Rail - type backplane assembly kit and related rail - type electronic devices

Abstract

To provide a rail mounting backplane assembly kit.SOLUTION: A rail mounting backplane assembly kit includes: a backplane assembly; a first mating structure; and a second mated structure. The first mating structure can permit or limit assembly of a backplane assembly and a first mated backplane assembly of a first mated backplane assembly kit by being cooperated with a first mated structure of the first mated backplane assembly kit. A second mated structure can permit or limit assembly of the backplane assembly and a second mated backplane assembly of a second mated backplane assembly kit by being cooperated with a second mated structure of a second mated backplane assembly kit.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a rail mounting backplane assembly kit and related rail-mounted electronic devices, and more particularly to a rail mounting backplane assembly kit having a fool-proof assembly mechanism and related rail-mounted electronic devices.

Background Art

[0002] The modular design has gradually become the mainstream trend of rail-mounted electronic devices. For example, a remote terminal unit (RTU) is a type of rail-mounted electronic device, which is installed on-site and used as part of a monitoring / control system for monitoring / controlling field devices. The remote terminal unit usually includes a plurality of modules and a common backplane for mounting the plurality of modules, among which these modules may be a power supply module, a signal switching module, an arithmetic module, a signal input / output module, etc. respectively. However, at present, the modular design of rail-mounted electronic devices still needs improvement.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Patent Document 5

Patent Document 6

[0004] One object of the present invention is to provide an orbital backplane assembly kit having a fool - proof assembly mechanism and a related orbital electronic device for solving the above - mentioned problems. [Means for Solving the Problems]

[0005] To achieve the above object, the present invention discloses an orbital backplane assembly kit, which includes a backplane assembly, a first mating structure and a second mated structure. The first mating structure is formed on the backplane assembly. The first mating structure includes a plurality of first mating features, and each first mating feature is a first protrusion mating feature, a first planar mating feature or a first recess mating feature. The first mating structure is used in cooperation with the first mated structure of the first mated backplane assembly kit to allow or restrict the assembly of the backplane assembly and the first mated backplane assembly of the first mated backplane assembly kit. The second mated structure is formed on the backplane assembly. The second mated structure includes a plurality of second mated features, and each second mated feature is a second protrusion mated feature, a second planar mated feature or a second recess mated feature. The second mated structure is used in cooperation with the second mating structure of the second mated backplane assembly kit to allow or restrict the assembly of the backplane assembly and the second mated backplane assembly of the second mated backplane assembly kit.

[0006] According to an embodiment of the present invention, the plurality of first mating features and the plurality of second mated features are respectively arranged in a matrix.

[0007] According to one embodiment of the present invention, when one of the plurality of first mating features of the track-type backplane assembly kit is the first protruding mating feature, and the first mated feature corresponding to the first mated structure of the first mated backplane assembly kit is the first recessed mated feature, the first protruding mating feature can enter the first recessed mated feature, whereby the backplane assembly of the track-type backplane assembly kit is allowed to be assembled to the first mated backplane assembly of the first mated backplane assembly kit.

[0008] According to one embodiment of the present invention, when one of the plurality of first mating features of the track-type backplane assembly kit is the first protruding mating feature, and the first mated feature corresponding to the first mated structure of the first mated backplane assembly kit is the first protruding mated feature or the first planar mated feature, the first protruding mating feature abuts against the first protruding mated feature or the first planar mated feature, whereby the backplane assembly of the track-type backplane assembly kit is prevented from being assembled to the first mated backplane assembly of the first mated backplane assembly kit.

[0009] According to one embodiment of the present invention, when one of the plurality of second mated features of the track-type backplane assembly kit is the second protruding mated feature, and the second mating feature corresponding to the second mating structure of the second mated backplane assembly kit is the second recessed mating feature, the second protruding mated feature can enter the second recessed mating feature, thereby allowing the backplane assembly of the track-type backplane assembly kit to be assembled to the second mated backplane assembly of the second mated backplane assembly kit.

[0010] According to one embodiment of the present invention, when one of the plurality of second mated features of the track-type backplane assembly kit is the second protruding mated feature, and the second mating feature corresponding to the second mating structure of the second mated backplane assembly kit is the second protruding mating feature or the second planar mating feature, the second protruding mated feature abuts against the second recessed mating feature or the second planar mating feature, thereby preventing the backplane assembly of the track-type backplane assembly kit from being assembled to the second mated backplane assembly of the second mated backplane assembly kit.

[0011] In addition, in order to achieve the above object, the present invention further discloses an orbital electronic device, which includes a first module, a second module and a first mating module. The second module is detachably assembled to the first module. The first mating module is installed between the first module and the second module. The first mating module includes a first mating structure and a first mated structure. The first mating structure is formed on the second module. The first mating structure includes a plurality of first mating features. Each first mating feature is a first protruding mating feature, a first planar mating feature or a first recessed mating feature. The first mated structure is formed on the first module. The first mated structure includes a plurality of first mated features. Each first mated feature is a first protruding mated feature, a first planar mated feature or a first recessed mated feature. When one of the plurality of first mating features is the first protruding mating feature, the corresponding first mated feature is the first recessed mated feature. When one of the plurality of first mating features is the first planar mating feature, the corresponding first mated feature is the first planar mated feature or the first recessed mated feature. When one of the plurality of first mating features is the first recessed mating feature, the corresponding first mated feature is the first protruding mated feature, the first planar mated feature or the first recessed mated feature.

[0012] According to an embodiment of the present invention, the plurality of first mating features and the plurality of first mated features are respectively arranged in a matrix.

[0013] According to an embodiment of the present invention, the orbital electronic device further includes a third module and a second mating module, the third module is detachably assembled to the second module, the second mating module is installed between the second module and the third module, the second mating module includes a second mating structure and a second mated structure, the second mating structure is formed on the third module, the second mating structure includes a plurality of second mating features, each second mating feature is a second protrusion mating feature, a second planar mating feature or a second recess mating feature, the second mated structure is formed on the second module, the second mated structure includes a plurality of second mated features, each second mated feature is a second protrusion mated feature, a second planar mated feature or a second recess mated feature, when one of the plurality of second mating features is the second protrusion mating feature, the corresponding second mated feature is the second recess mated feature, when one of the plurality of second mating features is the second planar mating feature, the corresponding second mated feature is the second planar mated feature or the second recess mated feature, when one of the plurality of second mating features is the second recess mating feature, the corresponding second mated feature is the second protrusion mated feature, the second planar mated feature or the second recess mated feature.

[0014] According to an embodiment of the present invention, when one of the plurality of second mating features is the second protrusion mating feature, the corresponding first mated feature is the first planar mated feature or the first protrusion mated feature.

[0015] According to an embodiment of the present invention, the first module, the second module, and the third module are a power supply module, an arithmetic module, and a signal input / output module, respectively.

[0016] According to an embodiment of the present invention, the plurality of first mating features, the plurality of second mating features, the plurality of first mated features, and the plurality of second mated features are each arranged in a matrix.

[0017] According to an embodiment of the present invention, the orbital electronic device further includes a fourth module and a third mating module. The fourth module is detachably assembled to the third module. The third mating module is installed between the third module and the fourth module. The third mating module includes a third mating structure and a third mated structure. The third mating structure is formed on the fourth module. The third mating structure includes a plurality of third mating features. Each third mating feature is a third protrusion mating feature, a third planar mating feature, or a third recess mating feature. The third mated structure is formed on the third module. The third mated structure includes a plurality of third mated features. Each third mated feature is a third protrusion mated feature, a third planar mated feature, or a third recess mated feature. When one of the plurality of third mating features is the third protrusion mating feature, the corresponding third mated feature is the third recess mated feature. When one of the plurality of third mating features is the third planar mating feature, the corresponding third mated feature is the third planar mated feature. When one of the plurality of third mating features is the third recess mating feature, the corresponding third mated feature is the third protrusion mated feature.

[0018] According to an embodiment of the present invention, when one of the plurality of second mating features is the second protrusion mating feature, the corresponding first mated feature is the first planar mated feature or the first protrusion mated feature.

[0019] According to an embodiment of the present invention, when one of the plurality of third mating features is the third protruding mating feature, the corresponding first mated feature is the first planar mated feature or the first protruding mated feature, and the corresponding second mated feature is the second recessed mated feature.

[0020] According to an embodiment of the present invention, the first module, the second module, the third module, and the fourth module are a power supply module, an arithmetic module, a signal input / output module, and an extended signal input / output module, respectively.

[0021] According to an embodiment of the present invention, when one of the plurality of second mating features is the second protruding mating feature, the corresponding first mated feature is the first recessed mated feature.

[0022] According to an embodiment of the present invention, when one of the plurality of third mating features is the third protruding mating feature, the corresponding first mated feature is the first planar mated feature or the first protruding mated feature, and the corresponding second mated feature is the second planar mated feature or the second protruding mated feature.

[0023] According to an embodiment of the present invention, the first module, the second module, the third module, and the fourth module are a power supply module, a signal exchange module, an arithmetic module, and a signal input / output module, respectively.

[0024] According to an embodiment of the present invention, the plurality of first mating features, the plurality of second mating features, the plurality of third mating features, the plurality of first mated features, the plurality of second mated features, and the plurality of third mated features are each arranged in a matrix.

Advantages of the Invention

[0025] In summary, according to the present invention, it is ensured that the first mated backplane assembly, the backplane assembly, and the second mated backplane assembly can be accurately assembled sequentially, or it can be ensured that the first backplane assembly, the second backplane assembly, the third backplane assembly, and the fourth backplane assembly can be accurately assembled sequentially. Therefore, the present invention can effectively avoid the occurrence of device failures or damages due to incorrect assembly.

Brief Description of the Drawings

[0026]

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Best Mode for Carrying Out the Invention

[0027] The above-described and other technical contents, features, functions, and effects of the present invention will become clear from the following detailed description of preferred embodiments based on the attached drawings. Note that terms regarding directions mentioned in the following embodiments, such as up, down, left, right, front, back, etc., are merely those of the directions of the attached drawings. Therefore, the terms of directions used are only for explaining the present invention and not for limiting the present invention. Also, unless otherwise specified, the term "connection" here includes any direct and indirect electrical or structural connection means. Thus, for example, when it is described that the first device is connected to the second device, it means that the first device is directly electrically / structurally connected to the second device, or is indirectly electrically / structurally connected to the second device by other devices or connection means.

[0028] Also, order-related terms mentioned in the following embodiments, such as first, second, third, etc., are only for explaining or distinguishing elements. Therefore, the order-related terms used are not for limiting the present invention but for explaining the present invention, that is, the position, importance, order of operation, and / or quantity of the elements are not limited by the definitions of the order-related terms.

[0029] Referring to FIGS. 1 to 4, FIGS. 1 and 2 are diagrams showing the orbital electronic device 1 according to the first embodiment of the present invention in different perspectives. FIGS. 3 and 4 are exploded views of the elements of the orbital electronic device 1 according to the first embodiment of the present invention in different perspectives. As shown in FIGS. 1 to 4, the orbital electronic device 1 may be a remote terminal device, which is detachably attached to the orbital component 2. The orbital electronic device 1 includes a first module 11, a second module 12, a third module 13, and a fourth module 14. The second module 12 is located between the first module 11 and the third module 13 along the side direction LD, and the second module 12 is electrically and structurally connected to the first module 11 and the third module 13. The third module 13 is located between the second module 12 and the fourth module 14 along the side direction LD, and the third module 13 is electrically and structurally connected to the second module 12 and the fourth module 14. The orbital electronic device 1 is arranged to be expandable. As can be understood, in another embodiment, the orbital electronic device may include more or fewer modules.

[0030] Specifically, the orbital component 2, the first module 11, the second module 12, the third module 13, and the fourth module 14 may be a telescopic orbital component, a power supply module, an arithmetic module, a signal input / output module, and an extended signal input / output module that meet the German Industrial Standards, respectively. It should be noted that the present invention is not limited to this embodiment. For example, in another embodiment, the first module, the second module, the third module, and the fourth module may be a power supply module, a signal exchange module, an arithmetic module, and a signal input / output module, respectively.

[0031] As shown in FIGS. 3 and 4, the first module 11 includes a first backplane assembly 111 and a first detachable assembly 112, the second module 12 includes a second backplane assembly 121 and a second detachable assembly 122, the third module 13 includes a third backplane assembly 131 and two third detachable assemblies 132, and the fourth module 14 includes a fourth backplane assembly 141 and four fourth detachable assemblies 142. Taking this embodiment as an example, the first backplane assembly 111, the second backplane assembly 121, the third backplane assembly 131, and the fourth backplane assembly 141 can be detachably attached to the track component 2 by a first locking component L1 movably attached to the first backplane assembly 111, a second locking component L2 movably attached to the second backplane assembly 121, a third locking component L3 movably attached to the third backplane assembly 131, and two fourth locking components L4 movably attached to the fourth backplane assembly 141, respectively. And the first detachable assembly 112, the second detachable assembly 122, each third detachable assembly 132, and each fourth detachable assembly 142 can be detachably assembled to the first backplane assembly 111, the second backplane assembly 121, the third backplane assembly 131, and the fourth backplane assembly 141 by a first locking assembly 113, a second locking assembly 123, a third locking assembly 133, and a fourth locking assembly 143, respectively.

[0032] Referring to FIGS. 3 to 11, FIG. 5 is an enlarged view of part A as shown in FIG. 3 of the orbital electronic device 1 according to the first embodiment of the present invention, FIG. 6 is an enlarged view of part B as shown in FIG. 3 of the orbital electronic device 1 according to the first embodiment of the present invention, FIG. 7 is an enlarged view of part C as shown in FIG. 3 of the orbital electronic device 1 according to the first embodiment of the present invention, FIG. 8 is an enlarged view of part D as shown in FIG. 3 of the orbital electronic device 1 according to the first embodiment of the present invention, FIG. 9 is an enlarged view of part E as shown in FIG. 4 of the orbital electronic device 1 according to the first embodiment of the present invention, FIG. 10 is an enlarged view of part F as shown in FIG. 4 of the orbital electronic device 1 according to the first embodiment of the present invention, and FIG. 11 is an enlarged view of part G as shown in FIG. 4 of the orbital electronic device 1 according to the first embodiment of the present invention. As shown in FIGS. 3 and 4, the orbital electronic device 1 further includes a first mating module 15, a second mating module 16, and a third mating module 17 to ensure the connection relationship between the first module 11, the second module 12, the third module 13, and the fourth module 14. As shown in FIGS. 3, 4, 5, and 9, the first mating module 15 is installed between the first module 11 and the second module 12, and the first mating module 15 includes a first mating structure 151 and a first mated structure 152. The first mating structure 151 is formed on the left side of the second backplane assembly 121 of the second module 12. The first mating structure 151 includes four first mating features 1511 to 1514. Among them, the two first mating features 1511 and 1512 located above are two first planar mating features, and the two first mating features 1513 and 1514 located below are two first protrusion mating features. The first mated structure 152 is formed on the right side of the first backplane assembly 111 of the first module 11. The first mated structure 152 includes four first mated features 1521 to 1524. Among them, the two first mated features 1521 and 1522 located above are two first planar mated features, and the two first mated features 1523 and 1524 located below are two first recessed mated features.In the process of assembling the second backplane assembly 121 of the second module 12 to the right side of the first backplane assembly 111 of the first module 11, the two lower first mating features 1513, 1514 enter the two lower first mated features 1523, 1524 respectively, so that the second backplane assembly 121 of the second module 12 can be assembled smoothly to the right side of the first backplane assembly 111 of the first module 11 without any obstacles.

[0033] Preferably, in this embodiment, the four first mating features 1511 - 1514 and the four first mated features 1521 - 1524 are each arranged in a 2x2 matrix. It should be noted that the present invention is not limited to this embodiment. For example, in another embodiment, the four first mating features and the four first mated features may each be arranged linearly.

[0034] As shown in FIGS. 3, 4, 6, and 10, the second mating module 16 is installed between the second module 12 and the third module 13, and the second mating module 16 includes a second mating structure 161 and a second mated structure 162. The second mating structure 161 is formed on the left side of the third backplane assembly 131 of the third module 13. The second mating structure 161 includes four second mating features 1611-1614. Among them, the two second mating features 1611 and 1612 located above are two second protruding mating features, and the two second mating features 1613 and 1614 located below are two second recessed mating features. The second mated structure 162 is formed on the right side of the second backplane assembly 121 of the second module 12. The second mated structure 162 includes four second mated features 1621-1624. Among them, the two second mated features 1621 and 1622 located above are two second recessed mated features, and the two second mated features 1623 and 1624 located below are two second flat mated features. During the process of assembling the third backplane assembly 131 of the third module 13 to the right side of the second backplane assembly 121 of the second module 12, the two second mating features 1611 and 1612 located above can enter the two second mated features 1621 and 1622 located above respectively, so as to allow the third backplane assembly 131 of the third module 13 to be assembled to the right side of the second backplane assembly 121 of the second module 12 without obstruction.

[0035] Preferably, in this embodiment, the four second mating features 1611 to 1614 and the four second mated features 1621 to 1624 are each arranged in a 2x2 matrix. It should be noted that the present invention is not limited to this embodiment. For example, in another embodiment, the four second mating features and the four second mated features may each be arranged linearly.

[0036] As shown in FIGS. 3, 4, 7, and 10, the third mating module 17 is installed between the third module 13 and the fourth module 14, and the third mating module 17 includes a third mating structure 171 and a third mated structure 172. The third mating structure 171 is formed on the left side of the fourth backplane assembly 141 of the fourth module 14. The third mating structure 171 includes four third mating features 1711-1714. Among them, the two third mating features 1711 and 1712 located above are two third protruding mating features, and the two third mating features 1713 and 1714 located below are two third recessed mating features. The third mated structure 172 is formed on the right side of the third backplane assembly 131 of the third module 13. The third mated structure 172 includes four third mated features 1721-1724. Among them, the two third mated features 1721 and 1722 located above are two third recessed mated features, and the two third mated features 1723 and 1724 located below are two third planar mated features. In the process of assembling the fourth backplane assembly 141 of the fourth module 14 to the right side of the third backplane assembly 131 of the third module 13, the two third mating features 1711 and 1712 located above can enter the two third mated features 1721 and 1722 located above respectively, so that the fourth backplane assembly 141 of the fourth module 14 can be assembled to the right side of the third backplane assembly 131 of the third module 13 without hindrance.

[0037] Preferably, in this embodiment, the four third mating features 1711 to 1714 and the four third mated features 1721 to 1724 are each arranged in a 2x2 matrix. Note that the present invention is not limited to this embodiment. For example, in another embodiment, the four third mating features and the four third mated features may each be arranged linearly.

[0038] As shown in FIGS. 5 and 10, when the third backplane assembly 131 of the third module 13 is mistakenly assembled to the right side of the first backplane assembly 111 of the first module 11, the two second mating features 1611 and 1612 located above abut against the two first mated features 1521 and 1522 located above, so that the third backplane assembly 131 of the third module 13 cannot be assembled to the right side of the first backplane assembly 111 of the first module 11. Alternatively, as shown in FIGS. 7 and 9, when the second backplane assembly 121 of the second module 12 is mistakenly assembled to the right side of the third backplane assembly 131 of the third module 13, the two first mating features 1513 and 1514 located below abut against the two second mated features 1623 and 1624 located below, so that the second backplane assembly 121 of the second module 12 cannot be assembled to the right side of the third backplane assembly 131 of the third module 13.

[0039] Also, as shown in FIG. 8, four fourth mated features 1821 - 1824 are further installed on the right side of the fourth backplane assembly 141 of the fourth module 14. They are used to allow the third module 13 and the fourth module 14 to be exchanged and installed, that is, to allow the user to assemble the fourth backplane assembly 141 of the fourth module 14 on the right side of the second backplane assembly 121 of the second module 12, and to assemble the third backplane assembly 131 of the third module 13 on the right side of the fourth backplane assembly 141 of the fourth module 14. Among them, the two fourth mated features 1821, 1822 located above are two fourth recessed mated features, and the two fourth mated features 1823, 1824 located below are two fourth planar mated features. As shown in FIGS. 6 and 11, during the process of assembling the fourth backplane assembly 141 of the fourth module 14 on the right side of the second backplane assembly 121 of the second module 12, the two third mating features 1711, 1712 located above can enter the two second mated features 1621, 1622 located above, so the fourth backplane assembly 141 of the fourth module 14 can be assembled on the right side of the second backplane assembly 121 of the second module 12 without obstruction. As shown in FIGS. 8 and 10, during the process of assembling the third backplane assembly 131 of the third module 13 on the right side of the fourth backplane assembly 141 of the fourth module 14, the two second mating features 1613, 1614 located below can enter the two fourth mated features 1823, 1824 located below, so the third backplane assembly 131 of the third module 13 can be assembled on the right side of the fourth backplane assembly 141 of the fourth module 14 without obstruction.On the other hand, as shown in FIGS. 8 and 9, when the second backplane assembly 121 of the second module 12 is mistakenly assembled to the right side of the fourth backplane assembly 141 of the fourth module 14, the two first mating features 1513 and 1514 located below abut the two fourth mated features 1823 and 1824 located below, thereby preventing the second backplane assembly 121 of the second module 12 from being assembled to the right side of the fourth backplane assembly 141 of the fourth module 14.

[0040] Referring to FIGS. 12 to 22, FIGS. 12 and 13 are exploded views of the elements of the orbital electronic device 1' according to the second embodiment of the present invention from different perspectives. FIG. 14 is an enlarged view of the H portion as shown in FIG. 12 of the orbital electronic device 1' according to the second embodiment of the present invention. FIG. 15 is an enlarged view of the I portion as shown in FIG. 12 of the orbital electronic device 1' according to the second embodiment of the present invention. FIG. 16 is an enlarged view of the J portion as shown in FIG. 12 of the orbital electronic device 1' according to the second embodiment of the present invention. FIG. 17 is an enlarged view of the K portion as shown in FIG. 12 of the orbital electronic device 1' according to the second embodiment of the present invention. FIG. 18 is an enlarged view of the L portion as shown in FIG. 12 of the orbital electronic device 1' according to the second embodiment of the present invention. FIG. 19 is an enlarged view of the M portion as shown in FIG. 13 of the orbital electronic device 1' according to the second embodiment of the present invention. FIG. 20 is an enlarged view of the N portion as shown in FIG. 13 of the orbital electronic device 1' according to the second embodiment of the present invention. FIG. 21 is an enlarged view of the O portion as shown in FIG. 13 of the orbital electronic device 1' according to the second embodiment of the present invention. FIG. 22 is an enlarged view of the P portion as shown in FIG. 13 of the orbital electronic device 1' according to the second embodiment of the present invention. As shown in FIGS. 12 and 13, the orbital electronic device 1' includes a first module 11', a second module 12', a third module 13', a fourth module 14' and a fifth module 10'. The second module 12' is located between the first module 11' and the third module 13' along the side direction LD, and the second module 12' is electrically and structurally connected to the first module 11' and the third module 13'. The third module 13' is located between the second module 12' and the fourth module 14' along the side direction LD, and the third module 13' is electrically and structurally connected to the second module 12' and the fourth module 14'. The fourth module 14' is located between the third module 13' and the fifth module 10' along the side direction LD, and the fourth module 14' is electrically and structurally connected to the third module 13' and the fifth module 10'.

[0041] Specifically, the first module 11’, the second module 12’, the third module 13’, the fourth module 14’ and the fifth module 10’ are a power supply module, a signal exchange module, an arithmetic module, a signal input / output module, and an extended signal input / output module respectively, but the present invention is not limited to this embodiment.

[0042] As shown in FIGS. 12 and 13, the first module 11' includes a first backplane assembly 111' and a first detachable assembly 112', the second module 12' includes a second backplane assembly 121' and a second detachable assembly 122', the third module 13' includes a third backplane assembly 131' and a third detachable assembly 132', the fourth module 14' includes a fourth backplane assembly 141' and two fourth detachable assemblies 142', and the fifth module 10' includes a fifth backplane assembly 101' and four fifth detachable assemblies 102'. Similar to the first embodiment, in this embodiment, the first backplane assembly 111', the second backplane assembly 121', the third backplane assembly 131', the fourth backplane assembly 141' and the fifth backplane assembly 101' can be detachably attached to the track component by a first locking component L1' movably attached to the first backplane assembly 111', a second locking component L2' movably attached to the second backplane assembly 121', a third locking component L3' movably attached to the third backplane assembly 131', a fourth locking component L4' movably attached to the fourth backplane assembly 141' and two fifth locking components L5' movably attached to the fifth backplane assembly 101', respectively, and the first detachable assembly 112', the second detachable assembly 122', the third detachable assembly 132', each fourth detachable assembly 142' and each fifth detachable assembly 102' can be detachably assembled to the first backplane assembly 111', the second backplane assembly 121', the third backplane assembly 131', the fourth backplane assembly 141' and the fifth backplane assembly 101' by a first locking assembly 113', a second locking assembly 123', a third locking assembly 133', a fourth locking assembly 143' and a fifth locking assembly 103', respectively.

[0043] As shown in FIGS. 12 and 13, the orbital electronic device 1' further includes a first mating module 15', a second mating module 16', a third mating module 17' and a fourth mating module 18' to ensure the connection relationship among the first module 11', the second module 12', the third module 13', the fourth module 14' and the fifth module 10'. As shown in FIGS. 12, 13, 14 and 19, the first mating module 15' is installed between the first module 11' and the second module 12', and the first mating module 15' includes a first mating structure 151' and a first mated structure 152'. The first mating structure 151' is formed on the left side of the second backplane assembly 121' of the second module 12', and the first mating structure 151' includes four first mating features 1511' - 1514'. Among them, the two first mating features 1511', 1512' located above are two first recessed mating features, and the two first mating features 1513', 1514' located below are two first protruding mating features. The first mated structure 152' is formed on the right side of the first backplane assembly 111' of the first module 11', and the first mated structure 152' includes four first mated features 1521' - 1524'. Among them, the two first mated features 1521', 1522' located above are a first protruding mated feature and a first recessed mated feature respectively, and the two first mated features 1523', 1524' located below are two first recessed mated features.In the process of assembling the second backplane assembly 121' of the second module 12' on the right side of the first backplane assembly 111' of the first module 11', the first mating features 1521' located above can enter the first mating features 1511' located above respectively, and the two first mating features 1513', 1514' located below can enter the two first mated features 1523', 1524' located below respectively. Thus, it can be allowed that the second backplane assembly 121' of the second module 12' can be assembled on the right side of the first backplane assembly 111' of the first module 11' without any obstacles.

[0044] Preferably, in this embodiment, the four first mating features 1511' - 1514' and the four first mated features 1521' - 1524' are respectively arranged in a 2x2 matrix. It should be noted that the present invention is not limited to this embodiment. For example, in another embodiment, the four first mating features and the four first mated features may be arranged linearly respectively.

[0045] As shown in FIGS. 12, 13, 15 and 20, the second mating module 16' is installed between the second module 12' and the third module 13', and the second mating module 16' includes a second mating structure 161' and a second mated structure 162'. The second mating structure 161' is formed on the left side of the third backplane assembly 131' of the third module 13', and the second mating structure 161' includes four second mating features 1611' to 1614'. Among them, the two second mating features 1611' and 1612' located above are a second recessed mating feature and a second planar mating feature respectively, and the two second mating features 1613' and 1614' located below are a second protruding mating feature and a second recessed mating feature respectively. The second mated structure 162' is formed on the right side of the second backplane assembly 121' of the second module 12', and the second mated structure 162' includes four second mated features 1621' to 1624'. Among them, the two second mated features 1621' and 1622' located above are two second planar mated features, and the two second mated features 1623' and 1624' located below are two second recessed mated features. In the process of assembling the third backplane assembly 131' of the third module 13' to the right side of the second backplane assembly 121' of the second module 12', the second mating feature 1613' located below can enter the second mated feature 1623' located below, thereby allowing the third backplane assembly 131' of the third module 13' to be assembled to the right side of the second backplane assembly 121' of the second module 12' without obstruction.

[0046] Preferably, in this embodiment, the four second mating features 1611’ to 1614’ and the four second mated features 1621’ to 1624’ are each arranged in a 2x2 matrix. It should be noted that the present invention is not limited to this embodiment. For example, in another embodiment, the four second mating features and the four second mated features may each be arranged linearly.

[0047] As shown in FIGS. 12, 13, 16, and 21, the third mating module 17' is installed between the third module 13' and the fourth module 14', and the third mating module 17' includes a third mating structure 171' and a third mated structure 172'. The third mating structure 171' is formed on the left side of the fourth backplane assembly 141' of the fourth module 14', and the third mating structure 171' includes four third mating features 1711' to 1714'. Among them, the two third mating features 1711' and 1712' located above are a third protrusion mating feature and a third planar mating feature respectively, and the two third mating features 1713' and 1714' located below are a third recess mating feature and a third planar mating feature respectively. The third mated structure 172' is formed on the right side of the third backplane assembly 131' of the third module 13', and the third mated structure 172' includes four third mated features 1721' to 1724'. Among them, the two third mated features 1721' and 1722' located above are two third recess mated features respectively, and the two third mated features 1723' and 1724' located below are two third planar mated features respectively. During the process of assembling the fourth backplane assembly 141' of the fourth module 14' on the right side of the third backplane assembly 131' of the third module 13', the third mating feature 1711' located above can enter the third mated feature 1721' located above, thereby allowing the fourth backplane assembly 141' of the fourth module 14' to be assembled on the right side of the third backplane assembly 131' of the third module 13' without obstruction.

[0048] Preferably, in this embodiment, the four third mating features 1711’ to 1714’ and the four third mated features 1721’ to 1724’ are each arranged in a 2x2 matrix. It should be noted that the present invention is not limited to this embodiment. For example, in another embodiment, the four third mating features and the four third mated features may each be arranged linearly.

[0049] As shown in FIGS. 12, 13, 17, and 22, the fourth mating module 18' is installed between the fourth module 14' and the fifth module 10', and the fourth mating module 18' includes a fourth mating structure 181' and a fourth mated structure 182'. The fourth mating structure 181' is formed on the left side of the fifth backplane assembly 101' of the fifth module 10', and the fourth mating structure 181' includes four fourth mating features 1811' to 1814'. Among them, the two fourth mating features 1811' and 1812' located above are a fourth protrusion mating feature and a fourth flat mating feature respectively, and the two fourth mating features 1813' and 1814' located below are a fourth recess mating feature and a fourth flat mating feature respectively. The fourth mated structure 182' is formed on the right side of the fourth backplane assembly 141' of the fourth module 14', and the fourth mated structure 182' includes four fourth mated features 1821' to 1824'. Among them, the two fourth mated features 1821' and 1822' located above are a fourth recess mated feature and a fourth flat mated feature respectively, and the two fourth mated features 1823' and 1824' located below are a fourth protrusion mated feature and a fourth recess mated feature respectively. In the process of assembling the fifth backplane assembly 101' of the fifth module 10' on the right side of the fourth backplane assembly 141' of the fourth module 14', the fourth mating feature 1811' located above can enter the fourth mated feature 1821' located above, and the fourth mated feature 1823' located below can enter the fourth mating feature 1813' located below, thereby allowing the fifth backplane assembly 101' of the fifth module 10' to be assembled on the right side of the fourth backplane assembly 141' of the fourth module 14' without hindrance. Preferably, in this embodiment, the four fourth mating features 1811’ to 1814’ and the four fourth mated features 1821’ to 1824’ are each arranged in a 2x2 matrix. It should be noted that the present invention is not limited to this embodiment. For example, in another embodiment, the four fourth mating features and the four fourth mated features may each be arranged linearly.

[0050] Note that, as shown in FIGS. 14 and 21, when the fourth backplane assembly 141' of the fourth module 14' is erroneously assembled to the right side of the first backplane assembly 111' of the first module 11', the third mating feature 1711' located above abuts against the first mated feature 1521' located above, so that the fourth backplane assembly 141' of the fourth module 14' cannot be assembled to the right side of the first backplane assembly 111' of the first module 11'. Alternatively, as shown in FIGS. 14 and 22, when the fifth backplane assembly 101' of the fifth module 10' is erroneously assembled to the right side of the first backplane assembly 111' of the first module 11', the fourth mating feature 1811' located above abuts against the first mated feature 1521' located above, so that the fifth backplane assembly 101' of the fifth module 10' cannot be assembled to the right side of the first backplane assembly 111' of the first module 11'. Alternatively, as shown in FIGS. 15 and 21, when the fourth backplane assembly 141' of the fourth module 14' is erroneously assembled to the right side of the second backplane assembly 121' of the second module 12', the third mating feature 1711' located above abuts against the second mated feature 1621' located above, so that the fourth backplane assembly 141' of the fourth module 14' cannot be assembled to the right side of the second backplane assembly 121' of the second module 12'. Alternatively, as shown in FIGS. 15 and 22, when the fifth backplane assembly 101' of the fifth module 10' is erroneously assembled to the right side of the second backplane assembly 121' of the second module 12', the fourth mating feature 1811' located above abuts against the second mated feature 1621' located above, so that the fifth backplane assembly 101' of the fifth module 10' cannot be assembled to the right side of the second backplane assembly 121' of the second module 12.

[0051] Also, as shown in FIG. 18, in this embodiment, four fifth mated features 1921' to 1924' are further installed on the right side of the fifth backplane assembly 101' of the fifth module 10'. They are used to allow the fourth module 14' and the fifth module 10' to be exchanged and installed. That is, they are used to allow the user to assemble the fifth backplane assembly 101' of the fifth module 10' on the right side of the third backplane assembly 131' of the third module 13', and to assemble the fourth backplane assembly 141' of the fourth module 14' on the right side of the fifth backplane assembly 101' of the fifth module 10'. Among them, the two upper fifth mated features 1921', 1922' are the fifth recessed mated feature and the fifth planar mated feature respectively, and the two lower fifth mated features 1923', 1924' are the fifth protruding mated feature and the fifth recessed mated feature. As shown in FIGS. 16 and 22, in the process of assembling the fifth backplane assembly 101' of the fifth module 10' on the right side of the third backplane assembly 131' of the third module 13', since the upper fourth mating feature 1811' can enter the upper third mated feature 1721', the fifth backplane assembly 101' of the fifth module 10' can be assembled on the right side of the third backplane assembly 131' of the third module 13' without any obstacles.As shown in FIGS. 18 and 21, in the process of assembling the fourth backplane assembly 141' of the fourth module 14' on the right side of the fifth backplane assembly 101' of the fifth module 10', the third mating feature 1711' located above can enter the fifth mated feature 1921' located above, and the fifth mated feature 1923' located below can enter the third mating feature 1713' located below. Therefore, the fourth backplane assembly 141' of the fourth module 14' can be assembled on the right side of the fifth backplane assembly 101' of the fifth module 10' without any obstacles.

[0052] Also, as shown in FIGS. 16 and 19, when the second backplane assembly 121' of the second module 12' is mistakenly assembled to the right side of the third backplane assembly 131' of the third module 13', the two first mating features 1513', 1514' located below abut against the two third mated features 1723', 1724' located below, so that the second backplane assembly 121' of the second module 12' cannot be assembled to the right side of the third backplane assembly 131' of the third module 13'. Or, as shown in FIGS. 17 and 19, when the second backplane assembly 121' of the second module 12' is mistakenly assembled to the right side of the fourth backplane assembly 141' of the fourth module 14', the first mating feature 1513' located below abuts against the fourth mated feature 1823' located below, so that the second backplane assembly 121' of the second module 12' cannot be assembled to the right side of the fourth backplane assembly 141' of the fourth module 14'. Or, as shown in FIGS. 18 and 19, when the second backplane assembly 121' of the second module 12' is mistakenly assembled to the right side of the fifth backplane assembly 101' of the fifth module 10', the first mating feature 1513' located below abuts against the fifth mated feature 1923' located below, so that the second backplane assembly 121' of the second module 12' cannot be assembled to the right side of the fifth backplane assembly 101' of the fifth module 10'.

[0053] On the other hand, as shown in FIGS. 17 and 20, when the third backplane assembly 131' of the third module 13' is erroneously assembled to the right side of the fourth backplane assembly 141' of the fourth module 14', the second mating feature 1613' located below abuts against the fourth mated feature 1823' located below, thereby preventing the third backplane assembly 131' of the third module 13' from being assembled to the right side of the fourth backplane assembly 141' of the fourth module 14'. Alternatively, as shown in FIGS. 18 and 20, when the third backplane assembly 131' of the third module 13' is erroneously assembled to the right side of the fifth backplane assembly 101' of the fifth module 10', the second mating feature 1613' located below abuts against the fifth mated feature 1923' located below, thereby preventing the third backplane assembly 131' of the third module 13' from being assembled to the right side of the fifth backplane assembly 101' of the fifth module 10'.

[0054] To be understandable, the mating features and mated features of the present invention are not limited to the above two embodiments. For example, each mating module may include two or more mating features and two or more mated features, and each mating feature or each mated feature may be configured as a planar feature, a protruding feature, or a recessed feature respectively based on the following assembly relationship shown in Table 1 below (where O represents that the corresponding two modules can be assembled with each other, and X represents that the corresponding two modules cannot be assembled with each other), whereby the assembly of the corresponding two modules can be allowed or restricted. Among them, when allowing the assembly of two modules, when the mating feature is a protruding mating feature, the corresponding mated feature is a recessed mated feature; when the mating feature is a planar mating feature, the corresponding mated feature is a planar mated feature or a recessed mated feature; when the mating feature is a recessed mating feature, the corresponding mated feature is a protruding mated feature, a planar mated feature, or a recessed mated feature. When restricting the assembly of two modules, when the mating feature is a protruding mating feature, the corresponding mated feature is a protruding mated feature or a planar mated feature; when the mating feature is a planar mating feature, the corresponding mated feature is a protruding mated feature.As shown in Table 1 below, the power supply module may have an installation state where it cannot be assembled on the right side of another power supply module, signal exchange module, arithmetic module, or signal input / output module. The signal exchange module can be assembled on the right side of the power supply module, but it may also have an installation state where it cannot be assembled on the right side of another signal exchange module, arithmetic module, or signal input / output module. The arithmetic module can be assembled on the right side of the power supply module or signal exchange module, but it may also have an installation state where it cannot be assembled on the right side of another arithmetic module or signal input / output module. The signal input / output module can be assembled on the right side of the signal exchange module or another signal input / output module, but it may also present an installation state where it cannot be assembled on the right side of the power supply module or signal exchange module.

[0055]

Table 1

[0056] Compared with the prior art, the present invention ensures that the first mated backplane assembly, the backplane assembly, and the second mated backplane assembly can be accurately assembled sequentially, or that the first backplane assembly, the second backplane assembly, the third backplane assembly, and the fourth backplane assembly can be accurately assembled sequentially. Therefore, the present invention can effectively avoid the occurrence of device failures or damages due to incorrect assembly.

[0057] The present invention has been disclosed as above based on the foregoing preferred embodiments. However, the foregoing preferred embodiments are not for limiting the present invention. Those skilled in the art can make minor changes and refinements to the present invention without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention is based on what is defined in the appended claims. Also, any embodiment or claim of the present invention does not need to achieve all the objects, advantages, or features disclosed in the present invention. Also, a part of the abstract and the title of the invention are only for assisting in document search and do not limit the scope of rights of the present invention. Also, terms such as "first" and "second" mentioned in this specification or the claims are only for naming elements or for distinguishing different embodiments or scopes, and are not for limiting the upper or lower limits of the quantity of elements.

Explanation of Reference Numerals

[0058] 1,1’: Orbital electronic device 10’: Fifth module 101’: Fifth backplane assembly 102’: Fifth detachable assembly 103’: Fifth locking assembly 11,11’: First module 111,111’: First backplane assembly 112,112’: First detachable assembly 113,113’: First locking assembly 12, 12’: Second module 121, 121’: Second backplane assembly 122, 122’: Second detachable assembly 123, 123’: Second lock assembly 13, 13’: Third module 131, 131’: Third backplane assembly 132, 132’: Third detachable assembly 133, 133’: Third lock assembly 14, 14’: Fourth module 141, 141’: Fourth backplane assembly 142, 142’: Fourth detachable assembly 143, 143’: Fourth lock assembly 15, 15’: First mating module 151, 151’: First mating structure 1511~1514, 1511’~1514’: First mating feature 152, 152’: First mated structure 1521~1524, 1521’~1524’: First mated feature 16, 16’: Second mating module 161, 161’: Second mating structure 1611~1614, 1611’~1614’: Second mating feature 162, 162’: Second mated structure 1621~1624, 1621’~1624’: Second mated feature 17, 17’: Third mating module 171, 171’: Third mating structure 1711~1714, 1711’~1714’: Third mating feature 172, 172’: Third mated structure 1721~1724, 1721’~1724’: Third mated feature 18’: Fourth mating module 1811’~1814’: Fourth mating feature 1821~1824, 1821’~1824’: Fourth mated feature 1921’~1924’: Fifth mated feature 2: Track component L1, L1’: First locking component L2, L2’: Second locking component L3, L3’: Third locking component L4, L4’: Fourth locking component L5’: Fifth locking component LD: Lateral direction

Claims

1. 1. A tracked backplane assembly kit comprising: a backplane assembly, a first mating structure and a second mated structure; the first mating structure is formed on the backplane assembly, the first mating structure includes a plurality of first mating features, each of which is a first protruding mating feature, a first planar mating feature, or a first recessed mating feature, and the first mating structure cooperates with a first mated structure of a first mated backplane assembly kit to permit or restrict assembly of the backplane assembly with a first mated backplane assembly of the first mated backplane assembly kit; the second mated structure is formed on the backplane assembly, the second mated structure including a plurality of second mated features, each second mated feature being a second protruding mated feature, a second planar mated feature or a second recessed mated feature, the second mated structure cooperating with a second mated structure of a second mated backplane assembly kit to permit or restrict assembly of the backplane assembly with a second mated backplane assembly of the second mated backplane assembly kit; the first mating structure and the second mated structure are respectively located on opposite sides of the backplane assembly; a track-type backplane assembly kit, wherein when the backplane assembly and the first mated backplane assembly of the first mated backplane assembly kit are assembled together, and when the backplane assembly and the second mated backplane assembly of the second mated backplane assembly kit are assembled together, the backplane assembly is located between the first mated backplane assembly of the first mated backplane assembly kit and the second mated backplane assembly of the second mated backplane assembly kit.

2. 2. The tracked backplane assembly kit of claim 1, comprising: a track-type backplane assembly kit, wherein the plurality of first mating features and the plurality of second mated features are respectively arranged in a matrix.

3. 2. The tracked backplane assembly kit of claim 1, comprising: a first mated feature corresponding to the first mated structure of the first mated backplane assembly kit being a first recess mated feature, the first mated feature being configured to enter the first recess mated feature, thereby allowing the backplane assembly of the first mated backplane assembly kit to be assembled to the first mated backplane assembly of the first mated backplane assembly kit.

4. 2. The tracked backplane assembly kit of claim 1, comprising: a first mated feature corresponding to the first mated structure of the first mated backplane assembly kit being a first protruding mating feature or a first planar mated feature, the first protruding mating feature abuts against the first protruding mated feature or the first planar mated feature, thereby preventing the backplane assembly of the track-based backplane assembly kit from being assembled to the first mated backplane assembly of the first mated backplane assembly kit.

5. 2. The tracked backplane assembly kit of claim 1, comprising: a second mating feature corresponding to the second mating structure of the second mated backplane assembly kit being a second recess mating feature, the second mated feature being configured to enter the second recess mating feature, thereby allowing the backplane assembly of the first mated backplane assembly kit to be assembled to the second mated backplane assembly of a second mated backplane assembly kit.

6. 2. The tracked backplane assembly kit of claim 1, comprising: a second mating structure corresponding to the second mating structure of the second mated backplane assembly kit being a second protrusion mating feature or a second planar mating feature, the second protrusion mated feature abuts against the second recess mating feature or the second planar mating feature, thereby preventing the backplane assembly of the track-based backplane assembly kit from being assembled to the second mated backplane assembly of a second mated backplane assembly kit.

7. An orbital electronic device, comprising: First module: A second module that can be removably assembled to the first module; and a first mating module disposed between the first module and the second module; the first mating module includes a first mating structure and a first mated structure; the first mating structure is formed on the second module, the first mating structure including a plurality of first mating features, each first mating feature being a first protruding mating feature, a first planar mating feature, or a first recessed mating feature; the first mated structure is formed on the first module, the first mated structure including a plurality of first mated features, each first mated feature being a first protrusion mated feature, a first planar mated feature, or a first recessed mated feature; when one of the plurality of first mating features is the first protrusion mating feature, the corresponding first mated feature is the first recessed mated feature; when one of the plurality of first mating features is the first planar mating feature, the corresponding first mated feature is the first planar mated feature or the first recessed mated feature; when one of the plurality of first mating features is the first recess mating feature, the corresponding first mated feature is the first protrusion mated feature, the first planar mated feature, or the first recess mated feature; The orbital electronic device is A third module that can be removably assembled to the second module; and a second mating module disposed between the second module and the third module; the second mating module includes a second mating structure and a second mated structure; the second mating structure is formed on the third module, the second mating structure including a plurality of second mating features, each second mating feature being a second protrusion mating feature, a second planar mating feature, or a second recessed mating feature; the second mated structure is formed on the second module, the second mated structure including a plurality of second mated features, each second mated feature being a second protrusion mated feature, a second planar mated feature, or a second recessed mated feature; when one of the plurality of second mating features is the second protrusion mating feature, the corresponding second mated feature is the second recessed mated feature; when one of the plurality of second mating features is the second planar mating feature, the corresponding second mated feature is the second planar mated feature or the second recessed mated feature; when one of the plurality of second mating features is the second recess mating feature, the corresponding second mated feature is the second protrusion mated feature, the second planar mated feature, or the second recess mated feature; the first mating structure and the second mated structure are respectively located on opposite sides of the second module; An orbital electronic device, wherein when the second module and the first module are assembled together and when the second module and the third module are assembled together, the second module is located between the first module and the third module.

8. 8. The orbital electronic device of claim 7, A track-type electronic device, wherein the plurality of first mating features and the plurality of first mated features are respectively arranged in a matrix.

9. 8. The orbital electronic device of claim 7, When one of the plurality of second mating features is the second protruding mating feature, the corresponding first mated feature is the first planar mated feature or the first protruding mated feature.

10. 10. The orbital electronic device of claim 9, The orbital electronic device, wherein the first module, the second module and the third module are a power supply module, a computing module and a signal input / output module respectively.

11. An orbital electronic device according to any one of claims 7 to 10, A track-type electronic device, wherein the plurality of first mating features, the plurality of second mating features, the plurality of first mated features and the plurality of second mated features are respectively arranged in a matrix.

12. 8. The orbital electronic device of claim 7, a fourth module removably attachable to the third module; and a third mating module disposed between the third module and the fourth module; the third mating module includes a third mating structure and a third mated structure; the third mating structure is formed on the fourth module, the third mating structure including a plurality of third mating features, each of the third mating features being a third protrusion mating feature, a third planar mating feature, or a third recessed mating feature; the third mated structure is formed on the third module, the third mated structure comprising a plurality of third mated features, each third mated feature comprising a third protrusion mated feature, a third planar mated feature or a third recessed mated feature; when one of the plurality of third mating features is the third protrusion mating feature, the corresponding third mated feature is the third recessed mated feature; when one of the plurality of third mating features is the third planar mating feature, the corresponding third mated feature is the third planar mated feature; When one of the plurality of third mating features is the third recess mating feature, the corresponding third mated feature is the third protrusion mated feature.

13. 13. The orbital electronic device of claim 12, When one of the plurality of second mating features is the second protruding mating feature, the corresponding first mated feature is the first planar mated feature or the first protruding mated feature.

14. 14. The orbital electronic device of claim 13, when one of the plurality of third mating features is the third protruding mating feature, the corresponding first mated feature is the first planar mated feature or the first protruding mated feature, and the corresponding second mated feature is the second recessed mated feature.

15. 15. The track-type electronic device of claim 14, The orbital electronic device, wherein the first module, the second module, the third module and the fourth module are a power supply module, a computing module, a signal input / output module and an expansion signal input / output module respectively.

16. 13. The orbital electronic device of claim 12, When one of the plurality of second mating features is the second protruding mating feature, the corresponding first mated feature is the first recessed mated feature.

17. 17. The track-type electronic device of claim 16, when one of the plurality of third mating features is the third protruding mating feature, the corresponding first mated feature is the first planar mated feature or the first protruding mated feature, and the corresponding second mated feature is the second planar mated feature or the second protruding mated feature.

18. 18. The orbital electronic device of claim 17, The orbital electronic device, wherein the first module, the second module, the third module and the fourth module are a power supply module, a signal exchange module, a calculation module and a signal input / output module respectively.

19. 19. An orbital electronic device according to any one of claims 12 to 18, comprising: An orbital electronic device, wherein the plurality of first mating features, the plurality of second mating features, the plurality of third mating features, the plurality of first mated features, the plurality of second mated features and the plurality of third mated features are each arranged in a matrix.

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