Optical Mounting System

Abstract

Disclosed are devices and methods for an optical component mounting system for supporting an optical component, such as a laser. The mounting system includes a first component including a first surface, a second component including a second surface opposite the first surface, and an adhesive between the first surface of the first component and the second surface of the second component. The first component includes at least three mounting pads extending from the first surface that contact the second surface of the second component and provide direct support between the first and second components. The component including the mounting pads may be a lower mount, an upper mount such as an upper clamp mount, a bond pad, or another component in a component stack. A method of assembling a component stack may include curing the adhesive at a temperature at or above the upper limit of the expected temperature operating range of the optical component mounting system.

Description

[Technical field]

[0001] SUMMARY The present disclosure is directed to optical component mounting systems, such as laser mounting systems for lasers used in ophthalmic procedures. [Background technology]

[0002] Lasers are used in many different medical procedures, including many different ophthalmic procedures. For example, therapeutic lasers are used in photocoagulation of retinal tissue to treat events such as retinal tears and the effects of diabetic retinopathy. In one example of such a procedure, the distal end of a laser probe is introduced into the eye through a trocar cannula. The laser system is activated to project an aiming laser beam, which may be a first color, such as red, to indicate where the laser probe is aimed. Once the surgeon (e.g., an ophthalmic surgeon) has aimed the aiming laser beam at a spot of interest, the surgeon can then activate the laser system to project a therapeutic laser beam, which may be a second color, such as green, at the spot of interest or an area surrounding the spot of interest to perform the treatment (e.g., photocoagulation).

[0003] In some laser configurations, light from multiple lasers can be coupled into one optical fiber. For example, in the ophthalmic procedure configuration described above, light from an aiming laser and light from a treatment laser can be coupled together into one optical fiber of the laser probe. In this way, the beam from the treatment laser is aligned to be aimed at the same location as the aiming spot.

[0004] In these and other related laser configurations, it is important that the laser be precisely aligned, for example to couple the laser's beam into the fiber core. Additionally, once the laser is aligned, it is important that the laser beam remain stable and do not drift in direction or other motion. It is also important that other optical components such as beam splitters, lenses, and mirrors remain mechanically stable. Lasers and other optical components can become misaligned due to external factors such as temperature, humidity, and / or vibration. There is a need for an improved optical component mounting system that allows for alignment of the laser or another optical component while maintaining the stability of the laser or other optical component once it is aligned and prevents and / or minimizes drift in the direction of the laser or other optical component. Summary of the Invention [Means for solving the problem]

[0005] The present disclosure is directed to improved designs of optical mounting systems, such as laser mounting systems for lasers used in ophthalmic procedures. The present disclosure is also directed to methods relating to the improved optical mounting systems.

[0006] In some embodiments, an optical component mounting system includes a component stack for supporting an optical component, the component stack including a first component including a first surface, a second component including a second surface opposite the first surface, and an adhesive between the first surface of the first component and the second surface of the second component to adhere the first and second components to one another, the first component including at least three mounting pads extending from the first surface, the mounting pads of the first component contact the second surface of the second component and provide direct support between the first and second components.

[0007] The first component, which includes at least three mounting pads, may be above or below the second component in the component stack. In one example, the first component is the bottom mounting base and the second component is the bottom bonding pad. parts In another example, the first component is a lower binding. parts and the second component is a lower mount. In another example, the first component is an upper clamp mount and the second component is an upper bond parts In another example, the first component is an upper binding. parts and the second component is a top clamping mount. The optical component may include a semiconductor laser or another optical component such as a beam splitter, a lens, or a mirror, such as a folding mirror.

[0008] In some embodiments, a method of assembling an optical mounting system includes the steps of (i) stacking a first component and a second component together, the first component including a first surface and the second component including a second surface opposite the first surface, the first component including at least three mounting pads extending from the first surface, such that when the first and second components are stacked together, the mounting pads of the first component contact the second surface of the second component, and stacking the first and second components together includes disposing an adhesive between the first surface of the first component and the second surface of the second component, and (ii) curing the adhesive at a temperature at or above an upper limit of an expected temperature operating range of the optical mounting system. For example, curing the adhesive may include curing the adhesive at or above 35 degrees Celsius. Stacking the first and second components together may include stacking the first component on the second component or stacking the second component on the first component. The optical component may include a semiconductor laser or another optical component such as a beam splitter, a lens or a mirror, such as a folding mirror.

[0009] These and other embodiments and their advantages will be recognized and understood by those skilled in the art in light of the description and accompanying drawings herein.

[0010] The accompanying drawings illustrate implementations of the apparatus and methods disclosed herein and, together with the description, serve to explain the principles of the disclosure. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 shows a perspective view of one example of an optical component mounting system according to the present invention in the form of a laser mounting system. [Diagram 2] FIG. 2 illustrates a side view of the laser mounting system of FIG. [Diagram 3] FIG. 3 illustrates an end view of the laser mounting system of FIG. [Figure 4] FIG. 4 illustrates a perspective view of the lower mount of the laser mounting system of FIG. [Diagram 5] FIG. 5 shows an example of a top clamp mount of a laser mounting system according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] The following detailed description may be read in conjunction with the accompanying drawings, in which:

[0013] For the purpose of promoting an understanding of the principles of the present disclosure, reference will be made below to implementations shown in the drawings, and specific language will be used to describe these implementations. However, it should be understood that no limitation to the scope of the present disclosure is intended. Any changes and further modifications to the described systems, devices, apparatus, and methods, and any further applications of the principles of the present disclosure, are fully contemplated as would normally occur to one skilled in the art to which the present disclosure pertains. In particular, features, components, and / or steps described with respect to one implementation may be combined with features, components, and / or steps described with respect to other implementations of the disclosure. For simplicity, in some cases, the same reference numbers will be used throughout the drawings to refer to the same or similar parts.

[0014] FIGURE 1 illustrates a perspective view of one example of an optical component mounting system 100 in accordance with the present invention. In this example, the optical component mounting system 100 is a laser mounting system used to align and support a semiconductor laser 30 and maintain its stability once the semiconductor laser 30 is aligned. Although FIGURE 1 illustrates a semiconductor laser 30, an optical component mounting system such as that shown in FIGURE 1 and illustrated and described herein may also be used to support and maintain the stability of other optical components, such as other lasers, beam splitters, lenses, or mirrors, such as folding mirrors.

[0015] An optics mounting system such as laser mounting system 100 may be part of a laser system for an ophthalmic procedure, which may be a stand-alone laser system or a laser module for an ophthalmic system used in an ophthalmic procedure. For example, an optics mounting system such as laser mounting system 100 may be incorporated into a laser system similar to Alcon's PUREPOINT® Vision System, headquartered in Fort Worth, Texas, which may be used as a stand-alone laser system or a laser module for a control console, such as the control console for Alcon's CONSTELLATION® Vision System.

[0016] An optical mounting system such as laser mounting system 100 may be mounted on an optical plate along with other optical components of the laser system. For example, optical fibers for guiding the laser light may also be mounted on the optical plate. Electrical wires 34 may be used to power and control the semiconductor laser 30.

[0017] 1-3, the exemplary optical mounting system 100 includes a component stack that functions both to mount the semiconductor laser 30 to an optical plate, to allow the position of the semiconductor laser 30 to be adjusted and then secured, and to hold the semiconductor laser 30 in a stable position. The exemplary laser mounting system 100 includes a submount 10 at its bottom end that serves as a base for the component stack of the laser mounting system 100. The submount 10 may be attached to the optical plate by one or more fasteners 54, 56.

[0018] The exemplary laser mounting system 100 includes an upper clamp mount 22 at its upper end that acts as a clamp for holding a semiconductor laser 30. In this example, the upper clamp mount 22 is configured to secure the semiconductor laser 30 between its jaws. One or more fasteners 52 can be loosened to allow the jaws of the upper clamp mount 22 to be separated to facilitate placement of the semiconductor laser 30 between the jaws, and one or more fasteners 52 can be tightened to secure the semiconductor laser 30 between the jaws of the upper clamp mount 22.

[0019] The laser mounting system 100 includes components between the upper clamping mount 22 and the lower mount 10. The components allow for adjusting the position of the semiconductor laser 30 and then fixing it in a stable position once the desired position (including angular orientation) of the semiconductor laser 30 is obtained. These components include a lower bonding part 14, which may be fixed to the lower mount 10 by adhesive 12, an upper bonding part 18, which may be fixed to the upper clamping mount 22 by adhesive 20, and a solder layer 16 between the lower bonding part 14 and the upper bonding part 18. The lower bonding part 14 is located above the lower mount 10 and the upper bonding part 18 is located below the upper clamping mount 22.

[0020] The solder layer 16 includes a solder material that flows when heated above its melting temperature, but is solid at lower temperatures, including room temperature, and is a fixing adhesive. Once the stack is assembled, the solder layer 16 is heated so that the position of the semiconductor laser 30 can be adjusted. For example, the laser mounting system 100 may include electrical terminals 42, 44 attached to the lower or upper bonding component 14, 18, and applying an electrical current to the electrical terminals 42, 44 heats the bonding component 14 or bonding component 18 to which the electrical terminals 42, 44 are attached. This in turn raises the temperature of the solder layer 16 to a level at which the solder material flows, allowing the upper portion of the stack (the semiconductor laser 30, the upper clamp mount 22, and the upper bonding component 18) to move relative to the lower portion of the stack (the lower bonding component 14 and the lower mount 10). At this point, a precision tool (e.g., a manipulator) may be used to adjust the position of the top portion of the stack (semiconductor laser 30, top clamping mount 22, and top coupling component 18) relative to the bottom portion of the stack (lower coupling component 14 and bottom mount 10). The precision tool may be attached to the top clamping mount 22 or another portion of the top of the stack and used to make small movements (e.g., both translational and angular movements) of the top of the stack until it is in the desired position, e.g., until the laser light emitted from the semiconductor laser 30 is properly directed into the optical fiber core. Once the top of the stack is in the desired position, the solder layer 16 is allowed to cool and harden, at which point the position of the top coupling component 18 relative to the bottom coupling component 14 is fixed, and therefore the position of the semiconductor laser 30.

[0021] Figure 4 shows a perspective view of the lower mount 10 of the laser mounting system 100. As can be seen in Figure 4, three mounting pads 62, 64, 66 extend from the top surface of the lower mount 10. The top surface is the surface that faces the lower bonding component 14 when the stack is assembled. When the stack is assembled, the facing surface of the lower bonding component 14 contacts these mounting pads 62, 64, 66 and adhesive 12 fills the remaining space between the lower bonding component 14 and the lower mount 10.

[0022] As can be seen in Fig. 4, the mounting pads 62, 64, 66 may be arranged in a triangle. In this way, the mounting pads 62, 64, 66 provide three contact points or areas for the facing surface of the lower connecting piece 14, which in this embodiment is flat. Like a tripod, these three contact points or areas allow for stable support of the lower connecting piece 14 (upper part) on the lower mounting base 10 (lower part). At the same time, a space is left between the facing surfaces of the lower mounting base 10 and the lower connecting piece 14 so that there is an area for the adhesive 12 to secure the two parts together.

[0023] In another configuration, the top surface of the lower mount 10 facing the lower coupling component 14 may be flat and the facing surface of the lower coupling component 14 may include three mounting pads. As in the illustrated embodiment, these three mounting pads provide three contact points or areas for the facing surface of the lower mount 10. Like a tripod, these three contact points or areas allow for stable support of the lower coupling component 14 (upper part) on the lower mount 10 (lower part). As in the illustrated embodiment, a space is left between the facing surface of the lower mount 10 and the facing surface of the lower coupling component 14 so that there is an area for adhesive 12 to secure the two components together.

[0024] Figure 5 shows an example of a top clamp mount 23 of a laser mounting system according to the present invention. The top clamp mount 23 is similar to the top clamp mount 22 described with respect to Figures 1-3 and can be used in place of the top clamp mount 22 as the top clamp mount of the laser mounting system 100 of Figures 1-3 (all other parts remain the same).

[0025] As can be seen in Figure 5, three mounting pads 72, 74, 76 extend from the underside of the upper clamp mount 23, which is the surface that faces the upper bonding component 18 when the stack is assembled. Although not visible in Figure 1, the upper clamp mount 22 may have three mounting pads similar to the mounting pads 72, 74, 76 of Figure 5 extending from the underside of the upper clamp mount 22. When the stack is assembled, these mounting pads 72, 74, 76 of the upper clamp mount 22 or upper clamp mount 23 contact the facing surface of the upper bonding component 18, and the adhesive 20 fills the remaining space between the upper bonding component 18 and the upper clamp mount 22 or upper clamp mount 23.

[0026] As can be seen in Fig. 5, the mounting pads 72, 74, 76, like the mounting pads 62, 64, 66, may be arranged in a triangle. In this way, the mounting pads 72, 74, 76 provide three contact points or areas for the facing surface of the upper connecting part 18, which is flat in this embodiment. Like a tripod, these three contact points or areas allow for stable support of the upper clamping mount 22 or the upper clamping mount 23 (upper part) on the upper connecting part 18 (lower part). At the same time, a space is left between the facing surface of the upper clamping mount 22 or the upper clamping mount 23 and the facing surface of the upper connecting part 18 so that there is an area for the adhesive 20 to secure the two parts together.

[0027] In another configuration, the underside of the upper clamp mount 22 or the upper clamp mount 23 facing the upper coupling component 18 may be flat, and the facing surface of the upper coupling component 18 may include three mounting pads. As in the illustrated embodiment, these three mounting pads provide three contact points or areas for the facing surface of the upper clamp mount 22 or the upper clamp mount 23. Like a tripod, these three contact points or areas allow for stable support of the upper clamp mount 22 or the upper clamp mount 23 (upper part) on the upper coupling component 18 (lower part). As in the illustrated embodiment, a space is left between the facing surface of the upper clamp mount 22 or the upper clamp mount 23 and the facing surface of the upper coupling component 18 so that there is an area for adhesive 20 to secure the two components together.

[0028] The above-described embodiments involving the use of mounting pads as shown and described herein provide advantages over prior art optical mounting systems. The optical mounting system with mounting pads as shown and described herein maintains the stability of the laser or other optical component once it is aligned and prevents and / or minimizes its drift. In prior art optical mounting systems, external factors such as temperature, humidity, and / or vibration can cause the laser or other optical component to become misaligned. This is especially true when two solid components are bonded by an adhesive layer without direct contact between the two solid components. When external factors such as temperature, humidity, and / or vibration are changed or introduced, the adhesive can deform and the solid components can become misaligned relative to each other. Adhesive deformation can also be caused or exacerbated by a situation where the mass is unevenly distributed on the adhesive. This can also cause the adhesive to deform and the components to become misaligned. For example, a semiconductor laser mounted as shown in FIG. 1 has more mass on one side of the top clamp mount compared to the other, causing the mass to be unevenly distributed on the adhesive. Adhesive deformation can also be caused or exacerbated by other forces. For example, an electrical cable such as that shown in FIG. 1 can exert an upward force on one side of the semiconductor laser, placing an uneven load on the adhesive. The optical component mounting system with mounting pads shown and described herein allows for direct contact between solid components that are joined by the adhesive. This direct contact prevents and / or minimizes drift of the laser or other optical components due to changes in the adhesive.

[0029] It will be appreciated that the use of three mounting pads allows for three-point contact and stable support of one component on the other, however, in alternative embodiments more than three mounting pads may be used.

[0030] The mounting pads may have any suitable shape to provide stable support as described herein. In FIG. 4, mounting pads 62, 64, 66 are shown having a rectangular footprint. These mounting pads 62, 64, 66 have rectangular flat contact surfaces for contacting adjacent components of the component stack. In FIG. 5, mounting pads 72, 74, 76 are shown having a footprint with two or three straight sides and one semicircular or curved side. The mounting pads may be shaped to have different contact surfaces or contact points. For example, each mounting pad may have a hemispherical or pyramidal shape and may present a single contact point for contacting an adjacent component of the component stack.

[0031] The component having the mounting pads may be manufactured by any suitable manufacturing method, for example the mounting pads may be manufactured by machining the component, alternatively the component having the mounting pads may be integrally molded or the mounting pads may be secured to the component.

[0032] Any suitable materials may be used for the components of the optical mounting system. By way of example, the upper clamping mount may be made of a ceramic material or a fiberglass composite material, the lower mount may be made of a ceramic material or a fiberglass composite material, and the upper and lower bonding pieces may be made of a ceramic material that can withstand soldering temperatures. The upper clamping mount and the lower mount may have low thermal conductivity.

[0033] To provide additional support in the adhesive area, one or more of the adhesive layers of the laser mounting system may include small solid particles, such as spherical glass or sapphire beads, in the adhesive. The solid particles (e.g., beads) may have a diameter that matches the desired layer thickness. In this manner, the solid particles maintain the layer thickness despite changes in the adhesive, thereby maintaining the position of the components in the stack and the stability of the laser or other optical components. The solid particles may also minimize thermally-induced expansion of the adhesive layer relative to adjacent rigid components when the assembly is at high temperatures.

[0034] In one example of a method of manufacturing an optical mounting system, a stack of components are assembled together, a first component including a first surface and a second component including a second surface opposite the first surface, the first component including at least three mounting pads extending from the first surface. An adhesive is disposed between the first surface of the first component and the second surface of the second component, and the components are stacked together, with the mounting pads of the first component contacting the second surface of the second component. The adhesive is cured at a temperature equal to or greater than the upper limit of an expected temperature operating range. As an example, if the expected temperature operating range is 10 degrees Celsius to 35 degrees Celsius, the adhesive may be cured at 35 degrees Celsius or greater, such as 40 degrees Celsius. Thus, during use of the optical mounting system, the system, and therefore the adhesive, is at a temperature at or below the temperature at which the adhesive was cured. In this way, the adhesive may shrink due to thermal effects, but does not expand beyond its cured volume. Thus, the adhesive does not push the components away from each other due to thermal expansion, and the mounting pads provide direct contact and support between the first and second components.

[0035] Those skilled in the art will recognize that the implementations encompassed by the present disclosure are not limited to the specific exemplary implementations described above. In this regard, while exemplary implementations have been shown and described, a wide range of modifications, changes, and substitutions are contemplated in the foregoing disclosure. It is understood that such variations may be made to the foregoing without departing from the scope of the present disclosure. Accordingly, it is appropriate that the appended claims be construed broadly and consistent with the disclosure.

Claims

1. 1. An optical mounting system for supporting an optical component, the optical mounting system including a component stack for supporting the optical component, the component stack comprising: a first component including a first surface; a second component including a second surface opposite the first surface; a third component adjacent to one of the first component and the second component; a solder layer between the third component and the one of the first component and the second component; an adhesive between the first surface of the first component and the second surface of the second component, the adhesive bonding the first component and the second component to one another; Including, the first component includes at least three mounting pads extending from the first surface, the mounting pads of the first component contacting the second surface of the second component to provide direct support between the first component and the second component; Optical mounting system.

2. 10. The optical mounting system of claim 1, wherein the first component is above the second component in the component stack.

3. 10. The optical mounting system of claim 1, wherein the first component is lower in the component stack than the second component.

4. 2. The optical mounting system of claim 1, wherein the first component is a lower mount and the second component is a lower coupling component.

5. 2. The optical mounting system of claim 1, wherein the first component is a lower coupling component and the second component is a lower mount.

6. 10. The optical mounting system of claim 1, wherein the first component is an upper clamping mount and the second component is an upper coupling component.

7. 10. The optical mounting system of claim 1, wherein the first component is an upper coupling component and the second component is an upper clamping mount.

8. The optical component mounting system of claim 1 , wherein the optical component comprises a semiconductor laser.

9. 1. A laser mounting system for supporting a laser, the laser mounting system including a component stack for supporting the laser, the component stack comprising: A lower mounting base; An upper mounting base; A lower connecting part; An upper connecting part; a solder layer between the lower joining component and the upper joining component; an adhesive between the lower mounting base and the lower connecting part, the adhesive bonding the lower mounting base and the lower connecting part to each other; an adhesive between the upper mounting base and the upper connecting part, the adhesive bonding the upper mounting base and the upper connecting part to each other; Including, at least one of the components in the component stack is a first component, the first component including at least three mounting pads extending toward an adjacent second component in the component stack, the mounting pads of the first component contacting the second component and providing direct support between the first component and the second component; Laser mounting system.

10. 10. The laser mounting system of claim 9, wherein the first component including the at least three mounting pads is the lower mounting base and the second component is the lower bonding component.

11. 10. The laser mounting system of claim 9, wherein the first component including the at least three mounting pads is the lower bonding piece and the second component is the lower mounting base.

12. 10. The laser mounting system of claim 9, wherein the first component including the at least three mounting pads is the upper mounting base and the second component is the upper bonding piece.

13. 10. The laser mounting system of claim 9, wherein the first component including the at least three mounting pads is the upper bonding piece and the second component is the upper mounting base.

14. 10. The laser mounting system of claim 9, wherein the top mount is a top clamp type mount.

15. 10. The laser mounting system of claim 9, wherein the laser comprises a semiconductor laser.

16. 1. A method of assembling an optical mounting system for supporting an optical component, the optical mounting system including a component stack for supporting the optical component, the method comprising: A lower mounting base; A lower connecting part; An upper mounting base; An upper connecting part; a solder layer between the lower joining component and the upper joining component; Stacking said component stacks together, said stacks comprising: at least one of the lower mounting base, the lower connecting piece, the upper connecting piece, and the upper mounting base is a first component, and at least another of the lower mounting base, the lower connecting piece, the upper connecting piece, and the upper mounting base adjacent to the first component is a second component, the first component including a first surface and the second component including a second surface opposite the first surface, the first component including at least three mounting pads extending from the first surface, and when the first component and the second component are stacked on top of each other, the mounting pads of the first component contact the second surface of the second component; applying an adhesive between the lower mount and the lower coupling piece so as to adhere the lower mount and the lower coupling piece to one another; applying an adhesive between the upper mount and the upper coupling piece so as to adhere the upper mount and the upper coupling piece to one another; attaching electrical terminals to the lower or upper bonding component, wherein an electric current is passed through the electrical terminals to heat the lower or upper bonding component with the attached electrical terminals, the heating by the electrical terminals increasing the temperature of the solder layer between the lower and upper bonding components to a level at which the solder material of the solder layer flows, and the upper mounting base and the upper bonding component can move relative to the lower mounting base and the lower bonding component; attaching a precision device to the upper mount for finely moving the upper mount until the laser light emitted from the semiconductor laser mounted on the upper mount is properly guided to the optical fiber core; curing the adhesive at a temperature at or above the upper limit of an expected temperature operating range of the optical mounting system; stopping the flow of the solder layer through the electrical terminals so as to cool and harden the solder layer; 16. A method of assembling an optical mounting system for supporting an optical component, comprising:

17. 20. The method of assembling an optical component mounting system of claim 16, wherein the step of curing the adhesive comprises curing the adhesive at or above 35 degrees Celsius.

18. 20. The method of assembling an optical component mounting system of claim 16, wherein the step of stacking the first component and the second component on one another comprises stacking the first component on top of the second component.

19. 20. The method of assembling an optical component mounting system of claim 16, wherein the step of stacking the first component and the second component on one another comprises stacking the second component on top of the first component.

20. The method of assembling an optical component mounting system of claim 16 , wherein the optical component comprises a semiconductor laser.

21. 17. The method of assembling an optical component mounting system of claim 16, wherein the first component including the at least three mounting pads is the lower mounting base and the second component is the lower coupling component.

22. 17. The method of assembling an optical component mounting system of claim 16, wherein the first component including the at least three mounting pads is the lower bonding component and the second component is the lower mounting base.

23. 17. The method of assembling an optical component mounting system of claim 16, wherein the first component including the at least three mounting pads is the upper mounting base and the second component is the upper coupling component.

24. 17. The method of assembling an optical component mounting system of claim 16, wherein the first component including the at least three mounting pads is the upper bonding component and the second component is the upper mounting base.

25. 20. The method of assembling an optical component mounting system of claim 16, wherein the top mount is a top clamp type mount.

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