Display device

Abstract

To provide a display device capable of facilitating alignment between a sensor unit and a sensing area, and a method for manufacturing the display device.SOLUTION: A display device comprises: a display module; a first adhesive member that includes a thermal initiator and is adhered to a rear surface of the display module; a sensor unit adhered to the first adhesive member; and a second adhesive member that includes a photoinitiator and is adhered to at least a part of the first adhesive member and the rear surface of the display module respectively. The thermal initiator may be activated by a change in temperature, and the photoinitiator may be activated by ultraviolet light.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a display device, and more particularly to a display device and a manufacturing method thereof. [Background technology]

[0002] 2. Description of the Related Art A variety of display devices have been developed for use in multimedia devices such as televisions, mobile phones, tablet computers, navigation systems, game consoles, and the like.

[0003] The display device includes a display panel that displays an image and an input sensing unit that senses an external input. The display panel includes a display area where an image is displayed and a bezel area arranged around the display area. Recently, display devices for reducing the bezel area and enlarging the display area have been developed. In this case, as the bezel area of ​​the display device is reduced, driving components arranged in the bezel area are arranged to overlap the display area. As an example, a display device including a fingerprint recognition sensor overlapping the display area has been developed.

[0004] The fingerprint recognition sensor may be attached to the rear surface of the display panel through an adhesive member. The adhesive member may be cured by a temperature change caused by heat provided from the outside. The adhesive member firmly fixes the fingerprint recognition sensor and the display panel to each other by the external heat.

[0005] Meanwhile, when the display device is moved to a heat-providing chamber in order to provide external heat to the adhesive member, a misalignment may occur between the adhesive member and the display panel, which may result in a misalignment between the fingerprint recognition sensor and the sensing area that recognizes the fingerprint. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] U.S. Patent No. 9,399,239 [Patent Document 2] U.S. Patent No. 9,639,224 Summary of the Invention [Problem to be solved by the invention]

[0007] SUMMARY OF THE DISCLOSURE An object of the present invention is to provide a display device and a manufacturing method thereof that can facilitate alignment between a sensor unit and a sensing area. [Means for solving the problem]

[0008] In one embodiment to achieve the object of the present invention, a display device includes a display module, a first adhesive member including a thermal initiator and adhered to a rear surface of the display module, a sensor unit adhered to the first adhesive member, and a second adhesive member including a photoinitiator and adhered to at least a portion of the first adhesive member and the rear surface of the display module, respectively.

[0009] According to one embodiment of the invention, the thermal initiator is activated by a change in temperature and the photoinitiator is activated by ultraviolet light.

[0010] According to an embodiment of the present invention, the display module includes a display area where an image is displayed and a bezel area adjacent to the display area, and the sensor unit overlaps the display area.

[0011] According to one embodiment of the present invention, the first adhesive member includes an opening overlapping the sensor unit, and the sensor unit is surrounded by the first adhesive member on a plane.

[0012] According to an embodiment of the present invention, the sensor unit is spaced apart from the rear surface of the display module by the first adhesive member.

[0013] According to one embodiment of the present invention, the sensor unit includes a sensor overlapping the opening, and a package in which the sensor is mounted and which is adhered to the first adhesive member.

[0014] According to an embodiment of the present invention, the sensor unit is an optical fingerprint sensor.

[0015] According to an embodiment of the present invention, the first adhesive member entirely overlaps the sensor unit and is attached to the rear surface of the display module and the sensor unit, respectively.

[0016] According to an embodiment of the present invention, the sensor unit is an ultrasonic fingerprint sensor.

[0017] According to one embodiment of the present invention, the first adhesive member and the second adhesive member are provided in an integrated form and disposed on the rear surface of the display module, the first adhesive member further comprising the photoinitiator, and the second adhesive member further comprising the thermal initiator.

[0018] According to one embodiment of the present invention, the display device further includes a circuit board electrically connected to the display module and disposed on a lower part of the rear surface of the display module, the circuit board having a hole area defined therein that overlaps with the sensor unit, and the sensor unit is inserted into the hole area and adhered to the first adhesive member.

[0019] According to one embodiment of the present invention, the display module includes a substrate, a display element layer disposed on the substrate, a sealing member disposed on the display element layer, and an input sensing unit disposed on the sealing member, and the first adhesive member and the second adhesive member are disposed on a rear surface of the substrate corresponding to the rear surface of the display module.

[0020] A display device according to another embodiment of the present invention for achieving the object of the present invention includes a display module including a display area in which an image is displayed and a bezel area adjacent to the display area, a protective member overlapping a region within the display area and disposed on a rear surface of the display module, a sensor unit overlapping the region and disposed on the protective member, and an adhesive member overlapping the sensor unit and adhering the protective member and the sensor unit.

[0021] According to an embodiment of the present invention, the display module is defined with a folding region and a non-folding region adjacent to the folding region and overlapping the sensor unit, and the protection member overlaps the non-folding region.

[0022] According to another embodiment of the present invention, a display device includes a display area and a bezel area adjacent to the display area, the display area being defined by a first adhesive member, a sensor unit being disposed on the first adhesive member, a second adhesive member being applied to the rear surface of the substrate such that the second adhesive member is in at least partial contact with the first adhesive member, and an external heat is applied to the first adhesive member.

[0023] According to one embodiment of the present invention, the first adhesive member includes a thermal initiator and is applied to the rear surface of the substrate by a first applicator so as to overlap the display area, and the second adhesive member includes a photoinitiator and is applied to the rear surface of the substrate by a second applicator so as to overlap the display area.

[0024] According to one embodiment of the present invention, the first adhesive material and the second adhesive material are applied to the back surface of the substrate by one application tool, and each of the first adhesive material and the second adhesive material includes a thermal initiator and a photoinitiator.

[0025] According to an embodiment of the present invention, the coating of the second adhesive material on the rear surface of the substrate and the irradiating of the second adhesive material with the ultraviolet light are performed simultaneously.

[0026] According to an embodiment of the present invention, the first adhesive member is applied so that the sensor unit is entirely overlapped by the first adhesive member.

[0027] According to one embodiment of the present invention, the first adhesive member is applied on a flat surface such that the sensor unit is surrounded by the first adhesive member. Effect of the Invention

[0028] According to one embodiment of the present invention, the sensor unit is disposed on a first adhesive member containing a thermal initiator, and the first adhesive member is fixed to the rear surface of the substrate by a second adhesive member containing a photoinitiator. In particular, the alignment between the first adhesive member and the substrate is maintained when moving to the chamber in response to the first adhesive member and the substrate being fixed by the second adhesive member. [Brief description of the drawings]

[0029] [Figure 1] FIG. 1 is a perspective view according to an embodiment of the present invention. [Diagram 2] 1 is an exploded perspective view of a display device according to an embodiment of the present invention; [Figure 3A] 1 is a cross-sectional view of a display device according to an embodiment of the present invention. [Figure 3B] FIG. 11 is a cross-sectional view of a display module according to another embodiment of the present invention. [Figure 4] 1 is a plan view of a display panel according to an embodiment of the present invention; [Diagram 5] FIG. 5 is an equivalent circuit diagram of the pixel shown in FIG. [Figure 6] FIG. 3 is a cross-sectional view taken along II' shown in FIG. 2 according to one embodiment of the present invention. [Figure 7] FIG. 2 is a plan view showing the rear surface of a display module according to an embodiment of the present invention. [Figure 8] 1 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present invention. [Figure 9A] 9 is a diagram showing a method for manufacturing the display device shown in FIG. 8. [Figure 9B] 9 is a diagram showing a method for manufacturing the display device shown in FIG. 8. [Figure 9C] 9 is a diagram showing a method for manufacturing the display device shown in FIG. 8. [Figure 9D] 9 is a diagram showing a method for manufacturing the display device shown in FIG. 8. [Figure 10A] FIG. 11 is a cross-sectional view of a display device according to another embodiment of the present invention. [Figure 10B] FIG. 10B is an exploded perspective view showing a sensor disposed on the back surface of the substrate according to the embodiment shown in FIG. 10A. [Figure 11A] 11 is a diagram illustrating a method of manufacturing a display device according to another embodiment of the present invention. [Figure 11B] 11 is a diagram illustrating a method of manufacturing a display device according to another embodiment of the present invention. [Figure 12A] FIG. 11 is a plan view of a display panel and a circuit board according to another embodiment of the present invention. [Figure 12B] 12B is a cross-sectional view of the display device including the display panel and the circuit board of FIG. 12A. [Figure 12C] 12B is a cross-sectional view of a display device including a variation of the display panel and circuit board shown in FIG. 12A. [Figure 13A] FIG. 11 is a plan view showing the rear surface of a display device according to another embodiment of the present invention. [Figure 13B] 13B is a cross-sectional view of the display device according to the embodiment shown in FIG. 13A. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] In this specification, when a component (or region, layer, portion, etc.) is referred to as being "on," "connected," or "coupled" to another component, it means that it is directly disposed / connected / coupled onto the other component, or that a third component may be disposed therebetween.

[0031] The same reference numerals refer to the same components. Also, in the drawings, thicknesses, ratios, and dimensions of components are exaggerated for the purpose of effectively explaining technical contents.

[0032] "And / or" includes all possible combinations of one or more of the associated constructs.

[0033] Terms such as first, second, etc. are used to describe various components, but the components should not be limited by the terms. The terms are used only to distinguish one component from another. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component, without departing from the scope of the present invention. A singular expression includes a plural expression unless otherwise clearly indicated by the context.

[0034] In addition, terms such as "under", "below", "on", "above" and the like are used to describe the relationship of components shown in the drawings. The terms are described as relative concepts based on the directions shown in the drawings.

[0035] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present invention belongs. Furthermore, terms that are the same as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the related art, and unless interpreted in an ideal or formal sense, are expressly defined herein.

[0036] The term "comprises" and the like are intended to express the presence of any feature, numeral, step, operation, component, part, or combination thereof set forth in the specification, and should be understood as not precluding the presence or additional possibility of one or more other features, numerals, steps, operations, components, parts, or combinations thereof.

[0037] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A display device according to an embodiment of the present invention will now be described with reference to the drawings.

[0038] Fig. 1 is a perspective view of a display device according to an embodiment of the present invention. Fig. 2 is an exploded perspective view of a display device according to an embodiment of the present invention. Fig. 3A is a cross-sectional view of a display device according to an embodiment of the present invention. Fig. 3B is a cross-sectional view of a display module according to another embodiment of the present invention.

[0039] Referring to Fig. 1, the display device DD displays an image IM through a display surface DD-IS. According to an embodiment of the present invention, the display device DD having a flat display surface DD-IS is illustrated, but is not limited thereto. The display device DD may include a curved display surface or a three-dimensional display surface. The three-dimensional display surface may include a plurality of display regions pointing in different directions, for example, a polygonal prism-shaped display surface.

[0040] According to an embodiment of the present invention, the display device DD is a flexible display device, but is not limited thereto, and the display device DD according to the present invention may be a rigid display device.

[0041] In addition, although not shown, an electronic module, a camera module, a power module, etc. mounted on a main board may be placed in a bracket / case together with the display device DD to form a mobile phone terminal. The display device DD according to an embodiment of the present invention may be applied to large electronic devices such as televisions and monitors, as well as small and medium-sized electronic devices such as tablets, car navigation systems, game consoles, and smart watches.

[0042] The display surface DD-IS is parallel to a plane defined by the first direction DR1 and the second direction DR2. The normal direction of the display surface DD-IS, i.e., the thickness direction of the display device DD, is indicated by the third direction DR3. The front (or top) and rear (or bottom) surfaces of each member or unit described below are separated by the third direction DR3. However, the first to third directions DR1, DR2, and DR3 illustrated in this embodiment are merely examples, and the directions indicated by the first to third directions DR1, DR2, and DR3 are converted to the opposite directions.

[0043] As shown in Fig. 1, the display surface DD-IS includes a display area DD-DA in which an image IM is displayed, and a bezel area DD-NDA adjacent to the display area DD-DA. The bezel area DD-NDA is an area in which no image is displayed. Fig. 1 illustrates an application icon and a clock window as examples of an image IM.

[0044] Also, the display area DD-DA is illustrated as having a rectangular shape, and the bezel area DD-NDA is illustrated surrounding the display area DD-DA. However, this is not limited thereto, and the shape of the display area DD-DA and the shape of the bezel area DD-NDA may be designed relatively. For example, the bezel area DD-NDA may be disposed adjacent to only one side of the display area DD-DA, or may be omitted.

[0045] Referring to FIG. 2, the display device DD includes a window member WM, a display module DM, a circuit board PCB, and a housing member BC.

[0046] The window member WM is disposed on the display module DM and transmits an image provided from the display module DM through the transmissive area TA. Specifically, the window member WM includes a transmissive area TA and a non-transmissive area NTA. The transmissive area TA overlaps the display area DD-DA and has a shape corresponding to the display area DD-DA. An image IM displayed in the display area DD-DA of the display device DD is viewed from the outside through the transmissive area TA of the window member WM.

[0047] The non-transmitting area NTA overlaps the bezel area DD-NDA and has a shape corresponding to the bezel area DD-NDA. The non-transmitting area NTA is an area having a relatively low light transmittance compared to the transmissive area TA. However, the technical idea of ​​the present invention is not limited thereto, and the non-transmitting area NTA may be omitted.

[0048] The window member WM is made of glass, sapphire, plastic, or the like. Also, although the window member WM is illustrated as a single layer, the window member WM may include multiple layers. The window member WM may include at least one print layer disposed on the back surface of the base layer, overlapping the base layer and the non-transmissive area NTA. The print layer has a predetermined color. As an example, the print layer may be provided in black, or may be provided in another color other than black.

[0049] According to an embodiment of the present invention, the transparent area TA includes a sensing area FSA, which overlaps the transparent area TA and is used for recognizing a fingerprint.

[0050] If the sensing area FSA were to overlap only the non-transmissive area NTA, the area of ​​the non-transmissive area NTA would be larger than that of the sensing area FSA. However, the display device DD of the present invention has a structure in which the sensing area FSA overlaps the display area DD-DA, so that the area of ​​the non-transmissive area NTA is reduced. As a result, the transmissive area TA is enlarged.

[0051] On the other hand, the sensor unit overlapping the sensing area FSA is the back surface of the display module DM. This will be described in detail later.

[0052] The display module DM is disposed between the window member WM and the housing member BC, and includes a display panel DP and an input sensing unit ISU.

[0053] The display panel DP generates an image and transmits the generated image to the window member WM. According to an embodiment of the present invention, the display panel DP is an organic light-emitting display panel, a liquid crystal display panel, or a quantum dot light-emitting display panel, but is not limited thereto. The organic light-emitting display panel includes organic light-emitting elements. The liquid crystal display panel includes liquid crystal molecules. The quantum dot light-emitting display panel includes quantum dots or quantum rods.

[0054] Hereinafter, the display panel DP according to the present invention will be described as an organic light emitting display panel, however, the technical idea of ​​the present invention is not limited thereto, and various display panels can be applied to the present invention according to the embodiments.

[0055] The input sensing unit ISU is disposed between the window member WM and the display panel DP. The input sensing unit ISU senses an input applied from the outside. The input applied from the outside is provided in various forms. For example, the external input includes various forms of external input such as a part of the user's body, a stylus pen, light, heat, or pressure. In addition, an input in which a part of the body such as a user's hand touches the screen, and of course, a nearby or adjacent spatial touch (e.g., hovering) is also a form of input.

[0056] The input sensing unit ISU is disposed directly on the display panel DP. In this embodiment, the input sensing unit ISU is manufactured in a continuous process with the display panel DP. However, the technical idea of ​​the present invention is not limited thereto, and the input sensing unit ISU is provided as a separate panel and is coupled to the display panel DP via an adhesive member.

[0057] The receiving member BC is combined with the window member WM. The receiving member BC provides a rear surface of the display device DD and is combined with the window member WM to define an internal space. The receiving member BC includes a material having relatively high strength. For example, the receiving member BC may include a plurality of frames and / or plates made of glass, plastic, or metal. The receiving member BC can stably protect the components of the display device DD accommodated in the internal space from external impact.

[0058] In addition, although the receiving member BC is described as including a material having high rigidity, the receiving member BC is not limited thereto, and may include a flexible material. Although not shown, the display device DD according to an embodiment of the present invention may have a folding or bending characteristic. As a result, the components included in the display device DD may also have a flexible characteristic.

[0059] 3A, a display module DM according to an embodiment of the present invention will be described. The display module DM includes the display panel DP and the input sensing unit ISU described in FIG.

[0060] The display panel DP includes a substrate SUB, a circuit layer COL, a display element layer ED, and a sealing member ECL. The display panel DP includes a display area DP-DA and a bezel area DP-NDA. The display area DP-DA and the bezel area DP-NDA of the display panel DP overlap with the display area DD-DA and the bezel area DD-NDA of the display device DD previously described through FIG. 1. The bezel area DP-NDA may be adjacent to one side of the display area DP-DA or may be omitted.

[0061] The substrate SUB generally supports the components of the display panel DP and the input sensing unit ISU and may include a flexible material. The substrate SUB may include a plastic substrate, a glass substrate, a metal substrate, an organic / inorganic composite material substrate, or the like. Alternatively, the substrate SUB may be a laminated structure including a plurality of insulating layers. The plastic substrate may include at least one of an acrylic resin, a methacrylic resin, a polyisoprene vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene resin.

[0062] The circuit layer COL includes a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the circuit layer COL constitute signal wiring or a control circuit for the pixels.

[0063] The display element layer ED overlaps the display area DP-DA and is disposed on the substrate SUB. The display element layer ED includes display elements, such as organic light emitting diodes. However, this is not limiting, and depending on the type of the display panel DP, the display element layer ED may include inorganic light emitting diodes or organic-inorganic hybrid light emitting diodes.

[0064] The sealing member ECL seals the display element layer ED. For example, the sealing member ECL overlaps the display area DP-DA and the bezel area DP-NDA, or does not overlap the bezel area DP-NDA.

[0065] According to the present embodiment, the encapsulation member ECL is an encapsulation substrate. The encapsulation member ECL protects the display element layer ED from foreign substances such as moisture, oxygen, and dust particles. The encapsulation member ECL is bonded to the substrate SUB through a sealing member SLP. The sealing member SLP includes a frit. However, this is merely an example, and the material constituting the sealing member SLP is not limited thereto.

[0066] The input sensing unit ISU overlaps the display area DP-DA and is disposed on the sealing member ECL.

[0067] 3A shows an example in which the input sensing unit ISU is directly formed on the sealing member ECL by a continuous process, but is not limited thereto. For example, an adhesive member (not shown) may be provided between the input sensing unit ISU and the sealing member ECL, and the input sensing unit ISU and the sealing member ECL are attached to each other by the adhesive member.

[0068] 3B, the display module DMa includes a display panel DPa and an input sensing unit ISUa. The display module DMa shown in FIG. 3B is substantially the same as the display module DM shown in FIG. 3A except that the configuration of the sealing member ECLa is different.

[0069] The display panel DPa includes a substrate SUB, a circuit layer COL, a display element layer ED, and a sealing member ECLa.

[0070] The encapsulating member ECLa seals the display element layer ED. For example, the encapsulating member ECLa may overlap the display area DP-DA and the bezel area DP-NDA, or may not overlap the bezel area DP-NDA. The encapsulating member ECLa includes at least one insulating layer. The encapsulating member ECLa according to an embodiment of the present invention may include at least one encapsulating organic film and at least one encapsulating inorganic film.

[0071] The sealing inorganic film protects the display element layer ED from moisture / oxygen, and the sealing organic film protects the display element layer ED from foreign substances such as dust particles. The sealing inorganic film may include, but is not limited to, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, an aluminum oxide layer, etc. The sealing organic film may include, but is not limited to, an acrylic-based organic film.

[0072] The input sensing unit ISUa is directly formed on the encapsulation member ECLa by a continuous process. However, the input sensing unit ISUa is not limited to this, and is coupled to the encapsulation member ECLa through an adhesive member. In this case, the input sensing unit ISUa may include a base layer and a sensing circuit layer. The sensing circuit layer may include a plurality of insulating layers and a plurality of conductive layers.

[0073] Fig. 4 is a plan view of a display panel according to an embodiment of the present invention, and Fig. 5 is an equivalent circuit diagram of the pixel shown in Fig. 4.

[0074] 4, the display panel DP includes a driving circuit GDC, a plurality of signal lines SGL, a plurality of first pads PD1 arranged in a first bonding region SPD, and a plurality of pixels PX.

[0075] The pixels PX are arranged in the display area DP-DA. Each of the pixels PX includes an organic light emitting diode and a pixel driving circuit connected thereto. The driving circuit GDC, the signal line SGL, the first pad PD1, and the pixel driving circuit are included in the circuit layer COL shown in FIG. 3A.

[0076] The driving circuit GDC is provided as a scanning driving circuit. The driving circuit GDC generates a plurality of scanning signals (hereinafter, scanning signals) and sequentially outputs the scanning signals to a plurality of scanning lines GL (hereinafter, scanning lines) described later. The driving circuit GDC can further output other control signals to the driving circuits of the pixels PX.

[0077] The driving circuit GDC includes a plurality of thin film transistors formed through the same process as the driving circuit of the pixel PX, for example, a low temperature polycrystalline silicon (LTPS) process or a low temperature polycrystalline oxide (LTPO) process.

[0078] The signal lines SGL are disposed on the substrate SUB. The signal lines SGL include scan lines GL, data lines DL, power lines PL, and control signal lines CSL. Each of the scan lines GL is connected to a corresponding pixel among the pixels PX, and each of the data lines DL is connected to a corresponding pixel among the pixels PX. The power lines PL are connected to the pixels PX. The control signal lines CSL provide control signals to the driving circuit GDC.

[0079] The signal lines SGL overlap the display area DP-DA and the bezel area DP-NDA. Each of the signal lines SGL includes a pad portion and a line portion. The line portion overlaps the display area DP-DA and the bezel area DP-NDA. The pad portion is connected to an end of the line portion. The pad portion is disposed in the bezel area DP-NDA and corresponds to a first pad PD1 disposed in the first bonding area SPD.

[0080] The circuit board PCB is connected to the display panel DP and includes a plurality of second pads PD2 arranged in the second bonding area DPD. The second pads PD2 are electrically bonded to the first pads PD1 arranged in the first bonding area SPD of the display panel DP to transmit a plurality of driving signals to the display panel DP. The circuit board PCB may be rigid or flexible. For example, when the circuit board PCB is flexible, it is provided as a flexible printed circuit board.

[0081] 4, the circuit board PCB and the display panel DP are shown in a separated state, but the circuit board PCB is disposed in a portion of the bezel area DP-NDA of the display panel DP and may overlap the display area DP-DA and the bezel area DP-NDA. For example, as shown in FIG. 2, the circuit board PCB is bent along one side of the substrate SUB and disposed on the rear surface of the display panel DP.

[0082] In this case, on the plane of the substrate SUB, the circuit board PCB may or may not overlap the sensing area FSA.

[0083] 5, a scan line GL, a data line DL, a power line PL, and pixels PX connected thereto are illustrated. The configuration of the pixels PX is not limited to that shown in FIG. 5 and may be modified.

[0084] The pixel PX includes an organic light emitting diode OLED and a pixel driving circuit.

[0085] The organic light emitting diode OLED is a top-emitting diode or a bottom-emitting diode. The pixel PX includes a first transistor T1 (or a switching transistor), a second transistor T2 (or a driving transistor), and a capacitor Cst as a pixel driving circuit for driving the organic light emitting diode OLED. A first power supply voltage ELVDD is provided to the second transistor T2, and a second power supply voltage ELVSS is provided to the organic light emitting diode OLED. The second power supply voltage ELVSS is a voltage lower than the first power supply voltage ELVDD.

[0086] The first transistor T1 outputs a data signal applied to the data line DL in response to a scan signal applied to the scan line GL. The capacitor Cst charges a voltage corresponding to the data signal received from the first transistor TR1. The second transistor T2 is connected to the organic light emitting diode OLED. The second transistor T2 controls a driving current flowing through the organic light emitting diode OLED in response to the amount of charge stored in the capacitor Cst.

[0087] The equivalent circuit is merely an embodiment and is not limited thereto. The pixel PX may further include a plurality of transistors and may further include a greater number of capacitors. The organic light emitting diode OLED may be connected between the power line PL and the second transistor T2.

[0088] Fig. 6 is a cross-sectional view taken along line II' in Fig. 2 according to an embodiment of the present invention. Fig. 7 is a plan view showing the rear surface of a display module according to an embodiment of the present invention.

[0089] Compared with the display device DD shown in FIG. 2, the display device DD shown in FIG. 6 further includes a polarizing layer POL, a window adhesive member AM, a sensor unit SU, and an adhesive member AU.

[0090] The polarizing layer POL is disposed between the display module DM and the window member WM. The polarizing layer POL polarizes external light incident through the window member WM, thereby preventing circuit elements included in the display module DM from being viewed from the outside. Depending on the embodiment, the polarizing layer POL may be omitted. The window adhesive member AM is disposed between the polarizing layer POL and the window member WM to adhere the polarizing layer POL and the window member WM to each other. Exemplarily, the window adhesive member AM is an optically clear adhesive film, an optically clear resin, or a pressure sensitive adhesive film.

[0091] Meanwhile, as described above with reference to Fig. 2, the sensing area FSA for recognizing an external fingerprint may overlap the display area DP-DA. However, the technical idea of ​​the present invention is not limited thereto, and the sensing area FSA may not overlap a portion of the bezel area DP-NDA.

[0092] Specifically, the sensor unit SU overlaps the sensing area FSA and is disposed on the rear surface of the substrate SUB. The sensor unit SU includes a sensor SS and a package SP in which the sensor SS is mounted.

[0093] According to an embodiment of the present invention, the sensor SS may include a fingerprint recognition sensor and may be used based on an optical, ultrasonic, or cap type. Although the sensor SS is described as being a fingerprint recognition sensor, the sensor SS is not limited thereto. That is, the sensor SS may be provided in various forms such as a camera, a pressure sensor, a proximity sensor, a brightness sensor, a temperature sensor, etc., disposed under the substrate SUB.

[0094] Hereinafter, the sensor unit SU according to the embodiment shown in Fig. 6 will be described as an optical fingerprint sensor. An optical fingerprint sensor is a technology for irradiating a fingerprint with light and then detecting the light reflected by the fingerprint to recognize the fingerprint.

[0095] The sensing area FSA includes a recognition area IA and a bonding area BA surrounding the recognition area IA. The sensor SS overlaps the recognition area IA for recognizing a fingerprint, and the package SP overlaps the recognition area IA and the bonding area BA, respectively. The package SP can entirely overlap the sensing area FSA.

[0096] The package SP mounts a sensor SS facing the substrate SUB and transmits a signal sensed by the sensor SS to the circuit board PCB. Although not shown, the package SP may include a control circuit electrically connected to each of the circuit board PCB and the sensor SS.

[0097] The adhesive member AU bonds the sensor unit SU and the substrate SUB to each other. The adhesive member AU includes a first adhesive member ADm and a second adhesive member ADa.

[0098] The first adhesive member ADm is disposed on the rear surface of the substrate SUB, more specifically, between the package SP and the substrate SUB. The first adhesive member ADm does not overlap the recognition area IA, but overlaps the bonding area BA.

[0099] The first adhesive member ADm is disposed on the rear surface of the substrate SUB so as to surround the sensor SS on a plane surface, so that an opening OP is defined between the sensor unit SU disposed on the first adhesive member ADm and the substrate SUB. The sensor SS receives light reflected from the fingerprint through the opening OP defined by the first adhesive member ADm.

[0100] According to an embodiment of the present invention, the first adhesive member ADm may include a thermal initiator that is activated when heat is applied. The first adhesive member ADm is activated in response to a temperature change caused by heat applied from the outside. The type of thermal initiator may vary depending on the temperature of heat applied in a manufacturing process of the display device DD and the duration of the high-temperature process.

[0101] Therefore, after the first adhesive member ADm is disposed between the package SP and the substrate SUB, heat provided from the outside is transferred to the first adhesive member ADm, so that the first adhesive member ADm is cured by the external heat, and the package SP and the substrate SUB are fixed to each other by the first adhesive member ADm.

[0102] Exemplarily, the thermal initiator contained in the first adhesive member ADm may be tert-amyl peroxybenzoate, 4,4'-azobis(4-cyanopentanoic acid), 1,1'-azobis(cyanocyclohexane), AIBN (azobisisobutylronitirile), 2,2-bis(tert-butylperoxy)butane, 1,1-bis(tert-butylperoxy)cyclohexane, BPO (Benzoyl peroxide, 2,5-Bis(tert-butylperoxy)-2,5-dimethylhexane, Bis[1-(tert-butylperoxy)-1-methylethyl]benzene, 1,1-Bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, tert-butyl hydroperoxide, tert-butyl peracetate, tert-butyl peroxide, tert-butyl peroxybenzoate, tert-butylperoxy isopropyl carbonate carbonate), Cumene hydroperoxide, Cyclohexanone peroxide, Dicumyl peroxide, Dodecanoyl peroxideThe at least one selected from the group consisting of 2,4-pentanedione peroxide, 2,4-pentanedione peroxide, and potassium peroxodisulfate.

[0103] Meanwhile, the display device DD is moved to a chamber or device that provides heat to harden the first adhesive member ADm disposed between the package SP and the substrate SUB. However, if heat is not provided to the first adhesive member ADm, the first adhesive member ADm and the substrate SUB may not be firmly fixed to each other. As a result, movement may occur between the first adhesive member ADm and the substrate SUB, which may cause the first adhesive member ADm and the sensing area FSA to not be accurately aligned.

[0104] According to an embodiment of the present invention, the substrate SUB and the first adhesive member ADm are bonded to each other by the second adhesive member ADa. The second adhesive member ADa according to the present invention includes a photoinitiator that is activated by ultraviolet light.

[0105] In particular, the second adhesive member ADa according to the present invention is disposed on at least a portion of the first adhesive member ADm and the substrate SUB, and is simultaneously irradiated with ultraviolet light from the outside. By irradiating with ultraviolet light, the second adhesive member ADa is cured, and the first adhesive member ADm and the substrate SUB are fixed to each other by the second adhesive member ADa. In particular, the second adhesive member ADa does not overlap with the sensor unit SU, and is adhered to at least a portion of the first adhesive member ADm and the substrate SUB, respectively.

[0106] Therefore, the first adhesive member ADm and the substrate SUB are fixed by the second adhesive member ADa, which is cured by ultraviolet light, so that the first adhesive member ADm and the sensing area FSA are accurately aligned.

[0107] Meanwhile, the first adhesive member ADm between the substrate SUB and the package SP overlapping the sensing area FSA cannot be irradiated with external ultraviolet light because the ultraviolet light is reflected by the sensor unit SU made of metal. Therefore, the first adhesive member ADm according to the present invention contains a thermal initiator and is cured through a heat treatment process.

[0108] Exemplarily, the photoinitiator contained in the second adhesive member ADa may be 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]-phenyl}-2-methylmethylpropan-1-one l)-benzyl]-phenyl}-2-methylpropan-1-one), 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 enyl)-butanone-1), 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenylphosphinephosphinate), bis(2,4,6-trimethylbenzoyl)-phenylphosphineoxide, [1-(4-phenylsulfanylbenzoyl)heptylideneamino]benzoate, [1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino]acetate acetate), and Bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyrryl)phenyl]titanium(IV).

[0109] Referring to FIG. 7, a sensor unit SU, an adhesive member AU, and a circuit board PCB are disposed on a rear surface SUB-BS of a substrate SUB.

[0110] The sensor SS of the sensor unit SU is mounted on the package SP and faces the rear surface SUB-BS. On the rear surface SUB-BS, the first adhesive member ADm surrounds the sensor SS and partially overlaps the package SP. That is, the first adhesive member ADm is adhered to both the package SP and the rear surface SUB-BS.

[0111] The second adhesive member ADa overlaps a part of the first adhesive member ADm and is attached to each of the first adhesive member ADm and the back surface SUB-BS. According to Fig. 7, the second adhesive member ADa is disposed at each corner of the first adhesive member ADm. For example, the second adhesive member ADa is disposed at the apex of the first adhesive member ADm on a plane, but is not limited thereto.

[0112] For example, the second adhesive member ADa surrounds the first adhesive member ADm and is attached to the first adhesive member ADm and the rear surface SUB-BS, respectively. That is, the second adhesive member ADa is a member for fixing the first adhesive member ADm and the substrate SUB to each other, and the shape and material of the second adhesive member ADa may be variously modified.

[0113] The circuit board PCB is spaced apart from the sensor unit SU at a fixed distance in the second direction DR2. The circuit board PCB is electrically connected to the sensor unit SU, for example, via a flexible printed circuit board.

[0114] 8 is a flow diagram showing a method for manufacturing a display device according to an embodiment of the present invention, and FIGS. 9A to 9D are views showing a method for manufacturing the display device shown in FIG.

[0115] 8 and 9A, a first applicator ND1 applies a first adhesive material ADm onto a rear surface SUB-BS of a substrate SUB (S110). According to one embodiment of the present invention, the first applicator ND1 applies the first adhesive material ADm including a thermal initiator as previously described in Fig. 6. Meanwhile, in the first process (S110), no external heat is provided to the first adhesive material ADm, and the first adhesive material ADm is not firmly attached to the substrate SUB.

[0116] In addition, the first applicator ND1 applies the first adhesive member ADm onto the rear surface SUB-BS so that the opening OP is defined. Although the first adhesive member ADm has a rectangular shape as an example, the shape of the first adhesive member ADm is not limited thereto and may be modified in various ways.

[0117] Meanwhile, the circuit layer COL, the display element layer ED, and the sealing member ECL described with reference to FIG. 3A are disposed on the upper surface SUB-US of the substrate SUB.

[0118] 8 and 9B, a sensor unit SU is disposed on a first adhesive member ADm (S120). The sensor unit SU overlaps at least a portion of the first adhesive member ADm. Similarly, the second process (S120) is a step in which no external heat is provided to the first adhesive member ADm, and the first adhesive member ADm is not firmly attached to the substrate SUB and the sensor unit SU.

[0119] 8 and 9C, the second applicator ND2 applies the second adhesive member ADa to the first adhesive member ADm and the rear surface SUB-BS (S130). The second adhesive member ADa overlaps at least a portion of the first adhesive member ADm.

[0120] According to an embodiment of the present invention, the second applicator ND2 applies the second adhesive member ADa containing the photoinitiator as previously described in Fig. 6. The second adhesive member ADa does not overlap with the sensor unit SU and is exposed to the outside from the first adhesive member ADm and the sensor unit SU.

[0121] The second adhesive member ADa is irradiated with ultraviolet light LB (S140). The ultraviolet light LB is irradiated by a light device UD. As the second adhesive member ADa is entirely exposed to the outside from the first adhesive member ADm and the sensor unit SU, the ultraviolet light LB is irradiated onto the entire second adhesive member ADa. As the ultraviolet light LB is irradiated onto the second adhesive member ADa, the second adhesive member ADa is cured. As a result, the first adhesive member ADm and the substrate SUB are firmly fixed to each other by the second adhesive member ADa.

[0122] According to an embodiment of the present invention, the third process (S130) and the fourth process (S140) may be performed simultaneously. That is, the second adhesive member ADa is irradiated with ultraviolet light LB at the same time as the second applicator ND2 applies the second adhesive member ADa to the rear surface SUB-BS. Therefore, the first adhesive member ADm and the substrate SUB are firmly fixed to each other by the second adhesive member ADa before the heat treatment process for providing external heat to the first adhesive member ADm.

[0123] Meanwhile, the third process (S130) and the fourth process (S140) may be performed before the second step (S120).

[0124] 8 and 9D, external heat is applied to the first adhesive member ADm (S150). The thermal initiator included in the first adhesive member ADm is activated by changing its temperature due to the heat applied from the outside.

[0125] Meanwhile, after the fourth process (S140), the substrate SUB is moved to a space where a heating device HD is arranged to receive external heat. In this case, since the substrate SUB and the first adhesive member ADm are fixed by the second adhesive member ADa, the alignment between the substrate SUB and the first adhesive member ADm is maintained.

[0126] The heating device HD generally applies heat HT to the first adhesive member ADm. The thermal initiator included in the first adhesive member ADm is activated by the heat HT and becomes more adhesive. That is, the first adhesive member ADm is cured by applying heat HT to the first adhesive member ADm.

[0127] In particular, heat is also applied to the entire first adhesive member ADm disposed between the rear surface SUB-BS and the sensor unit SU, so that the rear surface SUB-BS and the sensor unit SU are firmly fixed to each other.

[0128] Fig. 10A is a cross-sectional view of a display device according to another embodiment of the present invention, and Fig. 10B is an exploded perspective view showing a sensor disposed on the rear surface of the substrate according to the embodiment shown in Fig. 10A.

[0129] In the display device DDa shown in FIG. 10A, compared to the display device DD shown in FIG. 6, only the structures of the first adhesive member ADm1 and the sensor unit SUz are modified, and the structures of the remaining components are substantially the same.

[0130] 10A and 10B, the sensor unit SUz includes a sensor SSz and a package SPz that mounts the sensor SSz. According to an embodiment of the present invention, the sensor unit SUz is a fingerprint recognition sensor based on an ultrasonic method. Exemplarily, the fingerprint recognition sensor based on the ultrasonic method recognizes a fingerprint by using ultrasonic signals emitted from a plurality of piezoelectric sensors included in the sensor SSz.

[0131] The adhesive member AUz includes a first adhesive member ADm1 and a second adhesive member ADa1. The second adhesive member ADa1 has substantially the same configuration and structure as the second adhesive member ADa shown in FIG.

[0132] The first adhesive member ADm1 is disposed on the back surface SUB-BS of the substrate SUB. The first adhesive member ADm1 entirely overlaps the sensor unit SUz, and no separate opening is defined therebetween.

[0133] By providing a fingerprint recognition sensor based on an ultrasonic wave method in the sensor unit SUz, the sensor unit SUz is entirely attached to the rear surface SUB-BS of the substrate SUB by a first adhesive member ADm1 as shown in Fig. 10B. In this case, the thickness of the first adhesive member ADm1 shown in Fig. 10A is provided to be thinner than the thickness of the first adhesive member ADm shown in Fig. 6.

[0134] 11A and 11B are diagrams illustrating a method of manufacturing a display device according to another embodiment of the present invention.

[0135] The manufacturing method of the display device shown in Figures 11A and 11B is substantially the same as the manufacturing method of the display device described through Figures 9A to 9D, except for the method of applying the adhesive material AUk to the rear surface SUB-BS of the substrate SUB.

[0136] According to an embodiment of the present invention, the adhesive member AUk shown in FIGS. 11A and 11B is formed by integrally providing the first adhesive member ADm and the second adhesive member ADa shown in FIG.

[0137] 11A, the applicator NDk applies the adhesive material AUk onto the rear surface SUB-BS of the substrate SUB. The applicator NDk can apply the adhesive material AUk onto the rear surface SUB-BS in a manner corresponding to the shapes of the first adhesive member ADm and the second adhesive member ADa previously disclosed through FIGS. 9A and 9C. That is, the adhesive material AUk is applied onto the rear surface SUB-BS using one applicator NDk.

[0138] According to an embodiment of the present invention, the adhesive member AUk includes a thermal initiator and a photoinitiator, i.e., the characteristics of the adhesive member AUk shown in Fig. 11A correspond to the characteristics of the first adhesive member ADm and the second adhesive member ADa shown in Fig. 6, each of which includes both a thermal initiator and a photoinitiator.

[0139] As shown in Fig. 11B, since the adhesive member AUk contains a photoinitiator, ultraviolet light is provided to the adhesive member AUk by the light device UD. As a result, the adhesive member AUk is firmly fixed to the rear surface SUB-BS. After that, although not shown, the sensor unit SU shown in Fig. 6 is placed on the adhesive member AUk, and external heat is provided to the adhesive member AUk to fix the sensor unit SU and the adhesive member AUk to each other.

[0140] Fig. 12A is a plan view of a display panel according to another embodiment of the present invention, Fig. 12B is a cross-sectional view of the display device according to the embodiment shown in Fig. 12A, and Fig. 12C is a cross-sectional view of the display device according to the another embodiment shown in Fig. 12A.

[0141] Compared to the display device DD shown in Figures 4 and 6, the display device DDb shown in Figures 12A and 12B only has a different structure from the circuit board PCBz and a different position of the sensor unit SU, and the structure of the remaining components is substantially the same.

[0142] 12A and 12B, a hole region OP2 is defined in the circuit board PCBz according to the present invention. The second bonding region DPD of the circuit board PCBz is disposed on the first bonding region SPD, and the circuit board PCBz is bent along one side of the substrate SUB. As the circuit board PCBz is bent along one side of the substrate SUB, a portion of the circuit board PCBz is disposed on the rear surface of the substrate SUB. In this case, the circuit board PCBz partially disposed on the rear surface of the substrate SUB overlaps the bezel region DP-NDA and the display region DP-DA, respectively. In particular, the hole region OP2 included in the circuit board PCBz overlaps the sensing region FSA.

[0143] The sensor unit SU is inserted into the hole area OP2, disposed on the rear surface of the substrate SUB, and electrically connected to the circuit board PCBz.

[0144] The adhesive member AU according to the present invention is adhered to the sensor unit SU and the substrate SUB, respectively, to fix the sensor unit SU and the substrate SUB to each other.

[0145] 12C, the display device DDc shown in FIG. 12C is different from the display device DDb shown in FIG. 12B in that only the position of the sensor unit SU is changed, and the remaining configurations and structures are substantially the same.

[0146] According to an embodiment of the present invention, the hole region OP2 shown in Fig. 12C overlaps the display region DP-DA and the bezel region DP-NDA, respectively. Therefore, the sensor unit SU shown in Fig. 12C is provided in a structure overlapping the display region DP-DA and the bezel region DP-NDA, respectively.

[0147] Fig. 13A is a plan view showing the rear surface of a display device according to another embodiment of the present invention, and Fig. 13B is a cross-sectional view of the display device according to the embodiment shown in Fig. 13A.

[0148] Compared to the display device DD shown in Figures 6, the display device DDd shown in Figures 13A and 13B only has different configurations of the protective member PM and the adhesive members AD-Z, and the remaining configurations and structures are substantially identical.

[0149] According to an embodiment of the present invention, the display device DDd is provided as a flexible display device, i.e. the display device DDd comprises a folding area FA and a non-folding area NFA adjacent to the folding area FA, and the folding area FA is bent along a folding axis FX.

[0150] 13A and 13B, the protective member PM is disposed on the rear surface of the substrate SUB. In particular, the protective member PM is disposed on the rear surface of the substrate SUB so as to overlap the non-folding area NFA that overlaps with the sensor unit SU.

[0151] The adhesive member AD-Z and the circuit board PCBz are disposed on the protective member PM. The adhesive member AD-Z adheres the sensor unit SU to the protective member PM. For example, the adhesive member AD-Z is provided in the same configuration as the adhesive member AU shown in Fig. 6. For example, the adhesive member AD-Z is provided in the form of a double-sided adhesive tape.

[0152] The adhesive member AD-Z shown in Fig. 13B is provided in the form of a double-sided adhesive tape. In this case, the adhesive member AD-Z does not contain a thermal initiator or a photoinitiator, and can adhere the protective member PM and the sensor unit SU.

[0153] As described above, the embodiment of the present invention has been disclosed using the drawings and the specification. Although specific terms are used herein, they are used only for the purpose of describing one embodiment of the present invention, and are not used to limit the meaning or the scope of the present invention described in the claims. Therefore, a person having ordinary skill in the art can understand that various modifications and equivalent other embodiments are possible. Therefore, the technical scope of protection of the present invention should be determined by the technical ideas of the attached claims. [Explanation of symbols]

[0154] AM window adhesive material AU adhesive material BA Bonding Area DD display device DM Display Module DP-DA display area DP-NDA hidden area ECL sealing material FSA sensing area IA recognition area ISU Input Sensing Unit POL polarizing layer SU sensor unit WM Window Materials

Claims

1. a display module including a display area in which an image is to be displayed and a bezel area adjacent to the display area; a protective member disposed on a rear surface of the display module and overlapping a portion of the display area; a sensor unit disposed on the protection member and overlapping a portion of the display area; an adhesive member that is superimposed on the sensor unit and adheres the sensor unit to the protective member; Including, The adhesive member has an opening defined therein that overlaps with the sensor unit; less than the entire adhesive member overlaps the sensor unit; the sensor unit includes a sensor overlying the opening and a package in which the sensor is disposed; A display device, wherein a gap between the protective member and the sensor is equal to a thickness of the adhesive member.

2. A folding area and a non-folding area are defined in the display module; the unfolded region overlaps the sensor unit; The display device according to claim 1 , wherein the protection member overlaps the non-folding region.

3. The display device described in claim 1, wherein the package is directly adhered to the adhesive member.

4. The display device according to claim 3 , wherein the adhesive member is disposed at a distance from the sensor in a plan view.

5. In a plan view, the adhesive member does not overlap the sensor, The display device according to claim 3 , wherein the adhesive member overlaps a portion of the package in a plan view.

6. The display device according to claim 3 , wherein the package is surrounded by the adhesive member in a plan view.

Images