Optical image stabilization actuator and method and device for assembling same

Abstract

To provide a sensor shift type optical image stabilization actuator, an assembly method, and an assembly device thereof, which reduce the manufacturing cost of a sensor shift type actuator.SOLUTION: After assembling an FPC including a wiring to an actuator case, a board on which an image sensor is mounted is electrically connected to the FPC, the assembling of the FPC with the image sensor mounted on the actuator case is avoided to reduce costly image sensor scrap due to actuator assembly failure, and reduce the manufacturing cost of the sensor shift type actuator.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to the field of optical elements, and more particularly to a sensor-shift type optical image stabilization actuator and an assembly method thereof. [Background technology]

[0002] With the development of image processing hardware technology and the increasing needs of users for taking images, functions such as Optical Image Stabilization (OIS) have been applied to camera modules mounted on mobile terminals (e.g., smartphones, PDAs, and independent camera devices).

[0003] The Optical Image Stabilization (OIS) function refers to a function that improves image clarity by adaptively moving a bracket holding a lens in a direction that corrects the shake caused by vibration of the lens.

[0004] In the prior art, a sensor-shift optical image stabilization (Sensor-Shift OIS) technology is known. In this technology, a photosensitive element (image sensor) is fixed to a platform that can slide in parallel by electromagnetic effect, and when shooting, the platform stops the photosensitive element for a short time due to electromagnetic hysteresis, thereby achieving a certain degree of optical image stabilization.

[0005] In the conventional technology, the image sensor is easily damaged during assembly of the sensor-shift type optical image stabilization actuator, which increases the cost of the sensor-shift type actuator. Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present disclosure is to provide a sensor-shift type optical image stabilization actuator and an assembly method thereof that reduce the manufacturing cost of the sensor-shift type actuator. [Means for solving the problem]

[0007] In order to solve the above technical problems, the present disclosure is realized as follows. As a first aspect, there is provided a method for assembling a sensor-shift type optical image stabilization OIS actuator, comprising the steps of: mounting a flexible printed circuit (FPC) on which the image sensor wiring is set, on a case of the OIS actuator; This includes electrically connecting the substrate on which the image sensor is mounted to the FPC in the case. As a second aspect, there is provided a sensor-shift type optical image stabilization OIS actuator, the OIS actuator being assembled by the method described in the first aspect. As a third aspect, there is provided a sensor-shift type optical image stabilization OIS actuator-like assembly device, comprising a processor, a memory, and a program or instruction stored in the memory and executable on the processor, the program or instruction being executed by the processor to realize the assembly method described in the first aspect. In a fourth aspect, there is provided a computer readable storage medium having stored thereon a program or instructions which, when executed by the processor, implements the assembly method described in the first aspect. Effect of the Invention

[0008] In an embodiment of the present disclosure, an FPC including wiring is assembled into an actuator case, and then a substrate mounting an image sensor is electrically joined to the FPC, thereby avoiding assembling an FPC mounting an image sensor into the actuator case, thereby reducing costly disposal of image sensors due to defects in actuator assembly and reducing the manufacturing cost of sensor-shift type actuators. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram of a flow for assembling an actuator. [Diagram 2] FIG. 1 is a schematic diagram of an assembly flow of an actuator in an embodiment of the present disclosure. [Diagram 3] FIG. 1 is a schematic diagram showing electrical bonding between an FPC and a substrate in an embodiment of the present disclosure. [Figure 4] FIG. 13 is another schematic diagram of electrically bonding an FPC and a substrate in an embodiment of the present disclosure. [Diagram 5] FIG. 1 is a schematic diagram of a configuration of an actuator assembly device according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The following clearly and completely describes the technical means of the embodiments of the present disclosure together with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, and are not all of them. Based on the embodiments of the present disclosure, all other embodiments that can be made by those skilled in the art without any creative work are all within the scope of protection of the present disclosure.

[0011] The terms "first", "second", etc. in the specification and claims of the present disclosure are intended to distinguish between similar objects and are not necessarily intended to describe a particular order or priority. It should be understood that the data used in this manner may be appropriately interchanged so that the embodiments of the present disclosure described herein can be implemented in an order other than that shown or described herein. Furthermore, the objects distinguished by the terms "first", "second", etc. are generally of the same kind and do not limit the number of objects. For example, the first object may be one or more. Note that "and / or" in the specification and claims represents at least one of the connected objects. The character " / " generally indicates that the related objects before and after are in an "or" relationship.

[0012] Hereinafter, a sensor-shift type OIS actuator assembly method according to an embodiment of the present disclosure will be described in detail with reference to specific examples and application scenarios in conjunction with the drawings.

[0013] With reference to FIG. 1, the present disclosure provides a flow for assembling a sensor shift type OIS actuator. In S11, a PCB (Printed Circuit Board) 104 is bonded to flexible printed circuits (FPC) 102-103 and the like. The FPC is for wiring the image sensor, and an image sensor 101 is mounted on a substrate 104. Specifically, the substrate 104 may be a PCB. In S12, an infrared cutoff filter assembly 105 is mounted on the PCB 104 so as to be positioned above the image sensor 101, resulting in a configuration shown in S13. Next, an OIS actuator base 106 is bonded to the PCB 104, resulting in a structure shown in S14. In S15, the structure to which the OIS actuator base 106 is bonded is assembled into an actuator case 107, resulting in an assembled actuator structure as shown in S16.

[0014] Since it is easier to mount the image sensor on the FPC when the FPC is flat, in the above assembly method, when assembling the actuator, the image sensor is first mounted on the FPC and then the actuator assembly begins. However, in the above method, the FPC with the image sensor mounted needs to be assembled into a case for the subsequent actuator assembly, which may damage the image sensor, which is the most expensive part. There is also a risk that in the event of a defect during the actuator assembly, the image sensor, which is the most expensive part, will also have to be discarded. Also, factories that handle image sensors usually require clean rooms of class 100 or lower. Normally, the actuator assembly process does not require a very high level of cleanliness, so capital investment is required for the actuator assembly process.

[0015] The above assembly method entails the risk of damaging or destroying the expensive image sensor during the assembly of the actuator. Or, there is also the risk that the expensive image sensor will have to be discarded due to defects during the assembly of the actuator. In addition, the above assembly method requires a clean room to handle the FPC equipped with the image sensor, which increases the burden on the actuator supplier.

[0016] In order to solve the problems of conventional methods, an embodiment of the present disclosure separates the substrate on which the image sensor is mounted from the FPC for wiring, and after assembling the FPC including the wiring to the actuator, the substrate on which the image sensor is mounted is electrically joined to the FPC. This reduces the costly disposal of image sensors due to defective actuator assembly and reduces the production cost of the sensor shift actuator.

[0017] Specifically, in the method of assembling a sensor-shift type OIS actuator according to the embodiment of the present disclosure, an FPC on which wiring for an image sensor is set is mounted on a case of the OIS actuator, and then the substrate on which the image sensor is mounted and the FPC in the case are electrically joined.

[0018] According to the above assembly method, in the embodiments of the present disclosure, after or during the assembly of the actuator, the FPC and the image sensor are separated, and the FPC is assembled into the OIS actuator case, and then the FPC is electrically joined to the image sensor substrate. This avoids problems such as damage to the image sensor during actuator assembly and disposal of the image sensor due to defective actuator assembly, and allows the sensor-shift actuator to be assembled without the need for costly clean rooms when assembling the actuator, further reducing the production costs of the sensor-shift actuator.

[0019] 2, in the embodiment of the present disclosure, in S21, a base 206 of the OIS actuator is mounted on an FPC. Here, 202, 203, and 204 indicate the integration of the FPC. Then, in S22, the FPC with the mounted base is assembled to a case 207 of the OIS actuator, so that the FPC is mounted on the case of the OIS actuator as shown in S23. In S24, an image sensor 209 is mounted on a substrate 208. In S25, the substrate 208 with the mounted image sensor is electrically joined to the FPC in the case 207, so that an assembled OIS actuator is obtained as shown in S26.

[0020] In addition, in S24, after mounting the image sensor 209 on the substrate 208, the present disclosure may mount an infrared cutoff filter assembly 205 located above the image sensor 209 on the substrate 208. Specifically, the infrared cutoff filter assembly 205 includes a support and an infrared cutoff filter fixed to the support and connected to the substrate via the support.

[0021] As can be seen from the above steps, the embodiment of the present disclosure improves the efficiency of the actuator assembly by electrically bonding the substrate on which the image sensor is mounted after mounting the FPC to the case in S23. For example, the actuator assembly steps (e.g., S21, S22, S23, S24, S26) can be performed by the actuator supplier, and the image sensor substrate attachment (e.g., S24) can be performed by the image sensor module manufacturer, thereby reducing the burden and cost of the actuator manufacturer since the actuator manufacturer does not need to handle the image sensor attachment.

[0022] Generally, an image sensor has multiple pins (PINs), and therefore requires a large amount of wiring. In order to effectively wire the image sensor in a narrow area, the present disclosure electrically bonds the substrate 208 to the FPC by flip chip bonding in S25. Here, lands corresponding to the rear side of the substrate and the FPC are provided. As shown in FIG. 3, a plurality of lands 210 are provided on the rear side of the substrate 208, a plurality of lands 211 are provided on the FPC 204, and the lands 210 and 211 correspond to each other and are bonded by flip chip bonding. Of course, the embodiment of the present disclosure may electrically bond the substrate and the FPC by soldering. As shown in FIG. 4, a plurality of lands are provided on the FPC, a plurality of pins are provided on the substrate, and the pins are soldered to the corresponding lands to electrically bond the substrate and the FPC.

[0023] According to the above flow, an embodiment of the present disclosure provides a sensor-shift type OIS actuator, which is assembled according to the above method flow.

[0024] Optionally, as shown in Fig. 5, an embodiment of the present disclosure provides an electronic device 400. The electronic device 400 includes a processor 401, a memory 402, and a program or instruction stored in the memory 402 and executable on the processor, and when the program or instruction is executed by the processor 401, each process in the above-mentioned embodiment of the assembly method is realized and the same technical effect can be achieved, so that the description will not be repeated here to avoid duplication.

[0025] An embodiment of the present disclosure provides a readable storage medium, which stores a program or instruction, which, when executed by a processor, realizes each process in the above-mentioned assembly method embodiment, and can achieve the same technical effect, so that the description will not be repeated here to avoid redundancy.

[0026] The processor is the processor of the assembly device in the above embodiment. The readable storage medium includes a computer readable storage medium such as a read-only memory ROM, a random access memory RAM, a magnetic disk, or an optical disk.

[0027] It should be noted that the terms "comprise", "comprises" and any variations thereof are intended to cover a non-exclusive inclusion, and a process, method, product or apparatus that includes a set of elements is not limited to those elements, and may include other elements not expressly shown or inherent to those processes, methods, products or apparatus. In the absence of further limitations, an element limited by "comprises a" does not exclude the inclusion of other similar elements in the process, method, product or apparatus that includes the element. It should be noted that the scope of the methods and apparatus in the embodiments of the present disclosure is not limited to performing the functions in the order shown or discussed, but also includes performing the functions essentially in a simultaneous manner or in the reverse order based on such functions. For example, the methods described may be performed in a different order than described, and various steps may be added, omitted or combined. Also, features described with reference to one example may be combined with other examples.

[0028] From the description of the above embodiments, it is obvious to those skilled in the art that the methods of the above embodiments can be realized in the form of a general-purpose hardware platform that requires software, and of course can also be realized by hardware, and in many cases the former is a more preferred embodiment. Based on this understanding, the substantial or prior art contribution of the technical means of the present disclosure appears in the form of a software product. The computer software product is stored in a storage medium (e.g., ROM / RAM, magnetic disk, optical disk) and includes several instructions that cause a terminal device (such as a mobile phone, a computer, a server, or a network device) to execute the methods of each embodiment of the present disclosure.

[0029] Although the embodiments of the present disclosure have been described above based on the drawings, the present invention is not limited to the above specific embodiments. The above specific embodiments are illustrative and not limiting. Many forms that a person skilled in the art can make without departing from the spirit and scope of the present disclosure and the claims are all included in the scope of protection of the present disclosure.

Claims

1. A method for assembling a sensor-shift type optical image stabilization OIS actuator, comprising the steps of: Mounting a flexible printed circuit (FPC) on which wiring of the image sensor is set to a case of the OIS actuator; electrically connecting a substrate on which the image sensor is mounted and an FPC in the case; Mounting the flexible printed circuit FPC to a case of the OIS actuator includes: Mounting a base of an OIS actuator to the FPC; and assembling the base-mounted FPC to a case of the OIS actuator.

2. 2. The method of claim 1 , The method of claim 1, further comprising mounting the image sensor to a substrate prior to electrically bonding the substrate and an FPC in the case.

3. 3. The method of claim 2, and after mounting the image sensor to the substrate, an infrared cutoff filter assembly disposed over the image sensor is attached to the substrate.

4. 4. The method of claim 3, wherein the infrared cutoff filter assembly includes a support and an infrared cutoff filter fixed to the support and connected to the substrate through the support.

5. 3. The method of claim 2, The step of electrically connecting the substrate on which the image sensor is mounted and the FPC in the case includes: The method includes electrically bonding the substrate and the FPC with a flip chip, and providing corresponding lands on a backside of the substrate and on the FPC, respectively.

6. 2. The method of claim 1 , The step of electrically connecting the substrate on which the image sensor is mounted and the FPC in the case includes: electrically joining the substrate and the FPC by soldering.

7. 6. A sensor-shift type OIS actuator for optical image stabilization, the OIS actuator being assembled by the method according to claim 5.

8. A sensor-shift type optical image stabilization (OIS) actuator-type assembly device, An optical image stabilization (OIS) actuator-like assembly device comprising a processor, a memory, and a program or instruction stored in the memory and executable on the processor, the program or instruction realizing an assembly method according to any one of claims 1 to 6 when executed by the processor.

9. A readable storage medium on which a program or instruction is stored, A readable storage medium, characterized in that, when said program or instructions are executed by a processor, it implements the assembly method according to any one of claims 1 to 6.

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