Non-contact communication medium for a recording medium cartridge, recording medium cartridge, and method for manufacturing a non-contact communication medium for a recording medium cartridge

Abstract

To provide a non-contact communication medium for a recording medium cartridge, the recording medium cartridge, and a method for manufacturing the non-contact communication medium for the recording medium cartridge, in which stress generated in an IC chip due to deformation of a substrate is relaxed.SOLUTION: A non-contact communication medium for a recording medium cartridge includes: a substrate; an IC chip that is formed on the substrate and electrically connected to one end and the other end of an antenna coil that induces power by an action of a magnetic field applied from the outside; and a stress relaxation member provided between the IC chip and the substrate.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The technology of the present disclosure relates to a non-contact communication medium for a recording medium cartridge, a recording medium cartridge, and a method for manufacturing a non-contact communication medium for a recording medium cartridge.

Background Art

[0002] Patent Document 1 discloses a cartridge memory for a recording medium cartridge, which has a memory unit having a memory capacity capable of storing management information regarding a second information recording medium configured to be able to record information with a second number of data tracks larger than a first number of data tracks, and a capacity setting unit configured to be able to set, in the memory unit, a data storage area limited to a first capacity capable of storing management information regarding a first information recording medium configured to be able to record information with the first number of data tracks.

[0003] Patent Document 2 discloses a tape cartridge in which one reel 2 around which a tape 3 is wound is disposed inside a case body 1, and a non-contact memory cartridge M is disposed in a loading portion 10 provided inside the case body 1. A loading slot 23 for loading the memory cartridge M from the outside of the case is opened in a case peripheral wall facing the loading portion 10, and an engagement structure for engaging and fixing the memory cartridge M inserted and loaded into the loading portion 10 so as not to come off is provided between the loading portion 10 and the memory cartridge M. The memory cartridge M is characterized in that it can be assembled from the outside of the case to the loading portion 10.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

[0005] One embodiment of the technology according to the present disclosure provides a non-contact communication medium for a recording medium cartridge, a recording medium cartridge, and a method for manufacturing a non-contact communication medium for a recording medium cartridge, in which stress generated in an IC chip due to deformation of a substrate is alleviated.

Means for Solving the Problems

[0006] A first aspect of the technology according to the present disclosure is a non-contact communication medium for a recording medium cartridge, including a substrate, an IC chip formed on the substrate and electrically connected to one end and the other end of an antenna coil that induces electric power when an externally applied magnetic field acts thereon, and a stress relaxation member provided between the IC chip and the substrate.

[0007] A second aspect of the technology according to the present disclosure is the non-contact communication medium for a recording medium cartridge according to the first aspect, in which the stress relaxation member is formed of metal.

[0008] A third aspect of the technology according to the present disclosure is the non-contact communication medium for a recording medium cartridge according to the second aspect, in which the metal is the same as the metal forming the antenna coil.

[0009] A fourth aspect of the technology according to the present disclosure is the non-contact communication medium for a recording medium cartridge according to the second aspect or the third aspect, in which the metal is copper or a copper alloy.

[0010] A fifth aspect of the technology according to the present disclosure is the non-contact communication medium for a recording medium cartridge according to any one of the second aspect to the fourth aspect, in which the stress relaxation member is formed as a printed pattern.

[0011] A sixth aspect of the technology according to the present disclosure is the non-contact communication medium for a recording medium cartridge according to any one of the first aspect to the fifth aspect, in which the IC chip is square in plan view, and the stress relaxation member is provided at positions corresponding to the four corners of the IC chip when viewed in plan view.

[0012] A seventh aspect of the technology according to the present disclosure is a contactless communication medium for a recording medium cartridge according to any one of the first to fifth aspects, wherein the IC chip is square in plan view, and the stress relaxation member is provided along opposite sides of the IC chip when the IC chip is viewed in plan view.

[0013] An eighth aspect of the technology according to the present disclosure is a contactless communication medium for a recording medium cartridge according to any one of the first to fifth aspects, wherein the stress relaxation member is provided at a position corresponding to the entire IC chip when the IC chip is viewed in plan view.

[0014] A ninth aspect of the technology according to the present disclosure is a contactless communication medium for a recording medium cartridge according to any one of the first to fifth aspects, wherein the stress relaxation member is provided at a position corresponding to the outer peripheral portion of the IC chip when the IC chip is viewed in plan view.

[0015] A tenth aspect of the technology according to the present disclosure is a contactless communication medium for a recording medium cartridge according to any one of the first to ninth aspects, wherein the IC chip has a storage capacity of 32 kB or more.

[0016] An eleventh aspect of the technology according to the present disclosure is a contactless communication medium for a recording medium cartridge according to any one of the first to tenth aspects, wherein the ratio of the maximum outer dimension of the IC chip to the long side dimension of the substrate is 25% or more.

[0017] A twelfth aspect of the technology according to the present disclosure is a contactless communication medium for a recording medium cartridge according to any one of the first to eleventh aspects, wherein the substrate is a flexible type substrate.

[0018] A thirteenth aspect of the technology according to the present disclosure is a recording medium cartridge including the contactless communication medium for a recording medium cartridge according to any one of the first to twelfth aspects.

[0019] A fourteenth aspect of the technology of the present disclosure is a method for manufacturing a non-contact communication medium for a recording medium cartridge, including forming a stress relaxation member on a substrate, and mounting, via the stress relaxation member on the substrate, an IC chip that is formed on the substrate and is electrically connectable to one end and the other end of an antenna coil that induces electric power when an externally applied magnetic field acts thereon. BRIEF DESCRIPTION OF THE DRAWINGS

[0020]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Modes for Carrying Out the Invention

[0021] First, the terms used in the following description will be explained.

[0022] CPU refers to the abbreviation of "Central Processing Unit". RAM refers to the abbreviation of "Random Access Memory". NVM refers to the abbreviation of "Non-Volatile Memory". ROM refers to the abbreviation of "Read Only Memory". EEPROM refers to the abbreviation of "Electrically Erasable and Programmable Read Only Memory". SSD refers to the abbreviation of "Solid State Drive". USB refers to the abbreviation of "Universal Serial Bus". ASIC refers to the abbreviation of "Application Specific Integrated Circuit". PLD refers to the abbreviation of "Programmable Logic Device". FPGA refers to the abbreviation of "Field-Programmable Gate Array". SoC refers to the abbreviation of "System-on-a-Chip". IC refers to the abbreviation of "Integrated Circuit". RFID refers to the abbreviation of "Radio Frequency Identifier".

[0023] In the following description, for convenience of explanation, in FIG. 1, the loading direction of the magnetic tape cartridge 10 into the magnetic tape drive 30 (see FIG. 4) is indicated by an arrow A. The direction of the arrow A is defined as the front direction of the magnetic tape cartridge 10, and the side in the front direction of the magnetic tape cartridge 10 is defined as the front side of the magnetic tape cartridge 10. In the following structural description, "front" refers to the front side of the magnetic tape cartridge 10.

[0024] Also, in the following description, for convenience of explanation, in FIG. 1, the direction of an arrow B orthogonal to the direction of the arrow A is defined as the right direction, and the side in the right direction of the magnetic tape cartridge 10 is defined as the right side of the magnetic tape cartridge 10. In the following structural description, "right" refers to the right side of the magnetic tape cartridge 10.

[0025] Also, in the following description, for convenience of explanation, in FIG. 1, the direction orthogonal to the directions of the arrow A and the arrow B is indicated by an arrow C. The direction of the arrow C is defined as the upward direction of the magnetic tape cartridge 10, and the side in the upward direction of the magnetic tape cartridge 10 is defined as the upper side of the magnetic tape cartridge 10. In the following description, in the following structural description, "up" refers to the upper side of the magnetic tape cartridge 10.

[0026] Also, in the following description, for convenience of explanation, in FIG. 1, the direction opposite to the front direction of the magnetic tape cartridge 10 is defined as the rear direction of the magnetic tape cartridge 10, and the side in the rear direction of the magnetic tape cartridge 10 is defined as the rear side of the magnetic tape cartridge 10. In the following structural description, "rear" refers to the rear side of the magnetic tape cartridge 10.

[0027] Also, in the following description, for convenience of explanation, in FIG. 1, the direction opposite to the upward direction of the magnetic tape cartridge 10 is defined as the downward direction of the magnetic tape cartridge 10, and the side in the downward direction of the magnetic tape cartridge 10 is defined as the lower side of the magnetic tape cartridge 10. In the following structural description, "down" refers to the lower side of the magnetic tape cartridge 10.

[0028] As an example, as shown in FIG. 1, the magnetic tape cartridge 10 is substantially rectangular in plan view and includes a box-shaped case 12. The magnetic tape cartridge 10 is an example of a "recording medium cartridge" according to the technology of the present disclosure. The case 12 is made of a resin such as polycarbonate and includes an upper case 14 and a lower case 16. The upper case 14 and the lower case 16 are joined by welding (e.g., ultrasonic welding) and screwing with the lower peripheral edge surface of the upper case 14 and the upper peripheral edge surface of the lower case 16 in contact with each other. The joining method is not limited to welding and screwing, and other joining methods may be used.

[0029] Inside the case 12, a cartridge reel 18 is rotatably accommodated. The cartridge reel 18 includes a reel hub 18A, an upper flange 18B1, and a lower flange 18B2. The reel hub 18A is formed in a cylindrical shape. The reel hub 18A is the axial center portion of the cartridge reel 18, the axial direction is along the vertical direction of the case 12, and it is disposed at the central portion of the case 12. Each of the upper flange 18B1 and the lower flange 18B2 is formed in an annular shape. The central portion of the upper flange 18B1 in plan view is fixed to the upper end portion of the reel hub 18A, and the central portion of the lower flange 18B2 in plan view is fixed to the lower end portion of the reel hub 18A. A magnetic tape MT is wound around the outer peripheral surface of the reel hub 18A, and the end portions in the width direction of the magnetic tape MT are held by the upper flange 18B1 and the lower flange 18B2. Note that the reel hub 18A and the lower flange 18B2 may be integrally molded.

[0030] An opening 12B is formed in the front side of the right wall 12A of the case 12. The magnetic tape MT is drawn out from the opening 12B.

[0031] As an example, as shown in FIG. 2, a cartridge memory 19 is accommodated in the right rear end portion of the lower case 16. The cartridge memory 19 is an example of a "non-contact communication medium" according to the technology of the present disclosure. In the present embodiment, a so-called passive RFID tag is adopted as the cartridge memory 19.

[0032] The cartridge memory 19 stores management information. The management information is information for managing the magnetic tape cartridge 10. Examples of the management information include identification information that can identify the magnetic tape cartridge 10, the recording capacity of the magnetic tape MT, an outline of the information recorded on the magnetic tape MT (hereinafter also referred to as "recording information"), items of the recording information, and information indicating the recording format of the recording information, etc.

[0033] The cartridge memory 19 communicates with an external device (not shown) in a non-contact manner. Examples of the external device include a reading and writing device used in the production process of the magnetic tape cartridge 10, and a reading and writing device (for example, the non-contact reading and writing device 50 shown in FIGS. 4 to 6) used in a magnetic tape drive (for example, the magnetic tape drive 30 shown in FIG. 4).

[0034] The external device reads and writes various information to and from the cartridge memory 19 in a non-contact manner. Although details will be described later, the cartridge memory 19 generates electric power by acting electromagnetically on a magnetic field given by the external device. Then, the cartridge memory 19 operates using the generated electric power and communicates with the external device via the magnetic field to exchange various information with the external device.

[0035] As shown in FIG. 2 as an example, a support member 20 is provided on the inner surface of the bottom plate 16A at the right rear end of the lower case 16. The support member 20 is a pair of inclined platforms that support the cartridge memory 19 from below in an inclined state. The pair of inclined platforms are the first inclined platform 20A and the second inclined platform 20B. The first inclined platform 20A and the second inclined platform 20B are arranged at intervals in the left-right direction of the case 12 and are modularized on the inner surface of the rear wall 16B and the inner surface of the bottom plate 16A of the lower case 16. The first inclined platform 20A has an inclined surface 20A1, and the inclined surface 20A1 slopes downward from the inner surface of the rear wall 16B toward the inner surface of the bottom plate 16A. Also, the inclined surface 20B1 also slopes downward from the inner surface of the rear wall 16B toward the inner surface of the bottom plate 16A.

[0036] On the front side of the support member 20, a pair of position regulating ribs 22 are arranged at intervals in the left-right direction. The pair of position regulating ribs 22 are erected on the inner surface of the bottom plate 16A and regulate the position of the lower end portion of the cartridge memory 19 disposed on the support member 20.

[0037] As shown in FIG. 3 as an example, a reference surface 16A1 is formed on the outer surface of the bottom plate 16A. The reference surface 16A1 is a flat surface. Here, the flat surface refers to a surface parallel to the horizontal plane when the lower case 16 is placed on the horizontal plane with the bottom plate 16A facing downward. The inclination angle θ of the support member 20, that is, the inclination angles of the inclined surfaces 20A1 and 20B1, are 45 degrees with respect to the reference surface 16A1. Note that 45 degrees is merely an example, and it may be "0 degree < inclination angle θ < 45 degrees" or 45 degrees or more.

[0038] The cartridge memory 19 includes a substrate 26. The substrate 26 is an example of the "substrate" according to the technology of the present disclosure. The substrate 26 is a flexible type substrate. The substrate 26 has a rectangular flat plate shape with the corners chamfered in an arc shape as an example. The substrate 26 has two surfaces in the thickness direction, that is, a front surface 26A and a back surface 26B. The substrate 26 is placed on the support member 20 with the back surface 26B of the substrate 26 facing downward, and the support member 20 supports the back surface 26B of the substrate 26 from below. A part of the back surface 26B of the substrate 26 is in contact with the inclined surfaces of the support member 20, that is, the inclined surfaces 20A1 and 20B1, and the front surface 26A of the substrate 26 is exposed on the inner surface 14A1 side of the top plate 14A.

[0039] The upper case 14 includes a plurality of ribs 24. The plurality of ribs 24 are arranged at intervals in the left-right direction of the case 12. The plurality of ribs 24 project downward from the inner surface 14A1 of the top plate 14A of the upper case 14, and the tip surface 24A of each rib 24 has an inclined surface corresponding to the inclined surfaces 20A1 and 20B1. That is, the tip surface 24A of each rib 24 is inclined at 45 degrees with respect to the reference surface 16A1.

[0040] With the cartridge memory 19 disposed on the support member 20, when the upper case 14 is joined to the lower case 16 as described above, the tip surface 24A of each rib 24 contacts the substrate 26 from the surface 26A side, and the substrate 26 is sandwiched between the tip surface 24A of each rib 24 and the inclined surface of the support member 20. Thereby, the vertical position of the cartridge memory 19 is regulated by the ribs 24.

[0041] As an example, as shown in FIG. 4, the magnetic tape drive 30 includes a transport device 34, a read head 36, and a control device 38. A magnetic tape cartridge 10 is loaded into the magnetic tape drive 30. The magnetic tape drive 30 is a device that pulls out the magnetic tape MT from the magnetic tape cartridge 10 and reads the recorded information from the pulled-out magnetic tape MT in a linear serpentine manner using the read head 36. In this embodiment, reading the recorded information, in other words, refers to reproducing the recorded information.

[0042] The control device 38 controls the entire magnetic tape drive 30. In this embodiment, the control device 38 is realized by an ASIC, but the technology of the present disclosure is not limited thereto. For example, the control device 38 may be realized by an FPGA. Further, the control device 38 may be realized by a computer including a CPU, a ROM, and a RAM. Further, it may be realized by combining two or more of AISC, FPGA, PLD, and computer. That is, the control device 38 may be realized by a combination of a hardware configuration and a software configuration.

[0043] The transport device 34 is a device that selectively transports the magnetic tape MT in the forward and reverse directions, and includes a feed motor 40, a take-up reel 42, a take-up motor 44, a plurality of guide rollers GR, and a control device 38.

[0044] The delivery motor 40 rotationally drives the cartridge reel 18 within the magnetic tape cartridge 10 under the control of the control device 38. The control device 38 controls the rotation direction, rotation speed, rotation torque, etc. of the cartridge reel 18 by controlling the delivery motor 40.

[0045] The take-up motor 44 rotationally drives the take-up reel 42 under the control of the control device 38. The control device 38 controls the rotation direction, rotation speed, rotation torque, etc. of the take-up reel 42 by controlling the take-up motor 44.

[0046] When the magnetic tape MT is taken up by the take-up reel 42, the control device 38 rotates the delivery motor 40 and the take-up motor 44 so as to run the magnetic tape MT in the forward direction. The rotation speed, rotation torque, etc. of the delivery motor 40 and the take-up motor 44 are adjusted according to the speed of the magnetic tape MT taken up by the take-up reel 42.

[0047] When the magnetic tape MT is rewound onto the cartridge reel 18, the control device 38 rotates the delivery motor 40 and the take-up motor 44 so as to run the magnetic tape MT in the reverse direction. The rotation speed, rotation torque, etc. of the delivery motor 40 and the take-up motor 44 are adjusted according to the speed of the magnetic tape MT taken up by the take-up reel 42.

[0048] In this way, by adjusting the rotation speed, rotation torque, etc. of each of the delivery motor 40 and the take-up motor 44, a tension within a predetermined range is applied to the magnetic tape MT. Here, the predetermined range refers to, for example, the range of tension within which data can be read from the magnetic tape MT by the read head 36, and is the range of tension obtained by computer simulation and / or tests on the actual machine, etc.

[0049] In this embodiment, the tension of the magnetic tape MT is controlled by controlling the rotational speed, rotational torque, etc. of the feeding motor 40 and the take-up motor 44. However, the technology of the present disclosure is not limited to this. For example, the tension of the magnetic tape MT may be controlled using a dancer roller, or may be controlled by drawing the magnetic tape MT into a vacuum chamber.

[0050] Each of the plurality of guide rollers GR is a roller that guides the magnetic tape MT. The running path of the magnetic tape MT is defined by arranging the plurality of guide rollers GR at positions straddling the reading head 36 between the magnetic tape cartridge 10 and the take-up reel 42.

[0051] The reading head 36 includes a reading element 46 and a holder 48. The reading element 46 is held by the holder 48 so as to contact the running magnetic tape MT, and reads recording information from the magnetic tape MT conveyed by the conveying device 34.

[0052] The magnetic tape drive 30 includes a non-contact reading and writing device 50. The non-contact reading and writing device 50 is an example of an "external" according to the technology of the present disclosure. The non-contact reading and writing device 50 is arranged so as to face the back surface 26B of the cartridge memory 19 below the magnetic tape cartridge 10 with the magnetic tape cartridge 10 loaded. Note that the state where the magnetic tape cartridge 10 is loaded into the magnetic tape drive 30 refers to a state where the magnetic tape cartridge 10 has reached a position previously determined as a position where reading of recording information from the magnetic tape MT by the reading head 36 starts.

[0053] As shown in FIG. 5 as an example, the non-contact reading and writing device 50 emits a magnetic field MF from below the magnetic tape cartridge 10 toward the cartridge memory 19. The magnetic field MF penetrates the cartridge memory 19. Note that the magnetic field MF is an example of a "magnetic field" according to the technology of the present disclosure.

[0054] As an example, as shown in FIG. 6, the non-contact reading / writing device 50 is connected to the control device 38. The control device 38 outputs a control signal for controlling the cartridge memory 19 to the non-contact reading / writing device 50. The non-contact reading / writing device 50 emits a magnetic field MF toward the cartridge memory 19 in accordance with the control signal input from the control device 38. The magnetic field MF penetrates from the back surface 26B side to the front surface 26A side of the cartridge memory 19.

[0055] Under the control of the control device 38, the non-contact reading / writing device 50 spatially transmits a command signal to the cartridge memory 19. The command signal is a signal indicating a command for the cartridge memory 19. When the command signal is spatially transmitted from the non-contact reading / writing device 50 to the cartridge memory 19, the magnetic field MF includes the command signal by the non-contact reading / writing device 50 in accordance with an instruction from the control device 38. In other words, the command signal is superimposed on the magnetic field MF. That is, under the control of the control device 38, the non-contact reading / writing device 50 transmits the command signal to the cartridge memory 19 via the magnetic field MF.

[0056] As an example, as shown in FIG. 7, a coil 60 is formed in a loop shape on the back surface 26B of the cartridge memory 19. Here, copper foil is adopted as the material of the coil 60. The coil 60 induces an induced current when the magnetic field MF (see FIGS. 5 and 6) given from the non-contact reading / writing device 50 acts thereon. Here, an example where the coil 60 is formed on the back surface 26B of the cartridge memory 19 is shown, but it is merely an example, and the coil 60 may be formed by being embedded in the substrate 26 of the cartridge memory 19. Note that the coil 60 is an example of the "antenna coil" according to the technology of the present disclosure.

[0057] On the back surface 26B of the cartridge memory 19, a first conduction part 62A and a second conduction part 62B are provided. The first conduction part 62A and the second conduction part 62B have solder and electrically connect both ends of the coil 60 to the IC chip 52 on the front surface 26A. Note that the first conduction part 62A and the second conduction part 62B are an example of "one end and the other end of the antenna coil" according to the technology of the present disclosure.

[0058] As shown in FIG. 8 as an example, an IC chip 52 is mounted on the front surface 26A of the cartridge memory 19. On the front surface 26A of the cartridge memory 19, the IC chip 52 is electrically connected to the first conduction part 62A and the second conduction part 62B. Specifically, a first lead 102A, which is one of a pair of leads protruding from the IC chip 52, is soldered to the first conduction part 62A, and a second lead 102B, which is the other of the pair of leads, is soldered to the second conduction part 62B. Note that the IC chip 52 is an example of the "IC chip" according to the technology of the present disclosure.

[0059] As shown in FIG. 8 as an example, the IC chip 52 is mounted on the substrate 26 via a stress relaxation member 28. As shown in FIG. 8 as an example, the IC chip 52 has a rectangular shape in plan view. The maximum outer dimension L1 (that is, the length of the diagonal) of the IC chip 52 is 2.5 mm or more. Also, the long side dimension L2 of the substrate 26 is 10 mm. Therefore, the ratio of the maximum outer dimension L1 of the IC chip 52 to the long side dimension L2 of the substrate 26 (that is, L1 / L2) is 25% or more.

[0060] The stress relaxation members 28 are respectively provided at positions corresponding to the four corners of the IC chip 52 having a rectangular shape in plan view. That is, four stress relaxation members 28 are provided, and the stress relaxation members 28A, 28B, 28C, and 28D support the four corners of the IC chip 52, respectively.

[0061] As an example, as shown in FIG. 8, the stress relaxation members 28A, 28B, 28C, and 28D each have a rectangular shape. The area of the stress relaxation members 28A, 28B, 28C, and 28D when viewed in plan is not particularly limited, but it is sufficient if an area that supports the region including the four corners of the IC chip 52 and can relieve the stress transmitted from the substrate 26 can be secured.

[0062] As an example, as shown in FIG. 9, the stress relaxation member 28 is provided between the IC chip 52 and the substrate 26. The stress relaxation member 28 has a rectangular parallelepiped shape protruding from the substrate 26 toward the IC chip 52. The distance h by which the stress relaxation member 28 protrudes from the substrate 26 (i.e., the thickness of the stress relaxation member 28) is set to about 30 μm. The IC chip 52 and the stress relaxation member 28 are adhered to each other via an adhesive (not shown).

[0063] The stress relaxation member 28 is formed of metal as an example. Specifically, the stress relaxation member 28 is formed of the same metal as the metal forming the coil 60. Here, the term "same" refers to not only the case of being completely the same, but also the same including errors generally acceptable in the technical field to which the technology of the present disclosure belongs.

[0064] As an example, the stress relaxation member 28 is formed of a copper foil. The components of the copper foil are not particularly limited. For example, it may be pure copper (i.e., industrial pure copper), or a copper alloy having copper as a main component and various elements added thereto.

[0065] The stress relaxation member 28 is further formed as a printed pattern. That is, the stress relaxation member 28 is formed as a printed pattern together in the process of forming the coil 60. Specifically, using a known photolithography technique, the stress relaxation member 28 is formed as a printed pattern on the substrate 26.

[0066] As an example, as shown in FIG. 9, consider the case where bending stress associated with bending occurs with respect to the substrate 26. In this case, as shown in FIG. 9 as an example, the stress relaxation member 28 relaxes the stress transmitted from the substrate 26. Specifically, the stress relaxation member 28 is expanded and contracted by the stress transmitted from the substrate 26, thereby relaxing the stress. As a result, the generation of stress associated with the deformation of the substrate 26 with respect to the IC chip 52 is suppressed.

[0067] The IC chip 52 includes a computer (not shown). The computer includes a CPU, an NVM, and a RAM (all not shown). The NVM stores a program for a magnetic tape cartridge and management information. The CPU reads a program from the NVM and executes the program on the RAM to control the operation of the cartridge memory 19. Here, the storage capacity of the NVM is 32 kB or more. That is, the storage capacity of the IC chip 52 is 32 kB or more.

[0068] Next, the manufacturing process of the non-contact communication medium according to the present embodiment will be described with reference to FIG. 10.

[0069] In the manufacturing process of the non-contact communication medium shown in FIG. 10 as an example, first, in step ST101, the coil 60 is formed on the substrate 26. After this, the manufacturing process proceeds to step ST103.

[0070] In step ST103, the IC chip 52 is positioned on the substrate 26. After this, the manufacturing process proceeds to step ST105.

[0071] In step ST105, based on the position of the IC chip 52 positioned in step ST103, the stress relaxation member 28 is formed on the substrate 26. After this, the manufacturing process proceeds to step ST107.

[0072] In step ST107, the IC chip 52 is mounted on the substrate 26 via the stress relaxation member 28 formed in step ST105. Thereby, the manufacturing process of the non-contact communication medium is completed.

[0073] As described above, in the cartridge memory 19 according to the present embodiment, the stress relaxation member 28 is provided between the IC chip 52 and the substrate 26. Therefore, according to this configuration, the stress generated in the IC chip 52 due to the deformation of the substrate 26 is relaxed as compared with the case where the IC chip 52 is directly attached onto the substrate 26.

[0074] Further, in the cartridge memory 19, the stress relaxation member 28 is formed of metal. Therefore, according to this configuration, since the ductility of the metal is utilized for stress relaxation, the stress generated in the IC chip 52 due to the deformation of the substrate 26 is relaxed as compared with the case where the stress relaxation member 28 is formed of a material other than metal.

[0075] Further, in the cartridge memory 19, the metal forming the stress relaxation member 28 is the same as the metal forming the coil 60. Therefore, according to this configuration, the formation of the stress relaxation member 28 becomes easier as compared with the case where a metal different from the coil 60 is used as the stress relaxation member 28. As a result, an improvement in the productivity of the cartridge memory 19 can be expected.

[0076] Further, in the cartridge memory 19, the metal forming the stress relaxation member 28 is copper or a copper alloy. Therefore, according to this configuration, the formation of the stress relaxation member 28 becomes easier as compared with the case where a metal other than copper is the main component of the stress relaxation member 28. As a result, an improvement in the productivity of the cartridge memory 19 can be expected.

[0077] Further, in the cartridge memory 19, the stress relaxation member 28 is formed as a printed pattern. Therefore, according to this configuration, the formation of the stress relaxation member 28 becomes easier as compared with the case where the stress relaxation member 28 is attached as a separate component. As a result, an improvement in the productivity of the cartridge memory 19 can be expected.

[0078] Further, in the cartridge memory 19, the IC chip 52 is square in plan view, and the stress relaxation member 28 is provided at positions corresponding to the four corners of the IC chip 52 when the IC chip 52 is viewed in plan. Therefore, according to this configuration, compared with the case where the stress relaxation member 28 is provided in the central portion of the IC chip 52, the stress caused by the deformation of the substrate 26 is more likely to escape, and the stress generated in the IC chip 52 is relaxed.

[0079] Also, in the cartridge memory 19, the IC chip 52 has a storage capacity of 32 kB or more. Therefore, according to this configuration, compared with the case where the storage capacity of the IC chip 52 is less than 32 kB, even if the IC chip 52 is enlarged by setting the storage capacity of the IC chip 52 to 32 kB or more, the stress generated in the IC chip 52 due to the deformation of the substrate 26 is relaxed.

[0080] In the cartridge memory 19, the ratio of the maximum outer dimension L1 of the IC chip 52 to the long side dimension L2 of the substrate 26 is 25% or more. Therefore, according to this configuration, compared with the case where the ratio of the maximum outer dimension L1 of the IC chip 52 to the long side dimension L2 of the substrate 26 is less than 25%, even if the IC chip 52 is enlarged, the stress generated in the IC chip 52 due to the deformation of the substrate 26 is relaxed.

[0081] In the cartridge memory 19, the substrate 26 is a flexible type substrate. Therefore, according to this configuration, compared with the case where the substrate 26 is a rigid substrate, the stress generated in the IC chip due to the deformation of the substrate 26 is relaxed.

[0082] [First Modified Example] In the above embodiment, the form example in which the stress relaxation member 28 is provided at positions corresponding to the four corners of the IC chip 52 has been described, but the technology of the present disclosure is not limited to this. In this first modified example, as shown in FIG. 11 as an example, the stress relaxation member 28 is provided along the opposite sides of the IC chip 52 when the IC chip 52 is viewed in plan.

[0083] In the example shown in FIG. 11, stress relaxation members 28E and 28F are formed along a pair of long sides of the IC chip 52. The stress relaxation members 28E and 28F have a rectangular parallelepiped shape having long sides along the long sides of the IC chip 52. The lengths of the stress relaxation members 28E and 28F are set to be longer than the length of the long side of the IC chip 52. Also, the widths of the stress relaxation members 28E and 28F are set to be within a range including the long side of the IC chip 52. That is, the stress relaxation members 28E and 28F support a pair of long sides of the IC chip 52.

[0084] As described above, in the cartridge memory 19 according to the first modification, the IC chip 52 is square in plan view, and the stress relaxation member 28 is provided along opposite sides of the IC chip 52 when viewed in plan. Therefore, according to this configuration, compared with the case where the stress relaxation member 28 is provided only on a part of the opposite sides of the IC chip 52, the stress caused by the deformation of the substrate 26 is more likely to escape, and the stress generated in the IC chip 52 is relaxed.

[0085] In the first modification, an example in which the stress relaxation member 28 is formed along a pair of long sides of the IC chip 52 has been described, but the technology of the present disclosure is not limited to this. For example, the stress relaxation member 28 may be provided along a pair of short sides of the IC chip 52.

[0086] [Second Modification] Also, in the above embodiment, an example in which the stress relaxation member 28 is partially provided with respect to the IC chip 52 has been described, but the technology of the present disclosure is not limited to this. In the second modification, as an example, as shown in FIG. 12, the stress relaxation member 28 is provided at a position corresponding to the entire IC chip 52 when viewed in plan.

[0087] As an example, as shown in FIG. 12, the stress relaxation member 28G is formed in a flat plate shape. The stress relaxation member 28G has an area larger than that of the IC chip 52 when the IC chip 52 is viewed in plan view. That is, the stress relaxation member 28G supports the entire surface of the IC chip 52 on the substrate 26 side.

[0088] As an example, consider the case where bending stress due to bending occurs in the substrate 26 as shown in FIG. 13. In this case, as shown in FIG. 13 as an example, the stress relaxation member 28 relaxes the stress transmitted from the substrate 26. Specifically, the stress is relaxed by increasing the rigidity by the stress relaxation member 28 provided on the substrate 26. For example, the stress relaxation member 28 has the same rigidity as the IC chip 52 or higher rigidity than the IC chip 52. Further, the stress relaxation member 28 has, for example, higher rigidity than the substrate 26. That is, in the region of the substrate 26 where the stress relaxation member 28 is provided, the deformation of the substrate 26 itself is suppressed. As a result, the generation of stress due to the deformation of the substrate 26 with respect to the IC chip 52 is suppressed.

[0089] As described above, in the cartridge memory 19 according to the second modification example, the stress relaxation member 28 is provided at a position corresponding to the entire IC chip 52 when the IC chip 52 is viewed in plan view. Therefore, according to this configuration, compared with the case where the stress relaxation member 28 is provided at a position corresponding to a part of the IC chip 52, the deformation of the substrate 26 itself is suppressed, so that the stress generated in the IC chip 52 due to the deformation of the substrate 26 is relaxed.

[0090] [Third Modification Example] In the above-described embodiment, an example has been described in which the stress relaxation member 28 is provided at a position corresponding to the entire IC chip 52 when the IC chip 52 is viewed in plan view, but the technology of the present disclosure is not limited to this. For example, the stress relaxation member 28 may be provided at a position corresponding to the outer peripheral portion of the IC chip 52 as shown in FIG. 14 as an example.

[0091] As an example, as shown in FIG. 14, the stress relaxation member 28H is formed in a rectangular frame shape. The stress relaxation member 28H is formed along the outer peripheral portion of the IC chip 52 when the IC chip 52 is viewed in plan. That is, the stress relaxation member 28 supports the outer peripheral portion of the IC chip 52. The width of the stress relaxation member 28H is not particularly limited, as long as it has a width capable of supporting the region including the outer peripheral portion of the IC chip 52.

[0092] The stress relaxation member 28 relaxes the stress transmitted from the substrate 26. Specifically, the stress is relaxed by increasing the rigidity by the stress relaxation member 28 provided on the substrate 26. For example, the stress relaxation member 28 has the same rigidity as or higher rigidity than the IC chip 52. Further, the stress relaxation member 28 has, for example, higher rigidity than the substrate 26. That is, in the region of the substrate 26 where the stress relaxation member 28 is provided, the deformation of the substrate 26 itself is suppressed. As a result, the generation of stress due to the deformation of the substrate 26 with respect to the IC chip 52 is suppressed. Further, since the stress relaxation member 28 is in a rectangular frame shape, in other words, the stress relaxation member 28 is not formed in the inner portion of the rectangular frame. Therefore, the deformation of the substrate 26 is not excessively suppressed.

[0093] As described above, in the cartridge memory 19 according to the third modification example, the stress relaxation member 28H is provided at a position corresponding to the outer peripheral portion of the IC chip 52 when the IC chip 52 is viewed in plan. Therefore, according to this configuration, compared with the case where the stress relaxation member 28H is provided at a position corresponding to a part of the outer peripheral portion of the IC chip 52, the deformation of the substrate 26 itself is suppressed, so that the stress generated in the IC chip 52 due to the deformation of the substrate 26 is relaxed.

[0094] In the third modification example, the form example in which the stress relaxation member 28H is formed in a continuous rectangular frame shape has been described, but the technology of the present disclosure is not limited to this. For example, the stress relaxation member 28H may be in a discontinuous rectangular frame shape.

[0095] In the above-described embodiment, an example in which the stress relaxation member 28 has a square shape has been described, but the technology of the present disclosure is not limited thereto. For example, the stress relaxation member 28 may have a square shape with chamfered corners, or may have a polygonal shape other than a quadrilateral, a circular shape, or an annular shape in a plan view.

[0096] Further, in the above-described embodiment, an example in which a copper foil is employed as the coil 60 has been described, but the technology of the present disclosure is not limited thereto. For example, the coil 60 may be another type of conductive material such as an aluminum foil. In this case, another type of conductive material such as the aluminum foil forming the coil 60 is employed as the stress relaxation member 28.

[0097] The description content and the illustrated content shown above are detailed descriptions of the part related to the technology of the present disclosure and are merely examples of the technology of the present disclosure. For example, the description regarding the above-described configuration, function, action, and effect is an explanation of an example of the configuration, function, action, and effect of the part related to the technology of the present disclosure. Therefore, it goes without saying that within the scope not departing from the gist of the technology of the present disclosure, the description content and the illustrated content shown above may be modified by deleting unnecessary parts, adding new elements, or making replacements. Also, in order to avoid complication and facilitate the understanding of the part related to the technology of the present disclosure, the description regarding common technical knowledge that does not particularly require explanation for implementing the technology of the present disclosure is omitted from the description content and the illustrated content shown above.

[0098] In this specification, "A and / or B" is synonymous with "at least one of A and B". That is, "A and / or B" means that it may be only A, only B, or a combination of A and B. Also, in this specification, when expressing three or more matters connected by "and / or", the same concept as "A and / or B" is applied.

[0099] All documents, patent applications, and technical standards described in this specification are incorporated herein by reference to the same extent as if each individual document, patent application, and technical standard were specifically and individually indicated to be incorporated by reference.

Explanation of Reference Numerals

[0100] 10 Magnetic tape cartridge 12 Case 12A Right wall 12B Opening 14 Upper case 14A Top plate 14A1 Inner surface 16 Lower case 16A Bottom plate 16A1 Reference plane 16B Rear wall 18 Cartridge reel 18A Reel hub 18B1 Upper flange 18B2 Lower flange 19 Cartridge memory 20 Support member 20A First inclined table 20A1, 20B1 Inclined surface 20B Second inclined table 22 Position regulating rib 23 Loading slot 24 Rib 24A Tip surface 26 Substrate 26A Surface 26B Back surface 28, 28A, 28B, 28C, 28D, 28E, 28F, 28G, 28H Stress relaxation member 30 Magnetic tape drive 34 Conveying device 36 Reading head 38 Control device 40 Delivery motor 42 Take-up reel 44 Take-up motor 46 Reading element 48 Holder 50 Non-contact reading and writing device 52 IC chips 60 coils 62A First conduction part 62B Second conduction part 102A First lead 102B Second lead Arrows A, B, C GR Guide roller MF Magnetic field MT Magnetic tape θ1 Inclination angle

Claims

1. A substrate, an IC chip formed on the substrate and electrically connected to one end and the other end of an antenna coil that induces electric power when an externally applied magnetic field acts thereon, a stress relaxation member provided between the IC chip and the substrate, and a non-contact communication medium for a recording medium cartridge comprising the same.

2. The stress relaxation member is formed of metal. The non-contact communication medium for a recording medium cartridge according to Claim 1.

3. The metal is the same as the metal forming the antenna coil. The non-contact communication medium for a recording medium cartridge according to Claim 2.

4. The metal is copper or a copper alloy. The non-contact communication medium for a recording medium cartridge according to Claim 2 or 3.

5. The stress relaxation member is formed as a printed pattern. The non-contact communication medium for a recording medium cartridge according to any one of Claims 2 to 4.

6. The IC chip is square in plan view, and the stress relaxation member is provided at positions corresponding to the four corners of the IC chip when the IC chip is viewed in plan view. The non-contact communication medium for a recording medium cartridge according to any one of Claims 1 to 5.

7. The IC chip is square in plan view, and the stress relaxation member is provided along opposite sides of the IC chip when the IC chip is viewed in plan view. The non-contact communication medium for a recording medium cartridge according to any one of Claims 1 to 5.

8. The stress relaxation member is provided at a position corresponding to the entire IC chip when the IC chip is viewed in plan view. The non-contact communication medium for a recording medium cartridge according to any one of Claims 1 to 5.

9. The stress relaxation member is provided at a position corresponding to the outer peripheral portion of the IC chip when the IC chip is viewed in plan view. The non-contact communication medium for a recording medium cartridge according to any one of Claims 1 to 5.

10. The IC chip has a storage capacity of 32 kB or more. The non-contact communication medium for a recording medium cartridge according to any one of Claims 1 to 9.

11. The ratio of the maximum outer dimension of the IC chip to the long side dimension of the substrate is 25% or more. The non-contact communication medium for a recording medium cartridge according to any one of Claims 1 to 10.

12. The substrate is a flexible type substrate. A non-contact communication medium for a recording medium cartridge according to any one of claims 1 to 11.

13. A recording medium cartridge comprising the non-contact communication medium for a recording medium cartridge according to any one of claims 1 to 12.

14. Forming a stress relaxation member on a substrate, and Mounting an IC chip on the substrate via the stress relaxation member, the IC chip being formed on the substrate and electrically connectable to one end and the other end of an antenna coil that induces electric power when a magnetic field applied from the outside acts thereon. A method for manufacturing a non-contact communication medium for a recording medium cartridge including the above.

Images