Light-emitting substrate, method for manufacturing the same, and display device

Abstract

An embodiment of the present disclosure provides a light-emitting substrate, a manufacturing method thereof, and a display device, wherein the light-emitting substrate includes a first substrate, a second substrate, and a bonding wire structure, the first substrate includes a first base, a light-emitting diode mounted on the first base, and a first conductive mat mounted on the first base, the second substrate is mounted opposite the first substrate and includes a second base and a second conductive mat mounted on the second base, the bonding wire structure includes a bonding wire, the first conductive mat is located on a surface of the first substrate away from the second substrate, the second conductive mat is located on a surface of the second substrate away from the first substrate, and the bonding wire electrically connects the first conductive mat and the second conductive mat.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and in particular, to a light-emitting substrate, a method for manufacturing the same, and a display device.

Background Art

[0002] Light Emitting Diode (LED) technology has been developed for about 30 years, and its application scope has been continuously expanding. For example, it can be applied in the display field and used as a backlight of a display device or as an LED display. With the development of technology, Mini Light Emitting Diode (Mini LED) display technology and Micro Light Emitting Diode (Micro LED) display technology are gradually becoming a hot spot in display devices. LEDs have the advantages of self-luminescence, wide viewing angle, high-speed response, simple structure, long lifespan, etc. In addition, Mini LED / Micro LED display can achieve large-size display by a bonding method, so they have good market prospects. Currently, the structure and manufacturing process of Mini LED / Micro LED display devices are one of the important issues attracting the attention of developers.

[0003] The above information disclosed in this part is only used for understanding the background of the inventive concept of the present disclosure, so the above information may include information that does not constitute the prior art.

Summary of the Invention

Problems to be Solved by the Invention

[0004] In order to solve at least one aspect of the above problems, embodiments of the present disclosure provide a light-emitting substrate, a method for manufacturing the same, and a display device.

Means for Solving the Problems

[0005] In one aspect, a light-emitting substrate is provided, which includes a first substrate, a second substrate disposed opposite to the first substrate, and a bonding wire structure. The first substrate includes a first base, a light-emitting diode disposed on the first base, and a first conductive mat disposed on the first base. The second substrate includes a second base, and a second conductive mat disposed on the second base. The bonding wire structure includes bonding wires. The first conductive mat is located on a surface of the first substrate that is spaced apart from the second substrate. The second conductive mat is located on a surface of the second substrate that is spaced apart from the first substrate. The bonding wires electrically connect the first conductive mat and the second conductive mat.

[0006] According to some exemplary embodiments, the bonding wire structure further includes a first solder joint and a second solder joint. The first solder joint is a solder joint where one end of the bonding wire is soldered to the first conductive mat. The second solder joint is a solder joint where the other end of the bonding wire is soldered to the second conductive mat.

[0007] According to some exemplary embodiments, the light-emitting substrate further includes an adhesive backing, which is disposed between the first substrate and the second substrate and is used to integrally attach the first substrate and the second substrate.

[0008] According to some exemplary embodiments, the light-emitting substrate further includes a first protective adhesive layer. The first substrate includes a first sidewall adjacent to the first conductive mat. The second substrate includes a second sidewall adjacent to the second conductive mat. The first protective adhesive layer contacts at least the first sidewall and the second sidewall.

[0009] According to some exemplary embodiments, the back glue includes a third sidewall, and the orthographic projections of the first sidewall, the second sidewall, and the third sidewall onto the first base overlap each other.

[0010] According to some exemplary embodiments, the first protective adhesive layer further contacts the third sidewall.

[0011] According to some exemplary embodiments, the light-emitting substrate further includes a second protective adhesive layer. The bonding wire is sandwiched between the first protective adhesive layer and the second protective adhesive layer.

[0012] According to some exemplary embodiments, the projection of the second protective adhesive layer along the direction perpendicular to the first sidewall covers the projection of the bonding wire along the direction perpendicular to the first sidewall.

[0013] According to some exemplary embodiments, the orthographic projection of the second protective adhesive layer onto the first base covers the orthographic projections of the first conductive mat, the first solder joint, the second conductive mat, and the second solder joint onto the first base respectively.

[0014] According to some exemplary embodiments, the surface of the first protective adhesive layer spaced from the first sidewall contacts the bonding wire, and the surface of the second protective adhesive layer close to the first sidewall contacts the bonding wire.

[0015] According to some exemplary embodiments, the bonding wire forms a certain included angle with the plane where the first base is located at the first solder joint and the second solder joint respectively, and / or includes a portion having a bending radian.

[0016] According to some exemplary embodiments, the projection of the first protective adhesive layer along the direction perpendicular to the first sidewall does not overlap with the projection of the third sidewall along the direction perpendicular to the first sidewall.

[0017] According to some exemplary embodiments, the light-emitting substrate further includes a first welding point protection adhesive disposed at the first welding point and a second welding point protection adhesive disposed at the second welding point. The orthographic projection of the first welding point protection adhesive onto the first base covers at least the orthographic projection of the first welding point onto the first base, and the orthographic projection of the second welding point protection adhesive onto the first base covers at least the orthographic projection of the second welding point onto the first base.

[0018] According to some exemplary embodiments, the orthographic projection of the first welding point protection adhesive onto the first base covers the orthographic projection of the first conductive mat onto the first base, and the orthographic projection of the second welding point protection adhesive onto the first base covers the orthographic projection of the second conductive mat onto the first base.

[0019] According to some exemplary embodiments, the bonding wire is located on a side spaced from the first side wall of the first protection adhesive layer, and there is a gap between the first protection adhesive layer and the bonding wire in a direction perpendicular to the first side wall.

[0020] According to some exemplary embodiments, the light-emitting substrate further includes a second protection adhesive layer, the second protection adhesive layer covers the bonding wire, and further fills the gap between the first protection adhesive layer and the bonding wire.

[0021] According to some exemplary embodiments, the orthographic projection of the second protection adhesive layer onto the first base covers the orthographic projection of the bonding wire onto the first base, and the projection of the second protection adhesive layer along a direction perpendicular to the first side wall covers the projection of the bonding wire along a direction perpendicular to the first side wall.

[0022] According to some exemplary embodiments, the orthographic projection of the second protection adhesive layer onto the first base covers the orthographic projections of the first welding point protection adhesive and the second welding point protection adhesive onto the first base respectively.

[0023] According to some exemplary embodiments, the dimension along the direction perpendicular to the first side wall of the second protective adhesive layer is equal to the dimension along the direction perpendicular to the first side wall of the first protective adhesive layer.

[0024] According to some exemplary embodiments, the dimension along the direction perpendicular to the first side wall of the first protective adhesive layer is between 5 and 500 microns, and / or the Young's modulus of the adhesive material used for each of the first protective adhesive layer and the second protective adhesive layer is between 0.1 Mpa and 80 Gpa.

[0025] According to some exemplary embodiments, the light-emitting diode is a sub-millimeter light-emitting diode or a micro light-emitting diode.

[0026] According to some exemplary embodiments, both the first protective adhesive layer and the second protective adhesive layer include an insulating adhesive material.

[0027] According to some exemplary embodiments, the second protective adhesive layer includes a black adhesive material.

[0028] According to some exemplary embodiments, the diameter of the bonding wire is between 10 and 500 microns.

[0029] According to some exemplary embodiments, the numbers of the light-emitting diode, the first conductive mat, the second conductive mat, and the bonding wire are all plural, and the plural bonding wires electrically connect the plural first conductive mats and the plural second conductive mats respectively.

[0030] In another aspect, a display device including a plurality of such light-emitting substrates is provided.

[0031] In yet another aspect, a method for manufacturing a light-emitting substrate is provided, and the method for manufacturing the light-emitting substrate includes: providing a first substrate including a first base and a first conductive mat disposed on the first base; The step of binding a light-emitting diode to the first substrate; The step of providing a second substrate including a second base and a second conductive mat disposed on the second base; The step of holding the relative positions of the first substrate and the second substrate by disposing the first substrate and the second substrate on a carrier; The step of forming a bonding wire structure so as to electrically connect the first conductive mat and the second conductive mat; The step of inverting the second substrate toward the first substrate so that the surface spaced apart from the second conductive mat of the second base faces the first substrate, the first conductive mat is located on the surface of the first substrate spaced apart from the second substrate, and the second conductive mat is located on the surface of the second substrate spaced apart from the first substrate; The bonding wire structure includes bonding wires, and the bonding wires electrically connect the first conductive mat and the second conductive mat.

[0032] According to some exemplary embodiments, in the step of holding the relative positions of the first substrate and the second substrate by disposing the first substrate and the second substrate on a carrier, the first substrate and the second substrate are spaced apart by a predetermined distance, so that the first conductive mat and the second conductive mat are spaced apart by a predetermined distance, and a first surface of the first conductive mat spaced apart from the first base and a second surface of the second conductive mat spaced apart from the second base are in the same horizontal plane.

[0033] According to some exemplary embodiments, between the step of disposing the first substrate and the second substrate on a carrier and the step of forming a bonding wire structure, the manufacturing method further includes The step of forming a first protective adhesive layer in the gap between the first conductive mat and the second conductive mat, wherein a positive projection of the first protective adhesive layer onto the carrier covers a positive projection of the gap onto the carrier, and a third surface of the first protective adhesive layer spaced apart from the carrier is in the same horizontal plane as the first surface.

[0034] According to some exemplary embodiments, in the step of forming the bonding wire structure, the bonding wire is formed in the plane where the first conductive mat and the second conductive mat are located.

[0035] According to some exemplary embodiments, between the step of forming the bonding wire structure and the step of inverting the second substrate toward the first substrate, further, forming a second protective adhesive layer on a surface of each of the first conductive mat, the second conductive mat, and the bonding wire that is spaced apart from the first base or the second base, and the projection of the second protective adhesive layer in a direction perpendicular to the first surface covers the projection of each of the first conductive mat, the second conductive mat, and the bonding wire in a direction perpendicular to the first surface.

[0036] According to some exemplary embodiments, in the step of holding the relative positions of the first substrate and the second substrate by disposing the first substrate and the second substrate on a carrier, the first conductive mat and the second conductive mat are spaced apart by a predetermined distance, and the first surface of the first conductive mat spaced apart from the first base and the second surface of the second conductive mat spaced apart from the second base are in different horizontal planes, so that the first substrate and the second substrate are spaced apart by a predetermined distance.

[0037] According to some exemplary embodiments, between the step of disposing the first substrate and the second substrate on a carrier and the step of forming the bonding wire structure, further, forming a first protective adhesive layer to cover at least a first sidewall adjacent to the first conductive mat of the first substrate and a second sidewall adjacent to the second conductive mat of the second substrate.

[0038] According to some exemplary embodiments, in the step of forming the bonding wire structure, one end of the bonding wire is welded to the first conductive mat to form a first welding point on the first conductive mat, and the other end of the bonding wire is welded to the second conductive mat to form a second welding point on the second conductive mat. The bonding wire forms a certain included angle with the plane where the first base is located at the first welding point and the second welding point respectively, and / or includes a portion having a bending radian.

[0039] According to some exemplary embodiments, between the step of forming the bonding wire structure and the step of inverting the second substrate towards the first substrate, further, The step of forming a first welding point protection adhesive and a second welding point protection adhesive in the regions where the first welding point and the second welding point are located respectively by performing a dispensing process on the regions where the first welding point and the second welding point are located.

[0040] According to some exemplary embodiments, after the step of inverting the second substrate towards the first substrate, the manufacturing method further includes, The step of forming a second protective adhesive layer so as to cover the first conductive mat, the bonding wire, and the second conductive mat.

[0041] According to some exemplary embodiments, before the step of inverting the second substrate towards the first substrate, the manufacturing method further includes, The step of attaching an adhesive backing to one of the surface of the first base separated from the first conductive mat and the surface of the second base separated from the second conductive mat. Here, in the step of inverting the second substrate towards the first substrate, the other of the surface of the first base separated from the first conductive mat and the surface of the second base separated from the second conductive mat is attached to the adhesive backing.

[0042] According to some exemplary embodiments, the first substrate includes a first sidewall adjacent to the at least one first conductive mat, and the second substrate includes a second sidewall adjacent to the at least one second conductive mat. In the step of inverting the second substrate toward the first substrate, the first protective adhesive layer is brought into contact with at least the first sidewall and the second sidewall.

[0043] According to some exemplary embodiments, the distance between the first substrate and the second substrate is greater than the sum of the thickness of the first substrate and the thickness of the second substrate.

[0044] According to some exemplary embodiments, the step of forming the first protective adhesive layer specifically includes: forming a protective film on the first substrate, the protective film covering the light-emitting diode and the first conductive mat; forming a first protective adhesive material layer on the first substrate, the first protective adhesive material layer covering at least the first sidewall adjacent to the first conductive mat of the first substrate, and the orthographic projection of the first protective adhesive material layer onto the first base further at least partially overlapping the orthographic projections of the first conductive mat and the protective film onto the first base; exposing the first conductive mat by removing at least a part of the protective film and the overlapping part of the first protective adhesive material layer and the protective film.

Brief Description of the Drawings

[0045] By describing the present disclosure with reference to the drawings below, other objects and advantages of the present disclosure will be apparent and can contribute to a comprehensive understanding of the present disclosure.

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Mode for Carrying Out the Invention

[0046] In the following, for the purpose of explanation, many specific details are described to provide a comprehensive understanding of various exemplary embodiments. However, as is clear, various exemplary embodiments can be implemented without these specific details or with one or more equivalent arrangements. In other cases, by showing known structures and devices in the form of block diagrams, it is avoided that various exemplary embodiments are unnecessarily blurred. Also, various exemplary embodiments may be different but do not need to be exclusive. For example, without departing from the concept of the invention, the specific shapes, configurations, and characteristics of the exemplary embodiments can be used or implemented in other exemplary embodiments.

[0047] In the drawings, for clarity and / or for the purpose of description, the dimensions and relative dimensions of elements can be enlarged. Thus, the dimensions and relative dimensions of each element are not limited to the dimensions and relative dimensions shown in the figures. When exemplary embodiments can be implemented differently, the specific process order can be executed differently from the order described. For example, two consecutively described processes can be executed basically simultaneously or in the order reverse to the described order. Also, the same reference numerals indicate the same components.

[0048] When an element is described as being "above" another element and "connected" or "coupled" to the other element, the element may be directly located above the other element and directly connected or directly coupled to the other element, or there may be intermediate elements. However, when an element is described as being "directly located" above another element and "directly connected" or "directly coupled" to the other element, there are no intermediate elements. Other terms and / or expressions for describing the relationship between elements should be interpreted in a similar manner. For example, "located between..." corresponds to "directly located between...", "adjacent" corresponds to "directly adjacent", or "located on..." corresponds to "directly located on...". Also, the term "connection" can refer to physical connection, electrical connection, communication connection, and / or fluid connection. Further, the X-axis, Y-axis, and Z-axis are not limited to the three axes of a rectangular coordinate system and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be perpendicular to each other or may represent different directions that are not perpendicular to each other. For the purposes of the present disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z such as XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the recited related items.

[0049] Note that here, terms such as "first" and "second" can be used to describe different elements, but it should be understood that these elements should not be limited to these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the exemplary embodiments, the first element can be named the second element, and similarly, the second element can be named the first element.

[0050] In this specification, an inorganic light-emitting diode refers to a light-emitting element made of an inorganic material, where an LED indicates an inorganic light-emitting element different from an OLED. Specifically, the inorganic light-emitting element can include a submillimeter light-emitting diode (abbreviated as Mini LED in English) and a micro light-emitting diode (abbreviated as Micro LED in English). Here, a micro light-emitting diode (i.e., MicroLED) refers to an ultra-small light-emitting diode with a grain size of 100 microns or less, and a submillimeter light-emitting diode (i.e., Mini LED) refers to a small light-emitting diode with a grain size between that of a Micro LED and a conventional LED. For example, the grain size of a Mini LED can be between 100 and 300 microns, and the grain size of a Micro LED can be between 10 and 100 microns.

[0051] Some exemplary embodiments of the present disclosure provide a light-emitting substrate, a method for manufacturing the same, and a display device including the light-emitting substrate. For example, some embodiments of the present disclosure provide a light-emitting substrate including a first substrate, a second substrate, and a bonding wire structure. The first substrate includes a first base, a light-emitting diode installed on the first base, and a first conductive mat installed on the first base. The second substrate is installed opposite to the first substrate and includes a second base and a second conductive mat installed on the second base. The bonding wire structure includes bonding wires. Here, the first conductive mat is located on a surface of the first substrate that is spaced apart from the second substrate, the second conductive mat is located on a surface of the second substrate that is spaced apart from the first substrate, and the bonding wires electrically connect the first conductive mat and the second conductive mat. In this way, the structure of the light-emitting substrate can be simplified and the complexity of the process can be reduced, improving the product yield and saving the manufacturing cost.

[0052] Wire Bonding is a process of tightly welding a metal bonding wire and a substrate pad using heat, pressure, or ultrasonic energy. For example, in an IC package, wire bonding can connect the lands of a semiconductor chip and the I / O bonding wires of a microelectronic package or the metal wiring lands on a substrate with a metal filament. The principle of wire bonding is to adopt methods such as heating, pressurizing, or ultrasonic waves to break the oxide layer and contamination on the welding surface, causing plastic deformation, so that the metal bonding wire comes into close contact with the welding surface, reaches the atomic attraction range, and causes atomic diffusion between interfaces to form a welding point.

[0053] FIG. 1 is a schematic plan view of a light-emitting substrate according to some exemplary embodiments of the present disclosure. For the sake of explanation, FIG. 1 shows the state before the first substrate and the second substrate included in the light-emitting substrate are folded or inverted. FIG. 2 is a flowchart of a method for manufacturing a light-emitting substrate according to an exemplary embodiment of the present disclosure. FIGS. 3A to 3H are cross-sectional views schematically showing the structures formed after some steps of the method for manufacturing the light-emitting substrate are executed. Referring to FIGS. 1 to 3H, the method for manufacturing the light-emitting substrate can be executed according to the following steps.

[0054] In step S101, a first substrate 100 is provided.

[0055] Referring to FIGS. 1 and 3A, the first substrate 100 can include a first base 1, a plurality of first electrodes 2 and a plurality of first conductive mats 3 installed on the first base 1. The plurality of first conductive mats 3 are located at the edge positions of the first substrate 100. For example, the plurality of first conductive mats 3 are located in the fan-out region (i.e., the fan-out region) of the first substrate 100 and are used to electrically connect the signal lines located on the first substrate 100 (for example, some signal lines 150 are schematically shown in FIG. 1) to an external drive circuit.

[0056] For example, the material of the first base 1 can include, but is not limited to, glass, quartz, plastic, silicon, polyimide, etc. The first electrode 2 and the first conductive mat 3 may have a columnar structure. The materials of the first electrode 2 and the first conductive mat 3 can include, for example, conductive materials such as metal materials. Specifically, it may be at least one or a combination of at least two selected from gold, silver, copper, aluminum, molybdenum, gold alloy, silver alloy, copper alloy, aluminum alloy, molybdenum alloy, etc. The embodiments of the present disclosure are not limited thereto.

[0057] For example, the first substrate 100 may further include a driving circuit 4 electrically connected to the plurality of first electrodes 2, and the driving circuit 4 is installed on the first base 1. The driving circuit 4 can be used to provide an electrical signal to the light-emitting diode chips formed on the plurality of first electrodes 2 subsequently and control their emission luminance. For example, in some examples, the driving circuit 4 may be a plurality of pixel driving circuits connected in a one-to-one correspondence with each light-emitting diode chip, or may have a structure such as a plurality of micro-integrated circuit chips connected in a one-to-one correspondence with each light-emitting diode chip, and can control each light-emitting diode chip to emit different luminance gradations. Note that the specific circuit structure of the driving circuit 4 on the first substrate 100 can be installed according to actual needs, and the embodiments of the present disclosure are not particularly limited. Hereinafter, the driving circuit 4 will be exemplarily described with reference to the drawings.

[0058] In step S102, a plurality of light-emitting diodes 5 are transferred to and bound to the first substrate 100.

[0059] Referring to FIGS. 1 and 3B, each of the plurality of light-emitting diodes 5 includes an N electrode and a P electrode. The N electrode and the P electrode of the light-emitting diode 5 are respectively connected to the corresponding first electrodes 2, and the surfaces of the plurality of first conductive mats 3 are exposed to the outside.

[0060] Referring to FIG. 1, a plurality of light-emitting diodes are arranged in an array along a first direction X and a second direction Y. For example, the first direction X is the row direction, and the second direction Y is the column direction. Naturally, the embodiments of the present disclosure are not limited thereto, and the first direction and the second direction may be any directions, as long as the first direction and the second direction intersect. Also, the plurality of light-emitting diodes are not limited to being arranged along a straight line, and may be arranged along a curve, arranged in a ring shape, or arranged in any manner, which can be determined according to actual needs, and the embodiments of the present disclosure are not particularly limited.

[0061] A plurality of first conductive mats 3 are arranged at the edge positions of the first substrate 100 along the first direction X, that is, the plurality of first conductive mats 3 constitute a first conductive mat row. For example, the plurality of first conductive mats 3 are arranged at equal intervals along the first direction X. The dimension of each first conductive mat 3 along the first direction X is L1, and the distance along the first direction X between two adjacent first conductive mats 3 is D1. The sum of the dimension L1 of any first conductive mat 3 along the first direction X and the distance D1 along the first direction X between two adjacent first conductive mats 3 can be called the arrangement period of the first conductive mat 3. In some examples, the arrangement period is greater than 40 microns.

[0062] For example, the light-emitting diode can use a micro light-emitting diode (Micro-LED) or a submillimeter light-emitting diode (Mini-LED).

[0063] In step S103, a second substrate 200 is provided, and the first substrate 100 and the second substrate 200 are arranged on a carrier 300.

[0064] For example, the second substrate 200 may be a circuit board such as a PCB (Printed Circuit Board), an FPC (Flexible Printed Circuit), or a COF (Chip On Film).

[0065] Referring to FIG. 3C, the second substrate 200 may include a second base 6 and a plurality of second conductive mats 7 installed on the second base 6. For example, the plurality of second conductive mats 7 can be arranged along the first direction X (the direction perpendicular to the paper surface in FIG. 3C), that is, the plurality of second conductive mats 7 constitute a second conductive mat row. For example, the plurality of second conductive mats 7 can correspond one-to-one with the plurality of first conductive mats 3. That is, the arrangement period of the second conductive mats 7 is the same as the arrangement period of the first conductive mats 3.

[0066] Of course, the second substrate 200 can further include an external drive circuit installed on the second base 6, for example, an integrated circuit chip, but the embodiments of the present disclosure are not limited thereto.

[0067] The carrier 300 is used to maintain the relative positional relationship between the first substrate 100 and the second substrate 200 by fixing them at a distance. Referring to FIG. 3C, the first conductive mat 3 installed on the first substrate 100 has a first surface 31 (shown as the upper surface in the figure) spaced from the first base 1, and the second conductive mat 7 installed on the second substrate 200 has a second surface 71 (shown as the upper surface in the figure) spaced from the second base 6. Due to the fixing action of the carrier 300, the first substrate 100 and the second substrate 200 are separated by a predetermined distance. Accordingly, the first conductive mat row where the first conductive mat 3 is located and the second conductive mat row where the second conductive mat 7 is located are also separated by a predetermined distance, and the first surface 31 of the first conductive mat 3 and the second surface 71 of the second conductive mat 7 are in the same horizontal plane, thereby ensuring that the subsequent bonding wires are drawn out in one plane. For example, in some exemplary embodiments, the predetermined distance may be equal to or greater than the sum of the thicknesses of the first substrate 100 and the second substrate 200 and less than 1.5 times the sum of the thicknesses of the first substrate 100 and the second substrate 200. Also for example, the predetermined distance may be substantially equal to the sum of the thicknesses of the first substrate 100 and the second substrate 200.

[0068] In step S104, referring to FIGS. 3C and 3D, a first protective adhesive layer 8 is formed within a gap 400 between a first conductive mat row where the first conductive mat 3 is located and a second conductive mat row where the second conductive mat 7 is located.

[0069] For example, a protective adhesive with a certain thickness can be applied within the gap 400. The protective adhesive at least fills the gap 400, and due to the limitation of coating accuracy, the protective adhesive may further cover at least a part of the surfaces of the first conductive mat 3 and the second conductive mat 7 located on both sides of the gap 400. However, the part of the protective adhesive covering the first conductive mat 3 and the second conductive mat 7 can be removed by laser ablation or film removal methods later to avoid affecting subsequent processes, thereby obtaining the first protective adhesive layer 8 filled only in the gap 400. As can be understood, the orthographic projection of the first protective adhesive layer 8 onto the carrier 300 covers the orthographic projection of the gap 400 onto the carrier 300.

[0070] Referring to FIG. 3D, the side wall of the first protective adhesive layer 8 close to the first substrate 100 contacts the first conductive mat 3, and the side wall of the first protective adhesive layer 8 close to the second substrate 100 contacts the second conductive mat 7.

[0071] For example, the first protective adhesive layer 8 includes a third surface 81 spaced apart from the carrier 300. The third surface 81, the first surface 31, and the second surface 71 are substantially in the same horizontal plane, thereby ensuring that subsequent bonding wires are formed on a flat surface.

[0072] For example, the thickness of the first protective adhesive layer 8 is in the range of 5 to 500 microns, and the specific value is the same as the thickness of the first conductive mat 3 and / or the second conductive mat 7. The Young's modulus of the material used for the first protective adhesive layer 8 is between 0.1 Mpa and 80 Gpa. For example, the material may be silica gel or polydimethylsiloxane (i.e., PDMS).

[0073] In step S105, a bonding wire 9 is formed so that the first conductive mat 3 and the second conductive mat 7 are electrically connected.

[0074] Referring to FIG. 3E, the bonding wire 9 is formed such that one end 91 is connected to the first conductive mat 3 and the other end 92 is connected to the second conductive mat 7. That is, one end 91 of the bonding wire 9 is welded to the first conductive mat 3 and the other end 92 is welded to the second conductive mat 7. Referring to FIG. 3H, the weld point where the end 91 is welded to the first conductive mat 3 is called the first weld point 911, and the weld point where the end 92 is welded to the second conductive mat 7 is called the second weld point 921.

[0075] In the embodiment shown in FIG. 3E, the bonding wire 9 basically extends in the plane in which the first conductive mat 3 and the second conductive mat 7 are located, which is advantageous for subsequent bending processes.

[0076] For example, the first weld point 911 may be a wedge-shaped weld point, that is, the shape of the orthographic projection of the first weld point 911 onto the first base 1 is wedge-shaped. In this case, the height of the first weld point 911 on the first conductive mat 3 can be controlled to be between 1 and 10 microns. The diameter of the bonding wire 9 can be between 10 and 500 microns. The height of the first weld point 911 on the first conductive mat 3 is smaller than the diameter of the bonding wire 9, so that the bonding wire 9 can basically extend in the plane in which the first conductive mat 3 and the second conductive mat 7 are located.

[0077] For example, the bonding wire 9 can be made of a metal such as Cu, Al, Au, Ag or an alloy thereof.

[0078] Referring to FIGS. 1 and 3E together, each bonding wire 9 electrically connects one first conductive mat 3 and the corresponding second conductive mat 7. Since the plurality of first conductive mats 3 are arranged at equal intervals along the first direction X, the plurality of bonding wires 9 are also arranged at equal intervals along the first direction X.

[0079] For example, the diameter of the bonding wire 9 may be between 10 and 500 microns. When the first weld point 911 is a wedge-shaped weld point, the dimension L1 is about 1.2 to 3 times the diameter of the bonding wire.

[0080] It should be understood that the arrangement period of the plurality of first conductive mats 3 is related to the diameter of the bonding wire 9 and is further related to the wiring design on the first substrate 100.

[0081] In step S106, a second protective adhesive layer 11 is formed on the surfaces of the first conductive mat 3, the second conductive mat 7, and the bonding wire 9 that are spaced apart from the first base 1 and the second base 6, respectively.

[0082] Referring to FIG. 3F, the orthographic projection of the second protective adhesive layer 11 in the direction perpendicular to the first surface 31 covers the orthographic projections of the first conductive mat 3, the second conductive mat 7, and the bonding wire 9 in the direction perpendicular to their respective first surfaces 31. In this way, the bonding wire 9 and the weld points between the first conductive mat 3 and the second conductive mat 7 and the bonding wire 9 can be protected.

[0083] For example, the thickness of the second protective adhesive layer 11 is in the range of 5 to 500 microns, and the Young's modulus of the material used for the second protective adhesive layer 11 may be between 0.1 Mpa and 80 Gpa. For example, the material may be silica gel or polydimethylsiloxane (i.e., PDMS).

[0084] In some examples, the thickness of the second protective adhesive layer 11 may be substantially equal to the thickness of the first protective adhesive layer 8. In this way, it can be ensured that the bonding wire 9 is in the neutral layer of the upper and lower two protective adhesive layers.

[0085] Specifically, referring to FIGS. 4A and 4B, the bonding wire 9 is sandwiched between the first protective adhesive layer 8 and the second protective adhesive layer 11 to form a laminated structure. When the laminated structure is bent, the upper second protective adhesive layer 11 is subjected to the action of tensile stress, and the lower first protective adhesive layer 8 is subjected to the action of compressive stress. Since the thickness of the second protective adhesive layer 11 is substantially equal to the thickness of the first protective adhesive layer 8, the stress received by the bonding wire 9 at the intermediate position is almost zero, that is, the bonding wire 9 is in the bending neutral layer. In this way, the amount of deformation of the bonding wire can be reduced, and the reliability can be improved.

[0086] In step S107, an underlay 12 is attached to either one of the surface spaced from the first conductive mat 3 of the first base 1 and the surface spaced from the second conductive mat 7 of the second base 6. For example, referring to FIG. 3G, the underlay 12 is attached to the surface spaced from the first conductive mat 3 of the first base 1.

[0087] In step S108, referring to FIGS. 3G and 3H together, by inverting the second substrate 200 toward the first substrate 100, the surface spaced from the second conductive mat 7 of the second base 6 is attached to the underlay 12.

[0088] In this way, the second substrate 200 can be bent to the back surface of the first substrate 100, and the two substrates 100 and 200 can be integrally attached by the underlay 12.

[0089] For example, in the process of inverting the second substrate 200, the second substrate 200 is rotated to the lower surface of the first substrate 100 by a carrier 300 having a fixed rotation locus, so as to ensure the stability of the inversion process and reduce the risk of the bonding wire 9 breaking.

[0090] Continuing to refer to FIG. 3H, in step S108, by inverting the second substrate 200, the surface further spaced from the bonding wire 9 of the first protective adhesive layer 8 is brought into contact with the first substrate 100, the back paste 12, and the second substrate 200. Specifically, the surface spaced from the bonding wire 9 of the first protective adhesive layer 8 contacts the side wall of the first substrate 100, the side wall of the back paste 12, and the side wall of the second substrate 200. In such a form, the side wall of the first substrate 100, the side wall of the back paste 12, and the side wall of the second substrate 200 completely support the first protective adhesive layer 8, thereby completely supporting the bonding wire 9 and improving the reliability.

[0091] In the method for manufacturing a light-emitting substrate according to an embodiment of the present disclosure, by manufacturing a bonding wire through a wire bonding process and inverting the substrate to form an upper and lower substrate stacking structure, the complexity of the process can be reduced and the manufacturing cost can be reduced.

[0092] FIG. 5 is a flowchart showing a method for manufacturing a light-emitting substrate according to an exemplary embodiment of the present disclosure. FIGS. 6A to 6H are cross-sectional views schematically showing the structures formed after some steps of the method for manufacturing the light-emitting substrate are executed. Referring to FIGS. 1, 5 to 6H together, the method for manufacturing the light-emitting substrate can be executed according to the following steps.

[0093] It should be noted that hereinafter, the differences from the embodiments shown in FIGS. 2 to 3H will be mainly described, and for the same parts, reference can be made to the above description.

[0094] In step S201, the first substrate 100 is provided.

[0095] Referring to FIGS. 1 and 6A, the first substrate 100 can include a first base 1, a plurality of first electrodes 2 and a plurality of conductive mats 3 installed on the first base 1. The plurality of first conductive mats 3 are located at the edge positions of the first substrate 100.

[0096] In step S202, a plurality of light-emitting diodes 5 are transferred to the first substrate 100 and bonded thereto.

[0097] Referring to FIGS. 1 and 6B, each of the plurality of light-emitting diodes 5 includes an N electrode and a P electrode. The N electrode and the P electrode of the light-emitting diode 5 are respectively connected to the corresponding first electrode 2, and the surfaces of the plurality of first conductive mats 3 are exposed to the outside.

[0098] In step S203, a second substrate 200 is provided, and the first substrate 100 and the second substrate 200 are disposed on a carrier 300'.

[0099] The carrier 300' is used to maintain the relative positional relationship between the first substrate 100 and the second substrate 200 by fixing them with a space therebetween. Referring to FIG. 6C, the first conductive mat 3 installed on the first substrate 100 has a first surface 31 (shown as the upper surface in the figure) spaced apart from the first base 1, and the second conductive mat 7 installed on the second substrate 200 has a second surface 71 (shown as the upper surface in the figure) spaced apart from the second base 6. Due to the fixing action of the carrier 300', the first substrate 100 and the second substrate 200 are separated by a predetermined distance. Accordingly, the first conductive mat row where the first conductive mat 3 is located and the second conductive mat row where the second conductive mat 7 is located are also separated by a predetermined distance.

[0100] Specifically, the first substrate 100 and the second substrate 200 are separated by a certain distance in both the second direction Y and the third direction Z. Here, the third direction Z may be a direction perpendicular to the plane in which the first direction X and the second direction Y are located, and is shown as the height direction in FIG. 6C. For example, the distance between the first substrate 100 and the second substrate 200 in the second direction Y is S1 (hereinafter referred to as the first interval distance), and the distance between the first substrate 100 and the second substrate 200 in the third direction Z is S2 (hereinafter referred to as the second interval distance).

[0101] For example, the first interval distance S1 may be equal to or greater than the sum of the thicknesses of the first substrate 100 and the second substrate 200, and may be less than 1.5 times the sum of the thicknesses of the first substrate 100 and the second substrate 200. Further, for example, the first interval distance S1 may be made substantially equal to the sum of the thicknesses of the first substrate 100 and the second substrate 200.

[0102] A second interval distance S2 exists between the first substrate 100 and the second substrate 200. Accordingly, the first surface 31 of the first conductive mat 3 and the second surface 71 of the second conductive mat 7 are not located on the same horizontal plane, and there is a height difference between the two. In the example of FIG. 6C, the first surface 31 is higher than the second surface 71, and the height difference between the two is the second interval distance S2. Here, the second interval distance S2 is mainly caused by the thickness difference between the first base 1 and the second base 6. For example, the second interval distance S2 here may be between 0 and 2 millimeters, and for example, may be about 1 millimeter.

[0103] In step S204, with continued reference to FIGS. 6C and 6D, a first protective adhesive layer 8' is formed so as to cover at least the first side wall 101 adjacent to the first conductive mat 3 of the first substrate 100 and the second side wall 201 adjacent to the second conductive mat 7 of the second substrate 200.

[0104] Furthermore, the first protective adhesive layer 8' further covers and is in direct contact with an edge portion 102 located between the first conductive mat 3 and the first side wall 101 on the first substrate 100, and an edge portion 202 located between the second conductive mat 7 and the second side wall 201 on the second substrate 200.

[0105] For example, a protective adhesive of a certain thickness can be applied to all of the first conductive mat 3, the edge portion 102, the first side wall 101, the second conductive mat 7, the edge portion 202, and the second side wall 201. Then, the portions of the protective adhesive covering the first conductive mat 3 and the second conductive mat 7 can be removed by laser ablation or film removal methods to avoid affecting subsequent processes.

[0106] For example, the thickness of the first protective adhesive layer 8' is in the range of 5 to 500 microns, and the specific value is the same as the thickness of the first conductive mat 3 and / or the second conductive mat 7. The Young's modulus of the material used for the first protective adhesive layer 8' may be between 0.1 Mpa and 80 Gpa. For example, the material may be silica gel or polydimethylsiloxane (i.e., PDMS).

[0107] As an option, step S204 can be specifically executed according to the following steps.

[0108] In step S2041, referring to FIG. 7A, a protective film 801 is formed on the first substrate 100. The protective film 801 can cover the entire surface of the first substrate 100, that is, the orthographic projection of the protective film 801 on the first base 1 covers the orthographic projection of the plurality of light-emitting diodes on the first base 1, and further covers the orthographic projection of the plurality of first conductive mats 3 on the first base 1. For example, the thickness of the protective film 801 may be between 1 and 100 microns.

[0109] As shown in FIG. 7A, a sealing layer 501 can be installed on the side of the light-emitting diode 5 away from the first base 1.

[0110] In step S2042, a first protective adhesive material layer 8'' is formed on the first substrate 100. The first protective adhesive material layer 8'' covers at least the first side wall 101 adjacent to the first conductive mat 3 of the first substrate 100.

[0111] Referring to FIG. 7B, the orthographic projection of the first protective adhesive material layer 8'' on the first base 1 at least partially overlaps with the orthographic projection of the first conductive mat 3 on the first base 1. That is, the orthographic projection of the first protective adhesive material layer 8'' on the first base 1 at least partially overlaps with the orthographic projection of the protective film 801 on the first base 1. In other words, the first protective adhesive material layer 8'' covers a part of the protective film 801.

[0112] In step S2043, at least a part of the protective film 801 is removed to expose the first conductive mat 3.

[0113] For example, by adopting the methods of laser cutting and laser peeling (e.g., the LLO process), the portion covering the first conductive mat 3 of the protective film 801 can be removed. In this way, at the same time, the overlapping portion of the first protective adhesive material layer 8'' and the protective film 801 can be removed, and the first conductive mat 3 can be exposed. Alternatively, by directly adopting the method of laser ablation, the portion covering the first conductive mat 3 of the first protective adhesive material layer 8'' and the protective film 801 can be removed simultaneously, and the purpose of exposing the first conductive mat 3 can also be achieved.

[0114] As an option, in step S2043, as shown in FIG. 7D, the portions covering the plurality of light-emitting diodes in the protective film 801 can be removed simultaneously.

[0115] In step S205, a bonding wire 9 is formed so that the first conductive mat 3 and the second conductive mat 7 are electrically connected.

[0116] Referring to FIG. 6E, the bonding wire 9 is formed such that one end 91 is connected to the first conductive mat 3 and the other end 92 is connected to the second conductive mat 7. That is, for the bonding wire 9, one end 91 is welded to the first conductive mat 3 and the other end 92 is welded to the second conductive mat 7. The welding point where the end 91 is welded to the first conductive mat 3 is called the first welding point 911, and the welding point where the end 92 is welded to the second conductive mat 7 is called the second welding point 921.

[0117] In the embodiment shown in FIG. 6E, the bonding wire 9 is a bonding wire having a certain radian. Specifically, the bonding wire 9 forms a certain included angle with the plane where the first base is located at the first welding point 911 and the second welding point 921 respectively, and / or includes a portion having a curved radian. In this way, the processing difficulty can be reduced.

[0118] For example, the first welding point 911 may be a spherical welding point, that is, the shape of the orthographic projection of the first welding point 911 onto the first base 1 may be circular or substantially circular. In this case, due to the thermal effect of the welding process, as shown in FIG. 6E, the bonding wire 9 extending from the first welding point 911 forms a certain included angle with the plane where the first base is located and / or has a portion with a bending curvature. In some exemplary embodiments, the distance h1 and / or h2 from this portion in the direction perpendicular to the direction of the plane where the first base is located is 100 microns or more, for example, within the range of 100 to 500 microns.

[0119] For example, the bonding wire 9 can be made of a metal such as Cu, Al, Au, Ag or an alloy thereof.

[0120] Referring to FIGS. 1 and 6E together, each bonding wire 9 electrically connects one first conductive mat 3 and the corresponding second conductive mat 7. Since the plurality of first conductive mats 3 are arranged at equal intervals along the first direction X, the plurality of bonding wires 9 are also arranged at equal intervals along the first direction X.

[0121] For example, the diameter of the bonding wire 9 may be between 10 and 500 microns. When the first welding point 911 is a spherical welding point, the above dimension L1 is about 2 to 5 times the diameter of the bonding wire.

[0122] It should be understood that the arrangement period of the plurality of first conductive mats 3 is related to the diameter of the bonding wire 9 and further related to the wiring design on the first substrate 100.

[0123] In step S206, referring to FIG. 6F, a dispensing process is performed on the region where the first welding point 911 and the second welding point 921 are located.

[0124] For example, by applying a protective adhesive to both the regions where the first solder joint 911 and the second solder joint 921 are located, a first solder joint protective adhesive 912 and a second solder joint protective adhesive 922 are formed in the regions where the first solder joint 911 and the second solder joint 921 are located, respectively. The orthographic projection of the first solder joint protective adhesive 912 onto the first substrate 100 covers the orthographic projection of the first solder joint 911 onto the first substrate 100, and the orthographic projection of the second solder joint protective adhesive 922 onto the second substrate 200 covers the orthographic projection of the second solder joint 921 onto the second substrate 200. In this way, the first solder joint and the second solder joint can be protected. For example, the first solder joint protective adhesive 912 and the second solder joint protective adhesive 922 are adhesives having viscosity and insulation to protect the first solder joint and the second solder joint well.

[0125] In step S207, an underlay 12 is pasted on either one of the surface spaced apart from the first conductive mat 3 of the first base 1 and the surface spaced apart from the second conductive mat 7 of the second base 6. For example, referring to FIG. 6G, the underlay 12 is pasted on the surface spaced apart from the first conductive mat 3 of the first base 1.

[0126] In step S208, referring to FIGS. 6G and 6H together, by inverting the second substrate 200 toward the first substrate 100, the surface spaced apart from the second conductive mat 7 of the second base 6 is pasted on the underlay 12.

[0127] In this way, the second substrate 200 can be bent to the back surface of the first substrate 100, and the two substrates 100 and 200 can be integrally pasted by the underlay 12.

[0128] For example, in the process of inverting the second substrate 200, the second substrate 200 is rotated to the lower surface of the first substrate 100 by a carrier 300 having a fixed rotation locus, so as to ensure the stability of the inversion process and reduce the risk of the bonding wire 9 breaking.

[0129] Referring to FIG. 6H, after the surface that is separated from the second conductive mat 7 of the second base 6 by inverting the second substrate 200 is attached to the back glue 12, the first protective adhesive layer 8' does not cover the side wall of the back glue 12.

[0130] As described above, the first spacing distance S1 between the two substrates is larger than the sum of the thickness of the first substrate 100 and the thickness of the second substrate 200. Accordingly, the length of the formed bonding wire 9 is larger than the sum of the thickness of the first substrate 100 and the thickness of the second substrate 200. In this way, in the process of inverting the second substrate 200, it can be ensured that the bonding wire 9 is not torn off, and the risk of the bonding wire 9 breaking can be reduced.

[0131] In step S209, referring to FIG. 6H, a second protective adhesive layer 11' is formed so as to cover the first conductive mat 3, the bonding wire 9 and the second conductive mat 7.

[0132] Furthermore, the second protective adhesive layer 11' further covers the side wall of the first substrate 100, the side wall of the back glue 12 and the side wall of the second substrate 200.

[0133] For example, the thickness of the second protective adhesive layer 11' is in the range of 5 to 500 microns, and the Young's modulus of the material used for the second protective adhesive layer 11' may be between 0.1 Mpa and 80 Gpa. For example, the material may be silica gel or polydimethylsiloxane (i.e., PDMS).

[0134] As an option, in step S2043 above, it may not be necessary to remove the portion covering the plurality of light-emitting diodes in the protective film 801. The removal of the portion covering the plurality of light-emitting diodes in the protective film 801 may be performed after step S209. In this way, the light-emitting diodes can be protected during the manufacturing process.

[0135] For example, in step S209, since it is limited to the accuracy control problem of the dispensing process, there may be a possibility of introducing an extra protective adhesive into the area where the light-emitting diode is located. After step S209, the portions of the protective film 801 that cover the plurality of light-emitting diodes can be removed, and the extra protective adhesive can be removed simultaneously, achieving the overall peeling of the protective film and the extra protective adhesive thereon.

[0136] In the method for manufacturing a light-emitting substrate according to an embodiment of the present disclosure, a bonding wire can be manufactured by a wire bonding process, and by inverting the substrate to form an upper and lower substrate stacked structure, the complexity of the process can be reduced and the manufacturing cost can be reduced.

[0137] Some exemplary embodiments of the present disclosure further provide a light-emitting substrate. For example, referring to FIGS. 3H and 6H, the light-emitting substrate includes a first substrate 100, a second substrate 200, and an adhesive 12 that are stacked, and the adhesive 12 is disposed between the first substrate 100 and the second substrate 200 to integrally attach the first substrate 100 and the second substrate 200.

[0138] The first substrate 100 includes a first base 1, a plurality of light-emitting diodes disposed on the first base 1, and at least one first conductive mat 3 disposed on the first base 1. The first conductive mat 3 is located on the surface of the first substrate 100 that is spaced apart from the second substrate 200.

[0139] The second substrate 200 includes a second base 6 and at least one second conductive mat 7 disposed on the second base 2. The second conductive mat 7 is located on the surface of the second substrate 200 that is spaced apart from the first substrate 100.

[0140] The light-emitting substrate further includes at least one bonding wire structure 90, and the bonding wire structure 90 electrically connects the first conductive mat 3 and the second conductive mat 7.

[0141] Each bonding wire structure 90 includes a bonding wire 9, a first welding point 911, and a second welding point 921. The first welding point 911 is a welding point where one end of the bonding wire 9 is welded to the first conductive mat 3, and the second welding point 921 is a welding point where the other end of the bonding wire 9 is welded to the second conductive mat 7.

[0142] Referring to FIG. 3H, the light-emitting substrate further includes a first protective adhesive layer 8. The first protective adhesive layer 8 contacts at least the first side wall 101 of the first substrate 100 and the second side wall 201 of the second substrate 200. The first side wall 101 is a side wall adjacent to the first conductive mat 3 of the first substrate 100. The second side wall 201 is a side wall adjacent to the second conductive mat 7 of the second substrate 200.

[0143] Continuing to refer to FIG. 3H, the first protective adhesive layer 8 further contacts the side wall of the backing 12. The orthographic projections of the side wall of the backing 12, the first side wall 101, and the second side wall 201 onto the first substrate 100 overlap each other.

[0144] The light-emitting substrate further includes a second protective adhesive layer 11. The bonding wire 9 is sandwiched between the first protective adhesive layer 8 and the second protective adhesive layer 11.

[0145] Continuing to refer to FIG. 3H, the projection of the second protective adhesive layer 11 along the direction perpendicular to the first side wall 101 covers the projection of the bonding wire 9 along the direction perpendicular to the first side wall 101. And the orthographic projection of the second protective adhesive layer 11 onto the first base 1 covers the orthographic projections of the first conductive mat 3 and the second conductive mat 7 onto the first base 1 respectively. In this way, the second protective adhesive layer 11 can protect the bonding wire, the welding point, and the conductive mat.

[0146] The surface of the first protective adhesive layer 8 that is spaced apart from the first sidewall 101 contacts the bonding wire 9, and the surface of the second protective adhesive layer 11 that is close to the first sidewall 101 contacts the bonding wire 9. In this way, the bonding wire 9 can be sandwiched between the first protective adhesive layer 8 and the second protective adhesive layer 11 to obtain good protection.

[0147] For example, the dimension (i.e., thickness) along the direction perpendicular to the first sidewall 101 of the second protective adhesive layer 11 is equal to the dimension (i.e., thickness) along the direction perpendicular to the first sidewall 101 of the first protective adhesive layer 8.

[0148] Referring to FIG. 6H, the bonding wire 9 has a certain arc at both the first welding point 911 and the second welding point 921.

[0149] The light-emitting substrate further includes a first protective adhesive layer 8'. The first protective adhesive layer 8 contacts at least the first sidewall 101 of the first substrate 100 and the second sidewall 201 of the second substrate 200. The first protective adhesive layer 8' does not contact the sidewall of the backing 12. That is, the projection of the first protective adhesive layer 8' along the direction perpendicular to the first sidewall 101 does not overlap with the projection of the backing 12 along the direction perpendicular to the first sidewall 101.

[0150] The light-emitting substrate further includes a first welding point protective adhesive 912 and a second welding point protective adhesive 922. The orthographic projection of the first welding point protective adhesive 912 onto the first base 1 covers at least the orthographic projection of the first welding point 911 onto the first base 1, and the orthographic projection of the second welding point protective adhesive 922 onto the first base 1 covers at least the orthographic projection of the second welding point 921 onto the first base 1. As an option, the orthographic projection of the first welding point protective adhesive 912 onto the first base 1 covers the orthographic projection of the first conductive mat 3 onto the first base 1, and the orthographic projection of the second welding point protective adhesive 922 onto the first base 1 covers the orthographic projection of the second conductive mat 7 onto the first base 1.

[0151] The light-emitting substrate further includes a second protective adhesive layer 11'. The second protective adhesive layer 11' covers at least the first conductive mat 3, the bonding wire 9, and the second conductive mat 7. That is, the orthographic projection of the second protective adhesive layer 11' onto the first base 1 covers the orthographic projections of the first conductive mat 3 and the second conductive mat 7 onto the first base 1 respectively, the orthographic projection of the second protective adhesive layer 11' onto the first base 1 covers the orthographic projection of the bonding wire 9 onto the first base 1, and the projection along the direction perpendicular to the first side wall 101 of the second protective adhesive layer 11' covers the projection along the direction perpendicular to the first side wall 101 of the bonding wire 9.

[0152] Furthermore, the second protective adhesive layer 11' further covers the first side wall 101 of the first substrate 100, the side wall of the backing 12, and the second side wall 201 of the second substrate 200. That is, the projection along the direction perpendicular to the first side wall 101 of the second protective adhesive layer 11' covers each of the first side wall 101, the side wall of the backing 12, and the second side wall 201.

[0153] For example, in the embodiments of the present disclosure, the first protective adhesive layer, the second protective adhesive layer, and the solder joint protective adhesive layer are all insulating adhesive materials.

[0154] For example, the second protective adhesive layer may be a black adhesive material, thereby preventing the light reflected by the conductive mat and the bonding wire from interfering with the display light. As an option, the second protective adhesive layer may be a non-black adhesive material. In this case, a blackening treatment can be performed on the entire surface of the module.

[0155] The first substrate 100 may be a backplate used for a light-emitting diode display panel. The first substrate 100 is a passive drive backplate, or an active drive backplate including thin film transistors, or an active drive backplate driven by a micro IC, but is not limited thereto.

[0156] Hereinafter, the first substrate 100 will be described with one specific example. However, the following specific example should not be regarded as limiting the embodiments of the present disclosure. The backplate according to the embodiments of the present disclosure can include driving backplates of various types and various structures known in the art.

[0157] FIG. 9 is a schematic diagram of the arrangement of the light-emitting units of the light-emitting substrate shown in FIG. 1, and FIG. 10 is a schematic diagram of one light-emitting unit in the light-emitting substrate shown in FIG. 9. As shown in FIGS. 1, 9, and 10, the first substrate 100 can include a first base 1 and a plurality of light-emitting units 140 arranged in an array on the first base 1. For example, the plurality of light-emitting units 140 are arranged in N rows and M columns, where N is an integer greater than 0 and M is an integer greater than 0. For example, the number of the light-emitting units 140 can be determined according to actual needs, for example, determined according to the size of the light-emitting substrate and the required luminance. Only the light-emitting units 140 of 3 rows and 5 columns are shown in FIG. 9, but it should be understood that the number of the light-emitting units 140 is not limited thereto.

[0158] For example, the light-emitting units 140 in each row are arranged along the first direction X, and the light-emitting units 140 in each column are arranged along the second direction Y.

[0159] Each light-emitting part 140 includes a driving circuit 4, a plurality of light-emitting diodes 5, and a driving voltage terminal Vled.

[0160] The drive circuit 4 has a first input terminal Di, a second input terminal Pwr, an output terminal OT, and a common voltage terminal GND. The first input terminal Di receives a first input signal, and the first input signal is, for example, an address signal and is used to gate the drive circuit 4 corresponding to the address. For example, the addresses of different drive circuits 4 may be the same or different. The first input signal may be an 8-bit address signal, and the address of the transmission target can be grasped by analyzing the address signal. The second input terminal Pwr receives a second input signal, and the second input signal is, for example, a power line communication signal. For example, the second input signal not only provides electrical energy to the drive circuit 4 but also transmits communication data to the drive circuit 4, and the communication data can be used to control the light emission time of the corresponding light emitting unit 140 and further control its visual light emission luminance. The output terminal OT can output different signals within different periods, for example, output a relay signal and a drive signal respectively. For example, the relay signal is an address signal provided to another drive circuit 4, that is, the first input terminal Di of another drive circuit 4 receives the relay signal as the first input signal to obtain the address signal. For example, the drive signal may be a drive current and is used to drive the light emission of the light emitting diode 5. The common voltage terminal GND receives a common voltage signal which is, for example, a ground signal.

[0161] The drive circuit 4 is configured to output a relay signal at the output terminal OT within a first period based on a first input signal received at the first input terminal Di and a second input signal received at the second input terminal Pwr, and to provide a drive signal at the output terminal OT to a plurality of light-emitting diodes 5 connected in series in sequence within a second period. During the first period, the output terminal OT outputs a relay signal, and the relay signal is supplied to another drive circuit 4 so that the other drive circuit 4 can obtain an address signal. During the second period, the output terminal OT outputs a drive signal, and the drive signal is supplied to a plurality of light-emitting diodes 5 connected in series in sequence, whereby the light-emitting diodes 5 emit light during the second period. For example, the first period and the second period are different periods, and the first period may be earlier than the second period, for example. The first period may be continuously connected to the second period, and the end time of the first period is the start time of the second period, that is. Alternatively, there may be still other periods between the first period and the second period, and the other periods may be used to realize other necessary functions, or the other periods may be used only to separate the first period and the second period, thereby avoiding interference between the signals at the output terminal OT in the first period and the second period.

[0162] For example, as shown in FIG. 10, a plurality of light-emitting diodes 5 are connected in series in sequence and are connected in series between a drive voltage terminal Vled and an output terminal OT. For example, each light-emitting diode 5 includes a positive electrode (+) and a negative electrode (-) (which may also be referred to as an anode and a cathode, or may be referred to as a P electrode and an N electrode), and the positive and negative electrodes of the plurality of light-emitting diodes 5 are connected in series end to end in sequence, thereby forming a current path between the drive voltage terminal Vled and the output terminal OT. The drive voltage terminal Vled provides a drive voltage, which is a high voltage, for example, during a period (the second period) when it is necessary to cause the light-emitting diode 5 to emit light, and is a low voltage during other periods. Thereby, within the second period, a drive signal (for example, a drive current) flows from the drive voltage terminal Vled through the plurality of light-emitting diodes 5 in sequence and then flows into the output terminal OT of the drive circuit 4. The plurality of light-emitting diodes 5 emit light when a drive current flows, and by controlling the duration of the drive current, the light-emitting time of the light-emitting diode 5 can be controlled, and the visual light-emitting luminance can be controlled.

[0163] Note that in the embodiments of the present disclosure, the number of light-emitting diodes 5 in each light-emitting unit 140 is not limited, and may be any number such as 4, 5, 7, 8, etc., and is not limited to 6. The plurality of light-emitting diodes 5 can adopt any arrangement method, for example, arranged according to a required pattern, and is not limited to a matrix arrangement method. The installation position of the drive circuit 4 is not limited, and it can be installed in any gap between the light-emitting diodes 5, which can be determined according to actual needs, and the embodiments of the present disclosure do not limit this.

[0164] For example, referring back to FIG. 1, the drive circuit 4 in each light-emitting unit 140 can be guided to a first conductive mat 3 located in the fan-out region via a signal line 150, and then can be guided to an external drive circuit via a bonding wire 9 and a second conductive mat 7.

[0165] For example, the driving circuit 4 can include a thin film transistor array layer. Specifically, the thin film transistor array layer can include an active layer, a gate insulating layer, a gate, a source, a drain, a planarization layer, and the like. The specific film layer structure of the driving circuit 4 can refer to the film layer structure applied to a conventional array substrate, and the description thereof is omitted here.

[0166] Some exemplary embodiments of the present disclosure further provide a display device. FIGS. 11 and 12 are schematic diagrams of a display device according to an exemplary embodiment of the present disclosure. Referring to FIGS. 11 and 12, the display device includes at least two such light-emitting substrates. At least two such light-emitting substrates are joined together to form a display device.

[0167] FIG. 8 is a schematic diagram schematically showing a frame region of a light-emitting substrate according to an embodiment of the present disclosure. Referring to FIGS. 8, 11, and 12, S3 is the width of the light-emitting diode bonding region and the edge region of the silica gel seal, S4 is the width of the first conductive mat, which can be controlled to be between 1.5 and 2.5 times the diameter of the bonding wire 9, and S5 is the total thickness of the protection by applying gum to the bonding wire, that is, the sum of the thicknesses of the first protective adhesive layer and the second protective adhesive layer. Thus, the width of the frame region of one light-emitting substrate is basically the sum of S3, S4, and S5. It can be controlled to be about 0.08 to 1.5 millimeters. Therefore, in the display device of the embodiment of the present disclosure, the width of the joining region is 2×(S3+S4+S5), that is, the display device can realize a joining region width of 0.16 to 3 millimeters, thereby reducing the width of the joining region, which is advantageous for achieving a large-size display device.

[0168] It should be noted that some steps of the above manufacturing method can be executed alone or in combination, and can be executed in parallel or in sequence, and are not limited to the specific operation sequence shown in the drawings.

[0169] The display device according to some exemplary embodiments of the present disclosure should be understood to have all the features and advantages of the above-described light-emitting substrate, and these features and advantages can be referred to the description of the light-emitting substrate above, and the description thereof will be omitted here.

[0170] As used herein, the terms "substantially", "about", "approximate" and other similar terms are not terms of degree but are used as terms of approximation, and they are intended to account for the inherent deviations of measured or calculated values recognized by those skilled in the art. Considering factors such as process variations, measurement problems, and errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), "about" or "approximate" as used herein includes the recited value and indicates that it is within an acceptable deviation range for a particular value determined by those skilled in the art. For example, "about" can indicate within one or more standard deviations, or within ±10% or ±5% of the recited value.

[0171] Although some embodiments based on the overall inventive concept of the present disclosure have been illustrated and described, as will be understood by those skilled in the art, these embodiments can be modified on the premise of not departing from the principles and spirit of the overall inventive concept of the present disclosure, and the scope of the present disclosure is limited by the claims and their equivalents.

Claims

1. A light-emitting substrate comprising a first substrate, a second substrate disposed opposite to the first substrate, a first protective adhesive layer, a bonding wire structure, and a backing paste, wherein the first substrate comprises a first base, a light-emitting diode disposed on the first base, and a first conductive mat disposed on the first base, the second substrate comprises a second base, and a second conductive mat disposed on the second base, the first substrate includes a first sidewall adjacent to the first conductive mat, the bonding wire structure includes bonding wires, the first conductive mat is located on a surface of the first substrate facing away from the second substrate, the second conductive mat is located on a surface of the second substrate facing away from the first substrate, the bonding wires electrically connect the first conductive mat and the second conductive mat, the backing paste is disposed between the first substrate and the second substrate and is used to integrally attach the first substrate and the second substrate, and the backing paste includes a third sidewall, a projection along a direction perpendicular to the first sidewall of the first protective adhesive layer does not overlap with a projection along a direction perpendicular to the first sidewall of the third sidewall, the bonding wires are located on a side away from the first sidewall of the first protective adhesive layer, and there is a gap between the first protective adhesive layer and the bonding wires in a direction perpendicular to the first sidewall. A light-emitting substrate.

2. The bonding wire structure further includes a first weld point and a second weld point. The first weld point is a weld point where one end of the bonding wire is welded to the first conductive mat, and the second weld point is a weld point where the other end of the bonding wire is welded to the second conductive mat. The light-emitting substrate according to Claim 1.

3. The second substrate includes a second sidewall adjacent to the second conductive mat, and the first protective adhesive layer contacts at least the first sidewall and the second sidewall. The light-emitting substrate according to Claim 2.

4. Orthogonal projections of the first sidewall, the second sidewall, and the third sidewall onto the first base overlap each other. The light-emitting substrate according to Claim 3.

5. Further comprising a second protective adhesive layer, a projection along a direction perpendicular to the first sidewall of the second protective adhesive layer covers a projection along a direction perpendicular to the first sidewall of the bonding wires. The light-emitting substrate according to Claim 4.

6. The orthographic projection of the second protective adhesive layer onto the first base covers the orthographic projections of the first conductive mat, the first solder joint, the second conductive mat, and the second solder joint onto the first base, respectively. The light-emitting substrate according to claim 5.

7. The bonding wire forms a certain included angle with the plane where the first base is located at the first solder joint and the second solder joint, respectively, and / or includes a portion having a bending radian. The light-emitting substrate according to claim 5.

8. Further including a first solder joint protective adhesive installed at the first solder joint and a second solder joint protective adhesive installed at the second solder joint. The orthographic projection of the first solder joint protective adhesive onto the first base covers at least the orthographic projection of the first solder joint onto the first base. The orthographic projection of the second solder joint protective adhesive onto the first base covers at least the orthographic projection of the second solder joint onto the first base. The light-emitting substrate according to claim 7.

9. The orthographic projection of the first solder joint protective adhesive onto the first base covers the orthographic projection of the first conductive mat onto the first base. The orthographic projection of the second solder joint protective adhesive onto the first base covers the orthographic projection of the second conductive mat onto the first base. The light-emitting substrate according to claim 8.

10. The second protective adhesive layer covers the bonding wire and further fills the gap between the first protective adhesive layer and the bonding wire. The light-emitting substrate according to claim 9.

11. The orthographic projection of the second protective adhesive layer onto the first base covers the orthographic projection of the bonding wire onto the first base. The projection along the direction perpendicular to the first side wall of the second protective adhesive layer covers the projection along the direction perpendicular to the first side wall of the bonding wire. The light-emitting substrate according to claim 10.

12. The orthographic projection of the second protective adhesive layer onto the first base covers the orthographic projections of the first solder joint protective adhesive and the second solder joint protective adhesive onto the first base, respectively. The light-emitting substrate according to claim 11.

13. The dimension along the direction perpendicular to the first side wall of the second protective adhesive layer is equal to the dimension along the direction perpendicular to the first side wall of the first protective adhesive layer. The light-emitting substrate according to claim 10.

14. The dimension along the direction perpendicular to the first side wall of the first protective adhesive layer is between 5 and 500 microns, and / or the Young's modulus of the materials used for the first protective adhesive layer and the second protective adhesive layer is between 0.1 Mpa and 80 Gpa. The light-emitting substrate according to claim 13.

15. The light-emitting diode is a submillimeter light-emitting diode or a micro light-emitting diode. The light-emitting substrate according to any one of claims 1 to 4.

16. Both the first protective adhesive layer and the second protective adhesive layer contain an insulating adhesive material. The light-emitting substrate according to claim 10.

17. The second protective adhesive layer contains a black adhesive material. The light-emitting substrate according to claim 10.

18. The diameter of the bonding wire is between 10 and 500 microns. The light-emitting substrate according to any one of claims 1 to 4.

19. The numbers of the light-emitting diodes, the first conductive mat, the second conductive mat, and the bonding wires are all plural. The plurality of bonding wires electrically connect the plurality of first conductive mats and the plurality of second conductive mats respectively. The light-emitting substrate according to any one of claims 1 to 4.

20. A display device including the light-emitting substrate according to any one of claims 1 to 19.

21. Providing a first substrate including a first base and a first conductive mat disposed on the first base; Transferring and bonding a light-emitting diode to the first substrate; Providing a second substrate including a second base and a second conductive mat disposed on the second base; Holding the relative positions of the first substrate and the second substrate by disposing the first substrate and the second substrate on a carrier; Forming a first protective adhesive layer including a first side wall adjacent to the first conductive mat; Forming a bonding wire structure to electrically connect the first conductive mat and the second conductive mat; Installing an adhesive backing including a third side wall between the first substrate and the second substrate for integrally attaching the first substrate and the second substrate. By inverting the second substrate toward the first substrate, the surface of the second base that is spaced apart from the second conductive mat faces the first substrate, the first conductive mat is located on the surface of the first substrate that is spaced apart from the second substrate, and the second conductive mat is located on the surface of the second substrate that is spaced apart from the first substrate, including the step of making it so, The bonding wire structure includes bonding wires, and the bonding wires electrically connect the first conductive mat and the second conductive mat. The projection along the direction perpendicular to the first side wall of the first protective adhesive layer does not overlap with the projection along the direction perpendicular to the first side wall of the third side wall. The bonding wire is located on the side spaced apart from the first side wall of the first protective adhesive layer, and there is a gap between the first protective adhesive layer and the bonding wire in the direction perpendicular to the first side wall. A method for manufacturing a light-emitting substrate.

22. In the step of holding the relative positions of the first substrate and the second substrate by arranging the first substrate and the second substrate on a carrier, the first conductive mat and the second conductive mat are separated by a predetermined distance, and the first surface of the first conductive mat spaced apart from the first base and the second surface of the second conductive mat spaced apart from the second base are on the same horizontal plane, and the first substrate and the second substrate are separated by a predetermined distance. The method for manufacturing a light-emitting substrate according to claim 21.

23. Before the step of arranging the first substrate and the second substrate on a carrier and the step of forming a bonding wire structure, the manufacturing method further includes The method for manufacturing a light-emitting substrate according to claim 21, including the step of forming a first protective adhesive layer so as to cover at least the first side wall adjacent to the first conductive mat of the first substrate and the second side wall adjacent to the second conductive mat of the second substrate.

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