Variable pitch access vacuum robot device

Abstract

A robotic apparatus is provided with a variable pitch of the end effector suitable for accommodating different pitches such as between two adjacent processing chambers or between two adjacent load lock chambers. The robotic apparatus can operate in a dual substrate handling mode, a single substrate handling mode, or a combination thereof. The robotic apparatus can also be an off-axis robot. Various robotic apparatuses, electronic device processing systems including such robotic apparatuses, and methods of use thereof according to various embodiments are described.

Description

[Technical field]

[0001] SUMMARY OF THE DISCLOSURE Embodiments of the present application relate to a robot with multiple end effectors, an electronic device processing apparatus, and a method including a robot with multiple end effectors. [Background technology]

[0002] The processing of substrates in semiconductor electronic device manufacturing can include a combination of various processes applied within the same substrate processing system. For example, such processes include chemical vapor deposition / atomic layer deposition (CVD / ALD) and physical vapor deposition (PVD) applied in the same tool or platform. These processes can be applied using various configurations of processing chambers coupled to a mainframe. A robot is located within the transfer chamber of the mainframe and is configured to move substrates between the various processing chambers. Summary of the Invention

[0003] In some embodiments, a robotic apparatus is provided, the robotic apparatus including at least one lower arm configured to rotate about a first axis of rotation, at least one upper arm rotatably coupled to the at least one lower arm at a second axis of rotation spaced from the first axis of rotation, a first end effector rotatably coupled to the at least one upper arm, optionally via a first forearm, and a second end effector rotatably coupled to the at least one upper arm, optionally via a second forearm. In an embodiment, the robotic apparatus is configured to operate in both a dual substrate handling mode and a single substrate handling mode. In the dual substrate handling mode, the first end effector and the second end effector are rotated separately about one or more additional rotational axes different from the first and second rotational axes to separate the first end effector from the second end effector by a first pitch or a second pitch different from the first pitch, at least one of the first pitch or the second pitch being suitable for the first end effector and the second end effector to simultaneously access separate load lock chambers or separate processing chambers. In the single substrate handling mode, the first end effector and the second end effector are rotated separately about one or more additional rotational axes to align the first end effector and the second end effector in a configuration suitable for either the first end effector or the second end effector to access one load lock chamber or one processing chamber.

[0004] In another embodiment, an electronic device processing system is provided that includes a transfer chamber, two adjacent load lock chambers coupled to the transfer chamber and spaced apart horizontally by a first pitch, four or more processing chambers coupled to the transfer chamber, where at least one pair of adjacent processing chambers of the four or more processing chambers are spaced apart by a second pitch different from the first pitch, and a robotic device located at least partially within the transfer chamber. In an embodiment, the robotic device includes at least one lower arm configured to rotate about a first axis of rotation, at least one upper arm rotatably coupled to the at least one lower arm at a second axis of rotation spaced apart from the first axis of rotation, a first end effector rotatably coupled to the at least one upper arm, optionally via a first forearm, and a second end effector rotatably coupled to the at least one upper arm, optionally via a second forearm. In an embodiment, the robotic device is configured to operate in both a dual substrate handling mode and a single substrate handling mode, in which the first end effector and the second end effector are rotated separately about one or more additional rotational axes different from the first and second rotational axes to separate the first end effector from the second end effector by a first pitch or a second pitch different from the first pitch, allowing the first end effector and the second end effector to simultaneously access two adjacent load lock chambers or at least a pair of adjacent processing chambers. In a single substrate handling mode, the first end effector and the second end effector are rotated separately about one or more additional rotational axes to align the first end effector and the second end effector in a configuration suitable for either the first end effector or the second end effector to access one load lock chamber or one processing chamber.

[0005] In another embodiment, a method of transferring substrates is provided. The method includes operating a robotic apparatus in a dual substrate handling mode and a single substrate handling mode. In an embodiment, the robotic apparatus includes at least one lower arm configured to rotate about a first axis of rotation, at least one upper arm rotatably coupled to the at least one lower arm at a second axis of rotation spaced from the first axis of rotation, a first end effector rotatably coupled to the at least one upper arm, optionally via a first forearm, and a second end effector rotatably coupled to the at least one upper arm, optionally via a second forearm. In an embodiment, operating in a dual substrate handling mode includes rotating the first end effector and the second end effector separately about one or more additional rotational axes different from the first rotational axis and the second rotational axis to separate the first end effector from the second end effector by a first pitch or by a second pitch different from the first pitch, where at least one of the first pitch or the second pitch is suitable for the first end effector and the second end effector to simultaneously access separate load lock chambers or separate processing chambers. In an embodiment, operating in the single substrate handling mode includes separately rotating the first end effector and the second end effector about one or more additional axes of rotation to align the first end effector and the second end effector in a configuration suitable for either the first end effector or the second end effector to access a load lock chamber or a processing chamber.

[0006] In another embodiment, an electronic device processing system is provided that includes a transfer chamber including a center, two adjacent load lock chambers coupled to the transfer chamber and spaced apart horizontally by a first pitch, four or more processing chambers coupled to the transfer chamber, at least one pair of adjacent processing chambers of the four or more processing chambers spaced apart by a second pitch different from the first pitch, and a robotic device located at least partially within the transfer chamber. In an embodiment, the robotic device includes at least one lower arm configured to rotate about a first axis of rotation, the first axis of rotation being offset from a center of the transfer chamber, at least one upper arm rotatably coupled to the at least one lower arm at a second axis of rotation spaced apart from the first axis of rotation, a first end effector rotatably coupled to the at least one upper arm, optionally via a first forearm, and a second end effector rotatably coupled to the at least one upper arm, optionally via a second forearm. In an embodiment, the robotic device is configured to operate in a dual substrate handling mode in which the first end effector and the second end effector are separately rotated about one or more additional rotational axes different from the first and second rotational axes to separate the first end effector from the second end effector by a first pitch or by a second pitch different from the first pitch, allowing the first end effector and the second end effector to simultaneously access two adjacent load lock chambers or at least a pair of adjacent processing chambers.

[0007] Numerous other aspects and features are provided in accordance with the above and other embodiments of the present disclosure. Other features and aspects of the embodiments of the present disclosure will become more fully apparent from the following detailed description, the claims, and the accompanying drawings.

[0008] The drawings described below are for illustrative purposes only and are not necessarily drawn to scale. They are not intended to limit the scope of the present disclosure in any way. Wherever possible, the same or similar reference numbers will be used throughout the drawings to refer to the same or like parts. [Brief description of the drawings]

[0009] [Figure 1] 1 shows a schematic top view of a substrate processing system including a robotic device located within a transfer chamber of a mainframe according to a disclosed embodiment. [Figure 2A] FIG. 1 illustrates a perspective view of a robotic device according to a disclosed embodiment. [Figure 2B] FIG. 1 illustrates a top view of a robotic device according to a disclosed embodiment. [Figure 3A] FIG. 4 is a schematic diagram illustrating a dual substrate handling mode of the robotic device of FIGS. 2A-2B. [Figure 3B] FIG. 4 is a schematic diagram illustrating a dual substrate handling mode of the robotic device of FIGS. 2A-2B. [Figure 3C] FIG. 4 is a schematic diagram illustrating a dual substrate handling mode of the robotic device of FIGS. 2A-2B. [Figure 3D] FIG. 4 is a schematic diagram illustrating a dual substrate handling mode of the robotic device of FIGS. 2A-2B. [Figure 4A] FIG. 4 is a schematic diagram showing a single substrate handling mode of the robot device of FIGS. 2A and 2B. [Figure 4B] FIG. 4 is a schematic diagram showing a single substrate handling mode of the robot device of FIGS. 2A and 2B. [Figure 4C] FIG. 4 is a schematic diagram showing a single substrate handling mode of the robot device of FIGS. 2A and 2B. [Figure 4D] FIG. 4 is a schematic diagram showing a single substrate handling mode of the robot device of FIGS. 2A and 2B. [Figure 5A] FIG. 1 illustrates a perspective view of a robotic device according to a disclosed embodiment. [Figure 5B] FIG. 1 illustrates a top view of a robotic device according to a disclosed embodiment. [Figure 6A] FIG. 5C is a schematic diagram illustrating a dual substrate handling mode of the robotic device of FIGS. 5A-5B. [Figure 6B] FIG. 5C is a schematic diagram illustrating a dual substrate handling mode of the robotic device of FIGS. 5A-5B. [Figure 6C] FIG. 5C is a schematic diagram illustrating a dual substrate handling mode of the robotic device of FIGS. 5A-5B. [Figure 6D] FIG. 5C is a schematic diagram illustrating a dual substrate handling mode of the robotic device of FIGS. 5A-5B. [Figure 7A] FIG. 5C is a schematic diagram showing a single substrate handling mode of the robot device of FIGS. 5A and 5B. [Figure 7B] FIG. 5C is a schematic diagram showing a single substrate handling mode of the robot device of FIGS. 5A and 5B. [Figure 7C] FIG. 5C is a schematic diagram showing a single substrate handling mode of the robot device of FIGS. 5A and 5B. [Figure 7D] FIG. 5C is a schematic diagram showing a single substrate handling mode of the robot device of FIGS. 5A and 5B. [Figure 8A] FIG. 1 illustrates a perspective view of a robotic device according to a disclosed embodiment. [Figure 8B] FIG. 8B illustrates a top view of the robotic device of FIG. 8A shown in a folded configuration (e.g., chamber pre-position or load lock pre-position). [Figure 8C] FIG. 8B shows a top view of the robotic device of FIG. 8A shown in an extended configuration (eg, twin chamber reach or dual load lock reach in dual substrate handling mode). [Figure 9] 8A-8C positioned within a transfer chamber of a main frame according to a disclosed embodiment. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Reference will now be made in detail to the exemplary embodiments provided, as illustrated in the accompanying drawings. Unless specifically stated otherwise, the features of the various embodiments described herein may be combined with each other.

[0011] An electronic device processing system may perform a combination of multiple substrate manufacturing processes, including chemical vapor deposition / atomic layer deposition (CVD / ALD) processes, annealing processes, etching processes, physical vapor deposition (PVD), and / or other processes. An electronic device processing system may include a variety of different processing chambers and load lock chambers for performing a combination of multiple substrate manufacturing processes. Each of these processing chambers and load lock chambers may include one or more processing positions where a substrate is placed for processing. The processing positions in the various processing chambers and / or load lock chambers may be separated by different distances (e.g., pitch) depending on the physical layout of the processing chambers, the type of manufacturing process performed in each processing chamber, and / or the configuration of the processing chambers.

[0012] In an embodiment, the transfer chamber includes multiple load locks and / or multiple processing chambers connected to a side or facet of the transfer chamber. The transfer chamber may include a robot arm with a dual end effector for transferring substrates between the load locks and / or transfer chamber. The robot may be designed such that the pitch or separation between the dual end effectors is adjustable, and the end effectors may be further designed such that they may be positioned for single substrate handling (one substrate is removed from and / or inserted into a processing chamber or load lock) and also for multiple substrate handling (two substrates are removed from and / or inserted into a processing chamber or load lock).

[0013] Existing robotic devices, for example those with inline end effectors, access one process chamber and / or one load lock chamber at a time and exhibit throughputs ranging from about 60 to about 80 wafers per hour. Thus, in accordance with embodiments described herein, robotic devices with improved throughput are provided. In certain embodiments, the robotic devices described herein exhibit throughputs of at least about 100 wafers per hour, and even greater than 175 wafers per hour in certain embodiments.

[0014] A robotic device with a dual end effector can be implemented to place substrates on and remove substrates from multiple processing chambers (e.g., side-by-side processing chambers) simultaneously. However, a dual end effector arranged at a first fixed pitch may not be able to access one or more processing chambers or one or more load lock chambers because the processing chambers or load lock chambers are separated by a second fixed pitch different from the first fixed pitch. Thus, according to embodiments described herein, a robotic device with a variable end effector pitch is provided.

[0015] The robotic devices described herein can operate in a single substrate processing mode, a dual substrate processing mode, or a combination thereof. This added flexibility and ability to access separately allows for sequential loading and unloading of the various processing chambers or load lock chambers. This hybrid capability also allows the robotic device to continue to operate even when one processing chamber or load lock chamber of a pair of adjacent processing chambers or load lock chambers is not operational.

[0016] In one or more embodiments described herein, a robotic device configured to operate in a single substrate mode, a dual substrate mode, or a combination thereof is disclosed. When operating in dual substrate mode, the robotic device can, for example, have a variable end effector pitch to accommodate changes in pitch between two adjacent processing chambers or between two adjacent load lock chambers. In certain embodiments, the robotic device is an off-center robot (also referred to as an off-axis robot) disposed off-center from the center of the transfer chamber in which it is located.

[0017] Exemplary embodiments of robots, including various pitches between end effectors, are described herein with reference to FIGS. 1-9.

[0018] Referring now to FIG. 1, FIG. 1 shows a schematic top view of a substrate processing system 100 including a robotic device 102 according to the disclosed embodiments. The substrate processing system 100 can include a main frame 104, and the main frame 104 can include a transfer chamber 106 formed by the walls of the main frame 104. The transfer chamber 106 can be configured to operate, for example, under vacuum. The transfer chamber can have a center 150. The robotic device 102 can be at least partially disposed within the transfer chamber 106 and configured to operate within the transfer chamber 106. The robotic device 102 can include a body (214 in FIG. 2, 514 in FIG. 5, and 814 in FIG. 8A) configured to be attached to the wall (e.g., the floor) of the transfer chamber 106. The robotic device 102 can be "off axis" or "off center", and these terms, as used herein, refer to a robotic device having at least one lower arm configured to rotate about a first axis of rotation offset from the center 150 of the transfer chamber 106.

[0019] The robotic device 102 may be configured to pick up and / or place substrates 118 (sometimes referred to as "wafers" or "semiconductor wafers") to and from various destinations. The destinations may be processing chambers coupled to the transfer chamber 106. The destinations may also be load lock chambers coupled to the transfer chamber 106. For example, the destinations may be one or more processing chambers 120 and one or more load lock chambers 122 that may be coupled to the transfer chamber 106. The mainframe 104 may include more or fewer processing chambers 120 and more or fewer load lock devices 122 than shown in FIG. 1 .

[0020] The processing chambers 120 may be configured to perform any number of processing steps on the substrate 118, such as deposition, oxidation, nitridation, etching, polishing, cleaning, lithography, etc. In FIG. 1, seven processing chambers 120 are shown coupled to various sides of the transfer chamber 106. However, it should be noted that other configurations including more or fewer processing chambers are possible and contemplated by this disclosure. In certain embodiments, the number of processing chambers coupled to the transfer chamber 106 ranges from 4 to 24. In certain embodiments, the number of processing chambers coupled to the transfer chamber 106 ranges from 4 to 20. In certain embodiments, the number of processing chambers coupled to the transfer chamber 106 ranges from 5 to 16. In certain embodiments, the number of processing chambers coupled to the transfer chamber 106 ranges from 6 to 10. FIG. 9 illustrates an example of an electronic device processing system with 12 processing chambers. In some embodiments, the transfer chamber is a linear transfer chamber having two long sides and two short sides. In other embodiments, the transfer chamber can have more than four sides, such as five sides, six sides, seven sides, eight sides, etc. The sides can have the same size (e.g., the same length) and / or different sizes.

[0021] The load lock chambers 122 may be configured to interface with a factory interface 126. The factory interface 126 may include a load / unload robot 127 (shown as a dashed box) configured to transfer substrates 118 to and from a substrate carrier 128 (e.g., a Front Opening Unified Pod (FOUP)) docked to a load port 130 of the factory interface 126. Other load / unload robots may transfer substrates 118 between the substrate carriers 128 and the load lock chambers 122 in any sequence or order.

[0022] In some embodiments, two adjacent load lock chambers 122 are horizontally spaced apart by a first pitch D1. In some embodiments, the first pitch D1 between the centers of two adjacent load lock chambers 122 can be in a range from about 20 inches to about 25 inches. In some embodiments, the first pitch D1 between the centers of two adjacent load lock chambers 122 can be in a range from about 21 inches to about 23 inches. In some embodiments, the first pitch D1 between the centers of two adjacent load lock chambers 122 can be about 22 inches. Other distances for the first pitch D1 may be possible.

[0023] In some embodiments, at least one pair of two adjacent processing chambers 120 are horizontally spaced apart by a second pitch D2 that is different from the first pitch D1 (e.g., the second pitch D2 can be greater than the first pitch D1). In some embodiments, the second pitch D2 between the centers of the two adjacent processing chambers 120 can be in a range from about 32 inches to about 40 inches. In some embodiments, the second pitch D2 between the centers of the two adjacent processing chambers 120 can be in a range from about 34 inches to about 38 inches. In some embodiments, the second pitch D2 between the centers of the two adjacent processing chambers 120 can be about 36 inches. Other distances for the second pitch D2 can be possible.

[0024] The one or more load lock chambers 122 may be accessed by the robotic device 102 through a slit valve 134. The one or more processing chambers 120 may be accessed by the robotic device 102 through a slit valve 140.

[0025] A robotic device according to embodiments described herein includes at least one lower arm configured to rotate about a first axis of rotation, at least one upper arm coupled to the at least one lower arm at a second axis of rotation spaced from the first axis of rotation, a first end effector rotatably coupled to the at least one upper arm, optionally via a first forearm, and a second end effector rotatably coupled to the at least one upper arm, optionally via a second forearm. In certain embodiments, the first and second end effectors of the robotic device 102 are coplanar.

[0026] The slit valves 134 and 140 may have a slit valve width that allows access by the robotic device 102, particularly the first and second end effectors, in both dual and single substrate handling modes. In certain embodiments, the first and / or second end effector access the slit valve 134 and / or slit valve 140 orthogonally (relative to the horizontal opening of the slit valve 134 or slit valve 140). In alternative embodiments, the first and / or second end effector access the slit valve 134 and / or slit valve 140 at an angle (relative to the horizontal centerline of the slit valve 134 or slit valve 140). The first end effector and / or the second end effector can access one or more slit valves 134 and / or 140 at an angle ranging from about 0° to about 20°, from about 5° to about 17°, or from about 7° to about 14° when measured relative to a horizontal centerline of slit valve 134 or slit valve 140.

[0027] As used herein, the term "dual substrate handling mode" refers to the robotic device 102 simultaneously accessing two adjacent load lock chambers (e.g., load lock chamber 122) or at least a pair of adjacent processing chambers (e.g., processing chamber 120). When the robotic device 102 is in the dual substrate handling mode, the first end effector and the second end effector are rotated separately or together about one or more additional axes different from the first and second rotation axes to separate the first end effector from the second end effector by a first pitch D1 or a second pitch D2.

[0028] As used herein, "single substrate handling mode" refers to the robotic device accessing one load lock chamber (e.g., load lock chamber 122) or one process chamber (e.g., process chamber 120). When the robotic device 102 is in the single substrate handling mode, the first end effector and the second end effector are separately rotated about one or more additional axes different from the first and second rotation axes, and the first end effector and the second end effector are aligned in a configuration suitable for either the first end effector or the second end effector to access a load lock chamber or a process chamber. The second end effector that is not being used to pick or place a substrate can be rotated out of the way so as not to interfere with the first end effector picking or placing a substrate while picking and placing the substrate.

[0029] As used herein, the term "accessing" with respect to one or more end effectors accessing one or more load lock chambers and / or processing chambers refers to the end effectors accessing said chambers to pick up a substrate, place a substrate, exchange a substrate, and / or perform any other operation that one skilled in the art would understand to be performed by an end effector accessing a load lock chamber and / or processing chamber.

[0030] Various embodiments of the robotic apparatus 102 are contemplated herein, as shown in further detail with respect to Figures 2A-2B, 5A-5B, and 8A-8C. The modes of operation for the dual substrate handling mode and the single substrate handling mode may vary for the various embodiments of the robotic apparatus 102, as shown in further detail with respect to Figures 3A-3D, 4A-4D, 6A-6D, and 7A-7D.

[0031] A controller 142 may be in communication with the robotic device 102. The robotic device 102 may be controlled by appropriate commands from the controller 142. The controller 142 may also control the slit valves 134 and 140 and other components and processes taking place within the mainframe 104, the load lock chamber 122, and the processing chamber 120.

[0032] Further, reference is made to FIG. 2A, which illustrates a perspective view of an embodiment of the robotic device 102 according to the disclosed embodiment, and FIG. 2B, which illustrates a top view of the robotic device 102 according to the disclosed embodiment. In the embodiment illustrated in FIGS. 2A-2B, the robotic device 102A is shown. The robotic device 102A may include a lower arm 210 configured to rotate about a first axis of rotation 215. For example, one or more motors (not shown) located in the base 214 may rotate the lower arm 210 about the first axis of rotation 215. The robotic device 102A may further include an upper arm 220 rotatably coupled to the lower arm 210 at a second axis of rotation 225 spaced apart from the first axis of rotation 215. The upper arm 220 may be configured to rotate about the second axis of rotation 225. For example, one or more motors (not shown) located in the base 214 may rotate the upper arm 220 about the second axis of rotation 225. In some embodiments, portions of the lower arm 210 and upper arm 220 can move in different planes above and below each other.

[0033] The robotic device 102A may further include a first end effector 230A rotatably coupled to the one upper arm 220 at a third axis of rotation 235 spaced from the second axis of rotation 225. The first end effector may include a first curved portion 232A in a first direction in a horizontal plane. The robotic device 102A may also include a second end effector 230B rotatably coupled to the one upper arm 220 at the third axis of rotation 235. The second end effector may include a second curved portion 232B in a second direction opposite to the first direction in a horizontal plane. The first end effector 230A and the second end effector 230B are configured to rotate separately about the third axis of rotation 235 for both the dual substrate handling mode and the single substrate handling mode. For example, one or more motors (not shown) located in the base 214 can separately rotate the first end effector 230A and the second end effector 230B about the third axis of rotation 235 for both the dual substrate handling mode and the single substrate handling mode.

[0034] In certain embodiments, the present disclosure encompasses methods of transferring substrates by operating the robotic apparatus in a dual substrate handling mode and a single substrate handling mode. Operation of the robotic apparatus 102A in a dual substrate handling mode is further described with reference to Figures 3A-3D.

[0035] In FIG. 3A, the robot device 102A is shown in an extended configuration suitable for reaching (or accessing) into two horizontally adjacent load lock chambers (such as the load lock chamber 122 in FIG. 1). In this specification, this configuration is referred to as "dual load lock reach". The first end effector 230A and the second end effector 230B rotate separately around a third rotation axis 235 so that the two end effectors can reach a dual load lock reach separated by a first pitch. As can be seen from FIG. 3A, in the dual load lock reach, the first end effector 230A is separated from the second end effector 230B by a first pitch D1. In some embodiments, the first pitch D1 is measured between a first end point 232A of the first end effector 230A and a second end point 232B of the second end effector 230B as shown in the configuration of FIG. 3A, and the first pitch D1 corresponds to the distance between the centers of two horizontally adjacent load locks 122. In some embodiments, the first pitch D1 between the centers of two adjacent load lock chambers 122 can be in the range of about 20 inches to about 25 inches. In some embodiments, the first pitch D1 between the centers of two adjacent load lock chambers 122 can be in the range of about 21 inches to about 23 inches. In some embodiments, the first pitch D1 between the centers of two adjacent load lock chambers 122 can be about 22 inches. Other distances for the first pitch D1 are also possible.

[0036] In certain embodiments, the first end effector 230A and the second end effector 230B access two slit valves 134 of the load lock chamber 122 simultaneously and at an angle (relative to the horizontal centerline of the slit valve 134 or slit valve 140), as shown in FIGURE 3A. In certain embodiments (not shown), the first end effector 230A and the second end effector 230B access two slit valves 134 simultaneously and orthogonally (relative to the horizontal opening of the slit valve 134 or slit valve 140).

[0037] With dual load lock reach, the robotic device 102A can access both load lock chambers 122 to transfer two substrates 118 to the two processing chambers 120, or to load a processed substrate thereon for transfer out of the main frame 104.

[0038] To further illustrate the dual substrate handling mode, assume that the robotic device 102A retrieves two substrates 118 from the load lock chamber 122 and transfers them to two horizontally adjacent processing chambers 120. Upon retrieving the two substrates, the robotic device 102A pivots within the transfer chamber 106 to reach a "chamber preposition" alignment (FIG. 3B) in which the first and second end effectors 230A, 230B can rotate about the third axis of rotation 235 to be in a suitable position to access the two horizontally adjacent processing chambers 120. The pivoting may include one or more of the following: rotating the lower arm 210 about a first axis of rotation 215, rotating the upper arm 220 about a second axis of rotation 225, and / or separately rotating one or more of the first end effector 230A or the second end effector 230B about a third axis of rotation 235.

[0039] After reaching the "chamber pre-position" alignment, the first end effector 230A and the second end effector 230B can be further separated by a second pitch D2. The first end effector 230A and the second end effector 230B can be separately rotated about a third axis of rotation 235 to reach a dual processing chamber reach where the two end effectors are separated by the second pitch. In some embodiments, the second pitch D2 is measured between a first end point 232A of the first end effector 230A and a second end point 232B of the second end effector 230B as shown in the configuration of FIG. 3C, and the first pitch D2 corresponds to the distance between the centers of two horizontally adjacent processing chambers 120. In some embodiments, the second pitch D2 between the centers of two adjacent processing chambers 120 can be in a range of about 32 inches to about 40 inches. In some embodiments, the second pitch D2 between the centers of two adjacent processing chambers 120 can be in a range from about 34 inches to about 38 inches. In some embodiments, the second pitch D2 between the centers of two adjacent processing chambers 120 can be about 36 inches. Other distances for the second pitch D2 can also be possible.

[0040] In a particular embodiment (not shown), the first end effector 230A and the second end effector 230B access two slit valves 140 of two horizontally adjacent processing chambers 120 simultaneously and at an angle (relative to the horizontal centerline of the slit valves 140). In a particular embodiment, the first end effector 230A and the second end effector 230B access two slit valves 140 of two horizontally adjacent processing chambers 120 simultaneously and orthogonally (relative to the horizontal centerline of the slit valves 140), as shown in FIG.

[0041] In FIG. 3C, the robotic device 102A is shown in an extended configuration suitable for reaching (or accessing) into two horizontally adjacent process chambers (such as the process chamber 120 in FIG. 1). This configuration is referred to herein as a "dual process chamber reach." As can be seen in FIG. 3C, in the dual process chamber reach, the first end effector 230A is separated from the second end effector 230B by a second pitch D2. In the dual process chamber reach, the robotic device 102A can access two adjacent process chambers 120 to position two substrates 118 for processing (or retrieve processed substrates and transfer them for further processing or to the load lock chamber 122).

[0042] After processing, the robot 102A can retrieve processed substrates from a pair of horizontally adjacent processing chambers 120 in a "dual processing chamber reach" configuration and pivot within the transfer chamber 106 to reach a "load lock pre-position" alignment shown in FIG. 3D. The pivoting can include one or more of the following: rotating the lower arm 210 about the first rotation axis 215, rotating the upper arm 220 about the second rotation axis 225, and / or separately rotating one or more of the first end effector 230A or the second end effector 230B about the third rotation axis 235. Once the "load lock pre-position" alignment shown in FIG. 3D is reached, the robot apparatus 102A can cyclically repeat operations 3A-3D to sequentially load and / or unload the processing chambers 120 and the load lock chambers 122 in the electronic device processing system 100.

[0043] The operation of the robotic device 102A in the single-substrate handling mode will now be further described with reference to Figures 4A-4D.

[0044] In Figure 4A, the robotic device 102A is shown in a "dual load lock reach" as described with respect to Figure 3A. In the dual load lock reach, the robotic device 102A can access both load lock chambers 122 to retrieve two substrates 118 which can then be placed simultaneously into two horizontally adjacent processing chambers 120, as shown in Figures 3B-3C. Alternatively, the two substrates 118 can be sequentially unloaded into two processing chambers (which may or may not be horizontally adjacent), as shown with respect to Figures 4B-4C.

[0045] Although not shown, the robotic device 102A may also access one load lock chamber 122 to retrieve a single substrate 118 at a time. This may be useful, for example, to allow the electronic device processing system to continue operation when one load lock chamber becomes unrepairable. For example, the end effector 230A could access either one of the load lock chambers 122 without accessing the other. Similarly, the end effector 230B could access either one of the load lock chambers 122 without accessing the other. Doing so may include separately rotating the first end effector 230A and the second end effector 230B about the third rotation axis 235 to align the first end effector 230A and the second end effector 230B in a configuration suitable for either the first end effector 230A or the second end effector 230B to access one load lock chamber 122. In certain embodiments, the slit valve 134 of the load lock chamber 122 can have a width suitable to accommodate access by the first end effector 230A and / or the second end effector 230B, whether accessing two load lock chambers simultaneously or one load lock chamber sequentially.

[0046] The angle at which the first end effector and / or the second end effector access one or more load lock chambers may also vary depending on whether both end effectors access two load lock chambers simultaneously or one load lock chamber sequentially. In certain embodiments, the first end effector 230A and the second end effector 230B access two slit valves 134 simultaneously and orthogonally (with respect to the horizontal opening of the slit valves 134). In certain embodiments, the first end effector 230A and the second end effector 230B access two slit valves 134 simultaneously and at an angle (with respect to the horizontal centerline of the slit valves 134). In certain embodiments, the first end effector 230A and / or the second end effector 230B access the slit valves 134 of one load lock chamber sequentially and orthogonally (with respect to the horizontal opening of the slit valves 134). In certain embodiments, the first end effector 230A and / or the second end effector 230B access the slit valves 134 of one load lock chamber sequentially and at an angle (relative to the horizontal centerline of the slit valves 134).

[0047] 4B and 4C, the first end effector 230A and the second end effector 230B rotate separately about a third axis of rotation 235 to align the first end effector 230A and the second end effector 230B in a configuration suitable for either the first end effector 230A or the second end effector 230B to access one processing chamber 120. For example, in FIG. 4B, the first end effector 230A unloads a substrate into one processing chamber, and then the second end effector 230B unloads the substrate into another processing chamber (located on the opposite side of the processing chamber that received the substrate from the first end effector 230A).

[0048] In FIG. 4C, the first end effector 230A and the second end effector 230B rotate separately about a third rotation axis 235 to align the first end effector 230A and the second end effector 230B in a configuration suitable for either the first end effector 230A or the second end effector 230B to access one processing chamber 120.

[0049] In certain embodiments, the first end effector 230A and the second end effector 230B can sequentially access one slit valve 140 of the same processing chamber 120 (which may or may not be horizontally adjacent), i.e., two separate processing chambers 120. In certain embodiments (not shown), the first end effector 230A and / or the second end effector 230B access a given slit valve 140 at an angle (relative to the horizontal centerline of the slit valve 140). In certain embodiments, the first end effector 230A and / or the second end effector 230B access a processing chamber's slit valve 140 orthogonally (relative to the horizontal opening of the slit valve 140), as shown in FIGS. 4B and 4C.

[0050] After processing, the robot 102A can sequentially retrieve the processed substrates in a "single processing chamber reach" configuration shown in Figures 4B-4C and pivot within the transfer chamber 106 to reach a "load lock pre-position" alignment shown in Figure 4D. The pivoting can include one or more of the following: rotating the lower arm 210 about the first axis of rotation 215, rotating the upper arm 220 about the second axis of rotation 225, and / or separately rotating one or more of the first end effector 230A or the second end effector 230B about the third axis of rotation 235. Once the "load lock pre-position" alignment shown in Figure 4D is reached, the robot apparatus 102A can cyclically repeat operations 4A-4D to sequentially load and / or unload the processing chambers 120 and the load lock chambers 122 within the electronic device processing system 100.

[0051] The robotic apparatus 102A can also load and / or unload processing chambers 120 and load lock chambers 122 in the electronic device processing system 100 using a combination of the dual substrate operating mode of Figures 3A-3D and the single substrate operating mode of Figures 4A-4D.

[0052] For example, in an electronic device processing system with six processing chambers 120 (three on a first side and three on a second side opposite the first side), the robotic apparatus 102A can load substrates into the six processing chambers in three operational steps: 1) a dual substrate operational mode in which two substrates are simultaneously loaded into a pair of horizontally adjacent processing chambers on the first side (e.g., processing chambers 120A and 120B), 2) a dual substrate operational mode in which two substrates are simultaneously loaded into a pair of horizontally adjacent processing chambers on the second side (e.g., processing chambers 120E and 120F), and 3) a single substrate operational mode in which one substrate is sequentially loaded into the remaining empty processing chamber on the first side (e.g., processing chamber 120C) followed by one substrate being loaded into the remaining empty processing chamber on the second side (e.g., processing chamber 120D). Similar sequences can be used to unload into the same exemplary electronic device processing system. Similar sequences with more or fewer operational steps may be performed for other electronic device processing systems that include more or fewer processing chambers.

[0053] The sequence shown herein should not be construed as limiting. For example, processing chambers 120B and 120C may be loaded simultaneously, processing chambers 120D and 120E may be loaded simultaneously, and processing chambers 120A and 120F may be loaded sequentially. In other embodiments, processing chambers 120A and 120B may be loaded simultaneously, processing chambers 120D and 120E may be loaded simultaneously, and processing chambers 120C and 120F may be loaded sequentially. In yet another embodiment, processing chambers 120B and 120C may be loaded simultaneously, processing chambers 120E and 120F may be loaded simultaneously, and processing chambers 120A and 120D may be loaded sequentially. The order of loading and unloading the processing chambers should also not be construed as limiting.

[0054] In another example, in an electronic device processing system including six processing chambers 120 (three on a first side and three on a second side opposite the first side) and one operable load lock chamber (e.g., 122A), the robotic apparatus 102A can operate in the following sequences: 1) a single substrate operational mode in which it picks up one substrate from the load lock chamber 122A using the second end effector 230B; 2) a single substrate operational mode in which it picks up a second substrate from the load lock chamber 122A using the first end effector 230A; 3) a dual substrate operational mode in which it simultaneously loads two substrates into a pair of horizontally adjacent processing chambers, or a single substrate operational mode in which it sequentially loads one substrate into one processing chamber followed by a second substrate into the other processing chamber; and 4) by repeating 1)-3) until it is fully loaded into the electronic device processing system. Similar sequences can be used to unload into the same exemplary electronic device processing system. Similar sequences with more or fewer operation steps may be performed for other electronic device processing systems that include more or fewer processing chambers. Similar sequences may also be used when one operational load lock chamber is load lock chamber 122B.

[0055] Further, refer to FIG. 5A showing a perspective view of an embodiment of the robot device 102 according to the disclosed embodiment, and FIG. 5B showing a top view of the robot device 102 according to the disclosed embodiment. In the embodiment shown in FIGS. 5A - 5B, a robot device 102B is shown. The robot device 102B may include one lower arm 510 configured to rotate about a first rotation axis 515. For example, one or more motors (not shown) located within the base 514 can rotate one lower arm 510 about the first rotation axis 515. The robot device 102B may further include one upper arm 520 rotatably coupled to one lower arm 510 at a second rotation axis 525 spaced apart from the first rotation axis 515. The upper arm 520 may be configured to rotate about the second rotation axis 525. For example, one or more motors (not shown) located within the base 514 can rotate one upper arm 520 about the second rotation axis 525. In some embodiments, the portion of the lower arm 510 and the portion of the upper arm 520 can operate in planes that are vertically different from each other.

[0056] The robot device 102B may further include a first forearm 530A and a second forearm 530B each rotatably coupled to one upper arm 520 at a third rotation axis 535 spaced apart from the second rotation axis 525. The first forearm 530A and the second forearm 530B are configured to rotate separately about the third rotation axis 535 for both the dual - substrate handling mode and the single - substrate handling mode. For example, one or more motors (not shown) located within the base 514 can rotate the first forearm 530A and the second forearm 530B separately about the third rotation axis 535 for both the dual - substrate handling mode and the single - substrate handling mode.

[0057] The robotic device 102B may further include a first end effector 540A rotatably coupled to the first forearm 530A at a fourth axis of rotation 545 spaced from the third axis of rotation 535. The robotic device 102A may also include a second end effector 540B rotatably coupled to the second forearm 530B at a fifth axis of rotation 555 spaced from the third axis of rotation 535 and away from the fourth axis of rotation 545.

[0058] The first forearm 530A, the second forearm 530B, the first end effector 540A, and the second end effector 540B may be configured to rotate separately about a third axis of rotation 535, a fourth axis of rotation 545, and a fifth axis of rotation 555 for both the dual substrate handling mode and the single substrate handling mode. For example, one or more motors (not shown) located in the base 514 may separately rotate the first forearm 530A and the second forearm 530B about the third axis of rotation 535, rotate the first end effector 540A about the fourth axis of rotation 545, and rotate the second end effector 540B about the fifth axis of rotation 555 for both the dual substrate handling mode and the single substrate handling mode.

[0059] In an alternative embodiment, rather than motors controlling one or more components of the robotic device 102B, a cam pulley design, or a combination of a cam pulley design and one or more motors, may be used to control one or more components of the robotic device 102B. For example, one motor (not shown) located in the base 514 may be configured to independently rotate the lower arm 510 about the first axis of rotation 515, one motor (not shown) located in the base 514 may be configured to independently rotate the upper arm 520 about the second axis of rotation 525, and two motors (not shown) located in the base 514 may be configured to separately rotate the first forearm 530A and the second forearm 530B about the third axis of rotation 535, and a cam pulley design (not shown) may be configured to control the first forearm 530A, the second forearm 530B, the first end effector 540A, and the second end effector 540B to move the second end effector 540B away from the first end effector 540A by the first pitch D1 or the second pitch D2.

[0060] The operation of the robotic device 102B in the dual substrate handling mode is further described with reference to Figures 6A-6D.

[0061] In FIG. 6A, the robotic device 102B is shown in an extended configuration suitable for reaching (or accessing) into two horizontally adjacent load lock chambers (such as the load lock chamber 122 of FIG. 1) as described with respect to FIGS. 5A-5B. This configuration is referred to herein as a "dual load lock reach." The first and second forearms 530A and 530B can be rotated separately about a third axis of rotation 535, the first end effector 540A can be rotated independently about a fourth axis of rotation 545, and the second end effector 540B can be rotated independently about a fifth axis of rotation 555 to reach the dual load lock reach where the two end effectors are separated by a first pitch D1. As can be seen in FIG. 6A, in the dual load lock reach, the first end effector 540A is separated from the second end effector 540B by a first pitch D1. In some embodiments, the first pitch D1 is measured between the first end point 542A of the first end effector 540A and the second end point 542B of the second end effector 540B as shown in the configuration of FIG. 6A , and corresponds to the distance between the centers of two horizontally adjacent load lock chambers 122. In some embodiments, the first pitch D1 between the centers of two adjacent load lock chambers 122 can be in a range from about 20 inches to about 25 inches. In some embodiments, the first pitch D1 between the centers of two adjacent load lock chambers 122 can be in a range from about 21 inches to about 23 inches. In some embodiments, the first pitch D1 between the centers of two adjacent load lock chambers 122 can be about 22 inches. Other distances for the first pitch D1 may be possible.

[0062] With dual load lock reach, the robotic device 102B can access both load lock chambers 122 to transfer two substrates 118 to the two processing chambers 120, or to load a processed substrate thereon for transfer out of the main frame 104.

[0063] To further illustrate the dual substrate handling mode, assume that the robotic device 102B retrieves two substrates 118 from the load lock chamber 122 and transfers them to two horizontally adjacent processing chambers 120. Upon retrieving the two substrates, the robotic device 102B rotates (and / or retracts) the first forearm 530A, the second forearm 530B, the first end effector 540A, and the second end effector 540B to pivot within the transfer chamber 106 to reach a "chamber pre-position" alignment, which may also be referred to as a "W-shaped pre-position alignment" in this embodiment (FIG. 6B). In the "W"-shaped pre-position alignment, the first forearm 530A, the second forearm 530B, the first end effector 540A, and the second end effector 540B may be rotated about their corresponding rotational axes to be in suitable positions to access the two horizontally adjacent processing chambers 120. The pivoting may include one or more of rotating the lower arm 510 about a first rotational axis 515, rotating the upper arm 520 about a second rotational axis 525, separately rotating one or more of the first forearm 530A or the second forearm 530B about a third rotational axis 535, rotating the first end effector 540A about a fourth rotational axis 545, and / or rotating the second end effector about a fifth rotational axis 555.

[0064] After reaching the "chamber pre-position" alignment or "'W' shaped pre-position alignment" and pivoting to the appropriate orientation for the processing chamber reach, the first end effector 540A and the second end effector 540B can be further separated by a second pitch D2. The first forearm 530A and the second forearm 530B can be separately rotated about the third rotation axis 535, the first end effector 540A can be independently rotated about the fourth rotation axis 545, and the second end effector 540B can be independently rotated about the fifth rotation axis 555 to reach the dual processing chamber reach with the two end effectors separated by the second pitch. In some embodiments, the second pitch D2 is measured between the first end point 542A of the first end effector 540A and the second end point 542B of the second end effector 540B as shown in the configuration of FIG. 6C, and corresponds to the distance between the centers of two horizontally adjacent processing chambers 120. In some embodiments, the second pitch D2 between the centers of two adjacent processing chambers 120 can be in a range from about 32 inches to about 40 inches. In some embodiments, the second pitch D2 between the centers of two adjacent processing chambers 120 can be in a range from about 34 inches to about 38 inches. In some embodiments, the second pitch D2 between the centers of two adjacent processing chambers 120 can be about 36 inches. Other distances for the second pitch D2 may be possible.

[0065] In FIG. 6C, the robotic device 102B is shown in an extended configuration suitable for reaching into (or accessing) two horizontally adjacent process chambers (such as the process chamber 120 in FIG. 1). This configuration is referred to herein as a "dual process chamber reach." As can be seen in FIG. 6C, in the dual process chamber reach, the first end effector 540A is separated from the second end effector 540B by a second pitch D2. In the dual process chamber reach, the robotic device 102B can simultaneously access two adjacent process chambers 120 to position two substrates 118 for processing (or retrieve a processed substrate for further processing or transfer to a load lock chamber 122).

[0066] After processing, the robot 102B can simultaneously retrieve processed substrates from a pair of horizontally adjacent processing chambers 120 in a “dual processing chamber reach” configuration and pivot within the transfer chamber 106 to reach a “load lock pre-position” alignment, which may be referred to as a “V-shaped pre-position” alignment, as shown in FIG. 6D. The pivoting can include one or more of rotating the lower arm 510 about a first rotation axis 515, rotating the upper arm 520 about a second rotation axis 525, separately rotating one or more of the first forearm 530A or the second forearm 530B about a third rotation axis 535, rotating the first end effector 540A about a fourth rotation axis 545, and / or rotating the second end effector about a fifth rotation axis 555. Once the "load lock pre-position" alignment shown in FIG. 6D is reached, the robotic apparatus 102B can cyclically repeat operations 6A-6D to sequentially load and / or unload the processing chambers 120 and load lock chambers 122 within the electronic device processing system 100.

[0067] The operation of the robotic device 102B in the single-substrate handling mode will now be further described with reference to Figures 7A-7D.

[0068] In Figure 7A, the robotic device 102B is shown in a "dual load lock reach" as described with respect to Figure 6A. In the dual load lock reach, the robotic device 102B can access both load lock chambers 122 to retrieve two substrates 118 which can then be placed simultaneously into two horizontally adjacent processing chambers 120, as shown in Figures 6B-6C. Alternatively, the two substrates 118 can be unloaded sequentially into two processing chambers (which may or may not be horizontally adjacent), as shown with respect to Figures 7B-7C.

[0069] Although not shown, the robotic device 102B can also access one load lock chamber 122 to remove a single substrate 118 at a time. This can be useful, for example, to allow the electronic device processing system to continue operation when one load lock chamber becomes unrepairable. For example, end effector 540A could access either one of the load lock chambers 122 without accessing the other. Similarly, end effector 540B could access either one of the load lock chambers 122 without accessing the other. Doing so would include separately rotating the first forearm 530A and the second forearm 530B about a third axis of rotation 535, independently rotating the first end effector 230A about a fourth axis of rotation 545, and independently rotating the second end effector 540B about a fifth axis of rotation 555 to align the first end effector 540A and the second end effector 540B in a configuration suitable for one of the first end effector 540A or the second end effector 540B to access one load lock chamber 122. In certain embodiments, the slit valve 134 of the load lock chamber 122 can have a width suitable to accommodate access by the first end effector 540A and / or the second end effector 540B, whether accessing two load lock chambers simultaneously or sequentially.

[0070] In Figures 7B and 7C, the first forearm 530A and the second forearm 530B rotate separately about the third rotation axis 535, the first end effector 540A rotates independently about the fourth rotation axis 545, and the second end effector 540B rotates independently about the fifth rotation axis 555 to align the first end effector 540A and the second end effector 540B in a configuration suitable for either the first end effector 540A or the second end effector 540B to access one processing chamber 120. For example, in FIG. 7B, a first end effector 540A unloads a substrate into one processing chamber, and then, as shown in FIG. 7C, a second end effector 540B unloads the substrate into another processing chamber (located on the opposite side of the processing chamber that received the substrate from the first end effector 540A).

[0071] After processing, the robot 102B can sequentially retrieve the processed substrates via the "single process chamber reach" configuration shown in Figures 7B-7C and pivot within the transfer chamber 106 to reach a "load lock pre-position" alignment, which may also be referred to as a "V-shaped pre-position" alignment, shown in Figure 7D. The pivoting can include one or more of rotating the lower arm 510 about a first axis of rotation 515, rotating the upper arm 520 about a second axis of rotation 525, separately rotating one or more of the first forearm 530A or the second forearm 530B about a third axis of rotation 535, rotating the first end effector 540A about a fourth axis of rotation 545, and / or rotating the second end effector about a fifth axis of rotation 555. Upon reaching the "load lock pre-position" alignment or "V" shaped pre-position alignment shown in FIG. 7D, the robotic apparatus 102B can cyclically repeat operations 7A-7D to sequentially load and / or unload the processing chambers 120 and load lock chambers 122 within the electronic device processing system 100.

[0072] The robotic apparatus 102B can load and / or unload processing chambers 120 and load lock chambers 122 in the electronic device processing system 100 using a combination of the dual substrate operating mode of Figures 6A-6D and the single substrate operating mode of Figures 7A-7D.

[0073] For example, in an electronic device processing system with six processing chambers 120 (three on a first side and three on a second side opposite the first side), the robotic apparatus 102B can load substrates into the six processing chambers in three operational steps: 1) a dual substrate operational mode in which two substrates are simultaneously loaded into a pair of horizontally adjacent processing chambers on the first side (e.g., processing chambers 120A and 120B), 2) a dual substrate operational mode in which two substrates are simultaneously loaded into a pair of horizontally adjacent processing chambers on the second side (e.g., processing chambers 120E and 120F), and 3) a single substrate operational mode in which one substrate is sequentially loaded into the remaining empty processing chamber on the first side (e.g., processing chamber 120C) followed by one substrate being loaded into the remaining empty processing chamber on the second side (e.g., processing chamber 120D). Similar sequences can be used to unload into the same exemplary electronic device processing system. Similar sequences with more or fewer operational steps may be performed for other electronic device processing systems that include more or fewer processing chambers.

[0074] The sequence shown herein should not be construed as limiting. For example, processing chambers 120B and 120C may be loaded simultaneously, processing chambers 120D and 120E may be loaded simultaneously, and processing chambers 120A and 120F may be loaded sequentially. In other embodiments, processing chambers 120A and 120B may be loaded simultaneously, processing chambers 120D and 120E may be loaded simultaneously, and processing chambers 120C and 120F may be loaded sequentially. In yet another embodiment, processing chambers 120B and 120C may be loaded simultaneously, processing chambers 120E and 120F may be loaded simultaneously, and processing chambers 120A and 120D may be loaded sequentially. The order of loading and unloading the processing chambers should also not be construed as limiting.

[0075] In another example, in an electronic device processing system including six processing chambers 120 (three on a first side and three on a second side opposite the first side) and one operable load lock chamber (e.g., 122A), the robotic device 102B can operate in the following sequences: 1) a single substrate operational mode to pick up one substrate from the load lock chamber 122A using the second end effector 540B, 2) a single substrate operational mode to pick up a second substrate from the load lock chamber 122A using the first end effector 540A, 3) a dual substrate operational mode to simultaneously load two substrates into a pair of horizontally adjacent processing chambers or a single substrate operational mode to sequentially load one substrate into one processing chamber followed by a second substrate into the other processing chamber, and 4) by repeating 1)-3) until fully loaded into the electronic device processing system. Similar sequences can be used to unload into the same exemplary electronic device processing system. Similar sequences with more or fewer operation steps may be performed for other electronic device processing systems that include more or fewer processing chambers. Similar sequences may also be used when one operational load lock chamber is load lock chamber 122B.

[0076] Further reference is made to FIG. 8A, which illustrates a perspective view of one embodiment of a robotic device 102 according to a disclosed embodiment, FIG. 8B, which illustrates a top view of the robotic device 102 in a contracted (or folded) configuration according to a disclosed embodiment, and FIG. 8C, which illustrates a top view of the robotic device 102 in an extended configuration according to a disclosed embodiment. In the embodiment illustrated in FIGs. 8A-8C, a robotic device 102C is shown. The robotic device 102C can include a body 814 mounted on a linear track 816. The body 814 can be configured to move along the linear track 816.

[0077] The robotic device 102C may further include a first lower arm 810A configured to rotate about a first axis of rotation 815 and a second lower arm 810B configured to rotate about the first axis of rotation 815. For example, one or more motors (not shown) located in the base 814 can separately rotate the first lower arm 810A and / or the second lower arm 810B about the first axis of rotation 815.

[0078] The robotic device 102C may further include a first upper arm 820A rotatably coupled to the first lower arm 810A at a second axis of rotation 825 spaced from the first axis of rotation 815. The first upper arm 820A may be configured to rotate about the second axis of rotation 825. For example, one or more motors (not shown) located in the base 814 may rotate the first upper arm 820A about the second axis of rotation 825.

[0079] The robotic device 102C may further include a second upper arm 820B rotatably coupled to the second lower arm 810B at a sixth axis of rotation 835 spaced from the first axis of rotation 815. The second upper arm 820B may be configured to rotate about the sixth axis of rotation 835. For example, one or more motors (not shown) located in the base 814 may rotate the second upper arm 820B about the sixth axis of rotation 835.

[0080] The robotic device 102C may further include a first forearm 830A rotatably coupled to the first upper arm 820A at a seventh axis of rotation 845 spaced from the second axis of rotation 825. The first forearm 830A may include a first curvature in a first direction in a horizontal plane. The first forearm may be configured to independently rotate about the seventh axis of rotation 845. For example, one or more motors (not shown) located in the base 814 may independently rotate the first forearm 830A about the seventh axis of rotation 545 for both the dual substrate handling mode and the single substrate handling mode.

[0081] The robotic device 102C may further include a second forearm 830B rotatably coupled to the second upper arm 820B at an eighth axis of rotation 855 spaced from the sixth axis of rotation 835. The second forearm 830B may include a second curved portion in a horizontal plane in a second direction opposite the first direction. The second forearm may be configured to independently rotate about the eighth axis of rotation 855. For example, one or more motors (not shown) located in the base 814 may independently rotate the second forearm 830B about the eighth axis of rotation 855 for both the dual substrate handling mode and the single substrate handling mode.

[0082] Robotic device 102C may further include a first end effector 840A coupled (optionally rotatably) to a first forearm 830A, optionally via a first wrist 850A. Robotic device 102C may also include a second end effector 840B coupled (optionally rotatably) to a second forearm 830B, optionally via a second wrist 850B.

[0083] In the robotic device 102C, when the robotic device 102C is in a contracted (or folded) configuration as shown in FIG. 8B, first lower arm 810A, second lower arm 810B, first upper arm 820A, second upper arm 820B, first forearm 830A, second forearm 830B, optionally first wrist 850A, optionally second wrist 850B, first end effector 840A, and second end effector 840B together form a "W" shape.

[0084] In the robotic device 102C, when the robotic device 102C is in an extended configuration suitable for reaching into a load lock chamber (e.g., load lock chamber 122) or into a processing chamber (e.g., processing chamber 120) in a dual substrate operating mode, as shown in FIG. 8C, the first lower arm 810A, the second lower arm 810B, the first upper arm 820A, the second upper arm 820B, the first forearm 830A, the second forearm 830B, optionally a first wrist 850A, optionally a second wrist 850B, the first end effector 840A, and the second end effector 840B together form a "V" shape.

[0085] In the robotic device 102C, for both the dual substrate handling mode and the single substrate handling mode, the first lower arm 810A, the second lower arm 810B, the first upper arm 820A, the second upper arm 820B, the first forearm 830A, the second forearm 830B, optionally the first wrist 850A, optionally the second wrist 850B, the first end effector 840A, and the second end effector 840B are configured to rotate separately about their corresponding axes of rotation (e.g., the first axis of rotation 815, the second axis of rotation 825, the sixth axis of rotation 835, the seventh axis of rotation 845, and the eighth axis of rotation 855).

[0086] For example, one or more motors (not shown) located in the base 814 rotate the first lower arm 810A and the second lower arm 810B separately about a first rotational axis 815, rotate the first upper arm 820A about a second rotational axis 825, rotate the second upper arm 820B about a sixth rotational axis 835, rotate the first forearm 830A about a seventh rotational axis 845, and rotate the second forearm 830B about an eighth rotational axis 855 for both the dual substrate handling mode and the single substrate handling mode.

[0087] In operation, the robotic device 102C can move along the linear track 816 to access various processing chambers 920 or load lock chambers 922. Similarly, the robotic device 102C can operate in a single substrate handling mode, a dual substrate handling mode, or a combination thereof to load and / or unload processing chambers 920 and load lock chambers 922 within the electronic device processing system 900 shown in FIG.

[0088] For the robotic device 102C, operating in a dual substrate handling mode includes separately rotating the first lower arm 810A, the second lower arm 810B, the first upper arm 820A, the second upper arm 820B, the first forearm 830A, the second forearm 830B, optionally the first wrist 850A, optionally the second wrist 850B, the first end effector 840A, and the second end effector 840B about the first rotational axis 815, the second rotational axis 825, the sixth rotational axis 835, the seventh rotational axis 845, and the eighth rotational axis 855 to move the first end effector 850A away from the second end effector 850B by either the first pitch D91 or the second pitch D92.

[0089] As seen in FIG. 9, in some embodiments, the first pitch D91 is measured between a first end point 942A of the first end effector 940A and a second end point 942B of the second end effector 940B as shown in the configuration of FIG. 9, and corresponds to the distance between the centers of two horizontally adjacent load lock chambers 922. In some embodiments, the first pitch D91 between the centers of two adjacent load lock chambers 922 can be in a range from about 20 inches to about 25 inches. In some embodiments, the first pitch D91 between the centers of two adjacent load lock chambers 922 can be in a range from about 21 inches to about 23 inches. In some embodiments, the first pitch D91 between the centers of two adjacent load lock chambers 922 can be about 22 inches. Other distances for the first pitch D91 may be possible.

[0090] As seen in FIG. 9, in some embodiments, the second pitch D92 is measured between a first end point 942A of the first end effector 940A and a second end point 942B of the second end effector 940B as shown in the configuration of FIG. 9, and corresponds to the distance between the centers of two horizontally adjacent load lock chambers 922. In some embodiments, the second pitch D92 between the centers of two adjacent load lock chambers 922 can be in a range from about 20 inches to about 25 inches. In some embodiments, the second pitch D92 between the centers of two adjacent load lock chambers 922 can be in a range from about 21 inches to about 23 inches. In some embodiments, the second pitch D92 between the centers of two adjacent load lock chambers 922 can be about 22 inches. Other distances for the second pitch D91 may be possible.

[0091] For the robotic device 102C, operating in the single-substrate handling mode includes rotating the first lower arm 810A, the second lower arm 810B, the first upper arm 820A, the second upper arm 820B, the first forearm 830A, the second forearm 830B, optionally a first wrist 850A, optionally a second wrist 850B, the first end effector 840A, and the second end effector 840B in a first rotation. The method includes rotating the first end effector 840A and the second end effector 840B separately about axis 815, the second rotation axis 825, the sixth rotation axis 835, the seventh rotation axis 845, and the eighth rotation axis 855 to align the first end effector 840A and the second end effector 840B in a configuration suitable for either the first end effector 840A or the second end effector 840B to access one load lock chamber 922 or one processing chamber 920.

[0092] The foregoing description provides exemplary embodiments of the present disclosure. Modifications of the above-disclosed devices, systems, and methods that fall within the scope of the present disclosure will be readily apparent to those skilled in the art. Thus, although the present disclosure has been disclosed in connection with exemplary embodiments, it will be understood that other embodiments may fall within the scope of the present disclosure as defined by the following claims.

Claims

1. 1. A robotic device, comprising: at least one lower arm configured to rotate about a first axis of rotation; at least one upper arm rotatably coupled to the at least one lower arm at a second axis of rotation spaced from the first axis of rotation; a first end effector rotatably coupled to the at least one upper arm, optionally via a first forearm; a second end effector rotatably coupled to the at least one upper arm, optionally via a second forearm; and Equipped with the first end effector and the second end effector are coplanar; the robotic device is configured to operate in both a dual substrate handling mode and a single substrate handling mode; in the dual substrate handling mode, the first end effector and the second end effector are separately rotated about one or more additional rotational axes different from the first rotational axis and the second rotational axis to separate the first end effector from the second end effector by a first pitch or a second pitch different from the first pitch, at least one of the first pitch or the second pitch being suitable for the first end effector and the second end effector to simultaneously access separate load lock chambers or separate processing chambers; in the single substrate handling mode, the first end effector and the second end effector are separately rotated about the one or more additional rotational axes to align the first end effector and the second end effector in a configuration suitable for either the first end effector or the second end effector to access a load lock chamber or a processing chamber; the at least one lower arm includes a lower arm configured to rotate about the first axis of rotation; the at least one upper arm includes an upper arm rotatably coupled to the one lower arm at the second axis of rotation spaced from the first axis of rotation; The robotic device further comprises: a first forearm and a second forearm each rotatably coupled to the one upper arm at a third axis of rotation; the first end effector is rotatably coupled to the first forearm at a fourth axis of rotation; the second end effector is rotatably coupled to the second forearm at a fifth axis of rotation; the first forearm, the second forearm, the first end effector, and the second end effector are configured to rotate separately about the third rotational axis, the fourth rotational axis, and the fifth rotational axis for both the dual substrate handling mode and the single substrate handling mode.

2. 1. A robotic device, comprising: at least one lower arm configured to rotate about a first axis of rotation; at least one upper arm rotatably coupled to the at least one lower arm at a second axis of rotation spaced from the first axis of rotation; a first end effector rotatably coupled to the at least one upper arm, optionally via a first forearm; a second end effector rotatably coupled to the at least one upper arm, optionally via a second forearm; and Equipped with the first end effector and the second end effector are coplanar; the robotic device is configured to operate in both a dual substrate handling mode and a single substrate handling mode; in the dual substrate handling mode, the first end effector and the second end effector are separately rotated about one or more additional rotational axes different from the first rotational axis and the second rotational axis to separate the first end effector from the second end effector by a first pitch or a second pitch different from the first pitch, at least one of the first pitch or the second pitch being suitable for the first end effector and the second end effector to simultaneously access separate load lock chambers or separate processing chambers; in the single substrate handling mode, the first end effector and the second end effector are separately rotated about the one or more additional rotational axes to align the first end effector and the second end effector in a configuration suitable for either the first end effector or the second end effector to access a load lock chamber or a processing chamber; The robotic device further comprises: a body mounted on a linear track, the body configured to move along the linear track, the at least one lower arm and the at least one upper arm coupled to the body; The at least one lower arm is a first lower arm configured to rotate about a first axis of rotation; a second lower arm configured to rotate about the first axis of rotation; Including, The at least one upper arm is a first upper arm rotatably coupled to the first lower arm at the second axis of rotation spaced from the first axis of rotation; a second upper arm rotatably coupled to the second lower arm at a sixth axis of rotation spaced from the first axis of rotation; Including, The robotic device further comprises: a first forearm rotatably coupled to the first upper arm at a seventh axis of rotation, the first forearm including a first bend in a first direction in a horizontal plane; a second forearm rotatably coupled to the second upper arm at an eighth axis of rotation, the second forearm including a second bend in the horizontal plane in a second direction opposite the first direction; Including, the first end effector is coupled to the first forearm, optionally via a first wrist; the second end effector is coupled to the second forearm, optionally via a second wrist; wherein the first lower arm, the second lower arm, the first upper arm, the second upper arm, the first forearm, the second forearm, optionally the first wrist, optionally the second wrist, the first end effector, and the second end effector form a "W" shape together and are configured to rotate separately about the first rotational axis, the second rotational axis, the sixth rotational axis, the seventh rotational axis, and the eighth rotational axis for both the dual substrate handling mode and the single substrate handling mode.

3. 1. An electronic device processing system, comprising: A transfer chamber; two adjacent load lock chambers coupled to the transfer chamber and spaced apart horizontally by a first pitch; four or more processing chambers coupled to the transfer chamber, at least one pair of adjacent processing chambers of the four or more processing chambers being spaced apart by a second pitch different from the first pitch; a robotic device located at least partially within the transfer chamber; The robot device comprises: at least one lower arm configured to rotate about a first axis of rotation; at least one upper arm rotatably coupled to the at least one lower arm at a second axis of rotation spaced from the first axis of rotation; a first end effector rotatably coupled to the at least one upper arm, optionally via a first forearm; a second end effector rotatably coupled to the at least one upper arm, optionally via a second forearm; and Equipped with the first end effector and the second end effector are coplanar; the robotic device is configured to operate in both a dual substrate handling mode and a single substrate handling mode; in the dual substrate handling mode, the first end effector and the second end effector are separately rotated about one or more additional rotational axes different from the first rotational axis and the second rotational axis to separate the first end effector from the second end effector by a first pitch or by a second pitch different from the first pitch, allowing the first end effector and the second end effector to simultaneously access the two adjacent load lock chambers or the at least one pair of adjacent processing chambers; in the single substrate handling mode, the first end effector and the second end effector are separately rotated about the one or more additional rotational axes to align the first end effector and the second end effector in a configuration suitable for either the first end effector or the second end effector to access a load lock chamber or a processing chamber; In the robot device, the at least one lower arm includes a lower arm configured to rotate about the first axis of rotation; the at least one upper arm includes an upper arm rotatably coupled to the one lower arm at the second axis of rotation spaced from the first axis of rotation; The robotic device further comprises: a first forearm and a second forearm each rotatably coupled to the one upper arm at a third axis of rotation; the first end effector is rotatably coupled to the first forearm at a fourth axis of rotation; the second end effector is rotatably coupled to the second forearm at a fifth axis of rotation; the first forearm, the second forearm, the first end effector, and the second end effector are configured to rotate separately about the third axis of rotation, the fourth axis of rotation, and the fifth axis of rotation for both the dual substrate handling mode and the single substrate handling mode.

4. 1. An electronic device processing system, comprising: A transfer chamber; two adjacent load lock chambers coupled to the transfer chamber and spaced apart horizontally by a first pitch; four or more processing chambers coupled to the transfer chamber, at least one pair of adjacent processing chambers of the four or more processing chambers being spaced apart by a second pitch different from the first pitch; a robotic device located at least partially within the transfer chamber; The robot device comprises: at least one lower arm configured to rotate about a first axis of rotation; at least one upper arm rotatably coupled to the at least one lower arm at a second axis of rotation spaced from the first axis of rotation; a first end effector rotatably coupled to the at least one upper arm, optionally via a first forearm; a second end effector rotatably coupled to the at least one upper arm, optionally via a second forearm; and Equipped with the first end effector and the second end effector are coplanar; the robotic device is configured to operate in both a dual substrate handling mode and a single substrate handling mode; in the dual substrate handling mode, the first end effector and the second end effector are separately rotated about one or more additional rotational axes different from the first rotational axis and the second rotational axis to separate the first end effector from the second end effector by a first pitch or by a second pitch different from the first pitch, allowing the first end effector and the second end effector to simultaneously access the two adjacent load lock chambers or the at least one pair of adjacent processing chambers; in the single substrate handling mode, the first end effector and the second end effector are separately rotated about the one or more additional rotational axes to align the first end effector and the second end effector in a configuration suitable for either the first end effector or the second end effector to access a load lock chamber or a processing chamber; the robotic device further comprising a body mounted on a linear track, the body configured to move along the linear track, the at least one lower arm and the at least one upper arm coupled to the body; In the robot device, The at least one lower arm is a first lower arm configured to rotate about a first axis of rotation; a second lower arm configured to rotate about the first axis of rotation; Including, The at least one upper arm is a first upper arm rotatably coupled to the first lower arm at the second axis of rotation spaced from the first axis of rotation; a second upper arm rotatably coupled to the second lower arm at a sixth axis of rotation spaced from the first axis of rotation; The robotic device further comprises: a first forearm rotatably coupled to the first upper arm at a seventh axis of rotation, the first forearm including a first bend in a first direction in a horizontal plane; a second forearm rotatably coupled to the second upper arm at an eighth axis of rotation and including a second bend in the horizontal plane in a second direction opposite to the first direction; Including, the first end effector is coupled to the first forearm, optionally via a first wrist; the second end effector is coupled to the second forearm, optionally via a second wrist; wherein the first lower arm, the second lower arm, the first upper arm, the second upper arm, the first forearm, the second forearm, optionally the first wrist, optionally the second wrist, the first end effector, and the second end effector form a "W" shape together and are configured to rotate separately about the first rotational axis, the second rotational axis, the sixth rotational axis, the seventh rotational axis, and the eighth rotational axis for both the dual substrate handling mode and the single substrate handling mode.

5. 1. A method of transferring a substrate, comprising: operating the robotic device in a dual substrate handling mode and a single substrate handling mode; The robot device, at least one lower arm configured to rotate about a first axis of rotation; at least one upper arm rotatably coupled to the at least one lower arm at a second axis of rotation spaced from the first axis of rotation; a first end effector rotatably coupled to the at least one upper arm, optionally via a first forearm; a second end effector rotatably coupled to the at least one upper arm, optionally via a second forearm; and Equipped with the first end effector and the second end effector are coplanar; Operating in the dual substrate handling mode comprises: rotating the first end effector and the second end effector separately about one or more additional rotational axes different from the first rotational axis and the second rotational axis to move the first end effector away from the second end effector by a first pitch or by a second pitch different from the first pitch, at least one of the first pitch or the second pitch being suitable for the first end effector and the second end effector to simultaneously access separate load lock chambers or separate processing chambers; Operating in the single substrate handling mode comprises: separately rotating the first end effector and the second end effector about the one or more additional axes of rotation to align the first end effector and the second end effector in a configuration suitable for either the first end effector or the second end effector to access a load lock chamber or a processing chamber; In the robot device, the at least one lower arm includes a lower arm configured to rotate about the first axis of rotation; the at least one upper arm includes an upper arm rotatably coupled to the one lower arm at the second axis of rotation spaced from the first axis of rotation; The robotic device further comprises: a first forearm and a second forearm each rotatably coupled to the one upper arm at a third axis of rotation; the first end effector is rotatably coupled to the first forearm at a fourth axis of rotation; the second end effector is rotatably coupled to the second forearm at a fifth axis of rotation; operating in the dual substrate handling mode includes separately rotating the first forearm, the second forearm, the first end effector, and the second end effector about the third rotation axis, the fourth rotation axis, and the fifth rotation axis to move the first end effector away from the second end effector by the first pitch or the second pitch; The method, wherein operating in the single substrate handling mode includes rotating the first forearm, the second forearm, the first end effector, and the second end effector separately about the third rotation axis, the fourth rotation axis, and the fifth rotation axis to align the first end effector and the second end effector in a configuration suitable for either the first end effector or the second end effector to access a load lock chamber or a processing chamber.

6. 1. A method of transferring a substrate, comprising: operating the robotic device in a dual substrate handling mode and a single substrate handling mode; The robot device, at least one lower arm configured to rotate about a first axis of rotation; at least one upper arm rotatably coupled to the at least one lower arm at a second axis of rotation spaced from the first axis of rotation; a first end effector rotatably coupled to the at least one upper arm, optionally via a first forearm; a second end effector rotatably coupled to the at least one upper arm, optionally via a second forearm; and Equipped with the first end effector and the second end effector are coplanar; Operating in the dual substrate handling mode comprises: rotating the first end effector and the second end effector separately about one or more additional rotational axes different from the first rotational axis and the second rotational axis to move the first end effector away from the second end effector by a first pitch or by a second pitch different from the first pitch, at least one of the first pitch or the second pitch being suitable for the first end effector and the second end effector to simultaneously access separate load lock chambers or separate processing chambers; Operating in the single substrate handling mode separately rotating the first end effector and the second end effector about the one or more additional axes of rotation to align the first end effector and the second end effector in a configuration suitable for either the first end effector or the second end effector to access a load lock chamber or a processing chamber; the robotic device further comprising a body mounted on a linear track, the body configured to move along the linear track, the at least one lower arm and the at least one upper arm coupled to the body, and in the robotic device: The at least one lower arm is a first lower arm configured to rotate about a first axis of rotation; a second lower arm configured to rotate about the first axis of rotation; Including, The at least one upper arm is a first upper arm rotatably coupled to the first lower arm at the second axis of rotation spaced from the first axis of rotation; a second upper arm rotatably coupled to the second lower arm at a sixth axis of rotation spaced from the first axis of rotation; Including, The robotic device further comprises: a first forearm rotatably coupled to the first upper arm at a seventh axis of rotation, the first forearm including a first bend in a first direction in a horizontal plane; a second forearm rotatably coupled to the second upper arm at an eighth axis of rotation and including a second bend in the horizontal plane in a second direction opposite to the first direction; Including, the first end effector is coupled to the first forearm, optionally via a first wrist; the second end effector is coupled to the second forearm, optionally via a second wrist; operating in the dual substrate handling mode comprises rotating the first lower arm, the second lower arm, the first upper arm, the second upper arm, the first forearm, the second forearm, optionally the first wrist, optionally the second wrist, the first end effector, and the second end effector separately about the first rotation axis, the second rotation axis, the sixth rotation axis, the seventh rotation axis, and the eighth rotation axis to move the first end effector away from the second end effector by the first pitch or by the second pitch; the operating in the single substrate handling mode comprises rotating the first lower arm, the second lower arm, the first upper arm, the second upper arm, the first forearm, the second forearm, optionally the first wrist, optionally the second wrist, the first end effector, and the second end effector separately about the first rotation axis, the second rotation axis, the sixth rotation axis, the seventh rotation axis, and the eighth rotation axis to align the first end effector and the second end effector in a configuration suitable for either the first end effector or the second end effector to access a load lock chamber or a processing chamber.

7. A robotic device as described in claim 1 or 2, wherein the first pitch is within a range of about 20 to about 25 inches, and the second pitch is within a range of about 32 to about 40 inches.

8. The robotic device of claim 1 or 2, wherein the first pitch is approximately 22 inches and the second pitch is approximately 36 inches.

9. An electronic device processing system as described in claim 3 or 4, wherein the first pitch is within the range of about 20 to about 25 inches and the second pitch is within the range of about 32 to about 40 inches.

10. An electronic device processing system as described in claim 3 or 4, comprising 4 to 24 processing chambers.

11. The method described in claim 5 or 6, wherein the first pitch is within the range of about 20 to about 25 inches and the second pitch is within the range of about 32 to about 40 inches.

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