gaming machines

Abstract

To provide a game machine equipped with an electronic board mounted with a surface mounting electronic component, capable of suppressing deterioration in reliability.SOLUTION: A front board surface of a first board equipped with main control means for executing processing involved in the progress of a game has formed therein an insulation film and a notation part for specifying each of a plurality of electronic components on the insulation film. The front board surface is mounted with surface mounting type electronic components and insertion mounting type electronic components, and has formed therein a thermal pattern for connecting a specific connection part of a plurality of connection parts where the electronic components are soldered, to a solid ground. A front board surface of a second board arranged ahead of the first main board has formed therein an insulation film, but not a notation part, is mounted only with the surface mounting type electronic components, and has not formed therein a thermal pattern for connecting a specific connection part of a plurality of connection parts where the electronic components are soldered, to a solid ground.SELECTED DRAWING: Figure 129

Claims

[Claim 1] A gaming machine having a plurality of boards on which a plurality of electronic components are mounted, The plurality of substrates include: A first substrate having a main control means for executing processing related to the progress of a game; a second board electrically connected to the first board and disposed on the front side of the gaming machine closer to a player than the first board; an insulating coating is formed on a front substrate surface of the first substrate, and markings for identifying each of the plurality of electronic components are formed on the insulating coating; an insulating coating is formed on the front substrate surface of the second substrate, but no markings for identifying each of the plurality of electronic components are formed on the insulating coating; A solid ground pattern is formed on the first substrate, and a solid ground pattern is not formed on the second substrate, a surface mount type electronic component and an insertion mount type electronic component are mounted on the front substrate surface of the first substrate, and at least a special connection portion among a plurality of connection portions to which the surface mount type electronic component is soldered and a specific connection portion among a plurality of connection portions to which the insertion mount type electronic component is soldered are formed; the special connection portion is a thermal pad in which a thermal pattern formed around the connection portion is connected to the solid ground pattern; the specific connection portion is a thermal land in which a thermal pattern formed around the connection portion is connected to the solid ground pattern, At least a portion of the thermal pattern of the thermal pad and the thermal pattern of the thermal land are covered with the insulating coating; Furthermore, the surface-mount type electronic components include integrated circuit components related to the progress of the game, and specific discrete components soldered to the thermal lands of the insertion-mount type electronic components are arranged in the vicinity of the integrated circuit components without sandwiching any other electronic components between them, When the specific discrete component and the integrated circuit component are mounted on the first substrate, the height of the specific discrete component from the front substrate surface of the first substrate is higher than that of the integrated circuit component; At least one of the integrated circuit components is disposed between two of the specific discrete components without any other electronic components sandwiched between the integrated circuit components. A gaming machine characterized by:

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