Optical element driving device, camera module, and camera-mounted device

Abstract

To protect a coil.SOLUTION: An optical element drive device has a coil and a magnet which work together to move a mobile unit for holding an optical element to a fixation unit for supporting the mobile unit. The magnet is arranged in the mobile unit and the coil is arranged in the fixation unit. The fixation unit has a second recessed part for storing the coil and a main surface located closer to the light reception side in the direction of the optical axis than the bottom part on which the coil is placed in the second recessed part. In the main surface, a protective member is set to cover at least a part of the coil.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to an optical element driving device, a camera module, and a camera-mounted device. [Background technology]

[0002] In general, a small camera module is mounted on a mobile terminal such as a smartphone. Such a camera module uses an optical element driving device that drives an optical element.

[0003] The optical element driving device has an autofocus function (hereinafter referred to as the "AF function": AF: Auto Focus) and an image stabilization function (hereinafter referred to as the "OIS function": OIS: Optical Image Stabilization). The optical element driving device uses the AF function to automatically adjust the focus when photographing a subject, and uses the OIS function to optically correct shake (vibration) that occurs during shooting to reduce image distortion.

[0004] For example, Patent Document 1 discloses an optical element driving device having an AF function and an OIS function. The optical element driving device disclosed in Patent Document 1 includes a lens holder capable of holding a lens, a first driving unit having a coil and a magnet and moving the lens holder in the direction of the optical axis (optical axis direction), and a second driving unit moving the lens holder in a direction intersecting the optical axis (direction perpendicular to the optical axis).

[0005] The optical element driving device shown in Patent Document 1 is provided with a Hall element that detects the position of the lens holder by detecting changes in the magnetic flux of an opposing magnet. This Hall element is mounted on a flexible printed circuit (FPC: Flexible Printed Circuits) and installed in a position aligned with the coil on the outer periphery of the lens holder.

[0006] Also, as an example of an optical element driving device in which a Hall element for detecting the position of a lens holder is disposed, for example, the one described in Patent Document 2 is known. Patent Document 2 proposes a configuration in which the Hall element is not mounted on a board but directly fitted into a recess in the fixed part, addressing issues such as size increase due to mounting the Hall element on the FPC, the effect of the external shape accuracy and mounting accuracy of the FPC on the mounting accuracy of the Hall element, and the difficulty of handling due to mounting the Hall element on the FPC. A wiring member is insert-molded in the fixed part, and the Hall element is electrically connected to a circuit board that holds the imaging element via this wiring member. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2016-180836 A [Patent Document 2] JP 2015-175879 A [Patent Document 3] JP 2019-66568 A Summary of the Invention [Problem to be solved by the invention]

[0008] An object of the present invention is to provide an optical element driving device, a camera module, and a camera-mounted device that are capable of protecting a coil. [Means for solving the problem]

[0009] One aspect of the optical element driving device according to the present invention is to An optical element driving device including a movable part capable of holding an optical element and a fixed part supporting the movable part, The above Moving parts The above a coil and a magnet that cooperate to move the coil relative to a fixed portion; the magnet is disposed on the movable part, and the coil is disposed on the fixed part, the fixing portion has a second recess that accommodates the coil and a main surface that is located closer to an object in the optical axis direction than a bottom portion of the second recess on which the coil is placed, and has a rectangular outer shape surrounding a central opening in a plan view in the optical axis direction, Further comprising a protective member covering at least a portion of the coil; The main surface is The above a mounting surface on which a protective member is placed, and a convex portion formed to be convex toward an object side in an optical axis direction from the mounting surface and to restrict a displacement of the protective member, the protective member is a plate or a film having a shape corresponding to a shape of the fixing portion, The protrusions are formed on the four sides of the fixing portion at positions on the outer periphery of the protective member.

[0010] One aspect of the camera module according to the present invention is The optical element driving device, The optical element; An imaging unit that captures a subject image formed by the optical element.

[0011] One aspect of the camera-equipped device according to the present invention is to A camera-equipped device that is an information device or a transport device, The camera module described above; and an image processing unit that processes image information obtained by the camera module. Effect of the Invention

[0012] According to the present invention, the coil can be protected. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1A is a front view of an example of a camera-mounted device that is equipped with a camera module according to an embodiment of the present invention, and FIG. 1B is a rear view of the same camera-mounted device. [Diagram 2]FIG. 2A is a front view of another example of a camera-mounted device equipped with a camera module according to the present embodiment, and FIG. 2B is a perspective view of the same camera-mounted device. [Diagram 3] 1 is a perspective view showing a schematic configuration of a camera module according to an embodiment of the present invention; [Figure 4] 1 is an external perspective view of an optical element driving device of a camera module according to an embodiment of the present invention. [Diagram 5] 1 is an exploded perspective view of the camera module according to the embodiment, seen from above, with a cover removed from the optical element driving device. FIG. [Figure 6] FIG. 6 is an exploded perspective view of the state shown in FIG. 5, seen from below. [Figure 7] 6 is an exploded perspective view of the optical element driving device shown in FIG. 5 with an OIS movable part detached from an OIS fixed part, as viewed from above. [Figure 8] FIG. 8 is an exploded perspective view of the state shown in FIG. 7, seen from below. [Figure 9] 8 is a diagram explaining wiring in the OIS fixing portion shown in FIG. 7. FIG. [Figure 10] 8 is an exploded perspective view of the OIS fixing portion shown in FIG. 7 with a Hall element chip assembly and an OIS coil removed from a base member, as viewed from above. FIG. [Figure 11A] 6 is a side view illustrating the structure of four corner pillars of a base member in the optical element driving device shown in FIG. 5. [Figure 11B] 6 is a plan view illustrating the structure of four corner pillars of a base member in the optical element driving device shown in FIG. 5. [Figure 12] 6 is a diagram for explaining the driving principle of an AF driving section in the optical element driving device shown in FIG. 5. [Figure 13] 6 is a diagram for explaining the driving principle of an OIS driving section in the optical element driving device shown in FIG. 5. [Figure 14] 14A is a plan view showing a state in which a Hall element chip assembly is attached to the base member shown in FIG. 10, and FIG. 14B is a plan view showing a state in which an OIS coil is further attached to the state shown in FIG. 14A. [Figure 15] 14C is a cross-sectional view taken along the line XV-XV in FIG. 14B, showing a state in which the protective member shown in FIG. 7 is further attached. [Figure 16] 7 is a diagram showing a modified example of a displacement restriction mechanism for the protection member in the optical element driving device shown in FIG. [Figure 17] 7A and 7B are diagrams illustrating modified examples of the protective member in the optical element driving device shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

[0015] [Configuration of camera-equipped device] First, a camera-mounted device to which a camera module according to the present embodiment is applied will be described.

[0016] 1A and 1B are diagrams showing a smartphone M (an example of a device equipped with a camera) equipped with a camera module A according to the present embodiment. FIG. 1A is a front view of the smartphone M, and FIG. 1B is a rear view of the smartphone M. The smartphone M has one or more rear cameras OC, to which a camera module A is applied. The camera module A has an AF function and an OIS function, and can automatically adjust the focus when photographing a subject, and can optically correct shaking (vibration) that occurs during shooting to capture an image without image blur.

[0017] 2A and 2B are diagrams showing an automobile V (another example of a camera-mounted device) equipped with an in-vehicle camera module VC (Vehicle Camera). FIG. 2A is a front view of the automobile V, and FIG. 2B is a rear perspective view of the automobile V. As shown in FIGS. 2A and 2B, the in-vehicle camera module VC is attached, for example, to the windshield facing forward or to the rear gate facing backward. This in-vehicle camera module VC is used for a backup monitor, a drive recorder, collision avoidance control, automatic driving control, etc. A camera module A is applied to the in-vehicle camera module VC of the automobile V.

[0018] In this embodiment, the camera module A is applied to a smartphone M as an example, but the camera module A can be applied to various camera-mounted devices that have the camera module A and an image processing unit that processes image information obtained by the camera module A. For example, the camera-mounted devices include various information devices and transportation equipment. Information devices include, for example, mobile phones with cameras, notebook computers, tablet terminals, portable game consoles, web cameras, in-vehicle devices with cameras (for example, rear monitor devices, drive recorder devices), drones, etc. Furthermore, transportation equipment includes, for example, automobiles, drones, etc.

[0019] [Camera module configuration] Next, a schematic configuration of the camera module A will be described. Note that a Cartesian coordinate system (X, Y, Z) is used in the description of this embodiment. Note that in this embodiment, the intermediate directions between the X direction and the Y direction in the XY plane will be described as the U direction and the V direction (see Figs. 12 and 13). For example, the U direction and the Y direction are diagonal directions in the planar shape of the camera module A, which is a square in this embodiment. Note that the expressions relating to shapes used in the description of this embodiment are convenient expressions for a simple outline description, and it goes without saying that they do not necessarily apply to geometrically accurate definitions of figures.

[0020] Fig. 3 is a perspective view showing a schematic configuration of the camera module A. When a photograph is taken with a smartphone M, for example, the camera module A is mounted so that the X direction is the up-down direction (or left-right direction), the Y direction is the left-right direction (or up-down direction), and the Z direction is the front-rear direction. That is, the Z direction is the optical path direction, and in Fig. 3, the upper side (+Z side) is the light receiving side (also called the macro position side) of the optical path direction, and the lower side (-Z side) is the image forming side (also called the infinity position side) of the optical path direction. The direction perpendicular to the Z direction is the optical path perpendicular direction, and the X direction and the Y direction are examples of the optical path perpendicular direction.

[0021] Here, the optical path is the path of light formed by the opening 301 of the cover 3 described later, the lens housing opening 110a1 that houses the lens unit 2 in the AF movable unit 11 described later, or the central opening 250 for the image sensor 502 in the OIS fixed unit 20 described later (see FIG. 4). The direction in which this optical path extends (the penetrating direction of each opening) is the optical path direction. The optical path direction may be called by other names such as the optical axis direction or the focal direction (the direction for adjusting the focus) based on the type of optical element, etc. The direction perpendicular to the optical path may be called the optical axis perpendicular direction or the shake correction direction, etc., and the XY plane may be called the optical axis perpendicular plane or the shake correction plane, etc.

[0022] In the following description, unless otherwise specified, "radial direction" means a direction extending radially or centrifugal around the optical path or optical axis, "circumferential direction" means a direction extending around the optical path or optical axis, and unless otherwise specified, "outside" means the outside in the radial direction around the optical path or optical axis, and "inside" means the inside in the radial direction around the optical path or optical axis.

[0023] In the following description, the four corners of the planar shape (square in this embodiment) of the camera module A may be identified separately. In this case, for convenience, the corner on the positive X-direction side and the positive Y-direction side is referred to as a first corner, the corner on the negative X-direction side and the positive Y-direction side is referred to as a second corner, the corner on the negative X-direction side and the negative Y-direction side is referred to as a third corner, and the corner on the positive X-direction side and the negative Y-direction side is referred to as a fourth corner.

[0024] As shown in FIG. 3, the camera module A includes an optical element driving device 1 that realizes AF and OIS functions, a lens unit 2 (an example of an optical element) in which a lens is housed in a cylindrical lens barrel, and an imaging unit 5 that captures a subject image formed by the lens unit 2.

[0025] The optical element driving device 1 is covered on the outside with a cover 3. The cover 3 is a rectangular covered square cylinder in a plan view from the Z direction. In this embodiment, the cover 3 has a square shape in a plan view. The cover 3 has a substantially circular opening 301 on the upper surface (the surface on the +Z direction side). The lens unit 2 faces the outside from the opening 301 of the cover 3. The cover 3 is fixed to the base member 25 of the OIS fixing unit 20 of the optical element driving device 1, for example, by adhesion. The cover 3 is made of, for example, a magnetic material, and functions as a shielding member that blocks electromagnetic waves from the outside of the optical element driving device 1 and prevents magnetic interaction between the inside and outside of the optical element driving device 1.

[0026] The imaging unit 5 is disposed on the imaging side (negative side in the Z direction) of the optical element driving device 1. The imaging unit 5 has, for example, an image sensor board 501, an imaging element 502 mounted on the image sensor board 501, and a control unit 503. The imaging element 502 is configured, for example, with a CCD (charge-coupled device) type image sensor, a CMOS (complementary metal oxide semiconductor) type image sensor, or the like, and captures an image of a subject formed by the lens unit 2. The optical element driving device 1 is mounted on the image sensor board 501 and electrically connected to the image sensor board 501.

[0027] The control unit 503 is configured by, for example, a control IC (Integrated Circuit), and performs drive control of the optical element driving device 1. The control unit 503 may be provided in the image sensor substrate 501, or may be provided in a camera-mounted device (in this embodiment, a smartphone M) on which the camera module A is mounted.

[0028] In this embodiment, the optical element driving device 1 is configured to move the lens unit 2 of the OIS movable unit in the optical axis direction and in the direction orthogonal to the optical axis with respect to the image sensor substrate 501 whose position is fixed, but for the purpose of focusing or image blur correction, the lens unit 2 may be fixed (immovable) and the image sensor 502 may be movable (movable) in at least one of the optical axis direction and the direction orthogonal to the optical axis. In this case, the image sensor 502 is an example of an optical element held by the AF movable unit or the OIS movable unit.

[0029] [Configuration of the optical element driving device] Next, the configuration of the optical element driving device 1 will be described with reference to Figures 4 to 11. In the description of the configuration of the optical element driving device 1, for convenience, the + side in the Z direction will be referred to as "upper" and the - side in the Z direction will be referred to as "lower."

[0030] FIG. 4 is an external perspective view of the optical element driving device 1. FIGS. 5 and 6 are exploded perspective views of the optical element driving device 1 with the cover 3 removed, as viewed from above and below. FIGS. 7 and 8 are exploded perspective views of the optical element driving device 1 with the OIS movable part 10 removed from the OIS fixing part 20, as viewed from above and below. FIG. 9 is a diagram for explaining wiring in the OIS fixing part 20. FIG. 10 is an exploded perspective view of the OIS fixing part 20 with the Hall element chip assemblies 231A, 231D and the OIS coils 22A to 22D removed from the base member 25, as viewed from above. FIGS. 11A and 11B are a side view and a plan view for explaining the structure of the four corner pillar parts 259 of the base member 25 in the optical element driving device 1.

[0031] The optical element driving device 1 has an OIS movable section 10, an OIS fixed section 20, and an OIS support section 30.

[0032] The OIS movable part 10 has an OIS magnet part constituting an OIS voice coil motor, which is an example of an OIS drive part, and is a part that oscillates in a plane perpendicular to the optical axis during shake correction. The OIS fixed part 20 has an OIS coil part. In other words, the OIS drive part of the optical element drive device 1 uses a moving magnet system. The OIS movable part 10 is also an "AF unit" that includes an AF drive part.

[0033] The OIS movable part 10 is disposed on the OIS fixed part 20 at a distance from the OIS fixed part 20 on the +Z direction side (the light receiving side or upper side in the optical axis direction) and is connected to the OIS fixed part 20 by the OIS support part 30.

[0034] [About OIS Support Unit] The OIS support part 30 is composed of multiple suspension wires extending along the Z direction (hereinafter referred to as "suspension wires 30" instead of "OIS support part 30"). One end (lower end) of each suspension wire 30 is fixed to the OIS fixed part 20, and the other end (upper end) is fixed to the OIS movable part 10 (specifically, the upper elastic support part 13). The OIS movable part 10 is supported by the suspension wires 30 so as to be swingable within a plane perpendicular to the optical axis.

[0035] In this embodiment, the suspension wires 30 are arranged in pairs at each of the four corners. In this arrangement, the spring constant per wire can be made lower (in other words, the flexibility can be made higher) compared to the case where one wire is arranged at each of the four corners, and yet the same weight of the OIS movable part can be supported. This makes it possible to achieve both stable support performance and swing performance in shake correction. In addition, since stress is less likely to concentrate on each suspension wire 30, durability can also be improved.

[0036] The suspension wires 30 arranged at each of the four corners are all or selectively used as power supply paths to the AF coil section 111. The number of suspension wires 30 is not limited to eight, and may be less than eight or more than eight as long as the performance of swingably supporting the OIS movable section 10 is maintained. The configuration of the OIS support section is not limited to a linear member such as a suspension wire, and may be a configuration in which the OIS movable section 10 is swingably supported by a frame body having a base material of a resin material such as elastomer. In the present embodiment, the suspension wires 30 are members formed of a metal material for the purpose of power supply and signal transmission, but as long as a means for power supply and signal transmission is separately secured, the suspension wires 30 do not necessarily need to be formed of a metal material.

[0037] [About the OIS moving parts] The OIS movable portion 10 (also referred to as an AF unit) has an AF movable portion 11, an AF fixed portion 12, and an AF support portion (an upper elastic support portion 13 and a lower elastic support portion 14).

[0038] [About the AF moving parts] The AF movable part 11 is disposed radially inwardly and spaced apart from the AF fixed part 12, and is connected to the AF fixed part 12 by an upper elastic support part 13 and a lower elastic support part .

[0039] The AF movable part 11 has a coil part constituting an AF voice coil motor, which is an example of an AF drive part, and is a part that moves in the Z direction (optical axis direction) relative to the AF fixed part 12 during focusing. The AF fixed part 12 has a magnet part constituting an AF voice coil motor. That is, the AF drive part of the optical element drive device 1 employs a moving coil system.

[0040] The AF movable part 11 includes a lens holder 110 and an AF coil part 111 .

[0041] The lens holder 110 has a cylindrical lens housing portion 110a. The lens portion 2 is fixed to the inner peripheral surface of an opening (lens housing opening) 110a1 of the lens housing portion 110a by, for example, adhesion. Note that the method of fixing the lens portion 2 to the lens holder 110 is not limited to adhesion, and other methods may be used.

[0042] The lens holder 110 is formed from a molding material made of, for example, polyarylate (PAR) or a PAR alloy (for example, PAR / PC) made by mixing multiple resin materials including PAR. This increases the weld strength compared to conventional molding materials, for example, liquid crystal polymer (LCP: Liquid Crystal Polymer), so that toughness and impact resistance can be ensured even if the lens holder 110 is made thin. Therefore, the external size of the optical element driving device 1 can be reduced, and the device can be made compact and lightweight.

[0043] The lens holder 110 has an upper flange and a lower flange (not shown) that protrude radially outward from the upper and lower parts, respectively, of the outer circumferential surface of the lens housing part 110a, and a continuous groove is formed over the entire circumference between the upper flange and the lower flange on the outer circumferential surface. In other words, the lens holder 110 has a bobbin structure. The AF coil part 111 is arranged in the groove on the outer circumferential surface of the lens holder 110.

[0044] The AF coil section 111 is a coil to which current is applied during focusing. Both ends of the AF coil section 111 are wound around winding sections (not shown) provided on the lens holder 110.

[0045] Regarding the details of the configuration of the AF movable part 11, since known techniques described in, for example, Patent Document 3 can be appropriately adopted, a detailed description thereof will be omitted here.

[0046] [About the AF fixed part] The AF fixed portion 12 supports the AF movable portion 11 by the AF support portion so as to be movable in the optical axis direction. The AF fixed portion 12 has a magnet holder 12a and a magnet portion 125.

[0047] The magnet holder 12a has a square cylindrical shape in a plan view from the Z direction, and has magnet arrangement sections in the portions of its inner circumferential surface corresponding to the four corners, where the magnet section 125 is arranged. The inner hollow section defined by the magnet holder 12a and the magnet section 125 attached to the magnet arrangement section constitutes a lens holder accommodation opening that accommodates the AF movable section 11.

[0048] A groove recessed radially inward is formed at each of the four corners on the outer circumferential surface of the magnet holder 12a, and each groove accommodates a suspension wire 30. A damper material (e.g., silicone gel) may be placed in this groove, and the placement of the damper material can suppress the occurrence of unwanted resonance (higher-order resonance modes) and stabilize the operation of the OIS.

[0049] In the magnet holder 12a, a lower elastic support part 14 is fixed to the end face (rear face) on the negative side in the Z direction, and an upper elastic support part 13 is fixed to the face (front face) on the positive side in the Z direction.

[0050] In this embodiment, the magnet holder 12a is formed of a molding material made of polyarylate (PAR) or a PAR alloy (e.g., PAR / PC) made by mixing a plurality of resin materials including PAR, like the lens holder 110. This increases the weld strength, so that the toughness and impact resistance can be ensured even if the magnet holder 12a is thinned. Therefore, the external size of the optical element driving device 1 can be reduced, and the optical element driving device 1 can be made compact and low-profile.

[0051] The magnet section 125 has four rectangular columnar permanent magnets 125A to 125D (an example of a magnet). The permanent magnets 125A to 125D are fixed to the magnet arrangement section by, for example, adhesion. In this embodiment, the permanent magnets 125A to 125D have a substantially isosceles trapezoidal shape in a plan view.

[0052] This allows for effective use of the spaces (specifically, magnet arrangement sections) at the corners of magnet holder 12a. Permanent magnets 125A-125D are magnetized to generate a magnetic field that crosses AF coil section 111 in the radial direction as shown in Fig. 12 and crosses OIS coil section 22 in the optical axis direction as can be seen from Fig. 13. In this embodiment, permanent magnets 125A-125D are magnetized with an N pole on the inner circumference side and an S pole on the outer circumference side.

[0053] The end faces (rear faces) of the permanent magnets 125A-125D on the negative side in the Z direction protrude further toward the negative side in the Z direction than the magnet holder 12a. That is, the height of the OIS movable part 10 is determined by the permanent magnets 125A-125D. This makes it possible to minimize the height of the OIS movable part 10 according to the size of the permanent magnets 125A-125D for ensuring the magnetic force, thereby making it possible to reduce the height of the optical element driving device 1.

[0054] An AF voice coil motor (AF drive section) is configured by the above-described magnet section 125 and AF coil section 111. The magnet section 125 is used as both an AF magnet section and an OIS magnet section.

[0055] Regarding the detailed configuration of the AF fixing unit 12, since it is possible to appropriately adopt known techniques described in, for example, Patent Document 3, etc., a detailed description thereof will be omitted here.

[0056] [About the AF support part] The AF support part elastically supports the AF movable part 11 with respect to the AF fixed part 12. In this embodiment, the AF support part has an upper elastic support part 13 and a lower elastic support part 14. In this embodiment, the upper elastic support part 13 and the lower elastic support part 14 are both leaf springs. Therefore, in the following description, the terms "upper elastic support part 13" and "lower elastic support part 14" will be replaced with "upper leaf spring 13" and "lower leaf spring 14", respectively. The leaf spring is made of, for example, beryllium copper, nickel copper, or stainless steel.

[0057] The upper leaf spring 13 is fixed on the outside to the surface (surface) on the +Z direction side of the magnet holder 12a, and on the inside to the surface (surface) on the +Z direction side of the lens holder 110. In the upper leaf spring 13, an arm portion extending to an intermediate portion between the outside and the inside is elastically deformable, so that the inside portion of the upper leaf spring 13 is displaceable in the Z direction relative to the outside portion of the upper leaf spring 13.

[0058] Upper leaf spring 13 has an outer extension portion that extends further outward than the outer portion fixed to the surface of magnet holder 12a. The outer extension portion is disposed on the +Z direction side of the groove in magnet holder 12a in which suspension wire 30 is disposed. The outer extension portion is wire fixing portion 131 to which the upper end of suspension wire 30 is fixed by solder.

[0059] At each of the four corners, a pair of wire fixing portions 131 to which two adjacent suspension wires 30 are fixed may be connected and integrated between the two adjacent suspension wires 30, or may be divided by a slit 131a between the two adjacent suspension wires 30 and made independent of each other.

[0060] In the case where a pair of wire fixing parts 131 are integrated, when one wire fixing part 131 and one suspension wire 30 are soldered together and then the other wire fixing part 131 and the other suspension wire 30 are soldered together, there is a risk of a malfunction in which heat is transferred to the previously joined solder via the connection between the pair of wire fixing parts 131, causing remelting and even separation of the joint. There is also a risk of a malfunction in which the vibration behavior of two adjacent suspension wires 30 affects each other. In response to this, the risk of such malfunctions occurring can be suppressed by separating and making independent the pair of wire fixing parts 131, for example, by using slits 131a.

[0061] The upper leaf spring 13 is separated into a power supply path portion connected to the suspension wire 30 used as a power supply path to the AF control unit (not shown), and a signal path portion connected to the suspension wire 30 used as a signal path for transmitting a control signal to the AF control unit (not shown). The upper leaf spring 13 constituting the power supply path portion is connected to the AF coil unit 111 by soldering at a knotting portion provided on the magnet holder 12a.

[0062] The lower leaf spring 14 is fixed on the outside to the Z-direction negative surface (back surface) of the magnet holder 12a, and on the inside to the Z-direction negative surface (back surface) of the lens holder 110. In the lower leaf spring 14, an arm portion extending to an intermediate portion between the outside and the inside is elastically deformable, so that the inside portion of the lower leaf spring 14 is displaceable in the Z direction relative to the outside portion of the lower leaf spring 14.

[0063] Regarding the details of the configuration of the AF support portion, since known techniques described in, for example, Patent Document 3 can be appropriately adopted, a detailed description thereof will be omitted here.

[0064] [About the OIS fixing part] The OIS fixed section 20 supports the OIS movable section 10 so that it can swing in a direction perpendicular to the optical axis by means of suspension wires 30. The OIS fixed section 20 has an OIS coil section 22, a magnetic sensor section 23, a protective member 24, a base member 25, and a wiring member 27.

[0065] [About the OIS coil] The OIS fixing portion 20 has OIS coil portions 22 at the positions of the four corners facing the magnet portion 125 in the Z direction (optical axis direction). The OIS coil portion 22 is a coil to which current is applied during shake correction. The OIS coil portion 22 has four OIS coils 22A-22D corresponding to the permanent magnets 125A-125D. In this embodiment, the OIS coils 22A-22D are air-core coils.

[0066] The sizes and arrangements of OIS coils 22A-22D and permanent magnets 125A-125D are set so that the magnetic field radiated from the bottom surfaces of permanent magnets 125A-125D crosses the long sides of each of OIS coils 22A-22D in the Z direction (see FIG. 13). The combination of magnet section 125 and OIS coil section 22 constitutes an OIS voice coil motor (OIS drive section).

[0067] Ends of lead wires provided at both ends of each of OIS coils 22A-22D are connected by solder to coil terminal elements 27a1 (an example of a coil terminal) of wiring member 27 provided on base member 25. That is, in this embodiment, each of OIS coils 22A-22D is directly connected to coil terminal elements 27a1 without going through a substrate. Coil recesses (an example of a second recess) 252A-252D for arranging each of OIS coils 22A-22D are provided on base member 25, and each of OIS coils 22A-22D is arranged in coil recesses 252A-252D at the four corners, respectively. Details of the arrangement of each of OIS coils 22A-22D on base member 25 will be described later.

[0068] [About the magnetic sensor] The OIS fixed part 20 has a magnetic sensor part 23 in a hollow part at the center of the corresponding OIS coil 22A, 22D at a first corner and a fourth corner of the four corners. The magnetic sensor part 23 detects the position of the OIS movable part 10 in the plane perpendicular to the optical axis based on the relative positions of the permanent magnets 125A, 125D and the Hall elements 231A1, 231D1 in the plane perpendicular to the optical axis, which is determined by detecting the magnetic field formed by the magnet part 125 (permanent magnets 125A, 125D) with the Hall elements 231A1, 231D1. The magnetic sensor part 23 has Hall element chip assemblies 231A, 231D. The Hall element chip assemblies 231A, 231D have Hall elements 231A1, 231D1 (examples of magnetic sensors) and magnetic sensor substrates 231A2, 231D2 on which the chips of the Hall elements 231A1, 231D1 are mounted. The magnetic sensor substrates 231A2 and 231D2 are, for example, printed wiring boards (PWBs).

[0069] The Hall elements 231A1 and 231D1 are provided in the center of the main surface of the magnetic sensor substrates 231A2 and 231D2, and substrate side terminals are provided in the periphery thereof. The substrate side terminals are connected by solder to substrate terminal elements 27b1 (an example of substrate terminals) of the wiring member 27 provided on the base member 25. That is, in this embodiment, the Hall elements 231A1 and 231D1 are connected to the substrate terminal elements 27b1 via the magnetic sensor substrates 231A2 and 231D2. The base member 25 is provided with substrate recesses (an example of first recesses) 254A and 254D for arranging the Hall element chip assemblies 231A and 231D, and the Hall element chip assemblies 231A and 231D are arranged in the substrate recesses 254A and 254D at the four corners, respectively. Details of the arrangement of the Hall element chip assemblies 231A and 231D on the base member 25 will be described later.

[0070] [About the base material] The base member 25 is a square member in a plan view having a central opening 250 through which the optical path or optical axis passes. The base member 25 is made of a non-conductive material such as synthetic resin, for example, liquid crystal polymer (LCP). A wiring member 27 is insert-molded into the base member 25. The wiring member 27 will now be described with reference to FIG. 9. FIG. 9 is a diagram for explaining the wiring in the OIS fixing portion 20.

[0071] The wiring member 27 is a metal plate-shaped member that is insert-molded into the base member 25. The wiring member 27 is made of a conductive material such as beryllium copper, nickel copper, or stainless steel.

[0072] The wiring member 27 includes a coil terminal member 27a, a board terminal member 27b, and a wire terminal member 27c.

[0073] The coil terminal member 27a has a coil terminal element 27a1 and a coil terminal connection portion 27a2. The coil terminal element 27a1 is arranged so as to be exposed upward at the bottom of the coil recesses 252A-252D provided in the base member 25, and is directly connected by solder to the lead wires of the OIS coils 22A-22D arranged in the coil recesses 252A-252D. The coil terminal connection portion 27a2 protrudes from the outer edge of the base member 25 and is connectable to an external image sensor board 501. The coil terminal member 27a is embedded inside the base member 25 except for the portion exposed or protruding from the base member 25.

[0074] The board terminal member 27b has a board terminal element 27b1 and a board terminal connection portion 27b2. The board terminal element 27b1 is arranged so as to be exposed upward at the bottom of the board recesses 254A, 254D provided in the base member 25, and is directly connected by solder to the board side terminal portions of the Hall element chip assemblies 231A, 231D arranged in the board recesses 254A, 254D. The board terminal connection portion 27b2 protrudes from the outer edge of the base member 25 and can be connected to the external image sensor board 501. The board terminal member 27b is embedded inside the base member 25 except for the portion exposed or protruding from the base member 25.

[0075] The wire terminal member 27c has a wire terminal element 27c1 and a wire terminal connection portion 27c2. The wire terminal element 27c1 is arranged so as to be exposed upward and downward at the four corners of the base member 25, and is directly connected by solder to the lower end of the suspension wire 30 inserted into an insertion hole formed in the wire terminal element 27c1. The wire terminal connection portion 27c2 protrudes from the outer edge of the base member 25 and is connectable to an external image sensor board 501. The wire terminal member 27c has a portion other than the portion exposed or protruding from the base member 25 buried inside the base member 25.

[0076] [Protective materials] The protective member 24 is provided so as to cover the area surrounding the central opening 250 in the base member 25. The protective member 24 is a thin plate member or film member made of a non-conductive material such as a resin material. The protective member 24 completely covers the area in which the OIS coils 22A-22D are arranged, and therefore the protective member 24 is interposed between the OIS coils 22A-22D and the permanent magnets 125A-125D in the Z direction. This makes it possible to prevent the OIS coils 22A-22D and the permanent magnets 125A-125D from colliding with each other due to an external impact. It is also possible to prevent the lower leaf spring 14, which is also made of metal, from coming into contact with the OIS coils 22A-22D, which are also made of metal, to cause a short circuit. In the base member 25, the tops and upper surface 258 of the columnar portions 256A to 256D (the tops and upper surface 258 of the columnar portions 256A to 256D may be collectively referred to as the "principal surface") serve as a mounting surface for the protective member 24. On the upper surface 258 constituting the mounting surface for the protective member 24, bosses 2581 are formed on each of the four sides of the base member 25 as a mechanism for regulating the displacement (misalignment) of the attached protective member 24. In the configuration shown in FIG. 7, by forming in the protective member 24 a through hole 24B through which the boss 2581 passes and a notch 24A that fits with the boss 2581, the displacement (misalignment) of the protective member 24 attached to the base member 25 can be regulated.

[0077] Here, as shown in Fig. 16, which shows an enlarged view of the R portion surrounded by a dashed circle in Fig. 10, a boss 2581 protruding upward from the upper surface 258 may be provided on the outer peripheral surface 2583 of the base member 25. When the modified example shown in Fig. 16 is applied, a boss 2581 is provided on each of the four sides of the base member 25. In this case, it is possible to secure a larger area of ​​the flat portion on the mounting surface of the protective member 24 by, for example, eliminating all of the cylindrical bosses 2581 shown in Fig. 10 and the like, and also to simplify the configuration of the protective member 241 by forming a notch 241A in the protective member 241 that fits with the boss 2581 while eliminating the through hole through which the boss passes, as shown as a modified example in Fig. 17.

[0078] 17, the protective member 241 may be a single plate or film having a shape corresponding to the shape of the base member 25 surrounding the central opening 250. Since the protective members 24, 241 are thin and flexible, a single ring-shaped protective member 241 is less likely to twist during assembly and is easier to handle than two arc-shaped protective members 24, which has the advantage of making the assembly work more efficient.

[0079] Incidentally, in this embodiment, the protective member 24 has a shape and dimensions that can completely cover the arrangement area of ​​the OIS coils 22A to 22D, but it does not have to completely cover the arrangement area of ​​the OIS coils 22A to 22D. For example, if it is only necessary to prevent a short circuit due to contact with the lower leaf spring 14, it may be possible to cover only the area of ​​the arrangement area of ​​the OIS coils 22A to 22D that overlaps with the movement range of the lower leaf spring 14, as in the protective member 242 (a further modified example of the protective member 24) whose outline is roughly indicated by a two-dot chain line in Fig. 11B. In this case, if the protective member 242 is made to cover even the columnar portion 256 provided inside the coil opening of the OIS coils 22A to 22D, the placement state of the protective member 242 can be easily stabilized. Furthermore, in the case of the columnar portions 256A and 256D on which the magnetic sensor substrates 231A2 and 231D2 are arranged among the columnar portions 256 at the four corners (see FIG. 10), the protective member 242 can cover the magnetic sensor substrates 231A2 and 231D2 as well, so that not only the OIS coils 22A and 22D but also the magnetic sensor substrates 231A2 and 231D2 can be protected. Furthermore, the protective member 242 may be a single annular plate or film, like the modified example described above, that is, the protective member 241.

[0080] [About the structure of the four corner columns of the base material] Here, a description will be given of the structure of the four corners of the base member 25. Figures 11A and 11B are a side view and a plan view illustrating the structure of the four corner pillars 259 of the base member 25 in the optical element driving device 1.

[0081] The base member 25 has a bottom portion 257 that is square in plan view and located on the negative side in the Z direction (the image formation side in the optical axis direction) with respect to the OIS movable part 10, and four corner pillar portions 259 that extend from the four corners of the bottom portion 257 to the positive side in the Z direction (the light receiving side in the optical axis direction). The surface on the positive side in the Z direction (the light receiving side in the optical axis direction) of the bottom portion 257 faces the OIS movable part 10 and is an upper surface 258 that serves as a mounting surface for the protection member 24. The four corner pillar portions 259 rise from the bottom portion 257 so as to be higher than the height position of the upper surface 258.

[0082] The four corner pillars 259 have an inner pillar 2591 located relatively radially inward and an outer pillar 2592 located relatively radially outward. The inner pillar 2591 has a movable part facing surface 2591a on the radially inner side that faces the outer periphery of the OIS movable part 10, more specifically, the outer periphery of the magnet holder 12a. The movable part facing surface 2591a abuts against the outer periphery of the magnet holder 12a when the OIS movable part 10 moves in the direction perpendicular to the optical axis, thereby functioning as a stopper that can restrict the radial movement of the OIS movable part 10. The outer pillar 2592 has a cover facing surface 2592a on the radially outer side to which the cover 3 can be attached, for example, as an adhesive surface for the inner periphery of the cover 3 when the cover 3 is attached to the optical element driving device 1.

[0083] In order to ensure functionality, it is preferable that the movable part facing surface 2591a of the inner column part 2591, which functions as a stopper, and the cover facing surface 2592a of the outer column part 2592, which functions as an adhesive surface, have a large facing area with the opposing counterpart. Therefore, it is desirable to make both the inner column part 2591 and the outer column part 2592 as high as possible as long as it does not hinder the low profile of the optical element driving device 1. In addition, with regard to the functionality of the four corner column parts 259 as a stopper, it is desirable to suppress as much as possible the impact that will be applied to the magnet holder 12a when it abuts against the magnet holder 12a. Therefore, in this embodiment, the four corner column parts 259, especially the tops of the four corner column parts 259, are provided with dividing grooves 2593 that separate the inner side (inner column part 2591) and the outer side (outer column part 2592) in the radial direction. As a result, at least the tops of the four corner pillars 259 are divided into inner and outer parts, and the inner pillar 2591 can be made thinner in the radial direction, which allows the inner pillar 2591 to have a slight flexibility. This reduces the impact applied to the magnet holder 12a when it comes into contact with the magnet holder 12a. As an example, the position where the dividing groove 2593 is formed is a position where the radial dimension d1 of the inner pillar 2591 is smaller than the radial dimension d2 of the outer pillar 2592. The smaller the radial dimension d1 of the inner pillar 2591, the greater the flexibility of the inner pillar 2591 can be expected.

[0084] [Details of the composition] Other detailed configurations of the OIS fixing portion 20 will not be described in detail here, but known techniques described in, for example, Patent Document 3 and the like can be appropriately adopted.

[0085] [Operation of the optical element driving device] 12 and 13 are diagrams illustrating the driving principles of the AF driving section (AF voice coil motor) and the OIS driving section (OIS voice coil motor) in the optical element driving device 1.

[0086] When automatic focusing is performed in the optical element driving device 1, electricity is applied to the AF coil section 111. When electricity is applied to the AF coil section 111, a Lorentz force is generated in the AF coil section 111 due to the interaction between the magnetic field of the magnet section 125 and the current flowing through the AF coil section 111 (Fleming's left-hand rule). The direction of the Lorentz force in this case is a direction (i.e., Z direction (optical axis direction)) perpendicular to the direction of the magnetic field (direction toward the inside in the radial direction, see FIG. 12) and the direction of the current flowing through the AF coil section 111 (circumferential direction, see FIG. 12). Since the magnet section 125 (permanent magnets 125A to 125D) are fixed, a reaction force acts on the AF coil section 111. This reaction force becomes the driving force of the AF voice coil motor (AF driving section), and the AF movable section 11 having the AF coil section 111 moves in the Z direction (optical axis direction), thereby performing focusing.

[0087] When the optical element driving device 1 performs shake correction, electricity is applied to the OIS coils 22A to 22D. When electricity is applied to the OIS coils 22A to 22D, a Lorentz force is generated in the OIS coils 22A to 22D due to the interaction between the magnetic field of the magnet section 125 and the current flowing through the OIS coils 22A to 22D (Fleming's left-hand rule). In this case, the direction of the Lorentz force is a direction (i.e., V direction or U direction) perpendicular to the direction of the magnetic field (Z direction (optical axis direction), see FIG. 13) and the direction of the current (U direction or V direction, see FIG. 13) in the long side parts of the OIS coils 22A to 22D. Since the OIS coils 22A to 22D are fixed, a reaction force acts on the permanent magnets 125A to 125D. This reaction force becomes the driving force of the OIS voice coil motor (OIS driving section), and the OIS movable section 10 having the magnet section 125 swings in a plane perpendicular to the optical axis, thereby performing shake correction.

[0088] [Regarding the placement of the magnetic sensor and OIS coil parts on the base material in the OIS fixing part] Next, the arrangement of the magnetic sensor section and the OIS coil section on the base member 25 of the OIS fixing section 20 will be described with reference to Figs. 10, 14, and 15. Fig. 10 is an exploded perspective view of the OIS fixing section 20 with the Hall element chip assemblies 231A, 231D and the OIS coils 22A to 22D removed from the base member 25. Fig. 14A is a plan view showing a state in which the Hall element chip assemblies 231A, 231D are attached to the base member 25, and Fig. 14B is a plan view showing a state in which the OIS coils 22A to 22D are further attached to the state shown in Fig. 14A. Fig. 15 is a cross-sectional view taken along the line XV-XV in Fig. 14B with the protective member 24 further attached.

[0089] The base member 25 on which the Hall element chip assemblies 231A, 231D and the OIS coils 22A to 22D are arranged is provided with substrate recesses 254A, 254D and coil recesses 252A, 252B, 252C, 252D.

[0090] The coil recesses 252A-252D are formed at the four corners of the base member 25, radially inward from the position where the suspension wires 30 are arranged and radially outward from the central opening 250. The coil recesses 252A-252D are annular recesses formed in such a way that the columnar portions 256A, 256B, 256C, and 256D are left in the center so as to follow the oval loop shapes of the OIS coils 22A-22D, which are air-core coils. The columnar portions 256A-256D function as positioning members for arranging the OIS coils 22A-22D. The tops of the columnar portions 256A-256D are substantially flush with the surface surrounding the upper edge of the central opening 250 (the upper surface 258 of the base member 25). Therefore, the tops and upper surface 258 of the columnar portions 256A to 256D of the base member 25 function as a surface on which the protection member 24 is placed.

[0091] Among the coil recesses 252A to 252D, the coil recesses 252A and 252D located at the first and fourth corners have substrate recesses 254A and 254D formed to radially cross the columnar portions 256A and 256D and further recess the bottoms of the coil recesses 252A and 252D. The substrate recesses 254A and 254D are rectangular recesses in plan view so as to conform to the outer shapes of the magnetic sensor substrates 231A2 and 231D2 of the Hall element chip assemblies 231A and 231D, which are rectangular in plan view. The substrate recesses 254A and 254D have a slightly narrowed shape at the portions intersecting with the columnar portions 256A and 256D. In other words, a pair of columns constituting each of the columnar portions 256A and 256D partially narrows the width of the substrate recesses 254A and 254D interposed therebetween. Due to such a shape, the columnar portions 256A and 256D function as positioning members when the Hall element chip assemblies 231A and 231D are placed in the substrate recesses 254A and 254D.

[0092] In assembling the Hall element chip assemblies 231A, 231D and the OIS coils 22A-22D to the base member 25, first, the Hall element chip assemblies 231A, 231D are placed in the board recesses 254A, 254D (see FIG. 14A), and the board side terminals of the magnetic sensor boards 231A2, 231D2 are soldered to the board terminal elements 27b1 exposed upward at the bottoms of the board recesses 254A, 254D. Then, the OIS coils 22A-22D are placed in the coil recesses 252A-252D (see FIG. 14B), and the tips of the lead wires on both sides in the longitudinal direction of the OIS coils 22A-22D are soldered to the coil terminal elements 27a1 exposed upward at the bottoms of both ends of the coil recesses 252A-252D.

[0093] That is, the board terminal element 27b1 directly connected to the magnetic sensor boards 231A2, 231D2 in the OIS fixing part 20 (base member 25) is provided so as to be exposed in the board recesses 254A, 254D formed in the bottom center of the coil recesses 252A, 252D. Also, the coil terminal element 27a1 directly connected to the OIS coils 22A, 22D in the OIS fixing part 20 (base member 25) is provided so as to be exposed at both ends of the bottom of the coil recesses 252A, 252D. In this way, the board terminal element 27b1 and the coil terminal element 27a1 are both disposed in the bottom regions of the coil recesses 252A, 252D, but are located at positions spaced apart from each other, so that the soldering work for each can be easily performed.

[0094] The first stage of the assembly work may be performed in the following procedure. First, the magnetic sensor boards 231A2 and 231D2 on which the Hall elements 231A1 and 231D1 are not mounted are placed in the board recesses 254A and 254D, and the board side terminals located on the outer edges of the magnetic sensor boards 231A2 and 231D2 are soldered to the board terminal elements 27b1. Next, the Hall elements 231A1 and 231D1 are attached to the Hall element mounting surfaces located in the center of the magnetic sensor boards 231A2 and 231D2. In this way, even if the magnetic sensor boards 231A2 and 231D2 and the Hall elements 231A1 and 231D1 are individually mounted, the magnetic sensor boards 231A2 and 231D2 can be placed in the board recesses 254A and 254D before proceeding with the work, so that the positioning accuracy can be maintained at a high level.

[0095] The cross-sectional view of FIG. 15 shows a state in which the installation of the Hall element chip assemblies 231A, 231D and the OIS coils 22A to 22D to the base member 25 is complete, and further the attachment of the protective member 24 is also complete.

[0096] 14A and 14B, the depth of the substrate recesses 254A, 254D formed in a part of the bottom of the coil recesses 252A, 252D is greater than or equal to the thickness of the magnetic sensor substrates 231A2, 231D2 as shown in Fig. 15. Therefore, compared to the case where the Hall element is not mounted on the substrate and is used alone, the thickness increases by the amount of the magnetic sensor substrates 231A2, 231D2 used, but the depth of the substrate recesses 254A, 254D offsets this increase, and therefore there is no effect on the thinning of the base member 25. In addition, it is possible to prevent the magnetic sensor substrates 231A2, 231D2 from protruding from the substrate recesses 254A, 254D due to being unable to be accommodated in the substrate recesses 254A, 254D, so that the magnetic sensor substrates 231A2, 231D2 do not get in the way when arranging the OIS coils 22A, 22D in the coil recesses 252A, 252D, regardless of the planar size of the magnetic sensor substrates 231A2, 231D2.

[0097] Further, the depth of the recesses 254A and 254D for substrates is such that, when the magnetic sensor substrates 231A2 and 231D2 are housed therein, the light-receiving side end portions of the Hall elements 231A and 231D on the magnetic sensor substrates 231A2 and 231D2 are positioned equivalent to the light-receiving side end portions of the OIS coils 22A and 22D on the bottoms of the coil recesses 252A and 252D. Alternatively, the depth of the recesses 254A and 254D for substrates is such that, when the magnetic sensor substrates 231A2 and 231D2 are housed therein, the light-receiving side end portions of the Hall elements 231A and 231D on the magnetic sensor substrates 231A2 and 231D2 are positioned displaced toward the imaging side in the optical axis direction from the positions equivalent to the light-receiving side end portions of the OIS coils 22A and 22D on the bottoms of the coil recesses 252A and 252D (see FIG. 15). This makes it possible to prevent the light-receiving side ends of the Hall elements 231A1, 231D1 from protruding to a position higher than the light-receiving side ends of the OIS coils 22A, 22D in the optical axis direction, thereby more reliably reducing the thickness of the base member 25. In short, it becomes possible to arrange the magnetic sensor substrates 231A2, 231D2 and the OIS coils 22A, 22D so as to overlap each other in the Z direction, thereby minimizing the device size.

[0098] 14A and 14B, OIS coils 22A and 22D are air-core coils that are installed across substrate recesses 254A and 254D and across the bottoms of coil recesses 252A and 252D. Therefore, compared to the case where a sheet-type coil such as a coil substrate is installed across the bottoms of coil recesses 252A and 252D, the posture of OIS coils 22A and 22D can be stabilized, and an increase in the planar area of ​​base member 25 and thus an increase in the size of optical element driving device 1 can be suppressed.

[0099] As described above, according to this embodiment, the optical element driving device 1 is arranged separately into an OIS movable part 10 capable of holding the lens part 2, and an OIS fixed part 20 that supports the OIS movable part 10, and has OIS coils 22A, 22D and permanent magnets 125A, 125D that cooperate to move the OIS movable part 10 relative to the OIS fixed part 20, and Hall elements 231A1, 231D1 that detect the position of the OIS movable part 10 based on the relative position with the permanent magnets 125A, 125D, and the Hall elements 231A1, 231D1 are mounted on magnetic sensor substrates 231A2, 231D2, and the magnetic sensor substrates 231A2, 231D2 are housed in recesses provided in the OIS fixed part 20. This makes it possible to suppress an increase in the volume of the OIS fixing portion 20 even if the Hall elements 231A1, 231D1 are arranged in a state where they are mounted on the magnetic sensor boards 231A2, 231D2, thereby suppressing an increase in the device size of the optical element driving device 1. Also, since the Hall elements 231A1, 231D1 are not used individually but are mounted on the OIS fixing portion 20 via the magnetic sensor boards 231A2, 231D2, it is not difficult to check the mounting state of the Hall elements 231A1, 231D1 and the connection state with the wiring member 27, and the mounting accuracy of the Hall elements 231A1, 231D1 can be improved.

[0100] In addition, the OIS fixing part 20 has a base member 25 integrally provided with a board terminal element 27b1 that directly connects to the magnetic sensor boards 231A2 and 231D2, and a coil terminal element 27a1 that directly connects to the OIS coils 22A to 22D. This allows the Hall elements 231A1 and 231D1 to be individually connected to the OIS coils 22A to 22D, so the magnetic sensor boards 231A2 and 231D2 can be used as boards dedicated to mounting the Hall elements 231A1 and 231D1. This allows the size of the magnetic sensor boards 231A2 and 231D2 to be significantly reduced, thereby further reducing the size of the entire device.

[0101] Although the embodiment of the present invention has been specifically described above, the present invention is not limited to the above-mentioned specific embodiment. Various modifications and changes can be made to the specific examples described in the above embodiment within the scope of the gist of the present invention described in the claims. [Industrial Applicability]

[0102] The optical element driving device and camera module of the present invention are useful when installed in camera-mounted devices such as smartphones, mobile phones, digital cameras, notebook computers, tablet terminals, portable game consoles, in-vehicle cameras, and drones. [Explanation of symbols]

[0103] A Camera module M Smartphone OC Rear Camera V Automobile VC Vehicle Camera 1 Optical element driving device 2 Lens section 3 Cover 301 Opening 5. Imaging unit 501 Image sensor board 502 Image sensor 503 Control Unit 10 OIS moving part 11 AF moving part 110 Lens Holder 110a Lens housing 110a1 Lens receiving opening 111 AF coil section 12 AF fixed part 12a Magnet holder 125 Magnet section 125A, 125B, 125C, 125D permanent magnet 13 Upper elastic support part (upper leaf spring) 131 Wire fixing part 131a Slit 14 Lower elastic support part (lower leaf spring) 20 OIS fixing part 22 OIS coil section 22A, 22B, 22D, 22D OIS coil 23 Magnetic sensor section 231A, 231D Hall element chip assembly 231A1, 231D1 Hall element 231A2, 231D2 magnetic sensor board 24, 241, 242 Protective material 24A, 241A notch 24B through hole 25 Base material 250 central opening 252, 252A, 252B, 252C, 252D Coil recess (second recess) 254A, 254D Substrate recess (first recess) 256, 256A, 256B, 256C, 256D Column 257 Bottom 258 Top 2581 Boss 2583 Outer surface 259 Four corner pillars 2591 Inner column part 2591a OIS moving part facing surface 2592 Outer column part 2592a Cover facing surface 2593 Dividing groove 27 Wiring materials 27a Coil terminal parts 27a1 Terminal element for coil 27a2 Coil terminal connection 27b Board terminal parts 27b1 Terminal element for board 27b2 PCB terminal connection part 27c Wire terminal parts 27c1 Terminal element for wire 27c2 Wire Terminal Connection 30 OIS support part (suspension wire)

Claims

1. An optical element driving device comprising a movable part capable of holding an optical element and a fixed part supporting the movable part, a coil and a magnet that cooperate to move the movable part relative to the fixed part; the magnet is disposed on the movable part, and the coil is disposed on the fixed part, the fixing portion has a second recess that accommodates the coil and a main surface that is located closer to an object in the optical axis direction than a bottom portion of the second recess on which the coil is placed, and has a rectangular outer shape surrounding a central opening in a plan view in the optical axis direction, Further comprising a protective member covering at least a portion of the coil; the main surface has a placement surface on which the protective member is placed, and a convex portion that is formed to be convex toward an object side in an optical axis direction relative to the placement surface and that restricts displacement of the protective member, the protective member is a plate or a film having a shape corresponding to a shape of the fixing portion, The protrusions are formed on the four sides of the fixing portion at positions on the outer circumferential side of the protection member. Optical element driving device.

2. The protective member is interposed between the coil and the magnet in the optical axis direction. The optical element driving device according to claim 1 .

3. A wiring member is provided inside the fixing portion, The wiring member has a coil terminal member exposed from the fixed portion and connected to the coil. The optical element driving device according to claim 1 .

4. the main surface further includes an inner convex portion formed on each of the four sides of the fixing portion at a position on an inner circumferential side of the protection member so as to be convex with respect to the placement surface, The protective member has an opening formed along a contour of the central opening of the fixing portion, and a notch formed by cutting out an edge of the opening along a contour of the inner protrusion. The optical element driving device according to claim 1 .

5. a magnetic sensor mounted on a magnetic sensor substrate for detecting a position of the movable part with respect to the fixed part based on a relative position of the magnet; The fixing portion has a first recess for accommodating the magnetic sensor substrate. The optical element driving device according to claim 1 .

6. The optical element driving device according to claim 1 ; The optical element; an imaging unit that captures a subject image formed by the optical element; Camera module.

7. A camera-equipped device that is an information device or a transport device, A camera module according to claim 6; and an image processing unit that processes image information obtained by the camera module. Camera-equipped device.

Images