Camera module driving device and imaging device

Abstract

To provide a camera module drive device which can be suppressed in magnetic interferences with other devices.SOLUTION: A camera module drive device 101 comprises: a movable-side member MB including a module holder 2 that can hold a camera module CM having a lens body LS and an imaging device IS; a fixed-side member FB that includes a support 18 pivotably supporting the module holder 2; and a drive mechanism DM pivoting the module holder 2 with respect to the support 18 in such a manner that an optical axis JD of the lens body LS is tilted. The drive mechanism DM includes a plurality of shape memory alloy wires SA provided between the fixed-side member FB and the movable-side member MB. The shape memory alloy wires SA are arranged in such a manner that the height position in optical axis direction of one end, which is fixed to the fixing-side member FB, and the height position in optical axis direction of the other end, which is fixed to the movable-side member MB, are different from each other.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a camera module driving device and an imaging device. [Background technology]

[0002] Conventionally, there is known an optical photographing device that includes a camera module having a lens and an image sensor, and a shake correction device for correcting shake of an optical image formed on the image sensor by the lens (see Patent Document 1). The shake correction device includes a support that supports the camera module so that the camera module can be rocked, and a swing drive mechanism that corrects shake by rocking the camera module so that the optical axis of the lens is tilted relative to the support. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2011-257506 A Summary of the Invention [Problem to be solved by the invention]

[0004] The above-mentioned oscillating drive mechanism includes a shake correction magnet fixed to the outer circumferential surface of the camera module, and a shake correction coil fixed to the support and arranged to face the shake correction magnet. Therefore, if the above-mentioned oscillating drive mechanism is placed next to a device having a magnet and a coil, such as a voice coil motor type camera module, there is a risk of magnetic interference occurring between the device.

[0005] It is therefore desirable to provide a camera module driving device that can suppress magnetic interference with other devices. [Means for solving the problem]

[0006] A camera module driving device according to an embodiment of the present invention is a camera module driving device comprising: a movable-side member including a module holder capable of holding a camera module having a lens body and an image sensor; a fixed-side member including a support body that swingably supports the module holder having a substantially rectangular outer shape in a top view along an optical axis direction; and a driving mechanism that swings the module holder relative to the support body so that the optical axis of the lens body is tilted, the driving mechanism having a plurality of shape memory alloy wires provided between the fixed-side member and the movable-side member, the shape memory alloy wires being arranged to be fixed to one of four side surfaces constituting the module holder. , facing each other with the module holder in between On two sides, the height position of one end portion fixed to the fixed-side member in the optical axis direction is different from the height position of the other end portion fixed to the movable-side member in the optical axis direction, and among the four side surfaces constituting the module holder, , facing each other with the module holder in between The remaining two sides are not provided with any. Effect of the Invention

[0007] The above-described camera module driving device can suppress magnetic interference with other devices. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 illustrates an example of the configuration of an imaging device. [Diagram 2] 2 is an exploded perspective view of a camera module driving device in the imaging device of FIG. 1. [Diagram 3] 11A and 11B are diagrams illustrating an example of the configuration of a leaf spring attached to a fixed-side member and a movable-side member. [Figure 4] 11A and 11B are diagrams illustrating an example of a configuration of a metal member attached to a fixed-side member and a movable-side member. [Diagram 5] FIG. 2 is a diagram of a metal member having a shape memory alloy wire attached thereto. [Figure 6] FIG. [Figure 7]2 is a diagram showing the positional relationship between a leaf spring, a shape memory alloy wire, a metal member, an insulating substrate, and a conductive member in the imaging device of FIG. 1. [Figure 8] FIG. 2 is a diagram showing an example of a path of a current flowing through a shape memory alloy wire. [Figure 9] 11A and 11B are diagrams showing an example of the configuration of a lower holding body that is assembled to a support body. [Figure 10] FIG. 4 is a front view of the module holder and support body. [Figure 11] 2 is a diagram showing an example of the arrangement of members for detecting the swing state of a module holder in the imaging device of FIG. 1. [Figure 12] FIG. 13 is a diagram showing an example of an arrangement of a flexible cable. [Figure 13] FIG. 13 is a diagram illustrating another example of the configuration of an imaging device. [Figure 14] 14 is an exploded perspective view of a camera module driving device in the imaging device of FIG. 13. [Figure 15] 14 is a diagram showing the positional relationship between a leaf spring, a shape memory alloy wire, a metal member, and an insulating substrate in the imaging device of FIG. 13. FIG. [Figure 16] 14 is a diagram showing an example of the arrangement of members for detecting the swing state of a module holder in the imaging device of FIG. 13. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] An imaging device ID including a camera module driving device 101 according to an embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a perspective view of the imaging device ID. Specifically, Fig. 1(A) is a top perspective view of the imaging device ID in a state in which a camera module CM is attached to the camera module driving device 101, and Fig. 1(B) is a top perspective view of the imaging device ID in a state in which the camera module CM is removed from the camera module driving device 101. Fig. 2 is an exploded perspective view of the camera module driving device 101.

[0010] 1 and 2, X1 represents one direction of the X axis constituting the three-dimensional orthogonal coordinate system, and X2 represents the other direction of the X axis. Y1 represents one direction of the Y axis constituting the three-dimensional orthogonal coordinate system, and Y2 represents the other direction of the Y axis. Similarly, Z1 represents one direction of the Z axis constituting the three-dimensional orthogonal coordinate system, and Z2 represents the other direction of the Z axis. In FIG. 1 and FIG. 2, the X1 side of the camera module driving device 101 corresponds to the front side (front side) of the camera module driving device 101, and the X2 side of the camera module driving device 101 corresponds to the rear side (rear side) of the camera module driving device 101. The Y1 side of the camera module driving device 101 corresponds to the left side of the camera module driving device 101, and the Y2 side of the camera module driving device 101 corresponds to the right side of the camera module driving device 101. Moreover, the Z1 side of the camera module driving device 101 corresponds to the upper side (subject side) of the camera module driving device 101, and the Z2 side of the camera module driving device 101 corresponds to the lower side (imaging element side) of the camera module driving device 101. The same applies to the other figures.

[0011] 1 and 2, the camera module driving device 101 includes a cover member 4 that is a part of a fixed-side member FB. The cover member 4 includes an upper cover member 4U and a lower cover member 4D.

[0012] The cover member 4 is configured to function as a housing HS that covers other members constituting the imaging device ID. In this embodiment, the upper cover member 4U is made of synthetic resin, and the lower cover member 4D is made of non-magnetic metal. However, the upper cover member 4U may be made of magnetic metal or non-magnetic metal, and the lower cover member 4D may be made of synthetic resin or magnetic metal. In addition, as shown in FIG. 1(B), the cover member 4 has a box-shaped outer shape that defines a storage section 4S. A camera module CM is stored in the storage section 4S.

[0013] As shown in Fig. 1(B), the camera module CM is composed of a substrate CB, a lens driving device LD, a lens body LS held by the lens driving device LD, and an image sensor IS mounted on the substrate CB so as to face the lens body LS. The camera module CM is a voice coil motor type camera module including a magnet and a coil. The substrate CB is connected to the outside via a flexible cable 3.

[0014] The upper cover member 4U is formed by injection molding using a synthetic resin such as liquid crystal polymer (LCP). In this embodiment, the upper cover member 4U has a substantially rectangular outline in top view and has an opening 4K at the center, as shown in Fig. 2. Specifically, the upper cover member 4U has four sides 4E (a first side 4E1 to a fourth side 4E4) arranged to surround the opening 4K.

[0015] 2, the lower cover member 4D has an outer peripheral wall portion 4A having a substantially rectangular cylindrical shape and a flat bottom plate portion 4B provided so as to be continuous with the lower end (the end on the Z2 side) of the outer peripheral wall portion 4A. The outer peripheral wall portion 4A includes a first side plate portion 4A1 to a fourth side plate portion 4A4. The first side plate portion 4A1 and the third side plate portion 4A3 face each other, and the second side plate portion 4A2 and the fourth side plate portion 4A4 face each other. The first side plate portion 4A1 and the third side plate portion 4A3 extend perpendicular to the second side plate portion 4A2 and the fourth side plate portion 4A4.

[0016] The upper cover member 4U is joined to the lower cover member 4D by an adhesive as shown in Fig. 1. The cover member 4 as the housing HS contains the module holder 2, the metal member 5, the leaf spring 6, the insulating substrate 17, the support 18, the shape memory alloy wire SA, and the like as shown in Fig. 2.

[0017] The movable member MB includes a module holder 2 capable of holding a camera module CM. The module holder 2 is supported by a leaf spring 6 so as to be capable of tilting an optical axis JD related to the lens body LS. The module holder 2 is moved by a shape memory alloy wire SA constituting a drive mechanism DM so as to tilt the optical axis JD. The lens body LS is, for example, a cylindrical lens barrel equipped with at least one lens, and is configured so that its central axis is aligned with the optical axis JD.

[0018] The module holder 2 has an upper holder 2U and a lower holder 2D. The upper holder 2U is an example of a mounting member, and is formed by injection molding synthetic resin such as liquid crystal polymer (LCP). Specifically, as shown in FIG. 2, the upper holder 2U includes a cylindrical portion 12 formed to extend along the optical axis JD, and a movable base portion 12D and a protruding portion 12S formed to protrude upward from the upper end of the cylindrical portion 12. The lower holder 2D is an example of a case member, and is configured to accommodate at least a part of the camera module CM. In the example shown in FIG. 2, the lower holder 2D is formed of a magnetic metal so as to function as a magnetic shield. This is to suppress magnetic interference between the components of the camera module CM and the components of the camera module driving device 101. The lower holder 2D is fixed to the upper holder 2U by an adhesive.

[0019] The movable-side pedestal portion 12D includes a first movable-side pedestal portion 12D1 and a second movable-side pedestal portion 12D2. Specifically, the movable-side pedestal portions 12D are disposed on two opposing sides of the module holder 2 having a generally rectangular outer shape in a top view. A portion of the leaf spring 6 is placed on each of the two movable-side pedestal portions 12D.

[0020] The protrusions 12S are arranged to correspond to the four corners of the module holder 2, which has a generally rectangular outer shape in a top view. Specifically, the protrusions 12S are configured to function as stoppers that prevent the module holder 2 from moving excessively in the Z1 direction. In the example shown in Fig. 2, the protrusions 12S are configured to come into contact with the upper cover member 4U when the module holder 2 moves a predetermined distance in the Z1 direction.

[0021] The drive mechanism DM includes a shape memory alloy wire SA, which is an example of a shape memory actuator. In this embodiment, the shape memory alloy wire SA includes a first wire SA1 to a fourth wire SA4. When a current flows through the shape memory alloy wire SA, the temperature increases and the wire contracts in response to the increase in temperature. The drive mechanism DM can use the contraction of the shape memory alloy wire SA to swing the module holder 2 around the swing axis AX. The swing axis AX includes a first swing axis AX1 and a second swing axis AX2 that are perpendicular to each other.

[0022] The shape memory alloy wire SA is configured such that when one or more of the first wire SA1 to the fourth wire SA4 contract, the module holder 2 swings, and the swinging stretches the other one or more. Specifically, the drive mechanism DM can swing the module holder 2 counterclockwise in front view about the first swing axis AX1 by simultaneously contracting the first wire SA1 and the second wire SA2. Also, the drive mechanism DM can swing the module holder 2 clockwise in front view about the first swing axis AX1 by simultaneously contracting the third wire SA3 and the fourth wire SA4. Also, the drive mechanism DM can swing the module holder 2 counterclockwise in right side view about the second swing axis AX2 by simultaneously contracting the first wire SA1 and the third wire SA3. Also, the drive mechanism DM can swing the module holder 2 clockwise in right side view about the second swing axis AX2 by simultaneously contracting the second wire SA2 and the fourth wire SA4.

[0023] The leaf spring 6 is configured to be able to press the module holder 2 downward against the fixed member FB (support 18). In this embodiment, the leaf spring 6 is made of a metal plate whose main material is, for example, a copper alloy, a titanium-copper alloy (titanium-copper), or a copper-nickel alloy (nickel-tin-copper), and is configured to be able to function as a conductive path. Specifically, the leaf spring 6 includes a left leaf spring 6L and a right leaf spring 6R.

[0024] The insulating substrate 17 is a member for connecting the drive mechanism DM and the control device. The control device is configured to be able to supply current to the drive mechanism DM, and is typically installed outside the housing HS. In the example shown in FIG. 2, the insulating substrate 17 is a flexible printed circuit board, and includes a lower surface portion 17D and a front surface portion 17F. A conductive pattern connected to the drive mechanism DM is formed on the lower surface portion 17D. As shown in FIG. 7(A), the conductive pattern includes a first conductive pattern PT1 to a sixth conductive pattern PT6. The front surface portion 17F is configured to extend upward from the front end portion of the lower surface portion 17D along the inner surface of the first side plate portion 4A1 of the lower cover member 4D, and is folded back at the upper end of the first side plate portion 4A1 to extend outside the housing HS.

[0025] The support 18 is formed by injection molding using a synthetic resin such as liquid crystal polymer (LCP). In this embodiment, the support 18 has a generally rectangular outline when viewed from above. Specifically, the support 18 has a bottom wall portion 18B surrounded by four side portions 18E. The side portions 18E include a first side portion 18E1 to a fourth side portion 18E4. The support 18 also has four fixed side pedestal portions 18D (first fixed side pedestal portion 18D1 to fourth fixed side pedestal portion 18D4) formed at the four corners.

[0026] The leaf spring 6 is configured to connect the movable side pedestal portion 12D formed on the module holder 2 and the fixed side pedestal portion 18D formed on the support body 18. Specifically, the left leaf spring 6L is configured to connect the first movable side pedestal portion 12D1 formed on the module holder 2 and each of the first fixed side pedestal portion 18D1 and the second fixed side pedestal portion 18D2 formed on the support body 18. Similarly, the right leaf spring 6R is configured to connect the second movable side pedestal portion 12D2 formed on the module holder 2 and each of the third fixed side pedestal portion 18D3 and the fourth fixed side pedestal portion 18D4 formed on the support body 18.

[0027] 3, the left leaf spring 6L has an inner portion 6iL fixed to the movable member MB, an outer portion 6eL fixed to the fixed member FB, and an elastic arm 6gL connecting the inner portion 6iL and the outer portion 6eL. The outer portion 6eL includes a first outer portion 6eL1 and a second outer portion 6eL2, and the elastic arm 6gL includes a first elastic arm 6gL1 and a second elastic arm 6gL2. The same is true for the right leaf spring 6R.

[0028] Fig. 3 is a diagram showing a configuration example of the leaf spring 6. Specifically, Fig. 3(A) is a perspective view of the leaf spring 6 attached to the upper holding body 2U constituting the module holding body 2. Fig. 3(B) is a perspective view of the leaf spring 6 attached to the support body 18. Fig. 3(C) is a right side view of the leaf spring 6 attached between the upper holding body 2U and the support body 18. Note that in Fig. 3, for clarity, a fine dot pattern is applied to the upper holding body 2U, and a coarse dot pattern is applied to the support body 18.

[0029] With respect to the left leaf spring 6L, the inner portion 6iL is fixed to a first movable side pedestal portion 12D1 formed on the upper holding body 2U, the first outer portion 6eL1 is fixed to a first fixed side pedestal portion 18D1 formed on the support body 18, and the second outer portion 6eL2 is fixed to a second fixed side pedestal portion 18D2 formed on the support body 18. With respect to the right leaf spring 6R, the inner portion 6iR is fixed to a second movable side pedestal portion 12D2 formed on the upper holding body 2U, the first outer portion 6eR1 is fixed to a fourth fixed side pedestal portion 18D4 formed on the support body 18, and the second outer portion 6eR2 is fixed to a third fixed side pedestal portion 18D3 formed on the support body 18.

[0030] As shown in FIG. 3(C), the right leaf spring 6R is fixed to the movable member MB (upper holder 2U) and the fixed member FB (support 18) so that the height of the inner portion 6iR is higher than the heights of the first outer portion 6eR1 and the second outer portion 6eR2 by a height H1. The same is true for the left leaf spring 6L. Due to this configuration, the leaf spring 6 can always urge the movable member MB downward. In other words, the leaf spring 6 not only has the function of returning the module holder 2 to a non-swinging state, but also has the function of pressing the movable member MB against the fixed member FB.

[0031] 2, the metal member 5 is configured so that an end of the shape memory alloy wire SA is fixed. In this embodiment, the metal member 5 includes a fixed side metal member 5F and a movable side metal member 5M. The fixed side metal member 5F is configured so as to be fixed to the support body 18. The movable side metal member 5M is configured so as to be fixed to the module holder 2.

[0032] More specifically, the fixed metal member 5F is also referred to as a fixed terminal plate and includes a first fixed terminal plate 5F1 to a fourth fixed terminal plate 5F4. The movable metal member 5M is also referred to as a movable terminal plate and includes a first movable terminal plate 5M1 and a second movable terminal plate 5M2.

[0033] Next, the positional relationship between each of the movable side member MB (upper holding body 2U) and the fixed side member FB (support body 18) and the metal member 5 will be described with reference to Fig. 4. Fig. 4(A) is a perspective view of the movable side member MB (upper holding body 2U) to which the movable side metal member 5M is attached. Fig. 4(B) is a perspective view of the fixed side member FB (support body 18) to which the fixed side metal member 5F is attached. For clarity, a cross pattern is applied to the movable side metal member 5M in Fig. 4(A), and a cross pattern is applied to the fixed side metal member 5F in Fig. 4(B).

[0034] In the example shown in Fig. 4(A), the second movable side terminal plate 5M2 is fixed to the Y2 side wall (right mounting surface) of the second movable side pedestal portion 12D2. Specifically, the second movable side terminal plate 5M2 is fixed to the second movable side pedestal portion 12D2 by an adhesive in a state in which a square-shaped protrusion 2V formed on the second movable side pedestal portion 12D2 and protruding outward (Y2 side) is fitted into a rectangular hole AH (see Fig. 5(A)) formed in the second movable side terminal plate 5M2. The adhesive is, for example, a light-curing adhesive. The light-curing adhesive is, for example, an ultraviolet-curing adhesive or a visible-light-curing adhesive. The same is true for the first movable side terminal plate 5M1.

[0035] In the example shown in FIG. 4(B), the third fixed side terminal plate 5F3 is fixed to the Y2 side wall (right mounting surface) of the fourth side portion 18E4 of the support body 18. Specifically, the third fixed side terminal plate 5F3 is fixed to the support body 18 by an adhesive in a state in which a rectangular protrusion 18V formed on the right mounting surface and protruding outward (Y2 side) is fitted into a through hole RH (see FIG. 5(A)) formed in the third fixed side terminal plate 5F3. The adhesive is, for example, a light-curing adhesive. The light-curing adhesive is, for example, an ultraviolet-curing adhesive or a visible-light-curing adhesive. The same is true for the first fixed side terminal plate 5F1, the second fixed side terminal plate 5F2, and the fourth fixed side terminal plate 5F4.

[0036] The shape memory alloy wire SA extends along the inner surface of the outer peripheral wall portion 4A of the lower cover member 4D, and is configured to be able to swing the movable side member MB relative to the fixed side member FB. In this embodiment, the shape memory alloy wire SA includes a first wire SA1 to a fourth wire SA4, and is configured to be able to swing the module holder 2 as the movable side member MB relative to the support body 18 as the fixed side member FB. As shown in FIG. 2, each of the first wire SA1 to the fourth wire SA4 has one end fixed to the fixed side metal member 5F by crimping, welding, or the like, and the other end fixed to the movable side metal member 5M by crimping, welding, or the like.

[0037] Next, the metal member 5 to which the shape memory alloy wire SA is attached will be described with reference to FIG. 5. FIG. 5(A) is a view of the third wire SA3 attached to the second movable side terminal plate 5M2 and the third fixed side terminal plate 5F3, and the fourth wire SA4 attached to the second movable side terminal plate 5M2 and the fourth fixed side terminal plate 5F4, as viewed from the Y2 side. FIG. 5(B) is a view of the third wire SA3 attached to the second movable side terminal plate 5M2 and the third fixed side terminal plate 5F3, and the fourth wire SA4 attached to the second movable side terminal plate 5M2 and the fourth fixed side terminal plate 5F4, as viewed from the X1 side. Note that the positional relationship of each member shown in FIG. 5(A) and FIG. 5(B) corresponds to the positional relationship when the camera module driving device 101 is assembled. In FIG. 5(A) and FIG. 5(B), other members are omitted from the illustration for clarity. Further, the following description with reference to FIGS. 5(A) and 5(B) relates to the combination of the third wire SA3 and the fourth wire SA4, but is similarly applied to the combination of the first wire SA1 and the second wire SA2.

[0038] Specifically, one end of the third wire SA3 is fixed to the third fixed side terminal plate 5F3 by a holding portion J2 of the third fixed side terminal plate 5F3, and the other end of the third wire SA3 is fixed to the second movable side terminal plate 5M2 by a holding portion J1 on the front side (X1 side) of the second movable side terminal plate 5M2. Similarly, one end of the fourth wire SA4 is fixed to the fourth fixed side terminal plate 5F4 by a holding portion J4 of the fourth fixed side terminal plate 5F4, and the other end of the fourth wire SA4 is fixed to the second movable side terminal plate 5M2 by a holding portion J3 on the rear side (X2 side) of the second movable side terminal plate 5M2.

[0039] The holding portion J1 is formed by bending a part of the second movable terminal plate 5M2. Specifically, the part of the second movable terminal plate 5M2 is bent while sandwiching an end (other end) of the third wire SA3, thereby forming the holding portion J1. The end (other end) of the third wire SA3 is fixed to the holding portion J1 by welding. The same is true for the holding portions J2 to J4.

[0040] The third wire SA3 and the fourth wire SA4 are arranged so as to be twisted relative to each other, as shown in Fig. 5(A) and Fig. 5(B). In other words, the third wire SA3 and the fourth wire SA4 are arranged so as not to contact each other (to be non-contacting).

[0041] Next, the support 18 constituting the fixed-side member FB will be described in detail with reference to Fig. 6. Fig. 6 is a perspective view of the support 18. Specifically, Fig. 6(A) is a perspective view of the support 18 with the conductive member CD removed, Fig. 6(B) is a perspective view of the conductive member CD embedded in the support 18, and Fig. 6(C) is a perspective view of the support 18 with the conductive member CD embedded. Note that in Figs. 6(B) and 6(C), a dot pattern is applied to the conductive member CD for clarity.

[0042] A fixed-side pedestal portion 18D is formed as an extension on the upper surface, which is the surface on the subject side (the surface on the Z1 side) of the support body 18. The fixed-side pedestal portion 18D includes a first fixed-side pedestal portion 18D1 to a fourth fixed-side pedestal portion 18D4. A conductive member CD made of a metal plate containing a material such as copper, iron, or an alloy containing these as a main component, as shown in Fig. 6(B), is embedded in the support body 18 by insert molding.

[0043] In this embodiment, the conductive member CD is configured to have a first terminal portion TM1 protruding from the left side surface (surface on the Y1 side) of the support body 18 and extending to the left (Y1 direction), a second terminal portion TM2 protruding from the right side surface (surface on the Y2 side) of the support body 18 and extending to the right (Y2 direction), a first bonding surface portion CP1 exposed on the upper surface (surface on the Z1 side) of the first fixed side pedestal portion 18D1, and a second bonding surface portion CP2 exposed on the upper surface (surface on the Z1 side) of the fourth fixed side pedestal portion 18D4.

[0044] Specifically, the conductive member CD includes a first conductive member CD1 and a second conductive member CD2. The first conductive member CD1 includes a first terminal portion TM1 and a first bonding surface portion CP1, and the second conductive member CD2 includes a second terminal portion TM2 and a second bonding surface portion CP2.

[0045] Next, referring to FIG. 7, the positional relationship between the metal member 5, the leaf spring 6, the conductive member CD, and the shape memory alloy wire SA will be described. FIG. 7 is a diagram showing the positional relationship between the metal member 5, the leaf spring 6, the insulating substrate 17, the conductive member CD, and the shape memory alloy wire SA. Specifically, FIG. 7(A) is a perspective view of each member (metal member 5, leaf spring 6, insulating substrate 17, conductive member CD, and shape memory alloy wire SA), and FIG. 7(B) is a top view of each member. In addition, in FIG. 7(A) and FIG. 7(B), for clarity, a cross pattern is applied to the metal member 5, a fine dot pattern is applied to the leaf spring 6, and a coarse dot pattern is applied to the conductive member CD. In addition, in FIG. 7(B), the insulating substrate 17 is omitted from the illustration.

[0046] 7(B), the leaf spring 6 includes a left leaf spring 6L and a right leaf spring 6R. The left leaf spring 6L has a first outer portion 6eL1 fixed to a first fixed side pedestal portion 18D1 (see FIG. 2) of the support 18, a second outer portion 6eL2 fixed to a second fixed side pedestal portion 18D2 (see FIG. 2) of the support 18, an inner portion 6iL fixed to a first movable side pedestal portion 12D1 (see FIG. 2) of the module holder 2, a first elastic arm portion 6gL1 connecting the first outer portion 6eL1 and the inner portion 6iL, and a second elastic arm portion 6gL2 connecting the second outer portion 6eL2 and the inner portion 6iL.

[0047] The first outer portion 6eL1 is provided with a first through hole 6LH1 through which a round protruding portion 18T (see FIG. 3B) formed on the first fixed side pedestal portion 18D1 protruding upward is inserted, and a second through hole 6LH2 used for joining the first joint surface portion CP1 (see FIG. 6C) of the first conductive member CD1. In this embodiment, the first outer portion 6eL1 and the protruding portion 18T are joined by hot crimping or cold crimping the protruding portion 18T. However, the first outer portion 6eL1 and the protruding portion 18T may be joined by an adhesive. In this embodiment, the first outer portion 6eL1 and the first conductive member CD1 are joined by welding such as laser welding performed in the second through hole 6LH2. However, the first outer portion 6eL1 and the first conductive member CD1 may be joined by solder, a conductive adhesive, or the like.

[0048] The second outer portion 6eL2 has a third through hole 6LH3 through which a round protruding portion 18T (see FIG. 3(B)) formed on the second fixed-side pedestal portion 18D2 protruding upward is inserted. In this embodiment, the second outer portion 6eL2 and the protruding portion 18T are joined by hot crimping or cold crimping the protruding portion 18T. However, the second outer portion 6eL2 and the protruding portion 18T may also be joined by an adhesive.

[0049] The inner portion 6iL is formed with a fourth through hole 6LH4 and a fifth through hole 6LH5, through which a round protrusion 2T (see FIG. 3(A)) formed on the first movable-side pedestal portion 12D1 protruding upward is inserted. In this embodiment, the inner portion 6iL and the protrusion 2T are fixed to each other by hot crimping or cold crimping the protrusion 2T. However, the inner portion 6iL and the protrusion 2T may also be fixed to each other by an adhesive.

[0050] Similarly, the right side leaf spring 6R has a first outer portion 6eR1 fixed to the fourth fixed side base portion 18D4 (see Figure 2) of the support body 18, a second outer portion 6eR2 fixed to the third fixed side base portion 18D3 (see Figure 2) of the support body 18, an inner portion 6iR fixed to the second movable side base portion 12D2 (see Figure 2) of the module holder 2, a first elastic arm portion 6gR1 connecting the first outer portion 6eR1 and the inner portion 6iR, and a second elastic arm portion 6gR2 connecting the second outer portion 6eR2 and the inner portion 6iR.

[0051] The first outer portion 6eR1 is provided with a first through hole 6RH1 through which a round protruding portion 18T (see FIG. 3B) formed on the fourth fixed side pedestal portion 18D4 protruding upward is inserted, and a second through hole 6RH2 used for joining the second joint surface portion CP2 (see FIG. 6C) of the second conductive member CD2. In this embodiment, the first outer portion 6eR1 and the protruding portion 18T are joined by hot crimping or cold crimping the protruding portion 18T. However, the first outer portion 6eR1 and the protruding portion 18T may be joined by an adhesive. In this embodiment, the first outer portion 6eR1 and the second conductive member CD2 are joined by welding such as laser welding performed in the second through hole 6RH2. However, the first outer portion 6eR1 and the second conductive member CD2 may be joined by solder, a conductive adhesive, or the like.

[0052] The second outer portion 6eR2 has a third through hole 6RH3 through which a round protruding portion 18T (see FIG. 3(B)) formed on the third fixed-side pedestal portion 18D3 protruding upward is inserted. In this embodiment, the second outer portion 6eR2 and the protruding portion 18T are joined by hot crimping or cold crimping the protruding portion 18T. However, the second outer portion 6eR2 and the protruding portion 18T may also be joined by an adhesive.

[0053] The inner portion 6iR is formed with a fourth through hole 6RH4 and a fifth through hole 6RH5, through which a round protruding portion 2T (see FIG. 3(A)) formed on the second movable-side pedestal portion 12D2 protruding upward is inserted. In this embodiment, the inner portion 6iR and the protruding portion 2T are fixed to each other by hot crimping or cold crimping the protruding portion 2T. However, the inner portion 6iR and the protruding portion 2T may also be fixed to each other by an adhesive.

[0054] As shown in Fig. 7(B), the left leaf spring 6L and the right leaf spring 6R have approximately the same shape. Specifically, the left leaf spring 6L and the right leaf spring 6R are configured to have two-fold rotational symmetry with respect to the optical axis JD. Therefore, this configuration can reduce the number of parts of the camera module driving device 101. Furthermore, the left leaf spring 6L and the right leaf spring 6R can support the module holder 2 in a well-balanced manner. Furthermore, the leaf spring 6 can suppress adverse effects on the weight balance of the movable member MB supported by the four shape memory alloy wires SA (first wire SA1 to fourth wire SA4).

[0055] The right end center portion RC of the inner portion 6iR of the right leaf spring 6R is joined perpendicularly to the connection portion CTR of the second movable terminal plate 5M2 by solder or conductive adhesive as shown in Fig. 7(A). That is, the right end center portion RC and the connection portion CTR are joined in a state where their surfaces are substantially perpendicular to each other. Similarly, the left end center portion LC of the inner portion 6iL of the left leaf spring 6L is joined perpendicularly to the connection portion CTL of the first movable terminal plate 5M1 by solder or conductive adhesive as shown in Fig. 7(A).

[0056] 7(A), the first connection portion CN1 of the first fixed side terminal plate 5F1 is connected to the first conductive pattern PT1 by solder or conductive adhesive, and the second connection portion CN2 of the second fixed side terminal plate 5F2 is connected to the second conductive pattern PT2 by solder or conductive adhesive. Similarly, the third connection portion CN3 of the third fixed side terminal plate 5F3 is connected to the third conductive pattern PT3 by solder or conductive adhesive, and the fourth connection portion CN4 of the fourth fixed side terminal plate 5F4 is connected to the fourth conductive pattern PT4 by solder or conductive adhesive. Similarly, the first terminal portion TM1 of the first conductive member CD1 is connected to the fifth conductive pattern PT5 by solder or conductive adhesive, and the second terminal portion TM2 of the second conductive member CD2 is connected to the sixth conductive pattern PT6 by solder or conductive adhesive.

[0057] Next, the path of the current flowing through the shape memory alloy wire SA will be described with reference to Fig. 8. Fig. 8 is a perspective view of a portion of the configuration shown in Fig. 7(A). In Fig. 8, for clarity, a coarse dot pattern is applied to the second conductive member CD2, a fine dot pattern is applied to the right leaf spring 6R, and a cross pattern is applied to the metal member 5 (the second movable side terminal plate 5M2, the third fixed side terminal plate 5F3, and the fourth fixed side terminal plate 5F4).

[0058] Specifically, Fig. 8(A) shows the path of the current when the second terminal portion TM2 of the second conductive member CD2 is connected to a high potential and the third connection portion CN3 of the third fixed-side terminal plate 5F3 is connected to a low potential, and Fig. 8(B) shows the path of the current when the second terminal portion TM2 of the second conductive member CD2 is connected to a high potential and the fourth connection portion CN4 of the fourth fixed-side terminal plate 5F4 is connected to a low potential. The following description relates to the path of the current flowing through the third wire SA3 or the fourth wire SA4, but may be similarly applied to the path of the current flowing through the first wire SA1 or the second wire SA2.

[0059] When the second terminal TM2 of the second conductive member CD2 is connected to a high potential and the third connection CN3 of the third fixed terminal plate 5F3 is connected to a low potential, a current flows from the second terminal TM2 through the second conductive member CD2 to the right leaf spring 6R as shown by the arrows AR1 and AR2 in Fig. 8(A). The current then flows through the right leaf spring 6R as shown by the arrow AR3, through the second movable terminal plate 5M2 as shown by the arrow AR4, and through the third wire SA3 as shown by the arrow AR5. The current then flows through the third fixed terminal plate 5F3 to the third connection CN3 as shown by the arrows AR6 and AR7.

[0060] When the second terminal TM2 of the second conductive member CD2 is connected to a high potential and the fourth connection CN4 of the fourth fixed terminal plate 5F4 is connected to a low potential, a current flows from the second terminal TM2 through the second conductive member CD2 to the right leaf spring 6R as shown by arrows AR11 and AR12 in Fig. 8(B). The current then flows through the right leaf spring 6R as shown by arrow AR13, through the second movable terminal plate 5M2 as shown by arrow AR14, and through the fourth wire SA4 as shown by arrow AR15. The current then flows through the fourth fixed terminal plate 5F4 to the fourth connection CN4 as shown by arrows AR16 and AR17.

[0061] In the example shown in Figure 8, when the third connection portion CN3 of the third fixed side terminal plate 5F3 is connected to a low potential and when the fourth connection portion CN4 of the fourth fixed side terminal plate 5F4 is connected to a low potential, the path of the current flowing from the second terminal portion TM2 of the second conductive member CD2 to the right side leaf spring 6R is the same.

[0062] The above-described camera module driving device 101 is controlled by a control device. The control device is typically a device that is installed outside the camera module driving device 101, and is connected to the camera module driving device 101 via a flexible cable 3.

[0063] The control device can control the contraction of each of the first wire SA1 to the fourth wire SA4 by controlling the voltages applied to the first terminal TM1, the second terminal TM2, and the first connection portion CN1 to the fourth connection portion CN4, respectively. Alternatively, the control device can control the contraction of each of the first wire SA1 to the fourth wire SA4 by controlling the currents supplied to each of the first wire SA1 to the fourth wire SA4 via the first terminal TM1, the second terminal TM2, and the first connection portion CN1 to the fourth connection portion CN4. The control device can swing the module holder 2 by using the driving force caused by the contraction of the shape memory alloy wire SA as the driving mechanism DM, for example. The control device can realize a camera shake correction function, which is one of the lens adjustment functions, by swinging the module holder 2.

[0064] Next, a configuration for swinging the module holder 2 will be described with reference to FIG. 9. FIG. 9 is a diagram showing a configuration example of the lower holder 2D assembled to the support 18. Specifically, FIG. 9(A) is a top view of the lower holder 2D and the support 18. FIG. 9(B) is a vertical cross-sectional view of the lower holder 2D and the support 18 when the cross section of the lower holder 2D and the support 18 in a virtual plane parallel to the XZ plane including the dashed line L1 shown in FIG. 9(A) is viewed from the Y2 side. FIG. 9(C) is a vertical cross-sectional view of the lower holder 2D and the support 18 in a virtual plane parallel to the YZ plane including the dashed line L2 shown in FIG. 9(A) is viewed from the X1 side. Note that in FIG. 9, for clarity, a coarse dot pattern is applied to the support 18, and a fine dot pattern is applied to the lower holder 2D.

[0065] As shown in FIG. 9, a convex portion 2P that protrudes downward is formed in the center of the lower surface of the bottom plate portion 2B of the lower holding body 2D. In the example shown in FIG. 9, the convex portion 2P has a hemispherical shape and is received in a downwardly recessed recess 18R (see FIG. 6) that is formed in the center of the upper surface of the bottom wall portion 18B of the support body 18. The convex portion 2P of the lower holding body 2D and the recess 18R of the support body 18 form a swing support portion SB. The recess 18R is configured to have a hemispherical inner surface so as to fit the hemispherical convex portion 2P, but may be configured to have a conical or mortar-shaped inner surface. The convex portion 2P and the recess 18R are configured to have surface contact or line contact, but may also be configured to have point contact.

[0066] The swing support part SB is a structure for supporting the movable member MB so that it can swing. In the example shown in FIG. 9, the swing support part SB is composed of a convex part 2P formed on the lower surface of the bottom plate part 2B of the lower holding body 2D and a concave part 18R formed on the upper surface of the bottom wall part 18B of the support body 18, but it may be composed of an upwardly recessed concave part formed on the lower surface of the bottom plate part 2B of the lower holding body 2D and an upwardly protruding convex part formed on the upper surface of the bottom wall part 18B of the support body 18. Alternatively, the swing support part SB may be composed of a ball. Specifically, the swing support part SB may be composed of an upwardly recessed concave part formed on the lower surface of the bottom plate part 2B of the lower holding body 2D, a downwardly recessed concave part formed on the upper surface of the bottom wall part 18B of the support body 18, and a ball disposed between the two concave parts.

[0067] Next, with reference to Fig. 10, the state of the module holder 2 and the support body 18 when the module holder 2 is swung will be described. Fig. 10 is a front view of the module holder 2 and the support body 18. Specifically, Fig. 10(A) is a front view of the module holder 2 and the support body 18 when the camera module driving device 101 is in the initial state. Fig. 10(B) is a front view of the module holder 2 and the support body 18 when the module holder 2 is swung counterclockwise by angle θ when viewed from the front about the first swing axis AX1 (see Fig. 2).

[0068] The initial state of the camera module driving device 101 refers to the state of the camera module driving device 101 when no current is supplied to the shape memory alloy wire SA that constitutes the driving mechanism DM.

[0069] 10(B) is realized, for example, when currents of the same magnitude are simultaneously supplied to the first wire SA1 and the second wire SA2 arranged on the left side (Y1 side) of the module holder 2. At this time, the convex portion 2P formed on the lower holder 2D slides on the concave portion 18R formed on the support body 18.

[0070] Next, with reference to FIG. 11, the arrangement of members for detecting the swinging state of the module holder 2 will be described. FIG. 11 is a diagram showing an example of the arrangement of members for detecting the swinging state of the module holder 2. Specifically, FIG. 11(A) is an upper perspective view of the module holder 2 (upper holder 2U) to which the magnet 7 is attached. FIG. 11(B) is a top view of the support 18 in which a through hole 18H for accommodating the magnetic sensor 8 is formed. FIG. 11(C) is a front view of the module holder 2 (upper holder 2U) to which the magnet 7 is attached and the magnetic sensor 8. Note that in FIG. 11, for clarity, a coarse cross pattern is applied to the magnet 7, and a fine cross pattern is applied to the magnetic sensor 8. Also, in FIG. 11(C), the positional relationship between the magnet 7 and the magnetic sensor 8 when the camera module driving device 101 is in the initial state is shown, and for clarity, the support 18 is omitted from the illustration.

[0071] The swinging state of the module holder 2 is detected by utilizing a magnet 7 attached to the module holder 2 (upper holder 2U) and a magnetic sensor 8 attached to an insulating substrate 17 as shown in FIG.

[0072] The magnets 7 are permanent magnets magnetized with two poles in the Z-axis direction, and include a first magnet 7A to a fourth magnet 7D.

[0073] The magnetic sensor 8 is configured to detect the position of the movable member MB by detecting the position of the magnet 7. In this embodiment, the magnetic sensor 8 is configured to detect the position of the movable member MB by using a Hall element. However, the magnetic sensor 8 may be configured to detect the position of the movable member MB by using a magnetic resistance element such as a Giant Magneto Resistive effect (GMR) element, a Semiconductor Magneto Resistive (SMR) element, an Anisotropic Magneto Resistive (AMR) element, or a Tunnel Magneto Resistive (TMR) element that can detect the magnetic field generated by the magnet 7.

[0074] Specifically, the magnetic sensor 8 includes a first magnetic sensor 8A capable of detecting a magnetic field generated by the first magnet 7A, a second magnetic sensor 8B capable of detecting a magnetic field generated by the second magnet 7B, a third magnetic sensor 8C capable of detecting a magnetic field generated by the third magnet 7C, and a fourth magnetic sensor 8D capable of detecting a magnetic field generated by the fourth magnet 7D.

[0075] The magnetic sensor 8 is attached to the insulating substrate 17 so as to be housed in a through hole 18H formed in the support 18, and is configured so as to be able to detect the state of the module holder 2 which oscillates around the oscillation axis AX.

[0076] More specifically, the first magnetic sensor 8A is attached to the insulating substrate 17 so as to be accommodated in the first through hole 18HA formed in the support 18, the second magnetic sensor 8B is attached to the insulating substrate 17 so as to be accommodated in the second through hole 18HB formed in the support 18, the third magnetic sensor 8C is attached to the insulating substrate 17 so as to be accommodated in the third through hole 18HC formed in the support 18, and the fourth magnetic sensor 8D is attached to the insulating substrate 17 so as to be accommodated in the fourth through hole 18HD formed in the support 18.

[0077] It should be noted that two of the four magnetic sensors 8 may be omitted. That is, the swinging state of the module holder 2 may be detected using two magnets 7 and two magnetic sensors 8. For example, the third magnetic sensor 8C and the fourth magnetic sensor 8D may be omitted. That is, the swinging state of the module holder 2 may be detected using the first magnet 7A, the second magnet 7B, and the first magnetic sensor 8A and the second magnetic sensor 8B.

[0078] Next, the arrangement of the flexible cable 3 will be described with reference to Fig. 12. Fig. 12 is a diagram showing an example of the arrangement of the flexible cable 3. Specifically, Fig. 12(A) is a perspective view of the flexible cable 3, the cover member 4, and the insulating substrate 17. Fig. 12(B) is a longitudinal sectional view of the imaging device ID when the cross section of the imaging device ID in a virtual plane parallel to the XZ plane including the dashed dotted line L3 shown in Fig. 1 is viewed from the Y2 side.

[0079] 12(A), the cover member 4 is provided with an extension portion EG extending in a direction (Y-axis direction) intersecting with the extension direction (X-axis direction) of the flexible cable 3. Specifically, the extension portion EG is provided so as to form a central portion of a first side portion 4E1 of the upper cover member 4U. The upper surface of the extension portion EG facing the lower surface of the flexible cable 3 is formed in a curved shape so that the central portion is curved and higher. The extension portion EG is also configured so that the height of its upper surface is lower than the upper surfaces of the other sides (the second side portion 4E2 to the fourth side portion 4E4).

[0080] Compared to a case where the extension portion EG is not provided (where the first side portion 4E1 has the same configuration as the other sides), this configuration has the effect of preventing the flexible cable 3 from acting as resistance when the module holder 2 swings about the first oscillation axis AX1 parallel to the X-axis. This is because the curvature of the extension portion EG prevents the first side portion 4E1 from interfering with the swing of the flexible cable 3 about the first oscillation axis AX1.

[0081] As shown in Fig. 12(B), a space SP is formed between the camera module CM and the module holder 2. The flexible cable 3 passes through the space SP in a slack state and is disposed so as to extend to the outside of the housing HS while facing the center of the extension part EG so as to be able to abut against it. Note that in Fig. 12(B), for clarity, a dot pattern is applied to the space inside the housing HS, including the space SP.

[0082] The front side edge 12E (see FIG. 4(A)) of the tubular portion 12 of the upper holding body 2U is configured so that the height of its upper end is lower than the upper ends of the other sides. Also, as shown in FIG. 12(B), the front side edge 12E is configured to have an inclined surface portion SF on the inside portion.

[0083] Compared with a case in which the front side portion 12E has the same configuration as the other sides, this configuration has the effect of suppressing the flexible cable 3 from acting as resistance when the module holding body 2 swings about the second oscillation axis AX2 parallel to the Y axis. This is because the configuration of the front side portion 12E can suppress the tubular portion 12 of the upper holding body 2U from interfering with the swing of the flexible cable 3 about the second oscillation axis AX2.

[0084] Next, an imaging device IDA, which is another configuration example of the imaging device ID, will be described with reference to Figs. 13 and 14. Fig. 13 is a perspective view of the imaging device IDA. Specifically, Fig. 13(A) is an upper perspective view of the imaging device IDA in a state in which a camera module CM is attached to a camera module driving device 101A, and Fig. 13(B) is an upper perspective view of the imaging device IDA in a state in which the camera module CM is removed from the camera module driving device 101A. The camera module driving device 101A is another configuration example of the camera module driving device 101. Fig. 14 is an exploded perspective view of the camera module driving device 101A.

[0085] The imaging device IDA differs from the imaging device ID having the flexible cable 3 mainly in that the imaging device IDA has a first flexible cable 30 and a second flexible cable 50.

[0086] The first flexible cable 30 is a flexible cable having a conductive pattern formed thereon and connected to a substrate CB on which an imaging element IS of a camera module CM is mounted, and has a front portion 30F and an upper portion 30U. The first flexible cable 30 may be formed integrally with the substrate CB.

[0087] Both the front part 30F and the upper part 30U are attached to a cover member 40 that constitutes a housing of the lens driving device LD. In the example shown in Fig. 13, both the front part 30F and the upper part 30U are attached to the cover member 40 by an adhesive.

[0088] Specifically, as shown in FIG. 13B, the cover member 40 has a rectangular cylindrical outer peripheral wall portion 40A and a flat rectangular annular top plate portion 40T provided so as to be continuous with the upper end (the end on the Z1 side) of the outer peripheral wall portion 40A. The outer peripheral wall portion 40A includes a first side plate portion 40A1 to a fourth side plate portion 40A4. The first side plate portion 40A1 and the third side plate portion 40A3 face each other, and the second side plate portion 40A2 and the fourth side plate portion 40A4 face each other. The first side plate portion 40A1 and the third side plate portion 40A3 extend perpendicularly to the second side plate portion 40A2 and the fourth side plate portion 40A4. The front portion 30F is attached to the first side plate portion 40A1 of the cover member 40, and the upper portion 30U is attached to the top plate portion 40T of the cover member 40.

[0089] The second flexible cable 50 is a flexible cable on which conductive patterns are formed for connecting each of the insulating substrate 17 and the first flexible cable 30 to various external devices. In the example shown in FIG. 13, the second flexible cable 50 has an inner part 50i connected to the camera module CM with the first flexible cable 30 sandwiched therebetween, an outer part 50e fixed to the housing HS, and four connecting parts 50g connecting the inner part 50i and the outer part 50e. The conductive pattern formed on the first flexible cable 30 and the corresponding conductive pattern formed on the second flexible cable 50 are conductively connected at the inner part 50i. The conductive pattern formed on the insulating substrate 17 and the corresponding conductive pattern formed on the second flexible cable 50 are conductively connected at the outer part 50e.

[0090] 13(A), the inner portion 50i has a generally rectangular frame shape corresponding to the shape of the top plate portion 40T of the cover member 40, and includes a first side portion 50i1 to a fourth side portion 50i4. The outer portion 50e has a generally rectangular frame shape corresponding to the shape of the upper end portion of the cover member 4, and includes a first side portion 50e1 to a fourth side portion 50e4. The four connecting portions 50g include a first connecting portion 50g1 to a fourth connecting portion 50g4.

[0091] Each of the four connecting portions 50g is provided between the inner portion 50i and the outer portion 50e such that the position of the inner connecting portion IC as a first connecting portion connecting the inner portion 50i and one end of the connecting portion 50g and the position of the outer connecting portion EC as a second connecting portion connecting the other end of the connecting portion 50g and the outer portion 50e are shifted by approximately 90 degrees around the optical axis JD.

[0092] Specifically, the first outer connection portion EC1 of the first connecting portion 50g1 is disposed at the center of the first side portion 50e1 of the outer portion 50e, and the first inner connection portion IC1 of the first connecting portion 50g1 is disposed at the center of the second side portion 50i2 of the inner portion 50i. The second outer connection portion EC2 of the second connecting portion 50g2 is disposed at the center of the second side portion 50e2, and the second inner connection portion IC2 of the second connecting portion 50g2 is disposed at the center of the third side portion 50i3. The third outer connection portion EC3 of the third connecting portion 50g3 is disposed at the center of the third side portion 50e3, and the third inner connection portion IC3 of the third connecting portion 50g3 is disposed at the center of the fourth side portion 50i4. The fourth outer connection portion EC4 of the fourth coupling portion 50g4 is disposed in the central portion of the fourth side portion 50e4, and the fourth inner connection portion IC4 of the fourth coupling portion 50g4 is disposed in the central portion of the first side portion 50i1.

[0093] The camera module driving device 101A differs from the camera module driving device 101 in that the cover member 4 includes a top plate portion 4T (see FIG. 14) and does not have a bottom plate portion 4B, i.e., in that the cover member 4 is composed of two members, an upper cover member 4U and a lower cover member 4D, in that the cover member 4 includes a top plate portion 4T (see FIG. 14) and does not have a bottom plate portion 4B, i.e., in that the cover member 4 is composed of a single member. In the camera module driving device 101A, the cover member 4 is fixed to the support body 18 with an adhesive. At this time, the lower surface of the bottom wall portion 18B of the support body 18 is located at approximately the same height as the lower (Z2 side) open end of the outer peripheral wall portion 4A of the cover member 4. In other words, the bottom wall portion 18B also serves as the bottom plate portion of the housing HS.

[0094] 14, the top plate portion 4T is a flat portion provided so as to be continuous with the upper end (the end on the Z1 side) of the outer peripheral wall portion 4A. The top plate portion 4T has a substantially rectangular outline in a top view, and has an opening 4Q in the center. Specifically, the top plate portion 4T has four sides 4F (a first side 4F1 to a fourth side 4F4) arranged so as to surround the opening 4Q.

[0095] Furthermore, camera module driving device 101A differs from camera module driving device 101 in that the conductive pattern formed on insulating substrate 17 is configured to be directly connected to leaf spring 6 functioning as a conductive path, i.e., conductive member CD is not embedded in support body 18, in that camera module driving device 101A differs from camera module driving device 101 in that the conductive member CD connected to leaf spring 6 functioning as a conductive path is embedded in support body 18.

[0096] In the example shown in FIG. 14, insulating substrate 17 has a rear surface portion 17B, a lower surface portion 17D, a front surface portion 17F, and an upper surface portion 17U.

[0097] The lower surface portion 17D is a portion extending along the lower surface of the bottom wall portion 18B of the support body 18. A first conductive pattern PT1 to a fourth conductive pattern PT4 are formed on the upper surface (the surface on the Z1 side) of the lower surface portion 17D.

[0098] The rear surface portion 17B is a portion that extends upward from the rear end of the lower surface portion 17D along the rear surface (X2 side surface) of the support 18. That is, the rear surface portion 17B is a portion that extends upward from the rear end of the lower surface portion 17D along the inner surface (X1 side surface) of the third side plate portion 4A3 of the cover member 4. A fifth conductive pattern PT5 and a sixth conductive pattern PT6 are formed on the inner surface (X1 side surface) of the rear surface portion 17B. In addition, the two long holes formed in the rear surface portion 17B are formed so that an adhesive used for bonding the rear surface portion 17B and the rear surface (X2 side surface) of the support 18 can be applied.

[0099] The front surface portion 17F is a portion that extends upward from the front end portion of the lower surface portion 17D along the front surface (X1 side surface) of the support body 18. In other words, the front surface portion 17F is a portion that extends upward from the front end portion of the lower surface portion 17D along the outer surface (X1 side surface) of the first side plate portion 4A1 of the cover member 4.

[0100] The upper surface portion 17U is a portion attached to the upper surface of the first side portion 4F1 of the top plate portion 4T of the cover member 4. In the example shown in Fig. 14, the upper surface portion 17U extends inward (in the X2 direction) from the upper end portion of the front surface portion 17F along the upper surface of the first side portion 4F1 and is fixed to the upper surface of the first side portion 4F1 by an adhesive. A conductive pattern for connection (not shown) formed on the upper surface of the upper surface portion 17U is connected to a corresponding conductive pattern for connection (not shown) formed on the lower surface of the outer portion 50e (first side portion 50e1) of the second flexible cable 50.

[0101] FIG. 15 is a diagram showing the positional relationship of the metal member 5, the leaf spring 6, the insulating substrate 17, and the shape memory alloy wire SA that constitute the camera module driving device 101A, and corresponds to FIG.

[0102] 15 differs from the example shown in Fig. 7 in that the outer portion 6eL (second outer portion 6eL2) of the left leaf spring 6L is connected to the fifth conductive pattern PT5 formed on the rear surface portion 17B of the insulating substrate 17. In the example shown in Fig. 7, the outer portion 6eL (first outer portion 6eL1) of the left leaf spring 6L is connected to the fifth conductive pattern PT5 formed on the lower surface portion 17D of the insulating substrate 17 via a first conductive member CD1 embedded in the support 18.

[0103] 15 differs from the example shown in Fig. 7 in that an outer portion 6eR (second outer portion 6eR2) of the right leaf spring 6R is connected to a sixth conductive pattern PT6 formed on a rear surface portion 17B of the insulating substrate 17. In the example shown in Fig. 7, the outer portion 6eR (first outer portion 6eL1) of the right leaf spring 6R is connected to the sixth conductive pattern PT6 formed on a lower surface portion 17D of the insulating substrate 17 via a second conductive member CD2 embedded in the support body 18.

[0104] FIG. 16 is a diagram showing an example of the arrangement of members for detecting the swing state of the module holder 2 constituting the camera module driving device 101A, and corresponds to FIG. 11. Specifically, FIG. 16(A) is an upper perspective view of the module holder 2 (upper holder 2U) to which the magnet 7 is attached. FIG. 16(B) is an upper perspective view of the support 18 in which a through hole 18H for accommodating the magnetic sensor 8 is formed. FIG. 16(C) is an upper perspective view of the module holder 2 (upper holder 2U) to which the magnet 7 is attached, and the magnetic sensor 8. FIG. 16(D) is a right side view of the module holder 2 (upper holder 2U) to which the magnet 7 is attached, and the magnetic sensor 8. Note that in FIG. 16, for clarity, a coarse cross pattern is applied to the magnet 7, and a fine cross pattern is applied to the magnetic sensor 8. Also, Figures 16(C) and 16(D) show the positional relationship between the magnet 7 and the magnetic sensor 8 when the camera module driving device 101A is in the initial state, and for clarity, the support 18 is omitted from the illustration.

[0105] The swinging state of the module holder 2 is detected by utilizing a magnet 7 attached to the module holder 2 (upper holder 2U) and a magnetic sensor 8 attached to an insulating substrate 17 as shown in FIG.

[0106] The magnets 7 are permanent magnets magnetized with two poles in the Z-axis direction, and include a first magnet 7A to a fourth magnet 7D.

[0107] The magnetic sensor 8 is configured to be able to detect the position of the movable member MB by detecting the position of the magnet 7. In this embodiment, the magnetic sensor 8 is configured to be able to detect the position of the movable member MB by utilizing a Hall element. However, the magnetic sensor 8 may also be configured to be able to detect the position of the movable member MB by utilizing a magnetic resistance element.

[0108] Specifically, the magnetic sensors 8 include a left magnetic sensor 8L capable of detecting the magnetic field generated by the third magnet 7C, and a right magnetic sensor 8R capable of detecting the magnetic field generated by the fourth magnet 7D.

[0109] The magnetic sensor 8 is attached to the insulating substrate 17 so as to be housed in a through hole 18H formed in the support 18, and is configured so as to be able to detect the state of the module holder 2 which oscillates around the oscillation axis AX.

[0110] Specifically, the left magnetic sensor 8L is attached to the insulating substrate 17 so as to be accommodated in the left through hole 18HL formed in the support 18, and the right magnetic sensor 8R is attached to the insulating substrate 17 so as to be accommodated in the right through hole 18HR formed in the support 18.

[0111] 16, the first magnet 7A and the second magnet 7B are not used to detect the position of the movable member MB, but are used to balance the weight of the movable member MB. However, a magnetic sensor capable of detecting the magnetic field generated by the first magnet 7A may be attached to the insulating substrate 17, or a magnetic sensor capable of detecting the magnetic field generated by the second magnet 7B may be attached to the insulating substrate 17. In other words, the swing state of the module holder 2 may be detected using three or more magnets 7 and three or more magnetic sensors 8.

[0112] As described above, the camera module driving device 101 according to the embodiment of the present invention includes a movable side member MB including a module holder 2 capable of holding a camera module CM having a lens body LS and an image sensor IS, a fixed side member FB including a support 18 that supports the module holder 2 so as to be able to swing, and a driving mechanism DM that swings the module holder 2 relative to the support 18 so that the optical axis JD of the lens body LS is inclined. The driving mechanism DM includes a plurality of shape memory alloy wires SA provided between the fixed side member FB and the movable side member MB. The shape memory alloy wires SA are arranged such that the height position in the optical axis direction of one end fixed to the fixed side member FB is different from the height position in the optical axis direction of the other end fixed to the movable side member MB.

[0113] In the example shown in Fig. 5, the third wire SA3, which is one of the shape memory alloy wires SA, is arranged so that the height position H2 of one end in the optical axis direction (Z-axis direction) differs from the height position H3 of the other end in the optical axis direction by ΔH. One end of the third wire SA3 is fixed to the third fixed side terminal plate 5F3 as the fixed side member FB, and the other end of the third wire SA3 is fixed to the second movable side terminal plate 5M2 as the movable side member MB. The height positions H2 and H3 are, for example, heights relative to the bottom plate portion 4B of the lower cover member 4D.

[0114] This configuration does not use a magnet to swing the movable member MB, so even if another voice coil motor type camera module equipped with a magnet and a coil is placed adjacent, it has the effect of suppressing magnetic interference with the other camera module. Also, because this configuration does not use a magnet or a coil, it is possible to reduce the size of the camera module driving device 101.

[0115] The driving mechanism DM may be configured to have a plurality of wire pairs each consisting of two shape memory alloy wires SA arranged to cross each other three-dimensionally in a non-contact state. Specifically, the driving mechanism DM may be configured to have two wire pairs each consisting of a third wire SA3 and a fourth wire SA4 arranged to cross each other in a non-contact state when viewed from the right side as shown in Fig. 5. In the example shown in Fig. 2, the other of the two wire pairs is a wire pair each consisting of a first wire SA1 and a second wire SA2 arranged to cross each other in a non-contact state when viewed from the left side.

[0116] In this case, one wire pair and the other wire pair may be arranged to face each other across the module holder 2. In the example shown in Fig. 2, the first wire pair consisting of the first wire SA1 and the second wire SA2 is arranged on the left side surface (the surface on the Y1 side) of the module holder 2, and the second wire pair consisting of the third wire SA3 and the fourth wire SA4 is arranged on the right side surface (the surface on the Y2 side) of the module holder 2.

[0117] This configuration can reduce the number of sides on which the wire pairs are arranged among the four sides constituting the module holder 2. In other words, the shape memory alloy wire SA does not need to be arranged so as to face all of the four sides constituting the module holder 2.

[0118] In the example shown in FIG. 2, the two wire pairs are arranged to face each other with the module holder 2 in between. This arrangement provides the effect that the module holder 2 can be swung in a well-balanced manner around the first oscillation axis AX1 and the second oscillation axis AX2. This arrangement also provides the effect that the second wire pair can be extended by contracting the first wire pair, that is, the contracted shape memory alloy wire SA can be easily restored to its original length. However, the two wire pairs may be arranged on two orthogonal surfaces among the four side surfaces constituting the module holder 2. The two orthogonal surfaces are, for example, the left side surface (Y1 side surface) and the rear side surface (X2 side surface) of the module holder 2.

[0119] The camera module driving device 101 may be configured to have a swing support part SB between the module holder 2 and the support body 18. In this case, the module holder 2 may be biased toward the swing support part SB by a leaf spring 6 provided between the movable member MB and the fixed member FB.

[0120] Specifically, the camera module driving device 101 may be configured to have a swing support part SB between a center part of a lower holding body 2D constituting the module holding body 2 as viewed from the optical axis direction and a center part of the support body 18 as viewed from the optical axis direction, as shown in Fig. 9. In this case, the module holding body 2 may be biased toward the swing support part SB side (Z2 side) by a leaf spring 6 fixed to the movable side member MB (upper holding body 2U) and the fixed side member FB (support body 18) so that the height of the inner part 6iR is higher than the heights of the first outer part 6eR1 and the second outer part 6eR2 by a height H1, as shown in Fig. 3(C).

[0121] With this configuration, the leaf spring 6 can bias the module holder 2 toward the swing support part SB regardless of the posture of the camera module driving device 101.

[0122] As shown in Figure 9 (B), the swaying support portion SB may be composed of a curved convex portion 2P having a hemispherical shape protruding downward from the lower surface of the module holder 2, and a concave portion 18R formed on the upper surface of the support body 18 for slidably receiving the convex portion 2P.

[0123] This configuration brings about the effect that the height dimension of the swing support part SB, and therefore the height dimension of the camera module driving device 101, can be made smaller than when balls are used as components of the swing support part SB.

[0124] 2, the module holder 2 may be configured to have a lower holder 2D made of magnetic metal as a case member capable of housing at least a part of the camera module CM, and an upper holder 2U as a mounting member made of synthetic resin and fixed to the lower holder 2D. In this case, the leaf spring 6 is attached to the upper holder 2U.

[0125] This configuration can suppress the magnetic field of the magnet from affecting the outside even if the camera module CM includes a voice coil motor having a magnet and a coil. For example, this configuration can suppress the magnetic field of the magnet from affecting the magnetic sensor 8. This configuration also has the effect of suppressing the image sensor IS arranged at the bottom of the camera module CM from being subjected to electromagnetic noise from the outside.

[0126] The leaf spring 6 may have an outer portion as a fixed-side support portion fixed to the fixed-side member FB, an inner portion as a movable-side support portion fixed to the module holder 2, and an elastic arm portion provided between the outer portion and the inner portion. In this case, the support 18 may be formed of synthetic resin and may have a fixed-side metal member 5F as a first metal member to which one end of the shape memory alloy wire SA is fixed. The module holder 2 may have a movable-side metal member 5M as a second metal member to which the other end of the shape memory alloy wire SA is fixed. The leaf spring 6 may be formed of a conductive metal and connected to the movable-side metal member 5M.

[0127] This configuration has the advantage that the leaf spring 6 can be used as a conductive path leading to the shape memory alloy wire SA, making it easier to pass electricity through the shape memory alloy wire SA.

[0128] 6(C), the support 18 may have a bottom wall portion 18B disposed on the insulating substrate 17 and a fixed-side pedestal portion 18D as an extension portion extending upward from an edge portion of the bottom wall portion 18B. A metallic conductive member CD may be embedded in the fixed-side pedestal portion 18D. A part of the conductive member CD (the first bonding surface portion CP1 and the second bonding surface portion CP2) may be exposed on the upper surface of the fixed-side pedestal portion 18D, and another part (the first terminal portion TM1 and the second terminal portion TM2) may be exposed from the bottom wall portion 18B. A portion of the conductive member CD (the first bonding surface portion CP1 and the second bonding surface portion CP2) may be connected to the outer portion of the leaf spring 6 (the first outer portion 6eL1 and the first outer portion 6eR1) as shown in FIG. 7(B), and another portion of the conductive member CD (the first terminal portion TM1 and the second terminal portion TM2) may be connected to a conductive pattern (the fifth conductive pattern PT5 and the sixth conductive pattern PT6) formed on the insulating substrate 17 as shown in FIG. 7(A).

[0129] This configuration has the effect of enabling the conductive member CD to electrically connect the leaf spring 6, which is located at a relatively high position, and the conductive pattern formed on the insulating substrate 17.

[0130] As shown in FIG. 14, the camera module driving device 101A may have an insulating substrate 17 on which the first conductive pattern PT1 to the sixth conductive pattern PT6 are formed. In this case, the support 18 may have a bottom wall portion 18B and a fixed-side pedestal portion 18D as an extension portion extending upward from the edge of the bottom wall portion 18B. The insulating substrate 17 may have a lower surface portion 17D as a first surface portion facing the lower surface of the bottom wall portion 18B, and a rear surface portion 17B as a second surface portion facing the fixed-side pedestal portion 18D. The rear surface portion 17B is a portion bent from the lower surface portion 17D and extending upward. As shown in FIG. 15, a fixed-side metal member 5F as a first metal member may be connected to the conductive patterns (the first conductive pattern PT1 to the fourth conductive pattern PT4) formed on the lower surface portion 17D. In addition, the outer portions (second outer portion 6eL2 and second outer portion 6eR2) of the leaf spring 6 may be fixed to the upper surface of the fixed side base portion 18D and connected to conductive patterns (fifth conductive pattern PT5 and sixth conductive pattern PT6) formed on the rear surface portion 17B.

[0131] This configuration brings about the effect that the fixed metal member 5F and the movable metal member 5M (leaf spring 6) can be electrically connected to the corresponding conductive patterns formed on the same insulating substrate 17 with good space efficiency.

[0132] At least two magnets 7 may be fixed to the module holder 2 at different positions. At least two magnetic sensors 8 for detecting the magnetic fields of the at least two magnets 7 may be provided on the fixed-side member FB. In the above-described embodiment, four magnets 7 (first magnet 7A to fourth magnet 7D) are fixed to the module holder 2 as shown in FIG. 11(A). Furthermore, four magnetic sensors 8 (first magnetic sensor 8A to fourth magnetic sensor 8D) for detecting the magnetic fields of the four magnets 7 (first magnet 7A to fourth magnet 7D) are provided on the insulating substrate 17 as the fixed-side member FB.

[0133] This configuration brings about the effect that the current flowing through the shape memory alloy wire SA can be appropriately feedback-controlled in accordance with the position (posture) of the module holder 2 detected by at least two magnetic sensors 8.

[0134] In addition, the imaging device ID according to an embodiment of the present invention may have a camera module driving device 101, a camera module CM fixed to a module holder 2, and a flexible cable 3 having a conductive pattern formed thereon and connected to the imaging element IS of the camera module CM, as shown in FIG. 1(B).

[0135] This configuration does not use magnets to swing the camera module CM, and therefore has the advantage that magnetic interference with another camera module that uses a voice coil motor and has a magnet and a coil can be suppressed even if the other camera module is placed adjacent to the camera module.

[0136] In this configuration, the fixed member FB may have an upper cover member 4U as a frame-shaped cover member arranged above the module holder 2, as shown in FIG. 12(A). The upper cover member 4U may be provided with an extension part EG extending in a direction intersecting with the extension direction of the flexible cable 3. In this case, the upper surface of the extension part EG facing the flexible cable 3 may be curved so that the central part is higher. In addition, a space SP may be formed between the camera module CM and the module holder 2, as shown in FIG. 12(B). In this case, the flexible cable 3 drawn out from the camera module CM may pass through the space SP in a slack state and may be arranged to extend to the outside of the housing HS including the upper cover member 4U, facing the central part of the extension part EG so as to be able to abut against it.

[0137] This configuration brings about the effect of preventing the flexible cable 3 from acting as a resistance when the camera module CM is swung.

[0138] As shown in FIG. 13(B), the camera module driving device 101A may be configured to have a housing HS (cover member 4) with an opening formed on the upper surface. In this configuration, the imaging device IDA may have another flexible cable (second flexible cable 50) that is fixed to the upper surface of the camera module CM arranged in the housing HS and the upper surface of the housing HS and is connected to the flexible cable (first flexible cable 30). In this case, as shown in FIG. 13(A), the second flexible cable 50 may have an inner part 50i that is fixed to the camera module CM and connected to the first flexible cable 30, an outer part 50e that is fixed to the housing HS, and four connecting parts 50g that connect the inner part 50i and the outer part 50e. Each of the four connecting portions 50g may be provided between the inner portion 50i and the outer portion 50e so that an inner connecting portion IC as a first connecting portion connecting the inner portion 50i and one end of the connecting portion 50g, and an outer connecting portion EC as a second connecting portion connecting the other end of the connecting portion 50g and the outer portion 50e are shifted by approximately 90 degrees around the optical axis JD.

[0139] This configuration has the effect of suppressing the adverse effect on the movement of the camera module CM of the reaction force generated by the second flexible cable 50 when the camera module CM is swung. This is because the four connecting parts 50g are arranged in a well-balanced manner around the optical axis JD. Note that the reaction force by the second flexible cable 50 is, for example, the restoring force of the second flexible cable 50 that is deformed when the camera module CM is swung.

[0140] The preferred embodiments of the present invention have been described above in detail. However, the present invention is not limited to the above-described embodiments. Various modifications and substitutions may be applied to the above-described embodiments without departing from the scope of the present invention. Furthermore, each of the features described with reference to the above-described embodiments may be appropriately combined as long as there is no technical contradiction.

[0141] For example, in the above embodiment, the first wire pair consisting of the first wire SA1 and the second wire SA2 is disposed on the left side surface (the surface on the Y1 side) of the module holder 2, and the second wire pair consisting of the third wire SA3 and the fourth wire SA4 is disposed on the right side surface (the surface on the Y2 side) of the module holder 2. However, the first wire SA1 to the fourth wire SA4 may be disposed one each on each of the four side surfaces of the module holder 2.

[0142] Furthermore, in the above embodiment, the position of the movable member MB is detected based on the output of the magnetic sensor 8, but it may be detected based on the output of a sensor that detects the resistance value of the shape memory alloy wire SA.

[0143] Also, in the above embodiment, the fixed-side metal member 5F is fixed to the support 18 with an adhesive, but it may be embedded in the support 18 or may be a conductive pattern formed on the surface of the support 18. Similarly, the movable-side metal member 5M is fixed to the module holder 2 with an adhesive, but it may be embedded in the module holder 2 or may be a conductive pattern formed on the surface of the module holder 2. [Explanation of symbols]

[0144] Reference Signs List 2 Module holder 2D Lower holder 2P Convex portion 2T Protruding portion 2U Upper holder 2V Projecting portion 3 Flexible cable 4 Cover member 4A Outer peripheral wall portion 4A1 First side plate portion 4A2 Second side plate portion 4A3 Third side plate portion 4A4 Fourth side plate portion 4B Bottom plate portion 4D Lower cover member 4E Side portion 4E1 First side portion 4E2 Second side portion 4E3 Third side portion 4E4 Fourth side portion 4K, 4Q Opening 4S Storage portion 4U Upper cover member 5 Metal member 5F Fixed side metal member 5F1...First fixed side terminal plate 5F2...Second fixed side terminal plate 5F3...Third fixed side terminal plate 5F4...Fourth fixed side terminal plate 5M...Movable side metal member 5M1...First movable side terminal plate 5M2...Second movable side terminal plate 6...Leaf spring 6L...Left side leaf spring 6eL, 6eR...Outer part 6eL1, 6eR1...First outer part 6eL2, 6eR2...Second outer part 6gL, 6gR...Elastic arm part 6gL1, 6gR1...First elastic arm part 6gL2, 6gR2...Second elastic arm part 6iL, 6iR...Inner part 6LH1, 6RH1...First through hole 6LH2, 6RH2...Second through hole 6LH3, 6RH3...Third through hole 6LH4, 6RH4...Fourth through hole 6LH5, 6RH5...Fifth through hole 6R...Right side leaf spring 7...Magnet 7A...First magnet 7B...Second magnet 7C...Third magnet 7D...Fourth magnet 8...Magnetic sensor 8A...First magnetic sensor 8B...Second magnetic sensor 8C...Third magnetic sensor 8D...Fourth magnetic sensor 8L...Left side magnetic sensor 8R...Right side magnetic sensor 12...Cylindrical portion 12D...Movable side base portion 12D1...First movable side base portion 12D2...Second movable side base portion 12S...Protruding portion 17 Insulating substrate 17B Rear surface portion 17D Bottom surface portion 17F Front surface portion 17U Top surface portion 18 Support 18B Bottom wall portion 18D Fixed side pedestal portion 18D1 First fixed side pedestal portion 18D2 Second fixed side pedestal portion 18D3 Third fixed side pedestal portion 18D4 Fourth fixed side pedestal portion18E... Side 18E1... First side 18E2... Second side 18E3... Third side 18E4... Fourth side 18R... Recess 18T... Protrusion 18V... Protrusion 101, 101A... Camera module drive device AH... Rectangular hole AX... Oscillating axis AX1... First oscillation axis AX2... Second oscillation axis CM... Camera module CD... Conductive member CD1... First conductive member CD2... Second conductive member CN1... First connection part CN2... Second connection part CN3... Third connection part CN4... Fourth connection part CP1... First joint surface part CP2... Second joint surface part CTL, CTR... Connection part DM... Drive mechanism FB...Fixed-side component HS...Housing ID, IDA...Imaging device IS...Imaging element J1~J4...Holding part JD...Optical axis LD...Lens drive unit LS...Lens body MB...Movable-side component PT1...First conductive pattern PT2...Second conductive pattern PT3...Third conductive pattern PT4...Fourth conductive pattern PT5...Fifth conductive pattern PT6...Sixth conductive pattern RH...Through hole SA...Shape memory alloy wire SA1...First wire SA2...Second wire SA3...Third wire SA4...Fourth wire SB...Swinging support part TM1...First terminal part TM2...Second terminal part

Claims

1. a movable member including a module holder capable of holding a camera module having a lens body and an image sensor; a fixed-side member including a support body that supports the module holder in a swingable manner and has a generally rectangular outer shape when viewed from above along the optical axis; a drive mechanism for swinging the module holder relative to the support body so that an optical axis of the lens body is tilted, the drive mechanism includes a plurality of shape memory alloy wires provided between the fixed member and the movable member, the shape memory alloy wire is arranged on two of the four side surfaces that form the module holder, which are opposed to each other across the module holder, such that the height position in the optical axis direction of one end that is fixed to the fixed-side member is different from the height position in the optical axis direction of the other end that is fixed to the movable-side member, and the shape memory alloy wire is not arranged on the remaining two of the four side surfaces that are opposed to each other across the module holder, A camera module driving device comprising:

2. The driving mechanism has a plurality of wire pairs each including two of the shape memory alloy wires arranged to cross each other. The camera module driving device according to claim 1 .

3. The driving mechanism has two wire pairs each including two shape memory alloy wires arranged to cross each other. The camera module driving device according to claim 2 .

4. A movable side member including a module holder capable of holding a camera module having a lens body and an image sensor; a fixed-side member including a support body that supports the module holder in a swingable manner and has a generally rectangular outer shape when viewed from above along the optical axis; a drive mechanism for swinging the module holder relative to the support body so that an optical axis of the lens body is tilted, the drive mechanism includes a plurality of shape memory alloy wires provided between the fixed member and the movable member, the shape memory alloy wire is arranged on two of the four side surfaces constituting the module holder such that the height position in the optical axis direction of one end fixed to the fixed-side member is different from the height position in the optical axis direction of the other end fixed to the movable-side member, and is not arranged on the remaining two of the four side surfaces constituting the module holder; The drive mechanism has two wire pairs each including two of the shape memory alloy wires arranged to cross each other, One pair of wires and the other pair of wires are arranged to face each other with the module holder therebetween. A camera module driving device comprising:

5. A swing support portion is provided between the module holder and the support body, The module holder is biased toward the swing support portion by a leaf spring provided between the movable member and the fixed member.

5. The camera module driving device according to claim 1.

6. the swing support portion is composed of a curved convex portion protruding downward from a lower surface of the module holder, and a concave portion formed on an upper surface of the support body and adapted to slidably receive the convex portion. The camera module driving device according to claim 5 .

7. the module holder includes a case member made of a magnetic metal and capable of housing at least a portion of the camera module, and a mounting member made of a synthetic resin and fixed to the case member, The leaf spring is attached to the mounting member.

7. The camera module driving device according to claim 5.

8. the support body is made of a synthetic resin and has a first metal member to which the one end of the shape memory alloy wire is fixed; the module holder has a second metal member to which the other end of the shape memory alloy wire is fixed, The leaf spring is made of a conductive metal and is connected to the second metal member.

8. The camera module driving device according to claim 5, wherein the driving device is a driving circuit for driving a camera module.

9. a movable member including a module holder capable of holding a camera module having a lens body and an image sensor; a fixed side member including a support body that supports the module holder so as to be able to swing; a drive mechanism for swinging the module holder relative to the support body so that an optical axis of the lens body is tilted, the drive mechanism includes a plurality of shape memory alloy wires provided between the fixed member and the movable member, the shape memory alloy wire is disposed such that a height position in the optical axis direction of one end portion fixed to the fixed-side member is different from a height position in the optical axis direction of the other end portion fixed to the movable-side member, A swing support portion is provided between the module holder and the support body, the module holder is biased toward the swing support portion by a leaf spring provided between the movable member and the fixed member, the support body is made of a synthetic resin and has a first metal member to which the one end of the shape memory alloy wire is fixed; the module holder has a second metal member to which the other end of the shape memory alloy wire is fixed, The leaf spring is made of a conductive metal and is connected to the second metal member. The support body has a bottom wall portion disposed on the insulating substrate and an extension portion extending upward from an edge portion of the bottom wall portion, A metal conductive member is embedded in the extension portion, a portion of the conductive member is exposed on an upper surface of the extension portion and another portion is exposed from the bottom wall portion; the portion of the conductive member is connected to the leaf spring; the other part of the conductive member is connected to a conductive pattern formed on the insulating substrate. A camera module driving device comprising:

10. a movable member including a module holder capable of holding a camera module having a lens body and an image sensor; a fixed side member including a support body that supports the module holder so as to be able to swing; a drive mechanism for swinging the module holder relative to the support body so that an optical axis of the lens body is tilted, the drive mechanism includes a plurality of shape memory alloy wires provided between the fixed member and the movable member, the shape memory alloy wire is disposed such that a height position in the optical axis direction of one end portion fixed to the fixed-side member is different from a height position in the optical axis direction of the other end portion fixed to the movable-side member, A swing support portion is provided between the module holder and the support body, the module holder is biased toward the swing support portion by a leaf spring provided between the movable member and the fixed member, the support body is made of a synthetic resin and has a first metal member to which the one end of the shape memory alloy wire is fixed; the module holder has a second metal member to which the other end of the shape memory alloy wire is fixed, The leaf spring is made of a conductive metal and is connected to the second metal member. the fixed member has an insulating substrate, The support body has a bottom wall portion and an extension portion extending upward from an edge portion of the bottom wall portion, the insulating substrate has a first surface portion facing a lower surface of the bottom wall portion and a second surface portion facing the extension portion, the first metal member is connected to a conductive pattern formed on the first surface portion, The leaf spring is fixed to an upper surface of the extension portion and is connected to a conductive pattern formed on the second surface portion. A camera module driving device comprising:

11. At least two magnets are fixed to the module holder at different positions; At least two magnetic sensors for detecting magnetic fields of the at least two magnets are provided on the fixed member.

11. The camera module driving device according to claim 1.

12. A camera module driving device according to any one of claims 1 to 11, a camera module fixed to the module holder; a flexible cable having a conductive pattern formed thereon and connected to an imaging element of the camera module; An imaging device comprising:

13. a movable member including a module holder capable of holding a camera module having a lens body and an image sensor; a fixed side member including a support body that supports the module holder so as to be able to swing; a camera module driving device including a driving mechanism for swinging the module holder relative to the support body so that the optical axis of the lens body is tilted; a camera module fixed to the module holder; a flexible cable having a conductive pattern formed thereon and connected to the imaging element of the camera module, the drive mechanism includes a plurality of shape memory alloy wires provided between the fixed member and the movable member, the shape memory alloy wire is disposed such that a height position in the optical axis direction of one end portion fixed to the fixed-side member is different from a height position in the optical axis direction of the other end portion fixed to the movable-side member, the fixed-side member has a frame-shaped cover member disposed above the module holder, The cover member is provided with an extension portion extending in a direction intersecting an extending direction of the flexible cable, The upper surface of the extension portion facing the flexible cable is curved so that the central portion is higher, A space is formed between the camera module and the module holder, the flexible cable passes through the space and extends to the outside of a housing including the cover member while facing a central portion of the extension portion so as to be able to abut against the central portion of the extension portion; 1. An imaging device comprising:

14. a movable member including a module holder capable of holding a camera module having a lens body and an image sensor; a fixed side member including a support body that supports the module holder so as to be able to swing; a camera module driving device including a driving mechanism for swinging the module holder relative to the support body so that the optical axis of the lens body is tilted; a camera module fixed to the module holder; a flexible cable having a conductive pattern formed thereon and connected to the imaging element of the camera module, the drive mechanism includes a plurality of shape memory alloy wires provided between the fixed member and the movable member, the shape memory alloy wire is disposed such that a height position in the optical axis direction of one end portion fixed to the fixed-side member is different from a height position in the optical axis direction of the other end portion fixed to the movable-side member, The camera module driving device has a housing having an opening on an upper surface thereof, the imaging device includes another flexible cable that is fixed to an upper surface of the camera module disposed within the housing and to an upper surface of the housing and is connected to the flexible cable; the other flexible cable includes an inner portion fixed to the camera module and connected to the flexible cable, an outer portion fixed to the housing, and four connecting portions connecting the inner portion and the outer portion; each of the four connecting portions is provided between the inner portion and the outer portion such that a first connecting portion connecting the inner portion and one end of the connecting portion and a second connecting portion connecting the other end of the connecting portion and the outer portion are shifted by approximately 90 degrees around the optical axis; 1. An imaging device comprising:

Images