to change the type of electronic circuit board to be manufactured, starting production, or ending production. If the attached operation unit is included in the malfunction list information 35, the suitability judgment unit 38 displays a warning on the touch panel 22. The warning may include, for example, the reason why the operation unit is estimated to be malfunctioning, the recommended inspection content, or a recommendation to replace it with another operation unit. In addition, after the warning is issued, the worker may decide whether to use the unit, or an automatic interlock may be set to prevent use. By using multiple analyses of the necessity of maintenance and the malfunction estimation in combination, production stoppage due to malfunction of the operation unit can be further suppressed.

[0061] As described above, the manufacturing management device 3 is a data collection device that includes an acquisition unit 47 that acquires work history information 43 from work devices (component mounting devices M1-M3) equipped with work units (tape feeder 16, mounting head 14, suction nozzle 15) that perform work for manufacturing electronic circuit boards, a file generation unit 48 that generates, from the acquired work history information 43, a first file 44 including an operation event log and maintenance history information of the work devices and a second file 45 including a manufacturing log of the electronic circuit board, and a transmission unit (transmission processing unit 49, off-site communication unit 51) that transmits the first file 44 and the second file 45.

[0062] Moreover, the maintenance management device 5 equipped with the maintenance necessity determining unit 67 is a maintenance necessity determining device that determines whether or not maintenance is required for the work unit from the first file 65. Moreover, the maintenance management device 5 equipped with the condition estimating unit 68 is a condition estimating device that estimates the condition of the work unit from the second file 66. Then, the transmitting unit of the data collection device (manufacturing management device 3) transmits the first file 44 to the maintenance necessity determining device, and transmits the second file 45 to the condition estimating device.

[0063] In this way, the manufacturing management device 3 extracts and processes information required for analysis processing, creates first file 44 and second file 45 with small amounts of data, and then transmits them to the maintenance management device 5 (maintenance necessity determining device and condition estimating device), thereby reducing the burden required for sending and receiving data. As a result, the maintenance necessity determining device and condition estimating device that analyze the conditions of the operating devices and work units can properly analyze the conditions of the operating devices even if they are installed in a facility different from the factory F where the operating devices are installed.

[0064] Next, a method for analyzing the state of a task unit attached to a task device (component mounting devices M1 to M3) will be described with reference to the flow of Fig. 4. Fig. 4 is a flow diagram of the task device analysis method according to an embodiment of the present disclosure.

[0065] First, acquisition unit 47 acquires work history information 43 and mounting data 32 from the work apparatus (component mounting apparatuses M1 to M3) to which the work unit (tape feeder 16, mounting head 14, and suction nozzle 15) is attached (ST1).

[0066] The work history information 43 is acquired while the maintenance device is operating or at predetermined time intervals. Next, the file generation unit 48 generates a first file 44 including an operation event log and maintenance history information of the maintenance device from the acquired work history information 43 (ST2).

[0067] Next, the file generation unit 48 performs statistical processing on the manufacturing log of the electronic circuit board contained in the acquired work history information 43 (ST3).

[0068] Next, the file generation unit 48 generates a second file 45 including a manufacturing log of the electronic circuit board from the acquired work history information 43, mounting data 32, and the statistical processing results (ST4). The first file 44 and the second file 45 are transmitted to the maintenance management device 5 and stored in the maintenance storage unit 64 as a first file 65 and a second file 66.

[0069] Next, the maintenance necessity determining unit 67 determines whether or not the task unit requires maintenance from the first file 65 (ST5).

[0070] Next, the condition estimation unit 68 estimates the condition of the working unit from the second file 66 (ST6). This makes it possible to appropriately analyze the condition of the working device.

[0071] 4, next, the report creation unit 69 creates a report including information identifying the task units requiring maintenance or inspection and a recommended inspection method based on the information on the task units requiring maintenance and the information on the task units requiring inspection due to the estimated malfunction (ST7). The created report is sent as an email to the mail receiving device 4 in the factory F.

[0072] Next, the malfunction list creation unit 70 creates a malfunction list including information for identifying the work units that require inspection or maintenance based on the information on the work units that require the determined maintenance and the information on the work units that require inspection due to the estimated malfunction (ST8). The malfunction list is transmitted to the manufacturing management device 3 in the factory F and is used for warnings when a work unit included in the malfunction list is attached to a work device (component mounting devices M1 to M3).

[0073] As described above, the operating device analysis system 1 of this embodiment includes an acquisition unit 47 that acquires operation history information 43 from operating devices (component mounting devices M1 to M3) equipped with operating units (tape feeder 16, mounting head 14, suction nozzle 15) that perform operations for manufacturing electronic circuit boards, a file generation unit 48 that generates a first file 44 including an operation event log and maintenance history information of the operating devices from the acquired operation history information 43 and a second file 45 including a manufacturing log of the electronic circuit board, a maintenance necessity determination unit 67 that determines whether or not maintenance is necessary for the operating units from the first file 65 (first file 44), and a condition estimation unit 68 that estimates the condition of the operating units from the second file 66 (second file 45). This allows the condition of the operating devices to be appropriately analyzed.

[0074] Machine learning related to this embodiment includes, for example, supervised learning that learns the relationship between input and output using teacher data in which labels (output information) are assigned to input information, unsupervised learning that builds a data structure only from unlabeled input, semi-supervised learning that handles both labeled and unlabeled data, and reinforcement learning that learns the action that can obtain the most feedback by obtaining feedback for the action selected from the observation result of the state, etc. Specific machine learning techniques include neural networks (including deep learning using multi-layered neural networks), genetic programming, decision trees, Bayesian networks, support vector machines (SVM), etc.

[0075] In the above explanation, an embodiment has been described in which work history information is sent from a maintenance device equipped with a work unit that performs work to manufacture electronic circuit boards to maintenance necessity determining unit 67 to determine whether maintenance of the work unit is required, and the work history information is sent to health estimation unit 68 to estimate the health of the work unit. However, the present invention can be applied to other embodiments as long as the work history information is used to send to multiple devices from a maintenance device equipped with a work unit that performs work to manufacture electronic circuit boards. For example, there may be an operation analysis device that determines the operation analysis and an operation estimation device that estimates the operating status.

[0076] In addition, in the flow of the operation device analysis method according to one embodiment of the present disclosure in FIG. 4 above, the order of some of the flows may be changed. For example, in the creation of the first file (ST2), the statistical processing of the manufacturing log (ST3), and the creation of the second file (ST4), ST2 may be executed after ST4. Also, the order of determining whether or not maintenance is required for the operation unit from the first file (ST5) and estimating the condition of the operation unit from the second file (ST6) may be executed in reverse.

[0077] In the above description, the defined terms are not limited to the terms themselves. For example, the condition of the operational unit may include a sign of failure or a degree of risk, a degree of operational errors, and a degree of deterioration.

[0078] Furthermore, maintenance necessity determining unit 67 may determine whether or not maintenance is necessary for the operational units (tape feeder 16, mounting head 14, suction nozzle 15, etc.) based on first file 65 stored in maintenance memory unit 64 and operation specification value data measured when each operational unit is shipped or installed. Examples of operation specification value data measured when shipped or installed include the flow rate value of flow sensor 14a when a component is picked up, the pressure value of the vacuum gauge when a component is picked up, and the current value when tape feeder 16 is operated. [Industrial Applicability]

[0079] The operating tool analysis system, operating tool analysis method, and data collection device disclosed herein have the effect of being able to appropriately analyze the state of an operating tool, and are useful in the field of mounting electronic components on a circuit board. [Explanation of symbols]

[0080] 1. Work Equipment Analysis System 3 Manufacturing management equipment (data collection equipment) 5 Maintenance management device (maintenance necessity determining device, condition estimation device) 14 Mounting head (work unit) 15 Suction nozzle (work unit) 16 Tape feeder (working unit) D parts M1~M3 Component mounting equipment (work equipment)

Claims

1. an acquisition unit that acquires work history information from a working device equipped with a working unit that performs work for manufacturing an electronic circuit board; a file generating unit that generates a first file including an operation event log of the operating device and a second file including a manufacturing log of the electronic circuit board from the acquired operation history information; a maintenance necessity determining unit that determines whether or not the task unit needs maintenance from the first file; a mood estimation unit that estimates a mood of the task unit from the second file; Equipped with Work equipment analysis system.

2. the manufacturing log of the electronic circuit board includes a number of times that the work device that mounts components on the electronic circuit board makes mistakes in mounting the components, The work equipment analysis system according to claim 1 .

3. the manufacturing log of the electronic circuit board includes information on a positional deviation of the component held by the suction nozzle attached to the working device from a regular holding position, The work equipment analysis system according to claim 2 .

4. The acquisition unit further acquires mounting data to be used in the work performed by the work device, the file generation unit generates the second file, which further includes a size of the component mounted on the electronic circuit board, from the acquired mounting data. The working device analysis system according to claim 2 or 3.

5. the file generation unit performs statistical processing on the manufacturing log of the electronic circuit board to generate the second file. The working device analysis system according to any one of claims 1 to 4.

6. The acquisition unit acquires the work history information while the work device is operating or at predetermined time intervals. The working device analysis system according to any one of claims 1 to 5.

7. Acquire work history information from a work device equipped with a work unit that performs work for manufacturing an electronic circuit board; generating a first file including an operation event log of the operating device and a second file including a manufacturing log of the electronic circuit board from the acquired operation history information; determining whether or not the operation unit needs maintenance from the first file; inferring a cadence of the work unit from the second file; Work equipment analysis method.

8. the manufacturing log of the electronic circuit board includes a number of times that the work device that mounts components on the electronic circuit board makes mistakes in mounting the components, The working device analysis method according to claim 7.

9. the manufacturing log of the electronic circuit board includes information on a positional deviation of the component held by the suction nozzle attached to the working device from a regular holding position, The working device analysis method according to claim 8.

10. Further acquiring mounting data to be used for the operation by the operation device; generating the second file, which further includes a size of the component mounted on the electronic circuit board, from the acquired mounting data; The working device analysis method according to claim 8 or 9.

11. generating the second file by performing statistical processing on the manufacturing log of the electronic circuit board; The working device analysis method according to any one of claims 7 to 10.

12. The work history information is acquired while the work device is operating or at predetermined time intervals. The working device analysis method according to any one of claims 7 to 11.

13. an acquisition unit that acquires work history information from a working device equipped with a working unit that performs work for manufacturing an electronic circuit board; a file generating unit that generates a first file including an operation event log of the operating device and a second file including a manufacturing log of the electronic circuit board from the acquired operation history information; a transmission unit that transmits the first file and the second file, The transmission unit is transmitting the first file to a maintenance necessity determining device that determines whether or not maintenance is necessary for the operation unit; transmitting the second file to a health estimation device that estimates a health of the task unit; Data collection equipment.

14. the manufacturing log of the electronic circuit board includes a number of times that the work device that mounts components on the electronic circuit board makes mistakes in mounting the components, 14. The data collection device of claim 13.

15. the manufacturing log of the electronic circuit board includes information on a positional deviation of the component held by the suction nozzle attached to the working device from a regular holding position, 15. The data collection device of claim 14.

16. The acquisition unit further acquires mounting data to be used in the work performed by the work device, the file generation unit generates the second file including a size of the component mounted on the electronic circuit board from the acquired mounting data.

16. A data collection device according to claim 14 or 15.

17. the file generation unit performs statistical processing on the manufacturing log of the electronic circuit board to generate the second file.

17. A data collection device according to any one of claims 13 to 16.

18. The acquisition unit acquires the work history information while the work device is operating or at predetermined time intervals.

18. A data collection device according to any one of claims 13 to 17.

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