Temperature control device

Abstract

Provide a temperature control device that can accurately control the temperature of each of a plurality of test objects and simultaneously perform tests with a plurality of temperature settings on the plurality of test objects using a test device with a simple structure. 【Solution means】The temperature control device 1 of the present invention controls the temperature of a plurality of test objects 9 and performs evaluation tests, and includes a holder 8 that houses the plurality of test objects 9 and a heat exchange plate 2 through which the temperature-controlled heat medium circulates. The heat medium flowing into the heat exchange plate 2 is temperature-controlled to a predetermined temperature by changing the ratio of the heat medium from the high-temperature side heat medium tank 5a and the heat medium from the low-temperature side heat medium tank 5b.

Description

Technical Field

[0001] The present invention relates to a temperature control device provided in a test apparatus that requires temperature control of a test object.

Background Art

[0002] Conventionally, in a test for temperature control of a test object, a temperature control device is known that controls the temperature of the test object through a heat exchange plate through which a heat medium temperature-controlled in a heat medium tank circulates (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In this type of conventional temperature control device, when simultaneously conducting tests on test objects set at a plurality of temperatures controlled using a heat medium, it is necessary to prepare heat medium tanks in which the heat medium is temperature-controlled to the set temperatures according to the number of temperature settings.

[0005] However, installing as many heat medium tanks as the number of set temperatures has disadvantages such as an increase in power consumption for maintaining and changing the temperature of the heat solvent, an increase in the ambient temperature of the test chamber, and an increase in installation costs.

[0006] In view of the above disadvantages, an object of the present invention is to provide a temperature control device capable of efficiently controlling the temperature of a test object at a plurality of temperature settings.

Means for Solving the Problems

[0007] In order to achieve the above object, the present invention provides a temperature control device for thermally regulating a test object at a plurality of set temperatures, comprising a plurality of holders for accommodating the test object, a plurality of heat exchange plates through which a thermally regulated heat medium circulates, a high-temperature side heat medium tank for supplying a heat medium at a temperature higher than the set temperature to the heat exchange plates, and a low-temperature side heat medium tank for supplying a heat medium at a temperature lower than the set temperature to the heat exchange plates. The high-temperature side heat medium tank is connected in parallel to each of the plurality of heat exchange plates, and a flow path from the low-temperature side heat medium tank is further connected to the heat medium flow path from the high-temperature side heat medium tank to the heat exchange plates. A flow rate control valve is provided in each of the heat medium flow paths from the high-temperature side heat medium tank to the heat exchange plates and the heat medium flow path from the low-temperature side heat medium tank to the heat medium flow path from the high-temperature side heat medium tank to the heat exchange plates until connection. The flow rate control valve is controlled by the temperature of the temperature sensor provided on each heat exchange plate to By changing the mixing ratio of the heat medium from the high-temperature side heat medium tank and the heat medium from the low-temperature side heat medium tank, the temperature is regulated to a plurality of different set temperatures. The holder is detachably attached to the heat exchange plate, and the test object accommodated in the holder is thermally regulated to different set temperatures by the heat from each heat exchange plate.

[0009] The present invention In a temperature control device that adjusts the temperature of a test object to a plurality of set temperatures, it includes a plurality of holders for accommodating the test object, a plurality of heat exchange plates through which a temperature-controlled heat medium circulates, a high-temperature side heat medium tank that supplies a heat medium at a temperature higher than the set temperature to the heat exchange plates, and a low-temperature side heat medium tank that supplies a heat medium at a temperature lower than the set temperature to the heat exchange plates. Each of the plurality of heat exchange plates is connected in parallel to the high-temperature side heat medium tank and the low-temperature side heat medium tank. The heat medium flowing into each of the plurality of heat exchange plates opens and closes the flow rate control valve provided in the flow path of the high-temperature side heat medium tank and the flow rate control valve provided in the flow path of the low-temperature side heat medium tank according to the temperature of the temperature sensor provided on the heat exchange plate so that the heat exchange plate reaches a predetermined temperature, and adjusts the temperature to a plurality of different set temperatures by changing the mixing ratio of the heat medium in the high-temperature side heat medium tank and the heat medium in the low-temperature side heat medium tank. The holder is detachably attached to the heat exchange plate, and the test object accommodated in the holder is adjusted to different set temperatures by the heat from each heat exchange plate. A temperature test device characterized by the above.

[0010] According to the present invention, Just by providing the high-temperature side heat medium tank and the low-temperature side heat medium tank, each of the plurality of heat exchange plates can be efficiently temperature-adjusted to a plurality of different set temperatures, and each heat exchange plate can be temperature-adjusted to a plurality of set temperatures with a simple structure.

[0014] The present invention In a temperature control device that adjusts the temperature of a test object to a plurality of set temperatures, it includes a plurality of holders for accommodating the test object, a plurality of heat exchange plates through which a temperature-controlled heat medium circulates, a high-temperature side heat medium tank that supplies a heat medium at a temperature higher than the set temperature to the heat exchange plates, and a low-temperature side heat medium tank that supplies a heat medium at a temperature lower than the set temperature to the heat exchange plates. The heat medium flowing into each of the plurality of heat exchange plates is temperature-adjusted to a plurality of different set temperatures by changing the mixing ratio of the heat medium in the high-temperature side heat medium tank and the heat medium in the low-temperature side heat medium tank. The holder is detachably attached to the heat exchange plate, and the test object accommodated in the holder is temperature-adjusted to different set temperatures by the heat from each heat exchange plate. Among the heat media from the plurality of heat exchange plates set to a plurality of types of the set temperatures from a high set temperature to a lower set temperature, the heat media of the plurality of heat exchange plates at the high set temperature are refluxed to the high-temperature side heat medium tank, and the heat media of the plurality of heat exchange plates at the low set temperature are refluxed to the low-temperature side heat medium tank. Let 、 A return heat medium tank is provided and connected to the upstream of the reflux path of the high-temperature side heat medium tank where the heat medium of the plurality of heat exchange plates at the high-temperature side set temperature flows back, and the upstream of the reflux path of the low-temperature side heat medium tank where the heat medium of the plurality of heat exchange plates at the low-temperature side set temperature flows back, respectively. The two return heat medium tanks are connected by a pipeline so that when the heat medium in one return heat medium tank becomes excessive, it can flow into the other return heat medium tank. A temperature control device characterized by the above.

[0015] Furthermore, It is characterized in that the mixing ratio of the heat medium from the high-temperature side heat medium tank supplied to the heat exchange plate and the heat medium from the low-temperature side heat medium tank is changed so that the heat exchange plates are set to a plurality of types of temperatures from a high set temperature to a lower set temperature.

[0016] According to the present invention By changing the mixing ratio of the heat medium from the high-temperature side heat medium tank and the heat medium from the low-temperature side heat medium tank, each of the plurality of heat exchange plates can be efficiently set to a plurality of types of set temperatures from a high set temperature to a lower set temperature.

[0017] According to the present invention, since the temperature control device can simultaneously control the temperature of a heat exchange plate set to a plurality of types of set temperatures from a high set temperature to a lower set temperature while suppressing the number of heat medium tanks used, it is possible to suppress the cost of installing the heat medium tank, suppress the power consumption required for the heat medium tank, and suppress the rise in the ambient temperature due to the heat generation of the heat medium tank. In addition, since it is not necessary to change the set temperature of the heat medium tank every time the temperature setting of the heat exchange plate is changed, there is no need to wait until the heat medium in the heat medium tank reaches the set temperature, and the temperature setting of the test can be quickly switched.

[0018] Further, in the above invention, it is preferable that the test is a secondary battery charge and discharge test.

Brief Description of the Drawings

[0019]

Figure 1

Figure 2

Figure 3

Figure 4

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Figure 6A

Figure 6B

Figure 6C

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0020] Referring to the drawings, a temperature control device according to an embodiment of the invention will be described. Referring to FIGS. 1 and 2, the temperature control device 1 of the present embodiment is provided in a test device 100 that requires temperature management of a test object 9. Tests that require temperature management include, for example, a secondary battery charge and discharge test with a secondary battery as the test object.

[0021] The test device 100 in which the temperature control device 1 of the present embodiment is provided includes a fixing plate 3 to which a heat exchange plate 2 is fixed, a frame body 4 that supports the fixing plate 3 in alignment in the vertical direction and supports it on the front and back, and a heat medium that adjusts the temperature of the heat medium to a predetermined temperature and Heat exchange plate 2 a plurality of heat medium tanks 5 that can be supplied to.

[0022] Referring to FIG. 3, two flow paths 7, an upstream path and a return path, through which the heat medium supplied from the heat medium tank 5 flows, are provided in parallel on the heat exchange plate 2. Further, on one heat exchange plate 2, two holders 8 for accommodating the test object are detachably fixed side by side so as to straddle the two flow paths 7.

[0023] Referring to FIG. 3, the holder 8 includes a base portion 10 having four storage portions 10a having a cross-sectional arc shape that can accommodate four cylindrical secondary batteries as test objects 9 in parallel, and four storage portions 11a having a cross-sectional arc shape, and a lid portion 11 that sandwiches and holds the test object 9 between the storage portions 10a and 11a so that the test object 9 does not fall off the base portion 10.

[0024] Four screw holes 10b through which screws 10e can be inserted are provided in the base portion 10, and the base portion 10 is detachably configured by being screwed to the female screw portion 2a of the heat exchange plate 2 by the screws 10e inserted into the screw holes 10b. A heat transfer sheet 12 is sandwiched between the base portion 10 and the test object 9 and between the lid portion 11 and the test object 9 so that heat transfer can be performed well with as little gap as possible. When the test object needs to perform operations such as charge and discharge while adjusting the temperature like a secondary battery, it is advisable to provide an opening in the holder 8 for attaching the operation terminal 13 (charge and discharge terminal).

[0025] A hook 10c is provided on the side surface of the base portion 10. The lid portion 11 is provided with a patch lock 11b that can engage with the hook 10c, and the lid portion 11 is detachably fixed to the base portion 10 by this patch lock 11b. Further, the base portion 10 is provided with a positioning pin 10d that protrudes toward the lid portion 11 side. The lid portion 11 is provided with a positioning hole 11c that can receive the positioning pin 10d.

[0026] In the test apparatus of the present embodiment, since the heat exchange plates 2 are arranged side by side in the vertical direction, the surfaces of the heat exchange plates 2 are aligned in the vertical direction, and the operation of fixing the holder 8 to the heat exchange plate 2 or the operation of fixing the fixing plate 3 to which the heat exchange plate 2 and the holder 8 are fixed to the frame body 4 can be performed from one direction, which is convenient. Further, since the heat exchange plates 2 can be attached to the front and back of the frame body 4, the installation space can be effectively utilized, and a compact apparatus can be used to test a large number of test objects 9.

[0027] FIG. 4 shows the circulation circuit of the heat medium of the present embodiment. In FIG. 4, for the sake of convenience of explanation, the number of heat exchange plates 2 is set to five, which is half the number of heat exchange plates 2 in FIG. 1. In the parallel-type circulation circuit of the present embodiment, the heat medium supplied from the high-temperature-side heat medium tank 5a is controlled in the flow rate by the high-temperature-side flow rate control valve block 14a, and the heat medium supplied from the low-temperature-side heat medium tank 5b is controlled in the flow rate by the low-temperature-side flow rate control valve block 14b, and is distributed to the confluence points M1 to M5. Then, the heat medium discharged from each heat exchange plate 2 passes through the check valve 15, is refluxed to the return heat medium tank 16, and then refluxed to the high-temperature-side heat medium tank 5a and the low-temperature-side heat medium tank 5b, and is temperature-controlled again. The test object 9 held by the holder 8 is temperature-controlled to a predetermined temperature by the heat medium through the heat exchange plate 2.

[0028] Also, the inflow amounts of the heat medium discharged from the high-temperature-side heat medium tank 5a and the heat medium discharged from the low-temperature-side heat medium tank 5b, which are mixed at the confluence points M1 to M5, are controlled by the high-temperature-side flow control valves A1 to A5 and the low-temperature-side flow control valves B1 to B5, respectively. By controlling the ratio of the heat medium discharged from the high-temperature-side heat medium tank 5a and the heat medium discharged from the low-temperature-side heat medium tank 5b, the temperature can be adjusted to a different predetermined temperature for each heat exchange plate 2. The flow control valve is connected to the temperature control unit 6 via a wired or wireless communication line through a flow control block 14 such as a solenoid valve.

[0029] For example, when the heat exchange plates 2a, 2b, 2c, 2d, and 2e are adjusted to 10°C, 20°C, 30°C, 40°C, and 50°C, respectively, and tests are conducted simultaneously, the set temperature of the heat medium in the high-temperature-side heat medium tank 5a is set to 50°C or higher (e.g., 60°C), and the set temperature of the heat medium in the low-temperature-side heat medium tank 5b is set to 10°C or lower (e.g., 0°C). By mixing both heat media, the temperature of each heat exchange plate 2 can be adjusted to a predetermined temperature.

[0030] More specifically, the temperature control method of the heat medium flowing into the heat exchange plate 2 will be described with reference to FIG. 5. Temperature sensors T1 to T5 are provided on the downstream sides of the confluence points M1 to M5, respectively, to measure the temperature of the heat medium flowing into the heat exchange plate 2. Although not shown in the figure, the temperature sensor T may be provided inside the heat exchange plate 2 or on the downstream side of the heat exchange plate 2 as long as it is on the downstream side of the confluence point M. The measured temperature of the heat medium is transmitted to the temperature control unit 6 connected via a wired or wireless communication line to the temperature sensor, and temperature monitoring processing is performed.

[0031] The processing before the start of the test will be described with reference to the flowchart of FIG. 6A. After the user sets the set temperature, the temperature control device 6 acquires the set temperature (STEP1), and opens the high-temperature side flow control valve A and the low-temperature side flow control valve B at a predetermined ratio set in advance according to the set temperature (STEP2). Then, a temperature monitoring process (STEP3) is performed. If the result of the temperature monitoring process is positive (STEP4···YES), an instruction to start the test is sent to a test control device (not shown), and the test is started (STEP5). If the result of the temperature monitoring process is negative (STEP4···NO), the temperature monitoring process is repeated.

[0032] The details of the temperature monitoring process (STEP3) will be described using the flowchart in FIG. 6B. The temperature control device 6 acquires the temperature of the heat medium measured by the temperature sensor T (hereinafter sometimes referred to as the sensor temperature) (STEP31), and determines whether the set temperature and the sensor temperature are the same or within a predetermined range (STEP32). When the set temperature and the sensor temperature are the same or within the predetermined range, it is recognized that the temperature of the heat medium is appropriate (STEP33), the flow rate setting of the heat medium is maintained as it is, the temperature monitoring process is terminated, and the process proceeds to STEP5. When the sensor temperature is lower than the set temperature, the temperature control unit 6 issues an instruction to open the high-temperature side flow control valve A at a predetermined ratio (n1%) corresponding to the difference between the set temperature and the sensor temperature and close the low-temperature side flow control valve B at a predetermined ratio (n2%) corresponding to the difference between the set temperature and the sensor temperature (STEP321). After the standby time (S1 seconds) has elapsed (STEP322), the processes from STEP31 and later are performed again. When the sensor temperature is higher than the set temperature, the temperature control unit 6 issues an instruction to close the high-temperature side flow control valve A at a predetermined ratio (N1%) corresponding to the difference between the set temperature and the sensor temperature and open the low-temperature side flow control valve B at a predetermined ratio (N2%) corresponding to the difference between the set temperature and the sensor temperature (STEP323). After the standby time (S2 seconds) has elapsed (STEP324), the processes from STEP31 and later are performed again. The adjustment of the opening and closing ratios (n1%, n2%, N1%, N2%) of each control valve according to the difference between the set temperature and the sensor temperature is controlled by, for example, a PI control method or a PID control method. The standby times S1 seconds and S2 seconds may be the same or different, and may be a determined predetermined time or may be changed according to the set temperature. By repeating these processes, the test can be started in a state where the temperature control of the heat medium is completed.

[0033] Also, by making the sum of n1% and n2%, and the sum of N1% and N2% equal to 100%, the amount of the heat medium flowing into the heat exchange plate 2 can be made constant while adjusting the temperature of the heat medium.

[0034] The temperature deviation determination process during the test will be described using the flowchart of FIG. 6C. The temperature deviation determination process (STEP6) is performed after the start of the test or at any timing that has been set. The temperature control device 6 acquires the sensor temperature (STEP61), and determines whether the set temperature and the sensor temperature are the same or within a predetermined range (STEP62). When the set temperature and the sensor temperature are the same or within the predetermined range (STEP62... YES), it is recognized that the temperature of the heat medium is appropriate (STEP63), and the processes after STEP61 are performed again. When the set temperature and the sensor temperature are different or outside the predetermined range (STEP62... NO), it is recognized that the temperature of the heat medium is abnormal. By accumulating the processing results and the sensor temperature during the processing, it is possible to confirm whether there has been a temperature deviation during the test.

[0035] Also, when an abnormality is detected in any of the STEPs described in FIGS. 6A - 6C, the test may be terminated. Examples of abnormalities include being unable to acquire the sensor temperature, recognizing that the temperature of the heat medium is abnormal, and recognizing an abnormal temperature of the heat exchange plate 2 due to a decrease in the water level (flow rate) caused by an abnormality in the chiller.

[0036] Referring to FIG. 7, the description of the components with the same reference numerals will be omitted, and another embodiment will be described. By operating the return heat medium control valves C1 to C5, it is possible to select whether the heat medium refluxing from the heat exchange plate 2 is refluxed to either the high-temperature side return heat medium tank 16a or the low-temperature side return heat medium tank 16b. The operation of the return heat medium control valves C1 to C5 may be performed by the user, or may be performed by a return heat medium control unit 17 connected via a wired or wireless communication line through the return heat medium control valves C1 to C5 and the flow control valve block 14c. The return heat medium control unit 17 determines which of the set temperatures of the high-temperature side heat medium tank 5a and the low-temperature side heat medium tank 5b is closer to the respective temperatures measured by the temperature sensors T1 to T5, and controls the return heat medium control valves C1 to C5 so that the heat medium refluxes to either the high-temperature side return heat medium tank 16a or the low-temperature side return heat medium tank 16b. With such a configuration, it is possible to suppress the power consumption required for the heat medium refluxing to the heat medium tank 5 to return to the set temperature.

[0037] More specifically, the flow of the heat medium refluxing to the return heat medium tank 16 will be described with reference to FIG. 8. The heat medium flowing into the high-temperature side return heat medium tank 16a by the return heat medium control valves C1 to C5 is refluxed to the high-temperature side heat medium tank 5a, and the heat medium flowing into the low-temperature side return heat medium tank 16b is connected so as to reflux to the low-temperature side heat medium tank 5b. At this time, when the heat medium flows into either one of the high-temperature side return heat medium tank 16a or the low-temperature side return heat medium tank 16b in a biased manner, in order to prevent the heat medium from flowing backward into the heat exchange plate 2, the high-temperature side return heat medium tank 16a and the low-temperature side return heat medium tank 16b are connected by an overflow prevention pipe 18 such that when the capacity of the heat medium contained in either one of the return heat medium tanks exceeds a certain level, the heat medium flows into the other return heat medium tank. By providing the overflow prevention pipe 18, it is possible to prevent the heat medium from overflowing from the return heat medium tank 16 while suppressing the capacity of each return heat medium tank.

[0038] The temperature control unit 6 and the return heat medium control unit 17 are so-called processors composed of an arithmetic processing device such as a CPU (Central Processing Unit), a memory, and I / O (Input / Output) devices, and may be composed of the same device or different devices.

Explanation of Signs

[0039] 1 Temperature control device 2 Heat exchange plate 2a Female screw part 3 Fixed plate 4 Frame 5 Heat medium tank 5a High-temperature side heat medium tank 5b Low-temperature side heat medium tank 6 Temperature control unit 7 Flow path 8 Holder 9 Object under test 10 Base part 10a Storage part 10b Screw hole 10c Hook 10d Positioning pin 10e Screw 11 Lid part 11a Storage part 11b Patch lock 11c Positioning hole 12 Heat transfer sheet 13 Operation terminal 14 Flow control block 14a High-temperature side flow control valve block 14b Low-temperature side flow control valve block 15 Check valve 16 Return heat medium tank 16a High-temperature side return heat medium tank 16b Low-temperature side return heat medium tank 18 Overflow prevention pipe 100 Test device T Temperature sensor M Confluence point A High-temperature side flow control valve B Low-temperature side flow control valve C Return heat medium control valve

Claims

1. In a temperature control device that controls the temperature of a test object to a plurality of set temperatures, A plurality of holders for storing test objects; A plurality of heat exchange plates through which a temperature-controlled heat medium circulates; a high-temperature side heat medium tank that supplies a heat medium having a temperature higher than the set temperature to a heat exchange plate; a low-temperature side heat medium tank that supplies a heat medium having a temperature lower than the set temperature to a heat exchange plate; Equipped with the high-temperature side heat medium tank is connected in parallel to each of the plurality of heat exchange plates; a flow path from the low-temperature heat medium tank to a heat medium flow path from the high-temperature heat medium tank to a heat exchange plate; a flow control valve is provided in each of the heat medium flow paths from the high-temperature side heat medium tank to the heat exchange plate and from the low-temperature side heat medium tank to the heat medium flow path from the high-temperature side heat medium tank to the heat exchange plate, and the flow control valve is controlled based on the temperature of a temperature sensor provided in each heat exchange plate to change the mixing ratio of the heat medium from the high-temperature side heat medium tank and the heat medium from the low-temperature side heat medium tank, thereby adjusting the temperature to a plurality of different set temperatures; The holder is detachably attached to a heat exchange plate, and the temperature of a test object stored in the holder is adjusted to different set temperatures by heat from each heat exchange plate.

2. In a temperature control device that controls the temperature of a test object to a plurality of set temperatures, A plurality of holders for storing test objects; A plurality of heat exchange plates through which a temperature-controlled heat medium circulates; a high-temperature side heat medium tank that supplies a heat medium having a temperature higher than the set temperature to a heat exchange plate; a low-temperature side heat medium tank that supplies a heat medium having a temperature lower than the set temperature to a heat exchange plate; Equipped with the plurality of heat exchange plates are connected in parallel to the high-temperature side heat medium tank and the low-temperature side heat medium tank; the heat medium flowing into each of the plurality of heat exchange plates is adjusted to a plurality of different set temperatures by opening and closing a flow control valve provided in a flow path of the high-temperature side heat medium tank and a flow control valve provided in a flow path of the low-temperature side heat medium tank in response to temperatures detected by temperature sensors provided on the heat exchange plates, and changing the mixing ratio of the heat medium in the high-temperature side heat medium tank and the heat medium in the low-temperature side heat medium tank, so that the heat exchange plates are at predetermined temperatures; The holder is detachably attached to a heat exchange plate, and the temperature of a test object stored in the holder is adjusted to different set temperatures by heat from each heat exchange plate.

3. In a temperature control device that controls the temperature of a test object to a plurality of set temperatures, A plurality of holders for storing test objects; A plurality of heat exchange plates through which a temperature-controlled heat medium circulates; a high-temperature side heat medium tank that supplies a heat medium having a temperature higher than the set temperature to a heat exchange plate; a low-temperature side heat medium tank that supplies a heat medium having a temperature lower than the set temperature to a heat exchange plate; Equipped with the heat medium flowing into each of the plurality of heat exchange plates is adjusted to a plurality of different set temperatures by changing a mixing ratio of the heat medium in the high-temperature side heat medium tank and the heat medium in the low-temperature side heat medium tank; The holder is detachably attached to the heat exchange plate, and the temperature of the test object stored in the holder is adjusted to the different set temperatures by heat from each heat exchange plate, Among the heat medium from the plurality of heat exchange plates set to a plurality of set temperatures ranging from a high set temperature to a lower set temperature, the heat medium from the plurality of heat exchange plates having a high set temperature is returned to the high-temperature-side heat medium tank, and the heat medium from the plurality of heat exchange plates having a low set temperature is returned to the low-temperature-side heat medium tank, A temperature control device comprising: a high-temperature heat medium tank, through which the heat medium of a plurality of heat exchange plates having a high-temperature setting temperature is returned, and a low-temperature heat medium tank, through which the heat medium of a plurality of heat exchange plates having a low-temperature setting temperature is returned; a return heat medium tank, through which the heat medium of a plurality of heat exchange plates having a low-temperature setting temperature is returned, the return heat medium tanks being connected to each other; and a pipe connecting the two return heat medium tanks so that when there is an excess of heat medium in one return heat medium tank, the heat medium can flow into the other return heat medium tank.

4. The temperature test device according to any one of claims 1 to 3, A temperature testing device characterized in that a mixing ratio of the heat medium from the high-temperature side heat medium tank and the heat medium from the low-temperature side heat medium tank supplied to the heat exchange plate is changed so that the heat exchange plate can be set to a plurality of temperatures ranging from a high set temperature to a lower set temperature.

5. The temperature control device according to any one of claims 1 to 3, The temperature control device is characterized in that the test is a secondary battery charge / discharge test.

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