Display device

Abstract

SOLUTION: A display device according to an exemplary embodiment comprises a display unit DP for displaying an image, a metal layer 132 disposed above the display unit, and a reinforcement substrate 140 disposed over the metal layer and made of an amorphous metal thin film.EFFECT: The present invention enables attachment using an existing jig and effective shielding of electromagnetic waves.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a display device. [Background technology]

[0002] As we enter a full-fledged information age, the field of display devices that visually display electrical information signals is rapidly developing, and research is ongoing to develop various display devices with improved performance, such as thinner, lighter, and less power consumption.

[0003] Representative display devices include a liquid crystal display device (LCD), an electro-wetting display device (EWD), and an organic light emitting display device (OLED).

[0004] Among these, electroluminescent displays including organic light emitting displays are self-emitting displays that do not require a separate light source unlike liquid crystal displays and can be manufactured to be lightweight and thin. In addition, electroluminescent displays are advantageous in terms of power consumption due to low voltage operation, and are also excellent in color realization, response speed, viewing angle, and contrast ratio (CR), and are expected to be used in various fields. Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a display device including a sealing portion having a new structure.

[0006] Another problem to be solved by the present invention is to provide a display device including a sealing part having a new structure capable of shielding electromagnetic waves and capable of applying an existing magnetic jig process.

[0007] The object of the present invention is not limited to the above-mentioned objects, and other objects not mentioned herein will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0008] In order to solve the above-mentioned problems, a display device according to an embodiment of the present invention may include a display unit that displays an image, a metal layer disposed on an upper portion of the display unit, and a reinforcing substrate disposed on an upper portion of the metal layer and composed of an amorphous metal thin film.

[0009] In another embodiment of the present invention, a display device may include a display unit for displaying an image, a reinforcing substrate disposed on an upper portion of the display unit and made of an amorphous metal thin film, and a metal layer disposed on an upper portion of the reinforcing substrate.

[0010] Further details of the embodiments are included in the detailed description and the drawings.

[0011] The present invention makes it possible to form a sealing portion using a laminated structure of a low-rigidity nonmagnetic soft metal thin film and a high-rigidity, highly magnetically permeable amorphous metal thin film, thereby enabling attachment using existing tools and enabling electromagnetic wave shielding.

[0012] The effects of the present invention are not limited to the above-mentioned examples, and various other effects are included within the scope of the present invention. [Brief description of the drawings]

[0013] [Figure 1] 1 is a plan view illustrating a display device according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view taken along II' in FIG. [Diagram 3] 1 is a cross-sectional view showing a sub-pixel of a display device according to an embodiment of the present invention. [Figure 4] 1 is a table showing a comparison of characteristics of amorphous metal thin films. [Diagram 5]1 is a table showing the characteristics required for the amorphous metal thin film of the present invention. [Figure 6] FIG. 11 is a cross-sectional view illustrating a display device according to another embodiment of the present invention. [Figure 7] 1 is a table showing high-temperature, high-humidity moisture permeability reliability evaluation. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The advantages and features of the present invention, and the methods for achieving them, will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be embodied in various different forms, and the embodiments are provided solely for the purpose of making the disclosure of the present invention complete and fully conveying the scope of the invention to those skilled in the art to which the present invention pertains, and the present invention is only defined by the scope of the claims.

[0015] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are illustrative, and the present invention is not limited to the illustrated matters. In addition, when explaining the present invention, if it is determined that a specific description of related known technology may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. In addition, when the words "include," "have," "be made," etc. are used in this specification, other parts may be added since "only" is not used. When a component is expressed in the singular, it includes the case where it includes the plural, unless otherwise expressly specified.

[0016] When interpreting elements, they are interpreted as including a margin of error even if there is no other explicit description.

[0017] When describing a positional relationship, for example when describing the positional relationship of two parts using "on top of," "at the top of," "at the bottom of," "next to," etc., one or more other parts may be located between the two parts, so long as "immediately" or "directly" is not used.

[0018] When an element or layer is referred to as being on another element or layer, this includes the case where the element or layer is directly on the other element or has other layers or elements interposed therebetween.

[0019] Although the terms "first", "second" and the like are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, the first component referred to below may be the second component within the technical concept of the present invention.

[0020] Like reference numbers refer to like elements throughout the specification.

[0021] The size and thickness of each component shown in the drawings are shown for convenience of explanation, and the present invention is not necessarily limited to the size and thickness of the components shown.

[0022] The features of the various embodiments of the present invention may be partially or fully combined or combined with each other, and may be technically interlocked and driven in various ways, as will be readily understood by those skilled in the art, and each embodiment may be implemented independently of the others, or may be implemented together in a related relationship.

[0023] Various embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0024] FIG. 1 is a plan view illustrating a display device according to an embodiment of the present invention.

[0025] Referring to FIG. 1, for example, a display device 100 according to an embodiment of the present invention may include a display part DP, a sealing part FSPM, a flexible film 160 and a printed circuit board 170.

[0026] The display unit DP is a panel for displaying images to the user.

[0027] Although not shown, the display unit DP may include a display element for displaying an image, a driving element for driving the display element, and wiring for transmitting various signals to the display element and the driving element. The display element may be defined differently depending on the type of the display unit DP. For example, if the display unit DP is an organic light emitting display panel, the display element may be an organic light emitting element including an anode, an organic layer, and a cathode. For example, if the display unit DP is a liquid crystal display panel, the display element may be a liquid crystal display element.

[0028] In the following, it is assumed that the display unit DP is an organic light emitting display panel, but the display unit DP is not limited to an organic light emitting display panel.

[0029] The display unit DP can include a display area AA and a non-display area NA.

[0030] The display area AA is an area in which an image is displayed on the display unit DP.

[0031] In the display area AA, a plurality of sub-pixels constituting a plurality of pixels and a circuit for driving the plurality of sub-pixels may be arranged. The plurality of sub-pixels are the smallest units constituting the display area AA, and a display element may be arranged in each of the plurality of sub-pixels, and the plurality of sub-pixels may constitute a pixel. For example, an organic light-emitting element including an anode, an organic layer, and a cathode may be arranged in each of the plurality of sub-pixels, but is not limited thereto. And, the circuit for driving the plurality of sub-pixels may include a driving element, wiring, etc. For example, the circuit may be composed of a thin film transistor, a storage capacitor, a gate wiring, a data wiring, etc., but is not limited thereto.

[0032] The non-display area NA is an area where no image is displayed.

[0033] In FIG. 1, the non-display area NA is shown surrounding the rectangular display area AA, but the shapes and arrangements of the display area AA and the non-display area NA are not limited to the example shown in FIG.

[0034] For example, the display area AA and the non-display area NA may have a shape suitable for the design of an electronic device incorporating the display device 100. For example, exemplary shapes of the display area AA may be a pentagon, a hexagon, a circle, an ellipse, etc.

[0035] In the non-display area NA, various wirings and circuits for driving the organic light emitting elements in the display area AA may be arranged, for example, link wirings for transmitting signals to a plurality of sub-pixels and circuits in the display area AA or driving ICs such as a gate driver IC and a data driver IC may be arranged, but is not limited thereto.

[0036] For example, the display device 100 may include various additional elements for generating various signals or driving pixels in the display area AA. For example, additional elements for driving pixels may include an inverter circuit, a multiplexer, an electrostatic discharge (ESD) circuit, etc. The display device 100 may also include additional elements associated with functions other than driving pixels. For example, the display device 100 may further include additional elements providing a touch sensing function, a user authentication function (e.g., fingerprint recognition), a multi-level pressure sensing function, a tactile feedback function, etc. The above-mentioned additional elements may be located in the non-display area NA and / or an external circuit connected to a connection interface.

[0037] The flexible film 160 is a film in which various components are disposed on a ductile base film. For example, the flexible film 160 is a film for supplying signals to a plurality of sub-pixels and circuits of the display area AA, and may be electrically connected to the display unit DP. The flexible film 160 is disposed at one end of the display unit DP, and may supply a power supply voltage, a data voltage, etc. to a plurality of sub-pixels and circuits of the display area AA. Therefore, the number of flexible films 160 may be variously changed according to a design, and is not limited thereto.

[0038] A driving IC such as a gate driver IC and a data driver IC may be disposed on the flexible film 160. The driving IC is a component that processes data for displaying an image and a driving signal for processing the data. The driving IC may be disposed in a manner such as Chip On Glass (COG), Chip On Film (COF), Tape Carrier Package (TCP), etc., depending on the mounting manner.

[0039] The printed circuit board 170 may be disposed at one end of the flexible film 160 and connected to the flexible film 160. For example, the printed circuit board 170 is a component that supplies signals to a driving IC. The printed circuit board 170 may supply various signals, such as driving signals and data signals, to the driving IC. For example, a data driver that generates data signals may be mounted on the printed circuit board 170, and the generated data signals may be supplied to sub-pixels and circuits of the display unit DP through the multiple flexible films 160.

[0040] Meanwhile, a sealing part FSPM may be disposed on the upper part of the display part DP.

[0041] The sealing portion FSPM may include a sealing member and a reinforcing substrate.

[0042] When a multi-layered sealing structure including a reinforcing substrate is introduced, it is possible to secure sufficient rigidity and heat dissipation effect. However, when a plastic polymer such as polyethylene terephthalate (PET) is used as a reinforcing substrate, it is difficult to deal with electromagnetic interference (EMI). That is, a multi-layered sealing structure made of a metal thin film and PET has been developed to reduce material costs and weight, but there is a problem that air bubbles are generated inside due to the generation of steps when bonding with an adhesive pad due to low rigidity and the inability to use a magnetic jig. In addition, the upper layer is made of a non-conductive layer of PET, which may reduce the electromagnetic wave shielding performance. In addition, the risk of damage to the display unit may increase due to low rigidity.

[0043] Therefore, in the present invention, the sealing part FSPM is constructed of a laminated structure of a nonmagnetic soft metal thin film with low rigidity and an amorphous metal thin film with high rigidity and high magnetic permeability, which makes it possible to attach the sealing part using existing tools and effectively blocks electromagnetic waves.

[0044] The display portion DP and the sealing portion FSPM of the present invention will be described in detail below with reference to FIGS.

[0045] FIG. 2 is a cross-sectional view taken along line II' of FIG.

[0046] FIG. 3 is a cross-sectional view showing a sub-pixel of a display device according to an embodiment of the present invention.

[0047] FIG. 2 shows an example of a cross section of one side of the display device.

[0048] In FIG. 2, for convenience of explanation, specific configurations of the transistor layer TRL and the light emitting element layer EDL are omitted.

[0049] FIG. 3 is a cross-sectional view of one sub-pixel in a display unit DP according to an embodiment of the present invention.

[0050] 2 and 3, a transistor layer TRL may be disposed on top of a substrate 101.

[0051] For example, the substrate 101 may be a glass or plastic substrate. If the substrate 101 is a plastic substrate, a polyimide-based or polycarbonate-based material may be used to provide flexibility. In particular, polyimide is often used as a plastic substrate because it can be applied to high-temperature processes and is a coatable material.

[0052] A buffer layer 102 may be disposed on the substrate 101 .

[0053] The buffer layer 102 is a layer for protecting various electrodes and wirings from impurities such as alkali ions flowing out from the substrate 101 or a lower layer, and may have a multi-layer structure consisting of a first buffer layer 102a and a second buffer layer 102b, but is not limited thereto. The buffer layer 102 may be made of silicon oxide (SiOx), silicon nitride (SiNx), or a multi-layer thereof.

[0054] In addition, the buffer layer 102 can delay the diffusion of moisture and / or oxygen that has penetrated into the substrate 101. The buffer layer 102 can include a multi-buffer and / or an active buffer. The active buffer can protect the active layer 124 made of a semiconductor of the driving element 120 and block various types of impurities that flow in from the substrate 101. The active buffer can be made of amorphous silicon (a-Si) or the like.

[0055] An actuation element 120 may be disposed on the buffer layer 102 .

[0056] For example, the driving element 120 may be composed of an active layer 124 , a gate electrode 121 , a source electrode 122 and a drain electrode 123 , and may be electrically connected to the organic light emitting element 150 through a connecting electrode 115 to transmit a current or a signal to the organic light emitting element 150 .

[0057] The active layer 124 may be disposed on the buffer layer 102. The active layer 124 may be made of polysilicon (p-Si), in which case a predetermined region may be doped with impurities. The active layer 124 may also be made of amorphous silicon (a-Si) or may be made of various organic semiconductor materials such as pentacene. The active layer 124 may also be made of an oxide semiconductor.

[0058] A gate insulating layer 103 may be disposed on the active layer 124 .

[0059] The gate insulating layer 103 may be formed of an insulating inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx), or may be formed of an insulating organic material.

[0060] A gate electrode 121 may be disposed on the gate insulating layer 103 .

[0061] The gate electrode 121 may be formed of a variety of conductive materials, such as nickel (Ni), chromium (Cr), magnesium (Mg), aluminum (Al), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof.

[0062] An interlayer insulating layer 104 may be disposed on the gate electrode 121 .

[0063] The interlayer insulating layer 104 may be formed of an insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx), or may be formed of an insulating organic material.

[0064] By selectively removing the gate insulating layer 103 and the interlayer insulating layer 104, contact holes exposing the source and drain regions of the active layer 124 may be formed.

[0065] A source electrode 122 and a drain electrode 123 may be disposed on the interlayer insulating layer 104 .

[0066] The source electrode 122 and the drain electrode 123 may be formed of various conductive materials, such as nickel (Ni), chromium (Cr), magnesium (Mg), aluminum (Al), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof.

[0067] A source electrode 122 and a drain electrode 123 may be electrically connected to the source region and the drain region, respectively.

[0068] If necessary, an additional passivation layer made of an inorganic insulating material may be formed to cover the source electrode 122 and the drain electrode 123 .

[0069] A planarization layer PLN may be disposed on the upper portion of the transistor layer TRL configured in this manner.

[0070] For example, a planarization layer 105 may be disposed on top of the actuation elements 120 .

[0071] The planarization layer 105 may have a multi-layer structure composed of at least two layers, and may include, for example, a first planarization layer 105a and a second planarization layer 105b. The first planarization layer 105a may be disposed so as to cover the driving element 120, and may be disposed so that a portion of the source electrode 122 and the drain electrode 123 of the driving element 120 is exposed.

[0072] The planarization layer 105 may extend into the non-display area NA.

[0073] The planarization layer 105 may have a thickness of about 2 μm, but is not limited to such.

[0074] The planarization layer 105 may be, but is not limited to, an overcoat layer.

[0075] Meanwhile, a connection electrode 115 for electrically connecting the driving element 120 and the organic light emitting element 150 may be disposed on the first planarization layer 105a. Although not shown in FIG 3, various metal layers serving as wiring / electrodes such as data wiring and signal wiring may be disposed on the first planarization layer 105a.

[0076] In addition, a second planarization layer 105b may be disposed on the first planarization layer 105a and the connecting electrode 115.

[0077] The display unit DP according to the embodiment of the present invention has two planarization layers 105 because various signal wirings have increased as the display unit DP is designed with high resolution. Since it is difficult to arrange all wirings on one layer while ensuring the minimum spacing, an additional layer is provided. The addition of this additional layer, i.e., the second planarization layer 105b, provides more space for wiring arrangement, making it easier to design wiring / electrode arrangement. In addition, when a dielectric material is used as the multi-layered planarization layer 105, the planarization layer 105 can be used to form capacitance between metal layers.

[0078] The second planarization layer 105b may be formed such that a portion of the connecting electrode 115 is exposed, and the drain electrode 123 of the driving element 120 and the anode 151 of the organic light emitting element 150 may be electrically connected through the connecting electrode 115.

[0079] The light emitting element layer EDL can be disposed on the planarization layer PLN configured in this manner.

[0080] For example, the light emitting element layer EDL can be disposed in the display area AA.

[0081] The organic light emitting device 150 may be configured by sequentially arranging an anode 151, a plurality of organic layers 152, and a cathode 153.

[0082] For example, organic light emitting element 150 may be comprised of an anode 151 disposed on planarization layer 105 , an organic layer 152 disposed on anode 151 , and a cathode 153 disposed on organic layer 152 .

[0083] The electroluminescence display device may be implemented as a top emission or bottom emission type depending on the light emission direction. In the case of the top emission type, a reflective layer made of an opaque conductive material having high reflectivity, for example, silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr) or an alloy thereof, may be added to the bottom of the anode 151 so that light emitted from the organic layer 152 is reflected by the anode 151 and directed upward, for example, toward the cathode 153. In contrast, in the case of the bottom emission type, the anode 151 may be made of only a transparent conductive material, such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO). In the following description, it is assumed that the display device of the present invention is a bottom emission type.

[0084] Banks 106 may be disposed on the planarization layer 105 in the remaining area excluding the light emitting area.

[0085] For example, the bank 106 has a bank hole exposing the light emitting region and the corresponding anode 151. The bank 106 may be made of an inorganic insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx) or an organic insulating material such as BCB, an acrylic resin, or an imide resin.

[0086] The bank 106 may extend partially into the non-display area NA.

[0087] The bank 106 may have a thickness of about 1 μm, but is not limited to such.

[0088] An organic layer 152 may be disposed on the anode 151 exposed by the bank 106. The organic layer 152 may include an emissive layer, an electron injection layer, an electron transport layer, a hole transport layer, a hole injection layer, and the like.

[0089] The organic layer 152 may extend partially into the non-display area NA.

[0090] A cathode 153 may be disposed on the organic layer 152 .

[0091] In the case of a top emission type, the cathode 153 may include a transparent conductive material. For example, the cathode 153 may be made of indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc. In the case of a bottom emission type, the cathode 153 may include any one of a group consisting of a metal material such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), magnesium (Mg), palladium (Pd), copper (Cu), etc., or an alloy thereof. Alternatively, the cathode 153 may be formed by stacking a layer made of a transparent conductive material such as ITO (indium tin oxide), IZO (indium zinc oxide), or IGZO (indium gallium zinc oxide) and a layer made of a metal material such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), magnesium (Mg), palladium (Pd), copper (Cu), or an alloy thereof, but is not limited thereto.

[0092] The cathode 153 may extend into the non-display area NA.

[0093] A capping layer made of a material having a high refractive index and light absorptivity may be disposed on the organic light emitting device 150 in order to reduce diffuse reflection of external light.

[0094] For example, the capping layer may be an organic layer made of an organic material, and may be omitted as necessary.

[0095] The capping layer may extend into the non-display area NA.

[0096] A sealing part FSPM may be disposed on the light emitting element layer EDL configured in this manner.

[0097] A sealing part FSPM having a multi-layer structure including a sealing member 130 and a reinforcing substrate 140 may be disposed on the cathode 153 .

[0098] Small-sized display panels used in mobile and portable devices have a small display panel area, so heat generated by the elements can be dissipated quickly and there are fewer adhesion problems. However, large-sized display panels used in monitors, tablets, and television sets have a large display panel area, so a sealing structure is required for optimal heat dissipation effect and adhesion strength.

[0099] In addition, in order to secure the insufficient rigidity, the electroluminescence display device may further include a separate inner plate on the upper part of the encapsulation substrate. In this case, a space needs to be secured for disposing the separate inner plate, and there is a problem that the weight of the inner plate limits the slimming and weight reduction of the electroluminescence display device. In addition, there is a limit in that a vertical separation space occurs due to an air gap generated between the encapsulation substrate and the inner plate by the thickness of an adhesive tape disposed to bond the encapsulation substrate and the inner plate, which reduces heat dissipation performance.

[0100] Therefore, in the present invention, a multi-layered sealing part FSPM can be applied that includes a sealing member 130 that can fix a reinforcing substrate 140 having rigidity and high magnetic permeability while removing a separate inner plate and can prevent process defects.

[0101] The sealing member 130 of the present invention may include a first adhesive layer 131 facing the substrate 101, a second adhesive layer 133 facing the reinforcing substrate 140, and a metal layer 132 disposed between the first adhesive layer 131 and the second adhesive layer 133.

[0102] Each of the first adhesive layer 131 and the second adhesive layer 133 may be made of a polymer material having adhesiveness. For example, the first adhesive layer 131 may be made of any one of olefin-based, epoxy-based, urethane (or urea)-based, and acrylate-based polymer materials. Also, the second adhesive layer 133 may be made of any one of olefin-based, epoxy-based, acrylate-based, urethane-based, amine-based, phenol-based, and acid anhydride-based polymer materials not containing a carboxyl group. Also, for example, the second adhesive layer 133 may be made of a polymer material not containing a carboxyl group in order to improve the film uniformity of the metal layer 132 and prevent corrosion.

[0103] In order to dissipate heat from the substrate 101, at least the first adhesive layer 131 of the first and second adhesive layers 131, 133 may be made of a mixture containing an adhesive polymer material and metal material particles. As an example, the metal material particles may be nickel (Ni) powder. The first adhesive layer 131 that directly contacts the substrate 101 may have higher thermal conductivity than an adhesive polymer material by being made of a mixture containing an adhesive polymer material and metal material particles.

[0104] For example, the second adhesive layer 133 may also be made of a mixture containing an adhesive polymer material and particles of a metal material, and may have a higher thermal conductivity than the adhesive polymer material.

[0105] In this way, the speed at which the operating heat generated in the substrate 101 is dissipated through the sealing member 130 may be increased, and the heat dissipation effect on the substrate 101 may be improved.

[0106] In order to prevent moisture from passing through the light emitting element layer EDL, for example, the first adhesive layer 131 may be made of a mixture further containing a moisture absorbing inorganic filler.

[0107] For example, the hygroscopic inorganic filler may be at least one of barium oxide (BaO), calcium oxide (CaO), and magnesium oxide (MgO).

[0108] Unlike the first adhesive layer 131, the second adhesive layer 133 does not contact the light emitting element layer EDL, and therefore does not need to contain an inorganic filler for preventing moisture permeation of the light emitting element layer EDL. Therefore, the second adhesive layer 133 does not contain a moisture absorbing inorganic filler, and may contain only particles of a sticky polymer material and a metal material. In this way, the amount of the relatively expensive moisture absorbing inorganic filler input into the sealing member 130 may be reduced, and thus the manufacturing cost may be reduced.

[0109] In addition, since the second adhesive layer 133 does not contain a hygroscopic inorganic filler, the mixing ratio of the polymer material contained in the second adhesive layer 133 may be increased compared to the first adhesive layer 131, and therefore the adhesiveness of the second adhesive layer 133 may be improved compared to the adhesiveness of the first adhesive layer 131. As a result, the reinforcing substrate 140 may be more firmly fixed on the upper portion of the second adhesive layer 133, and the reliability of the adhesion between the substrate 101 and the reinforcing substrate 140 may be further improved.

[0110] By forming the first adhesive layer 131 and the second adhesive layer 133 in a multi-layer structure, a warpage phenomenon in which the display panel is warped can be reduced, and reliability can be improved.

[0111] The thickness of each of the first and second adhesive layers 131 and 133 may be limited to a critical thickness or less that prevents process defects, and, for example, the sum of the thicknesses of the first and second adhesive layers 131 and 133 may be limited to a critical thickness or more that ensures reliability in fixing the reinforcing substrate 140.

[0112] For example, the first adhesive layer 131 may have a thickness in the range of about 10 um to 100 um, and the second adhesive layer 133 may have a thickness in the range of about 5 um to 30 um.

[0113] Metal layer 132 may be made of a thin film metallic material.

[0114] The metal layer 132 may be made of a non-magnetic soft metal thin film with low stiffness of about 100-350 MPa. For example, the metal layer 132 may be made of an aluminum (Al) thin film. Aluminum has a high shielding ability against moisture and gas, and has the advantages of being lightweight and low cost.

[0115] For example, the first and second adhesive layers 131, 133 are each composed of a polymeric material having adhesive properties, and the metal layer 132, which is made of a relatively hard material, is disposed between the first adhesive layer 131 and the second adhesive layer 133, and the first adhesive layer 131 and the second adhesive layer 133 are adhered to one side and the other side of the metal layer 132, respectively, thereby improving the adhesion strength.

[0116] For example, the thickness of the metal layer 132 may be limited to a value smaller than the thickness of the first adhesive layer 131 in order to minimize an increase in the thickness of the sealing member 130 due to the metal layer 132. For example, the thickness of the metal layer 132 may be within a range of greater than 10 μm and smaller than the thickness of the first adhesive layer 131.

[0117] Meanwhile, in the present invention, an amorphous metal thin film having high rigidity and high magnetic permeability can be applied as the reinforcing substrate 140. The amorphous metal thin film has high magnetic permeability, so that the existing magnetic fixture process can be applied, has high electromagnetic wave absorption at high frequencies, and excels in electromagnetic wave shielding, and has high rigidity to prevent damage to the display unit DP from external impact.

[0118] For example, the reinforcing substrate 140 may be composed of an amorphous metal thin film of an Fe-based alloy.

[0119] As mentioned above, the hybrid structure of metal thin film and PET, which is being developed to reduce material costs and improve performance, has the disadvantage that the existing magnetic fixture process cannot be applied because the aluminum of the metal thin film is not magnetic. Therefore, when creating a fixture structure using an adhesive pad, the rigidity of the sealing structure decreases, and air bubbles are generated at the step after bonding. In addition, the hybrid structure of metal thin film and PET requires structural improvement for electromagnetic wave shielding because the outermost layer is PET.

[0120] Therefore, the present invention can improve the problems associated with the hybrid structure of metal thin film and PET by constructing the sealing part FSPM with a laminated structure of a metal layer 132 made of a non-magnetic soft metal thin film with low rigidity and a reinforcing substrate 140 made of an amorphous metal thin film with high rigidity and high magnetic permeability.

[0121] Amorphous metals have high rigidity, high magnetic permeability, and electromagnetic field shielding properties. For example, the reinforcing substrate 140 has high rigidity, very high magnetic permeability, and therefore high electromagnetic field shielding properties compared to the metal layer 132. However, the reinforcing substrate 140 has low electrical conductivity and low electromagnetic wave reflection properties compared to the metal layer 132.

[0122] For example, the stiffening substrate 140 may be composed of an amorphous metal thin film having a magnetic permeability of 100-200,000 (units).

[0123] First, while weak bonds between crystalline structures are easily broken by external impact, amorphous metals have a significantly reduced crystalline structure and therefore have high rigidity against external impact.

[0124] For example, the elastic limit, or the limit of how much they can stretch (deform), is between 0 and 1% for silica, steel, and Ti-based alloys, while amorphous metals and polymers can have an elastic limit of 2% or more.

[0125] In addition, amorphous metals and nanocrystal alloys derived from them are ductile materials with lower coercivity than crystalline alloys, and because they have high permeability, they can have high magnetic flux density even in low external magnetic fields.

[0126] Coercivity refers to the ability of a ferromagnetic material to remain magnetized even after the external magnetic field is removed after it has been magnetized by the external magnetic field.

[0127] In addition, amorphous metals have low electrical conductivity and therefore low electromagnetic wave reflection (SE(R)) properties, but can have high electromagnetic wave absorption (SE(A)) properties due to their very high magnetic permeability.

[0128] FIG. 4 is a table showing a comparison of the characteristics of amorphous metal thin films.

[0129] Referring to FIG. 4, for a 30 um thick copper, the specific conductivity and specific permeability may have values ​​of 1 and 1, respectively, and the electromagnetic wave reflection (SE(R)) and electromagnetic wave absorption (SE(A)) may have values ​​of 78.1 and 124.7, respectively.

[0130] Also, for a 30 um thick aluminum, the specific conductivity and specific permeability may have values ​​of 0.63 and 1, respectively, and the electromagnetic wave reflection (SE(R)) and electromagnetic wave absorption (SE(A)) may have values ​​of 76.1 and 99.2, respectively.

[0131] In contrast, for example, a 25 um thick iron-based alloy amorphous metal may have specific electrical conductivity and specific magnetic permeability values ​​of 0.012 and 100,000, respectively, and electromagnetic reflection (SE(R)) and electromagnetic absorption (SE(A)) values ​​of 8.9 and 3598.5, respectively.

[0132] As described above, amorphous metals (A-metals) have high electromagnetic wave absorption (SE(A)) properties despite their low electrical conductivity due to their extremely high magnetic permeability.

[0133] For reference, according to electromagnetic shielding theory, the shielding effect (SE(T)) can be composed of the sum of reflection loss (SE(R)), absorption loss (SE(A)) and multiple reflection loss (SE(M)), and each shielding can be expressed as a function of the material constants of the medium's electrical conductivity and magnetic permeability and its thickness.

[0134] The return loss (SE(R)) can be expressed by the following equation (1). [Number 1] TIFF0007640649000001.tif14170

[0135] Thus, it can be seen that the reflection loss (SE(R)) is not related to the thickness of the medium, increases as the conductivity of the medium increases, and decreases as the permeability and wavelength increase.

[0136] The absorption loss (SE(A)) can be expressed by the following equation (2). [Number 2] TIFF0007640649000002.tif7170

[0137] In contrast, it can be seen that the absorption loss (SE(A)) is determined by the conductivity and permeability of the medium for a given thickness.

[0138] The multiple reflection loss (SE(M)) can be expressed by the following [Equation 3]. [Number 3] TIFF0007640649000003.tif12170

[0139] σ r indicates the specific conductivity based on copper, and μ r indicates the relative permeability based on copper.

[0140] Also, f MHZ denotes the frequency in MHZ, and t mm indicates thickness in mm.

[0141] Next, the differences in electromagnetic field shielding properties due to metal properties are as follows:

[0142] Conductive magnetic metals such as iron (Fe) are advantageous in all aspects of reflection loss (SE(R)) due to increased conductivity, absorption loss (SE(A)), and multiple reflection loss (SE(M)). Most of the effect is related to reflection loss (SE(R)).

[0143] Conductive non-magnetic metals such as copper (Cu) and aluminum (Al) have excellent reflection loss (SE(R)) but are inferior to magnetic metals in terms of absorption loss (SE(A)).

[0144] It is found that amorphous metals have lower electrical conductivity and therefore reduced reflection loss (SE(R)) compared to crystalline metals, but have superior properties in terms of absorption loss (SE(A)) due to their high magnetic permeability.

[0145] For example, the amorphous metal thin film of the present invention may be composed of low-cost iron (Fe) as the main component, forming a stable amorphous structure, and may contain various impurities to improve physical and electromagnetic properties. For example, the amorphous metal thin film may contain impurities such as boron (B), silicon (Si), nickel (Ni), niobium (Nb), and copper (Cu) in iron (Fe).

[0146] For example, if the iron content is low, it may be disadvantageous in terms of magnetic permeability and saturation magnetism, and if the iron content is 85% or more, it may be difficult to form an amorphous structure, so that the iron content may be about 65-85%.

[0147] The amorphous metal thin film according to the embodiment of the present invention can include not only a completely amorphous structure, but also a dispersed structure of, for example, nano-sized crystalline structures.

[0148] FIG. 5 is a table showing the properties required for the amorphous metal thin film of the present invention.

[0149] 5, the amorphous metal properties required for the amorphous metal thin film of the present invention may be, for example, a thickness of 20 to 40 um, a tensile strength of 1 Gpa or more, a standard hardness (HV) of 400 or more, a saturation magnetic flux density of 1 T or more, a magnetic permeability of 5,000 or more, and a coercive force (Hc) of 10 A / m or less. However, the present invention is not limited thereto.

[0150] An amorphous metal thin film composed of iron, silicon and boron may have a thickness of 25 um and, for example, a coefficient of thermal expansion (CTE) of 4.3 ppm / °C, an elastic modulus of 120 Gpa, and a thermal conductivity of 8 W / mK at 25°C.

[0151] For example, amorphous metals are molten alloys without crystallinity produced by rapid casting, and have a random atomic structure and no crystal anisotropy compared to crystalline metals. In addition, amorphous metals have soft magnetic properties, and their magnetic properties can be changed by heat treatment.

[0152] Meanwhile, the present invention may be configured such that the positions of the reinforcing substrate and the metal layer are interchangeable, which will be described in detail with reference to the drawings.

[0153] FIG. 6 is a cross-sectional view that illustrates a schematic configuration of a display device according to another embodiment of the present invention.

[0154] A display device 200 according to another embodiment of the present invention in Figure 6 differs from the display device 100 according to an embodiment of the present invention in Figure 2 described above only in the configuration of the sealing part FSPM, and the other configurations are essentially the same, so duplicated explanations will be omitted.

[0155] FIG. 6 shows a cross section of one side of the display device 200 as an example.

[0156] In FIG. 6, for convenience of explanation, specific configurations of the transistor layer TRL and the light emitting element layer EDL are omitted.

[0157] Referring to FIG. 6, a transistor layer TRL, a planarization layer PLN, and a light emitting element layer EDL may be disposed on a substrate 101.

[0158] A sealing portion FSPM having a multi-layer structure may be disposed on the light emitting element layer EDL.

[0159] For example, a reinforcing substrate 240 may be disposed on the light emitting element layer EDL.

[0160] In the present invention, the reinforcing substrate 240 may be an amorphous metal thin film having high rigidity and high magnetic permeability.

[0161] For example, the reinforcing substrate 240 may be composed of an amorphous metal thin film of an Fe-based alloy.

[0162] For example, the reinforcing substrate 240 may have a thickness of about 20 um-40 um.

[0163] For example, the amorphous metal thin film of the present invention may contain low-cost iron (Fe) as a main component, and may also contain impurities such as boron (B), silicon (Si), nickel (Ni), niobium (Nb), and copper (Cu).

[0164] For example, if the iron content is low, it may be disadvantageous in terms of permeability and saturation magnetism, and if the iron content is 85% or more, it may be difficult to form an amorphous structure, so the iron content may be about 65-85%.

[0165] The amorphous metal thin film according to the embodiment of the present invention can include not only a completely amorphous structure, but also a dispersed structure of, for example, nano-sized crystalline structures.

[0166] A first adhesive layer 231 may be disposed between the light emitting element layer EDL and the reinforcing substrate 240 .

[0167] The first adhesive layer 231 may be made of a polymer material having adhesiveness, for example, any one of olefin-based, epoxy-based, urethane-based, and acrylate-based polymer materials.

[0168] For example, the first adhesive layer 231 may be made of a mixture including particles of an adhesive polymer material and a metal material.

[0169] The first adhesive layer 231 may have a thickness of about 40 um-60 um.

[0170] For example, the first adhesive layer 231 may be made of a mixture further including a hygroscopic inorganic filler.

[0171] For example, the hygroscopic inorganic filler may be at least one of barium oxide (BaO), calcium oxide (CaO), and magnesium oxide (MgO).

[0172] A metal layer 232 may be disposed on top of the stiffening substrate 240 .

[0173] Metal layer 232 may be made of a thin film metallic material.

[0174] The metal layer 232 may be made of a non-magnetic soft metal thin film with low stiffness of about 100-350 Mpa. For example, the metal layer 232 may be made of an aluminum (Al) thin film. For example, the metal layer 232 may be made of an aluminum (Al) thin film with a thickness of about 30 um-50 um.

[0175] A second adhesive layer 233 may be disposed between the reinforcing substrate 240 and the metal layer 232 .

[0176] The second adhesive layer 233 may be made of a polymer material having adhesive properties, for example, any one of olefin-based, epoxy-based, acrylate-based, urethane-based, amine-based, phenol-based, and acid anhydride-based polymer materials that do not contain a carboxyl group.

[0177] For example, the second adhesive layer 233 may also be made of a mixture containing particles of an adhesive polymer material and a metal material, in which case the second adhesive layer 233 may have a higher thermal conductivity than the adhesive polymer material.

[0178] The second adhesive layer 233 may not include a hygroscopic inorganic filler, but may include only particles of an adhesive polymer material and a metal material.

[0179] For example, the second adhesive layer 233 may have a thickness of about 5um-30um.

[0180] FIG. 7 is a table showing the high-temperature, high-humidity moisture permeability reliability evaluation.

[0181] FIG. 7 shows the results of evaluating the moisture permeability reliability over time under high temperature and high humidity conditions of 85° C. and 85%.

[0182] In FIG. 7, Comparative Example 1 is a case where a conventional sealing part has about 0.08t of invar on an adhesive layer, and Comparative Example 2 is a case where only an amorphous metal reinforcing substrate is provided on the adhesive layer.

[0183] 7, Experimental Example 1 is a case where a reinforcing substrate is provided on a metal layer according to the above-mentioned embodiment of the present invention, and Experimental Example 2 is a case where a metal layer is provided on a reinforcing substrate according to the above-mentioned other embodiment of the present invention. Here, for example, the metal layer may be made of aluminum foil of about 40 um, and the reinforcing substrate may be made of an amorphous metal thin film of an iron-based alloy of about 20 um-40 um.

[0184] Referring to FIG. 7, it can be seen that Comparative Example 1, which includes invar, meets the moisture permeability reliability, but Comparative Example 2, which includes only an amorphous metal reinforcing substrate, does not meet the moisture permeability reliability under high temperature and high humidity conditions.

[0185] In contrast, in the cases of Experimental Examples 1 and 2 in which the aluminum foil metal layer was provided on the upper and lower parts of the amorphous metal reinforcing substrate, it was found that the moisture permeability reliability was satisfied. As a result, the present invention can configure a sealing part with a laminated structure of a low-rigidity nonmagnetic soft metal thin film and a high-rigidity, high-magnetic permeability amorphous metal thin film.

[0186] A display device according to an embodiment of the present invention can be described as follows.

[0187] A display device according to an embodiment of the present invention may include a display unit for displaying an image, a metal layer disposed on an upper portion of the display unit, and a reinforcing substrate disposed on an upper portion of the metal layer and made of an amorphous metal thin film.

[0188] In another embodiment of the present invention, a display device may include a display unit for displaying an image, a reinforcing substrate disposed on an upper portion of the display unit and made of an amorphous metal thin film, and a metal layer disposed on an upper portion of the reinforcing substrate.

[0189] According to another aspect of the present invention, the display unit may include a transistor layer, a planarization layer on the transistor layer, and a light emitting element layer on the planarization layer.

[0190] According to another aspect of the present invention, the metal layer may be made of a non-magnetic soft metal thin film having a low stiffness of 100-350 Mpa.

[0191] According to another aspect of the present invention, the metal layer may be made of an aluminum (Al) thin film.

[0192] According to another aspect of the present invention, the metal layer may have a thickness of 30um-50um.

[0193] According to another aspect of the present invention, the reinforcing substrate may be made of an amorphous metal thin film of an Fe-based alloy.

[0194] According to another aspect of the present invention, the amorphous metal thin film may include at least one impurity selected from the group consisting of iron (Fe), boron (B), silicon (Si), nickel (Ni), niobium (Nb) and copper (Cu) based on iron (Fe).

[0195] According to another aspect of the present invention, the amorphous metal thin film may contain 65-85% of iron.

[0196] According to another aspect of the present invention, the reinforcing substrate may have a thickness of 20um-40um.

[0197] According to another aspect of the present invention, the display device may further include a first adhesive layer disposed between the display unit and the metal layer, and a second adhesive layer disposed between the metal layer and the reinforcing substrate.

[0198] According to another aspect of the present invention, the display device may further include a first adhesive layer disposed between the display unit and the reinforcing substrate, and a second adhesive layer disposed between the reinforcing substrate and the metal layer.

[0199] According to another aspect of the present invention, the first adhesive layer and the second adhesive layer may be made of a polymer material having adhesive properties.

[0200] According to another aspect of the present invention, the first adhesive layer may be made of any one of olefin-based, acrylate-based, urethane-based, and epoxy-based polymer materials.

[0201] According to another aspect of the present invention, the first adhesive layer may have a thickness of 40 um to 60 um.

[0202] According to another aspect of the present invention, the second adhesive layer may be made of any one of olefin-based, epoxy-based, acrylate-based, urethane-based, amine-based, phenol-based, and acid anhydride-based polymer materials.

[0203] According to another aspect of the present invention, the second adhesive layer may be made of a mixture containing particles of the polymer material and a metal material.

[0204] According to another aspect of the present invention, the second adhesive layer may have a thickness of 5 um-30 um.

[0205] According to another aspect of the present invention, the reinforcing substrate may be made of an amorphous metal thin film having a tensile strength of 1 Gpa or more.

[0206] According to another aspect of the present invention, the metal layer may have a greater electromagnetic wave reflection value than the reinforcing substrate, and the reinforcing substrate may have a greater electromagnetic wave absorption value than the reinforcing substrate.

[0207] Although the embodiments of the present invention have been described in detail above with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications can be made within the scope of the technical idea of ​​the present invention. Therefore, the embodiments disclosed in the present invention are for illustration purposes, not for limiting the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative and not restrictive in all respects. The scope of protection of the present invention should be interpreted according to the following claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention. [Explanation of symbols]

[0208] 100, 200: Display device 101: Substrate 102: Buffer layer 102a: first buffer layer 102b: second buffer layer 103: Gate insulating layer 104: Interlayer insulating layer 105: Flattening layer 105a: First planarization layer 105b: Second planarization layer 106: Bank 107: Capping layer 130: Sealing member 131, 231: 1st adhesive layer 132, 232: Metal layer 133, 233: Second adhesive layer 140, 240: Reinforcement substrate 150: Organic light-emitting element 151: Anode 152:Organic layer 153: Cathode AA:Display area DP: Display unit EDL: Light emitting device layer FSPM: Sealing part NA: Hidden area PLN: Planarization layer TRL: Transistor layer

Claims

1. A display unit for displaying images; a metal layer disposed on top of the display portion; a reinforcing substrate disposed on the metal layer and composed of an amorphous metal thin film; a first adhesive layer disposed between the display portion and the metal layer; and a second adhesive layer disposed between the metal layer and the reinforcing substrate; Including, the first adhesive layer and the second adhesive layer are made of a polymeric material having adhesive properties, At least one of the first adhesive layer and the second adhesive layer contains particles of a metal material.

2. A display unit for displaying images; a reinforcing substrate disposed on the display unit and made of an amorphous metal thin film; a metal layer disposed on the stiffening substrate; A first adhesive layer disposed between the display unit and the reinforcing substrate; and a second adhesive layer disposed between the reinforcing substrate and the metal layer; Including, the first adhesive layer and the second adhesive layer are made of a polymeric material having adhesive properties, At least one of the first adhesive layer and the second adhesive layer contains particles of a metal material.

3. The display unit includes: Transistor layer; a planarization layer on top of the transistor layer; and The light-emitting element layer on the planarization layer The display device according to claim 1 or 2, comprising:

4. 4. The display device according to claim 3, wherein the metal layer is made of a non-magnetic soft metal thin film having a rigidity of 100-350 MPa.

5. The display device according to claim 4 , wherein the metal layer is made of an aluminum (Al) thin film.

6. The display device of claim 5, wherein the metal layer has a thickness of 30um-50um.

7. 4. The display device according to claim 3, wherein the reinforcing substrate is made of an amorphous metal thin film of an iron-based alloy.

8. 4. The display device according to claim 3, wherein the amorphous metal thin film is based on iron (Fe) and contains at least one impurity selected from the group consisting of boron (B), silicon (Si), nickel (Ni), niobium (Nb) and copper (Cu).

9. 9. The display device according to claim 8, wherein the amorphous metal thin film contains 65-85% iron.

10. The display device of claim 7, wherein the reinforcing substrate has a thickness of 20um-40um.

11. A display device as described in claim 1 or 2, wherein the particles of the metal material contain nickel (Ni).

12. The display device of claim 1 , wherein the first adhesive layer is made of any one of an olefin-based, an acrylate-based, a urethane-based, and an epoxy-based polymer material.

13. The display device of claim 1 , wherein the first adhesive layer has a thickness of 40 um to 60 um.

14. The display device of claim 1 , wherein the second adhesive layer is made of any one of olefin-based, epoxy-based, acrylate-based, urethane-based, amine-based, phenol-based, and acid anhydride-based polymer materials.

15. The display device of claim 1 , wherein the second adhesive layer has a thickness of 5 um to 30 um.

16. 5. The display device according to claim 4, wherein the reinforcing substrate is made of an amorphous metal thin film having a tensile strength of 1 Gpa or more.

17. The display device of claim 16 , wherein an electromagnetic wave reflection value of the metal layer is greater than an electromagnetic wave reflection value of the reinforcing substrate, and an electromagnetic wave absorption value of the reinforcing substrate is greater than an electromagnetic wave absorption value of the metal layer.

Images