Heat dissipation member, lighting device, and method for manufacturing heat dissipation member
JP7668974B1Active Publication Date: 2025-04-25MITSUBISHI ELECTRIC CORP
Patent Information
- Application Number
- JP2024567569
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2024-06-06
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2044-06-06
Smart Images
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Abstract
The heat dissipation member (1) has a first protrusion (31) having a first surface (41) and a second protrusion (32) having a second surface (42) facing the first surface (41). The material of the first surface (41) is different from the material of the second surface (42). The radiation spectrum of the material of the first surface (41) and the radiation spectrum of the material of the second surface (42) each have an average emissivity of 0.5 or more in a wavelength range of 2.5 μm to 25 μm. In a range of 30% or more in the wavelength range of 2.5 μm to 25 μm, the difference between the emissivity of the radiation spectrum of the material of the first surface (41) and the emissivity of the radiation spectrum of the material of the second surface (42) is 0.3 or more.
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Citation Information
Patent Citations
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